A reflow soldering oven air flow circulation assembly

Abstract

The application belongs to the technical field of reflow soldering, and discloses a reflow soldering furnace air flow circulating assembly, which comprises a reflow soldering equipment main body, one side of the top of the reflow soldering equipment main body is fixedly provided with an inlet sprocket driven device; the application is provided with a wind deflector, an air outlet hole and a concentrated guide plate, etc., so as to achieve the purpose of uniform heating of the PCB. The PCB is preheated through the air outlet groove and the air outlet hole, the temperature of the air discharged between the two air outlet bins gradually increases during the movement of the PCB, until the PCB moves to the middle part between the two air outlet bins, the air at the left and right ends of the air outlet bin is discharged through the middle part of the inner side of the two air outlet bins under the guidance of the concentrated guide plate, the soldering paste on the surface of the PCB is melted, the components and the PCB are connected, the heating of the PCB is more uniform, the PCB is gradually heated, the stability of the soldering paste is increased, and the effect of uniform heating of the PCB is achieved.

Description

Technical Field

[0001] This invention belongs to the field of reflow soldering technology, specifically a reflow oven airflow circulation component. Background Technology

[0002] Reflow soldering technology is mainly used in the field of electronics. It involves heating air or nitrogen to a sufficiently high temperature using internal heating circuitry, then blowing this gas onto a circuit board with components already mounted. This melts the solder on both sides of the components, causing them to bond to the motherboard. As SMT (Surface Mount Technology) technology has become increasingly sophisticated, with the emergence of various surface mount components (SMC) and surface mount devices (SMD), reflow soldering technology and equipment, as part of surface mount technology, have also developed accordingly, and their applications are becoming increasingly widespread.

[0003] Chinese patent CN200910035695.6 discloses an exhaust plate for a reflow oven. The problem this patent addresses is that current reflow ovens only have an exhaust plate at the top of the exhaust duct, primarily for guiding airflow. Hot air is sprayed onto the PCB board through the exhaust duct, bounces, and then circulates back to the top of the reflow oven via air channels on both sides. However, the airflow heating the PCB board inside the reflow oven includes both high-temperature air directly from the exhaust duct and lower-temperature air after the PCB board has been heated. This is not conducive to direct heating of the PCB board by high-temperature gas, and the airflow inside the reflow oven is also chaotic and unevenly distributed. This patent addresses this by adding an exhaust plate structure, making the exhaust plate a two-layer structure. Each exhaust duct and return air inlet forms a micro-circulation system, allowing for orderly airflow circulation and even distribution, ultimately achieving uniform heating.

[0004] The aforementioned reflow soldering airflow circulation components typically have multiple exhaust vents to ensure uniform airflow contact with the PCB board. However, existing reflow soldering airflow circulation components have circulation inlets around the multiple exhaust vents. Since the circulation inlets are connected to the exhaust vents, the airflow fails to make sufficient contact with the PCB board during the intake process and is sucked away by the circulation component. This results in insufficient airflow contact with the PCB board, reduced PCB board heating efficiency, increased heating time, and increased PCB board reflow soldering costs. Summary of the Invention

[0005] To address the problems mentioned in the background section, this invention provides a reflow oven airflow circulation assembly. The assembly uses a high-speed rotating impeller to draw air in from both the left and right ends of the reflow oven body. Guided by a baffle plate on the left end, the air is discharged through an exhaust duct and an exhaust port, heating the top and bottom of the PCB board. As the PCB board moves, the temperature of the air discharged between the two exhaust chambers gradually increases until the PCB board reaches the center between them. At this point, the solder paste on the PCB board surface melts, connecting the components to the PCB board and resulting in more uniform heating. This gradual heating also increases the stability of the solder paste, achieving the advantage of uniform PCB board heating.

[0006] To achieve the above objectives, the present invention provides the following technical solution: a reflow oven airflow circulation component, comprising a reflow oven body, an inlet sprocket driven device fixedly installed on one side of the top of the reflow oven body, a first windbreak curtain fixedly installed on the side of the top of the reflow oven body away from the inlet sprocket driven device, an airflow guiding component fixedly installed on the top inside the reflow oven body, a control host fixedly installed on the front of the reflow oven body, a connecting area fixedly installed on the side of the top of the reflow oven body away from the airflow guiding component, a cooling area fixedly installed on the side of the top of the reflow oven body away from the connecting area, a second windbreak curtain fixedly installed on the side of the top of the reflow oven body away from the cooling area, and an outlet active mechanism fixedly installed on the side of the top of the reflow oven body away from the second windbreak curtain.

[0007] The airflow guiding component includes an exhaust duct, an exhaust hole, a central guiding plate, a baffle plate, a diffuser plate, and an exhaust chamber. Baffle plates are fixedly installed at equal intervals at the bottom of the exhaust chamber. Exhaust ducts and exhaust holes are equally spaced on the bottom side of the exhaust chamber away from the baffle plates. A central guiding plate is fixedly installed at the center of the top of the exhaust chamber. A diffuser plate is fixedly installed at the bottom of the exhaust chamber. The exhaust duct, exhaust hole, and baffle plate are symmetrical about the longitudinal central axis of the exhaust chamber. A heating component and a power component are fixedly installed at the top of the exhaust chamber. A circulation component is fixedly installed on the front of the exhaust chamber. The airflow guiding component is symmetrically fixedly installed at the top and bottom of the main body of the reflow soldering equipment.

[0008] Preferably, the heating assembly includes a protective shell, a diversion chamber, a guide chamber, a heating plate, and a first guide plate. The protective shell is fixedly installed on the top of the exhaust chamber, the diversion chamber is fixedly installed on one side of the protective shell, the guide chamber is fixedly installed on one side of the diversion chamber, the first guide plate is fixedly installed inside the diversion chamber, and the heating plate is fixedly installed inside the protective shell. The heating assembly is symmetrical about the longitudinal central axis of the exhaust chamber.

[0009] Preferably, the power assembly includes a drive shaft, a motor, an air inlet, a solenoid valve, an impeller, and an oxygen detector. The motor is fixedly installed on the top of the exhaust chamber, the drive shaft is fixedly installed on the output end of the motor, the impeller is fixedly installed on the outside of the drive shaft, the air inlet is fixedly installed on the top of the protective shell, the solenoid valve is fixedly installed on the front of the air inlet, and the oxygen detector is fixedly installed on the front of the exhaust chamber. The power assembly is symmetrical about the longitudinal central plane of the exhaust chamber.

[0010] Preferably, the circulation assembly includes an air intake chamber, an air intake pipe, an expansion plate, and a second guide plate. Air intake chambers are fixedly installed at the left and right ends of the front of the exhaust chamber, and second guide plates are fixedly installed inside the air intake chambers. Air intake pipes are fixedly installed at the top of the air intake chambers, and expansion plates are fixedly installed at the bottom of the air intake chambers. The circulation assembly is symmetrical about the front and back of the horizontal central axis of the exhaust chamber.

[0011] Preferably, the height of the wind baffle gradually increases from the left and right ends toward the middle, the top of the wind baffle is arc-shaped, the left and right ends of the exhaust chamber are arc-shaped, and the arc direction of the wind baffle and the exhaust chamber is opposite.

[0012] Preferably, the exhaust trough and the exhaust hole are located on one side of the baffle plate, the size of the exhaust hole and the exhaust trough gradually decreases from the left and right ends to the middle, the left and right sides of the central guide plate are concave, the central guide plate is located in the middle of the top of the exhaust chamber, and the height of the central guide plate is greater than the height of the exhaust chamber.

[0013] Preferably, the guide chamber is connected to the left and right ends of the exhaust chamber, the guide chamber is connected to the diversion chamber, the diversion chamber is connected to the interior of the protective shell, and the heating plate has rectangular holes on its surface.

[0014] Preferably, one side of the air intake pipe is connected to the interior of the air intake chamber, and the other side of the air intake pipe is connected to the interior of the protective shell and is located away from the impeller.

[0015] Preferably, the impeller is located inside the protective shell, the impeller is turbine-shaped, and the impeller is located on one side of the heating plate.

[0016] Preferably, the height of the bottom of the air intake chamber is greater than the height of the bottom of the exhaust chamber, and the width of the second guide plate gradually increases from bottom to top.

[0017] Compared with the prior art, the beneficial effects of the present invention are as follows:

[0018] This invention achieves uniform heating of the PCB board by incorporating baffles, exhaust vents, and a centralized guide plate. High-speed impeller rotation draws air in from both the left and right ends of the reflow soldering equipment. The baffle on the left guides the air out through the exhaust duct and exhaust vent, heating the top and bottom of the PCB board. Because the size of the exhaust duct and exhaust vent gradually decreases from the left and right ends towards the center, the airflow at the bottom left and right ends of the reflow soldering equipment is less than the airflow in the center. When the PCB board enters the left end between the two exhaust chambers… First, the PCB board is preheated through the exhaust duct and exhaust hole. During the movement of the PCB board, the temperature of the air discharged between the two exhaust chambers will gradually increase until the PCB board moves to the middle between the two exhaust chambers. The air at the left and right ends of the exhaust chamber is guided by the central guide plate and discharged through the middle of the inner side of the two exhaust chambers. The solder paste on the surface of the PCB board will melt, connecting the components to the PCB board, making the PCB board more evenly heated. At the same time, the gradual heating of the PCB board increases the stability of the solder paste, so that the PCB board is evenly heated.

[0019] This invention achieves the purpose of furnace gas circulation by setting up air inlet chambers, second guide plates, and expansion plates. Air is discharged through the inner sides of two exhaust chambers to heat the top and bottom of the PCB board. The air enters the interior of the air inlet chambers at high speed due to the high-speed rotation of the impeller. Guided by the second guide plate, the air inside the main body of the reflow soldering equipment enters the air inlet chambers evenly. At the same time, the air enters the interior of the protective shell through the air inlet pipe to continue heating and circulating. The air inlet chambers are distributed on the front and rear sides of the exhaust chambers, so that the discharged air contacts the surface of the PCB board more evenly, thus achieving the effect of furnace gas circulation.

[0020] This invention achieves uniform heating of the furnace gas by incorporating an impeller, heating plate, and first guide plate. The main control unit activates the inlet sprocket driven device and motor, and starts the heating plate. The inlet sprocket driven device transports the PCB board into the interior of the reflow soldering equipment. The PCB board enters between two airflow guide components. At this time, two motors start, driving the drive shaft and impeller to rotate. During the high-speed rotation of the impeller, air is drawn from inside the reflow soldering equipment through two air inlet chambers. The air enters the protective shell and passes through the interior of the heating plate, where it is heated, carrying away the heat generated by the heating plate. Guided by the two first guide plates, the air is evenly distributed inside the two guide chambers and evenly enters the exhaust chamber, achieving uniform heating of the furnace gas. Attached Figure Description

[0021] Figure 1 This is a schematic diagram of the overall appearance of the present invention;

[0022] Figure 2 This is a cross-sectional schematic diagram of the wind direction guiding component of the present invention;

[0023] Figure 3 This is a schematic diagram of the wind direction guiding component of the present invention;

[0024] Figure 4 This is a partial cross-sectional schematic diagram of the wind direction guiding component of the present invention;

[0025] Figure 5 This is a top cross-sectional view of the wind direction guiding component of the present invention;

[0026] Figure 6 This is a front cross-sectional view of the wind direction guiding component of the present invention;

[0027] Figure 7 This is a top view of the entire invention;

[0028] Figure 8 This is a schematic diagram of one side of the appearance of the present invention;

[0029] Figure 9 This is a schematic diagram of the appearance of the other side of the present invention.

[0030] In the diagram: 1. Main body of reflow soldering equipment; 2. Inlet sprocket driven device; 3. First baffle box; 4. Control host; 5. Link area; 6. Power component; 601. Drive shaft; 602. Motor; 603. Air inlet; 604. Solenoid valve; 605. Impeller; 606. Oxygen detector; 7. Cooling area; 8. Second baffle box; 9. Outlet active mechanism; 10. Heating component; 101. Protective shell; 102. Diverter chamber; 103. Guide chamber; 104. Heating plate; 105. First guide plate; 11. Circulation component; 111. Air inlet chamber; 112. Air inlet pipe; 113. Expansion plate; 114. Second guide plate; 12. Air direction guiding component; 121. Exhaust duct; 122. Exhaust hole; 123. Centralized guide plate; 124. Baffle plate; 125. Diffuser plate; 126. Exhaust chamber. Detailed Implementation

[0031] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0032] like Figure 1-9 As shown, the present invention provides a reflow oven airflow circulation component, including a reflow oven body 1, an inlet sprocket driven device 2 fixedly installed on one side of the top of the reflow oven body 1, a first windbreak curtain box 3 fixedly installed on the side of the top of the reflow oven body 1 away from the inlet sprocket driven device 2, an airflow guiding component 12 fixedly installed on the top inside the reflow oven body 1, a control host 4 fixedly installed on the front of the reflow oven body 1, a connecting area 5 fixedly installed on the side of the top of the reflow oven body 1 away from the airflow guiding component 12, a cooling area 7 fixedly installed on the side of the top of the reflow oven body 1 away from the connecting area 5, a second windbreak curtain box 8 fixedly installed on the side of the top of the reflow oven body 1 away from the cooling area 7, and an outlet active mechanism 9 fixedly installed on the side of the top of the reflow oven body 1 away from the second windbreak curtain box 8.

[0033] The wind direction guiding component 12 includes an exhaust duct 121, an exhaust hole 122, a central guiding plate 123, a wind baffle 124, a diffuser 125, and an exhaust chamber 126. The wind baffle 124 is fixedly installed at equal intervals at the bottom inside the exhaust chamber 126. An exhaust duct 121 and an exhaust hole 122 are equally spaced on the bottom side of the exhaust chamber 126 away from the wind baffle 124. A central guiding plate 123 is fixedly installed in the middle of the top inside the exhaust chamber 126. A diffuser plate 125 is fixedly installed at the bottom of the exhaust chamber 126. The exhaust duct 121, exhaust hole 122, and baffle plate 124 are symmetrical about the longitudinal central axis of the exhaust chamber 126. A heating component 10 is fixedly installed at the top of the exhaust chamber 126. A power component 6 is fixedly installed at the top of the exhaust chamber 126. A circulation component 11 is fixedly installed at the front of the exhaust chamber 126. Wind direction guiding components 12 are symmetrically fixedly installed at the top and bottom of the reflow soldering equipment body 1.

[0034] Solder paste is applied to the corresponding positions on the PCB board, and the corresponding components are placed. The PCB board is then placed on top of the inlet sprocket driven device 2 for conveying. High-speed rotation of two impellers 605 draws air in, with air entering the interior of the reflow soldering equipment body 1 from both the left and right ends. The air guided by the left-side baffle 124 is discharged from the exhaust duct 121 and exhaust hole 122, heating the top and bottom of the PCB board. Because the size of the exhaust duct 121 and exhaust hole 122 gradually decreases from the left and right ends towards the center, the airflow at the bottom left and right ends of the reflow soldering equipment body 1 is less than the airflow in the center. The PCB board enters the two exhaust chambers... When the PCB board is at the left end between the two exhaust chambers 126, the air is first discharged through the exhaust duct 121 and exhaust hole 122 to preheat the PCB board. During the movement of the PCB board, the temperature of the air discharged between the two exhaust chambers 126 will gradually increase until the PCB board moves to the middle between the two exhaust chambers 126. The air at the left and right ends inside the exhaust chamber 126 is discharged through the middle of the inner side of the two exhaust chambers 126 under the guidance of the central guide plate 123, melting the solder paste on the surface of the PCB board, connecting the components to the PCB board, making the PCB board more evenly heated, and gradually heating the PCB board to increase the stability of the solder paste and make the PCB board evenly heated.

[0035] like Figure 2-6As shown, the heating assembly 10 includes a protective shell 101, a diversion chamber 102, a guide chamber 103, a heating plate 104, and a first guide plate 105. The protective shell 101 is fixedly installed on the top of the exhaust chamber 126. The diversion chamber 102 is fixedly installed on one side of the protective shell 101, and the guide chamber 103 is fixedly installed on one side of the diversion chamber 102. The first guide plate 105 is fixedly installed inside the diversion chamber 102, and the heating plate 104 is fixedly installed inside the protective shell 101. The heating assembly 10 is symmetrical about the longitudinal central plane of the exhaust chamber 126. (Power unit) Component 6 includes a drive shaft 601, a motor 602, an air inlet 603, a solenoid valve 604, an impeller 605, and an oxygen detector 606. The motor 602 is fixedly mounted on the top of the exhaust chamber 126. The drive shaft 601 is fixedly mounted on the output end of the motor 602. The impeller 605 is fixedly mounted on the outside of the drive shaft 601. The air inlet 603 is fixedly mounted on the top of the protective housing 101. The solenoid valve 604 is fixedly mounted on the front of the air inlet 603. The oxygen detector 606 is fixedly mounted on the front of the exhaust chamber 126. The power assembly 6 is connected to the exhaust chamber 126. 26. The longitudinal central axis is symmetrical. The control host 4 starts two motors 602 to drive the transmission shaft 601 and impeller 605 to rotate, drawing air from inside the reflow soldering equipment body 1 into the protective shell 101. The high-speed rotation of the impeller 605 causes the air to move rapidly, passing over the surface of the heating plate 104 and carrying away the heat from its surface. The air then enters the distribution chamber 102, where the first guide plate 105 distributes the air evenly into the guide chamber 103 and then evenly into the exhaust chamber 1. Inside the 26, air is evenly discharged through the exhaust duct 121 and exhaust hole 122, making the PCB board more evenly heated. During the heating process of the PCB board, the oxygen detector 606 monitors the oxygen content inside the reflow soldering equipment body 1 in real time. When the oxygen content inside the reflow soldering equipment body 1 is too low, the solenoid valve 604 automatically opens, and air is drawn from the outside into the reflow soldering equipment body 1 through the air inlet 603. When the oxygen content inside the reflow soldering equipment body 1 is higher than 50 PMM, the solenoid valve 604 will automatically close.

[0036] like Figure 3 , Figure 5-6As shown, the circulation assembly 11 includes an air intake chamber 111, an air intake pipe 112, an expansion plate 113, and a second guide plate 114. Air intake chambers 111 are fixedly installed at the left and right ends of the front of the exhaust chamber 126. The second guide plate 114 is fixedly installed inside each air intake chamber 111. An air intake pipe 112 is fixedly installed on the top of each air intake chamber 111, and an expansion plate 113 is fixedly installed at the bottom of each air intake chamber 111. The circulation assembly 11 is symmetrical about the horizontal central axis of the exhaust chamber 126. Air is exhausted through the bottom of the exhaust chamber 126 to heat and melt the solder paste on the top and bottom of the PCB board, thus bonding the components. Connected to the PCB board, the impeller 605 rotates at high speed and draws air from inside the reflow soldering equipment body 1 through the air inlet chamber 111. The air discharged into the reflow soldering equipment body 1 enters the air inlet chamber 111. At the same time, the second guide plate 114 guides the air inside the reflow soldering equipment body 1, so that the air inside the reflow soldering equipment body 1 enters the air inlet chamber 111 evenly, making the contact between the air discharged into the reflow soldering equipment body 1 and the PCB board more uniform. At the same time, the PCB board is heated more evenly. The air then enters the protective shell 101 through the air inlet pipe 112 for continued circulation and heating.

[0037] like Figure 2-6As shown, the height of the baffle plate 124 gradually increases from the left and right ends towards the middle. The top of the baffle plate 124 is arc-shaped. The left and right ends of the exhaust chamber 126 are arc-shaped. The arc directions of the baffle plate 124 and the exhaust chamber 126 are opposite. The exhaust trough 121 and the exhaust hole 122 are located on one side of the baffle plate 124. The size of the exhaust hole 122 and the exhaust trough 121 gradually decreases from the left and right ends towards the middle. The left and right sides of the central guide plate 123 are concave. The central guide plate 123 is located in the middle of the top of the exhaust chamber 126. The height of the central guide plate 123 is greater than the height of the exhaust chamber 126. The guide chamber 103 is connected to the left and right ends of the exhaust chamber 126. The guide chamber 103 is connected to the diversion chamber 102. The diversion chamber 102 is connected to the interior of the protective shell 101. The heating plate 104 has rectangular holes on its surface. The impeller 605 is rotated by the starting motor 602 to draw air from inside the main body 1 of the reflow soldering equipment. The air carries away the heat generated on the surface of the heating plate 104 and is guided into the interior of the guide chamber 103 by the first guide plate 105. The air then moves towards the center of the exhaust chamber 126 by passing through the left and right ends and the curvature of the exhaust chamber 126. During this movement, the air is guided by the baffle plate 124 and discharged through the exhaust duct 121 and exhaust hole 122 to heat the surface of the PCB board. Because the exhaust chamber 12... The size of the bottom exhaust duct 121 and exhaust hole 122 gradually decreases from the left and right ends towards the middle, so that the air volume at the left and right ends is less than that in the middle. The air volume at the left end of the exhaust chamber 126 continuously heats the PCB board. As the PCB board moves, the heating temperature gradually increases until the solder paste reaches its melting point, melting and connecting the components to the PCB board. The PCB board continues to move to the right end, and the temperature gradually decreases during the movement, gradually cooling the PCB board and making the solder paste more stable and less prone to cracking.

[0038] like Figure 2-6As shown, one side of the air inlet pipe 112 is connected to the interior of the air inlet chamber 111, and the other side of the air inlet pipe 112 is connected to the interior of the protective shell 101 and is away from the impeller 605. The impeller 605 is located inside the protective shell 101 and is turbine-shaped. The impeller 605 is located on one side of the heating plate 104. The bottom height of the air inlet chamber 111 is greater than the bottom height of the exhaust chamber 126. The width of the second guide plate 114 gradually increases from bottom to top. The motor 602 is started by the control host 4 to drive the drive shaft 601 and the impeller 605 to rotate, and air is drawn from the interior of the reflow soldering equipment body 1 through the air inlet chamber 111. The gas inside the reflow soldering equipment body 1 is drawn into the second guide plate 114. Guided by the guide plate 114, the air enters the interior of the air intake chamber 111, then enters the interior of the protective shell 101 through the air intake pipe 112. The heat generated by the heating plate 104 is carried away by the heating plate 104. The air then enters the interior of the distribution chamber 102 and is guided into the interior of the guide chamber 103 by the first guide plate 105. Finally, the air enters the interior of the exhaust chamber 126 evenly and is discharged through the exhaust slot 121 and exhaust hole 122 to heat the surface of the PCB board. The discharged air passes through the bottom of the diffuser plate 125 and then enters the interior of the air intake chamber 111. Since the bottom of the air intake chamber 111 is higher than the bottom of the exhaust chamber 126, the air contacts the PCB board more evenly, and the PCB board is heated more evenly.

[0039] Working principle and usage process of this invention:

[0040] First, apply solder paste to the corresponding positions on the PCB board and place the corresponding components. Then, place the PCB board on top of the inlet sprocket driven device 2. Start the inlet sprocket driven device 2 and motor 602 through the control host 4 to transport the PCB board into the interior of the reflow soldering equipment body 1. The PCB board will enter between the two air direction guide components 12. At this time, the two motors 602 start to drive the drive shaft 601 and impeller 605 to rotate. During the high-speed rotation of the impeller 605, air is drawn from the interior of the reflow soldering equipment body 1 through the two air inlet chambers 111. The air enters the interior of the protective shell 101 and passes through the interior of the heating plate 104. The heating plate 104 heats the air and removes the heat generated by the heating plate 104. Under the guidance of the two first guide plates 105, the air is evenly distributed inside the two guide chambers 103.

[0041] Air enters the interior of the reflow soldering equipment body 1 from both the left and right ends. Guided by the left end baffle plate 124, the air is discharged from the exhaust duct 121 and exhaust hole 122 respectively, heating the top and bottom of the PCB board. Since the size of the exhaust duct 121 and exhaust hole 122 gradually decreases from the left and right ends to the middle, the air volume at the left and right ends of the bottom of the reflow soldering equipment body 1 is less than the air volume in the middle. When the PCB board enters the left end between the two exhaust chambers 126, it is preheated by the exhaust duct 121 and exhaust hole 122. During the movement of the PCB board, the temperature of the air discharged between the two exhaust chambers 126 will gradually increase until the PCB board moves to the middle between the two exhaust chambers 126. The air from the left and right ends inside the exhaust chamber 126 is discharged through the middle of the inner side of the two exhaust chambers 126 under the guidance of the central guide plate 123. The solder paste on the surface of the PCB board will melt, connecting the components to the PCB board.

[0042] As the PCB continues to move to the right, the temperature of the air discharged from the middle to the right between the two exhaust chambers 126 gradually decreases, causing the surface temperature of the PCB to gradually decrease until it drops to room temperature. This slow cooling process makes the solder paste more stable and less prone to cracking.

[0043] Air is exhausted through the inner sides of two exhaust chambers 126. The high-speed rotation of the impeller 605 directs the air into the air intake chamber 111. Guided by the second guide plate 114, the air from inside the reflow soldering equipment body 1 enters the air intake chamber 111 evenly. Simultaneously, the air enters the protective shell 101 through the air intake pipe 112 for continued heating and circulation. Meanwhile, the oxygen detector 606 monitors the oxygen content inside the reflow soldering equipment body 1 in real time. When the oxygen content inside the reflow soldering equipment body 1 is too low, the solenoid valve 604 automatically opens, drawing external gas into the reflow soldering equipment body 1. When the oxygen content inside the reflow soldering equipment body 1 reaches 50 PMM, the solenoid valve 604 automatically closes.

[0044] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0045] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A reflow oven airflow circulation assembly, comprising a reflow oven body (1), characterized in that: An inlet sprocket driven device (2) is fixedly installed on one side of the top of the reflow soldering equipment body (1). A first windproof curtain box (3) is fixedly installed on the side of the top of the reflow soldering equipment body (1) away from the inlet sprocket driven device (2). A wind direction guide component (12) is fixedly installed on the top inside the reflow soldering equipment body (1). A control host (4) is fixedly installed on the front of the reflow soldering equipment body (1). A link area (5) is fixedly installed on the side of the top of the reflow soldering equipment body (1) away from the wind direction guide component (12). A cooling area (7) is fixedly installed on the side of the top of the reflow soldering equipment body (1) away from the link area (5). A second windproof curtain box (8) is fixedly installed on the side of the top of the reflow soldering equipment body (1) away from the cooling area (7). An outlet active mechanism (9) is fixedly installed on the side of the top of the reflow soldering equipment body (1) away from the second windproof curtain box (8). The wind direction guiding component (12) includes an exhaust duct (121), an exhaust hole (122), a central guide plate (123), a wind baffle (124), a diffuser plate (125), and an exhaust chamber (126). The bottom of the exhaust chamber (126) is equidistantly fitted with wind baffles (124). The bottom of the exhaust chamber (126) away from the wind baffles (124) is equidistantly provided with an exhaust duct (121) and an exhaust hole (122). The center of the top of the exhaust chamber (126) is fixedly fitted with a central guide plate (123). A diffuser plate (125) is fixedly installed at the bottom of the chamber (126). The exhaust duct (121), exhaust hole (122), and baffle plate (124) are symmetrical about the longitudinal central axis of the exhaust chamber (126). A heating component (10) is fixedly installed at the top of the exhaust chamber (126). A power component (6) is fixedly installed at the top of the exhaust chamber (126). A circulation component (11) is fixedly installed on the front of the exhaust chamber (126). The airflow guiding component (12) is symmetrically fixedly installed at the top and bottom of the reflow soldering equipment body (1).

2. The reflow oven airflow circulation assembly according to claim 1, characterized in that: The heating assembly (10) includes a protective shell (101), a diversion chamber (102), a guide chamber (103), a heating plate (104), and a first guide plate (105). The protective shell (101) is fixedly installed on the top of the exhaust chamber (126). The diversion chamber (102) is fixedly installed on one side of the protective shell (101). The guide chamber (103) is fixedly installed on one side of the diversion chamber (102). The first guide plate (105) is fixedly installed inside the diversion chamber (102). The heating plate (104) is fixedly installed inside the protective shell (101). The heating assembly (10) is symmetrical about the longitudinal central axis of the exhaust chamber (126).

3. The reflow oven airflow circulation assembly according to claim 2, characterized in that: The power assembly (6) includes a drive shaft (601), a motor (602), an air inlet (603), a solenoid valve (604), an impeller (605), and an oxygen detector (606). The motor (602) is fixedly installed on the top of the exhaust chamber (126). The drive shaft (601) is fixedly installed on the output end of the motor (602). The impeller (605) is fixedly installed on the outside of the drive shaft (601). The air inlet (603) is fixedly installed on the top of the protective shell (101). The solenoid valve (604) is fixedly installed on the front of the air inlet (603). The oxygen detector (606) is fixedly installed on the front of the exhaust chamber (126). The power assembly (6) is symmetrical about the longitudinal central plane of the exhaust chamber (126).

4. The reflow oven airflow circulation assembly according to claim 3, characterized in that: The circulation assembly (11) includes an air intake chamber (111), an air intake pipe (112), an expansion plate (113), and a second guide plate (114). The air intake chamber (111) is fixedly installed on the left and right ends of the front of the exhaust chamber (126). The second guide plate (114) is fixedly installed inside the air intake chamber (111). The air intake pipe (112) is fixedly installed on the top of the air intake chamber (111). The expansion plate (113) is fixedly installed on the bottom of the air intake chamber (111). The circulation assembly (11) is symmetrical about the front and back of the horizontal central axis of the exhaust chamber (126).

5. A reflow oven airflow circulation assembly according to claim 1, characterized in that: The height of the wind deflector (124) gradually increases from the left and right ends toward the middle. The top of the wind deflector (124) is arc-shaped. The left and right ends of the exhaust chamber (126) are arc-shaped. The arc direction of the wind deflector (124) and the exhaust chamber (126) is opposite.

6. The reflow oven airflow circulation assembly according to claim 1, characterized in that: The exhaust trough (121) and the exhaust hole (122) are respectively located on one side of the baffle plate (124). The size of the exhaust hole (122) and the exhaust trough (121) gradually decreases from the left and right ends to the middle. The left and right sides of the central guide plate (123) are concave. The central guide plate (123) is located in the middle of the top of the exhaust chamber (126). The height of the central guide plate (123) is greater than the height of the exhaust chamber (126).

7. A reflow oven airflow circulation assembly according to claim 2, characterized in that: The guide chamber (103) is connected to the left and right ends of the exhaust chamber (126) respectively. The guide chamber (103) is connected to the diversion chamber (102) respectively. The diversion chamber (102) is connected to the interior of the protective shell (101). The heating plate (104) has rectangular holes on its surface.

8. A reflow oven airflow circulation assembly according to claim 4, characterized in that: One side of the air intake pipe (112) is connected to the interior of the air intake chamber (111), and the other side of the air intake pipe (112) is connected to the interior of the protective shell (101) and is away from the impeller (605).

9. A reflow oven airflow circulation assembly according to claim 3, characterized in that: The impeller (605) is located inside the protective shell (101), the impeller (605) is turbine-shaped, and the impeller (605) is located on one side of the heating plate (104).

10. A reflow oven airflow circulation assembly according to claim 4, characterized in that: The bottom height of the air intake chamber (111) is greater than the bottom height of the exhaust chamber (126), and the width of the second guide plate (114) gradually increases from bottom to top.

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