Module and device for direct interconnection of microwave coaxial signals between microstrip boards

Abstract

The application provides a module and device for directly interconnecting microwave coaxial signals between microstrip boards, which is used for connecting two adjacent microstrip boards, and comprises: an insulator connecting block provided with a mounting through hole; and a radio frequency insulator fixedly arranged in the mounting through hole and provided with a signal pin along a direction perpendicular to the radio frequency insulator, both ends of the signal pin being arranged outside the radio frequency insulator and capable of being connected with the microstrip boards on both sides. The application realizes direct interconnection of microwave signals between printed boards, good grounding, good transmission performance of microwave signals between two microstrip boards, small size, machining and assembly by using ordinary technology, easy cost control and large-scale batch production.

Description

Technical Field

[0001] This invention relates to the field of radar technology, and specifically to a module and device for direct interconnection of microwave coaxial signals between microstrip boards. Background Technology

[0002] With the trend of miniaturization and integration of RF systems, in addition to the application of various integrated chips and micro-assembly technologies to make modules smaller and smaller, module interconnection is also becoming a bottleneck for miniaturization, and miniaturization design is needed while ensuring that performance is not reduced.

[0003] Traditional inter-module microwave signal interconnection uses coaxial cables or blind-plug connectors. Coaxial cable interconnection occupies the most space, and while blind-plug coaxial connectors are much smaller, the coaxial signal still has to pass through three structures ("socket-plug-socket"), leading to increased manufacturing and blind-plug errors. Repeated insertion and removal further exacerbate these errors, negatively impacting microwave performance, especially standing wave ratios and losses. Newer connectors, such as snap-fit ​​connectors, are small and perform well, but are mainly used in micro-assembly and vertical interconnection applications, and require specific machining precision and assembly methods. Summary of the Invention

[0004] In view of this, the present invention provides a module and device for direct interconnection of microwave coaxial signals between microstrip boards, so as to achieve the purpose of direct interconnection of microwave signals between printed circuit boards.

[0005] This specification provides the following technical solution through its embodiments: a module for direct interconnection of microwave coaxial signals between microstrip boards, used to connect two adjacent microstrip boards. The module includes: an insulator connecting block with mounting through holes; and a radio frequency insulator fixedly disposed within the mounting through holes, with signal pins passing through it in a direction perpendicular to the radio frequency insulator. Both ends of the signal pins are located on the outside of the radio frequency insulator and can be connected to the microstrip boards located on both sides.

[0006] Furthermore, both ends of the signal pin are connected to the front surfaces of two adjacent microstrip boards.

[0007] Furthermore, the other end of the insulator connecting block is placed on the opposite side of two adjacent microstrip plates, and the other end of the insulator connecting block is fixedly connected to the opposite side.

[0008] Furthermore, the other end of the insulator connecting block is connected to the reverse side by welding or conductive adhesive, and the conductive adhesive or solder used for welding can fill the gap between the insulator connecting block and the two adjacent microstrip boards.

[0009] Furthermore, the module for direct interconnection of microwave coaxial signals between microstrip boards also includes components, with insulator connecting blocks fixedly connected to the components.

[0010] Furthermore, solder paste is applied between the component and the insulator connecting block, between the insulator connecting block and the radio frequency insulator, between the radio frequency insulator and the signal pin, and between the signal pin and the connected microstrip board, and all are formed in one step by reflow soldering.

[0011] Furthermore, the thickness of the insulator connecting block is the same as the thickness of the radio frequency insulator.

[0012] Furthermore, the gap between the insulator connecting block and the two adjacent microstrip plates is less than 0.1 mm.

[0013] The present invention also provides an apparatus comprising a module for direct interconnection of microwave coaxial signals between microstrip boards, wherein the module for direct interconnection of microwave coaxial signals between microstrip boards is the aforementioned module for direct interconnection of microwave coaxial signals between microstrip boards.

[0014] Compared with the prior art, the beneficial effects that can be achieved by the above-mentioned at least one technical solution adopted in the embodiments of this specification include: realizing direct interconnection of microwave signals between printed circuit boards, while ensuring good grounding, achieving good transmission performance of microwave signals between two microstrip boards, while achieving small size, machining and assembly using ordinary processes, easy cost control, and easy large-scale mass production.

[0015] This invention is small in size and has a high frequency of application, increasing the design flexibility and scalability of microstrip board modules, and is suitable for miniaturized internal interconnection design of complex functional modules. Attached Figure Description

[0016] To more clearly illustrate the technical solutions of the embodiments of this application, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0017] Figure 1 This is a frontal three-dimensional structural schematic diagram of an embodiment of the present invention;

[0018] Figure 2 This is a schematic diagram of the reverse three-dimensional structure of an embodiment of the present invention;

[0019] Figure 3 This is a frontal three-dimensional cross-sectional view of an embodiment of the present invention.

[0020] The reference numerals in the figure are as follows: 1. Insulator connecting block; 2. Radio frequency insulator; 21. Signal pin; 3. Component; 41. First microstrip board; 411. First connection area; 42. Second microstrip board; 421. Second connection area. Detailed Implementation

[0021] The embodiments of this application will now be described in detail with reference to the accompanying drawings.

[0022] It should be noted that, unless otherwise specified, the embodiments and features described in this application can be combined with each other. The present invention will now be described in detail with reference to the accompanying drawings and embodiments.

[0023] like Figures 1 to 3 As shown, this embodiment of the invention provides a module for direct microwave coaxial signal interconnection between microstrip boards, used to connect two adjacent microstrip boards. The module includes an insulator connecting block 1 and a radio frequency insulator 2. The insulator connecting block 1 is provided with a mounting through hole; the radio frequency insulator 2 is fixedly disposed in the mounting through hole, and a signal pin 21 is provided along a direction perpendicular to the radio frequency insulator 2. Both ends of the signal pin 21 are located on the outside of the radio frequency insulator 2 and can be connected to the microstrip boards located on both sides.

[0024] By connecting the signal pins 21 on both sides of the radio frequency insulator 2 to the microstrip boards placed on both sides, a large module with a complex function can be broken down into several functional microstrip board components for separate design and assembly, and then assembled. Alternatively, readily available functional microstrip board components can be directly borrowed. This reduces the overall workload, cost, and difficulty, improves the reusability of functional microstrip board components, and expands the functionality of the overall large module.

[0025] It should be noted that the thickness of the insulator connecting block 1 in this embodiment of the invention is the same as the thickness of the radio frequency insulator 2. Furthermore, the gap between the insulator connecting block 1 and the two adjacent microstrip boards is less than 0.1 mm. The radio frequency insulator 2 is a 50Ω radio frequency insulator.

[0026] In this embodiment, a first microstrip board 41 and a second microstrip board 42 are provided on both sides. Both the front sides of the first microstrip board 41 and the second microstrip board 42 are provided with 50Ω lines for interconnection. Both ends of the signal pin 21 are connected to the front sides of the two adjacent microstrip boards and to the corresponding 50Ω lines (which can be soldered). The final input points (approximately 4-5 mm in length) of the 50Ω lines for interconnection on the front sides of the first microstrip board 41 and the second microstrip board 42 need to be gold-plated but not coated with a solder mask.

[0027] Preferably, the other end of the insulator connecting block 1 is placed on the reverse side of two adjacent microstrip boards, and the other end of the insulator connecting block 1 is fixedly connected to the reverse side. The back side of the first microstrip board 41 is provided with a first connection area 411, and the back side of the second microstrip board 42 is provided with a second connection area 421. The other end of the insulator connecting block 1 is connected to the first connection area 411 and the second connection area 421 by welding or conductive adhesive. The conductive adhesive or the solder used for welding can fill the gap between the insulator connecting block 1 and the two adjacent microstrip boards to ensure good grounding.

[0028] The first connection area 411 and the second connection area 421 need to be gold-plated and not coated with solder mask, and the gold-plated area needs to extend to the outermost edge of the corresponding first microstrip board 41 and second microstrip board 42.

[0029] Preferably, the module for direct interconnection of microwave coaxial signals between microstrip boards further includes component 3, and the insulator connecting block 1 is fixedly connected to component 3.

[0030] The outer shells of the radio frequency insulator 2 and the insulator connecting block 1 are gold-plated, and the parts of the component 3 that come into contact with the first microstrip board 41, the second microstrip board 42, the radio frequency insulator 2 and the insulator connecting block 1 are gold-plated.

[0031] In this embodiment of the invention, solder paste is applied between component 3 and insulator connecting block 1, between insulator connecting block 1 and radio frequency insulator 2, between radio frequency insulator 2 and signal pin 21, and between signal pin 21 and connected microstrip board, and all are formed in one step by reflow soldering.

[0032] The present invention also provides an apparatus comprising a module for direct interconnection of microwave coaxial signals between microstrip boards, wherein the module for direct interconnection of microwave coaxial signals between microstrip boards is the aforementioned module for direct interconnection of microwave coaxial signals between microstrip boards.

[0033] The beneficial effects of the embodiments of the present invention are as follows:

[0034] (1) High frequency: The normal operating frequency range of the 50Ω RF insulator itself covers DC-40GHz. With the matching design of the microstrip board input and output ports, broadband signal matching transmission between two microstrip boards in the Ku band and below can be realized.

[0035] (2) Small size and thin thickness (the thickness of the insulator connecting block, that is, the distance between the two microstrip boards, depends only on the length of the radio frequency insulator body, usually 1.6 to 4 mm), much smaller than the blind plug form of the "socket-plug-socket" connector (taking SMP as an example, the "socket-plug-socket" requires a thickness of about 11 mm), and the weight is also greatly reduced.

[0036] (3) A large module with a complex function can be broken down into several functional microstrip board components for design and assembly, and then assembled. Alternatively, readily available functional microstrip board components can be directly borrowed. This reduces the overall workload, cost and difficulty, increases the reusability of functional microstrip board components and expands the overall functionality of the large module.

[0037] (4) The two microstrip boards only need to have their upper surfaces flush and their 50Ω lines aligned. There are no other fundamental requirements for the microstrip boards themselves. Therefore, this interconnection structure is particularly suitable for interconnecting two microstrip boards or multilayer boards that must use different thicknesses, different media, and different stack-up structures, which increases the flexibility of the design.

[0038] (5) This invention only requires ordinary machining precision and normal reflow soldering process. The cost is easy to control and it is easy to mass-produce.

[0039] (6) The invention can be widely applied in microwave circuit design, including communication systems, radar systems, electronic warfare systems and other fields.

[0040] The above description is merely a specific embodiment of the present invention and should not be construed as limiting the scope of the invention. Therefore, any substitution of equivalent components or equivalent changes and modifications made within the scope of protection of this patent should still fall within the scope of this patent. Furthermore, the technical features, technical features and technical solutions, and technical solutions in this invention can be freely combined and used.

Claims

1. A module for direct interconnection of microwave coaxial signals between microstrip boards, used to connect two adjacent microstrip boards, characterized in that, Modules for direct interconnection of microwave coaxial signals between microstrip boards include: Insulator connecting block (1) is provided with mounting through holes; The radio frequency insulator (2) is fixedly installed in the mounting through hole, and a signal pin (21) is inserted in a direction perpendicular to the radio frequency insulator (2). Both ends of the signal pin (21) are placed on the outside of the radio frequency insulator (2) and can be connected to the microstrip plates located on both sides. The radio frequency insulator is a 50Ω radio frequency insulator; the normal operating frequency range of the 50Ω radio frequency insulator covers DC-40GHz; Both ends of the signal pin (21) are connected to the front side of two adjacent microstrip boards and connected to the 50Ω line on the front side of the corresponding microstrip board. The thickness of the insulator connecting block (1) is the same as the thickness of the radio frequency insulator (2), and the gap between the insulator connecting block (1) and the two adjacent microstrip boards is less than 0.1 mm.

2. The module for direct interconnection of microwave coaxial signals between microstrip boards according to claim 1, characterized in that, The other end of the insulator connecting block (1) is placed on the opposite side of two adjacent microstrip plates, and the other end of the insulator connecting block (1) is fixedly connected to the opposite side.

3. The module for direct interconnection of microwave coaxial signals between microstrip boards according to claim 2, characterized in that, The other end of the insulator connecting block (1) is connected to the reverse side by welding or conductive adhesive, and the conductive adhesive or solder used for welding can fill the gap between the insulator connecting block (1) and the two adjacent microstrip boards.

4. The module for direct interconnection of microwave coaxial signals between microstrip boards according to claim 3, characterized in that, The module for direct interconnection of microwave coaxial signals between microstrip boards also includes component (3), and insulator connecting block (1) is fixedly connected to component (3).

5. The module for direct interconnection of microwave coaxial signals between microstrip boards according to claim 4, characterized in that, Solder paste is applied between component (3) and insulator connecting block (1), between insulator connecting block (1) and radio frequency insulator (2), between radio frequency insulator (2) and signal pin (21), and between signal pin (21) and connected microstrip board, and all are formed in one step by reflow soldering.

6. A device comprising a module for direct interconnection of microwave coaxial signals between microstrip boards, characterized in that, The module for direct interconnection of microwave coaxial signals between microstrip boards is the module for direct interconnection of microwave coaxial signals between microstrip boards as described in any one of claims 1 to 5.

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