Display substrate, display substrate motherboard cutting method and device

Abstract

The present disclosure relates to a display substrate, a cutting method and device of a display substrate mother board, to reduce cutting stress and prevent the cutting edge from appearing edge collapse phenomenon. The cutting method of the display substrate comprises: heating a to-be-cut part on the display substrate to a specified temperature to obtain a heated display substrate; the display substrate is a rigid substrate; the inside of the to-be-cut part comprises micro-cracks; the heated display substrate is cooled, and the temperature of the parts on both sides of the to-be-cut part of the cooled display substrate is different, so that the inside of the to-be-cut part forms thermal stress, the micro-cracks expand under the action of the thermal stress, the display substrate is broken at the to-be-cut part, and the cutting of the display substrate is realized. The technical scheme of the present disclosure can reduce the cutting stress and prevent the cutting edge from appearing edge collapse phenomenon.

Description

TECHNICAL FIELD

[0001] The present disclosure relates to the technical field of display, and in particular, to a display substrate, a cutting method and device of a display substrate mother board. BACKGROUND

[0002] In the related art, for a display substrate mother board using a rigid substrate, a cutter wheel is mostly used to cut the rigid substrate to cut the display substrate mother board into a plurality of display substrates. This cutting scheme has excellent mass production performance and large yield. However, as the use time of the cutter wheel increases, the edge of the cutter wheel is abraded, which causes cutting defects such as feathering, micro-cracks and the like, resulting in a decrease in the strength of the display substrate. In addition, since the rigid substrate is very sensitive to tensile stress, the micro-cracks on the surface of the rigid substrate are very easy to cause defect propagation and edge collapse phenomenon under the tensile stress, resulting in display failure. SUMMARY

[0003] To overcome the problems in the related art, the embodiments of the present disclosure provide a display substrate, a cutting method and device of a display substrate mother board, to reduce the cutting stress and prevent the edge collapse phenomenon from occurring in the cutting edge.

[0004] According to a first aspect of the embodiments of the present disclosure, a cutting method of a display substrate is provided, comprising:

[0005] heating a to-be-cut part on the display substrate to a specified temperature to obtain a heated display substrate; the display substrate is a rigid substrate; an inside of the to-be-cut part includes micro-cracks;

[0006] cooling the heated display substrate, and making the temperature of the parts on both sides of the to-be-cut part in the cooled display substrate different, so as to form thermal stress in the inside of the to-be-cut part, the micro-cracks are expanded under the action of the thermal stress, the display substrate is broken at the to-be-cut part, and the cutting of the display substrate is realized.

[0007] In an embodiment, before the heating of the to-be-cut part on the display substrate to the specified temperature to obtain the heated display substrate, the method further comprises:

[0008] placing a heating coil on the to-be-cut part;

[0009] The heating of the to-be-cut part on the display substrate to the specified temperature to obtain the heated display substrate comprises:

[0010] energizing the heating coil to make the heating coil generate heat to heat the to-be-cut part, until the to-be-cut part is heated to the specified temperature.

[0011] In one embodiment, the heating coil comprises a metal core and a cladding layer, the material of the cladding layer is a heat-conducting insulating material, and the material of the display substrate is glass.

[0012] In one embodiment, the material of the metal core is copper, copper-nickel alloy or silver.

[0013] The material of the cladding layer is phenolic plastic or silicone rubber.

[0014] In one embodiment, the display substrate comprises a first support portion and a second support portion, and the first support portion and the second support portion are located on both sides of the to-be-cut portion.

[0015] Before heating the to-be-cut portion on the display substrate to a specified temperature, the method further comprises:

[0016] The display substrate is placed on a carrier substrate, the carrier substrate is provided with spacers, a first type of liquid and a second type of liquid arranged in a first direction and a second direction, the spacers are soaked in the first type of liquid and the second type of liquid, the spacers, the first type of liquid and the second type of liquid are located between the carrier substrate and the display substrate, the first type of liquid and the second type of liquid are immiscible, and the thermal conductivity of the first type of liquid is different from that of the second type of liquid.

[0017] The first type of liquid is controlled to be in contact with the first support portion, the second type of liquid is controlled to be in contact with the second support portion, the projection of the first type of liquid on the carrier substrate is located within the projection of the first support portion on the carrier substrate, the projection of the second type of liquid on the carrier substrate is located within the projection of the second support portion on the carrier substrate, and the projection of the to-be-cut portion on the carrier substrate is located at the intersection of the projection of the first type of liquid on the carrier substrate and the projection of the second type of liquid on the carrier substrate.

[0018] In one embodiment, the display substrate is cooled after being heated, and the temperature of the portions of the cooled display substrate located on both sides of the to-be-cut portion are different, so that thermal stress is formed inside the to-be-cut portion, and the method comprises:

[0019] The first type of liquid absorbs heat from the first support portion and conducts the absorbed heat away, so that the temperature of the first support portion is reduced to a first temperature; the second type of liquid absorbs heat from the second support portion and conducts the absorbed heat away, so that the temperature of the second support portion is reduced to a second temperature; and the second temperature is different from the first temperature, so that thermal stress is formed inside the to-be-cut portion.

[0020] In one embodiment, the material of the first type of liquid is deionized water or sodium fatty acid, and the material of the second type of liquid is phenylalanine or polyacrylic acid.

[0021] In one embodiment, a projected area of ​​the first type of liquid on the carrier substrate is larger than a projected area of ​​the second type of liquid on the carrier substrate, and the second type of liquid surrounds at least a portion of the first type of liquid.

[0022] In one embodiment, the first type of liquid does not carry an electric charge, and the second type of liquid carries an electric charge;

[0023] The controlling the first type of liquid to contact the first supporting portion and the second type of liquid to contact the second supporting portion includes:

[0024] applying an electric field to the second supporting portion in a direction perpendicular to the surface of the display substrate facing the carrier substrate; the electric field is used to attract the charges;

[0025] Under the action of the electric field, the second type of liquid gathers in the space where the electric field exists and contacts the second support part, and the first type of liquid gathers in the space where the electric field does not exist and contacts the first support part.

[0026] In one embodiment, the first type of liquid carries a negative charge, and the second type of liquid carries a positive charge;

[0027] The controlling the first type of liquid to contact the first supporting portion and the second type of liquid to contact the second supporting portion includes:

[0028] In a direction perpendicular to the surface of the display substrate facing the carrier substrate, a first electric field is applied to the first supporting portion, and a second electric field is applied to the second supporting portion; the first electric field is used to attract the negative charges, and the second electric field is used to attract the positive charges;

[0029] Under the action of the first electric field, the first type of liquid gathers in the space where the first electric field is located and contacts the first support part. Under the action of the second electric field, the second type of liquid gathers in the space where the second electric field is located and contacts the second support part.

[0030] In one embodiment, the spacer is cylindrical, the diameter of the spacer is 1 mm to 7 mm, and the height of the spacer is 0.3 mm to 0.5 mm;

[0031] The spacing between the spacers in the first direction is the same as the spacing between the spacers in the second direction;

[0032] The spacing between the spacers in the first direction is 10 mm to 40 mm, and the spacing between the spacers in the second direction is 10 mm to 40 mm.

[0033] In one embodiment, an annular dam is provided on the carrier substrate, the height of the annular dam is the same as the height of the spacer, and the first type of liquid and the second type of liquid are located in the annular dam.

[0034] According to a second aspect of an embodiment of the present disclosure, a method for cutting a display substrate motherboard is provided. The display substrate motherboard includes a display base and at least one light-emitting device. The display base includes at least one portion to be cut arranged in an array and at least one device portion arranged in an array. At least one portion to be cut corresponds to at least one device portion, and each portion to be cut surrounds a corresponding device portion. The light-emitting device is disposed on the device portion.

[0035] The display substrate is cut using the above method.

[0036] According to a third aspect of an embodiment of the present disclosure, there is provided a display substrate cutting device, comprising:

[0037] A heating assembly is configured to heat the portion to be cut on the display substrate to a specified temperature to obtain a heated display substrate; the display substrate is a rigid substrate; the interior of the portion to be cut includes microcracks;

[0038] The cooling assembly is configured to cool the heated display substrate and make the temperatures of the portions of the cooled display substrate located on both sides of the portion to be cut different, so that thermal stress is formed inside the portion to be cut. The microcracks expand under the action of the thermal stress, and the display substrate breaks at the portion to be cut, thereby achieving cutting of the display substrate.

[0039] In one embodiment, the heating assembly includes a heating coil, which is configured to be placed on the portion to be cut and generate heat to heat the portion to be cut when powered on, until the portion to be cut is heated to the designated temperature.

[0040] In one embodiment, the display substrate includes a first supporting portion and a second supporting portion, wherein the first supporting portion and the second supporting portion are located on both sides of the portion to be cut;

[0041] The cooling assembly includes a carrier substrate, a first type of liquid, a second type of liquid, and a control assembly. Spacers arranged in an array along a first direction and a second direction are provided on the carrier substrate. The first type of liquid and the second type of liquid are located on the carrier substrate, and the spacers are immersed in the first type of liquid and the second type of liquid.

[0042] Before the portion to be cut is heated to a specified temperature, the display substrate is placed on the carrier substrate, and the spacer, the first type of liquid, and the second type of liquid are located between the carrier substrate and the display substrate;

[0043] The control component is configured to control the first type of liquid to contact the first supporting part and the second type of liquid to contact the second supporting part before the part to be cut is heated to a specified temperature, so that after the part to be cut is heated to the specified temperature, the first type of liquid absorbs heat from the first supporting part and conducts the absorbed heat, so that the temperature of the first supporting part is reduced to a first temperature, and the second type of liquid absorbs heat from the second supporting part and conducts the absorbed heat, so that the temperature of the second supporting part is reduced to a second temperature, and the second temperature is different from the first temperature, so that thermal stress is formed inside the part to be cut, wherein the projection of the first type of liquid on the carrier substrate is located within the projection of the first supporting part on the carrier substrate, the projection of the second type of liquid on the carrier substrate is located within the projection of the second supporting part on the carrier substrate, and the projection of the part to be cut on the carrier substrate is located at the intersection of the projection of the first type of liquid on the carrier substrate and the projection of the second type of liquid on the carrier substrate.

[0044] According to a fourth aspect of the embodiments of the present disclosure, a device for cutting a display substrate motherboard is provided. The display substrate motherboard includes a display base and at least one light-emitting device. The display base includes at least one portion to be cut arranged in an array and at least one device portion arranged in an array. At least one portion to be cut corresponds to at least one device portion, and each portion to be cut surrounds a corresponding device portion. The light-emitting device is disposed on the device portion.

[0045] The display substrate motherboard cutting device includes:

[0046] A heating assembly is configured to heat the portion to be cut on the display substrate to a specified temperature to obtain a heated display substrate; the display substrate is a rigid substrate; and the interior of the portion to be cut includes microcracks;

[0047] The cooling assembly is configured to cool the heated display substrate and make the temperatures of the portions of the cooled display substrate located on both sides of the portion to be cut different, so that thermal stress is formed inside the portion to be cut. The microcracks expand under the action of the thermal stress, and the display substrate breaks at the portion to be cut, thereby achieving cutting of the display substrate.

[0048] According to a fifth aspect of an embodiment of the present disclosure, a display substrate cutting device is provided, comprising a processor and a memory; the memory is used to store a computer program; the processor is used to execute the computer program stored on the memory to implement the method described in the first aspect above.

[0049] According to a sixth aspect of an embodiment of the present disclosure, a computer-readable storage medium is provided, wherein a computer program is stored in the computer-readable storage medium, and when the computer program is executed by a processor, the method described in the first aspect is implemented.

[0050] According to the seventh aspect of the embodiment of the present disclosure, a cutting device for a display substrate motherboard is provided, comprising a processor and a memory; the memory is used to store a computer program; the processor is used to execute the computer program stored on the memory to implement the method described in the second aspect above.

[0051] According to an eighth aspect of an embodiment of the present disclosure, a computer-readable storage medium is provided, wherein a computer program is stored in the computer-readable storage medium, and when the computer program is executed by a processor, the method described in the second aspect is implemented.

[0052] The technical solution provided by the embodiments of the present disclosure may include the following beneficial effects: by heating the portion to be cut on the display substrate to a specified temperature, a heated display substrate is obtained, wherein the interior of the portion to be cut includes microcracks; then, the heated display substrate is cooled, and the temperatures of the portions of the cooled display substrate located on both sides of the portion to be cut are made different, thereby forming thermal stress inside the portion to be cut, and the microcracks inside the portion to be cut expand under the action of the thermal stress, causing the display substrate to break at the portion to be cut, thereby achieving cutting of the display substrate. Compared with using a cutter wheel to cut the display substrate, the cutting stress is reduced, and the edge chipping phenomenon of the cutting edge can be prevented. Moreover, no debris or chipping will be generated, and the process is clean and efficient.

[0053] It is to be understood that the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the disclosure. BRIEF DESCRIPTION OF THE DRAWINGS

[0054] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present disclosure and, together with the description, serve to explain the principles of the present disclosure.

[0055] Figure 1 The figure is a flow chart showing a method for cutting a display substrate according to an exemplary embodiment.

[0056] Figure 2 The figure is a schematic diagram of an application scenario of a method for cutting a display substrate according to an exemplary embodiment.

[0057] Figure 3 is a flow chart showing a method for cutting a display substrate according to another exemplary embodiment.

[0058] Figures 4 to 6 FIG. 4 is a schematic diagram showing cutting a display substrate according to an exemplary embodiment.

[0059] Figure 7 FIG. 1 is a schematic structural diagram of a display substrate motherboard according to an exemplary embodiment.

[0060] Figure 8 is a structural block diagram of a display substrate cutting device according to an exemplary embodiment.

[0061] Figure 9 FIG. 1 is a schematic structural diagram of a device for cutting a display substrate according to an exemplary embodiment.

[0062] Figure 10 The figure is a schematic structural diagram of a device for cutting a display substrate motherboard according to an exemplary embodiment. DETAILED DESCRIPTION

[0063] Exemplary embodiments will be described in detail herein, with examples illustrated in the accompanying drawings. In the following description, when referring to the drawings, identical numerals in different figures represent identical or similar elements, unless otherwise indicated. The embodiments described in the following exemplary embodiments are not intended to represent all possible embodiments consistent with the present disclosure. Rather, they are merely examples of apparatus and methods consistent with certain aspects of the present disclosure, as detailed in the appended claims.

[0064] Figure 1 FIG. 1 is a flow chart of a method for cutting a display substrate according to an exemplary embodiment. Figure 1 As shown, the display substrate cutting method includes the following steps S101-S102:

[0065] In step S101 , a portion to be cut on a display substrate is heated to a specified temperature to obtain a heated display substrate; the display substrate is a rigid substrate; and the interior of the portion to be cut includes microcracks.

[0066] In one embodiment, the material of the display substrate is glass. The display substrate is a part of the display panel. In addition to the display substrate, the display panel may also include other devices, and the display substrate is used to carry other devices. In an exemplary embodiment, the display panel is an OLED (Organic Electroluminescence Display) display panel, which, in addition to the display substrate, may also include a drive circuit layer and a light-emitting layer, and the display substrate is used to carry the drive circuit layer and the light-emitting layer, and the drive circuit layer is located between the display substrate and the light-emitting layer. In another exemplary embodiment, the display panel is a liquid crystal (LCD) display panel, which, in addition to the display substrate, may also include a drive circuit layer and a liquid crystal layer, and the display substrate is used to carry the drive circuit layer and the liquid crystal layer, and the drive circuit layer is located between the display substrate and the liquid crystal layer.

[0067] In one embodiment, when the display substrate needs to be cut, the portion to be cut on the display substrate can be heated to a specified temperature to obtain a heated display substrate. Figure 2 As shown, when preparing the display panel 21, a plurality of display panels 21 are usually prepared on the same display substrate 22. Then, the display substrate 22 is cut to obtain a plurality of separate display panels 21. When cutting the display substrate 22, the portion to be cut (not shown) on the display substrate 22 can be heated to a specified temperature to obtain a heated display substrate.

[0068] In step S102, the heated display substrate is cooled, and the temperatures of the portions of the cooled display substrate located on both sides of the portion to be cut are made different, so that thermal stress is formed inside the portion to be cut. Microcracks expand under the action of the thermal stress, and the display substrate breaks at the portion to be cut, thereby achieving cutting of the display substrate.

[0069] In one embodiment, the heated display substrate can be cooled, and the temperatures of the portions of the cooled display substrate located on both sides of the portion to be cut are made different, so that thermal stress is formed inside the portion to be cut. Microcracks inside the portion to be cut expand under the action of the thermal stress, and the display substrate can be broken at the portion to be cut, thereby achieving cutting of the display substrate.

[0070] In this embodiment, the portion to be cut on the display substrate is heated to a specified temperature to obtain a heated display substrate, wherein the interior of the portion to be cut includes microcracks. The heated display substrate is then cooled, and the temperatures of the portions of the cooled display substrate on either side of the portion to be cut are different. This causes thermal stress to form within the portion to be cut. The microcracks within the portion to be cut propagate under the action of the thermal stress, causing the display substrate to fracture at the portion to be cut, thereby achieving cutting of the display substrate. Compared to cutting the display substrate with a cutter wheel, this method reduces cutting stress and prevents chipping of the cut edge. Furthermore, it does not produce debris or chips, and is clean and efficient.

[0071] Figure 3 FIG. 1 is a flow chart of a method for cutting a display substrate according to another exemplary embodiment. In this embodiment, the method for cutting a display substrate includes the following steps S301 to S305:

[0072] In step S301, a display substrate is placed on a carrier substrate, the display substrate includes a first supporting portion and a second supporting portion, the first supporting portion and the second supporting portion are located on both sides of the portion to be cut, and spacers, a first type of liquid, and a second type of liquid are arranged in an array along a first direction and a second direction on the carrier substrate. The spacers are immersed in the first type of liquid and the second type of liquid. The spacers, the first type of liquid, and the second type of liquid are located between the carrier substrate and the display substrate, the first type of liquid and the second type of liquid are immiscible with each other, and the thermal conductivity of the first type of liquid is different from that of the second type of liquid.

[0073] In one embodiment, Figure 4 As shown, the display substrate 22 may include a first supporting portion 221, a second supporting portion 222 and a portion to be cut 223. The first supporting portion 221 and the second supporting portion 222 are located on both sides of the portion to be cut 223. The first supporting portion 221 may be a portion for supporting other components in the display panel, and the second supporting portion 222 may be a portion that needs to be removed. A spacer 42, a first type of liquid 43 and a second type of liquid 44 are provided on the supporting substrate 41, and the spacer 42 is soaked in the first type of liquid 43 and the second type of liquid 44. The first type of liquid 43 and the second type of liquid 44 are immiscible with each other, and the thermal conductivity of the first type of liquid 43 is different from that of the second type of liquid 44. After the display substrate 22 is placed on the supporting substrate 41, the spacer 42, the first type of liquid 43 and the second type of liquid 44 are located between the supporting substrate 41 and the display substrate 22.

[0074] In one embodiment, the spacer 42 may be cylindrical, but is not limited thereto.

[0075] In one embodiment, the diameter of the spacer 42 is 1 mm to 7 mm. For example, the diameter of the spacer 42 is 1 mm, 3 mm, 5 mm, or 7 mm.

[0076] In one embodiment, the height of the spacer 42 is 0.3 mm to 0.5 mm. For example, the height of the spacer 42 is 0.3 mm, 0.4 mm, or 0.5 mm.

[0077] In one embodiment, a circular dam may be provided on the carrier substrate 41. The height of the circular dam is the same as that of the spacer 42. The first type of liquid 43 and the second type of liquid 44 are located in the circular dam. The circular dam and the carrier substrate 41 form a container for containing the first type of liquid 43 and the second type of liquid 44.

[0078] In one embodiment, Figure 5 As shown, a plurality of spacers 42 are disposed on a carrier substrate 41 , and the spacers 42 are arranged in an array along a first direction X and a second direction Y. The spacers 42 are immersed in a first liquid 43 and a second liquid 44 .

[0079] In one embodiment, the spacing between the spacers 42 in the first direction X is the same as the spacing between the spacers 42 in the second direction Y. The spacing between the spacers 42 in the first direction X is 10 mm to 40 mm. For example, the spacing between the spacers 42 in the first direction X is 10 mm, 20 mm, 30 mm, or 40 mm. The spacing between the spacers 42 in the second direction Y is 10 mm, 20 mm, 30 mm, or 40 mm.

[0080] In one embodiment, Figure 5 As shown, the second type of liquid 44 surrounds the first type of liquid 43. In other embodiments, the second type of liquid 44 can surround a portion of the first type of liquid 43.

[0081] In one embodiment, the projected area of ​​the first type of liquid 43 on the carrier substrate 41 may be larger than the projected area of ​​the second type of liquid 44 on the carrier substrate 41 , but the present invention is not limited thereto.

[0082] In step S302, the first type of liquid is controlled to contact the first supporting part, and the second type of liquid is controlled to contact the second supporting part. The projection of the first type of liquid on the carrier substrate is located within the projection of the first supporting part on the carrier substrate, the projection of the second type of liquid on the carrier substrate is located within the projection of the second supporting part on the carrier substrate, and the projection of the part to be cut on the carrier substrate is located at the intersection of the projection of the first type of liquid on the carrier substrate and the projection of the second type of liquid on the carrier substrate.

[0083] In one embodiment, the first type of liquid does not carry an electric charge, and the second type of liquid carries an electric charge. The method of controlling the first type of liquid to contact the first support portion and the second type of liquid to contact the second support portion is as follows: Figure 4As shown, an electric field E is applied to the second support portion 222 in a direction Z perpendicular to the surface of the display base 22 facing the carrier substrate 41. The electric field E is used to attract the charges carried by the second type of liquid 44. Under the action of the electric field E, the second type of liquid 44 gathers in the space where the electric field E is located and contacts the second support portion 222. The first type of liquid 43 gathers in the space where the electric field E is not present and contacts the first support portion 221.

[0084] like Figure 4 As shown, the projection of the first type of liquid 43 on the carrier substrate 41 is located within the projection of the first supporting portion 221 on the carrier substrate 41, the projection of the second type of liquid 44 on the carrier substrate 41 is located within the projection of the second supporting portion 222 on the carrier substrate 41, and the projection of the portion to be cut 223 on the carrier substrate 41 is located at the intersection of the projection of the first type of liquid 43 on the carrier substrate 41 and the projection of the second type of liquid 44 on the carrier substrate 41.

[0085] In one exemplary embodiment, the first type of liquid 43 carries no charge, while the second type of liquid 44 carries a positive charge. The first type of liquid 43 is made of deionized water, while the second type of liquid 44 is made of an organic substance, such as phenylalanine. A negative electrode may be provided on the carrier substrate 41, with the projection of the negative electrode on the carrier substrate 41 located within the projection of the second support portion 222 on the carrier substrate 41. The aforementioned electric field E is applied via the negative electrode, with the direction of the electric field E being from the display substrate 22 toward the carrier substrate 41.

[0086] In other embodiments, the first type of liquid 43 may carry a negative charge, and the second type of liquid 44 may carry a positive charge. The material of the first type of liquid 43 may be sodium fatty acid, and the material of the second type of liquid 44 may be polyacrylic acid. The method for controlling the contact between the first type of liquid 43 and the first support portion 221 and the second type of liquid 44 and the second support portion 222 is as follows: a first electric field is applied to the first support portion 221 and a second electric field is applied to the second support portion 222 in a direction Z perpendicular to the surface of the display substrate 22 facing the carrier substrate 41. The first electric field is used to attract the negative charge carried by the first type of liquid 43, and the second electric field is used to attract the positive charge carried by the second type of liquid 44. Under the action of the first electric field, the first type of liquid 43 gathers in the space where the first electric field is located and contacts the first support portion 221. Under the action of the second electric field, the second type of liquid 44 gathers in the space where the second electric field is located and contacts the second support portion 222. The method of applying the first electric field to the first support portion 221 and the method of applying the second electric field to the second support portion 222 are similar to the method of applying the electric field E to the second support portion 222 , and are not described in detail here.

[0087] In step S303, a heating coil is placed on the portion to be cut.

[0088] In one embodiment, Figure 4As shown in FIG. 4, the heating coil 45 is placed on the to-be-cut portion 223.

[0089] In one embodiment, as shown in FIG. 5, the heating coil 45 comprises a metal core 451 and a cladding layer 452, and the material of the cladding layer 452 is a heat-conducting insulating material. Figure 4

[0090] In one embodiment, the material of the metal core is copper. In other embodiments, the material of the metal core can be copper-nickel alloy or silver.

[0091] In one embodiment, the material of the cladding layer is phenolic plastic. In other embodiments, the material of the cladding layer is silicone rubber.

[0092] In one embodiment, as shown in FIG. 6, when the display substrate 22 needs to be cut into a special shape, the heating coil 45 can be placed on the to-be-cut portion 223 in the manner shown in FIG. 6. Figure 6 Figure 6

[0093] In step S304, the heating coil is powered on to generate heat to heat the to-be-cut portion until the to-be-cut portion is heated to a specified temperature, and a heated display substrate is obtained.

[0094] In one embodiment, during the heating of the to-be-cut portion 223, a temperature sensor can be used to detect the temperature of the to-be-cut portion 223, and when the temperature of the to-be-cut portion 223 reaches the specified temperature, a temperature controller can be used to cut off the power supply and prohibit the heating coil 45 from being powered on.

[0095] It should be noted that heating the to-be-cut portion 223 to the specified temperature means heating the surface of the to-be-cut portion 223 facing the heating coil 45 to the specified temperature.

[0096] In one embodiment, the specified temperature is 350-400°C. For example, the specified temperature is 350°C, 380°C or 400°C.

[0097] In step S305, the heated display substrate is cooled, and the temperatures of the portions of the cooled display substrate located on both sides of the to-be-cut portion are different, so that the internal heat stress of the to-be-cut portion is formed, the micro-cracks are expanded under the action of the heat stress, the display substrate is broken at the to-be-cut portion, and the cutting of the display substrate is realized.

[0098] ​​​In one embodiment, the first type of liquid 43 absorbs heat from the first support portion 221 and conducts the absorbed heat away, lowering the temperature of the first support portion 221 to a first temperature. The second type of liquid 44 absorbs heat from the second support portion 222 and conducts the absorbed heat away, lowering the temperature of the second support portion 222 to a second temperature. Because the thermal conductivity of the first type of liquid 43 differs from that of the second type of liquid 44, the second temperature differs from the first temperature, thereby causing thermal stress within the portion to be cut 223. For example, if the thermal conductivity of the first type of liquid 43 is greater than that of the second type of liquid 44, the first type of liquid 43 conducts heat faster than the second type of liquid 44. After the same cooling period, the second temperature is greater than the first temperature.

[0099] After thermal stress forms within the portion to be cut 223, microcracks within the portion to be cut 223 expand under the action of the thermal stress, causing the display substrate 22 to fracture at the portion to be cut 223, thereby completing the cutting of the display substrate 22. Compared to cutting the display substrate 22 with a cutter wheel, this reduces cutting stress and prevents chipping of the cut edge. Furthermore, it avoids chipping and chipping, achieving a clean and efficient process.

[0100] Another exemplary embodiment of the present disclosure provides a method for cutting a display substrate motherboard. In this embodiment, Figure 7 As shown, the display substrate motherboard 200 may include a display base 22 and at least one light-emitting device (not shown), the display base 22 includes at least one portion to be cut (not shown) arranged in an array and at least one device portion 23 arranged in an array, at least one portion to be cut corresponds to at least one device portion 23, and each portion to be cut surrounds the corresponding device portion 23; the device portion 23 is used to set the light-emitting device.

[0101] In this embodiment, the display substrate 22 can be cut using the above-mentioned display substrate cutting method to obtain at least one display panel. Each display panel includes a device portion 23 on which the light-emitting device is disposed.

[0102] Figure 8 FIG. 1 is a schematic structural diagram of a display substrate cutting device according to an exemplary embodiment. Figure 8 As shown, the cutting device for display substrate comprises:

[0103] The heating assembly 81 is configured to heat the portion to be cut on the display substrate to a specified temperature to obtain a heated display substrate; the display substrate is a rigid substrate; and the interior of the portion to be cut includes microcracks.

[0104] The cooling assembly 82 is configured to cool the heated display substrate and make the temperatures of the portions of the cooled display substrate located on both sides of the portion to be cut different, so that thermal stress is formed inside the portion to be cut. The microcracks expand under the action of the thermal stress, and the display substrate breaks at the portion to be cut, thereby achieving cutting of the display substrate.

[0105] In one embodiment, Figure 4 As shown, the heating assembly 81 includes a heating coil 45 , which is configured to be placed on the portion to be cut and generate heat to heat the portion to be cut when powered on, until the portion to be cut is heated to the specified temperature.

[0106] In one embodiment, Figure 4 As shown, the display substrate 22 includes a first supporting portion 221 and a second supporting portion 222 . The first supporting portion 221 and the second supporting portion 222 are located on both sides of the to-be-cut portion 223 .

[0107] like Figure 4 and Figure 5 As shown, the cooling component 82 includes a carrier substrate 41, a first type of liquid 43, a second type of liquid 44 and a control component (not shown). The carrier substrate 41 is provided with spacers 42 arranged in an array along a first direction X and a second direction Y. The first type of liquid 43 and the second type of liquid 44 are located on the carrier substrate 41, and the spacers 42 are immersed in the first type of liquid 43 and the second type of liquid 44.

[0108] Before the portion to be cut 223 is heated to a specified temperature, the display substrate 22 is placed on the carrier substrate 41 , and the spacers 42 , the first liquid 43 , and the second liquid 44 are located between the carrier substrate 41 and the display substrate 22 .

[0109] The control component is configured to control the first type of liquid 43 to contact the first support part 221 and the second type of liquid 44 to contact the second support part 222 before heating the portion to be cut 223 to a specified temperature, so that after the portion to be cut 223 is heated to a specified temperature, the first type of liquid 43 absorbs heat from the first support part 221 and conducts the absorbed heat away, so that the temperature of the first support part 221 is reduced to the first temperature, and the second type of liquid 44 absorbs heat from the second support part 222 and conducts the absorbed heat away, so that the temperature of the second support part 222 is reduced to the first temperature. The temperature is lowered to a second temperature, which is different from the first temperature, so that thermal stress is formed inside the portion to be cut 223, wherein the projection of the first type of liquid 43 on the carrier substrate 41 is located within the projection of the first supporting portion 221 on the carrier substrate 41, the projection of the second type of liquid 44 on the carrier substrate 41 is located within the projection of the second supporting portion 222 on the carrier substrate 41, and the projection of the portion to be cut 223 on the carrier substrate 41 is located at the intersection of the projection of the first type of liquid 43 on the carrier substrate 41 and the projection of the second type of liquid 44 on the carrier substrate 41.

[0110] Another exemplary embodiment of the present disclosure provides a cutting device for a display substrate motherboard. Figure 7 As shown, the display substrate motherboard 200 includes a display base 22 and at least one light-emitting device (not shown), the display base 22 includes at least one portion to be cut arranged in an array and at least one device portion 23 arranged in an array, at least one portion to be cut corresponds to at least one device portion 23, and each portion to be cut surrounds the corresponding device portion 23; the device portion 23 is used to set the light-emitting device.

[0111] Similar to the display substrate cutting device, the display substrate motherboard cutting device includes:

[0112] The heating assembly 81 is configured to heat the portion to be cut on the display substrate to a specified temperature to obtain a heated display substrate; the display substrate is a rigid substrate; the interior of the portion to be cut includes microcracks;

[0113] The cooling assembly 82 is configured to cool the heated display substrate and make the temperatures of the portions of the cooled display substrate located on both sides of the portion to be cut different, so that thermal stress is formed inside the portion to be cut. The microcracks expand under the action of the thermal stress, and the display substrate breaks at the portion to be cut, thereby achieving cutting of the display substrate.

[0114] Regarding the apparatus in the above embodiment, the specific manner in which the processor performs operations has been described in detail in the embodiment of the method, and will not be elaborated on here.

[0115] Figure 9 is a block diagram illustrating an apparatus for cutting a display substrate according to an exemplary embodiment. For example, apparatus 900 includes a processing component 902, which further includes one or more processors 920, and memory resources represented by memory 904 for storing instructions, such as an application, executable by processing component 902. The application stored in memory 904 may include one or more modules, each corresponding to a set of instructions. Furthermore, processing component 902 is configured to execute the instructions to perform the above-described method for cutting a display substrate.

[0116] In an exemplary embodiment, a non-transitory computer-readable storage medium including instructions is also provided, such as a memory 904 including instructions. The instructions can be executed by the processing component 902 of the apparatus 900 to perform the above-described method for cutting a display substrate. For example, the non-transitory computer-readable storage medium can be a ROM, a random access memory (RAM), a CD-ROM, a magnetic tape, a floppy disk, an optical data storage device, and the like.

[0117] Figure 10 This is a block diagram illustrating an apparatus for cutting display substrate motherboards according to an exemplary embodiment. For example, apparatus 1000 includes a processing component 1002, which further includes one or more processors 1020, and memory resources represented by memory 1004 for storing instructions, such as applications, executable by processing component 1002. The applications stored in memory 1004 may include one or more modules, each corresponding to a set of instructions. Furthermore, processing component 1002 is configured to execute the instructions to perform the aforementioned method for cutting display substrate motherboards.

[0118] In an exemplary embodiment, a non-transitory computer-readable storage medium including instructions is also provided, such as a memory 1004 including instructions. The instructions can be executed by the processing component 1002 of the apparatus 1000 to implement the above-mentioned method for cutting a display substrate motherboard. For example, the non-transitory computer-readable storage medium can be a ROM, a random access memory (RAM), a CD-ROM, a magnetic tape, a floppy disk, an optical data storage device, etc.

[0119] Other embodiments of the present disclosure will readily occur to those skilled in the art after considering the specification and practicing the disclosure herein. This disclosure is intended to cover any variations, uses, or adaptations of the present disclosure that follow the general principles of the present disclosure and include common knowledge or customary techniques in the art not disclosed herein. The description and examples are to be considered as exemplary only, with the true scope and spirit of the present disclosure being indicated by the following claims.

[0120] It should be understood that the present disclosure is not limited to the exact structures that have been described above and shown in the drawings, and that various modifications and changes can be made without departing from the scope thereof. The scope of the present disclosure is limited only by the appended claims.

Claims

1. A method for cutting a display substrate, characterized in that: include: placing a display substrate on a carrier substrate; A first type of liquid and a second type of liquid are arranged in an array along a first direction and a second direction on the carrier substrate. The display substrate includes a portion to be cut, and a first supporting portion and a second supporting portion located on both sides of the portion to be cut. The first type of liquid and the second type of liquid are located between the carrier substrate and the display substrate. The first type of liquid and the second type of liquid are mutually immiscible, and the thermal conductivity of the first type of liquid is different from the thermal conductivity of the second type of liquid. The first type of liquid is controlled to contact the first supporting portion, and the second type of liquid is controlled to contact the second supporting portion. heating the portion to be cut on the display substrate to a specified temperature to obtain a heated display substrate; The display substrate is a rigid substrate; the interior of the portion to be cut includes microcracks; The heated display substrate is cooled, and the temperatures of the first supporting portion and the second supporting portion of the cooled display substrate are made different, so that thermal stress is formed inside the portion to be cut. The microcracks expand under the action of the thermal stress, and the display substrate breaks at the portion to be cut, thereby achieving cutting of the display substrate.

2. The method according to claim 1, characterized in that Before heating the portion to be cut on the display substrate to a specified temperature to obtain the heated display substrate, the method further comprises: placing a heating coil on the portion to be cut; The method of heating the portion to be cut on the display substrate to a specified temperature to obtain a heated display substrate comprises: The heating coil is energized to generate heat to heat the portion to be cut until the portion to be cut is heated to the specified temperature.

3. The method according to claim 2, characterized in that The heating coil includes a metal core and a cladding layer. The cladding layer is made of a heat-conducting insulating material. The display substrate is made of glass.

4. The method according to claim 3, characterized in that The metal core is made of copper, copper-nickel alloy or silver.

5. The method according to claim 1, wherein The display substrate is placed on the carrier substrate, further comprising: The carrier substrate is provided with spacers arranged in an array along a first direction and a second direction, the spacers are immersed in the first type of liquid and the second type of liquid, and the spacers are located between the carrier substrate and the display base; The projection of the first type of liquid on the carrier substrate is located within the projection of the first supporting part on the carrier substrate, the projection of the second type of liquid on the carrier substrate is located within the projection of the second supporting part on the carrier substrate, and the projection of the part to be cut on the carrier substrate is located at the intersection of the projection of the first type of liquid on the carrier substrate and the projection of the second type of liquid on the carrier substrate.

6. The method according to claim 1, characterized in that The step of cooling the heated display substrate and making the temperatures of the first supporting portion and the second supporting portion of the cooled display substrate different from each other, thereby forming thermal stress inside the portion to be cut, comprises: The first type of liquid absorbs heat from the first supporting part and conducts the absorbed heat, so that the temperature of the first supporting part is reduced to a first temperature; the second type of liquid absorbs heat from the second supporting part and conducts the absorbed heat, so that the temperature of the second supporting part is reduced to a second temperature; the second temperature is different from the first temperature, so that thermal stress is formed inside the part to be cut.

7. The method according to claim 1, characterized in that The material of the first type of liquid is deionized water or sodium fatty acid, and the material of the second type of liquid is phenylalanine or polyacrylic acid.

8. The method according to claim 1, characterized in that A projected area of ​​the first type of liquid on the carrier substrate is larger than a projected area of ​​the second type of liquid on the carrier substrate, and the second type of liquid surrounds at least a portion of the first type of liquid.

9. The method according to claim 1, characterized in that The first type of liquid does not carry an electric charge, and the second type of liquid carries an electric charge; The controlling the first type of liquid to contact the first supporting portion and the second type of liquid to contact the second supporting portion includes: applying an electric field to the second supporting portion in a direction perpendicular to the surface of the display substrate facing the carrier substrate; the electric field is used to attract the charges; Under the action of the electric field, the second type of liquid gathers in the space where the electric field exists and contacts the second support part, and the first type of liquid gathers in the space where the electric field does not exist and contacts the first support part.

10. The method according to claim 1, characterized in that The first type of liquid carries a negative charge, and the second type of liquid carries a positive charge; The controlling the first type of liquid to contact the first supporting portion and the second type of liquid to contact the second supporting portion includes: In a direction perpendicular to the surface of the display substrate facing the carrier substrate, a first electric field is applied to the first supporting portion, and a second electric field is applied to the second supporting portion; the first electric field is used to attract the negative charges, and the second electric field is used to attract the positive charges; Under the action of the first electric field, the first type of liquid gathers in the space where the first electric field is located and contacts the first support part. Under the action of the second electric field, the second type of liquid gathers in the space where the second electric field is located and contacts the second support part.

11. The method according to claim 5, characterized in that The spacer is cylindrical, the diameter of the spacer is 1mm to 7mm, and the height of the spacer is 0.3mm to 0.5mm; The spacing between the spacers in the first direction is the same as the spacing between the spacers in the second direction; The spacing between the spacers in the first direction is 10 mm to 40 mm, and the spacing between the spacers in the second direction is 10 mm to 40 mm.

12. The method according to claim 5, characterized in that An annular dam is provided on the carrier substrate. The height of the annular dam is the same as that of the spacer. The first type of liquid and the second type of liquid are located in the annular dam.

13. A method for cutting a display substrate motherboard, characterized in that: The display substrate motherboard includes a display base and at least one light-emitting device, wherein the display base includes at least one portion to be cut arranged in an array and at least one device portion arranged in an array, wherein at least one portion to be cut corresponds to at least one device portion, and each portion to be cut surrounds the corresponding device portion; the light-emitting device is arranged on the device portion; The display substrate is cut using the method according to any one of claims 1 to 12.

14. A cutting device for a display substrate, characterized in that: include: A heating assembly is configured to heat the portion to be cut on the display substrate to a specified temperature to obtain a heated display substrate; The display substrate is a rigid substrate; The interior of the portion to be cut includes micro cracks; wherein the display substrate includes a first supporting portion and a second supporting portion, and the first supporting portion and the second supporting portion are located on both sides of the portion to be cut; A cooling assembly includes a carrier substrate, a first type of liquid, and a second type of liquid, wherein the first type of liquid and the second type of liquid are located on the carrier substrate; Before heating the portion to be cut to a specified temperature, the display substrate is placed on the carrier substrate, the first type of liquid and the second type of liquid are located between the carrier substrate and the display substrate, and the first type of liquid is in contact with the first supporting portion, and the second type of liquid is in contact with the second supporting portion; The cooling assembly is configured to cool the heated display substrate and make the temperatures of the first supporting portion and the second supporting portion located on both sides of the to-be-cut portion of the cooled display substrate different, so that thermal stress is formed inside the to-be-cut portion. The microcracks expand under the action of the thermal stress, and the display substrate breaks at the to-be-cut portion, thereby achieving cutting of the display substrate.

15. The device according to claim 14, characterized in that The heating assembly includes a heating coil configured to be placed on the portion to be cut and to generate heat to heat the portion to be cut when energized, until the portion to be cut is heated to the designated temperature.

16. The device according to claim 15, characterized in that The cooling assembly further includes a control assembly, and the carrier substrate is provided with spacers arranged in an array along a first direction and a second direction, and the spacers are immersed in the first type of liquid and the second type of liquid; The control component is configured to control the first type of liquid to contact the first supporting part and the second type of liquid to contact the second supporting part before the part to be cut is heated to a specified temperature, so that after the part to be cut is heated to the specified temperature, the first type of liquid absorbs heat from the first supporting part and conducts the absorbed heat, so that the temperature of the first supporting part is reduced to a first temperature, and the second type of liquid absorbs heat from the second supporting part and conducts the absorbed heat, so that the temperature of the second supporting part is reduced to a second temperature, and the second temperature is different from the first temperature, so that thermal stress is formed inside the part to be cut, wherein the projection of the first type of liquid on the carrier substrate is located within the projection of the first supporting part on the carrier substrate, the projection of the second type of liquid on the carrier substrate is located within the projection of the second supporting part on the carrier substrate, and the projection of the part to be cut on the carrier substrate is located at the intersection of the projection of the first type of liquid on the carrier substrate and the projection of the second type of liquid on the carrier substrate.

17. A display substrate motherboard cutting device, characterized in that: The display substrate motherboard includes a display base and at least one light emitting device, wherein the display base includes at least one portion to be cut arranged in an array and at least one device portion arranged in an array, at least one portion to be cut corresponds to at least one device portion, and each portion to be cut surrounds the corresponding device portion; The device portion is used to arrange the light-emitting device; The display substrate motherboard cutting device includes: The heating component is configured to heat the portion to be cut on the display substrate to a specified temperature to obtain a heated display substrate; the display substrate is a rigid substrate; the interior of the portion to be cut includes microcracks; wherein, The display substrate includes a first supporting portion and a second supporting portion, wherein the first supporting portion and the second supporting portion are located on both sides of the portion to be cut; A cooling assembly includes a carrier substrate, a first type of liquid, and a second type of liquid, wherein the first type of liquid and the second type of liquid are located on the carrier substrate; Before heating the portion to be cut to a specified temperature, the display substrate is placed on the carrier substrate, the first type of liquid and the second type of liquid are located between the carrier substrate and the display substrate, and the first type of liquid is in contact with the first supporting portion, and the second type of liquid is in contact with the second supporting portion; The cooling assembly is configured to cool the heated display substrate and make the temperatures of the first supporting portion and the second supporting portion located on both sides of the to-be-cut portion of the cooled display substrate different, so that thermal stress is formed inside the to-be-cut portion. The microcracks expand under the action of the thermal stress, and the display substrate breaks at the to-be-cut portion, thereby achieving cutting of the display substrate.

18. A cutting device for a display substrate, characterized in that: The method comprises a processor and a memory; the memory is used to store a computer program; the processor is used to execute the computer program stored in the memory to implement the method according to any one of claims 1 to 12.

19. A computer-readable storage medium, characterized in that The computer-readable storage medium stores a computer program, and when the computer program is executed by a processor, the method according to any one of claims 1 to 12 is implemented.

20. A display substrate motherboard cutting device, characterized in that: The system comprises a processor and a memory; the memory is used to store a computer program; the processor is used to execute the computer program stored in the memory to implement the method described in claim 13.

21. A computer-readable storage medium, characterized in that The computer-readable storage medium stores a computer program, and when the computer program is executed by a processor, the method according to claim 13 is implemented.

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