Antenna package and method of forming the same

Abstract

Embodiments of the present application provide an antenna package, comprising: a substrate; an electronic component electrically connected to a first surface of the substrate; a circuit board comprising a first portion and a second portion, the substrate and the electronic component being sandwiched between the first portion and the second portion, the second portion being attached to a second surface of the substrate opposite to the first surface; a via connecting the substrate and the first portion; a first antenna and a second antenna respectively located on the first portion and the second portion, the electronic component being electrically connected to the first antenna through the substrate, the via and the first portion. The present application aims to provide an antenna package and a forming method thereof to optimize the performance of the antenna package.

Description

Technical Field

[0001] Embodiments of this application relate to antenna packages and methods of forming thereof. Background Technology

[0002] Currently, most millimeter-wave (mmWave) antenna packaging products are designed with antennas in a single direction, which means that terminal system products need to be equipped with more than two antenna modules to meet the requirements of multi-directional signal transmission and reception.

[0003] To address the aforementioned issues, existing designs utilize printed circuit boards (FPCs) as antenna boards and additional circuit boards for radio frequency integrated circuits (RFICs). This allows the antenna pattern at one end of the FPC to be moved to a specified direction based on the bending requirements of the FPC, thereby providing the transmission and reception of radio frequency signals in that specified direction. However, FPCs are expensive and lack rigidity, limiting their ability to withstand component assembly. Summary of the Invention

[0004] In view of the problems existing in related technologies, the purpose of this invention is to provide an antenna package and a method for forming the same, so as to optimize the performance of the antenna package.

[0005] To achieve the above objectives, embodiments of the present invention provide an antenna package, comprising: a substrate; an electronic component electrically connected to a first surface of the substrate; a circuit board including a first portion and a second portion, wherein the substrate and the electronic component are sandwiched between the first portion and the second portion, and the second portion is attached to a second surface of the substrate opposite to the first surface; a through-hole connecting the substrate and the first portion; a first antenna and a second antenna respectively located on the first portion and the second portion, wherein the electronic component is electrically connected to the first antenna through the substrate, the through-hole, and the first portion.

[0006] In some embodiments, the circuit board further includes a third portion connecting the first portion and the second portion, the third portion being located on the side of the electronic component, and a third antenna located on the third portion being connected to the electronic component through the third portion, the second portion and the substrate.

[0007] In some embodiments, the third portion has a line clearance area without lines, which is located between the location of the third antenna and the second portion.

[0008] In some embodiments, the third part is a bent portion of the circuit board. In a top view viewed along the extension direction of the through hole, the circuit board has a first side and a second side intersecting the first side. The first side is shorter than the second side, and the bent portion is located at the first side.

[0009] In some embodiments, the device further includes: a first connector located on a first surface of the substrate, the first connector being disposed side-by-side with the electronic components, and the first connector being electrically connected to the substrate.

[0010] In some embodiments, the device further includes: a second connector located on the side of the first portion opposite to the first antenna, the second connector facing the first connector, the second connector being electrically connected to the first antenna through the first portion; and a lead located between the first connector and the second connector.

[0011] In some embodiments, it further includes: a molding compound covering the electronic component, a first portion being bonded to the molding compound, and a through-hole passing through the molding compound.

[0012] In some embodiments, the substrate has an extension that extends relative to the molding compound and the second portion, and a first connector is located on a first surface of the extension of the substrate.

[0013] In some embodiments, the circuit board is softer than the substrate.

[0014] In some embodiments, the first and second portions of the circuit board are not directly connected.

[0015] Embodiments of this application also provide a method for forming an antenna package, comprising: providing a substrate; electrically connecting electronic components to a first surface of the substrate; forming a through-hole on the first surface of the substrate; disposing a first portion of a circuit board on the through-hole, and disposing a second portion of the circuit board on a second surface of the substrate opposite to the first surface; forming a first antenna and a second antenna on the first portion and the second portion respectively, wherein the electronic components are electrically connected to the first antenna through the substrate, the through-hole, and the first portion of the circuit board.

[0016] In some embodiments, after electronic components are disposed on a first surface of a substrate, the electronic components are encapsulated using a molding compound, through-holes are formed in the molding compound, and a first portion of a circuit board is disposed on the molding compound and the through-holes.

[0017] In some embodiments, the method further includes forming a first connector on a first surface of the substrate, wherein the molding compound does not cover the first connector.

[0018] In some embodiments, the method further includes: forming a second connector on the side of the first portion opposite to the first antenna, the second connector not being encapsulated by a molding compound, the second connector being electrically connected to the first antenna through the first portion, and the second connector being connected to the first connector via a lead.

[0019] In some embodiments, a lamination process is used to bond a second portion of the circuit board to a second side of the substrate.

[0020] In some embodiments, after the second portion of the circuit board is disposed on the second surface, the first portion of the circuit board is disposed on the through hole.

[0021] In some embodiments, after the first portion of the circuit board is disposed on the through hole, the third portion of the circuit board connected to the first portion and the second portion is bent in a direction perpendicular to the first surface, and the third portion is further bent in a direction parallel to the first surface to dispose the second portion on the second surface, with the substrate, electronic components and the through hole sandwiched between the first portion and the second portion.

[0022] In some embodiments, a third antenna is formed on a third portion, and the third antenna is electrically connected to electronic components through the third portion, the second portion, and the substrate.

[0023] In some embodiments, the second antenna is formed on the side of the second portion opposite to the substrate.

[0024] In some embodiments, when projected along a direction perpendicular to the first surface, the substrate has a protrusion that does not overlap with the first portion, and a first connector is formed on the first surface of the protrusion. The first connector is connected to the second antenna through the substrate and the second portion. Attached Figure Description

[0025] The various aspects of the invention will be best understood from the following detailed description when read in conjunction with the accompanying drawings. It should be noted that, in accordance with standard industrial practice, the components are not drawn to scale. In fact, for clarity of discussion, the dimensions of the components may be arbitrarily increased or decreased.

[0026] Figures 1 to 10 The process of forming a semiconductor package according to an embodiment of this application is illustrated.

[0027] Figures 11 to 15 The process of forming a semiconductor package according to other embodiments of this application is illustrated.

[0028] Figures 16 to 17 The diagram shows a schematic representation of a semiconductor package according to different embodiments of this application. Detailed Implementation

[0029] To better understand the spirit of the embodiments of this application, the following description is based on some preferred embodiments of this application.

[0030] Embodiments of this application will be described in detail below. Throughout this specification, identical or similar components and components having identical or similar functions are indicated by similar reference numerals. The embodiments described herein with reference to the accompanying drawings are illustrative and diagrammatic in nature and are intended to provide a basic understanding of this application. The embodiments of this application should not be construed as limiting this application.

[0031] As used herein, the terms “approximately,” “generally,” “substantially,” and “about” are used to describe and indicate small variations. When used in conjunction with an event or situation, the terms may refer to examples in which the event or situation occurred precisely and examples in which the event or situation occurred very approximately. For example, when used in conjunction with numerical values, the terms may refer to a range of variation less than or equal to ±10% of the numerical value, such as less than or equal to ±5%, less than or equal to ±4%, less than or equal to ±3%, less than or equal to ±2%, less than or equal to ±1%, less than or equal to ±0.5%, less than or equal to ±0.1%, or less than or equal to ±0.05%. For example, if the difference between two values ​​is less than or equal to ±10% of the average of the values ​​(e.g., less than or equal to ±5%, less than or equal to ±4%, less than or equal to ±3%, less than or equal to ±2%, less than or equal to ±1%, less than or equal to ±0.5%, less than or equal to ±0.1%, or less than or equal to ±0.05%), then the two values ​​can be considered "substantially" the same.

[0032] In this specification, unless otherwise specified or limited, relative terms such as “central,” “longitudinal,” “lateral,” “front,” “rear,” “right,” “left,” “inner,” “outer,” “lower,” “higher,” “horizontal,” “vertical,” “above,” “below,” “above,” “below,” “top,” “bottom,” and their derivatives (e.g., “horizontally,” “downward,” “upward,” etc.) should be interpreted as referring to the directions described in the discussion or depicted in the accompanying drawings. These relative terms are used for descriptive convenience only and do not require that this application be constructed or operated in a particular orientation.

[0033] Additionally, quantities, ratios, and other numerical values ​​are sometimes presented in range format in this document. It should be understood that such range format is for convenience and brevity and should be interpreted flexibly to include not only the numerical values ​​explicitly specified as range limits, but also all individual numerical values ​​or subranges covered within the range, as if each numerical value and subrange were explicitly specified.

[0034] Furthermore, for ease of description, "first," "second," "third," etc., can be used in this article to distinguish different components of a figure or a series of figures. "First," "second," "third," etc., are not intended to describe the corresponding components.

[0035] The antenna package and its forming method of this application will be described in detail below with reference to the accompanying drawings.

[0036] See Figure 1 A substrate 10 is provided, and a plurality of contacts 12 are formed on the substrate 10. In some embodiments, the material of the contacts 12 includes solder.

[0037] See Figure 2 Electronic components 20 are electrically connected to the first surface 22 of substrate 10 using surface mounting technology (SMT).

[0038] See Figure 3 The reflow process 31 is performed to bond the contact 12 to the electronic component 20.

[0039] See Figure 4 The material overflowing from between the electronic component 20 and the substrate 10 at the contact 12 is removed [e.g., flux clean]. In some embodiments, a plasma removal process 41 is performed to remove excess material from the contact 12.

[0040] See Figure 5 The electronic component 20 and the contact 12 are encapsulated using a molding compound 50, which covers a portion of the first surface 22 of the substrate 10. In some embodiments, the molding compound 50 uses a material with high heat dissipation properties.

[0041] See Figure 6 A plurality of openings 60 are formed in the molding compound 50 using a laser drilling process to expose the first surface 22 of the substrate 20.

[0042] See Figure 7 The second portion 70 of the circuit board is attached to the second surface 72 of the substrate 10, which is opposite to the first surface 22, and a second antenna 74 is disposed on the second portion 70 of the circuit board. In some embodiments, the circuit board is softer than the substrate. In some embodiments, the second portion 70 of the circuit board is attached to the second surface 72 of the substrate 10 by a lamination process, for example, by connecting the substrate 10 and the second portion 70 by an adhesive layer.

[0043] See Figure 8 Conductive material is filled into the opening 60 to form a through-hole 80 in the molding compound. In some embodiments, the through-hole 80 is a through-molding compound via (TMV). In some embodiments, this can be performed first. Figure 8 Perform the steps shown below again. Figure 7 The steps shown are as follows: first, fill the opening 60 with conductive material to form a through hole 80, and then attach the second part 70 of the circuit board to the substrate 10.

[0044] See Figure 9A first portion 90 of the circuit board is disposed on the molding compound 50 and the through-hole 80, and a first antenna 92 ​​is formed on the first portion 90. The first portion 90 and the second portion 70 of the circuit board are not directly connected. Referring to path B, the electronic component 20 is electrically connected to the first antenna 92 ​​through the substrate 10, the through-hole 80 and the first portion 90 of the circuit board.

[0045] See Figure 10 A first connector 100 is formed on the first surface 22 of the substrate 10, and the molding compound 50 does not cover the first connector 100. Projected along a direction perpendicular to the first surface 22, the substrate 10 has a protrusion 102 extending relative to the molding compound 50 and the first portion 90, and the first connector 100 is located on the first surface 22 of the protrusion 102 of the substrate 10. The provision of the protrusion 102 makes it easier to subsequently install the connector on the substrate 10 without space limitations. Referring to path D, the first connector 100 is connected to the second antenna 74 through the substrate 10 and the second portion 70. Thus, the antenna package 1000 of this application is formed. In some embodiments, the first connector 100 is used to connect components other than the antenna package 1000 to the antenna package 1000. In some embodiments, the first connector 1000 is electrically connected to the first antenna 92 ​​or the second antenna 74 through an electronic component 20 or further through a through-hole 80.

[0046] Figures 11 to 15 It shows Figures 7 to 10 For alternative embodiments, see Figure 11 First, through holes 80 are formed in molding compound 50.

[0047] See Figure 12 The first portion 90 of the circuit board is disposed on the molding compound 50 and the through hole 80, and the first antenna 92 ​​is formed on the first portion 90.

[0048] See Figure 13 The third portion 130 of the circuit board, which is connected to the first portion 90 and the second portion 70, is bent along a direction perpendicular to the first surface 22, and further bent along a direction parallel to the first surface 22, so that the second portion 70 of the circuit board is attached to the second surface 72 of the substrate 10, which is opposite to the first surface 22. The second antenna 74 is disposed on the second portion 70 of the circuit board. The substrate 10, the electronic component 20, and the through-hole 80 are sandwiched between the first portion 90 and the second portion 70. The third antenna 132 is formed on the third portion 130. In some embodiments, referring to path A, the third antenna 132 is electrically connected to the electronic component 20 through the third portion 130, the second portion 70, and the substrate 10. Referring to path C, the third antenna 132 is electrically connected to the first antenna 92 ​​through the third portion 130 and the first portion. Similarly, Figure 13 The illustrated embodiments also exist. Figure 9 Route A is shown in the embodiment. In some embodiments, the third portion 130 has a line clearance area 134 without any lines, which is located between the third antenna 132 and the second portion 70. The clearance area 134 improves the bending capability of the circuit board, eliminating the risk of damage to the lines due to excessive bending. The clearance area 134 also avoids interference between the second antenna 92 ​​and the third antenna 132.

[0049] See Figure 14 A first connector 100 is formed on the first surface 22 of the substrate 10, and the molding compound 50 does not cover the first connector 100. The first connector 100 is arranged side by side with the electronic component 20 and is electrically connected to the substrate 10. Thus, the antenna package 1000 of this application is formed. Figure 14 This is a cross-section of the antenna package 1000 of this application. In other embodiments, circuit boards and antennas on the circuit boards can be arranged around all six sides of the electronic component 20 to achieve multi-directional radiation of the antenna.

[0050] Figure 15 It shows Figure 14 The top view of the antenna package 1000 shown, in some embodiments, shows a third portion 130 that is a bent portion of a circuit board. In the top view viewed along the extension direction of the through-hole, the circuit board has a first side 150 and a second side 152 intersecting the first side 150, the first side 150 being shorter than the second side 152. The bent portion is located at the first side 150. In some embodiments, a plurality of first antennas 92 form an antenna array. In a bottom view (not shown) of some embodiments of the antenna package 1000, a plurality of second antennas 74 also form an antenna array.

[0051] Figure 16 Another embodiment of the antenna package 1000 of this application is shown, which further includes a second connector 160 located on the side of the first portion 90 opposite to the first antenna 92. The second connector 160 is not encapsulated by the molding compound 50 and faces the first connector 100. Referring to path E, the second connector 160 is electrically connected to the first antenna 92 ​​through the first portion 90. Paths D and E directly lead out the antenna, making the antenna signal transmission path shorter. A lead 162 is located between the first connector 100 and the second connector 160, and the second connector 160 is connected to the first connector 100 through the lead 162. The embodiments of this application utilize the space raised by the thickness of the molding compound 50 to accommodate connectors respectively disposed on the first portion 90 of the substrate 10 and the circuit board, thereby reducing the horizontal and vertical dimensions of the antenna package and avoiding the use of connectors with a large number of pins to provide sufficient input / output (I / O), which would affect the area occupied by the substrate 10.

[0052] Figure 17 Another embodiment of the antenna package 1000 of this application is shown, wherein a first connector 100 is formed on a substrate 10 using hot bar soldering, and a connecting line 170 leads out the first connector 100. Hot bar soldering technology can control the thickness of the first connector 100, reducing the space required for the first connector 100.

[0053] Embodiments of the present invention utilize a combination of rigid and flexible boards, using a substrate 10 (e.g., a radio frequency (RF) board) as a rigid board for assembly, and a circuit board (e.g., an FPC) as a flexible board to carry the antenna. This combination provides both rigidity and design flexibility for the antenna package, facilitating thinner packages and enabling multi-directional antenna configuration. Furthermore, the farther the antenna pattern is from the electronic component 20 (e.g., an RFIC), the longer the signal feed path and the greater the signal loss. Embodiments of the present invention can shorten the signal transmission path between the electronic component 20 and the antenna pattern by not only using the feed path through the circuit board (e.g., through vias 80), thereby improving the antenna's radiation performance.

[0054] The above description is merely a preferred embodiment of the present invention and is not intended to limit the invention. Various modifications and variations can be made to the present invention by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the scope of protection of the present invention.

Claims

1. An antenna package, characterized in that, include: substrate; Electronic components are electrically connected to the first side of the substrate; A circuit board includes a first part and a second part, wherein a substrate and an electronic component are sandwiched between the first part and the second part, and the second part is attached to a second side of the substrate that is opposite to the first side. Through-hole, connecting the substrate and the first part; A first antenna and a second antenna are respectively located on the first part and the second part. The first part includes a first upper surface and a first lower surface, and the second part includes a second upper surface and a second lower surface. The first antenna is disposed on the first upper surface, and the second antenna is disposed on the second lower surface. A molding compound is used to encapsulate the electronic component, the first portion of which is bonded to the molding compound, and the through-hole passes through the molding compound; A first connector is disposed on the first surface of the substrate relative to the protrusion of the first portion extending outward from the molding compound, wherein the molding compound does not cover the first connector; A second connector is disposed on the side of the first portion opposite to the first antenna. The second connector is not covered by the molding compound and is connected to the first connector via a lead. The electronic component is electrically connected to the first antenna via the substrate and the through-hole.

2. The antenna package according to claim 1, characterized in that, The circuit board further includes a third portion connecting the first portion and the second portion, the third portion being located on the side of the electronic component, and a third antenna located on the third portion being connected to the electronic component through the third portion, the second portion and the substrate.

3. The antenna package according to claim 2, characterized in that, The third part has a line clearance area without any lines, which is located between the location of the third antenna and the second part.

4. The antenna package according to claim 2, characterized in that, The third part is the bent portion of the circuit board. In a top view viewed along the extension direction of the through hole, the circuit board has a first side and a second side intersecting the first side. The first side is shorter than the second side, and the bent portion is located at the first side.

5. The antenna package according to claim 1, characterized in that, The first connector is arranged side by side with the electronic component, and the first connector is electrically connected to the substrate.

6. The antenna package according to claim 5, characterized in that, The second connector faces the first connector, and the second connector is electrically connected to the first antenna through the first portion; and the lead is located between the first connector and the second connector.

7. A method for forming an antenna package, characterized in that, include: Provide substrate; Electrically connect electronic components to the first side of the substrate; A through hole is formed on the first surface of the substrate; A first part of the circuit board is disposed on the through hole, and a second part of the circuit board is disposed on a second surface of the substrate opposite to the first surface; A first antenna and a second antenna are formed on the first portion and the second portion, respectively. The first portion includes a first upper surface and a first lower surface, and the second portion includes a second upper surface and a second lower surface. The first antenna is disposed on the first upper surface, and the second antenna is disposed on the second lower surface. After the electronic component is disposed on the first surface of the substrate, the electronic component is encapsulated with a molding compound, the through-hole is formed in the molding compound, and the first portion of the circuit board is disposed on the molding compound and the through-hole; A first connector is formed on the first surface of the substrate relative to the molding compound and the protrusion extending from the first portion, wherein the molding compound does not cover the first connector; A second connector is formed on the side of the first portion opposite to the first antenna. The second connector is not encapsulated by the molding compound. The second connector is connected to the first connector via a lead. The electronic components are electrically connected to the first antenna through the substrate, the via, and the first portion of the circuit board.

8. The method for forming an antenna package according to claim 7, characterized in that, Also includes: The second connector is electrically connected to the first antenna via the first part.

9. The method for forming an antenna package according to claim 7, characterized in that, After the first portion of the circuit board is disposed on the through hole, the third portion of the circuit board connected to the first portion and the second portion is bent in a direction perpendicular to the first surface, and the third portion is further bent in a direction parallel to the first surface to dispose the second portion on the second surface, with the substrate, the electronic component and the through hole sandwiched between the first portion and the second portion.

10. The method for forming an antenna package according to claim 9, characterized in that, A third antenna is formed on the third portion, and the third antenna is electrically connected to the electronic component through the third portion, the second portion, and the substrate.

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