Wafer tape-out and manufacturing method thereof

Abstract

The present invention discloses a wafer flow sheet and a manufacturing method thereof, which relates to the field of wafer flow sheet processing technology, including manufacturing equipment, a second pulley, a second servo motor and a drive motor, wherein the bottom end of the manufacturing equipment is fixedly connected to a fixed column, one side of the fixed column is fixedly connected to a reinforcement rod, and the other side of the fixed column is fixedly connected to a cross bar, and the manufacturing equipment is provided with a collection port, and a limit plate is fixedly installed on the bottom end of the collection port, and a collection box is inserted into the limit plate. The present invention has a reasonable structure, realizes the preliminary fixation of the position of the single crystal silicon ingot by the clamping component, and then locates the position of the single crystal silicon ingot by the limit component, and the limit component can be adjusted according to the single crystal silicon ingots of different sizes, and finally the single crystal is cut by the cutting component.

Description

Technical Field

[0001] The present invention relates to the technical field of wafer flow processing, and in particular to a wafer flow and a manufacturing method thereof. Background Art

[0002] A wafer is the silicon chip used to manufacture semiconductor integrated circuits. Because of its round shape, it's called a wafer. A chip is a small silicon chip containing an integrated circuit, often part of a computer or other electronic device. Tapeout refers to the process of manufacturing a chip through a series of steps, similar to an assembly line. Successful chip tapeout refers to the successful, error-free manufacture of a chip through a series of steps, similar to an assembly line. In the field of integrated circuit design, "tapeout" refers to "trial production," meaning that after the circuit design is completed, a few chips are produced... What is tapeout? It's manufactured through a series of processes, similar to an assembly line.

[0003] When existing single crystal silicon ingots are cut into slices, most of them are cut by manually holding the single crystal silicon ingot and using a cutting device. However, during the cutting process, workers are unable to well control the vibrations generated during the cutting process, resulting in an uneven cut surface of the single crystal silicon ingot. Therefore, the present application provides a wafer flow and a manufacturing method thereof to meet the needs. Summary of the Invention

[0004] The purpose of this application is to provide a wafer flow and a manufacturing method thereof, which realizes the preliminary fixation of the position of the single crystal silicon ingot by a clamping component, and then positioning the position of the single crystal silicon ingot by a limiting component. The limiting component can be adjusted according to the single crystal silicon ingots of different sizes, and finally the single crystal is cut by the cutting component.

[0005] To achieve the above-mentioned objectives, the present application provides the following technical solutions: a wafer flow manufacturing device, including manufacturing equipment, a second pulley, a second servo motor and a drive motor, the bottom end of the manufacturing equipment is fixedly connected to a fixed column, one side of the fixed column is fixedly connected to a reinforcement rod, the other side of the fixed column is fixedly connected to a cross bar, a material collection port is opened on the manufacturing equipment, a limiting plate is fixedly installed on the bottom end of the material collection port, a collection box is inserted into the limiting plate, one side of the collection box is fixedly connected to a handle, and a console is fixedly installed on the manufacturing equipment; it also includes a clamping assembly, a limiting assembly and a cutting assembly, the clamping assembly is used to fix the raw materials for wafer flow, the limiting assembly is used in conjunction with the limiting assembly, and the cutting assembly is used to cut the raw materials for wafer flow.

[0006] Preferably, the clamping assembly includes a processing table fixedly mounted on the manufacturing equipment, a collecting plate fixedly mounted on the processing table, a slide groove is provided on the top of the collecting plate, a guide rail is provided on the collecting plate, a pair of shaft rod seats are fixedly mounted on the processing table, a rotating rod is rotatably connected to the pair of shaft rod seats, a gear disk is fixedly mounted on the rotating rod, a first pulley is fixedly mounted on one end of the rotating rod, a transmission belt is sleeved on the first pulley, the bottom end of the transmission belt is sleeved on the second pulley, the second pulley is fixedly mounted on the first servo motor, and the first servo motor is fixedly mounted on the manufacturing equipment.

[0007] Preferably, a slide is slidably connected to the inside of the slide groove, and the slide is fixedly mounted on the rack. One end of the rack is fixedly connected to a circular ring. A first bolt is threadedly connected to the circular ring. The bottom end of the first bolt is rotatably connected to a splint. A storage plate is fixedly mounted on the circular ring. A slider is fixedly mounted on the bottom end of the storage plate. The slider is slidably connected to the guide rail.

[0008] Preferably, two groups of toothed discs are provided, and the toothed discs and the racks are meshed with each other.

[0009] Preferably, the limiting assembly includes a fixed seat fixedly mounted on the top of the collecting plate, a second bolt is threadedly connected to the fixed seat, the top of the second bolt extends to the outside of the fixed seat, a pair of sliding rods are fixedly connected to the inside of the fixed seat, a moving block is slidably connected to the sliding rods, one side of the moving block is rotatably connected to a rotating shaft, and a roller is fixedly mounted on the rotating shaft.

[0010] Preferably, a spring is sleeved on the pair of sliding rods, and two ends of the spring are fixedly connected to the inner wall of the fixing seat and the top end of the moving block respectively.

[0011] Preferably, the cutting assembly includes a control box on the manufacturing equipment, a cavity is opened inside the control box, a threaded rod is rotatably connected inside the control box, one end of the threaded rod extends to the outside of the control box, one end of the threaded rod is fixedly connected to the output end of the second servo motor, the second servo motor is fixedly installed on the manufacturing equipment, a sleeve block is sleeved on the threaded rod, the sleeve block is fixedly installed on the mounting seat, the mounting seat is attached to the top of the control box, a drive motor is fixedly installed on the mounting seat, and a cutting blade is fixedly installed on the output end of the drive motor.

[0012] Preferably, an internal thread is provided inside the sleeve block, and the sleeve block and the threaded rod form a spiral rotation structure.

[0013] Preferably, the cutting blade is located on one side of the collecting plate, and the cutting blade is located at the upper end of the collecting opening.

[0014] The present invention also provides a wafer taping manufacturing method, comprising the following steps:

[0015] S1. Heating the deoxidized sand and melting it;

[0016] S2, extracting the silicon from the heated sand and shaping the single crystal silicon ingot into a cylindrical shape through a mold;

[0017] S3. Then place the single crystal silicon ingot inside the aggregate plate and fix it with a circular ring. Then, the rack is moved by rotating the toothed disc, and its position is positioned by the limiting component. Then, the columnar single crystal silicon ingot is sliced ​​by the cutting component.

[0018] In summary, the technical effects and advantages of the present invention are as follows:

[0019] 1. The present invention has a reasonable structure. When the position of the single crystal silicon ingot needs to be fixed, the single crystal silicon ingot is placed in the ring on the collecting plate, and then the first bolt on the ring is rotated. The rotation of the first bolt causes the clamping plate to fit on the top of the single crystal silicon ingot. After the single crystal silicon ingot is fixed, the control console is operated to operate the first servo motor. The operation of the first servo motor causes the second pulley to rotate. The rotation of the second pulley drives the first pulley to rotate through the transmission belt. The first pulley is fixedly mounted on the rotating rod, and a toothed disc is fixedly mounted on the rotating rod. The rotation of the first pulley causes the toothed disc to drive the entire slide to move, thereby facilitating the movement of the single crystal silicon ingot.

[0020] 2. In the present invention, when the single crystal silicon ingot is moved to the fixed seat position, a slide rod is fixedly connected to the interior of the fixed seat, and a moving block is slidably connected to the slide rod. A spring is sleeved on the slide rod, and the elastic force of the spring causes the roller on the moving block to move downward, thereby facilitating the roller to roll on the single crystal silicon ingot, thereby preventing the single crystal silicon ingot from shifting during the cutting process. When the size of the single crystal silicon ingot is too small, the second bolt on the fixed seat is rotated, and the rotation of the second bolt pushes the moving block to move, thereby facilitating the roller to adapt to single crystal silicon ingots of different sizes.

[0021] 3. In the present invention, when the single crystal silicon ingot is cut and the single crystal silicon ingot on the ring is moved to the cutting blade position, the second servo motor is operated through the operation console, and a threaded rod is fixedly connected to the output end of the second servo motor, and the threaded rod is rotatably inserted into the interior of the control box. The threaded rod is rotated by the operation of the second servo motor, and a sleeve is provided on the threaded rod. The sleeve is moved by the rotation of the threaded rod, and the movement of the sleeve drives the mounting seat to move, thereby facilitating the cutting blade on the driving motor to slice the single crystal silicon ingot back and forth, and the sheet-like wafer flow will fall into the interior of the collection box through the collection port for centralized collection. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present application. For those skilled in the art, other drawings can be obtained based on these drawings without paying any creative work.

[0023] Figure 1 It is a schematic diagram of the side structure of the manufacturing equipment;

[0024] Figure 2 It is a schematic diagram of the three-dimensional structure of the manufacturing equipment;

[0025] Figure 3 This is a schematic diagram of the three-dimensional structure of the manufacturing equipment when viewed from above;

[0026] Figure 4 This is a schematic diagram of the three-dimensional structure of the manufacturing equipment from a top view;

[0027] Figure 5 It is a schematic diagram of the three-dimensional structure of the control box;

[0028] Figure 6 It is a schematic diagram of the three-dimensional structure of the clamping component;

[0029] Figure 7 It is a schematic diagram of the three-dimensional structure of the limiting component.

[0030] In the figure: 1. Manufacturing equipment; 101. Fixed column; 102. Reinforcement rod; 103. Crossbar; 104. Collecting port; 105. Limit plate; 106. Collecting box; 107. Handle; 108. Control console; 2. Processing table; 201. Collecting plate; 202. Slide; 203. Guide rail; 204. Shaft seat; 205. Rotating rod; 206. Toothed disc; 207. First pulley; 208. Transmission belt; 209. Second pulley; 210. First servo motor Machine; 3. Slide plate; 301. Rack; 302. Ring; 303. First bolt; 304. Clamp; 305. Storage plate; 306. Slider; 4. Fixed seat; 401. Second bolt; 402. Slide bar; 403. Spring; 404. Moving block; 405. Rotating shaft; 406. Roller; 5. Control box; 501. Threaded rod; 502. Second servo motor; 503. Bushing block; 504. Mounting seat; 505. Drive motor; 506. Cutting disc. DETAILED DESCRIPTION

[0031] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0032] Example: Reference Figure 1-3 The wafer flow manufacturing device shown includes a manufacturing device 1, a second pulley 209, a second servo motor 502 and a drive motor 505. The bottom end of the manufacturing device 1 is fixedly connected to a fixed column 101, one side of the fixed column 101 is fixedly connected to a reinforcing rod 102, and the other side of the fixed column 101 is fixedly connected to a cross bar 103. A collection port 104 is opened on the manufacturing device 1, and a limiting plate 105 is fixedly installed on the bottom end of the collection port 104. A collection box 106 is inserted on the limiting plate 105, and a handle 107 is fixedly connected to one side of the collection box 106. A control console 108 is fixedly installed on the manufacturing device 1; it also includes a clamping assembly, a limiting assembly and a cutting assembly. The clamping assembly is used to fix the raw materials for wafer flow, the limiting assembly is used in conjunction with the limiting assembly, and the cutting assembly is used to cut the raw materials for wafer flow.

[0033] Specifically, it should be noted that the second pulley 209, the second servo motor 502 and the drive motor 505 are electrically connected to the console 108 through wires, and the specific working principles therebetween are referenced through existing technologies and will not be elaborated on here. The position of the single crystal silicon ingot is initially fixed by the clamping assembly on the collecting plate 201, and then the position of the single crystal silicon ingot can be positioned by the limiting assembly to prevent shaking during the cutting process, and then the cutting work is performed by the cutting assembly.

[0034] As an implementation method in this embodiment, according to the attached Figure 6 As shown, the clamping assembly includes a processing table 2 fixedly mounted on the manufacturing equipment 1, a collecting plate 201 is fixedly mounted on the processing table 2, a slide groove 202 is provided on the top of the collecting plate 201, a guide rail 203 is provided on the collecting plate 201, a pair of shaft rod seats 204 are fixedly mounted on the processing table 2, a rotating rod 205 is rotatably connected to the pair of shaft rod seats 204, a toothed disc 206 is fixedly mounted on the rotating rod 205, a first pulley 207 is fixedly mounted on one end of the rotating rod 205, a transmission belt 208 is sleeved on the first pulley 207, the bottom end of the transmission belt 208 is sleeved on the second pulley 209, and the second pulley 209 is fixedly mounted On the first servo motor 210, the first servo motor 210 is fixedly installed on the manufacturing equipment 1, and the slide 3 is slidably connected to the inside of the slide groove 202, and the slide 3 is fixedly installed on the rack 301. One end of the rack 301 is fixedly connected to the ring 302, and the first bolt 303 is threadedly connected to the ring 302. The bottom end of the first bolt 303 is rotatably connected to the clamping plate 304, and a storage plate 305 is fixedly installed on the ring 302. The bottom end of the storage plate 305 is fixedly installed with a slider 306, and the slider 306 is slidably connected in the guide rail 203. Two groups of toothed discs 206 are provided, and the toothed discs 206 and the rack 301 are engaged with each other.

[0035] Specifically, when it is necessary to fix the position of the single crystal silicon ingot, the single crystal silicon ingot is placed in the ring 302 on the collecting plate 201, and then the first bolt 303 on the ring 302 is rotated. The rotation of the first bolt 303 makes the clamping plate 304 fit on the top of the single crystal silicon ingot. After fixing the single crystal silicon ingot, the control console 108 is operated to operate the first servo motor 210. The operation of the first servo motor 210 causes the second pulley 209 to rotate. The rotation of the second pulley 209 drives the first pulley 207 to rotate through the transmission belt 208. The first pulley 207 is fixedly mounted on the rotating rod 205, and a gear disk 206 is fixedly mounted on the rotating rod 205. The rotation of the first pulley 207 causes the gear disk 206 to drive the slide plate 3 to move as a whole, thereby facilitating the movement of the single crystal silicon ingot.

[0036] As an implementation method in this embodiment, according to the attached Figure 7 As shown, the limiting assembly includes a fixed base 4 fixedly mounted on the top of the collecting plate 201, a second bolt 401 is threadedly connected to the fixed base 4, the top of the second bolt 401 extends to the outside of the fixed base 4, a pair of slide rods 402 are fixedly connected to the inside of the fixed base 4, a moving block 404 is slidably connected to the slide rods 402, one side of the moving block 404 is rotatably connected to a rotating shaft 405, a roller 406 is fixedly mounted on the rotating shaft 405, a pair of slide rods 402 are provided with a spring 403, and the two ends of the spring 403 are respectively fixedly connected to the inner wall of the fixed base 4 and the top of the moving block 404.

[0037] Specifically, when the single crystal silicon ingot moves to the position of the fixed seat 4, a slide rod 402 is fixedly connected to the inside of the fixed seat 4, and a moving block 404 is slidably connected to the slide rod 402, and a spring 403 is sleeved on the slide rod 402. The elastic force of the spring 403 causes the roller 406 on the moving block 404 to move downward, thereby facilitating the roller 406 to roll on the single crystal silicon ingot, preventing the single crystal silicon ingot from shifting during the cutting process. When the size of the single crystal silicon ingot is too small, the second bolt 401 on the fixed seat 4 is rotated, and the rotation of the second bolt 401 pushes the moving block 404 to move, thereby facilitating the roller 406 to be suitable for single crystal silicon ingots of different sizes.

[0038] As an implementation method in this embodiment, according to the attached Figure 4 and 5 As shown, the cutting assembly includes a control box 5 on the manufacturing equipment 1, and a cavity is opened inside the control box 5. The control box 5 has a threaded rod 501 rotatably connected inside the control box 5. One end of the threaded rod 501 extends to the outside of the control box 5, and one end of the threaded rod 501 is fixedly connected to the output end of the second servo motor 502. The second servo motor 502 is fixedly installed on the manufacturing equipment 1. A sleeve 503 is sleeved on the threaded rod 501, and the sleeve 503 is fixedly installed on the mounting seat 504. The mounting seat 504 fits the top of the control box 5, and a driving motor 505 is fixedly installed on the mounting seat 504. A cutting blade 506 is fixedly installed on the output end of the driving motor 505, and an internal thread is provided inside the sleeve 503. The sleeve 503 and the threaded rod 501 form a spiral rotating structure. The cutting blade 506 is located on one side of the collecting plate 201, and the cutting blade 506 is located at the upper end of the collecting port 104.

[0039] Specifically, when the single crystal silicon ingot is cut, when the single crystal silicon ingot on the ring 302 moves to the position of the cutting blade 506, the second servo motor 502 is operated by operating the console 108. A threaded rod 501 is fixedly connected to the output end of the second servo motor 502, and the threaded rod 501 is rotatably inserted into the interior of the control box 5. The threaded rod 501 is rotated by the operation of the second servo motor 502, and a sleeve block 503 is sleeved on the threaded rod 501. The sleeve block 503 is moved by the rotation of the threaded rod 501, and the movement of the sleeve block 503 drives the mounting seat 504 to move, thereby facilitating the cutting blade 506 on the driving motor 505 to slice the single crystal silicon ingot back and forth. The sheet-like wafer flow will fall into the interior of the collection box 106 through the collection port 104 for centralized collection.

[0040] Working principle of the present invention: when the position of the single crystal silicon ingot needs to be fixed, the single crystal silicon ingot is placed in the ring 302 on the collecting plate 201, and then the first bolt 303 on the ring 302 is rotated, and the rotation of the first bolt 303 makes the clamping plate 304 fit on the top of the single crystal silicon ingot. After the single crystal silicon ingot is fixed, the control console 108 is operated to operate the first servo motor 210, and the operation of the first servo motor 210 rotates the second pulley 209. The rotation of the second pulley 209 drives the first pulley 207 to rotate through the transmission belt 208. The first pulley 207 is fixedly mounted on the rotating rod 205, and the rotating rod 205 is fixedly mounted with a toothed disc 206. The rotation of the first pulley 207 causes the toothed disc 206 to drive the slide plate 3 to move as a whole, thereby facilitating the movement of the single crystal silicon ingot.

[0041] When the single crystal silicon ingot moves to the position of the fixed seat 4, a slide rod 402 is fixedly connected to the interior of the fixed seat 4, and a moving block 404 is slidably connected to the slide rod 402. A spring 403 is sleeved on the slide rod 402. The elastic force of the spring 403 causes the roller 406 on the moving block 404 to move downward, thereby facilitating the roller 406 to roll on the single crystal silicon ingot, thereby preventing the single crystal silicon ingot from shifting during the cutting process. When the size of the single crystal silicon ingot is too small, the second bolt 401 on the fixed seat 4 is rotated, and the rotation of the second bolt 401 pushes the moving block 404 to move, thereby facilitating the roller 406 to be suitable for single crystal silicon ingots of different sizes.

[0042] When the single crystal silicon ingot is cut, when the single crystal silicon ingot on the ring 302 moves to the position of the cutting blade 506, the second servo motor 502 is operated by operating the control console 108. A threaded rod 501 is fixedly connected to the output end of the second servo motor 502, and the threaded rod 501 is rotatably inserted into the interior of the control box 5. The threaded rod 501 is rotated by the operation of the second servo motor 502, and a sleeve block 503 is sleeved on the threaded rod 501. The sleeve block 503 is moved by the rotation of the threaded rod 501, and the movement of the sleeve block 503 drives the mounting seat 504 to move, thereby facilitating the cutting blade 506 on the driving motor 505 to slice the single crystal silicon ingot back and forth. The sheet-like wafer flow will fall into the interior of the collection box 106 through the collection port 104 for centralized collection.

[0043] The present invention also provides a wafer taping manufacturing method, comprising the following steps:

[0044] S1. Heating the deoxidized sand and melting it;

[0045] S2, extracting the silicon from the heated sand and shaping the single crystal silicon ingot into a cylindrical shape through a mold;

[0046] S3. Then place the single crystal silicon ingot inside the collecting plate 201 and fix it with the ring 302. Then, the rack 301 is moved by rotating the toothed disc 206. Its position is positioned by the limiting assembly. Then, the columnar single crystal silicon ingot is sliced ​​by the cutting assembly.

[0047] Finally, it should be noted that the above is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art can still modify the technical solutions described in the aforementioned embodiments or make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. A wafer flow manufacturing device, comprising a manufacturing device (1), a second pulley (209), a second servo motor (502) and a drive motor (505), characterized in that: The bottom end of the manufacturing equipment (1) is fixedly connected to a fixed column (101), one side of the fixed column (101) is fixedly connected to a reinforcement rod (102), and the other side of the fixed column (101) is fixedly connected to a cross bar (103). The manufacturing equipment (1) is provided with a material collection port (104), the bottom end of the material collection port (104) is fixedly installed with a limiting plate (105), a collection box (106) is inserted into the limiting plate (105), and one side of the collection box (106) is fixedly connected to a handle (107). The manufacturing equipment (1) is fixedly installed with a control console (108); It also includes a clamping assembly, a limiting assembly and a cutting assembly, wherein the clamping assembly is used to fix the raw materials of the wafer flow, the limiting assembly is used in conjunction with the limiting assembly, and the cutting assembly is used to cut the raw materials of the wafer flow; The clamping assembly includes a processing table (2) fixedly mounted on the manufacturing equipment (1), a collecting plate (201) fixedly mounted on the processing table (2), a slide groove (202) provided at the top of the collecting plate (201), a guide rail (203) provided on the collecting plate (201), a pair of shaft rod seats (204) fixedly mounted on the processing table (2), a rotating rod (205) rotatably connected to the pair of shaft rod seats (204), a toothed disc (206) fixedly mounted on the rotating rod (205), a first pulley (207) fixedly mounted on one end of the rotating rod (205), a transmission belt (208) sleeved on the first pulley (207), the bottom end of the transmission belt (208) sleeved on the second pulley (209), the The second pulley (209) is fixedly mounted on the first servo motor (210), the first servo motor (210) is fixedly mounted on the manufacturing equipment (1), the interior of the slide groove (202) is slidably connected to a slide plate (3), the slide plate (3) is fixedly mounted on a rack (301), one end of the rack (301) is fixedly connected to a circular ring (302), a first bolt (303) is threadedly connected to the circular ring (302), the bottom end of the first bolt (303) is rotatably connected to a clamping plate (304), a storage plate (305) is fixedly mounted on the circular ring (302), a slider (306) is fixedly mounted on the bottom end of the storage plate (305), and the slider (306) is slidably connected to the inside of the guide rail (203); The limiting assembly includes a fixing seat (4) fixedly mounted on the top of the collecting plate (201), a second bolt (401) being threadedly connected to the fixing seat (4), the top of the second bolt (401) extending to the outside of the fixing seat (4), a pair of sliding rods (402) being fixedly connected to the inside of the fixing seat (4), a moving block (404) being slidably connected to the sliding rods (402), one side of the moving block (404) being rotatably connected to a rotating shaft (405), and a roller (406) being fixedly mounted on the rotating shaft (405).

2. The wafer fabrication device according to claim 1, wherein: The toothed discs (206) are provided in two groups, and the toothed discs (206) and the racks (301) are meshed with each other.

3. The wafer fabrication device according to claim 1, wherein: A spring (403) is sleeved on a pair of the slide bars (402), and two ends of the spring (403) are fixedly connected to the inner wall of the fixed seat (4) and the top end of the moving block (404) respectively.

4. The wafer fabrication device according to claim 3, wherein: The cutting assembly comprises a control box (5) on the manufacturing equipment (1), a cavity is provided inside the control box (5), a threaded rod (501) is rotatably connected inside the control box (5), one end of the threaded rod (501) extends outside the control box (5), one end of the threaded rod (501) is fixedly connected to the output end of a second servo motor (502), the second servo motor (502) is fixedly mounted on the manufacturing equipment (1), a sleeve block (503) is sleeved on the threaded rod (501), the sleeve block (503) is fixedly mounted on a mounting seat (504), the mounting seat (504) is attached to the top of the control box (5), a drive motor (505) is fixedly mounted on the mounting seat (504), and a cutting blade (506) is fixedly mounted on the output end of the drive motor (505).

5. The wafer fabrication device according to claim 4, wherein: The sleeve block (503) is provided with an internal thread inside, and the sleeve block (503) and the threaded rod (501) form a spiral rotation structure.

6. The wafer fabrication device according to claim 5, wherein: The cutting blade (506) is located on one side of the material collecting plate (201), and the cutting blade (506) is located at the upper end of the material collecting opening (104).

7. A wafer taping manufacturing method, based on a wafer taping manufacturing device according to any one of claims 1 to 6, characterized in that: The steps include: S1. Heating the deoxidized sand and melting it; S2, extracting the silicon from the heated sand and shaping the single crystal silicon ingot into a cylindrical shape through a mold; S3. The single crystal silicon ingot is then placed inside the collecting plate (201) and fixed by the ring (302). The rack (301) is moved by rotating the toothed disc (206), and its position is positioned by the limiting assembly. The columnar single crystal silicon ingot is then sliced ​​by the cutting assembly.

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