A tin bead processing apparatus for photovoltaic solder ribbon

Abstract

The application discloses a tin bead processing device for a photovoltaic welding strip, which comprises a storage mechanism, two groups of which are arranged at intervals and used for on-line storage of the photovoltaic welding strip; a driving mechanism, which is used for pulling the photovoltaic welding strip to move; a tin bead detection mechanism, which is used for detecting tin beads on the photovoltaic welding strip when the photovoltaic welding strip moves; and a tin bead processing mechanism, which is used for melting and eliminating the tin beads and then solidifying the tin beads again; the tin bead detection mechanism, the tin bead processing mechanism and the driving mechanism are sequentially arranged between the two storage mechanisms. The application realizes the processing of the tin beads by a hot melting method, the spring driving mold acts on the welding strip, and the tin beads are melted through heat transfer; and the tin on the surface of the welding strip is solidified again through a rapid cooling mode, so that the operation is convenient and damage to other parts of the welding strip is reduced.

Description

Technical Field

[0001] This invention relates to the field of photovoltaic solder ribbon inspection, and in particular to a solder ball processing device for photovoltaic solder ribbon. Background Technology

[0002] Photovoltaic soldering ribbon consists of a copper base strip and a tin layer coated on the copper base strip. The tin is heated to a liquid state, the copper base strip is immersed in the molten tin, and then cooled and solidified. During the tinning process, tin beads inevitably appear. The presence of tin beads can easily lead to uneven resistivity of the overall solder ribbon, and it is also not conducive to laying during the cutting process, easily causing path bulging.

[0003] Publication No. CN 215757560 U describes a solder bead blocker for photovoltaic solder ribbon, in which the solder ribbon is scraped off through the edges of the groove and the outlet hole; however, during the movement of the solder ribbon, it is inevitable that it will touch the groove and the outlet hole, thus there is a possibility of scraping off the surface solder layer. Summary of the Invention

[0004] To address the shortcomings of the existing technology, the main objective of this invention is to overcome these deficiencies and disclose a solder ball processing device for photovoltaic solder ribbons, comprising:

[0005] The storage mechanism is provided in two sets at intervals for online storage of photovoltaic welding strips;

[0006] The drive mechanism pulls the photovoltaic welding strip to move it.

[0007] Solder ball inspection agencies detect solder balls on photovoltaic solder ribbons as they move.

[0008] The solder ball processing mechanism melts and removes the solder balls, then solidifies them again.

[0009] The solder ball detection mechanism, the solder ball processing mechanism, and the driving mechanism are arranged sequentially between the two storage mechanisms.

[0010] Furthermore, the solder ball processing mechanism includes a first support, a mold, and a driving assembly. The first support is provided with a processing area, and two molds are arranged opposite each other in the processing area. The molds are provided with grooves, and after the two molds come into contact, the grooves are joined to form a shaping hole that mates with the photovoltaic solder ribbon. The molds are provided with a heating module, which is used to heat the molds. The driving assembly is provided on the first support, which is used to drive the molds to move horizontally.

[0011] Furthermore, the driving assembly includes a cylinder, a driving block, a slider, a guide rod, and a spring. The guide rod is disposed on the first bracket, and the slider and the spring are disposed on the guide rod. The spring drives the slider to move toward the first bracket. The driving block is slidably disposed on the first bracket. The cylinder drives the driving block to reciprocate, thereby driving the slider to move along the guide rod. An inclined surface is provided on the slider.

[0012] Furthermore, a sliding groove is provided on the side of the first bracket, and the driving block is slidably disposed within the sliding groove.

[0013] Furthermore, the slider is a ceramic fiberboard.

[0014] Furthermore, an air intake is provided at the upper part of the processing area, and an air blowing port is provided at the lower part of the processing area.

[0015] Furthermore, the mold is provided with several heat dissipation channels spaced apart along its axial direction.

[0016] Furthermore, the solder ball detection mechanism includes a second bracket, a first support wheel, a detection wheel, and a displacement sensor. The first support wheel is fixedly mounted on the second bracket, and the detection wheel is floatingly mounted on the second bracket. The first support wheel and the detection wheel are provided with semi-circular grooves that cooperate with the photovoltaic solder ribbon. The displacement sensor monitors the upward displacement distance of the detection wheel.

[0017] Furthermore, the driving mechanism includes a third bracket, a second support wheel, a drive wheel, and a motor. The second support wheel and the drive wheel are vertically distributed on the third bracket, and the motor drives the drive wheel to rotate.

[0018] Furthermore, the material storage mechanism includes a fourth support, a fixed shaft, a floating shaft, and a wire storage wheel. The fixed shaft and the floating shaft are mounted on the fourth support, the floating shaft is vertically slidably connected to the fourth support, and the wire storage wheel is arranged on the fixed shaft and the floating shaft.

[0019] The beneficial effects achieved by this invention are as follows:

[0020] 1. This invention processes solder balls using a hot-melting method. A spring-driven mold acts on the solder strip and melts the solder balls through heat transfer. Rapid cooling then solidifies the solder on the surface of the solder strip, making the operation convenient and reducing damage to other parts of the solder strip.

[0021] 2. Storage mechanisms are set at both the front and back ends to provide reliable time for solder ball processing, and the storage status of the front and back storage mechanisms is controlled by setting the drive mechanism.

[0022] 3. Heat dissipation channels are set inside the mold, and air intakes and exhaust vents are set on the support to increase the heat dissipation area and increase the flow rate of cooling air, thereby further improving the heat dissipation effect. Attached Figure Description

[0023] Figure 1 This is a schematic diagram of the structure of a solder ball processing device for photovoltaic solder ribbon according to the present invention;

[0024] Figure 2 A three-dimensional structural diagram of the solder ball processing mechanism;

[0025] Figure 3 for Figure 2 A bottom view;

[0026] Figure 4 for Figure 3 Sectional view of AA;

[0027] Figure 5 This is a schematic diagram of the structure of a tin bead testing facility;

[0028] Figure 6 This is a schematic diagram of the drive mechanism;

[0029] Figure 7 This is a schematic diagram of the wire storage mechanism;

[0030] The attached figures are labeled as follows:

[0031] 1. Material storage mechanism; 2. Drive mechanism; 3. Solder ball detection mechanism; 4. Solder ball processing mechanism; 11. Fourth support; 12. Fixed shaft; 13. Floating shaft; 14. Wire storage wheel; 21. Third support; 22. Second support wheel; 23. Drive wheel; 31. Second support; 32. First support wheel; 33. Detection wheel; 34. Displacement sensor; 41. First support; 42. Mold; 43. Drive assembly; 411. Processing area; 412. Slide groove; 413. Air intake; 414. Air outlet; 421. Groove; 422. Heat dissipation channel; 423. Air inlet; 424. Air outlet; 431. Cylinder; 432. Drive block; 433. Slider; 434. Guide rod; 435. Spring. Detailed Implementation

[0032] To make the objectives, technical solutions, and advantages of this invention clearer, the invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the invention.

[0033] A solder ball processing device for photovoltaic solder ribbon, such as Figures 1-7 As shown, it includes:

[0034] Storage mechanism 1, with two sets of storage mechanisms at intervals, is used for online storage of photovoltaic welding strips;

[0035] Drive mechanism 2 pulls the photovoltaic welding strip to move the photovoltaic welding strip;

[0036] Solder ball inspection unit 3 detects solder balls on the photovoltaic solder ribbon as it moves.

[0037] Solder ball processing mechanism 4 melts and removes the solder balls, then solidifies them again;

[0038] Between the two storage mechanisms 1, a solder ball detection mechanism 3, a solder ball processing mechanism 4, and a drive mechanism 2 are sequentially arranged. The operation is as follows: After passing through the rear storage mechanism 1, the photovoltaic solder ribbon is wound onto a reel by a winding machine. When the solder ball detection mechanism 3 detects a solder ball, it controls the drive mechanism 2 to stop operating. At this time, the solder ribbon pre-stored in the rear storage mechanism 1 continues to be wound by the winding mechanism. The front storage mechanism 1 stores the solder ribbon produced by the front-end equipment. The solder section with solder balls is located in the solder ball processing mechanism 4. After processing by the solder ball processing mechanism 4, the drive mechanism 2 starts, continuing to pull the solder ribbon. By adjusting the transmission speed of the drive, the output of the front storage mechanism 1 is reduced, and the output of the rear storage mechanism 1 is increased, to facilitate the next solder ball processing.

[0039] The solder ball processing mechanism 4 includes a first support 41, a mold 42, and a drive assembly 43. The first support 41 has a processing area 411. Two molds 42 are provided, each with a groove 421. When the two molds 42 come into contact, the groove 421 forms a shaping hole that mates with the photovoltaic solder ribbon. The mold 42 is positioned within the processing area 411. By driving the mold 42 to move horizontally, the shaping hole can be opened and closed. A heating module (not shown) is provided on the mold 42; the heating module can be a heating wire; the heating module heats the mold 42 to reach a specified temperature.

[0040] The drive assembly 43 includes a cylinder 431, a drive block 432, a slider 433, a guide rod 434, and a spring 435. In this embodiment, to improve the stability of the mold 42 during movement, the slider 433 is located at both ends of the mold 42 and is connected to the mold 42. The guide rod 434 is located on the upper and lower sides of the processing area 411, and the slider 433 is slidably connected to the guide rod 434. The spring 435 is mounted on the guide rod 434, with both ends acting on the guide rod 434 and the slider 433, respectively, driving the slider 433 to move towards the first support 41. The drive block 432 is vertically slidably mounted on the side of the first support 41, and an inclined surface is provided on the drive block 432. In use, the cylinder 431 pushes the drive block 432 downward to drive the slider 433 away from the first support 41 via the inclined surface. This causes the mold 42 to move away from the photovoltaic solder ribbon, allowing the solder ribbon to pass unobstructed through the solder ball processing mechanism 4.

[0041] In the above embodiments, such as Figures 1-7 As shown, a sliding groove 412 is provided on the side of the first bracket 41, and the driving block 432 is slidably disposed within the sliding groove 412. This allows the driving block 432 to move stably on the first bracket 41.

[0042] In one embodiment, such as Figures 1-7 As shown, slider 433 is a ceramic fiber plate. The ceramic fiber plate has low thermal conductivity, which reduces heat transfer from mold 42.

[0043] In one embodiment, such as Figures 1-7 As shown, an air intake 413 is provided at the upper part of the processing zone 411, and an air blowing 414 is provided at the lower part of the processing zone 411. The air blowing 414 is connected to an air source, and the air intake 413 is connected to an air extraction device. The air blowing 414 and the air intake 413 work together to promote gas flow and thus improve cooling efficiency.

[0044] In one embodiment, such as Figures 1-7 As shown, a plurality of heat dissipation channels 422 are arranged at intervals along the axial direction on the mold 42. Part of the gas blown out by the air outlet 414 flows through the heat dissipation channels 422 and is sucked out by the air intake 413. By setting a plurality of heat dissipation channels 422, the heat dissipation area is increased, and the heat dissipation efficiency is further improved.

[0045] In the above embodiments, such as Figures 1-7 As shown, after the two molds 42 are joined together, an air inlet 423 and an air outlet 424 are formed. The size of the air outlet 414 is larger than that of the air inlet 423, and the size of the air intake 413 is larger than that of the air outlet 424. This allows some air to be blown towards the outer wall of the mold 42, further improving heat dissipation efficiency.

[0046] In one embodiment, such as Figures 1-7As shown, the solder ball detection mechanism 3 includes a second bracket 31, a first support wheel 32, a detection wheel 33, and a displacement sensor 34. The first support wheel 32 is fixedly mounted on the second bracket 31, and the detection wheel 33 is floatingly mounted on the second bracket 31. The first support wheel 32 and the detection wheel 33 are provided with semi-circular grooves that mate with the photovoltaic solder ribbon. The displacement sensor 34 monitors the upward displacement distance of the detection wheel 33. The first support wheel 32 and the detection wheel 33 are tangent, and the two semi-circular grooves form a hole that mates with the photovoltaic solder ribbon. If there are solder balls on the surface of the photovoltaic solder ribbon, then the first support wheel 32 and the detection wheel 33 cannot make contact, thereby lifting the detection wheel 33. The displacement sensor 34 detects the fluctuation of the detection wheel 33, indicating the presence of solder balls, thus realizing solder ball detection.

[0047] In one embodiment, such as Figures 1-7 As shown, the drive mechanism 2 includes a third bracket 21, a second support wheel 22, a drive wheel 23, and a motor (not shown). The second support wheel 22 and the drive wheel 23 are vertically distributed on the third bracket 21, and the motor drives the drive wheel 23 to rotate. The second support wheel 22 and the drive wheel 23 also have semi-circular grooves that mate with the photovoltaic welding strip.

[0048] In one embodiment, such as Figures 1-7 As shown, the storage mechanism 1 includes a fourth support 11, a fixed shaft 12, a floating shaft 13, and a wire storage wheel 14. The fixed shaft 12 and the floating shaft 13 are mounted on the fourth support 11, and the floating shaft 13 is vertically slidably connected to the fourth support 11. The wire storage wheels 14 are arranged on the fixed shaft 12 and the floating shaft 13. The wire storage wheels 14 can rotate independently. In use, the photovoltaic welding ribbon is reciprocated around the wire storage wheels 14 on the fixed shaft 12 and the floating shaft 13. When the wire inlet stops, the wire outlet continues to pull, causing the floating shaft 13 to move upward. When the wire inlet continues to feed wire while the wire outlet stops, the floating shaft 13 moves downward, increasing the distance between the floating shaft 13 and the fixed shaft 12, thus storing the photovoltaic welding ribbon.

[0049] A method of using the solder ball processing equipment for photovoltaic solder ribbon according to the present invention is as follows: Figures 1-7 As shown,

[0050] S1, mold 42 is preheated to 150-180℃; the photovoltaic solder ribbon is moved by the drive mechanism 2, and the photovoltaic solder ribbon is inspected by the solder ball detection mechanism 3 at the same time;

[0051] S2, when the solder ball detection mechanism 3 detects the solder ball, the control drive mechanism 2 stops and locks, so that the photovoltaic solder ribbon stops moving, the front-end storage mechanism 1 outputs the solder ribbon produced by the front-end equipment; the winding mechanism winds up the photovoltaic solder ribbon pre-stored by the rear-end discharge mechanism 1.

[0052] S3, the mold 42 is rapidly heated to 228°C to 230°C, and the driving component 43 applies the mold 42 to the photovoltaic solder ribbon. The solder balls are softened by heat transfer. After waiting for 2-5 seconds, the heating module stops heating, and the blowing port 414 and the suction port 413 are activated to rapidly cool the mold 42 to 150°C-180°C.

[0053] S4, restart drive mechanism 2 to move the photovoltaic solder ribbon, and then open the mold through drive component 43. This completes one solder ball processing cycle.

[0054] The above are merely preferred embodiments of the present invention and are not intended to limit the scope of the present invention. Any modifications or equivalent substitutions made to the present invention without departing from the spirit and scope thereof should be covered within the protection scope of the claims of the present invention.

Claims

1. A solder ball processing device for photovoltaic solder ribbon, characterized in that, include: The storage mechanism is provided in two sets at intervals for online storage of photovoltaic welding strips; The drive mechanism pulls the photovoltaic welding strip to move it. Solder ball inspection agencies detect solder balls on photovoltaic solder ribbons as they move. The solder ball processing mechanism melts and removes the solder balls, then solidifies them again. The solder ball detection mechanism, the solder ball processing mechanism, and the driving mechanism are sequentially arranged between the two storage mechanisms; The solder ball processing mechanism includes a first support, a mold, and a drive assembly. The first support has a processing area, and two molds are arranged opposite each other in the processing area. The molds have grooves, and when the two molds come into contact, the grooves are joined to form a shaping hole that mates with the photovoltaic solder ribbon. The molds are equipped with heating modules to heat the molds. The drive assembly is mounted on the first support and drives the molds to move horizontally.

2. The solder ball processing equipment for photovoltaic solder ribbon according to claim 1, characterized in that, The driving assembly includes a cylinder, a driving block, a slider, a guide rod, and a spring. The guide rod is mounted on the first bracket, and the slider and the spring are mounted on the guide rod. The spring drives the slider to move toward the first bracket. The driving block is slidably mounted on the first bracket, and the cylinder drives the driving block to reciprocate, thereby moving the slider along the guide rod. An inclined surface is provided on the slider.

3. The solder ball processing equipment for photovoltaic solder ribbon according to claim 2, characterized in that, The first bracket has a sliding groove on its side, and the drive block is slidably disposed in the sliding groove.

4. The solder ball processing equipment for photovoltaic solder ribbon according to claim 2, characterized in that, The slider is a ceramic fiberboard.

5. The solder ball processing equipment for photovoltaic solder ribbon according to claim 1, characterized in that, An air intake is provided at the top of the processing area, and an air blower is provided at the bottom of the processing area.

6. The solder ball processing equipment for photovoltaic solder ribbon according to claim 1, characterized in that, The mold is provided with several heat dissipation channels spaced apart along its axial direction.

7. The solder ball processing equipment for photovoltaic solder ribbon according to claim 1, characterized in that, The solder ball detection mechanism includes a second bracket, a first support wheel, a detection wheel, and a displacement sensor. The first support wheel is fixedly mounted on the second bracket, and the detection wheel is floatingly mounted on the second bracket. The first support wheel and the detection wheel are provided with semi-circular grooves that cooperate with the photovoltaic solder ribbon. The displacement sensor monitors the upward displacement distance of the detection wheel.

8. The solder ball processing equipment for photovoltaic solder ribbon according to claim 1, characterized in that, The driving mechanism includes a third bracket, a second support wheel, a drive wheel, and a motor. The second support wheel and the drive wheel are arranged vertically on the third bracket, and the motor drives the drive wheel to rotate.

9. The solder ball processing equipment for photovoltaic solder ribbon according to claim 1, characterized in that, The material storage mechanism includes a fourth support, a fixed shaft, a floating shaft, and a wire storage wheel. The fixed shaft and the floating shaft are mounted on the fourth support, and the floating shaft is vertically slidably connected to the fourth support. The wire storage wheel is arranged on the fixed shaft and the floating shaft.

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