Display panel and manufacturing method thereof, and etching liquid composition

Abstract

This application discloses a display panel and its manufacturing method, as well as an etching solution composition. The display panel includes a driving backplate and a light-emitting chip disposed on the driving backplate. The driving backplate includes a driving layer and electrode terminals disposed on the driving layer, with the light-emitting chip fixedly connected to the electrode terminals. A rust-preventive layer is disposed on the surface of the electrode terminals, the corrosion rate of which is lower than that of the electrode terminals, and the light-emitting chip is in direct contact with the rust-preventive layer. This application provides an etching solution composition and uses this composition to process and manufacture the display panel, forming a rust-preventive layer on the surface of the electrode terminals within the display panel. This effectively reduces corrosion at the welding points between the electrode terminals and the light-emitting chip caused by subsequent processing, stabilizes the display effect of the display panel, and improves product yield.

Description

Technical Field

[0001] The present application relates to the field of display panel manufacturing, and in particular to a display panel and a manufacturing method thereof, and an etching liquid composition. Background Art

[0002] Mini-LED and Micro-LED are collectively referred to as MLED. MLED display technology refers to a display technology that uses self-luminous micron-sized light-emitting diodes LEDs as light-emitting pixel units and assembles them on a driving panel to form a high-density LED array.

[0003] Currently, MLED chips are generally mounted on electrode terminals on an array substrate through laser welding technology. However, in subsequent manufacturing processes, the welding positions between the MLED chips and the electrode terminals made of copper-based metal materials are easily corroded due to the intrusion of water vapor, resulting in poor conductivity between the MLED chips and the driver backplane, which in turn causes poor display problems. Summary of the invention

[0004] The present application provides a display panel and a manufacturing method thereof, and an etching liquid composition, so as to improve the problem that the welding position between the current MLED chip and the electrode terminal is easily corroded due to water vapor intrusion, resulting in poor display.

[0005] To solve the above technical problems, the technical solutions provided by this application are as follows:

[0006] The present application provides a display panel, comprising:

[0007] A driving backplane, comprising a substrate and electrode terminals disposed on the substrate; and

[0008] A light emitting chip is disposed on the driving backplane, and the light emitting chip is fixedly connected to the electrode terminal;

[0009] Wherein, a rust-proof layer is provided on the surface of the electrode terminal, the corrosion rate of the rust-proof layer is lower than the corrosion rate of the electrode terminal, and the light-emitting chip is in direct contact with the rust-proof layer.

[0010] In the display panel of the present application, the anti-rust layer includes an azole compound, and the electrode terminal is fixedly connected to the anti-rust layer by van der Waals force.

[0011] In the display panel of the present application, the azole compound includes at least one of diazole, triazole and tetrazole.

[0012] In the display panel of the present application, the diazole includes at least one of imidazole and pyrazole, the triazole includes at least one of 3-amino-1,2,3-triazole, 3-amino-1,2,4-triazole, 4-amino-1,2,3-triazole, and 4-amino-1,2,4-triazole, and the tetrazole includes at least one of 5-methyltetrazole and 5-aminotetrazole.

[0013] The present application also provides an etching liquid composition for manufacturing the display panel, wherein the etching liquid composition comprises the following components by mass fraction:

[0014] Decomposer 0.5% to 6%, chelating agent 0.01% to 3%, corrosion protection agent 0.01% to 1%, surfactant 0.001% to 0.5%, and the balance is water;

[0015] Wherein, the decomposing agent is a Lewis acid having reducing and oxidizing properties, and the corrosion protection agent includes an azole compound.

[0016] In the etching solution composition of the present application, the etching solution composition includes the following components by mass fraction:

[0017] The decomposer is 1% to 4%, the chelating agent is 0.5% to 1%, the corrosion protection agent is 0.05% to 0.3%, the surfactant is 0.005% to 0.15%, and the balance is water.

[0018] In the etching solution composition of the present application, the decomposition agent includes at least one of hydrogen peroxide, nitrous acid, and sulfurous acid, and the pH value of the etching solution composition is 5 to 8.

[0019] In the etching solution composition of the present application, the chelating agent includes at least one of iminodiacetic acid, nitrilotriacetic acid, ethylenediaminetetraacetic acid, diethylnitroacetic acid, aminotrimethylenephosphonic acid, 1-hydroxyethane-1,1-diphosphonic acid, ethylenediaminetetramethylenephosphonic acid, and diethylenetriaminepentamethylenephosphonic acid.

[0020] In the etching solution composition of the present application, the surfactant includes an anionic surfactant, and the anionic surfactant includes at least one of sodium dodecyl sulfate, ammonium lauryl sulfate, potassium dodecyl sulfate, sodium dodecyl sulfonate, ammonium dodecylbenzene sulfonate, and potassium dodecylbenzene sulfonate.

[0021] The present application also provides a method for manufacturing a display panel, wherein the display panel is manufactured by using the etching liquid composition, and the method for manufacturing the display panel comprises:

[0022] Providing a driving backplane, the driving backplane comprising a substrate and electrode terminals arranged on the substrate;

[0023] Treating the surface of the electrode terminal with an etching liquid composition to form an anti-rust layer on the surface of the electrode terminal;

[0024] A plurality of light-emitting chips are provided, and the plurality of light-emitting chips are welded on the surface of the electrode terminal.

[0025] Beneficial Effects

[0026] The present application provides an anti-rust layer on the surface of the electrode terminal, and the corrosion rate of the anti-rust layer is lower than the corrosion rate of the electrode terminal, so that the anti-rust layer can play a good protective effect on the surface of the electrode terminal, effectively preventing or delaying the corrosion of the welding position between the light-emitting chip and the electrode terminal, thereby improving the current problem that the welding position between the MLED chip and the electrode terminal is easily corroded due to water vapor intrusion, causing poor display. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For those skilled in the art, other drawings can be obtained based on these drawings without creative work.

[0028] Figure 1 is a schematic diagram of the overall structure of the display panel described in this application;

[0029] Figure 2 is a schematic diagram of the connection structure between the electrode terminal and the light-emitting chip described in the present application;

[0030] Figure 3 is a flowchart of a method for manufacturing a display panel described in the present application;

[0031] Figure 4 It is a table of test data of the etching solution composition described in this application.

[0032] Description of reference numerals:

[0033] 100, driving backplane; 110, substrate; 120, driving layer; 130, electrode terminal;

[0034] 200. Light-emitting chip;

[0035] 300. Anti-rust layer. DETAILED DESCRIPTION

[0036] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the present application. In addition, it should be understood that the specific implementation methods described herein are only used to illustrate and explain the present application, and are not used to limit the present application. In the present application, unless otherwise stated, the directional words such as "upper" and "lower" used generally refer to the upper and lower parts of the device in actual use or working state, specifically the drawing direction in the accompanying drawings; while "inside" and "outside" refer to the outline of the device.

[0037] At present, MLED chips are generally mounted on electrode terminals on array substrates through laser welding technology. However, in the subsequent manufacturing process, the welding position between the MLED chip and the electrode terminals made of copper metal is easily corroded due to water vapor intrusion, resulting in poor conduction between the MLED chip and the driver backplane, which in turn causes poor display. Based on the above technical problems, this application proposes the following solution.

[0038] See also Figure 1 and Figure 2 The present application provides a display panel, comprising a driving backplane and a light-emitting chip disposed on the driving backplane, wherein the driving backplane comprises a driving layer and an electrode terminal disposed on the driving layer, and the light-emitting chip is fixedly connected to the electrode terminal. The surface of the electrode terminal is provided with an anti-rust layer, the corrosion rate of the anti-rust layer is lower than the corrosion rate of the electrode terminal, and the light-emitting chip is in direct contact with the anti-rust layer.

[0039] The present application provides an anti-rust layer on the surface of the electrode terminal, and the corrosion rate of the anti-rust layer is lower than the corrosion rate of the electrode terminal, so that the anti-rust layer can play a good protective effect on the surface of the electrode terminal, effectively preventing or delaying the corrosion of the welding position between the light-emitting chip and the electrode terminal, thereby improving the current problem that the welding position between the MLED chip and the electrode terminal is easily corroded due to water vapor intrusion, causing poor display.

[0040] The technical solution of the present application is now described in conjunction with specific embodiments. It should be noted that the description order of the following embodiments is not intended to limit the preferred order of the embodiments.

[0041] In this embodiment, the driving backplane may be an array substrate, the driving backplane may further include a substrate, and the driving layer may be an array driving layer disposed on the substrate. The array driving layer may include a plurality of data lines, a plurality of scan lines, and a plurality of thin film transistors, the gate of the thin film transistor being electrically connected to the scan line, the source / drain of the thin film transistor being connected to the data line, and the drain / source of the thin film transistor being electrically connected to the electrode terminal. The scanning signal on the scanning line controls the conduction of the source-drain layer of the thin film transistor through the gate, and the data signal on the data line is transmitted to the light-emitting chip through the source-drain layer to realize the light-emitting display function of the light-emitting chip.

[0042] In this embodiment, the light-emitting chip may be an MLED chip, and the MLED chip may include a Mini-LED chip, a Micro-LED chip, and the like.

[0043] In this embodiment, the electrode terminal may be made of copper, aluminum, molybdenum-based metals, or alloys thereof.

[0044] In this embodiment, the material of the anti-rust layer can be an organic compound material with conductive properties, which has good anti-corrosion performance and can achieve electrical conduction between the light-emitting chip and the electrode terminal. The P-pole and N-pole pins of the light-emitting chip can be in direct contact with the anti-rust layer and fixedly connected to the electrode terminal by laser welding or other techniques.

[0045] In the display panel of the present application, the anti-rust layer may include an azole compound, and the electrode terminal and the anti-rust layer may be fixedly connected by van der Waals force. Specifically, taking Cu as an example, the s orbital and p orbital of the N atom in the azole compound overlap with the d orbital of the Cu atom, thereby chemical adsorption and physical adsorption occur. Chemical adsorption is caused by the interaction between the s orbital and p orbital of the N atom and the d orbital of the Cu atom, and physical adsorption is caused by the van der Waals interaction of neutral molecules and the electrostatic interaction of protonated molecules.

[0046] In this embodiment, the anti-rust layer is set to an azole compound, so that the azole compound can form a dense protective film on the surface of the electrode terminal through chemical adsorption and / or physical adsorption, thereby separating the corrosive medium such as external water vapor from the metal interface of the electrode terminal, thereby protecting the electrode terminal from corrosion or delaying corrosion.

[0047] In this embodiment, the azole compound may include at least one of diazole, triazole, and tetrazole. Specifically, the diazole may include at least one of imidazole and pyrazole; the triazole may include at least one of 3-amino-1,2,3-triazole, 3-amino-1,2,4-triazole, 4-amino-1,2,3-triazole, and 4-amino-1,2,4-triazole; the tetrazole may include at least one of 5-methyltetrazole and 5-aminotetrazole.

[0048] In this embodiment, by setting the azole compound to include at least one of the above-mentioned diazole, triazole, and tetrazole, the adsorption effect between the azole compound and the electrode terminal can be better, so that a dense protective film can be formed on the surface of the electrode terminal more stably, thereby achieving a better anti-corrosion protection effect.

[0049] The present application also provides an etching liquid composition for making the display panel described in the above embodiment. The etching liquid composition may include the following components by mass fraction: 0.5% to 6% of a decomposer, 0.01% to 3% of a chelating agent, 0.01% to 1% of a corrosion protection agent, 0.001% to 0.5% of a surfactant, and the balance is water; wherein the decomposer is a Lewis acid having reducing and oxidizing properties, and the corrosion protection agent includes an azole compound.

[0050] Before the chip binding process of the display panel, the electrode terminal will be oxidized or corroded in the front-end process, resulting in the formation of metal rust on its surface, such as copper rust CuO on the surface of the electrode terminal made of Cu. The Lewis acid with reducing and oxidizing properties described in this embodiment can react with metal oxides such as metal rust such as copper rust CuO, and dissolve metal oxides such as metal rust into metal ions while undergoing redox reactions, so that the corrosion protection agent made of azole compound material can be adsorbed on the newly formed metal surface such as copper metal surface through physical adsorption and / or chemical adsorption, thereby forming a dense protective film layer on the metal surface, which can prevent or slow down the Lewis acid and external water vapor in subsequent processes from further corroding the metal surface, thereby achieving a good anti-corrosion effect.

[0051] In the etching solution composition of the present application, the mass percentage of the decomposing agent in the etching solution composition can be any value between 0.5% and 6%. For example, the mass percentage of the decomposing agent in the etching solution composition can be 0.5%, 1%, 2.5%, 4%, 5%, 6%, etc.

[0052] In this embodiment, the mass percentage of the decomposer in the etching solution composition can be 1% to 4%, so that the concentration of the decomposer is moderate, the dissolution rate of the metal rust on the surface of the electrode terminal is better controllable, and the metal damage of the electrode terminal itself can be effectively reduced.

[0053] In this embodiment, the decomposition agent may include at least one of hydrogen peroxide, nitrous acid, and sulfurous acid, and the pH value of the etching solution composition is 5 to 8. Hydrogen peroxide, nitrous acid, and sulfurous acid are all weak acids that are both reducing and oxidizing. Such weak acids can dissolve metal rust and the dissolution rate is controllable. In addition to metal ions and water, the reaction product is a gas that can escape the reaction system and will not affect the subsequent adhesion of corrosion inhibitors to the newly formed metal surface. In this embodiment, by setting the system pH value of the etching solution composition to 5 to 8, the system of the etching solution composition can be always maintained at a weak acid or neutral state, which is conducive to maintaining the stability of the decomposition agent.

[0054] In this embodiment, the decomposition agent may be any one of hydrogen peroxide, nitrous acid, and sulfurous acid. For example, the decomposition agent may be hydrogen peroxide, or the decomposition agent may be nitrous acid, or the decomposition agent may be sulfurous acid.

[0055] In this embodiment, the decomposition agent may also be a combination of any two of hydrogen peroxide, nitrous acid, and sulfurous acid. For example, the decomposition agent may be a combination of hydrogen peroxide and nitrous acid. The hydrogen peroxide and the nitrous acid may be mixed in any mass ratio, such as 1:1, 1:2, 1:3, 2:1, 3:1, etc. to form the decomposition agent. It should be noted that this embodiment is only described by taking the above specific ratio as an example, and the mass ratio of the hydrogen peroxide and the nitrous acid in the decomposition agent is not limited to the above ratio, and other mass ratios should also be within the protection scope of this application.

[0056] In the etching solution composition of the present application, the mass percentage of the chelating agent in the etching solution composition can be any value between 0.01% and 3%. For example, the mass percentage of the chelating agent in the etching solution composition can be 0.05%, 0.15%, 0.5%, 1%, 2%, 3%, etc.

[0057] In this embodiment, the mass percentage of the chelating agent in the etching solution composition can be 0.5% to 1%, so that the etching solution composition maintains a high etching efficiency and the stability of the reaction system, thereby achieving good economic benefits.

[0058] In this embodiment, the chelating agent includes at least one of iminodiacetic acid, nitrilotriacetic acid, ethylenediaminetetraacetic acid, diethylnitroacetic acid, aminotrimethylenephosphonic acid, 1-hydroxyethane-1,1-diphosphonic acid, ethylenediaminetetramethylenephosphonic acid, and diethylenetriaminepentamethylenephosphonic acid. It should be noted that when the chelating agent is composed of at least two of the above substances, the mass ratio of each component in the chelating agent can be any ratio, and the present application does not impose any specific restrictions on this.

[0059] In this embodiment, the chelating agent is at least one of the above compounds, so that the chelating agent can form a metal complex with the metal ions generated by the reaction and dissolution of the above-mentioned decomposing agent and metal rust, thereby inhibiting the reactivity of the metal ions, avoiding or weakening the hydrolysis-promoting effect of the metal ions on the weakly acidic decomposing agent, and further inhibiting the hydrolysis decomposition reaction of the decomposing agent, which is beneficial to maintaining the system stability of the etching solution composition.

[0060] In the etching solution composition of the present application, the mass percentage of the corrosion protection agent in the etching solution composition can be any value between 0.01% and 1%. For example, the mass percentage of the corrosion protection agent in the etching solution composition can be 0.01%, 0.05%, 0.1%, 0.2%, 0.25%, 0.5%, 1%, etc.

[0061] In this embodiment, the mass percentage of the corrosion protectant in the etching solution composition can be 0.05% to 0.3%, so that the corrosion protectant has an appropriate van der Waals force with the newly formed metal surface of the electrode terminal within this concentration range, thereby stably adsorbing on the metal surface to form a dense protective film layer.

[0062] In this embodiment, the azole compound in the corrosion protection agent may include at least one of diazole, triazole, and tetrazole. Specifically, the diazole may include at least one of imidazole and pyrazole, the triazole may include at least one of 3-amino-1,2,3-triazole, 3-amino-1,2,4-triazole, 4-amino-1,2,3-triazole, and 4-amino-1,2,4-triazole, and the tetrazole may include at least one of 5-methyltetrazole and 5-aminotetrazole. It should be noted that when the corrosion protection agent is composed of at least two of the above substances, the mass ratio of each component substance in the corrosion protection agent can be any ratio, and this application does not impose specific restrictions on this.

[0063] In this embodiment, by setting the corrosion protection agent to include the above-mentioned types of azole compounds, the adsorption effect between the azole compounds and the electrode terminals is better, so that a dense protective film can be formed on the surface of the electrode terminal more stably, thereby achieving a better anti-corrosion protection effect.

[0064] In the etching solution composition of the present application, the mass percentage of the surfactant in the etching solution composition can be any value between 0.001% and 0.5%. For example, the mass percentage of the corrosion protection agent in the etching solution composition can be 0.001%, 0.005%, 0.01%, 0.05%, 0.1%, 0.2%, 0.3%, etc.

[0065] In this embodiment, the mass percentage of the surfactant in the etching solution composition can be 0.005% to 0.15%, so that the activity of the surfactant is moderate, the bubbles generated when removing foreign matter from the electrode terminal surface are smaller, and it is conducive to the stable adhesion of the corrosion protection agent on the surface of the electrode terminal.

[0066] In this embodiment, the surfactant may include an anionic surfactant, and the anionic surfactant may include at least one of sodium dodecyl sulfate, ammonium lauryl sulfate, potassium dodecyl sulfate, sodium dodecyl sulfonate, ammonium dodecylbenzene sulfonate, and potassium dodecylbenzene sulfonate. It should be noted that when the surfactant is composed of at least two of the above substances, the mass ratio of each component in the surfactant can be any ratio, and the present application does not impose any specific restrictions on this.

[0067] In this embodiment, by configuring the surfactant to include the above-mentioned types of anionic surfactants, the surfactant can remove foreign matter on the surface of the electrode terminal, thereby improving the adsorption effect of the corrosion protection agent on the surface of the electrode terminal, thereby achieving a better corrosion inhibition effect.

[0068] In the etching liquid composition of the present application, the remaining water in the etching liquid composition can be ordinary pure water or ionized water, and the resistivity of the water is above 18 MΩ·CM.

[0069] In the etching solution composition of the present application, based on the total weight of the etching solution composition as 100%, the content of each component can be: 1% to 4% of decomposer, 0.5% to 1% of chelating agent, 0.05% to 0.3% of corrosion protection agent, 0.005% to 0.15% of surfactant, and the balance is water.

[0070] In this embodiment, by setting the content of each component in the etching solution composition within the above range, the etching efficiency of the etching solution composition can be higher, the etching speed can be better controlled, and the damage to the surface of the electrode terminal can be less.

[0071] See also Figure 3 The embodiment of the present application also provides a method for manufacturing a display panel, by using the etching liquid composition described in the above embodiment to manufacture the display panel described in the above embodiment.

[0072] In this embodiment, the method for manufacturing the display panel may include:

[0073] S100, providing a driving backplane, wherein the driving backplane comprises a driving layer and electrode terminals disposed on the driving layer.

[0074] S200, treating the surface of the electrode terminal with an etching solution composition to form an anti-rust layer on the surface of the electrode terminal.

[0075] S300, providing a plurality of light-emitting chips, and welding the plurality of light-emitting chips on the surface of the electrode terminal.

[0076] Through the above-mentioned manufacturing method, this embodiment can not only remove the metal rust generated on the surface of the electrode terminal in the process before binding the light-emitting chip, but also form a dense protective film layer, i.e., an anti-rust layer, on the surface of the electrode terminal, thereby preventing or slowing down the corrosion of the electrode terminal in subsequent processes and improving the display stability of the display panel.

[0077] In this embodiment, the step S100 may include:

[0078] S110, forming an array driving layer on a glass substrate, and forming an electrode metal layer on the array driving layer;

[0079] S120, patterning the electrode metal layer using a photoresist to form an electrode terminal.

[0080] In this embodiment, the step S200 may include:

[0081] S210, coating or spraying the etching liquid composition on the surface of the electrode terminal, so that the etching liquid composition dissolves the metal rust on the surface of the electrode terminal;

[0082] S220, cleaning the surface of the electrode terminal, and then drying it to a dry state, so that a dense protective film layer, i.e., an anti-rust layer, is formed on the surface of the electrode terminal;

[0083] S230, transferring the light-emitting chip to the electrode terminal, and welding and fixing the pins of the light-emitting chip to the surface of the electrode terminal by laser welding or other techniques.

[0084] In the method for manufacturing a display panel of the present application, in order to verify that an anti-rust layer is formed on the surface of the electrode terminal in the step S200, an effect verification experiment may be performed under the same conditions as the step S200, specifically including:

[0085] Step (1): when the electrode metal layer is patterned to form an electrode terminal in step S120, at least one 4 cm×3 cm metal test piece is formed at the same time, and a contact angle measuring instrument is used to measure the contact angle (before) of the metal test piece before subsequent treatment;

[0086] Step (2): using a stripping solution to separate the metal test piece from the array driving layer, and removing the photoresist on the metal test piece;

[0087] Step (3): heating the etching solution composition to 30° C. in a water bath;

[0088] Step (4): placing the metal test piece in the etching solution composition by dipping or immersing, and washing the metal test piece with water after 2 minutes and drying;

[0089] Step (5): using a contact angle measuring instrument to measure the contact angle (after) of at least one metal test piece treated with the etching solution composition and at least one metal test piece not treated with the etching solution, and comparing the contact angles of the metal test pieces before and after being treated with the etching solution composition.

[0090] In this embodiment, 5 metal test pieces treated with the etching solution composition can be selected as "examples", wherein the contents of each component in the etching solution composition selected in Example 1, Example 2, Example 3, Example 4, and Example 5 can be different.

[0091] In this embodiment, three metal test pieces may be selected and treated with etching liquid compositions other than those described in the embodiment of the present application as Comparative Examples 1, 2, and 3. Among them, at least one of the contents of the components in the etching liquid compositions in Comparative Examples 1, 2, and 3 is not within the range disclosed in the embodiment of the present application, and the contents of the components in the etching liquid compositions in Comparative Examples 1, 2, and 3 may be different.

[0092] See also Figure 4 In this embodiment, the comparison of the component proportions (mass percentages) of the etching solution compositions in Examples 1, 2, 3, 4, 5 and Comparative Examples 1, 2, 3 and the sizes of their contact angles is shown in the table.

[0093] according to Figure 4 It can be seen from the table data that when the etching liquid composition in the embodiment of the present application treats the metal surface such as the electrode terminal, the metal surface can be converted into a hydrophilic surface, thereby indirectly confirming that the etching liquid composition in the embodiment of the present application can form a dense protective film layer composed of azole compounds on the metal surface, i.e., an anti-rust layer, which has an anti-corrosion protection effect on the electrode terminal.

[0094] The embodiment of the present application provides an etching liquid composition, and uses the etching liquid composition to process and manufacture a display panel, so that an anti-rust layer is formed on the surface of the electrode terminal in the display panel, thereby effectively reducing the corrosion of the welding position between the electrode terminal and the light-emitting chip caused by subsequent processing, stabilizing the display effect of the display panel, and improving the product yield.

[0095] The above is a detailed introduction to a display panel and its manufacturing method, and an etching liquid composition provided in the embodiments of the present application. Specific examples are used herein to illustrate the principles and implementation methods of the present application. The description of the above embodiments is only used to help understand the method of the present application and its core idea; at the same time, for technical personnel in this field, according to the idea of ​​the present application, there will be changes in the specific implementation method and application scope. In summary, the content of this specification should not be understood as a limitation on the present application.

Claims

1. A display panel, characterized in that: include: A driving backplane, comprising a driving layer and electrode terminals disposed on the driving layer; as well as A light emitting chip is disposed on the driving backplane, and the light emitting chip is fixedly connected to the electrode terminal; Wherein, the surface of the electrode terminal is provided with an anti-rust layer, the corrosion rate of the anti-rust layer is lower than the corrosion rate of the electrode terminal, and the light emitting chip is in direct contact with the anti-rust layer; The anti-rust layer is formed after the surface of the electrode terminal is treated with an etching solution composition; The etching solution composition comprises: 0.5% to 6% of a decomposer, 0.01% to 3% of a chelating agent, 0.01% to 1% of a corrosion protection agent, 0.001% to 0.5% of a surfactant, and the balance is water; Wherein, the decomposition agent includes at least one of hydrogen peroxide, nitrous acid, and sulfurous acid; The chelating agent includes at least one of iminodiacetic acid, nitrilotriacetic acid, ethylenediaminetetraacetic acid, diethylnitroacetic acid, aminotrimethylenephosphonic acid, 1-hydroxyethane-1,1-diphosphonic acid, ethylenediaminetetramethylenephosphonic acid, and diethylenetriaminepentamethylenephosphonic acid; The corrosion protection agent includes an azole compound; The surfactant includes an anionic surfactant, and the anionic surfactant includes at least one of sodium dodecyl sulfate, ammonium lauryl sulfate, potassium dodecyl sulfate, sodium dodecyl sulfonate, ammonium dodecylbenzene sulfonate, and potassium dodecylbenzene sulfonate.

2. The display panel according to claim 1, characterized in that: The anti-rust layer includes an azole compound, and the electrode terminal is fixedly connected to the anti-rust layer through van der Waals force.

3. The display panel according to claim 2, characterized in that: The azole compound includes at least one of diazole, triazole and tetrazole.

4. The display panel according to claim 3, characterized in that: The diazole includes at least one of imidazole and pyrazole, the triazole includes at least one of 3-amino-1,2,3-triazole, 3-amino-1,2,4-triazole, 4-amino-1,2,3-triazole, and 4-amino-1,2,4-triazole, and the tetrazole includes at least one of 5-methyltetrazole and 5-aminotetrazole.

5. The display panel according to claim 1, characterized in that: The etching solution composition comprises the following components by mass fraction: The decomposer is 1% to 4%, the chelating agent is 0.5% to 1%, the corrosion protection agent is 0.05% to 0.3%, the surfactant is 0.005% to 0.15%, and the balance is water.

6. The display panel according to claim 1, characterized in that: The pH value of the etching solution composition is 5 to 8.

7. A method for manufacturing a display panel, manufacturing the display panel according to any one of claims 1 to 6, characterized in that: include: Providing a driving backplane, the driving backplane comprising a driving layer and electrode terminals arranged on the driving layer; Treating the surface of the electrode terminal with an etching liquid composition to form an anti-rust layer on the surface of the electrode terminal; A plurality of light-emitting chips are provided, and the plurality of light-emitting chips are welded on the surface of the electrode terminal.

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