Wafer detection device and wafer detection method

Abstract

The present invention provides a wafer detection device and a wafer detection method, which relate to the field of wafer detection. A wafer detection device comprises an operating table, wherein the upper surface of the operating table is fixedly connected with a protective cover, the right side of the upper surface of the operating table is fixedly connected with a bracket, the front and rear sides of the left side of the upper surface of the operating table are fixedly connected with support plates, the right side surface of the support plate on the rear side is rotatably connected with two screws, the rod walls of the two screws are threadedly connected with a movable plate, and the lower surface of the movable plate on the upper side is fixedly connected with an air jet shell. The present invention sets an air jet shell and an air suction shell. When the wafer is being inspected, the air jet shell blows off the dust on the surface of the wafer, and the air suction shell then absorbs the blown dust, thereby preventing the dust from falling on the surface of the wafer or the operating table again to interfere with the detection results and keep the internal environment of the protective cover clean.

Description

Technical Field

[0001] The present invention relates to the field of wafer detection, and in particular to a wafer detection device and a wafer detection method. Background Art

[0002] Wafer refers to the silicon chip used to make silicon semiconductor circuits. Its original material is silicon. High-purity polycrystalline silicon is dissolved and doped with silicon crystal seeds, and then slowly pulled out to form cylindrical single crystal silicon. After grinding, polishing and slicing, the silicon crystal rod is formed into a silicon wafer, that is, a wafer. Domestic wafer production lines are mainly 8 inches and 12 inches. The main processing methods of wafers are sheet processing and batch processing, that is, processing one or more wafers at the same time. As the feature size of semiconductors becomes smaller and smaller, the processing and measurement equipment becomes more and more advanced, resulting in new data characteristics in wafer processing. At the same time, the reduction in feature size increases the impact of the number of particles in the air on the quality and reliability of the wafer after processing. As the cleanliness improves, the number of particles also shows new data characteristics.

[0003] Wafer testing is the process of probing each die on a chip. A probe made of gold wire as thin as a hair is installed on the inspection head to contact the contacts on the die to test its electrical properties. Unqualified die will be marked. Then, when the chip is cut into independent die, the marked unqualified die will be eliminated and will not proceed to the next process to avoid increasing manufacturing costs.

[0004] When the existing wafers are tested, the surface of the wafers is easily stained with dust, which can easily affect the test results. The existing cleaning method is to blow out the dust on the surface of the wafer through a nozzle, but when in use, the dust is easily dispersed in the air, so when the dust falls, the dust is still easy to fall back to the surface of the wafer, resulting in insufficient dust cleaning. Summary of the invention

[0005] 1. Technical issues to be resolved

[0006] In view of the deficiencies in the prior art, the present invention provides a wafer inspection device and a wafer inspection method, which solves the problem that during the inspection of the existing wafers, the surface of the wafer is easily stained with dust, which easily affects the inspection result; and the existing cleaning method blows out the dust on the surface of the wafer through a nozzle, but when in use, the dust is easily dispersed in the air, so when the dust falls, the dust is still easy to fall back to the surface of the wafer, resulting in the problem that the dust is not cleaned thoroughly enough.

[0007] (II) Technical solution

[0008] To achieve the above objectives, the present invention is implemented through the following technical solutions: a wafer inspection device, including an operating table, a protective cover is fixedly connected to the upper surface of the operating table, a bracket is fixedly connected to the right side of the upper surface of the operating table, support plates are fixedly connected to the front and rear sides of the left side of the upper surface of the operating table, two screw rods are rotatably connected to the right side surface of the support plate on the rear side, the rod walls of the two screw rods are threadedly connected to a moving plate, an air jet shell is fixedly connected to the lower surface of the upper moving plate, an air intake shell is fixedly connected to the lower surface of the lower moving plate, a plurality of air outlets are provided on the lower surface and left side surface of the air intake shell and the right side surface of the air jet shell, a first cavity is provided on the rear side of the right side surface of the bracket, and a driving mechanism is provided inside the first cavity.

[0009] Preferably, the driving mechanism includes two spur gears, the right ends of the two screw rods pass through the right side of the inner wall of the bracket to the inside of the first cavity, the right sides of the rod walls of the two screw rods are fixedly connected to the inner wall of the spur gears, the right side surface of the bracket is fixedly connected to a driving motor, the output end of the driving motor passes through the right side surface of the bracket to the inside of the first cavity, the output end of the driving motor is fixedly connected to the right end of the lower screw rod, the rear surfaces of the two spur gears are jointly meshed and connected with a transmission gear, the left and right sides of the inner wall of the first cavity are provided with first grooves, and moving blocks are provided inside the two first grooves, and the opposite side surfaces of the two moving blocks are jointly rotatably connected with a support rod, and the rod wall of the support rod is fixedly connected to the inner wall of the transmission gear.

[0010] Furthermore, the front and rear sides of the inner wall of the first groove on the right side are connected to a screw rod for rotation together, the front surface of the movable block on the right side is provided with a threaded opening, the inner wall of the threaded opening is threadedly connected to the rod wall of the screw rod, and the right side surface of the operating table is located in front of the first cavity. A second cavity is provided, and a motor is fixedly connected to the inner wall of the second cavity, and the output end of the motor passes through the rear side of the inner wall of the second cavity to the interior of the first cavity, and the output end of the motor is fixedly connected to the front end of the screw rod.

[0011] Furthermore, a first sliding rod is fixedly connected to the front and rear sides of the inner wall of the first groove on the left side, a first circular opening is opened on the front surface of the moving block on the left side, and the inner wall of the first sliding rod is slidably connected to the inner wall of the first circular opening.

[0012] Furthermore, two second sliding rods are fixedly connected to the right side surface of the front support plate and the front of the right side of the inner wall of the bracket, and a second circular opening is opened on the front side of the left side surface of the two movable plates, and the inner walls of the two second circular openings are respectively slidably connected to the rod walls of the corresponding second sliding rods.

[0013] Furthermore, two electric slide rails are fixedly connected to the upper surface of the operating table, and the inner walls of the two electric slide rails are slidably connected to a moving table through electric sliders. A detection table is arranged above the moving table, and a clamping device is arranged on the upper surface of the detection table. A second groove is opened on the upper surface of the moving table, and a rotating device is arranged inside the second groove.

[0014] Furthermore, the rotating device includes a gear ring, the upper surface of the gear ring is fixedly connected to the lower surface of the detection platform, the gear ring is meshed with drive gears on all sides, and the lower surfaces of multiple drive gears are fixedly connected to transmission rods, a third cavity is opened around the movable platform, the lower ends of multiple transmission rods pass through the lower side of the inner wall of the second groove to the inside of the third cavity, the lower sides of multiple transmission rod walls are fixedly connected to sprockets, the surfaces of multiple sprockets are connected for rotation through a chain, a fourth cavity is opened on the left side surface of the movable platform, a servo motor is fixedly connected to the inner wall of the fourth cavity, the output end of the servo motor passes through the upper side of the inner wall of the fourth cavity to the inside of the third cavity, and the output end of the servo motor is fixedly connected to the lower end of the transmission rod on the left.

[0015] Furthermore, an annular sliding groove is provided on the lower side of the inner wall of the second groove, and the inner wall of the annular sliding groove is slidably connected to the lower surface of the gear ring through an annular sliding block.

[0016] Furthermore, an electric cylinder is fixedly connected to the upper side of the inner wall of the bracket, and a detection component is fixedly connected to the output end of the electric cylinder.

[0017] A wafer detection method, the specific operation steps are as follows:

[0018] S1. Connect an external power supply to the equipment that needs to be powered on in the device, place the wafer that needs to be tested on the test table, clamp it with a clamping device to keep it stable, start the motor to drive the screw to rotate, so that the moving block drives the transmission gear on the support rod to move, so that the transmission gear moves to a position that meshes with the two spur gears, and under the action of the first slide rod, the transmission gear remains stable while moving;

[0019] S2, start the driving motor to drive the lower spur gear to rotate, thereby driving the upper spur gear to move through the transmission of the transmission gear, so that the moving plates on the two screw rods respectively drive the air-injection shell and the air-intake shell to move, and under the action of the second sliding rod, ensure the stability of the two moving plates when moving, and connect the air-injection shell with the external fan, and connect the air-intake shell with the external air pump, so that when the air-injection shell and the air-intake shell move, the air-injection shell blows out impurities on the surface of the wafer, and the air-intake shell quickly absorbs the blown impurities;

[0020] S3. After cleaning, move both the jet shell and the air suction shell to a position close to the support plate, start the drive motor to drive the spur gear below to rotate, so that under the transmission of the transmission gear, the spur gear above is driven to rotate at the same time, so that the two screws move at the same time, driving the jet shell and the air suction shell to move. When the jet shell moves to the leftmost side, turn off the drive motor, start the motor, drive the transmission gear away from the two spur gears, so that under the rotation of the transmission gear, the air suction shell is driven to move to the leftmost side;

[0021] S4. Inspect the wafer, start the electric cylinder and the inspection component. Under the action of the electric cylinder, drive the inspection component close to the inspection position, and start the electric slide rail to drive the wafer to move under the inspection component. When the wafer is inspected, start the servo motor, drive the sprockets on all the transmission rods to rotate through the chain, thereby driving all the drive gears to rotate, and driving the gear ring on the inspection table to rotate, so as to fully inspect the wafer.

[0022] (III) Beneficial effects

[0023] The present invention provides a wafer detection device and a wafer detection method, which have the following beneficial effects:

[0024] 1. The present invention provides an air-injection shell and an air-intake shell. When the wafer is inspected, the air-injection shell blows off the dust on the surface of the wafer, and the air-intake shell then absorbs the blown-out dust, thereby preventing the dust from falling on the surface of the wafer or the operating table again to interfere with the inspection results, and keeping the internal environment of the protective cover clean.

[0025] 2. The present invention provides a spur gear and a transmission gear so that the air intake shell can be moved independently, so that the air containing impurities in the interior of the protective cover can be extracted through the air intake shell, thereby keeping the internal environment of the protective cover clean and making the detection result more accurate.

[0026] 3. The present invention provides an electric slide rail to facilitate the movement of the wafer, so that the detection component can perform a comprehensive detection during the detection, and under the action of the clamping device, the wafer is kept stable during the detection. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 It is a schematic diagram of the overall front side cross-sectional structure of the present invention;

[0028] Figure 2 For the present invention Figure 1 A schematic diagram of the enlarged structure of part A;

[0029] Figure 3 It is a schematic diagram of the cross-sectional structure of the upper side of the bracket of the present invention;

[0030] Figure 4 It is a schematic diagram of the overall rear side cross-sectional structure of the present invention;

[0031] Figure 5 For the present invention Figure 4 A schematic diagram of the enlarged structure of part B;

[0032] Figure 6 This is a schematic diagram of the three-dimensional structure of the operating table of the present invention;

[0033] Figure 7 It is a schematic diagram of the three-dimensional structure of the jet shell of the present invention;

[0034] Figure 8 It is a schematic diagram of the three-dimensional structure of the transmission gear of the present invention;

[0035] Among them, 1. operating table; 2. bracket; 3. support plate; 4. screw; 5. moving plate; 6. jet shell; 7. suction shell; 8. air outlet; 9. spur gear; 10. transmission gear; 11. moving block; 12. support rod; 13. screw; 14. motor; 15. first slide rod; 16. second slide rod; 17. electric slide rail; 18. moving table; 19. testing table; 20. driving motor; 21. clamping device; 22. gear ring; 23. driving gear; 24. transmission rod; 25. sprocket; 26. servo motor; 27. electric cylinder; 28. testing component; 29. ​​protective cover. DETAILED DESCRIPTION

[0036] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0037] Embodiment 1

[0038] like Figure 1-8As shown, an embodiment of the present invention provides a wafer inspection device, including an operating table 1, a protective cover 29 is fixedly connected to the upper surface of the operating table 1, a bracket 2 is fixedly connected to the right side of the upper surface of the operating table 1, a support plate 3 is fixedly connected to the front and rear sides of the left side of the upper surface of the operating table 1, two screw rods 4 are rotatably connected to the right side surface of the rear support plate 3, the rod walls of the two screw rods 4 are threadedly connected to a moving plate 5, the lower surface of the upper moving plate 5 is fixedly connected to an air injection shell 6, and the lower surface of the lower moving plate 5 is fixedly connected to a suction The air shell 7, the lower surface and the left surface of the air intake shell 7 and the right surface of the air jet shell 6 are all provided with a plurality of air vents 8, the rear side of the right surface of the bracket 2 is provided with a first cavity, and a driving mechanism is arranged inside the first cavity. By arranging the air jet shell 6 and the air intake shell 7, when the wafer is inspected, the air jet shell 6 blows off the dust on the surface of the wafer, and the air intake shell 7 then absorbs the blown dust, thereby preventing the dust from falling on the surface of the wafer or the operating table 1 again to interfere with the inspection result, and keeping the internal environment of the protective cover 29 clean.

[0039] Embodiment 2

[0040] like Figure 1 , Figure 2 Figure 3 and Figure 8 As shown, an embodiment of the present invention provides a wafer inspection device, which is further expanded according to the content of the specific embodiment 1:

[0041] Among them, the driving mechanism includes two spur gears 9, the right ends of the two screw rods 4 pass through the right side of the inner wall of the bracket 2 to the inside of the first cavity, the right sides of the rod walls of the two screw rods 4 are fixedly connected to the inner wall of the spur gear 9, the right side surface of the bracket 2 is fixedly connected with a driving motor 20, the output end of the driving motor 20 passes through the right side surface of the bracket 2 to the inside of the first cavity, the output end of the driving motor 20 is fixedly connected to the right end of the lower screw rod 4, the rear side surfaces of the two spur gears 9 are jointly meshed and connected with a transmission gear 10, the left and right sides of the inner wall of the first cavity are provided with first grooves, and the interiors of the two first grooves are provided with moving blocks 11, the opposite side surfaces of the two moving blocks 11 are jointly rotatably connected with a support rod 12, the rod wall of the support rod 12 is fixedly connected to the inner wall of the transmission gear 10, and by providing the spur gears 9 and the transmission gears 10, the air intake shell 7 can be moved independently The air containing impurities in the protective cover 29 can be extracted through the air suction shell 7 to keep the internal environment of the protective cover 29 clean, so that the detection result is more accurate. The front and rear sides of the inner wall of the first groove on the right side are connected to the screw 13 for rotation. The front surface of the moving block 11 on the right side is provided with a threaded opening, and the inner wall of the threaded opening is threadedly connected with the rod wall of the screw 13. The right side surface of the operating table 1 is located on the front side of the first cavity and a second cavity is provided. The inner wall of the second cavity is fixedly connected with a motor 14. The output end of the motor 14 passes through the rear side of the inner wall of the second cavity to the inside of the first cavity. The output end of the motor 14 is fixedly connected to the front end of the screw 13. Under the action of the screw 13, it is convenient to drive the transmission gear 10 to move, so that the transmission gear 10 can mesh with the spur gear 9, and the operation of the spur gear 9 below is transmitted to the spur gear 9 above.

[0042] Embodiment 3

[0043] like Figure 1 , Figure 2 , Figure 3 , Figure 4 and Figure 6 As shown, an embodiment of the present invention provides a wafer inspection device, which is further expanded according to the content of the specific embodiment 2:

[0044] Among them, the front and rear sides of the inner wall of the first groove on the left side are jointly fixedly connected with a first slide rod 15, the front surface of the moving block 11 on the left side is provided with a first circular opening, and the inner wall of the first slide rod 15 is slidably connected to the inner wall of the first circular opening. Under the action of the first slide rod 15, the transmission gear 10 can remain stable when moving, and the right side surface of the front support plate 3 and the front of the right side of the inner wall of the bracket 2 are jointly fixedly connected with two second slide rods 16, the front sides of the left side surfaces of the two moving plates 5 are provided with second circular openings, and the inner walls of the two second circular openings are respectively slidably connected to the rod walls of the corresponding second slide rods 16. Under the action of the second slide rod 16, the two moving plates 5 can remain stable when moving.

[0045] Embodiment 4

[0046] like Figure 1 , Figure 4 , Figure 5 and Figure 6 As shown, an embodiment of the present invention provides a wafer inspection device, which is further expanded according to the content of the specific embodiment 1:

[0047] Among them, two electric slide rails 17 are fixedly connected to the upper surface of the operating table 1, and the inner walls of the two electric slide rails 17 are slidably connected to a moving table 18 through electric sliders. A detection table 19 is arranged above the moving table 18, and a clamping device 21 is arranged on the upper surface of the detection table 19. A second groove is opened on the upper surface of the moving table 18, and a rotating device is arranged inside the second groove. The electric slide rails 17 are arranged to facilitate the movement of the wafer, so that the detection component 28 can be fully inspected during the inspection, and under the action of the clamping device 21, the wafer is kept stable during the inspection. The rotating device includes a gear ring 22, and the upper surface of the gear ring 22 is fixedly connected to the lower surface of the detection table 19. The four sides of the gear ring 22 are meshed with driving gears 23, and a plurality of driving gears are connected. The lower surface of the wheel 23 is fixedly connected with a transmission rod 24, and a third cavity is opened around the movable platform 18. The lower ends of multiple transmission rods 24 pass through the lower side of the inner wall of the second groove to the inside of the third cavity, and the lower sides of the rod walls of multiple transmission rods 24 are fixedly connected with sprockets 25. The surfaces of multiple sprockets 25 are connected for rotation by a chain. A fourth cavity is opened on the left surface of the movable platform 18, and a servo motor 26 is fixedly connected to the inner wall of the fourth cavity. The output end of the servo motor 26 passes through the upper side of the inner wall of the fourth cavity to the inside of the third cavity. The output end of the servo motor 26 is fixedly connected to the lower end of the transmission rod 24 on the left. Under the action of the transmission device, the detection platform 19 can be rotated, thereby driving the wafer to perform rotation detection, so that the detection component 28 can perform a comprehensive detection of the surface of the wafer.

[0048] Embodiment 5

[0049] like Figure 1 , Figure 4 , Figure 5 and Figure 6 As shown, an embodiment of the present invention provides a wafer inspection device, which is further expanded according to the content of the specific embodiment 4:

[0050] Among them, an annular slide groove is opened on the lower side of the inner wall of the second groove, and the inner wall of the annular slide groove is slidably connected to the lower surface of the gear ring 22 through an annular slider. Under the action of the annular slide groove, the detection platform 19 remains stable during rotation. An electric cylinder 27 is fixedly connected to the upper side of the inner wall of the bracket 2, and a detection component 28 is fixedly connected to the output end of the electric cylinder 27. Under the action of the electric cylinder 27, the detection component 28 is driven close to the wafer detection position.

[0051] Embodiment 6

[0052] like Figure 1-8 As shown, an embodiment of the present invention provides a wafer detection method, and the specific operation steps are as follows:

[0053] S1. Connect an external power supply to the equipment that needs to be powered on in the device, place the wafer to be tested on the test table 19, clamp it with the clamping device 21 to keep it stable, start the motor 14 to drive the screw 13 to rotate, so that the moving block 11 drives the transmission gear 10 on the support rod 12 to move, so that the transmission gear 10 moves to a position meshing with the two spur gears 9, and under the action of the first slide rod 15, the transmission gear 10 remains stable while moving;

[0054] S2, start the driving motor 20 to drive the lower spur gear 9 to rotate, thereby driving the upper spur gear 9 to move through the transmission of the transmission gear 10, so that the moving plates 5 on the two screw rods 4 respectively drive the air-injection shell 6 and the air-intake shell 7 to move, and under the action of the second sliding rod 16, ensure the stability of the two moving plates 5 when moving, and connect the air-injection shell 6 with the external fan, and connect the air-intake shell 7 with the external air pump, so that when the air-injection shell 6 and the air-intake shell 7 move, the air-injection shell 6 blows out impurities on the surface of the wafer, and the air-intake shell 7 quickly absorbs the blown impurities;

[0055] S3. After cleaning, move both the jet shell 6 and the suction shell 7 to a position close to the support plate 3, start the drive motor 20 to drive the lower spur gear 9 to rotate, so that under the transmission of the transmission gear 10, the upper spur gear 9 is driven to rotate at the same time, so that the two screw rods 4 move at the same time, driving the jet shell 6 and the suction shell 7 to move. When the jet shell 6 moves to the far left, turn off the drive motor 20, start the motor 14, drive the transmission gear 10 away from the two spur gears 9, so that under the rotation of the transmission gear 10, the suction shell 7 is driven to move to the far left;

[0056] S4. Inspect the wafer, start the electric cylinder 27 and the inspection component 28. Under the action of the electric cylinder 27, drive the inspection component 28 close to the inspection position, and start the electric slide 17 to drive the wafer to move below the inspection component 28. When the wafer is inspected, start the servo motor 26, and drive the sprockets 25 on all the transmission rods 24 to rotate through the chain, thereby driving all the driving gears 23 to rotate, and driving the gear ring 22 on the inspection table 19 to rotate, so as to fully inspect the wafer.

Claims

1. A wafer inspection device, comprising an operating table (1), characterized in that: The upper surface of the operating table (1) is fixedly connected to a protective cover (29); the right side of the upper surface of the operating table (1) is fixedly connected to a bracket (2); the front and rear sides of the left side of the upper surface of the operating table (1) are fixedly connected to support plates (3); the right side surface of the rear support plate (3) is rotatably connected to two screw rods (4); the rod walls of the two screw rods (4) are threadedly connected to a movable plate (5); the lower surface of the upper movable plate (5) is fixedly connected to an air-injection shell (6); the lower surface of the lower movable plate (5) is fixedly connected to an air-intake shell (7); the lower surface and left side surface of the air-intake shell (7) and the right side surface of the air-injection shell (6) are both provided with a plurality of air outlets (8); the rear side of the right side surface of the bracket (2) is provided with a first cavity; a driving mechanism is provided inside the first cavity; The driving mechanism comprises two spur gears (9), the right ends of the two screw rods (4) both penetrate the right side of the inner wall of the bracket (2) to the inside of the first cavity, the right sides of the rod walls of the two screw rods (4) are fixedly connected to the inner wall of the spur gear (9), the right side surface of the bracket (2) is fixedly connected to a driving motor (20), the output end of the driving motor (20) penetrates the right side surface of the bracket (2) to the inside of the first cavity, the output end of the driving motor (20) is fixedly connected to the right end of the lower screw rod (4), the rear side surfaces of the two spur gears (9) are jointly meshed and connected with a transmission gear (10), the left and right sides of the inner wall of the first cavity are each provided with a first groove, the inside of the two first grooves are each provided with a moving block (11), the opposite side surfaces of the two moving blocks (11) are jointly rotatably connected with a support rod (12), and the rod wall of the support rod (12) is fixedly connected to the inner wall of the transmission gear (10); The front and rear sides of the inner wall of the first groove on the right side are connected to a screw rod (13) for rotation, the front side surface of the moving block (11) on the right side is provided with a threaded opening, the inner wall of the threaded opening is threadedly connected to the rod wall of the screw rod (13), the right side surface of the operating table (1) is provided with a second cavity located in front of the first cavity, the inner wall of the second cavity is fixedly connected to a motor (14), the output end of the motor (14) passes through the rear side of the inner wall of the second cavity to the inside of the first cavity, and the output end of the motor (14) is fixedly connected to the front end of the screw rod (13); A first sliding rod (15) is fixedly connected to the front and rear sides of the inner wall of the first groove on the left side, a first circular opening is provided on the front surface of the moving block (11) on the left side, and the inner wall of the first sliding rod (15) is slidably connected to the inner wall of the first circular opening; Two second sliding rods (16) are fixedly connected to the right side surface of the front support plate (3) and the front of the right side of the inner wall of the bracket (2); the front sides of the left side surfaces of the two movable plates (5) are each provided with a second circular opening, and the inner walls of the two second circular openings are respectively slidably connected to the rod walls of the corresponding second sliding rods (16); The upper surface of the operating table (1) is fixedly connected to two electric slide rails (17), the inner walls of the two electric slide rails (17) are slidably connected to a moving table (18) via an electric slider, a detection table (19) is arranged above the moving table (18), a clamping device (21) is arranged on the upper surface of the detection table (19), a second groove is opened on the upper surface of the moving table (18), and a rotating device is arranged inside the second groove; The rotating device comprises a gear ring (22), the upper surface of the gear ring (22) is fixedly connected to the lower surface of the detection platform (19), the gear ring (22) is meshedly connected with a driving gear (23) on all sides, the lower surfaces of the plurality of driving gears (23) are fixedly connected with a transmission rod (24), the movable platform (18) is provided with a third cavity on all sides, the lower ends of the plurality of transmission rods (24) pass through the lower side of the inner wall of the second groove to the inside of the third cavity, the lower sides of the rod walls of the plurality of transmission rods (24) are fixedly connected with a sprocket (25), the surfaces of the plurality of sprockets (25) are connected in rotation via a chain, the left side surface of the movable platform (18) is provided with a fourth cavity, the inner wall of the fourth cavity is fixedly connected with a servo motor (26), the output end of the servo motor (26) passes through the upper side of the inner wall of the fourth cavity to the inside of the third cavity, and the output end of the servo motor (26) is fixedly connected to the lower end of the left transmission rod (24); An annular sliding groove is provided on the lower side of the inner wall of the second groove, and the inner wall of the annular sliding groove is slidably connected to the lower surface of the gear ring (22) via an annular sliding block.

2. A wafer inspection device according to claim 1, characterized in that: An electric cylinder (27) is fixedly connected to the upper side of the inner wall of the bracket (2), and a detection component (28) is fixedly connected to the output end of the electric cylinder (27).

3. A detection method for a wafer detection device according to any one of claims 1-2, characterized in that: The specific steps are as follows: S1. Connect an external power supply to the equipment that needs to be powered on in the device, place the wafer that needs to be tested on the test table (19), clamp it with the clamping device (21) to keep it stable, start the motor (14) to drive the screw (13) to rotate, so that the moving block (11) drives the transmission gear (10) on the support rod (12) to move, so that the transmission gear (10) moves to a position where it meshes with the two spur gears (9), and under the action of the first sliding rod (15), the transmission gear (10) remains stable while moving; S2, starting the driving motor (20) to drive the spur gear (9) below to rotate, thereby driving the spur gear (9) above to move through the transmission of the transmission gear (10), so that the moving plates (5) on the two screw rods (4) respectively drive the jet shell (6) and the suction shell (7) to move, and under the action of the second sliding rod (16), the stability of the two moving plates (5) during movement is ensured, and the jet shell (6) is connected to an external fan, and the suction shell (7) is connected to an external air pump, so that when the jet shell (6) and the suction shell (7) move, the jet shell (6) blows out impurities on the surface of the wafer, and the suction shell (7) quickly absorbs the blown impurities; S3. After cleaning is completed, the air jet housing (6) and the air suction housing (7) are moved to a position close to the support plate (3), and the drive motor (20) is started to drive the spur gear (9) below to rotate, thereby driving the spur gear (9) above to rotate at the same time under the transmission of the transmission gear (10), so that the two screw rods (4) move at the same time, driving the air jet housing (6) and the air suction housing (7) to move. When the air jet housing (6) moves to the leftmost position, the drive motor (20) is turned off, and the motor (14) is started to drive the transmission gear (10) away from the two spur gears (9), thereby driving the air suction housing (7) to move to the leftmost position under the rotation of the transmission gear (10); S4, inspecting the wafer, starting the electric cylinder (27) and the inspection component (28), under the action of the electric cylinder (27), driving the inspection component (28) close to the inspection position, and starting the electric slide rail (17) to drive the wafer to move below the inspection component (28). When the wafer is inspected, starting the servo motor (26), driving the sprockets (25) on all the transmission rods (24) to rotate through the chain, thereby driving all the driving gears (23) to rotate, and driving the gear ring (22) on the inspection table (19) to rotate, so as to fully inspect the wafer.

Images