Wafer appearance inspection machine

Abstract

The present invention discloses a wafer appearance inspection machine, which includes a machine body, a driven wheel assembly, a driving wheel assembly and a detection assembly; a tilted main frame is arranged in the machine body, a support frame is arranged on the main frame, and the support frame is perpendicular to the main frame; the driven wheel assembly includes a first lifting cylinder and a matching wheel mechanism, and the output shaft of the first lifting cylinder is connected to the matching wheel mechanism; the driving wheel assembly includes a driving motor and a driving wheel mechanism, and the driving end of the driving motor is connected to the driving wheel mechanism; the detection assembly is arranged on the side of the driving wheel assembly, and the detection assembly includes a first camera and a second camera. The wafer appearance inspection machine ejects the workpiece through the driven wheel assembly and the driving wheel assembly and performs rotation detection. The detection assembly performs double-sided shooting when the workpiece stops, and performs analysis and processing when the workpiece rotates, thereby improving the detection efficiency, avoiding direct contact of the equipment with the workpiece surface during the detection process, and reducing the defective rate of the workpiece detection.

Description

Technical Field

[0001] The present invention mainly relates to the technical field of mechanical processing equipment, and in particular to a wafer appearance inspection machine. Background Art

[0002] Wafer refers to the silicon wafer used to make silicon semiconductor circuits, and its original material is silicon. High-purity polysilicon is dissolved and doped with silicon crystal seeds, and then slowly pulled out to form cylindrical single crystal silicon. In the semiconductor industry, the yield rate of wafers is the main production standard, so wafers need to be strictly inspected for appearance, including inspections of defects such as breakage, cracks, pores, cracks, etc. on the appearance of the wafers. Generally, appearance inspections are performed manually by staff, and the staff need to concentrate highly during the inspection process, resulting in high labor intensity and high labor costs. In addition, manual inspections are time-consuming and labor-intensive, inefficient, and workpieces are easily damaged by external forces from staff.

[0003] The wafer appearance inspection machines currently on the market have a complex structure and use a robot to grab the workpiece, which is easily damaged by external forces, resulting in an increase in the defective rate of products. Summary of the invention

[0004] The purpose of the present invention is to overcome the shortcomings of the prior art. The present invention provides a wafer appearance inspection machine, which has an inclined inspection station, and uses a driven wheel assembly and a driving wheel assembly to eject the workpiece and then rotate it for inspection, and performs double-sided photography inspection on the workpiece to improve the inspection efficiency. The inspection process avoids direct contact between the equipment and the workpiece surface, and effectively reduces the defective rate of workpiece inspection.

[0005] The present invention provides a wafer appearance inspection machine, which includes a machine body, a lifting assembly, a driven wheel assembly, a driving wheel assembly and a detection assembly;

[0006] The machine body is provided with an inclined main frame, the lifting assembly is fixed on the main frame, the main frame is provided with a supporting frame, and the supporting frame and the main frame are perpendicular to each other;

[0007] The driven wheel assembly is located on a side of the support frame close to the main frame, and the driven wheel assembly includes a first lifting cylinder and a matching wheel mechanism, wherein the output shaft of the first lifting cylinder is connected to the matching wheel mechanism;

[0008] The driving wheel assembly is located at the other side of the support frame, and the driving wheel assembly includes a driving motor and a driving wheel mechanism, and the output shaft of the driving motor is connected to the driving wheel mechanism;

[0009] The detection component is arranged on the side of the driving wheel component, and the detection component includes a first camera and a second camera. The first camera is fixed at the upper end of the interior of the body, and the second camera is fixed at the lower end of the interior of the body. The shooting directions of the first camera and the second camera are toward the support frame.

[0010] Further, the main frame includes a first fixing seat fixed to the bottom plate inside the machine body, a second fixing seat fixed to the top plate inside the machine body, and a fixing plate;

[0011] The first fixing seat is provided with a first rotating shaft, the second fixing seat is provided with a second rotating shaft, one end of the fixing plate is sleeved on the first rotating shaft, and the other end of the fixing plate is sleeved on the second rotating shaft.

[0012] Further, the lifting assembly includes an electric slide, a servo motor, a sliding member slidably connected to the electric slide, and a support plate fixed to the sliding member, the electric slide is arranged on the main frame, and the driving end of the servo motor is connected to the electric slide;

[0013] The support plate and the sliding member are perpendicular to each other, and the support plate is used for carrying a workpiece.

[0014] Furthermore, the electric slide also includes a first limit switch, a second limit switch, a first origin switch and a first induction sheet;

[0015] The first limit switch is located at one end of the side wall of the electric slide, the second limit switch is located at the other end of the side wall of the electric slide, and the first origin switch is located between the first limit switch and the second limit switch;

[0016] The first sensing sheet is located on the side wall of the sliding member.

[0017] Furthermore, the driven wheel assembly further comprises a first bottom plate, a first guide rail and a first slider, and the mating wheel mechanism comprises a mating wheel and a first mounting plate;

[0018] The first guide rail is arranged on the first bottom plate, and the first sliding block is slidably connected to the first guide rail;

[0019] One end of the first mounting plate is fixed on the first sliding block, and the other end of the first mounting plate is connected to the matching wheel.

[0020] Furthermore, the driving wheel assembly also includes a second mounting plate, a second bottom plate, a second guide rail and a second slider;

[0021] The second guide rail is arranged on the second bottom plate, the second slider is slidably connected to the second guide rail, and the second mounting plate is fixed on the second slider;

[0022] The driving motor and the driving wheel mechanism are arranged on the second mounting plate.

[0023] Further, the driving wheel mechanism includes a first driving wheel and a synchronous belt device, the synchronous belt device includes a first transmission gear, a second transmission gear and a synchronous belt, and the first transmission gear is connected to the second transmission gear based on the synchronous belt;

[0024] The output shaft of the driving motor is sleeved in the first transmission gear, and the first driving wheel is coaxially arranged with the second transmission gear and connected based on a connecting shaft.

[0025] Furthermore, the driving wheel mechanism is provided with a top block, the top block is provided with a top plate, and the top plate is used to lift the workpiece.

[0026] Further, the detection assembly includes a mounting bracket, a third mounting plate, a third guide rail and a third slide block;

[0027] The mounting bracket is fixed to one side of the support frame, and the third guide rail is arranged on the mounting bracket;

[0028] The third sliding block is slidably connected to the third guide rail, and the third mounting plate is fixed on the third sliding block.

[0029] Furthermore, the detection assembly also includes a first light board, a second light board, a third light board, a first connecting frame, and a second connecting frame;

[0030] One end of the first connecting frame is fixed to the upper end of the third mounting plate, and the second connecting frame is fixed to the lower end of the third mounting plate;

[0031] The first light board is fixed to the other end of the first connecting frame, and the second light board is fixed to the other end of the second connecting frame;

[0032] The third light board is fixed on the third mounting plate. The present invention provides a wafer appearance inspection machine, which arranges a material frame with a workpiece to be inspected at an angle, partially pushes the workpiece out of the material frame through a driven wheel assembly, and performs rotation inspection in cooperation with a driving wheel assembly, without taking all the workpieces out of the material frame for inspection. The camera on the inspection assembly performs double-sided shooting inspection when the workpiece stops. The inspection machine analyzes and processes the photographed data when the workpiece rotates, thereby improving the inspection efficiency. After the inspection is completed, the workpiece falls back onto the material frame under the action of its own gravity, thereby avoiding direct contact between the equipment and the workpiece surface, and effectively reducing the defective rate of workpiece inspection. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0034] Figure 1 is a schematic diagram of the structure of a wafer appearance inspection machine in an embodiment of the present invention;

[0035] Figure 2 Schematic diagram of the internal structure of a wafer appearance inspection machine according to an embodiment of the present invention;

[0036] Figure 3 This is a schematic diagram of the main frame structure in an embodiment of the present invention;

[0037] Figure 4 is a schematic diagram of the structure of the lifting assembly in an embodiment of the present invention;

[0038] Figure 5 is a schematic structural diagram of a first driven wheel assembly in an embodiment of the present invention;

[0039] Figure 6 is a schematic structural diagram of a first driving wheel assembly in an embodiment of the present invention;

[0040] Figure 7 is a side view of the detection component structure in an embodiment of the present invention;

[0041] Figure 8 It is a front view of the detection component structure in an embodiment of the present invention. DETAILED DESCRIPTION

[0042] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0043] Figure 1 The figure shows a schematic diagram of the structure of a wafer appearance inspection machine according to an embodiment of the present invention. Figure 2 The schematic diagram of the internal structure of the wafer appearance inspection machine in the embodiment of the present invention is shown. The automatic wafer appearance inspection machine comprises a machine body 1, a lifting assembly 7, a driven wheel assembly, a driving wheel assembly and a detection assembly 6;

[0044] Specifically, an inclined main frame 8 is provided in the machine body 1 , the lifting assembly 7 is fixed on the main frame 8 , a support frame 87 is provided on the main frame, and the support frame 87 and the main frame 8 are perpendicular to each other.

[0045] Furthermore, a control panel 11 is disposed outside the machine body 1 , and the control panel 11 is convenient for an operator to change and debug the operating program of the wafer appearance inspection machine.

[0046] Specifically, the driven wheel assembly includes a first lifting cylinder 21 and a matching wheel 22 mechanism, the output shaft of the first lifting cylinder 21 is connected to the matching wheel 22 mechanism, and the driven wheel assembly is arranged on a side of the support frame 87 close to the main frame 8.

[0047] Furthermore, the detection component 6 is arranged on the side of the driving wheel assembly, and the detection component 6 includes a first camera 61 and a second camera 62, the first camera 61 is arranged above the driving wheel assembly, and the second camera 62 is arranged below the driving wheel assembly, and the shooting directions of the first camera 61 and the second camera 62 are toward the driving wheel assembly.

[0048] Specifically, Figure 3 A schematic diagram of the main frame structure in an embodiment of the present invention is shown, wherein the main frame 8 includes a fixed plate 81, a first rotating shaft 83, a second rotating shaft 85, a first fixed seat 82 and a second fixed seat 84, wherein the first fixed seat 82 is fixed to the bottom surface of the body 1, the first rotating shaft 83 is arranged in the first fixed seat 82, the second fixed seat 84 is fixed to the top surface of the body 1, and the second rotating shaft 85 is arranged in the second fixed seat 84.

[0049] Furthermore, one end of the fixed plate 81 is fixed on the first rotating shaft 83, and the other end of the fixed plate 81 is fixed on the second rotating shaft 85. The inclination angle of the main frame 8 can be adjusted through the first rotating shaft 83 and the second rotating shaft 85 to meet the detection requirements of wafers of different sizes.

[0050] Furthermore, reinforcing ribs 86 are provided on the fixing plate 81 , and the reinforcing ribs 86 increase the overall rigidity of the main frame 8 and improve the bearing capacity of the main frame 8 .

[0051] Specifically, Figure 4 A schematic diagram of the structure of a lifting component in an embodiment of the present invention is shown, wherein the lifting component 7 includes an electric slide 71, a servo motor 72, a sliding member 73 and a support plate 74, wherein the sliding member 73 is slidably connected to the electric slide 71, and the support plate 74 is fixed on the sliding member 73 and is perpendicular to the sliding member 73, and the support plate 74 is used to carry a workpiece.

[0052] Specifically, the electric slide 71 is fixed on the main frame 8, and the driving end of the servo motor 72 is connected to the electric slide 71. The servo motor 72 drives the electric slide 71 to drive the workpiece to perform linear motion. The servo motor 72 can drive the slide to move a preset distance on the electric slide 71 each time it works according to the electronic control program.

[0053] Specifically, an upper limit sensing switch 711, a lower limit sensing switch 712 and a first origin sensing switch 713 are provided on the side wall of the electric slide 71, and a first sensing sheet 731 is provided on the side wall of the sliding member 73. The first sensing sheet 731 can trigger induction with the upper limit sensing switch 711, the lower limit sensing switch 712 and the first origin sensing switch 713.

[0054] Furthermore, the upper limit sensing switch 711 is used to mark the limit position of the rising movement of the lifting assembly 7, and the lower limit sensing switch 712 is used to mark the limit position of the descending movement of the lifting assembly 7. When the first sensing plate 731 triggers induction with the upper limit sensing switch 711 or the lower limit sensing switch 712, the servo motor 72 stops driving and controlling the electric slide 71.

[0055] Furthermore, the first origin sensing switch 713 is used to mark the origin working position of the lifting assembly 7 to facilitate debugging of the electric control program.

[0056] Specifically, Figure 5 A schematic diagram of the structure of the first driven wheel assembly in an embodiment of the present invention is shown, a first driven wheel assembly 2 is arranged on one side of the support frame 87, and a second driven wheel assembly 3 is arranged on the other side, the driven wheel assembly also includes a first base plate 28, a first guide rail 27 and a first slider 26, the mating wheel 22 mechanism includes a mating wheel 22 and a first mounting plate 25; the first guide rail 27 is arranged on the first base plate 28, and the first slider 26 is slidably connected to the first guide rail 27; one end of the first mounting plate 25 is fixed on the first slider 26, and the other end of the first mounting plate 25 is connected to the mating wheel 22.

[0057] Furthermore, a matching groove is provided on the circumferential outer wall of the matching wheel 22, and the matching groove matches with the wafer workpiece.

[0058] Specifically, an adjusting block 23 is fixed on the first mounting plate 25, and the output shaft of the first lifting cylinder 21 is connected to the adjusting block 23. The first lifting cylinder 21 is a telescopic cylinder, and the first lifting cylinder 21 drives the adjusting block 23 to move, thereby driving the matching wheel 22 mechanism to move telescopically.

[0059] Furthermore, a pressure sensor 24 is provided at the connection position between the output shaft of the first lifting cylinder 21 and the adjusting block 23. The pressure sensor 24 is used to monitor the pressure between the first driven wheel assembly 2 and the wafer workpiece, thereby ensuring the normal cooperation between the first driven wheel assembly 2 and the wafer workpiece during the detection process, thereby improving the safety and accuracy of the detection.

[0060] Furthermore, the second driven wheel assembly 3 has the same structural features and functional effects as the first driven wheel assembly 2. For details, please refer to the structural features and functional effects of the first driven wheel assembly 2, which will not be described in detail here.

[0061] Specifically, Figure 6 The schematic diagram of the structure of the first driving wheel assembly in the embodiment of the present invention is shown, the first driving wheel assembly 4 and the second driving wheel assembly 5 are arranged on the support frame 87, and the first driving wheel assembly 4 and the second driving wheel assembly 5 are symmetrically arranged at both ends of the support frame 87. The first driving wheel assembly 4 includes a driving motor 41 and a driving wheel mechanism, and the output shaft of the driving motor 41 is connected to the driving wheel mechanism.

[0062] Further, the driving wheel mechanism includes a first driving wheel 43 and a synchronous belt device 42, the synchronous belt device 42 includes a first transmission gear 424, a second transmission gear 423 and a synchronous belt 422, the first transmission gear 424 is connected to the second transmission gear 423 based on the synchronous belt 422. The output shaft of the driving motor 41 is sleeved in the first transmission gear 424, the first driving wheel 43 and the second transmission gear 423 are coaxially arranged and connected based on a connecting shaft. The driving motor 41 drives the first driving wheel 43 to rotate through the synchronous belt device 42, and the first driving wheel 43 is connected with the wafer workpiece, thereby driving the wafer workpiece to rotate.

[0063] Furthermore, a protective cover 421 is provided on the driving wheel mechanism, and the protective cover 421 covers the synchronous belt device 42 to protect the synchronous belt device 42, ensure the normal operation of the device, and improve the appearance of the equipment.

[0064] Specifically, the first driving wheel assembly 4 further includes a second mounting plate 46, a second bottom plate 47, a second guide rail 45, a second slider 44, and a second lifting cylinder 48. The second guide rail 45 is arranged on the second bottom plate 47, the second slider 44 is slidably connected to the second guide rail 45, and the second mounting plate 46 is fixed to the second slider 44. The driving wheel mechanism is fixed to the second mounting plate 46 and can move on the second guide rail 45 based on the second slider 44.

[0065] Furthermore, the driving wheel mechanism is fixed on the second mounting plate 46, and the output shaft of the second lifting cylinder 48 is connected to the driving wheel mechanism. A connecting block 481 is provided on the output shaft of the second lifting cylinder 48, and one end of the connecting block 481 is fixed on the driving wheel mechanism. The second lifting cylinder 48 is a telescopic cylinder, and the second lifting cylinder 48 can drive the driving wheel mechanism to move.

[0066] Specifically, the driving wheel mechanism is provided with a top block 49, and the top block 49 is provided with a top plate 491. When the first driven wheel assembly 2 and the second driven wheel assembly 3 push out the wafer workpiece, the first driving wheel 43 mechanism moves toward the direction of the wafer workpiece, and the top plate 491 contacts the top of the wafer workpiece and lifts the wafer workpiece. When the wafer workpiece contacts and cooperates with the driving wheel, the top plate 491 disengages from the wafer workpiece, thereby facilitating the first driving wheel assembly 4 to drive the wafer workpiece to rotate.

[0067] Specifically, a second origin switch is provided on the second mounting plate 46, and a second induction sheet 431 is provided at the bottom of the driving wheel, and the second induction sheet 431 cooperates with the second origin switch. When the driving wheel mechanism is reset based on the second lifting cylinder 48, the second induction sheet 431 cooperates with the second origin switch to contact, the second lifting cylinder 48 stops working, and the first driving wheel assembly 4 is reset.

[0068] Furthermore, the second driving wheel assembly 5 has the same structural features and functional effects as the first driving wheel assembly 4 , and the structural features and functional effects of the first driving wheel assembly 4 may be specifically referred to, and will not be described in detail here.

[0069] Specifically, when the first driven wheel assembly 2 and the second driven wheel assembly 3 move toward the wafer workpiece, the first driving wheel assembly 4 and the second driving wheel assembly 5 move toward the wafer workpiece synchronously. During the process of the wafer workpiece being ejected by the first driven wheel assembly 2 and the second driven wheel assembly 3, the wafer workpiece contacts the first driving wheel assembly 4 and the second driving wheel assembly 5. Based on the top plate 491 being lifted by the first driving wheel assembly 4 and the second driving wheel assembly 5, the wafer workpiece is cooperatively connected with the first driving wheel assembly 4, the second driving wheel assembly 5, the first driven wheel assembly 2 and the second driven wheel assembly 3.

[0070] Furthermore, the wafer workpiece is in an inclined state, and based on the effect of its own gravity, it can be closely connected with the driving wheel assembly and the driven wheel assembly, maintain a lifted state, and be out of contact with the material frame, so as to facilitate rotation detection.

[0071] Specifically, Figure 7 A side view of the detection component structure in an embodiment of the present invention is shown. Figure 8 The front view of the detection assembly structure in the embodiment of the present invention is shown. The detection assembly 6 includes a first camera 61 and a second camera 62, wherein the first camera 61 is arranged above the driving wheel assembly, and the second camera 62 is arranged below the driving wheel assembly, and the shooting directions of the first camera 61 and the second camera 62 are toward the driving wheel assembly.

[0072] The first camera 61 and the second camera 62 are 2000W black and white cameras with a pixel resolution of 0.022 mm / pixel, which can detect defects of 0.1 mm and accurately detect the appearance of the wafer workpiece.

[0073] Specifically, the detection component 6 also includes a first light board 63, a second light board 64 and a third light board 65. The first light board 63 is arranged above the support frame 87, the second light board 64 is arranged below the support frame 87, and the third light board 65 is arranged between the first light board 63 and the second light board 64. The first light board 63, the second light board 64 and the third light board 65 provide lighting for wafer appearance inspection to meet the lighting requirements of the inspection.

[0074] Furthermore, during the inspection process, the wafer workpiece is ejected by the first driven wheel assembly 2 and the second driven wheel assembly 3, and partially extends out of the material frame. The lighting direction of the first lamp board 63 is toward the top surface of the wafer workpiece, the lighting direction of the second lamp board 64 is toward the bottom surface of the wafer workpiece, and the lighting direction of the third lamp board 65 is toward the circumferential side wall of the wafer workpiece.

[0075] Furthermore, the light emitted by the first light board 63 and the second light board 64 may be highly uniform light, and the light emitted by the first light board 63 and the second light board 64 may also be strip-shaped surface light. The light emitted by the third light board 65 is arc strip-shaped light.

[0076] Specifically, the detection component 6 also includes a mounting bracket 66, a third guide rail 68, a third slider 67 and a third mounting plate 69. The mounting bracket 66 is fixed to one end of the support frame 87, the third guide rail 68 is fixed to the mounting bracket 66, the third slider 67 is slidably connected to the third guide rail 68, and the third mounting plate 69 is fixed to the third slider 67.

[0077] Further, the third lamp board 65 is fixed on the third mounting plate 69, and the first lamp board 63 and the second lamp board 64 are connected and fixed on the third mounting plate 69 based on a connecting bracket. The first lamp board 63, the second lamp board 64 and the third lamp board 65 can move on the third guide rail 68 with the third mounting plate 69, so as to facilitate the loading and unloading operation of the wafer appearance inspection machine.

[0078] Furthermore, the angles of the first light board 63 and the second light board 64 can be adjusted. According to the tilt angle of the main frame, the illumination angles of the first light board 63 and the second light board 64 are adjusted to meet the requirement of highly uniform strip light irradiating the top and bottom surfaces of the wafer workpiece during the detection process.

[0079] Specifically, a third sensing plate 691 and a clamping block 693 are provided on one end of the third mounting plate 69, and a micro-sensing switch 692 and a buckle 694 are provided on the other end of the support frame 87. When the third mounting plate 69 moves to the other end of the support frame 87, the third sensing plate 691 cooperates with the micro-sensing switch 692, and the clamping block 693 cooperates with the buckle 694 to be locked, and the detection component 6 starts to work.

[0080] Specifically, the detection principle of the wafer appearance inspection machine is that the lifting assembly 7 is at the origin position, the material frame containing the workpiece to be inspected is placed on the pallet, and the first driven wheel assembly 2 and the second driven wheel assembly 3 push out the wafer workpiece at the bottom of the material frame, and extend part of the wafer workpiece into the detection range of the inspection assembly 6. The first camera 61 and the second camera 62 collect the surface appearance information of the wafer workpiece, and send the information to the processing system of the inspection machine for analysis and processing.

[0081] Specifically, the first driving wheel assembly 4 and the second driving wheel assembly 5 cooperate with the first driven wheel assembly 2 and the second driven wheel assembly 3 to lift and fix the wafer workpiece, and the first driving wheel assembly 4 and the second driving wheel assembly 5 drive the wafer workpiece to rotate. During the detection process, the first driving wheel assembly 4 and the second driving wheel assembly 5 rotate the wafer workpiece by a preset angle, and after staying for a preset time, continue to drive the wafer workpiece to rotate by a preset angle until the wafer workpiece completes the detection.

[0082] Furthermore, the preset angle can be 40°, the preset time can be 0.3 seconds, the detection component 6 completes a shot within 0.3 seconds, completes the detection and analysis during the rotation of the wafer workpiece, and completes the detection of the wafer workpiece after 9 shots and detections.

[0083] Specifically, after completing the appearance inspection of a wafer workpiece, the first driving wheel assembly 4, the second driving wheel assembly 5, the first driven wheel assembly 2 and the second driven wheel assembly 3 are reset, and the wafer workpiece is returned to the material frame under the action of its own gravity. The lifting assembly 7 drives the material frame to move downward a preset distance so that the next wafer workpiece is in the inspection position, and the inspection machine starts to perform wafer appearance inspection until all wafer workpieces in the material frame are inspected.

[0084] Furthermore, the preset distance is adjusted according to the spacing between two adjacent wafer workpieces and may be 10 mm.

[0085] The present invention provides a wafer appearance inspection machine, which arranges a material frame with a workpiece to be inspected at an angle, pushes part of the workpiece out of the material frame through a driven wheel assembly, and performs rotation inspection in cooperation with a driving wheel assembly, without the need to take all the workpieces out of the material frame for inspection, and a camera on the inspection assembly performs double-sided photography inspection when the workpiece is paused, and the inspection machine analyzes and processes the photographed data when the workpiece rotates, thereby improving the inspection efficiency, and after the inspection is completed, the workpiece falls back onto the material frame under the action of its own gravity, thereby avoiding direct contact of the equipment with the workpiece surface, and effectively reducing the defective rate of workpiece inspection.

[0086] A person skilled in the art may understand that all or part of the steps in the various methods of the above embodiments may be completed by instructing related hardware through a program, and the program may be stored in a computer-readable storage medium, and the storage medium may include: a read-only memory (ROM), a random access memory (RAM), a disk or an optical disk, etc.

[0087] In addition, the above is a detailed introduction to a wafer appearance inspection machine provided by an embodiment of the present invention. Specific examples are used herein to illustrate the principles and implementation methods of the present invention. The description of the above embodiments is only used to help understand the method of the present invention and its core idea; at the same time, for those skilled in the art, according to the idea of ​​the present invention, there will be changes in the specific implementation methods and application scopes. In summary, the content of this specification should not be understood as a limitation on the present invention.

Claims

1. A wafer appearance inspection machine, characterized in that: The wafer appearance inspection machine comprises a machine body, a lifting assembly, a driven wheel assembly, a driving wheel assembly and a detection assembly; The machine body is provided with an inclined main frame, the lifting assembly is fixed on the main frame, the main frame is provided with a supporting frame, and the supporting frame and the main frame are perpendicular to each other; The driven wheel assembly is located on a side of the support frame close to the main frame, and the driven wheel assembly includes a first lifting cylinder and a matching wheel mechanism, wherein the output shaft of the first lifting cylinder is connected to the matching wheel mechanism; The driving wheel assembly is located at the other side of the support frame, and the driving wheel assembly includes a driving motor and a driving wheel mechanism, and the output shaft of the driving motor is connected to the driving wheel mechanism; The detection assembly is arranged on the side of the driving wheel assembly, and the detection assembly includes a first camera and a second camera, the first camera is fixed to the upper end of the interior of the body, and the second camera is fixed to the lower end of the interior of the body, and the shooting directions of the first camera and the second camera are toward the support frame; The driven wheel assembly further comprises a first bottom plate, a first guide rail and a first slider, and the mating wheel mechanism comprises a mating wheel and a first mounting plate; The first guide rail is arranged on the first bottom plate, and the first sliding block is slidably connected to the first guide rail; One end of the first mounting plate is fixed on the first sliding block, and the other end of the first mounting plate is connected to the matching wheel, and a matching groove is provided on the circumferential outer wall of the matching wheel, and the matching groove matches with the wafer workpiece, and the workpiece is ejected through the driven wheel assembly and the driving wheel assembly and then rotated for detection; The material frame with the workpiece to be inspected is arranged at an angle, and the workpiece is partially ejected from the material frame by the driven wheel assembly, and the driving wheel assembly is cooperated to perform rotation inspection.

2. The wafer appearance inspection machine according to claim 1, characterized in that: The main frame includes a first fixing seat fixed to the bottom plate inside the machine body, a second fixing seat fixed to the top plate inside the machine body, and a fixing plate; The first fixing seat is provided with a first rotating shaft, the second fixing seat is provided with a second rotating shaft, one end of the fixing plate is sleeved on the first rotating shaft, and the other end of the fixing plate is sleeved on the second rotating shaft.

3. The wafer appearance inspection machine according to claim 1, characterized in that: The lifting assembly includes an electric slide, a servo motor, a sliding member slidably connected to the electric slide, and a support plate fixed to the sliding member, the electric slide is arranged on the main frame, and the driving end of the servo motor is connected to the electric slide; The support plate and the sliding member are perpendicular to each other, and the support plate is used for carrying a workpiece.

4. The wafer appearance inspection machine according to claim 3, characterized in that: The electric slide also includes a first limit switch, a second limit switch, a first origin switch and a first induction sheet; The first limit switch is located at one end of the side wall of the electric slide, the second limit switch is located at the other end of the side wall of the electric slide, and the first origin switch is located between the first limit switch and the second limit switch; The first sensing sheet is located on the side wall of the sliding member.

5. The wafer appearance inspection machine according to claim 1, characterized in that: The driving wheel assembly also includes a second mounting plate, a second bottom plate, a second guide rail and a second slider; The second guide rail is arranged on the second bottom plate, the second slider is slidably connected to the second guide rail, and the second mounting plate is fixed on the second slider; The driving motor and the driving wheel mechanism are arranged on the second mounting plate.

6. The wafer appearance inspection machine according to claim 1, characterized in that: The driving wheel mechanism includes a first driving wheel and a synchronous belt device, the synchronous belt device includes a first transmission gear, a second transmission gear and a synchronous belt, and the first transmission gear is connected to the second transmission gear based on the synchronous belt; The output shaft of the driving motor is sleeved in the first transmission gear, and the first driving wheel is coaxially arranged with the second transmission gear and connected based on a connecting shaft.

7. The wafer appearance inspection machine according to claim 1, characterized in that: The driving wheel mechanism is provided with a top block, the top block is provided with a top plate, and the top plate is used to lift the workpiece.

8. The wafer appearance inspection machine according to claim 1, characterized in that: The detection assembly includes a mounting bracket, a third mounting plate, a third guide rail and a third slide block; The mounting bracket is fixed to one side of the support frame, and the third guide rail is arranged on the mounting bracket; The third sliding block is slidably connected to the third guide rail, and the third mounting plate is fixed on the third sliding block.

9. The wafer appearance inspection machine according to claim 8, characterized in that: The detection assembly also includes a first light board, a second light board, a third light board, a first connecting frame and a second connecting frame; One end of the first connecting frame is fixed to the upper end of the third mounting plate, and the second connecting frame is fixed to the lower end of the third mounting plate; The first light board is fixed to the other end of the first connecting frame, and the second light board is fixed to the other end of the second connecting frame; The third lamp board is fixed on the third mounting plate.

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