Method for collecting silicon wafers in a material box

Abstract

The present application discloses a method for collecting silicon wafers in a material box, which is used for collecting silicon wafers in a first material box unit and a second material box unit which are sequentially arranged along a direction perpendicular to the conveying direction of silicon wafers. The method for collecting silicon wafers in a material box includes: controlling the first material box unit to descend from a first film receiving position and move horizontally to a first film taking position, and taking out the silicon wafers in the first material box unit located at the first film taking position, the first film taking position being located below the second material box unit; while keeping the second material box unit located at the second film receiving position, the second film receiving position and the first film receiving position being located at the same horizontal plane. Before taking out the silicon wafers in the first material box unit, the present application first controls the first material box unit to descend from the first film receiving position and move horizontally to the first film taking position, moves the first material box unit to a position convenient for taking out the silicon wafers, and then takes out the silicon wafers therein, which is more convenient than taking out the wafers at the first film receiving position, thereby improving the efficiency of collecting the silicon wafers.

Description

Technical Field

[0001] The present application belongs to the field of silicon wafer sorting, and specifically, relates to a method for collecting silicon wafers in a material box. Background Art

[0002] After the silicon wafers are sorted and tested by the sorting machine, they must be classified and collected according to the sorted grades, and silicon wafers of different grades must be collected into different material boxes. Figure 1 In the silicon wafer receiving area shown, when two material boxes are arranged at intervals on both sides of a conveyor line perpendicular to the conveyor line, it is inconvenient to take out the silicon wafers in the material box close to the conveyor line, and the efficiency of taking out the wafers is low.

[0003] Therefore, how to solve the problem of the inconvenience of collecting silicon wafers in the material box near the conveyor line is a technical problem that urgently needs to be solved. Summary of the invention

[0004] In view of the problem that it is inconvenient to collect silicon wafers in a material box near a conveyor line, the present application proposes a method for collecting silicon wafers in a material box.

[0005] In a first aspect, the present application proposes a method for collecting silicon wafers in a material box, which is used to collect silicon wafers in a first material box unit and a second material box unit arranged in sequence perpendicular to a conveying direction of silicon wafers. The method for collecting silicon wafers in a material box includes:

[0006] Control the first material box unit to descend from the first film receiving position and move horizontally to the first film taking position to take out the silicon wafer in the first material box unit located at the first film taking position, and the first film taking position is located below the second material box unit;

[0007] At the same time, the second material box unit is kept at the second film receiving position, and the second film receiving position and the first film receiving position are located on the same horizontal plane.

[0008] When taking out silicon wafers from a first material box unit and a second material box unit which are arranged in sequence perpendicular to the direction in which the silicon wafers are conveyed, the present application first controls the first material box unit to descend from the first wafer receiving position and move horizontally to the first wafer taking position before taking out the silicon wafers from the first material box unit, and moves the first material box unit to a position convenient for taking out the silicon wafers. This is more convenient than taking out the wafers at the first wafer receiving position, thereby improving the efficiency of collecting the silicon wafers.

[0009] Optionally, after controlling the first material box unit to descend from the first film receiving position and move laterally to the first film taking position, the receiving method further includes:

[0010] Monitoring whether the first material box unit reaches the first film taking position;

[0011] If the first material box unit arrives at the first wafer taking position, a first wafer taking prompt is performed, and the first wafer taking prompt is used to prompt the silicon wafer in the first material box unit to be taken out.

[0012] After controlling the first material box unit to descend from the first wafer receiving position and move horizontally to the first wafer taking position, monitor whether the first material box unit has reached the first wafer taking position to ensure that the first material box unit has arrived at the first wafer taking position with the silicon wafers. Through the wafer taking prompt, the silicon wafers in the first material box unit located at the first wafer taking position are promptly taken out to prevent taking out the wafers too long, thereby improving the efficiency of collecting the silicon wafers.

[0013] Optionally, controlling the first material box unit to descend from the first film receiving position and move laterally to the first film taking position includes:

[0014] When the first material box unit descends from the first sheet receiving position, the first guide unit is used to guide the descent of the first material box;

[0015] During the process of the first material box unit being laterally moved to the first sheet picking position, the second guiding unit is used to guide the lateral movement of the first material box unit.

[0016] During the descent and lateral movement of the first material box unit, the first guide unit and the second guide unit are respectively used to guide the first material box unit, which helps to increase the stability of the descent and lateral movement of the first material box unit and reduce the shaking of the first material box unit during the descent and lateral movement, thereby ensuring the quality of the silicon wafers in the first material box unit.

[0017] Optionally, after taking out the silicon wafers in the first material box unit located at the first wafer taking position, the method for collecting the silicon wafers in the material box further includes:

[0018] The first material box unit is controlled to move horizontally from the first film taking position and rise to the first film receiving position, while the second material box unit is kept at the second film receiving position.

[0019] During the process of resetting the first material box unit from the first wafer taking position to the first wafer receiving position, the second material box unit is kept at the second wafer receiving position. In this way, before the first material box unit is reset, the second material box unit can receive the silicon wafers at the second wafer receiving position, and the overall efficiency of silicon wafer receiving will not be affected by the position switch of the first material box unit.

[0020] Optionally, before controlling the first material box unit to descend from the first wafer receiving position and move horizontally to the first wafer taking position, the method for receiving the silicon wafers in the material box further includes: judging whether the silicon wafers in the first material box unit meet the first wafer taking condition, and if the silicon wafers in the first material box unit meet the first wafer taking condition, executing the step of controlling the first material box unit to descend from the first wafer receiving position and move horizontally to the first wafer taking position, wherein the first wafer taking condition is: the height of the silicon wafers reaches the first preset height or the task of the first material box unit receiving the silicon wafers has been completed;

[0021] And / or, after controlling the first material box unit to move horizontally from the first wafer taking position and rise to the first wafer receiving position, the method for receiving the silicon wafers in the material box also includes: judging whether all the silicon wafers in the first material box unit have been taken out; if all the silicon wafers in the first material box unit have been taken out, starting to receive the silicon wafers into the first material box unit.

[0022] Before controlling the first material box unit to descend from the first wafer receiving position and move horizontally to the first wafer picking position, first determine whether the silicon wafers in the first material box unit meet the first wafer picking condition, so as to more accurately ensure that each time the first material box unit is controlled to descend from the first wafer receiving position and move horizontally to the first wafer picking position, the silicon wafers in the first material box unit are in a full or receiving-finished state, thereby preventing the silicon wafers in the first material box unit from descending and moving horizontally to the first wafer picking position in advance before being fully received or receiving is completed, thereby affecting the efficiency of silicon wafer receiving.

[0023] After controlling the first material box unit to move horizontally from the first wafer taking position and rise to the first wafer receiving position, it is determined whether all the silicon wafers in the first material box unit have been taken out, so as to prevent the silicon wafers from being damaged by directly receiving the wafers into the first material box unit without taking out the silicon wafers in the first wafer taking position.

[0024] Optionally, controlling the first material box unit to descend from the first film receiving position and move laterally to the first film taking position includes:

[0025] A driving source is used to control the first material box unit to descend from the first film receiving position and move horizontally to the first film taking position;

[0026] or,

[0027] The first driving source is used to control the first material box unit to descend from the first film receiving position, and the second driving source is used to control the first material box unit to move horizontally to the first film taking position.

[0028] Considering the cost and efficiency, one can flexibly choose to use one driving source or two driving sources to control the descent and lateral movement of the first material box unit.

[0029] Optionally, taking out the silicon wafer in the first material box unit located at the first wafer taking position includes:

[0030] The first material box unit and the second material box unit are staggered, and the silicon wafers in the first material box unit are taken out by a robot or a second wafer taking prompt is performed, and the second wafer taking prompt is used to prompt the silicon wafers in the first material box unit to be taken out.

[0031] The first material box unit and the second material box unit are staggered to make it easier to take out the silicon wafers from the first material box unit. The silicon wafers in the first material box unit are taken out by a robot, making the collection of silicon wafers more automated and more efficient. The second wafer taking reminder is provided to remind workers to take out the silicon wafers in the first material box unit, thus reducing the temporary storage time of silicon wafers in the first material box unit after it is full, further improving the efficiency of silicon wafer collection.

[0032] Optionally, the method for collecting silicon wafers in the material box further includes:

[0033] When the first material box unit is located at the first wafer receiving position, determine whether the silicon wafers in the second material box unit meet the second wafer taking condition. If the silicon wafers in the second material box unit meet the second wafer taking condition, take out the silicon wafers in the second material box unit, wherein the second wafer taking condition includes: the height of the silicon wafers in the second material box unit reaches the second preset height or the task of the second material box unit to collect the silicon wafers has been completed.

[0034] By judging whether the silicon wafers in the second material box unit meet the second wafer taking condition, it can be more accurately ensured that when the silicon wafers in the second material box unit are taken, the silicon wafers in the second material box unit are in a full or finished state, and prevent the silicon wafers in the second material box unit from being taken in advance before they are fully taken or finished, which affects the normal wafer taking of the second material box unit and thus affects the efficiency of silicon wafer taking. When the first material box unit is at the first wafer taking position, the above judgment is performed, and even if the second material box unit is taken, the first material box unit can take the wafers, which will not affect the efficiency of silicon wafer taking.

[0035] Optionally, taking out the silicon wafer in the second material box unit includes:

[0036] Using a robot to take out the silicon wafer from the second material box unit;

[0037] Or a third wafer taking prompt is performed, where the third wafer taking prompt is used to prompt the silicon wafer in the second material box unit to be taken out.

[0038] The silicon wafers in the second material box unit are taken out by mechanical collection, making the collection of silicon wafers more automated and more efficient. A second material collection reminder is provided to prompt workers to take out the silicon wafers in the second material box unit, thereby reducing the temporary storage time of silicon wafers in the second material box unit after it is full, further improving the efficiency of silicon wafer collection.

[0039] Optionally, before taking out the silicon wafers in the second material box unit, the method for collecting the silicon wafers in the material box further includes:

[0040] Controlling the second material box unit to descend to a predetermined height;

[0041] or,

[0042] The second material box unit is controlled to descend to a predetermined height and to move laterally a predetermined distance.

[0043] Before taking out the silicon wafers in the second material box unit, the second material box unit is controlled to descend to a predetermined height so that the second material box unit is located at a height that is more suitable for the wafer taking operation, thereby improving the efficiency of silicon wafer collection; before taking out the silicon wafers in the second material box unit, the second material box unit is controlled to descend to a predetermined height and move horizontally a predetermined distance so that the second material box unit is located at a height that is more suitable for the wafer taking operation and closer to a position convenient for wafer taking, thereby improving the efficiency of silicon wafer collection. BRIEF DESCRIPTION OF THE DRAWINGS

[0044] Figure 1 A schematic diagram of a silicon wafer collecting device using the method for collecting silicon wafers in a material box of the present application;

[0045] Figure 2 The present invention is a flow chart of controlling the first material box unit from the first sheet receiving position to the first sheet taking position. DETAILED DESCRIPTION

[0046] In order to make the purpose, technical scheme and advantages of the embodiments of the present application clearer, the technical scheme in the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Among them, the described embodiments are part of the embodiments of the present application, rather than all the embodiments. Therefore, the following detailed description of the embodiments of the present application provided in the drawings is not intended to limit the scope of the present application for protection, but merely represents selected embodiments of the present application.

[0047] The present application will be described in detail below with reference to the accompanying drawings and in combination with embodiments. It should be noted that the embodiments and features in the embodiments of the present application can be combined with each other without conflict.

[0048] like Figure 1 As shown, when the first material box unit 1 and the second material box unit 2 are arranged in sequence perpendicular to the silicon wafer conveying direction (i.e., the direction of arrow 11 in the figure), the first material box unit 1 is located between the silicon wafer conveying line and the second material box unit 2, which makes it inconvenient to take out the silicon wafers in the first material box unit 1, and it is laborious and time-consuming to take out, which seriously affects the collecting efficiency of the silicon wafer collecting device.

[0049] In view of the problem that it is inconvenient to collect silicon wafers in a material box (first material box unit 1) close to a conveying line, the present application proposes a method for collecting silicon wafers in a material box, which is used to collect silicon wafers in a first material box unit 1 and a second material box unit 2 arranged in sequence perpendicular to the conveying direction of silicon wafers. The method for collecting silicon wafers in a material box includes:

[0050] The first material box unit 1 is controlled to descend from the first film receiving position A and move horizontally to the first film taking position B, and the silicon wafer in the first material box unit 1 located at the first film taking position B is taken out. The first film taking position B is located below the second material box unit 2;

[0051] The second film receiving position C and the first film receiving position A are located on the same horizontal plane.

[0052] When taking out silicon wafers from the first material box unit 1 and the second material box unit 2 which are arranged in sequence perpendicular to the direction of conveying the silicon wafers, the present application first controls the first material box unit 1 to descend from the first wafer receiving position A and move horizontally to the first wafer taking position B before taking out the silicon wafers from the first material box unit 1, and moves the first material box unit 1 to a position convenient for taking out the silicon wafers, and then takes out the silicon wafers therefrom. This is more convenient than taking out the wafers at the first wafer receiving position A, thereby improving the efficiency of collecting the silicon wafers.

[0053] The first material box unit 1 is controlled to switch from the first film receiving position A to the first film taking out position B by descending and moving horizontally. Compared with directly moving from the first film receiving position A to the first film taking out position B along a straight line, it can better avoid interference with the second material box unit 2 and prevent interference with the second material box unit 2, thereby damaging the silicon wafers in the first material box unit 1 and the second material box unit 2.

[0054] In addition, while controlling the first material box unit 1 to descend from the first film receiving position A and move horizontally to the first film taking position B, the second material box unit 2 is kept at the second film receiving position C, so that while the first material box unit 1 switches its position, the second material box unit 2 can always perform the film receiving action, thereby avoiding affecting the efficiency of the silicon wafer receiving device due to the position switching of the first material box unit 1.

[0055] Optionally, after controlling the first material box unit 1 to descend from the first film receiving position A and move laterally to the first film taking position B, the receiving method further includes:

[0056] Monitor whether the first material box unit 1 reaches the first sheet taking position B;

[0057] If the first material box unit 1 reaches the first wafer taking position B, a first wafer taking prompt is performed, and the first wafer taking prompt is used to prompt the silicon wafer in the first material box unit to be taken out.

[0058] After controlling the first material box unit 1 to descend from the first wafer receiving position A and move horizontally to the first wafer taking position B, monitor whether the first material box unit 1 reaches the first wafer taking position B to ensure that the first material box unit 1 has arrived at the first wafer taking position B with the silicon wafers. Through the wafer taking prompt, the silicon wafers in the first material box unit 1 located at the first wafer taking position B are promptly taken out to prevent taking out the wafers too long, thereby improving the efficiency of collecting the silicon wafers.

[0059] Optionally, controlling the first material box unit 1 to descend from the first film receiving position A and move laterally to the first film taking position B includes:

[0060] During the process of the first magazine unit 1 descending from the first film receiving position A, as shown in FIG. Figure 2 (a) Figure 2 As shown in (b), the first guide unit 3 is used to guide the descent of the first material box, which helps to increase the stability of the descent and lateral movement of the first material box unit 1, reduce the risk of shaking during the descent of the first material box unit 1, ensure the quality of the silicon wafers in the first material box unit 1, and also increase the descent speed of the first material box unit 1 and improve the efficiency of wafer collection;

[0061] During the process of the first material box unit 1 moving horizontally to the first sheet taking position B, Figure 2 (c) Figure 2 As shown in (d), the second guide unit 4 is used to guide the lateral movement of the first material box unit 1, which helps to increase the stability of the lateral movement of the first material box unit 1 and reduce the shaking of the first material box unit 1 during the lateral movement, thereby ensuring the quality of the silicon wafers in the first material box unit 1, and also improving the lateral movement speed of the first material box unit 1 and the wafer collection efficiency.

[0062] Optionally, after taking out the silicon wafers in the first material box unit 1 located at the first wafer taking position B, the method for collecting the silicon wafers in the material box further includes:

[0063] The first material box unit 1 is controlled to move horizontally from the first film taking position B and rise to the first film receiving position A, while the second material box unit 2 is kept at the second film receiving position C.

[0064] During the process of resetting the first material box unit 1 from the first wafer taking position B to the first wafer receiving position A, the second material box unit 2 is kept at the second wafer receiving position C. In this way, before the first material box unit 1 is reset, the second material box unit 2 can receive the silicon wafers at the second wafer receiving position C, and the overall efficiency of silicon wafer receiving will not be affected by the position switch of the first material box unit 1.

[0065] Optionally, before controlling the first material box unit 1 to descend from the first film receiving position A and move laterally to the first film picking position B, the method for receiving silicon wafers in the material box also includes: judging whether the silicon wafers in the first material box unit 1 meet the first film picking condition; if the silicon wafers in the first material box unit 1 meet the first film picking condition, executing the step of controlling the first material box unit 1 to descend from the first film receiving position A and move laterally to the first film picking position B, wherein the first film picking condition is: the height of the silicon wafers reaches the first preset height or the task of the first material box unit 1 to receive the silicon wafers has been completed.

[0066] It should be noted that the first preset height can be personalized according to different user requirements. Generally speaking, the first preset height is set based on the thickness of the total amount of silicon wafers that can be carried in the first material box unit 1. As to how to judge whether the height of the silicon wafers has reached the first preset height, a photoelectric sensor can be set at the first preset height. When the signal of the photoelectric sensor changes, it means that the height of the silicon wafers in the first material box unit 1 has reached the first preset height.

[0067] Whether the task of the first material box unit 1 to collect silicon wafers has been completed can be determined by combining the number of silicon wafers that have been sorted and tested by the silicon wafer sorter to complete the sorting of a batch of silicon wafers. When the number of tested silicon wafers reaches the corresponding batch, it means that the task of collecting silicon wafers has been completed.

[0068] Before controlling the first material box unit 1 to descend from the first wafer receiving position A and move horizontally to the first wafer picking position B, first determine whether the silicon wafers in the first material box unit 1 meet the first wafer picking condition, so as to more accurately ensure that each time the first material box unit 1 is controlled to descend from the first wafer receiving position A and move horizontally to the first wafer picking position B, the silicon wafers in the first material box unit 1 are in a full or finished state, thereby preventing the silicon wafers in the first material box unit 1 from descending and moving horizontally to the first wafer picking position B in advance before being fully collected or before being collected, thereby affecting the efficiency of silicon wafer collection.

[0069] Optionally, after controlling the first material box unit 1 to move horizontally from the first wafer taking position B and rise to the first wafer receiving position A, the method for collecting silicon wafers in the material box also includes: judging whether all the silicon wafers in the first material box unit 1 have been taken out; if all the silicon wafers in the first material box unit 1 have been taken out, starting to collect silicon wafers into the first material box unit 1.

[0070] A photoelectric sensor can be used to detect whether all the silicon wafers in the first material box unit 1 have been taken out. In order to increase the detection accuracy, the photoelectric sensor can be set at a second preset height, generally based on half of the total thickness of the silicon wafers that the first material box unit 1 can bear. Of course, a weighing sensor can also be set on the first material box unit 1. When the weight obtained by the weighing sensor is significantly higher than the weight of the empty material box, it means that the silicon wafers in the first material box unit 1 have not been completely taken out.

[0071] After controlling the first material box unit 1 to move horizontally from the first wafer taking position B and rise to the first wafer receiving position A, it is determined whether all the silicon wafers in the first material box unit 1 have been taken out, so as to prevent the silicon wafers from being damaged by directly receiving the wafers into the first material box unit 1 without taking out the silicon wafers in the first wafer taking position B.

[0072] Optionally, before controlling the first material box unit 1 to descend from the first wafer receiving position A and move horizontally to the first wafer taking position B, the method for receiving the silicon wafers in the material box further includes: judging whether the silicon wafers in the first material box unit 1 meet the first wafer taking condition, and if the silicon wafers in the first material box unit 1 meet the first wafer taking condition, executing the step of controlling the first material box unit 1 to descend from the first wafer receiving position A and move horizontally to the first wafer taking position B, wherein the first wafer taking condition is: the height of the silicon wafers reaches the first preset height or the task of the first material box unit 1 to receive the silicon wafers has been completed;

[0073] After controlling the first material box unit 1 to move horizontally from the first wafer taking position B and rise to the first wafer receiving position A, the method for receiving the silicon wafers in the material box also includes: judging whether all the silicon wafers in the first material box unit 1 have been taken out; if all the silicon wafers in the first material box unit 1 have been taken out, starting to receive the silicon wafers into the first material box unit 1.

[0074] Optionally, controlling the first material box unit 1 to descend from the first film receiving position A and move laterally to the first film taking position B includes:

[0075] like Figure 2 As shown, a driving source is used to control the first material box unit 1 to descend from the first film receiving position A and move horizontally to the first film taking position B;

[0076] or,

[0077] The first driving source is used to control the first material box unit 1 to descend from the first film receiving position A, and the second driving source is used to control the first material box unit 1 to move horizontally to the first film taking position B.

[0078] Considering the cost and efficiency, one or two driving sources can be flexibly selected to control the descent and lateral movement of the first material box unit 1 .

[0079] Optionally, taking out the silicon wafer in the first material box unit 1 located at the first wafer taking position B includes:

[0080] The first material box unit 1 and the second material box unit 2 are staggered, and the silicon wafers in the first material box unit 1 are taken out by a robot or a second wafer taking prompt is performed, and the second wafer taking prompt is used to prompt the silicon wafers in the first material box unit 1 to be taken out.

[0081] The first material box unit 1 and the second material box unit 2 are staggered to facilitate the removal of silicon wafers from the first material box unit 1. The silicon wafers in the first material box unit 1 are taken out by a robot, making the collection of silicon wafers more automated and more efficient; the second wafer taking reminder is performed to remind workers to take out the silicon wafers in the first material box unit 1, reducing the temporary storage time of silicon wafers in the first material box unit 1 after it is full, further improving the efficiency of silicon wafer collection.

[0082] Optionally, the method for collecting silicon wafers in the material box further includes:

[0083] When the first material box unit 1 is located at the first wafer receiving position A, it is determined whether the silicon wafers in the second material box unit 2 meet the second wafer taking condition. If the silicon wafers in the second material box unit 2 meet the second wafer taking condition, the silicon wafers in the second material box unit 2 are taken out, wherein the second wafer taking condition includes: the height of the silicon wafers in the second material box unit 2 reaches the second preset height or the task of the second material box unit 2 to take in the silicon wafers has been completed.

[0084] It should be noted that the second preset height can be personalized according to different user requirements. Generally speaking, the second preset height is set based on the thickness of the total amount of silicon wafers that can be carried in the second material box unit 2. As for how to judge whether the height of the silicon wafers has reached the second preset height, a photoelectric sensor can be set at the second preset height. When the signal of the photoelectric sensor changes, it means that the height of the silicon wafers in the second material box unit 2 has reached the first preset height.

[0085] Whether the task of receiving silicon wafers by the second material box unit 2 has been completed can be determined by combining the number of silicon wafers that have been sorted and tested by the silicon wafer sorter to complete the sorting of a batch of silicon wafers. When the number of tested silicon wafers reaches the corresponding batch, it means that the task of receiving silicon wafers has been completed.

[0086] By judging whether the silicon wafers in the second material box unit 2 meet the second wafer taking condition, it can be more accurately ensured that when the silicon wafers in the second material box unit 2 are taken, the silicon wafers in the second material box unit 2 are in a full or finished state, and prevent the silicon wafers in the second material box unit 2 from being taken in advance before they are fully taken or finished, which affects the normal wafer taking of the second material box unit 2 and thus affects the efficiency of wafer taking. When the first material box unit 1 is located at the first wafer taking position A, the above judgment is performed, and even if the second material box unit 2 is taken, the first material box unit 1 can take the wafers, which will not affect the efficiency of wafer taking.

[0087] Optionally, taking out the silicon wafer in the second material box unit 2 includes:

[0088] Use a robot to take out the silicon wafer in the second material box unit 2;

[0089] Or a third wafer taking prompt is performed, where the third wafer taking prompt is used to prompt the silicon wafer in the second material box unit 2 to be taken out.

[0090] The silicon wafers in the second material box unit 2 are taken out by a robot, making the collection of silicon wafers more automated and more efficient. A second material collection prompt is provided to prompt workers to take out the silicon wafers in the second material box unit 2, thereby reducing the temporary storage time of silicon wafers in the second material box unit 2 after it is full, further improving the efficiency of silicon wafer collection.

[0091] Optionally, before taking out the silicon wafers in the second material box unit 2, the method for collecting the silicon wafers in the material box further includes:

[0092] The second magazine unit 2 is controlled to descend to a predetermined height.

[0093] Before taking out the silicon wafers in the second material box unit 2, the second material box unit 2 is controlled to descend to a predetermined height, so that the second material box unit 2 is located at a height more suitable for the wafer taking operation, thereby improving the efficiency of silicon wafer taking;

[0094] Optionally, before taking out the silicon wafers in the second material box unit 2, the method for collecting the silicon wafers in the material box further includes: controlling the second material box unit 2 to descend to a predetermined height and to move horizontally a predetermined distance.

[0095] As for how to control the second magazine unit 2 to move laterally by a predetermined distance, the second magazine unit 2 may be pulled out by a predetermined distance in a direction away from the first magazine unit 1 .

[0096] Before taking out the silicon wafers in the second material box unit 2, the second material box unit 2 is controlled to descend to a predetermined height and move horizontally a predetermined distance, so that the second material box unit 2 is located at a height more suitable for the wafer taking operation and closer to a position convenient for taking out the wafers, thereby improving the efficiency of silicon wafer collection.

[0097] The invention of the present application and its implementation methods are described schematically above, and the description is not restrictive. The drawings show only one implementation method of the invention of the present application, and the actual structure is not limited thereto. Therefore, if ordinary technicians in the field are inspired by it and design structural methods and embodiments similar to the technical solution without creativity without departing from the purpose of the invention, they should all fall within the scope of protection of this patent.

Claims

1. A method for collecting silicon wafers in a material box, characterized in that: The method for collecting silicon wafers in a material box is used to collect silicon wafers in a first material box unit and a second material box unit which are sequentially arranged along a direction perpendicular to the conveying direction of silicon wafers, wherein the first material box unit is located between the silicon wafer conveying line and the second material box unit, and the method for collecting silicon wafers in a material box comprises: Determine whether the silicon wafers in the first material box unit meet the first wafer taking condition, where the first wafer taking condition is: the height of the silicon wafers reaches the first preset height or the task of the first material box unit to take the silicon wafers has been completed; If the silicon wafers in the first magazine unit meet the first wafer taking condition, the first magazine unit is controlled to descend from the first wafer receiving position and move horizontally to the first wafer taking position to take out the silicon wafers in the first magazine unit located at the first wafer taking position, and the first wafer taking position is located below the second magazine unit; The first material box unit is controlled to move horizontally from the first wafer taking position and rise to the first wafer receiving position, while the second material box unit is kept at the second wafer receiving position, and the second material box unit receives the silicon wafers at the second wafer receiving position, and the second wafer receiving position and the first wafer receiving position are located on the same horizontal plane.

2. The method for collecting silicon wafers in a material box according to claim 1, characterized in that: After controlling the first material box unit to descend from the first film receiving position and move laterally to the first film taking position, the receiving method further includes: Monitoring whether the first material box unit reaches the first film taking position; If the first material box unit reaches the first wafer taking position, a first wafer taking prompt is performed, wherein the first wafer taking prompt is used to prompt the silicon wafer in the first material box unit to be taken out.

3. The method for collecting silicon wafers in a material box according to claim 1, characterized in that: The controlling the first material box unit to descend from the first film receiving position and move laterally to the first film taking position comprises: When the first material box unit descends from the first sheet receiving position, a first guide unit is used to guide the descent of the first material box; During the process of the first material box unit being laterally moved to the first sheet picking position, the second guiding unit is used to guide the lateral movement of the first material box unit.

4. The method for collecting silicon wafers in a material box according to claim 1, characterized in that: After controlling the first material box unit to move horizontally from the first wafer taking position and rise to the first wafer receiving position, the method for receiving the silicon wafers in the material box also includes: judging whether all the silicon wafers in the first material box unit have been taken out, and if all the silicon wafers in the first material box unit have been taken out, starting to receive the silicon wafers into the first material box unit.

5. The method for collecting silicon wafers in a material box according to claim 1, characterized in that: The controlling the first material box unit to descend from the first film receiving position and move laterally to the first film taking position comprises: A driving source is used to control the first material box unit to descend from the first film receiving position and move horizontally to the first film taking position; or, The first driving source is used to control the first material box unit to descend from the first film receiving position, and the second driving source is used to control the first material box unit to move horizontally to the first film taking position.

6. The method for collecting silicon wafers in a material box according to claim 1, characterized in that: The method of taking out the silicon wafer from the first material box unit located at the first wafer taking position comprises: The first material box unit and the second material box unit are staggered, and the silicon wafers in the first material box unit are taken out by a robot or a second wafer taking prompt is performed, wherein the second wafer taking prompt is used to prompt the silicon wafers in the first material box unit to be taken out.

7. The method for collecting silicon wafers in a material box according to claim 1, characterized in that: The method for collecting the silicon wafers in the material box also includes: When the first material box unit is located at the first wafer receiving position, determine whether the silicon wafers in the second material box unit meet the second wafer taking condition, and if the silicon wafers in the second material box unit meet the second wafer taking condition, take out the silicon wafers in the second material box unit, wherein the second wafer taking condition includes: the height of the silicon wafers in the second material box unit reaches a second preset height or the task of the second material box unit to collect the silicon wafers has been completed.

8. The method for collecting silicon wafers in a material box according to claim 7, characterized in that: The step of taking out the silicon wafer from the second material box unit comprises: Using a robot to take out the silicon wafer in the second material box unit; Or a third wafer taking prompt is performed, where the third wafer taking prompt is used to prompt the silicon wafer in the second material box unit to be taken out.

9. The method for collecting silicon wafers in a material box according to claim 8, characterized in that: Before taking out the silicon wafers in the second material box unit, the method for collecting the silicon wafers in the material box further includes: Controlling the second magazine unit to descend to a predetermined height; or, The second material box unit is controlled to descend to a predetermined height and to move laterally a predetermined distance.

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