Circuit board gating device and method based on surface acoustic wave manipulation of conductive particle clusters
By manipulating conductive particle clusters using surface acoustic waves, the complexity of electrical gating devices is solved, enabling customized gating and resistance value control of circuits. This approach offers flexibility and high precision without compromising the properties of the particles.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- ZHEJIANG UNIV
- Filing Date
- 2022-11-28
- Publication Date
- 2026-08-04
AI Technical Summary
Existing electrical gating devices are complex and difficult to use for flexible circuit gating and resistance adjustment. Furthermore, traditional methods can damage the properties of particles.
By manipulating a cluster of conductive particles using surface acoustic waves, high-frequency surface acoustic waves are excited by inputting an AC signal through interdigital electrodes, driving the conductive particles to form a patterned arrangement in the sound pressure field, constructing a conduction path, and achieving customized gating and resistance control of the circuit by regulating the excitation signal.
It enables customized gating and real-time reconfiguration of circuits. The equipment is simple and easy to operate, with flexible gating and precise resistance value control capabilities, without damaging the properties of particles.
Smart Images
Figure CN115733460B_ABST
Abstract
Description
Technical Field
[0001] This invention relates to a circuit board gating device and method in the field of particle manipulation applications, and in particular to a circuit board gating device and method based on surface acoustic waves to manipulate conductive particle clusters. Background Technology
[0002] In current scientific research, particle swarm manipulation technology has become a crucial technology in fields such as microrobotics and biomedicine, with applications extending to various engineering areas, such as targeted drug delivery, micromanipulation of cell clusters, and microelectronics. While the real-time manipulation of various functional micro / nanoparticles or fibers using external physical fields (such as light, magnetic, and electric fields) has seen gradual development, particle swarm manipulation technology based on these physical fields still faces challenges such as complex manipulation systems, cumbersome manipulation methods, the potential for high temperatures generated during manipulation to alter the properties of functional particles, and the need for particles with specific electromagnetic properties. These problems significantly limit the development of particle swarm manipulation technology.
[0003] On the other hand, significant progress has recently been made in the research of methods for precise cluster manipulation of particles using sound fields, including the use of bulk acoustic waves and surface acoustic waves (SAWs) to drive and position particle clusters. SAW devices, due to their good integrability, lack of special requirements on the properties of manipulated particles, and simple manipulation methods, have obvious advantages in the field of particle manipulation applications. SAW manipulation technology is a non-contact manipulation technique that creates a sound pressure field with a stable morphology in space, causing particles within the manipulation area to move towards the troughs near their location under the influence of sound radiation forces and eventually maintain stable aggregation. Therefore, it is possible to achieve specific patterned arrangements of particle clusters within the manipulation chamber.
[0004] Traditional electrical gating devices often require complex relay units and gating circuits to achieve flexible gating functions, and also require corresponding controllers and scanning circuits. This greatly increases the complexity of the circuit and makes it difficult to simultaneously achieve flexible control of the resistance value in the circuit. Existing technology lacks a simple, stable and efficient gating method to solve the problems of current electrical gating devices. Summary of the Invention
[0005] To achieve customized gating and real-time reconstruction of electrodes in circuit boards, this invention proposes a circuit board gating device and method based on surface acoustic wave (SAW) manipulation of conductive particle clusters, leveraging the high precision of SAW on conductive particle clusters and the ability to control their position in real time. By inputting an AC signal to the interdigitated electrodes at the top of the device, high-frequency SAW waves are excited on the piezoelectric sheet through the inverse piezoelectric effect. This drives the conductive particles in the control chamber to form a striped patterned arrangement within the SAW sound pressure field, thereby creating a conductive circuit between disconnected electrode plates, constructing a stable conduction path. Furthermore, the pathways connected by the conductive particles attenuate across all frequency bands, effectively suppressing loop current and noise. By changing the combination and amplitude of the excitation signals input to the interdigitated electrodes, customized gating and precise control of the resistance value can be achieved.
[0006] The technical solution adopted by this invention to solve its technical problem is as follows:
[0007] I. Circuit board gating device based on surface acoustic wave manipulation of conductive particle clusters:
[0008] It includes a piezoelectric sheet, a gate electrode, interdigitated electrodes, a square control frame, a circuit board, and conductive particles. The gate electrode is arranged on the outer periphery of the upper surface of the circuit board, the control frame is placed on the circuit board, the conductive particles are stored inside the control frame, the piezoelectric sheet is placed on the upper surface of the control frame, the interdigitated electrodes are electrically connected to the lower surface of the piezoelectric sheet, and the interdigitated electrodes are connected to external electrical signals.
[0009] An external electrical signal is converted into a sinusoidal excitation signal via interdigital electrodes. The sinusoidal excitation signal causes surface acoustic waves to be generated on the lower surface of the piezoelectric sheet. Conductive particles gather at the troughs of the surface acoustic waves to form a conductive path. The two ends of the conductive path are connected between two gate electrodes. By adjusting the phase of the external electrical signal applied to the interdigital electrodes, the position of the conductive path is adjusted, thereby adjusting the conduction between the gate electrodes at different positions.
[0010] Several of the aforementioned gate electrodes are arranged at intervals along the circumference of the circuit board on the outer periphery of the upper surface of the circuit board. The control frame is located in the center of the upper surface of the circuit board and is placed on the gate electrodes. The hollow part in the middle of the control frame is a control chamber for placing conductive particles. One end of each gate electrode is located inside the control chamber. The piezoelectric sheet is placed on the control frame.
[0011] Four interdigital electrodes are evenly spaced and bonded to the lower surface of the piezoelectric sheet. The opening direction of each interdigital electrode is radial to the piezoelectric sheet. There is no contact between the individual gate electrodes and the individual interdigital electrodes.
[0012] The interdigitated electrodes are made of single-metal aluminum using a magnetron sputtering process.
[0013] The gate electrode is connected to an external device that needs to be controlled to conduct, and the conduction relationship between the external devices that need to be controlled to conduct is controlled by adjusting the conduction between different gate electrodes.
[0014] II. A circuit board selection method applied to the aforementioned device, comprising the following steps:
[0015] Step 1: Input an external electrical signal into any two interdigital electrodes. The interdigital electrodes convert the external electrical signal into a sinusoidal excitation signal, which is then input into the piezoelectric element. The sinusoidal excitation signal causes a two-dimensional surface acoustic wave (SAW) to be generated on the lower surface of the piezoelectric element. The SAW drives conductive particles to gather at the troughs of the SAW. The gathered conductive particles form several conductive paths perpendicular to the propagation direction of the SAW. Each conductive path is formed by the sequential arrangement and connection of conductive particles gathered at the troughs along the same straight line. The conductive paths are arranged at intervals along the propagation direction of the SAW to form a stripe array. By adjusting the phase of the input external electrical signal, the phase position of the SAW is changed, and the position of the conductive path is changed so that the two ends of the conductive path are respectively connected to the ends of the two gating electrodes within the control frame.
[0016] By changing the relative positional relationship between the two interdigitated electrodes that input an external electrical signal, the position and shape of the conductive path in the stripe array are changed, thereby achieving gating control between different gating electrodes;
[0017] The gate electrode is connected to the external device that needs to be controlled to conduct. By realizing the gate control between different gate electrodes, the conduction relationship between the external devices that need to be controlled to conduct is ultimately controlled.
[0018] Step 2: Measure the resistance value of the conductive path, change the excitation voltage of the input external electrical signal, repeat Step 1 multiple times, measure the resistance value of the conductive path under different excitation voltages, obtain the relationship curve between excitation voltage and resistance value, and by adjusting the excitation voltage of the external electrical signal, the degree of aggregation between conductive particles can be changed by adjusting the amplitude of the generated surface acoustic wave, thereby realizing the control of the resistance value of the conductive path.
[0019] In step one, by changing the relative positional relationship of the two interdigitated electrodes that input the external electrical signal, the position and shape of the conductive path in the stripe array are changed, thereby achieving gating control between different gating electrodes. Specifically:
[0020] If an external electrical signal is input to two non-adjacent interdigitated electrodes, the propagation direction of the generated surface acoustic wave is parallel to the opening direction of the interdigitated electrode into which the external electrical signal is input. Each conductive path is formed by a series of conductive particles that are arranged and connected at the trough of the same straight line perpendicular to the propagation direction of the surface acoustic wave. Each conductive path connects the gate electrodes on both sides of the first center line of the control frame. The first center line is the center line of the control frame that is parallel to the propagation direction of the surface acoustic wave.
[0021] If an external electrical signal is input to two adjacent interdigital electrodes, the propagation direction of the generated surface acoustic wave is perpendicular to the first diagonal of the control frame. The first diagonal is the control frame diagonal parallel to the centroidal connection line of the two interdigital electrodes that input the external electrical signal. Each conductive path is formed by the sequential arrangement and connection of conductive particles gathered at the trough of the same straight line perpendicular to the propagation direction of the surface acoustic wave. Each conductive path connects the selection electrodes on the same side of the first diagonal.
[0022] This invention proposes a circuit board gating device and method based on surface acoustic waves (SAW) for manipulating conductive particle clusters, leveraging the high-precision manipulation and real-time position control of SAW clusters. By inputting an AC signal to the interdigitated electrodes at the top of the device, high-frequency SAW waves are excited on the piezoelectric plate, driving the conductive particles in the control chamber to form a striped patterned arrangement within the SAW sound pressure field. This allows for the formation of a conductive circuit between the disconnected electrode plates, constructing a stable conduction path. Furthermore, by changing the combination and amplitude of the excitation signals input to the interdigitated electrodes, customized gating and precise resistance control of the circuit can be achieved.
[0023] The beneficial effects of this invention are as follows:
[0024] 1. This invention utilizes surface acoustic waves of a sound field to achieve high-precision and real-time controllable cluster manipulation of conductive particles, enabling customized selection of circuits and real-time reconfigurable deployment.
[0025] 2. The equipment used in this invention is simple and easy to operate. It can also achieve functions such as flexible selection of complex circuit boards and flexible adjustment of electrode resistance values by adjusting the combination and amplitude of the excitation electrical signals input to the interdigital electrodes.
[0026] 3. This invention is characterized by its ease of integration with other electrical technologies and low cost;
[0027] 4. The present invention has the characteristics of reconfigurability, strong stability, simple operation, simple equipment and high precision. Attached Figure Description
[0028] Figure 1This is a three-dimensional exploded view of the circuit board selection device of the present invention;
[0029] Figure 2 This is a schematic diagram of the assembly structure of the circuit board selection device of the present invention;
[0030] Figure 3 This is a schematic diagram illustrating how two interdigitated electrodes located on the same diameter of the circuit board enable circuit selection in an embodiment.
[0031] Figure 4 This is a schematic diagram of an embodiment where two adjacent interdigitated electrodes are activated to achieve circuit selection;
[0032] Figure 5 This is a graph showing the relationship between the circuit resistance value and the excitation voltage regulation in the embodiment.
[0033] In the diagram: 1. Piezoelectric element; 2. Interdigitated electrode; 3. Interdigitated electrode; 4. Interdigitated electrode; 5. Interdigitated electrode; 6. Control frame; 7. Gating electrode; 8. Circuit board; 9. Conductive microparticle; 10. External electrical signal; 11. Surface acoustic wave; 12. Stripe array. Detailed Implementation
[0034] The present invention will be further described below with reference to the accompanying drawings and embodiments, but the implementation of the present invention is not limited thereto.
[0035] like Figures 1-3 As shown, the device includes a piezoelectric sheet 1, a gate electrode 7, an interdigital electrode, a square control frame 6, and a circular circuit board 8. The gate electrode 7 is arranged on the outer periphery of the upper surface of the circuit board 8. The control frame 6 is placed on the circuit board 8. The piezoelectric sheet 1 is placed on the upper surface of the control frame 6. The interdigital electrode is electrically connected to the lower surface of the piezoelectric sheet 1. The interdigital electrode is connected to an external electrical signal 10.
[0036] The external electrical signal 10 is converted into a sinusoidal excitation signal via the interdigital electrodes. The sinusoidal excitation signal excites the inverse piezoelectric effect on the lower surface of the piezoelectric sheet 1 to generate a surface acoustic wave 11. The conductive particles 9 gather at the trough of the surface acoustic wave 11 to form a conductive path. The two ends of the conductive path are respectively connected between two gate electrodes 7. By adjusting the external electrical signal 10 applied to the interdigital electrodes, the position of the conductive path is adjusted, thereby adjusting the conduction between the gate electrodes 7 at different positions.
[0037] Several gate electrodes 7 are arranged at intervals along the circumference of the upper surface of the circuit board 8. The control frame 6 is located in the middle of the upper surface of the circuit board 8 and is placed on the gate electrodes 7. The hollow part in the middle of the control frame 6 is a control chamber for placing conductive particles 9. One end of each gate electrode 7 is located inside the control chamber. A circular piezoelectric sheet 1 is placed on the control frame 6. The piezoelectric sheet 1 is used to excite high-frequency surface acoustic waves 11.
[0038] Four interdigital electrodes 2, 3, 4, and 5 are evenly spaced and bonded to the lower surface of the piezoelectric sheet 1 along its circumference. The opening direction of each interdigital electrode 2, 3, 4, and 5 is radial to the piezoelectric sheet 1. There is no contact between each gate electrode 7 and each interdigital electrode 2, 3, 4, and 5 to prevent crosstalk and mis-channeling between electrical signals.
[0039] The control frame 6 is placed on the gate electrode 7, so there is a gap between the control frame 6 and the circuit board. The size of this gap is the thickness of the gate electrode 7. Since the thickness of the gate electrode 7 is at the nanometer level, while the diameter of the conductive particles 9 is at the micrometer level, the diameter of the conductive particles 9 is much larger than the thickness of the gate electrode 7, i.e. the size of the gap between the control frame 6 and the circuit board. Therefore, it can be ensured that the conductive particles 9 only move in the control chamber.
[0040] Interdigitated electrodes 2, 3, 4, and 5 are made of monometallic aluminum using a magnetron sputtering process.
[0041] Interdigitated electrodes 2, 3, 4, and 5, together with piezoelectric element 1, constitute a surface acoustic wave transducer, which is used to generate surface acoustic waves 11.
[0042] Conductive particles 9 refer to particles with resistance values approaching zero. When such a particle cluster conducts in a circuit, its resistance value depends only on the degree of aggregation between the particles, not on the number of particles. The path connected by conductive particles 9 can attenuate across all frequency bands, thereby effectively suppressing loop current and noise.
[0043] like Figure 3 As shown, after the external electrical signal 10 is input to the interdigital electrodes 2, 3, 4, and 5, the interdigital electrodes 2, 3, 4, and 5 convert the external electrical signal 10 into a sinusoidal excitation signal, which is then input to the piezoelectric element 1. The piezoelectric element 1 excites the inverse piezoelectric effect, thereby generating a surface acoustic wave 11. After the surface acoustic wave 11 propagates to the control chamber, the conductive particles 9 in the control chamber will gather at the trough of the surface acoustic wave 11 under the action of the surface acoustic wave 11, thereby forming a stripe array 12 of a specific shape. By adjusting the phase of the surface acoustic wave 11, the trough of the surface acoustic wave 11 can be located at the position of the gating electrode 7, thereby enabling a stable connection between multiple gating electrodes 7 through the conductive particles 9, and completing the selection of the circuit.
[0044] The gate electrode 7 is connected to an external device that needs to be controlled to conduct. The conduction relationship between the external devices that need to be controlled to conduct is controlled by adjusting the conduction between different gate electrodes 7.
[0045] The circuit board selection method of the device includes the following steps:
[0046] Step 1: As Figure 2As shown, the conductive particles 9 in the control chamber 6 are in a disordered and random distribution state when no external electrical signal 10 is input. When the same external electrical signal 10 is input into any two interdigitated electrodes, the interdigitated electrodes convert the external electrical signal 10 into a sinusoidal excitation signal, which is then input into the piezoelectric element 1. The sinusoidal excitation signal excites the inverse piezoelectric effect in the piezoelectric element 1, causing a two-dimensional surface acoustic wave 11 to be generated on the lower surface of the piezoelectric element 1. The surface acoustic wave 11 excites a linear sound pressure field along the propagation direction of the surface acoustic wave 11 in the control chamber. The surface acoustic wave 11 in the linear sound pressure field drives the disordered and randomly distributed conductive particles 9 toward the trough of the surface acoustic wave 11. The conductive particles 9 are aggregated to form several conductive paths perpendicular to the propagation direction of the surface acoustic wave 11. Each conductive path is formed by the sequential arrangement and connection of conductive particles 9 aggregated at the troughs along the same straight line perpendicular to the propagation direction of the surface acoustic wave 11. The conductive paths are arranged at intervals along the propagation direction of the surface acoustic wave 11 to form a stripe array 12. By adjusting the phase of the input external electrical signal 10, the phase position of the surface acoustic wave 11 is changed, thereby changing the position of each trough and adjusting the position of the conductive path. The position of the conductive path is changed so that the two ends of the conductive path are respectively connected to the ends of the two gate electrodes 7 within the control frame.
[0047] By changing the relative positional relationship between the two interdigitated electrodes of the input external electrical signal 10, the position and shape of the conductive path in the stripe array 12 are changed, thereby realizing the gating control between different gating electrodes 7.
[0048] The gate electrode 7 is connected to an external device that needs to be controlled to conduct. By realizing the gate control between different gate electrodes 7, the conduction relationship control between the external devices that need to be controlled to conduct is finally realized.
[0049] Step 2: Measure the resistance value of the conductive path, change the excitation voltage of the input external electrical signal 10, repeat Step 1 multiple times, and measure the resistance value of the conductive path under different excitation voltages to obtain the relationship curve between excitation voltage and resistance value, such as... Figure 5 As shown, the conductive particles 9 refer to particles with a resistance value close to zero. When the conductive particles 9 cluster conducts in the circuit, its resistance value depends only on the degree of aggregation between the particles and not on the number of particles. By adjusting the excitation voltage of the external electrical signal 10, the amplitude of the generated surface acoustic wave 11 is adjusted to change the degree of aggregation between the conductive particles (9), thereby achieving precise control of the resistance value of the conductive path.
[0050] In step 1, by changing the relative positional relationship of the two interdigitated electrodes of the input external electrical signal 10, the position and shape of the conductive path in the stripe array 12 are changed, thereby realizing the gating control between different gating electrodes 7, specifically:
[0051] like Figure 3 As shown, if an external electrical signal 10 is input to two non-adjacent interdigital electrodes 2 and 4, the propagation direction of the generated surface acoustic wave 11 is parallel to the opening direction of the interdigital electrodes 2 and 4 where the external electrical signal 10 is input. Each conductive path is formed by the sequential arrangement and connection of conductive particles 9 that are gathered at the trough along the same straight line perpendicular to the propagation direction of the surface acoustic wave 11. Each conductive path connects the gate electrodes 7 on both sides of the first center line of the control frame 6. The first center line is the center line of the control frame 6 that is parallel to the propagation direction of the surface acoustic wave 11.
[0052] like Figure 4 As shown, if an external electrical signal 10 is input to two adjacent interdigital electrodes 4 and 5, the propagation direction of the generated surface acoustic wave 11 is perpendicular to the first diagonal of the control frame 6. The first diagonal is the diagonal of the control frame 6 that is parallel to the centroidal connection line of the two interdigital electrodes 4 and 5 that input the external electrical signal 10. Each conductive path is formed by the sequential arrangement and connection of conductive particles 9 that are gathered at the trough of the same straight line perpendicular to the propagation direction of the surface acoustic wave 11. Each conductive path connects the selection electrodes 7 on the same side of the first diagonal.
[0053] As can be seen from the embodiments, the present invention realizes customized circuit gating based on surface acoustic wave manipulation of conductive particle clusters, and achieves precise control of circuit resistance by changing the input electrical signal. It has the characteristics of reconfigurability, strong stability, simple operation, simple equipment and high precision.
Claims
1. A circuit board gating device based on surface acoustic wave manipulation of conductive particle clusters, characterized in that: The device includes a piezoelectric sheet (1), a gate electrode (7), interdigital electrodes (2, 3, 4, 5), a square control frame (6), a circuit board (8), and conductive particles (9). The gate electrode (7) is arranged on the outer periphery of the upper surface of the circuit board (8), the control frame (6) is placed on the circuit board (8), the conductive particles (9) are stored inside the control frame (6), the piezoelectric sheet (1) is placed on the upper surface of the control frame (6), the interdigital electrodes are electrically connected to the lower surface of the piezoelectric sheet (1), and the interdigital electrodes are connected to an external electrical signal (10). The external electrical signal (10) is converted into a sinusoidal excitation signal through the interdigital electrode. The sinusoidal excitation signal causes the piezoelectric sheet (1) to generate a surface acoustic wave (11) on the lower surface. The conductive particles (9) gather at the trough of the surface acoustic wave (11) to form a conductive path. The two ends of the conductive path are connected between two gate electrodes (7). By adjusting the phase of the external electrical signal (10) applied to the interdigital electrode, the position of the conductive path is adjusted, thereby adjusting the conduction between the gate electrodes (7) at different positions. Several gate electrodes (7) are arranged at intervals along the circumference of the circuit board (8) on the outer periphery of the upper surface of the circuit board (8). The control frame (6) is located in the center of the upper surface of the circuit board (8) and is placed on the gate electrodes (7). The hollow part in the middle of the control frame (6) is a control chamber for placing conductive particles (9). One end of each gate electrode (7) is located inside the control chamber. The piezoelectric sheet (1) is placed on the control frame (6). Four interdigitated electrodes (2, 3, 4, 5) are evenly spaced along the circumference of the piezoelectric sheet (1) and bonded to the lower surface of the piezoelectric sheet (1). The opening direction of each interdigitated electrode (2, 3, 4, 5) is radial to the piezoelectric sheet (1). There is no contact between each gate electrode (7) and each interdigitated electrode (2, 3, 4, 5).
2. The circuit board gating device based on surface acoustic wave manipulation of conductive particle clusters according to claim 1, characterized in that: The interdigitated electrodes (2, 3, 4, 5) are made of single-metal aluminum by magnetron sputtering.
3. The circuit board gating device based on surface acoustic wave manipulation of conductive particle clusters according to claim 1, characterized in that: The gate electrode (7) is connected to an external device that needs to be controlled to conduct. The conduction relationship between the external devices that need to be controlled to conduct is controlled by adjusting the conduction between different gate electrodes (7).
4. A circuit board selection method applied to the device according to any one of claims 1-3, characterized in that, Includes the following steps: Step 1: Input an external electrical signal (10) into any two interdigitated electrodes. The interdigitated electrodes convert the external electrical signal (10) into a sinusoidal excitation signal and input it into the piezoelectric sheet (1). The sinusoidal excitation signal causes the lower surface of the piezoelectric sheet (1) to generate a surface acoustic wave (11) with a two-dimensional waveform. The surface acoustic wave (11) drives the conductive particles (9) to gather at the trough of the surface acoustic wave (11). The gathered conductive particles (9) form several conductive paths perpendicular to the propagation direction of the surface acoustic wave (11). Each conductive path is formed by the conductive particles (9) gathered at the trough along the same straight line arranged in sequence. Each conductive path is arranged at intervals along the propagation direction of the surface acoustic wave (11) to form a stripe array (12). By adjusting the phase of the input external electrical signal (10), the phase position of the surface acoustic wave (11) is changed, and the position of the conductive path is changed so that the two ends of the conductive path are respectively connected to the ends of the two gate electrodes (7) within the control frame. By changing the relative positional relationship between the two interdigitated electrodes of the input external electrical signal (10), the position and shape of the conductive path in the stripe array (12) are changed, thereby realizing the gating control between different gating electrodes (7); The gate electrode (7) is connected to the external device that needs to be controlled to conduct. By realizing the gate control between different gate electrodes (7), the conduction relationship control between the external devices that need to be controlled to conduct is finally realized. Step 2: Measure the resistance value of the conductive path, change the excitation voltage of the input external electrical signal (10), repeat step 1 multiple times, measure the resistance value of the conductive path under different excitation voltages, obtain the relationship curve between excitation voltage and resistance value, and change the degree of aggregation between conductive particles (9) by adjusting the excitation voltage of the external electrical signal (10) and the amplitude of the generated surface acoustic wave (11), thereby realizing the control of the resistance value of the conductive path.
5. The circuit board selection method according to claim 4, characterized in that: In step 1, by changing the relative positional relationship of the two interdigitated electrodes of the input external electrical signal (10), the position and shape of the conductive path in the stripe array (12) are changed, thereby realizing the gating control between different gating electrodes (7), specifically: If an external electrical signal (10) is input to two non-adjacent interdigitated electrodes (2, 4), the propagation direction of the generated surface acoustic wave (11) is parallel to the opening direction of the interdigitated electrodes (2, 4) that input the external electrical signal (10). Each conductive path is formed by sequentially arranging and connecting conductive particles (9) that gather at the trough of the same straight line perpendicular to the propagation direction of the surface acoustic wave (11). Each conductive path connects the gate electrodes (7) on both sides of the first center line of the control frame (6). The first center line is the center line of the control frame (6) that is parallel to the propagation direction of the surface acoustic wave (11). If an external electrical signal (10) is input to two adjacent interdigital electrodes (4, 5), the propagation direction of the generated surface acoustic wave (11) is perpendicular to the first diagonal of the control frame (6). The first diagonal is the diagonal of the control frame (6) that is parallel to the centroidal connection line of the two interdigital electrodes (4, 5) inputting the external electrical signal (10). Each conductive path is formed by the sequential arrangement and connection of conductive particles (9) gathered at the trough of the same straight line perpendicular to the propagation direction of the surface acoustic wave (11). Each conductive path connects the gate electrodes (7) on the same side of the first diagonal.