Warpage prevention circuit board, method of manufacturing the same, and electronic device

Abstract

The application discloses a warping-preventing circuit board, which comprises a circuit substrate, a first insulating protective layer and a second insulating protective layer. The first insulating protective layer is combined with the circuit substrate. The first insulating protective layer comprises a plurality of first protective units which are independently arranged in a segmented manner, and each first protective unit is combined with the surface of the circuit substrate. A first gap exists between two adjacent first protective units. The second insulating protective layer has a reflecting performance. The second insulating protective layer comprises a plurality of second protective units which are independently arranged in a segmented manner, and each second protective unit corresponds to a first gap. The warping-preventing circuit board is beneficial to preventing warping on the basis of lightening and thinning. The application further provides a manufacturing method of the warping-preventing circuit board and an electronic device using the warping-preventing circuit board.

Description

Technical Field

[0001] This application relates to an anti-warping circuit board, a method for manufacturing the same, and an electronic device using the circuit board. Background Technology

[0002] With the miniaturization of various electronic products, circuit boards used in these products are also trending towards thinner and lighter designs. However, this trend can easily lead to warping. Therefore, preventing circuit board warping while maintaining a thinner and lighter design is a pressing issue that needs to be addressed. Summary of the Invention

[0003] In view of this, it is necessary to provide an anti-warping circuit board that is conducive to preventing warping while achieving a thinner and lighter design.

[0004] There is also a need to provide a manufacturing method for an anti-warping circuit board that is simple to produce and facilitates the prevention of warping while achieving a thinner and lighter design.

[0005] In addition, it is necessary to provide an electronic device that uses the aforementioned anti-warping circuit board.

[0006] An anti-warping circuit board includes a circuit board, a first insulating protective layer, and a second insulating protective layer. The first insulating protective layer is bonded to the circuit board and includes a plurality of independently segmented first protective units, each of which is bonded to the surface of the circuit board. A first gap exists between adjacent first protective units. The second insulating protective layer has reflective properties and includes a plurality of independently segmented second protective units, each of which fills one of the first gaps.

[0007] A method for manufacturing an anti-warping circuit board includes the following steps:

[0008] Provide a circuit board;

[0009] A first insulating protective layer is formed on the aforementioned circuit board to obtain an intermediate structure; wherein the first insulating protective layer includes a plurality of independently separated first protective units, each of the first protective units being bonded to the surface of the circuit board, and a first gap existing between adjacent first protective units; and

[0010] A second insulating protective layer is provided on the intermediate structure, wherein the second insulating protective layer has reflective properties and includes a plurality of independently separated second protective units, each of which fills a first gap.

[0011] An electronic device comprising an anti-warping circuit board as described above.

[0012] The aforementioned anti-warping circuit board and its manufacturing method of this application divide the first insulating protective layer into multiple independently arranged first protective units through the first gap. This utilizes the discontinuity of the tension in the first insulating protective layer to reduce stress concentration on the circuit board, thereby helping to prevent warping. Furthermore, filling the first gap with a second insulating protective layer made of a different material than the first insulating protective layer further helps to reduce stress concentration on the circuit board. Simultaneously, the reflective properties of the second insulating protective layer help to improve the reflectivity of the circuit board. Attached Figure Description

[0013] Figure 1 This is a schematic diagram of the anti-warping circuit board according to one embodiment of this application.

[0014] Figure 2 This is a schematic diagram of the structure of a circuit board according to one embodiment of this application.

[0015] Figure 3 This is a schematic diagram of the intermediate structure of one embodiment of this application.

[0016] Figure 4 In order to be in Figure 3 The diagram shows a structure with a second insulating protective layer on the intermediate structure.

[0017] Explanation of main component symbols

[0018]

[0019]

[0020] The following detailed description, in conjunction with the accompanying drawings, will further illustrate this application. Detailed Implementation

[0021] The technical solutions in the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments.

[0022] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application.

[0023] The following detailed description of some embodiments of this application is provided in conjunction with the accompanying drawings. Unless otherwise specified, the following embodiments and features can be combined with each other.

[0024] Please see Figure 1An anti-warping circuit board 100 according to one embodiment of this application includes a circuit board 10, a first insulating protective layer 30, and a second insulating protective layer 50. The first insulating protective layer 30 is bonded to the circuit board 10 and includes a plurality of independently partitioned first protective units 31, each of which is bonded to the surface of the circuit board 10. A first gap 301 exists between adjacent first protective units 31. The second insulating protective layer 50 has reflective properties and includes a plurality of independently partitioned second protective units 51, each of which fills one of the first gaps 301.

[0025] The first gap 301 divides the first insulating protective layer 30 into multiple independently arranged first protective units 31, thereby reducing stress concentration on the circuit board by utilizing the discontinuity of tension in the first insulating protective layer 30, which helps prevent the circuit board from warping. Furthermore, filling the first gap 301 with a second insulating protective layer 50 made of a different material than the first insulating protective layer 30 further helps reduce stress concentration on the circuit board. Simultaneously, the reflective properties of the second insulating protective layer 50 help improve the reflectivity of the circuit board.

[0026] In some embodiments, each of the second protection units 51 may also extend from the first gap 301 to the surface of the adjacent first protection unit 31 facing away from the circuit board 10, which is beneficial to further improve the reflectivity of the circuit board.

[0027] In some embodiments, the first insulating protective layer 30 also has reflective properties. Preferably, the reflectivity of the second insulating protective layer 50 is greater than that of the first insulating protective layer 30, which is beneficial for reducing stress concentration on the circuit board while improving the reflectivity of the circuit board.

[0028] The circuit board 10 may include at least one pad 101. The first insulating protective layer 30 has a second gap 303 corresponding to the pad 101 to expose the pad 101 so that the pad 101 can be connected to external electronic components.

[0029] In some embodiments, the first insulating protective layer 30 may be disposed on one side of the circuit board 10.

[0030] In some embodiments, the first insulating protective layer 30 may be disposed on opposite sides of the circuit board 10. Preferably, the first insulating protective layers 30 disposed on opposite sides of the circuit board 10 are asymmetrically arranged relative to the circuit board 10, which helps to further reduce the problem of stress concentration on the circuit board. More specifically, the first gaps 301 located on opposite sides of the circuit board 10 are asymmetrically arranged relative to the circuit board 10, that is, at least a portion of the first gaps 301 located on opposite sides of the circuit board 10 are staggered.

[0031] The circuit board 10 can be a single-layer circuit board, a double-layer circuit board, or a multi-layer circuit board. In this embodiment, the circuit board 10 is described as a double-layer circuit board.

[0032] Specifically, the circuit board 10 includes a first circuit layer 11, a dielectric layer 13, and a second circuit layer 15 stacked sequentially. The first insulating protective layer 30 is bonded to opposite sides of the dielectric layer 13 spaced apart along the stacking direction, and covers the first circuit layer 11 and a portion of the second circuit layer 15, with portions of the first circuit layer 11 and the second circuit layer 15 exposed from the first gap 301.

[0033] The first circuit layer 11 and the second circuit layer 15 each include at least one pad 101, which is exposed from the second gap 303.

[0034] In some embodiments, the surface of the pad 101 may be galvanized to form a metal protective layer 103, thereby protecting the pad 101 from oxidation and thus improving the stability of the connection when connecting external electronic components.

[0035] Please refer to the following: Figures 1 to 4 A method for manufacturing an anti-warping circuit board according to an embodiment of this application includes the following steps:

[0036] Step S1, please refer to Figure 2 A circuit board 10 is provided.

[0037] The circuit board 10 can be a single-layer circuit board, a double-layer circuit board, or a multi-layer circuit board. In this embodiment, the circuit board 10 is described as a double-layer circuit board.

[0038] The circuit board 10 includes a first circuit layer 11, a dielectric layer 13, and a second circuit layer 15 stacked sequentially.

[0039] The first circuit layer 11 and the second circuit layer 15 each include at least one pad 101.

[0040] For step S2, please refer to [link / reference]. Figure 3 A first insulating protective layer 30 is formed on the circuit board 10 to obtain an intermediate structure 100a. The first insulating protective layer 30 includes a plurality of independently separated first protection units 31. Each first protection unit 31 is bonded to the surface of the circuit board 10, and a first gap 301 exists between adjacent first protection units 31.

[0041] In some embodiments, the first insulating protective layer 30 may have reflective properties.

[0042] The first insulating protective layer 30 has a second gap 303 corresponding to the pad 101 to expose the pad 101 so that the pad 101 can be connected to external electronic components.

[0043] In some embodiments, the first insulating protective layer 30 may be disposed on one side of the circuit board 10.

[0044] In some embodiments, the first insulating protective layer 30 may be disposed on opposite sides of the circuit board 10. Preferably, the first insulating protective layers 30 disposed on opposite sides of the circuit board 10 are asymmetrically arranged relative to the circuit board 10, which helps to further reduce the problem of stress concentration on the circuit board. More specifically, the first gaps 301 located on opposite sides of the circuit board 10 are asymmetrically arranged relative to the circuit board 10, that is, at least a portion of the first gaps 301 located on opposite sides of the circuit board 10 are staggered.

[0045] In some embodiments, the first insulating protective layer 30 can be obtained by pressing an insulating protective film and then exposing, developing, and baking the insulating protective film.

[0046] Step S3, please refer to Figure 4 A second insulating protective layer 50 is provided on the intermediate structure 100a. The second insulating protective layer 50 has reflective properties and includes a plurality of independently separated second protective units 51, each of which fills a corresponding first gap 301.

[0047] In some embodiments, each of the second protection units 51 may also extend from the first gap 301 to the surface of the adjacent first protection unit 31 facing away from the circuit board 10, which is beneficial to further improve the reflectivity of the circuit board.

[0048] Preferably, the reflectivity of the second insulating protective layer 50 is greater than that of the first insulating protective layer 30, which is beneficial to improve the reflectivity of the circuit board while reducing stress concentration.

[0049] For step S4, please refer to [link / reference]. Figure 1 The pads 101 exposed from the second gap 303 are subjected to electroless gold treatment to form a metal protective layer 103, thereby protecting the pads 101 from oxidation and thus improving the connection strength when connecting external electronic components.

[0050] In some implementations, step S4 can be omitted.

[0051] The circuit board 100 described above can be applied to various electronic devices (not shown in the figure), which may be, but are not limited to, mobile phones, computers, wearable devices, electric toys, etc.

[0052] The circuit board and its manufacturing method described in this application divide the first insulating protective layer 30 into multiple independently arranged first protective units 31 through the first gap 301. This utilizes the discontinuity of tension in the first insulating protective layer 30 to reduce stress concentration on the circuit board, thereby helping to prevent warping. Furthermore, filling the first gap 301 with a second insulating protective layer 50 made of a different material than the first insulating protective layer 30 further helps reduce stress concentration. Simultaneously, the reflective properties of the second insulating protective layer 50 help improve the reflectivity of the circuit board.

[0053] The above description is merely a preferred embodiment of this application and is not intended to limit this application in any way. Although the preferred embodiment has been disclosed above, it is not intended to limit this application. Any person skilled in the art can make some modifications or alterations to the above-disclosed technical content to create equivalent embodiments without departing from the scope of the technical solution of this application. Any simple modifications, equivalent changes, and alterations made to the above embodiments based on the technical essence of this application without departing from the scope of the technical solution of this application shall still fall within the scope of the technical solution of this application.

Claims

1. An anti-warping circuit board, comprising a circuit board substrate, a first insulating protective layer, and a second insulating protective layer, wherein the first insulating protective layer is bonded to the circuit board substrate, the circuit board substrate is a single-sided circuit board substrate, the single-sided circuit board substrate being composed of a dielectric layer and a first circuit layer bonded to one side of the dielectric layer, characterized in that, The first insulating protective layer includes a plurality of independently segmented first protective units, and each first protective unit is bonded to the surface of the circuit board; a first gap exists between two adjacent first protective units; the second insulating protective layer has reflective properties, and the second insulating protective layer includes a plurality of independently segmented second protective units, each second protective unit correspondingly filling one of the first gaps, and each second protective unit also extends from the first gap to the surface of the adjacent first protective unit away from the circuit board; the first insulating protective layer has reflective properties, and the reflectivity of the second insulating protective layer is greater than that of the first insulating protective layer; the first insulating protective layer is disposed on opposite sides of the circuit board, and the first insulating protective layers disposed on opposite sides of the circuit board are asymmetrically disposed relative to the circuit board, and the first gaps located on opposite sides of the circuit board are asymmetrically disposed relative to the circuit board; the first circuit layer includes at least one pad, and the first insulating protective layer has a second gap corresponding to the pad to expose the pad.

2. A method for manufacturing an anti-warping circuit board, comprising the following steps: A circuit board is provided, the circuit board being a single-sided circuit board, the single-sided circuit board being composed of a dielectric layer and a first circuit layer bonded to one side of the dielectric layer, the first circuit layer further comprising at least one pad. A first insulating protective layer is disposed on opposite sides of the aforementioned circuit substrate to form an intermediate structure; wherein, the first insulating protective layer includes a plurality of independently disposed first protective units, each first protective unit being bonded to the surface of the circuit substrate, a first gap existing between adjacent first protective units, and a second gap corresponding to the pads in the first insulating protective layer to expose the pads; the first insulating protective layer has reflective properties; the first insulating protective layers disposed on opposite sides of the circuit substrate are asymmetrically disposed relative to the circuit substrate, and the first gaps located on opposite sides of the circuit substrate are asymmetrically disposed relative to the circuit substrate; and A second insulating protective layer is provided on the intermediate structure, wherein the second insulating protective layer has reflective properties and the reflectivity of the second insulating protective layer is greater than that of the first insulating protective layer. The second insulating protective layer includes a plurality of independently separated second protective units, each of the second protective units corresponding to fill a first gap, and each of the second protective units also extends from the first gap to the surface of the adjacent first protective unit away from the circuit board.

3. An electronic device, characterized in that, The electronic device includes the anti-warping circuit board as described in claim 1.

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