A device integration structure with heat dissipation and shielding structure

Abstract

The present application relates to a device integration structure with heat dissipation and shielding structure, comprising: a substrate which is divided into a plurality of substrate regions or PCB board regions; a shell which is located at the outermost layer of the device integration structure with heat dissipation and shielding structure, and is configured to shield the interference of electrostatic and electromagnetic field of external environment to internal devices, and dissipate heat; a device unit with heat dissipation device which is arranged in the substrate region or the PCB board region, the device unit with heat dissipation device comprises a second heat dissipation device and a device unit, wherein the device unit comprises: a second electromagnetic field shielding device which is located at the outermost layer of the device unit; a third heat dissipation device which is located at the second outer layer of the device unit; a first electronic device which is arranged in the internal space surrounded by the third heat dissipation device; and a fourth heat dissipation device which is connected with the first electronic device and the third heat dissipation device; and a static magnetic shielding device which covers the outside of the device unit with heat dissipation device.

Description

Technical Field

[0001] This invention relates to the field of semiconductor packaging technology, and more particularly to a device integration structure with heat dissipation and shielding. Background Technology

[0002] With advancements in science and technology, electronic products are becoming increasingly integrated, incorporating multiple electronic components. These internal components generate electromagnetic waves during operation, causing mutual interference. Furthermore, various electromagnetic waves from the external environment can also interfere with these components. Simultaneously, due to the increasing integration and insufficient heat dissipation, these components overheat significantly. Therefore, it is necessary to reduce mutual interference between internal electronic components and the interference from external electromagnetic waves, as well as to solve the problem of heat dissipation. Summary of the Invention

[0003] The objective of this invention is to provide a device integration structure with heat dissipation and shielding structures. This device integration structure reduces mutual interference between internal electronic components through partitioned shielding, the shielding structure of the housing can reduce interference from the external environment to the internal electronic components, and the heat dissipation structure in this device integration structure can solve the problem of heat dissipation of the internal electronic components.

[0004] In a first aspect, addressing the problems existing in the prior art, the present invention provides a device integration structure with heat dissipation and shielding structures, comprising:

[0005] The substrate is divided into multiple substrate areas or PCB areas;

[0006] The housing, located on the outermost layer of the device integration structure with heat dissipation and shielding, is configured to shield the internal devices from electrostatic and electromagnetic interference from the external environment and to dissipate heat.

[0007] A device unit with a heat dissipation device is disposed in the substrate area or PCB area. The device unit with the heat dissipation device includes a second heat dissipation device and a device unit grounded to the substrate area or PCB area. The device unit includes:

[0008] The second electromagnetic field shielding device is located on the outermost layer of the device unit;

[0009] The third heat dissipation device is located in the outermost layer of the device unit;

[0010] A first electronic device, disposed within the internal space surrounded by the third heat dissipation device; and

[0011] A fourth heat dissipation device, which is connected to the first electronic device and the third heat dissipation device; and

[0012] A static magnetic shielding device is installed on the outside of the device unit with a heat dissipation device.

[0013] In one embodiment of the present invention, the housing comprises, from the outside to the inside, an electrostatic shielding device, a first electromagnetic field shielding device, and a first heat dissipation device.

[0014] In one embodiment of the present invention, the electrostatic shielding device and the first electromagnetic field shielding device are connected by thermal adhesive; and / or

[0015] The first electromagnetic field shielding device and the first heat dissipation device are connected by thermal adhesive.

[0016] In one embodiment of the present invention, the static magnetic shielding device and the second electromagnetic field shielding device are connected by thermal adhesive.

[0017] In one embodiment of the present invention, the second heat dissipation device and the fourth heat dissipation device are aluminum nitride thermally conductive ceramics; and / or

[0018] The first electromagnetic field shielding device and the second electromagnetic field shielding device are made of nickel silver; and / or

[0019] The first heat dissipation device and the third heat dissipation device are made of copper; and / or

[0020] The electrostatic shielding device is made of flexible graphite shielding material.

[0021] In one embodiment of the present invention, the device unit is connected to a second heat dissipation device.

[0022] In one embodiment of the present invention, the device unit is provided with a wire bonding start point; and / or

[0023] The substrate area or PCB area is provided with a substrate window or PCB window and lead bond alloy fingers, wherein the lead bond alloy fingers are exposed from the substrate window or PCB window.

[0024] In one embodiment of the present invention, the lead-bonding alloy finger is connected to the lead-bonding starting point via a bonding lead, wherein the lead-bonding alloy finger is connected to the line ground terminal.

[0025] In one embodiment of the present invention, the housing is disposed on the substrate;

[0026] The electrostatic shielding device and the first electromagnetic field shielding device are connected to the grounding terminal of the circuit on the substrate or PCB board by contacting the substrate or PCB board; and / or

[0027] The static magnetic shielding device is connected to the grounding terminal of the circuit on the substrate area or PCB area by contacting the substrate area or PCB area.

[0028] In one embodiment of the present invention, the device unit further includes a second electronic device disposed in the internal space surrounded by the third heat dissipation device.

[0029] The present invention has at least the following beneficial effects: The device integration structure disclosed herein, with heat dissipation and shielding, divides the substrate into multiple regions according to actual usage functions. An electromagnetic field shielding device is provided for each device unit in each region, and the electromagnetic field device is grounded to reduce or even eliminate mutual interference between internal electronic components, effectively achieving electromagnetic shielding of each substrate region or PCB area. The electrostatic shielding device and electromagnetic field shielding device in the housing of this device integration structure can reduce or even eliminate interference from the external environment to the internal electronic components. For electronic components requiring heat dissipation in this device integration structure, aluminum nitride thermally conductive ceramic is used as the thermally conductive medium, which has thermal conductivity exceeding that of metal materials such as steel and iron. Furthermore, by utilizing the electrostatic shielding device and electromagnetic field shielding device for heat dissipation, better heat dissipation can be achieved, thus solving the problem of heat dissipation for internal electronic components. Attached Figure Description

[0030] To further illustrate the above and other advantages and features of the various embodiments of the present invention, a more specific description of the embodiments of the invention will be presented with reference to the accompanying drawings. It is to be understood that these drawings depict only typical embodiments of the invention and are therefore not intended to limit its scope. In the drawings, identical or corresponding parts will be indicated by identical or similar reference numerals for clarity.

[0031] Figure 1 A perspective view of a device integration structure with heat dissipation and shielding structure according to an embodiment of the present invention is shown;

[0032] Figure 2 A top view of a device integration structure with heat dissipation and shielding structure according to an embodiment of the present invention is shown;

[0033] Figure 3 A cross-sectional view along line a is shown of the upper surface of the housing of a device integration structure with heat dissipation and shielding structure according to an embodiment of the present invention;

[0034] Figure 4 A schematic diagram of a device unit with a heat dissipation device disposed in a substrate area or PCB area according to an embodiment of the present invention is shown.

[0035] Figure 5 A schematic diagram of the structure of a device unit according to an embodiment of the present invention is shown; and

[0036] Figure 6 A cross-sectional view of the upper surface of a device unit along line b is shown according to an embodiment of the present invention. Detailed Implementation

[0037] It should be noted that the components in the accompanying drawings may be shown exaggerated for illustrative purposes and may not be to scale.

[0038] In this invention, the various embodiments are merely intended to illustrate the solutions of the invention and should not be construed as limiting.

[0039] In this invention, unless otherwise specified, the quantifiers “a” and “one” do not exclude scenarios involving multiple elements.

[0040] It should also be noted that, in the embodiments of the present invention, only a portion of the parts or components may be shown for clarity and simplicity. However, those skilled in the art will understand that, under the teachings of the present invention, the required parts or components can be added as needed for specific scenarios.

[0041] It should also be noted that within the scope of this invention, the terms "same", "equal", and "equal to" do not mean that the two values ​​are absolutely equal, but allow for a certain reasonable error. In other words, the terms also cover "substantially the same", "substantially equal", and "substantially equal to".

[0042] It should also be noted that in the description of this invention, the terms "center," "longitudinal," "lateral," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing the invention and for simplifying the description, and do not explicitly or implicitly suggest that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0043] Furthermore, the embodiments of the present invention describe the process steps in a specific order. However, this is only for the convenience of distinguishing each step, and is not a limitation on the order of each step. In different embodiments of the present invention, the order of each step can be adjusted according to the process.

[0044] Figure 1 A perspective view of a device integration structure with heat dissipation and shielding structure according to an embodiment of the present invention is shown; Figure 2 A top view of a device integration structure with heat dissipation and shielding structure according to an embodiment of the present invention is shown; Figure 3 A cross-sectional view along line a is shown of the upper surface of the housing of a device integration structure with heat dissipation and shielding structure according to an embodiment of the present invention.

[0045] like Figure 1 and Figure 2 As shown, a device with heat dissipation and shielding structure includes a substrate or PCB board (printed circuit board) 1, a housing, a device unit 6 with a heat dissipation device, and a static magnetic shielding device 7.

[0046] The housing is mounted on the substrate or PCB board 1, located as the outermost layer of the device with heat dissipation and shielding structures. It is configured to shield the internal components from electrostatic and electromagnetic interference from the external environment and to dissipate heat. From the outside to the inside, the housing includes an electrostatic shielding device 2, a first electromagnetic field shielding device 3, and a first heat dissipation device 4. The housing is in direct contact with the substrate or PCB board 1. The electrostatic shielding device 2 and the first electromagnetic field shielding device 3 are in contact with the substrate or PCB board 1, achieving a grounding connection with the grounding terminal (GND) of the circuit on the substrate or PCB board 1. This grounding connection shields against electrostatic and electromagnetic fields from the external environment. Figure 3 As shown, the electrostatic shielding device 2 and the first electromagnetic field shielding device 3, as well as the first electromagnetic field shielding device 3 and the heat dissipation device 4, are connected by thermal adhesive 30.

[0047] The electrostatic shielding device 2 is used to shield the internal electronic components from interference by static electricity from the external environment; the first electromagnetic field shielding device 3 is used to shield the internal electronic components from interference by electromagnetic fields from the external environment. In one embodiment of the present invention, the electrostatic shielding device 2 is made of flexible graphite shielding material. In one embodiment of the present invention, the first electromagnetic field shielding device 3 is made of nickel silver. In one embodiment of the present invention, the first heat dissipation device 4 is made of copper.

[0048] To reduce interference between electronic components within electronic products, the substrate or PCB board should be partitioned and shielded according to its actual function. For example... Figure 1 As shown, the substrate or PCB board is divided into multiple substrate regions or PCB board regions 5, and the device units in each region are shielded. This embodiment uses a 2x2 region as an example to illustrate region shielding and heat dissipation.

[0049] like Figure 1 and Figure 2As shown, each substrate area or PCB area 5 is provided with a device unit 6 with a heat dissipation device and a static magnetic shielding device 7 covering the device unit 6 with the heat dissipation device. The static magnetic shielding device 7 is in direct contact with the substrate area or PCB area 5, and is connected to the grounding terminal of the line on the substrate area or PCB area 5. That is, the static magnetic shielding device 7 is grounded to the substrate or PCB, shielding the magnetic field from the external environment and the magnetic field of the device inside the device unit.

[0050] Figure 4 A schematic diagram of a device unit with a heat dissipation device disposed in a substrate area or PCB area according to an embodiment of the present invention is shown. Figure 5 A schematic diagram of the structure of a device unit according to an embodiment of the present invention is shown; Figure 6 A cross-sectional view of the upper surface of a device unit along line b is shown according to an embodiment of the present invention.

[0051] like Figure 4 As shown, a device unit 6 with a heat dissipation device is arranged in the substrate area or PCB area 5. The device unit 6 with the heat dissipation device includes a device unit 61 and a second heat dissipation device 8 disposed on the device unit 61. The device unit 61 includes an outermost second electromagnetic field shielding device 9 and a second outermost third heat dissipation device 10. A wire bonding starting point 91 is provided on the second electromagnetic field shielding device 9. The substrate area or PCB area 5 is provided with a substrate opening or PCB opening 51 and wire bond alloy fingers 52. The wire bond alloy fingers 52 are located in the substrate opening or PCB opening 51. The function of the substrate opening or PCB opening 51 is to expose the wire bond alloy fingers 52 on the substrate area or PCB area 5 and prevent the green solder mask from flowing into the substrate area or PCB area 5.

[0052] The wire bonding starting point 91 and the wire bonding alloy finger 52 are connected by bonding leads 20, wherein the wire bonding alloy finger 52 is connected to the ground terminal, that is, a ground connection is established between the device unit and the substrate area or PCB area. Electromagnetic field shielding of the internal components of the device unit is achieved by a second electromagnetic field shielding device 9, which connects to ground (GND) via wire bonding. In one embodiment of the invention, the wire bonding 20 uses gold wire.

[0053] like Figure 5As shown, device unit 61 includes an outermost second electromagnetic field shielding device 9, a next outermost third heat dissipation device 10, a first electronic device 62, a second electronic device 63, and a fourth heat dissipation device 11. The first electronic device 62, the second electronic device 63, and the fourth heat dissipation device 11 are disposed within the internal space surrounded by the third heat dissipation device 10. The first electronic device 62 is the electronic device requiring heat dissipation. The second electronic device 63 is the electronic device not requiring heat dissipation. The third heat dissipation device 10 is made of copper.

[0054] The fourth heat dissipation device 11 is connected to the first electronic component 62 via thermal adhesive. The fourth heat dissipation device 11 is also connected to the third heat dissipation device 10 via thermal adhesive. (See also...) Figure 6 The third heat dissipation device 10 and the second electromagnetic field shielding device 9 are connected by heat dissipation adhesive 30.

[0055] In one embodiment of the present invention, the second heat dissipation device 8 and the fourth heat dissipation device 11 are made of aluminum nitride thermally conductive ceramic. Aluminum nitride thermally conductive ceramic has high thermal conductivity and high temperature resistance, and is also a combination of electrical insulators; therefore, it is chosen as the heat-conducting medium. In one embodiment of the present invention, the second electromagnetic field shielding device 9 is made of nickel silver.

[0056] A second heat dissipation device 8 is provided on the second electromagnetic field shielding device 9. The second electromagnetic field shielding device 9 is connected to the static magnetic shielding device 7 through the second heat dissipation device 8, wherein the second heat dissipation device 8 and the second electromagnetic field shielding device 9 are connected by thermal adhesive. The static magnetic shielding device 7 is connected to the first heat dissipation device 4 through thermal adhesive.

[0057] The electromagnetic shielding measures involved in this invention are as follows: (1) The outer cover of the device unit 6 with heat dissipation device is provided with a second electromagnetic shielding device 9, which can realize electromagnetic shielding between device units 6 with heat dissipation devices in each substrate area or PCB area; (2) The device unit 6 with heat dissipation device is connected to the second electromagnetic shielding device 9 and the lead bonding alloy finger 52 through bonding wires, thereby better realizing electromagnetic shielding in each substrate area or PCB area; (3) The outer layer of the device integrated structure with heat dissipation and shielding structure is provided with a first electromagnetic shielding device 3 to reduce or even eliminate the electromagnetic influence of external environmental electromagnetic fields on internal electronic devices.

[0058] The static magnetic shielding measures involved in this invention are as follows: a static magnetic shielding device 7 is provided outside the device unit 6 with a heat dissipation device to reduce or even eliminate the influence of the magnetic field generated by the device unit 6 with a heat dissipation device in each substrate area or PCB area during operation and the magnetic field of the external environment.

[0059] The electrostatic shielding measures involved in this invention patent are as follows: an electrostatic shielding device 2 is provided on the outermost layer of the device integrated structure with heat dissipation and shielding structure to reduce or even eliminate the influence of external environmental static electricity on internal electronic devices.

[0060] The heat dissipation measures involved in this invention are as follows: (1) The first electronic device 62 is connected to the fourth heat dissipation device 11, and the fourth heat dissipation device 11 is connected to the third heat dissipation device 10 through thermal adhesive, which can dissipate heat for the first electronic device 62; (2) The third heat dissipation device 10 and the second electromagnetic field shielding device 9 are connected through thermal adhesive 30. The material of the second electromagnetic field shielding device 9 is nickel silver, which is a metal that can conduct heat and dissipate heat; (3) The second electromagnetic field shielding device 9 and the static magnetic shielding device 7 are connected through the second heat dissipation device 8, and the static magnetic shielding device 7 and the first heat dissipation device 8 are connected through the second heat dissipation device 8. The heat-generating device 4 is connected by heat-dissipating adhesive. The material of the static magnetic shielding device 7 is silicon steel. Silicon steel is a high magnetic permeability material with good thermal conductivity, which can dissipate heat. (4) The first electromagnetic field shielding device 3 and the first heat dissipation device 4 are connected by heat-dissipating adhesive 30. The material of the first electromagnetic field shielding device 3 is nickel silver, which can dissipate heat. (5) The electrostatic shielding device 2 and the first electromagnetic field shielding device 3 are connected by heat-dissipating adhesive 30. The electrostatic shielding device 2 is a flexible graphite shielding material. Flexible graphite is a heat-conducting medium. Its thermal conductivity exceeds that of metal materials such as steel and iron, which can dissipate heat.

[0061] The heat dissipation path of the first electronic device 62 inside the device unit 6 with heat dissipation device that needs to dissipate heat is as follows: the first electronic device 62 transfers heat to the fourth heat dissipation device 11, and then to the third heat dissipation device 10 through the thermal adhesive; the third heat dissipation device 10 transfers heat to the second electromagnetic field shielding device 9; the second electromagnetic field shielding device 9 transfers heat to the static magnetic shielding device 7 through the second heat dissipation device 8, and then to the first heat dissipation device 4; the first heat dissipation device 4 transfers heat to the first electromagnetic field shielding device 3; the first electromagnetic field shielding device 3 transfers heat to the electrostatic shielding device 2 through the thermal adhesive, and the electrostatic shielding device 2 dissipates heat through heat exchange with the outside.

[0062] The present invention has at least the following beneficial effects: The device integration structure disclosed herein, with heat dissipation and shielding, divides the substrate into multiple regions according to actual usage functions. An electromagnetic field shielding device is provided for each device unit in each region, and the electromagnetic field device is grounded to reduce or even eliminate mutual interference between internal electronic components, effectively achieving electromagnetic shielding of each substrate region or PCB area. The electrostatic shielding device and electromagnetic field shielding device in the housing of this device integration structure can reduce or even eliminate interference from the external environment to the internal electronic components. For electronic components requiring heat dissipation in this device integration structure, aluminum nitride thermally conductive ceramic is used as the thermally conductive medium, which has thermal conductivity exceeding that of metal materials such as steel and iron. Furthermore, by utilizing the electrostatic shielding device and electromagnetic field shielding device for heat dissipation, better heat dissipation can be achieved, thus solving the problem of heat dissipation for internal electronic components.

[0063] While some embodiments of the present invention have been described in this application, those skilled in the art will understand that these embodiments are merely illustrative. Numerous variations, alternatives, and improvements will arise in those skilled in the art under the teachings of this invention without departing from its scope. The appended claims are intended to define the scope of the invention and thereby cover methods and structures within the scope of the claims themselves and their equivalents.

Claims

1. A device integration structure with heat dissipation and shielding structure, characterized by, The application relates to a device integration structure with a heat dissipation and shielding structure. The device integration structure comprises: a substrate or PCB board, which is divided into multiple substrate regions or PCB board regions; a shell, which is located at the outermost layer of the device integration structure with the heat dissipation and shielding structure, and is configured to shield the interference of electrostatic and electromagnetic fields in the external environment on the internal devices and dissipate heat; the shell comprises, from the outside to the inside, an electrostatic shielding device, a first electromagnetic field shielding device and a first heat dissipation device; the electrostatic shielding device and the first electromagnetic field shielding device are connected through heat dissipation glue; the first electromagnetic field shielding device and the first heat dissipation device are connected through heat dissipation glue; a device unit with a heat dissipation device, which is arranged in the substrate region or the PCB board region; the device unit with the heat dissipation device comprises a second heat dissipation device and a device unit connected to the ground of the substrate region or the PCB board region; the device unit is connected to the second heat dissipation device, wherein the device unit comprises: a second electromagnetic field shielding device, which is located at the outermost layer of the device unit; a third heat dissipation device, which is located at the second outermost layer of the device unit; the third heat dissipation device is connected to the second electromagnetic field shielding device through heat dissipation glue; a first electronic device, which is arranged in the internal space surrounded by the third heat dissipation device; and a fourth heat dissipation device, which is connected to the first electronic device and the third heat dissipation device; and a static magnetic shielding device, which is arranged outside the device unit with the heat dissipation device; the static magnetic shielding device is connected to the circuit ground end on the substrate region or the PCB board region through contact with the substrate region or the PCB board region; the material of the static magnetic shielding device is silicon steel material; the second electromagnetic field shielding device is connected to the static magnetic shielding device through the second heat dissipation device; the second heat dissipation device is connected to the second electromagnetic field shielding device through heat dissipation glue; 2. The device integration structure with heat dissipation and shielding structure according to claim 1, characterized in that, the materials of the first electromagnetic field shielding device and the second electromagnetic field shielding device are white brass; the material of the electrostatic shielding device is flexible graphite shielding material. the second heat dissipation device and the fourth heat dissipation device are aluminum nitride heat-conducting ceramics; and / or 3. The device integration structure with heat dissipation and shielding structure according to claim 1, wherein, the materials of the first heat dissipation device and the third heat dissipation device are red copper. the device unit is provided with a wire bonding starting point; and / or 4. The device integration structure with heat dissipation and shielding structure according to claim 3, characterized in that, the substrate region or the PCB board region is provided with a substrate window or a PCB board window and a wire bonding finger, wherein the wire bonding finger is exposed from the substrate window or the PCB board window.

5. The device integration structure with heat dissipation and shielding structure according to claim 1, wherein, the wire bonding finger is connected to the wire bonding starting point through a bonding wire, wherein the wire bonding finger is connected to the circuit ground end. the shell is arranged on the substrate; 6. The device integration structure with heat spreading and shielding structure according to claim 1, wherein, the electrostatic shielding device and the first electromagnetic field shielding device are connected to the circuit ground end on the substrate or the PCB board through contact with the substrate or the PCB board. the device unit further comprises a second electronic device, which is arranged in the internal space surrounded by the third heat dissipation device.

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