Circuit board for lens module and manufacturing method thereof

Abstract

The present application proposes a method for manufacturing a circuit board for a lens module, comprising: providing a first circuit substrate having a through hole formed therein; forming a second circuit substrate on the surface of the first conductive circuit layer; providing a support sheet; placing the support sheet in the through hole; forming a third circuit substrate on the surface of the second conductive circuit layer; forming a fourth circuit substrate on the surface of the third conductive circuit layer; forming a fifth circuit substrate on the surface of the fourth conductive circuit layer; and mounting a first photosensitive chip and a second photosensitive chip on the first surface and a portion of the second surface, respectively, to obtain the circuit board. A lens module prepared from the circuit board of the present application has a relatively small thickness. The present application also provides a circuit board for a lens module.

Description

Technical Field

[0001] The present application relates to the field of circuit boards, and in particular to a circuit board for a lens module and a manufacturing method thereof. Background Art

[0002] With the continuous advancement of the functionality of electronic devices such as smartphones and tablets, thin, yet comprehensive features are increasingly popular. Due to the increasing demand for mobile phone camera functionality, existing electronic devices often include more than one camera. However, due to the limited space in mobile phones, increasing the number of cameras takes up a significant amount of space within the device, making it difficult to achieve thinner designs. Summary of the Invention

[0003] In view of this, the present application provides a method for manufacturing a circuit board that can reduce the thickness of a lens module.

[0004] In addition, it is also necessary to provide a circuit board manufactured by the above method.

[0005] An embodiment of the present application provides a method for manufacturing a circuit board for a lens module, comprising:

[0006] Providing a first circuit substrate, the first circuit substrate comprising a base layer and a first conductive circuit layer and a second conductive circuit layer respectively provided on two opposite surfaces of the base layer, wherein a through hole is provided in the first circuit substrate;

[0007] A second circuit substrate is formed on a surface of the first conductive circuit layer, the second circuit substrate comprising a first adhesive layer and a third conductive circuit layer disposed on a surface of the first adhesive layer, the first adhesive layer having a first opening, the first adhesive layer comprising a first bonding area surrounding the first opening, the orthographic projection of the first bonding area on the third conductive circuit layer being within the range of the orthographic projection of the through hole on the third conductive circuit layer;

[0008] Providing a support sheet, the support sheet comprising a first surface and a second surface disposed opposite to each other;

[0009] placing the support sheet in the through hole and bonding the first surface to the first bonding area;

[0010] A third circuit substrate is formed on the surface of the second conductive circuit layer, the third circuit substrate comprising a second adhesive layer and a fourth conductive circuit layer disposed on the surface of the second adhesive layer, the second adhesive layer having a second opening, the second adhesive layer comprising a second bonding area surrounding the second opening, the orthographic projection of the second bonding area on the fourth conductive circuit layer being within the range of the orthographic projection of the through hole on the fourth conductive circuit layer, and the second surface being bonded to the second bonding area;

[0011] A first groove corresponding to the first opening is formed in the second circuit substrate, and a second groove corresponding to the second opening is formed in the third circuit substrate, thereby exposing a portion of the first surface and a portion of the second surface;

[0012] forming a fourth circuit substrate on the surface of the third conductive circuit layer, the fourth circuit substrate comprising a third adhesive layer and a fifth conductive circuit layer disposed on the surface of the third adhesive layer, the third adhesive layer having a third opening, the inner diameter of the third opening being larger than the inner diameter of the first groove;

[0013] A fifth circuit substrate is formed on the surface of the fourth conductive circuit layer, the fifth circuit substrate comprising a fourth adhesive layer and a sixth conductive circuit layer disposed on the surface of the fourth adhesive layer, the fourth adhesive layer having a fourth opening, the inner diameter of the fourth opening being larger than the inner diameter of the second groove;

[0014] A third groove corresponding to the third opening is formed in the fourth circuit substrate, and a fourth groove corresponding to the fourth opening is formed in the fifth circuit substrate, thereby exposing a portion of the first surface and a portion of the second surface again, wherein a portion of the third conductive circuit layer is exposed in the third groove to form a first solder pad, and a portion of the fourth conductive circuit layer is exposed in the fourth groove to form a second solder pad; and

[0015] A first photosensitive chip and a second photosensitive chip are respectively installed on the exposed portion of the first surface and the portion of the second surface, and the first photosensitive chip and the second photosensitive chip are respectively electrically connected to the first welding pad and the second welding pad, thereby obtaining the circuit board.

[0016] One embodiment of the present application further provides a circuit board for a lens module, comprising:

[0017] A first circuit substrate, the first circuit substrate comprising a base layer and a first conductive circuit layer and a second conductive circuit layer respectively provided on two opposite surfaces of the base layer, wherein the first circuit substrate is provided with a through hole;

[0018] a second circuit substrate, the second circuit substrate being located on a surface of the first conductive circuit layer, the second circuit substrate comprising a first adhesive layer and a third conductive circuit layer disposed on a surface of the first adhesive layer, the first adhesive layer defining a first opening, the first adhesive layer comprising a first bonding region surrounding the first opening, the orthographic projection of the first bonding region on the third conductive circuit layer being located within the range of the orthographic projection of the through hole on the third conductive circuit layer, and the second circuit substrate defining a first slot corresponding to the first opening;

[0019] a support sheet, the support sheet comprising a first surface and a second surface opposite to each other, the support sheet being located in the through hole and the first surface being bonded to the first bonding area;

[0020] a third circuit substrate, the third circuit substrate being located on a surface of the second conductive circuit layer, the third circuit substrate comprising a second adhesive layer and a fourth conductive circuit layer disposed on a surface of the second adhesive layer, the second adhesive layer being provided with a second opening, the second adhesive layer comprising a second bonding region surrounding the second opening, the orthographic projection of the second bonding region on the fourth conductive circuit layer being located within the range of the orthographic projection of the through hole on the fourth conductive circuit layer, the second surface being bonded to the second bonding region, and the third circuit substrate being provided with a second groove corresponding to the second opening;

[0021] a fourth circuit substrate, located on a surface of the third conductive circuit layer, the fourth circuit substrate comprising a third adhesive layer and a fifth conductive circuit layer disposed on a surface of the third adhesive layer, the third adhesive layer defining a third opening, the inner diameter of the third opening being greater than the inner diameter of the first groove, the fourth circuit substrate defining a third groove corresponding to the third opening, a portion of the first surface being exposed to the first groove and the third groove, and a portion of the third conductive circuit layer being exposed to the third groove to form a first solder pad;

[0022] a fifth circuit substrate, located on a surface of the fourth conductive circuit layer, the fifth circuit substrate comprising a fourth adhesive layer and a sixth conductive circuit layer disposed on a surface of the fourth adhesive layer, the fourth adhesive layer defining a fourth opening, the inner diameter of the fourth opening being greater than the inner diameter of the second groove, the fifth circuit substrate defining a fourth groove corresponding to the fourth opening, a portion of the second surface being exposed to the second groove and the fourth groove, and a portion of the fourth conductive circuit layer being exposed to the fourth groove to form a second solder pad;

[0023] a first photosensitive chip, the first photosensitive chip being mounted on the exposed portion of the first surface, the first photosensitive chip being electrically connected to the first pad; and

[0024] A second photosensitive chip is mounted on the exposed portion of the second surface, and the second photosensitive chip is electrically connected to the second pad.

[0025] The present application saves space inside the electronic device by setting the supporting sheet in the through hole of the first circuit substrate and installing the first photosensitive chip and the second photosensitive chip on the first surface and the second surface of the supporting sheet respectively so as to install two optical lenses, thereby making the lens module prepared by the circuit board have a smaller thickness. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 2 is a schematic structural diagram of a first circuit substrate provided in an embodiment of the present application.

[0027] Figure 2 is Figure 1 The schematic diagram of the structure after a through hole is opened in the first circuit substrate is shown.

[0028] Figure 3 is Figure 2 The schematic diagram of the structure after the second circuit substrate is formed on the surface of the first conductive circuit layer is shown.

[0029] Figure 4 is Figure 3 Schematic diagram of the structure after the support sheet is placed in the through hole shown.

[0030] Figure 5 is Figure 4 The schematic diagram of the structure after the third circuit substrate is formed on the surface of the second conductive circuit layer is shown.

[0031] Figure 6 is Figure 5 The diagram shows a structure in which a first slot is opened in the second circuit substrate and a second slot is opened in the third circuit substrate.

[0032] Figure 7 is Figure 6 The structure diagram shown is a schematic diagram of a fourth circuit substrate formed on the surface of the third conductive circuit layer, and a fifth circuit substrate formed on the surface of the fourth conductive circuit layer.

[0033] Figure 8 is Figure 7 The structure diagram shown is a schematic diagram of a first solder mask layer formed on the surface of a fourth circuit substrate and a second solder mask layer formed on the surface of a fifth circuit substrate.

[0034] Figure 9 is Figure 8 The diagram shows a structure after a third slot is opened in the fourth circuit substrate and a fourth slot is opened in the fifth circuit substrate.

[0035] Figure 10 is Figure 9The diagram shows a structure diagram after the first photosensitive chip and the second photosensitive chip are installed on the first surface and the second surface.

[0036] Figure 11 is Figure 10 The schematic diagram of the structure of the circuit board for the lens module is shown after the first slot and the third slot are filled with the first packaging glue, and the second slot and the fourth slot are filled with the second packaging glue.

[0037] Description of main component symbols

[0038] Circuit board 100

[0039] First circuit substrate 10

[0040] Grassroots 101

[0041] First conductive circuit layer 102

[0042] Second conductive circuit layer 103

[0043] Through hole 11

[0044] Second circuit substrate 20

[0045] First adhesive layer 201

[0046] First bonding area 2011

[0047] The third conductive circuit layer 202

[0048] First Pad 2021

[0049] First opening 21

[0050] First slot 22

[0051] Support sheet 30

[0052] First surface 301

[0053] Second surface 302

[0054] Third circuit substrate 40

[0055] Second adhesive layer 401

[0056] Second bonding area 4011

[0057] Fourth conductive circuit layer 402

[0058] Second pad 4021

[0059] Second opening 41

[0060] Second slot 42

[0061] Fourth circuit substrate 50

[0062] The third adhesive layer 501

[0063] Fifth conductive circuit layer 502

[0064] The third opening 51

[0065] The third slot 52

[0066] Fifth circuit substrate 60

[0067] Fourth adhesive layer 601

[0068] Sixth conductive circuit layer 602

[0069] Fourth opening 61

[0070] Fourth slot 62

[0071] First solder resist layer 70

[0072] Second solder resist layer 71

[0073] First photosensitive chip 80

[0074] Second photosensitive chip 81

[0075] First conductive wire 90

[0076] Second wire 91

[0077] First packaging glue 92

[0078] Second packaging glue 93

[0079] The following specific implementation methods will further illustrate the present application in conjunction with the above-mentioned drawings. DETAILED DESCRIPTION

[0080] The technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments.

[0081] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art to which this application pertains. The terms used herein in the specification of this application are for the purpose of describing specific embodiments only and are not intended to limit this application.

[0082] In order to further illustrate the technical means and effects adopted by this application to achieve the intended purpose, the following detailed description of this application is made in conjunction with the accompanying drawings and preferred implementation methods.

[0083] An embodiment of the present application provides a method for manufacturing a circuit board for a lens module, comprising the following steps:

[0084] Step S11, please refer to Figure 1 , providing a first circuit substrate 10.

[0085] In one embodiment, the first circuit substrate 10 includes a base layer 101 and a first conductive circuit layer 102 and a second conductive circuit layer 103 respectively disposed on two opposite surfaces of the base layer 101 .

[0086] The material of the base layer 101 can be selected from one of epoxy resin, polypropylene (PP), BT resin, polyphenylene oxide (PPO), polyimide (PI), polyethylene terephthalate (PET), and polyethylene naphthalate (PEN). In this embodiment, the material of the base layer 101 is polyimide.

[0087] Step S12, please refer to Figure 2 , a through hole 11 is opened in the first circuit substrate 10.

[0088] The through hole 11 sequentially passes through the second conductive circuit layer 103 , the base layer 101 and the first conductive circuit layer 102 .

[0089] In this embodiment, the through hole 11 can be formed by laser drilling.

[0090] Step S13, please refer to Figure 3 , a second circuit substrate 20 is formed on the surface of the first conductive circuit layer 102 .

[0091] In this embodiment, the second circuit substrate 20 includes a first adhesive layer 201 and a third conductive circuit layer 202 disposed on a surface of the first adhesive layer 201. The first adhesive layer 201 is located between the third conductive circuit layer 202 and the first conductive circuit layer 102. In other embodiments, the second circuit substrate 20 may include multiple third conductive circuit layers 202. The first adhesive layer 201 is disposed between each adjacent third conductive circuit layer 202. In other words, the second circuit substrate 20 may be a single-layer circuit board or a multi-layer circuit board.

[0092] The first adhesive layer 201 has a first opening 21 formed therein. The first adhesive layer 201 includes a first bonding region 2011 surrounding the first opening 21. The first bonding region 2011 is not bonded to the first circuit substrate 10, and the orthographic projection of the first bonding region 2011 on the third conductive circuit layer 202 is within the range of the orthographic projection of the through hole 11 on the third conductive circuit layer 202.

[0093] The material of the first adhesive layer 201 can be selected from one of epoxy resin, polypropylene (PP), BT resin, polyphenylene oxide (PPO), polyimide (PI), polyethylene terephthalate (PET), and polyethylene naphthalate (PEN). In this embodiment, the material of the first adhesive layer 201 is polypropylene.

[0094] Step S14, please refer to Figure 4 , providing a support sheet 30.

[0095] The support sheet 30 includes a first surface 301 and a second surface 302 that are opposite to each other.

[0096] The support sheet 30 may be a metal sheet. In this embodiment, the support sheet 30 is a steel sheet. In other embodiments, the support sheet 30 may be other metal sheets, such as an iron sheet and an aluminum sheet.

[0097] In step S15 , the support sheet 30 is placed in the through hole 11 and the first surface 301 is bonded to the first bonding area 2011 .

[0098] The thickness and width of the support sheet 30 are substantially the same as the depth and width of the through hole 11 , respectively. That is, the support sheet 30 completely fills the through hole 11 .

[0099] Step S16, see Figure 5 , a third circuit substrate 40 is formed on the surface of the second conductive circuit layer 103 .

[0100] In this embodiment, the third circuit substrate 40 includes a second adhesive layer 401 and a fourth conductive circuit layer 402 disposed on the surface of the second adhesive layer 401. The second adhesive layer 401 is located between the fourth conductive circuit layer 402 and the second conductive circuit layer 103. In other embodiments, the third circuit substrate 40 may include multiple fourth conductive circuit layers 402. The second adhesive layer 401 is disposed between each adjacent fourth conductive circuit layer 402. In other words, the third circuit substrate 40 can be a single-layer circuit board or a multi-layer circuit board.

[0101] The second adhesive layer 401 has a second opening 41 formed therein. The second adhesive layer 401 includes a second bonding region 4011 surrounding the second opening 41. The second bonding region 4011 is not bonded to the first circuit substrate 10. The orthographic projection of the second bonding region 4011 on the fourth conductive circuit layer 402 is within the orthographic projection of the through hole 11 on the fourth conductive circuit layer 402. The second surface 302 is bonded to the second bonding region 4011.

[0102] The material of the second adhesive layer 401 may be the same as that of the first adhesive layer 201 . For details, please refer to the material of the first adhesive layer 201 , which will not be described in detail here.

[0103] Step S17, please refer to Figure 6 , a first groove 22 corresponding to the first opening 21 is opened in the second circuit substrate 20 (i.e., a cover opening step), and a second groove 42 corresponding to the second opening 41 is opened in the third circuit substrate 40 (i.e., a cover opening step), thereby exposing a portion of the first surface 301 and a portion of the second surface 302.

[0104] The first slot 22 includes the first opening 21 , and the inner diameter of the first slot 22 is equal to the inner diameter of the first opening 21 . The second slot 42 includes the second opening 41 , and the inner diameter of the second slot 42 is equal to the inner diameter of the second opening 41 .

[0105] In this embodiment, the first slot 22 sequentially penetrates the third conductive circuit layer 202 and the first adhesive layer 201 , and the second slot 42 sequentially penetrates the fourth conductive circuit layer 402 and the second adhesive layer 401 .

[0106] Step S18, please refer to Figure 7 A fourth circuit substrate 50 is formed on the surface of the third conductive circuit layer 202 .

[0107] In this embodiment, the fourth circuit substrate 50 includes a third adhesive layer 501 and a fifth conductive circuit layer 502 disposed on the surface of the third adhesive layer 501. The third adhesive layer 501 is located between the fifth conductive circuit layer 502 and the third conductive circuit layer 202. In other embodiments, the fourth circuit substrate 50 may include multiple fifth conductive circuit layers 502. The third adhesive layer 501 is disposed between each adjacent fifth conductive circuit layer 502. In other words, the fourth circuit substrate 50 can be a single-layer circuit board or a multi-layer circuit board.

[0108] The third adhesive layer 501 defines a third opening 51 , and an inner diameter of the third opening 51 is greater than an inner diameter of the first slot 22 .

[0109] The material of the third adhesive layer 501 may be the same as that of the first adhesive layer 201 . For details, please refer to the material of the first adhesive layer 201 , which will not be described in detail here.

[0110] In step S19 , a fifth circuit substrate 60 is formed on the surface of the fourth conductive circuit layer 402 .

[0111] In this embodiment, the fifth circuit substrate 60 includes a fourth adhesive layer 601 and a sixth conductive circuit layer 602 disposed on the surface of the fourth adhesive layer 601. The fourth adhesive layer 601 is located between the sixth conductive circuit layer 602 and the fourth conductive circuit layer 402. In other embodiments, the fourth circuit substrate 50 may include multiple sixth conductive circuit layers 602. The fourth adhesive layer 601 is disposed between each adjacent sixth conductive circuit layer 602. In other words, the fifth circuit substrate 60 can be a single-layer circuit board or a multi-layer circuit board.

[0112] A fourth opening 61 is defined in the fourth adhesive layer 601 , and an inner diameter of the fourth opening 61 is greater than an inner diameter of the second slot 42 .

[0113] The material of the fourth adhesive layer 601 may be the same as that of the first adhesive layer 201 . For details, please refer to the material of the first adhesive layer 201 , which will not be described in detail here.

[0114] Step S20, see Figure 8 A first solder resist layer 70 is formed on the surface of the fourth circuit substrate 50 , and a second solder resist layer 71 is formed on the surface of the fifth circuit substrate 60 .

[0115] Specifically, in this embodiment, the first solder mask layer 70 is formed on the surface of the outermost fifth conductive circuit layer 502, and the second solder mask layer 71 is formed on the surface of the outermost sixth conductive circuit layer 602. The first solder mask layer 70 is used to protect the outermost fifth conductive circuit layer 502, and the second solder mask layer 71 is used to protect the outermost sixth conductive circuit layer 602.

[0116] The first solder mask layer 70 and the second solder mask layer 71 can both be made of solder mask ink, such as green ink.

[0117] Step S21, please refer to Figure 9 , a third groove 52 corresponding to the third opening 51 is opened in the fourth circuit substrate 50 having the first solder mask layer 70 (i.e., a cover opening step), and a fourth groove 62 corresponding to the fourth opening 61 is opened in the fifth circuit substrate 60 having the second solder mask layer 71, thereby exposing part of the first surface 301 and part of the second surface 302 again.

[0118] The third slot 52 includes the third opening 51 and is in communication with the first slot 22. The fourth slot 62 includes the fourth opening 61 and is in communication with the second slot 42. The inner diameter of the third slot 52 is equal to that of the third opening 51, and the inner diameter of the fourth slot 62 is equal to that of the fourth opening 61.

[0119] The inner diameter of the third slot 52 is larger than the inner diameter of the first slot 22, so that the outermost portion of the third conductive circuit layer 202 is exposed to the third slot 52 to form a first solder pad 2021. The inner diameter of the fourth slot 62 is larger than the inner diameter of the second slot 42, so that the outermost portion of the fourth conductive circuit layer 402 is exposed to the fourth slot 62 to form a second solder pad 4021.

[0120] In this embodiment, the third slot 52 sequentially passes through the first solder mask layer 70, the fifth conductive circuit layer 502 and the third adhesive layer 501, and the fourth slot 62 sequentially passes through the second solder mask layer 71, the sixth conductive circuit layer 602 and the fourth adhesive layer 601.

[0121] Step S22, see Figure 10 , a first photosensitive chip 80 and a second photosensitive chip 81 are respectively installed on the exposed portion of the first surface 301 and the exposed portion of the second surface 302.

[0122] In step S23 , a first wire 90 and a second wire 91 are provided, the first wire 90 is electrically connected to the first photosensitive chip 80 and the first pad 2021 , and the second wire 91 is electrically connected to the second photosensitive chip 81 and the second pad 4021 .

[0123] Step S24, please refer to Figure 11 , a first packaging glue 92 is filled in the first groove 22 and the third groove 52 , and a second packaging glue 93 is filled in the second groove 42 and the fourth groove 62 , thereby obtaining the circuit board 100 .

[0124] The first packaging glue 92 and the second packaging glue 93 are both transparent glue, and the light transmittance of the transparent glue is greater than 90%.

[0125] In this embodiment, the surface of the first encapsulant 92 away from the support sheet 30 is substantially flush with the surface of the first solder mask layer 70 away from the support sheet 30, and the surface of the second encapsulant 93 away from the support sheet 30 is substantially flush with the surface of the second solder mask layer 71 away from the support sheet 30. The first encapsulant 92 is used to fix the first photosensitive chip 80 and the first wire 90, and the second encapsulant 93 is used to fix the second photosensitive chip 81 and the second wire 91.

[0126] In actual application, a first lens (not shown) and a second lens (not shown) are respectively installed on one side of the first photosensitive chip 80 and one side of the second photosensitive chip 81 of the circuit board 100, so that the first lens is opposite to the first photosensitive chip 80 and the second lens is opposite to the second photosensitive chip 81, thereby obtaining a lens module.

[0127] See also Figure 11 An embodiment of the present application also provides a circuit board 100 for a lens module, wherein the circuit board 100 includes a first circuit substrate 10, a second circuit substrate 20, a support sheet 30, a third circuit substrate 40, a fourth circuit substrate 50, a fifth circuit substrate 60, a first solder mask 70, a second solder mask 71, a first photosensitive chip 80 and a second photosensitive chip 81, a first packaging glue 92 and a second packaging glue 93.

[0128] In one embodiment, the first circuit substrate 10 includes a base layer 101 and a first conductive circuit layer 102 and a second conductive circuit layer 103 respectively disposed on two opposite surfaces of the base layer 101 .

[0129] The material of the base layer 101 can be selected from one of epoxy resin, polypropylene (PP), BT resin, polyphenylene oxide (PPO), polyimide (PI), polyethylene terephthalate (PET), and polyethylene naphthalate (PEN). In this embodiment, the material of the base layer 101 is polyimide.

[0130] A through hole 11 is defined in the first circuit substrate 10. The through hole 11 passes through the second conductive circuit layer 103, the base layer 101, and the first conductive circuit layer 102 in sequence.

[0131] The second circuit substrate 20 is located on the surface of the first conductive circuit layer 102. In this embodiment, the second circuit substrate 20 includes a first adhesive layer 201 and a third conductive circuit layer 202 disposed on the surface of the first adhesive layer 201. The first adhesive layer 201 is located between the third conductive circuit layer 202 and the first conductive circuit layer 102. In other embodiments, the second circuit substrate 20 may include multiple third conductive circuit layers 202. The first adhesive layer 201 is disposed between each adjacent third conductive circuit layer 202. In other words, the second circuit substrate 20 can be a single-layer circuit board or a multi-layer circuit board.

[0132] The first adhesive layer 201 has a first opening 21 formed therein. The first adhesive layer 201 includes a first bonding region 2011 surrounding the first opening 21. The first bonding region 2011 is not bonded to the first circuit substrate 10, and the orthographic projection of the first bonding region 2011 on the third conductive circuit layer 202 is within the range of the orthographic projection of the through hole 11 on the third conductive circuit layer 202.

[0133] The material of the first adhesive layer 201 can be selected from one of epoxy resin, polypropylene (PP), BT resin, polyphenylene oxide (PPO), polyimide (PI), polyethylene terephthalate (PET), and polyethylene naphthalate (PEN). In this embodiment, the material of the first adhesive layer 201 is polypropylene.

[0134] The support sheet 30 includes a first surface 301 and a second surface 302 that are oppositely disposed. The support sheet 30 is located in the through hole 11, and the first surface 301 is bonded to the first bonding area 2011. The thickness and width of the support sheet 30 are substantially the same as the depth and width of the through hole 11, respectively, meaning that the support sheet 30 completely fills the through hole 11.

[0135] The support sheet 30 may be a metal sheet. In this embodiment, the support sheet 30 is a steel sheet. In other embodiments, the support sheet 30 may be other metal sheets, such as an iron sheet and an aluminum sheet.

[0136] The second circuit substrate 20 is provided with a first slot 22 corresponding to the first opening 21. The first slot 22 includes the first opening 21, and the inner diameter of the first slot 22 is equal to the inner diameter of the first opening 21. In this embodiment, the first slot 22 sequentially penetrates the third conductive circuit layer 202 and the first adhesive layer 201. A portion of the first surface 301 is exposed in the first slot 22.

[0137] The third circuit substrate 40 is located on the surface of the second conductive circuit layer 103. In this embodiment, the third circuit substrate 40 includes a second adhesive layer 401 and a fourth conductive circuit layer 402 disposed on the surface of the second adhesive layer 401. The second adhesive layer 401 is located between the fourth conductive circuit layer 402 and the second conductive circuit layer 103. In other embodiments, the third circuit substrate 40 may include multiple fourth conductive circuit layers 402. The second adhesive layer 401 is disposed between each adjacent fourth conductive circuit layer 402. In other words, the third circuit substrate 40 can be a single-layer circuit board or a multi-layer circuit board.

[0138] The second adhesive layer 401 has a second opening 41 formed therein. The second adhesive layer 401 includes a second bonding region 4011 surrounding the second opening 41. The second bonding region 4011 is not bonded to the first circuit substrate 10. The orthographic projection of the second bonding region 4011 on the fourth conductive circuit layer 402 is within the orthographic projection of the through hole 11 on the fourth conductive circuit layer 402. The second surface 302 is bonded to the second bonding region 4011.

[0139] The material of the second adhesive layer 401 may be the same as that of the first adhesive layer 201 . For details, please refer to the material of the first adhesive layer 201 , which will not be described in detail here.

[0140] The third circuit substrate 40 has a second slot 42 corresponding to the second opening 41. The second slot 42 includes the second opening 41, and the inner diameter of the second slot 42 is equal to the inner diameter of the second opening 41. In this embodiment, the second slot 42 sequentially passes through the fourth conductive circuit layer 402 and the second adhesive layer 401. A portion of the second surface 302 is exposed in the second slot 42.

[0141] The fourth circuit substrate 50 is located on the surface of the third conductive circuit layer 202. In this embodiment, the fourth circuit substrate 50 includes a third adhesive layer 501 and a fifth conductive circuit layer 502 disposed on the surface of the third adhesive layer 501. The third adhesive layer 501 is located between the fifth conductive circuit layer 502 and the third conductive circuit layer 202. In other embodiments, the fourth circuit substrate 50 may include multiple fifth conductive circuit layers 502. The third adhesive layer 501 is disposed between each adjacent fifth conductive circuit layer 502. In other words, the fourth circuit substrate 50 can be a single-layer circuit board or a multi-layer circuit board.

[0142] The third adhesive layer 501 defines a third opening 51 , and an inner diameter of the third opening 51 is greater than an inner diameter of the first slot 22 .

[0143] The material of the third adhesive layer 501 may be the same as that of the first adhesive layer 201 . For details, please refer to the material of the first adhesive layer 201 , which will not be described in detail here.

[0144] The fourth circuit substrate 50 defines a third slot 52 corresponding to the third opening 51. The third slot 52 includes the third opening 51 and communicates with the first slot 22. The inner diameter of the third slot 52 is equal to that of the third opening 51. A portion of the first surface 301 is exposed in the third slot 52.

[0145] The inner diameter of the third slot 52 is greater than the inner diameter of the first slot 22 , so that a portion of the third conductive circuit layer 202 located at the outermost side is exposed to the third slot 52 to form a first pad 2021 .

[0146] The fifth circuit substrate 60 is located on the surface of the fourth conductive circuit layer 402. In this embodiment, the fifth circuit substrate 60 includes a fourth adhesive layer 601 and a sixth conductive circuit layer 602 disposed on the surface of the fourth adhesive layer 601. The fourth adhesive layer 601 is located between the sixth conductive circuit layer 602 and the fourth conductive circuit layer 402. In other embodiments, the fourth circuit substrate 50 may include multiple sixth conductive circuit layers 602. The fourth adhesive layer 601 is disposed between each adjacent sixth conductive circuit layer 602. In other words, the fifth circuit substrate 60 can be a single-layer circuit board or a multi-layer circuit board.

[0147] A fourth opening 61 is defined in the fourth adhesive layer 601 , and an inner diameter of the fourth opening 61 is greater than an inner diameter of the second slot 42 .

[0148] The material of the fourth adhesive layer 601 may be the same as that of the first adhesive layer 201 . For details, please refer to the material of the first adhesive layer 201 , which will not be described in detail here.

[0149] The fifth circuit substrate 60 defines a fourth slot 62 corresponding to the fourth opening 61. The fourth slot 62 includes the fourth opening 61 and communicates with the second slot 42. The inner diameter of the fourth slot 62 is equal to the inner diameter of the fourth opening 61. A portion of the second surface 302 is exposed in the fourth slot 62.

[0150] The inner diameter of the fourth slot 62 is greater than the inner diameter of the second slot 42 , so that a portion of the fourth conductive circuit layer 402 located at the outermost side is exposed to the fourth slot 62 to form a second pad 4021 .

[0151] The first solder mask layer 70 is located on the surface of the fourth circuit substrate 50, and the second solder mask layer 71 is located on the surface of the fifth circuit substrate 60. Specifically, in this embodiment, the first solder mask layer 70 is located on the surface of the outermost fifth conductive circuit layer 502, and the second solder mask layer 71 is located on the surface of the outermost sixth conductive circuit layer 602. The first solder mask layer 70 is used to protect the outermost fifth conductive circuit layer 502, and the second solder mask layer 71 is used to protect the outermost sixth conductive circuit layer 602.

[0152] The first solder mask layer 70 and the second solder mask layer 71 can both be made of solder mask ink, such as green ink.

[0153] In this embodiment, the third slot 52 sequentially passes through the first solder mask layer 70, the fifth conductive circuit layer 502 and the third adhesive layer 501, and the fourth slot 62 sequentially passes through the second solder mask layer 71, the sixth conductive circuit layer 602 and the fourth adhesive layer 601.

[0154] The first photosensitive chip 80 is mounted on the exposed portion of the first surface 301, and the second photosensitive chip 81 is mounted on the exposed portion of the second surface 302. The first photosensitive chip 80 is electrically connected to the first pad 2021 via a first wire 90, and the second photosensitive chip 81 is electrically connected to the second pad 4021 via a second wire 91.

[0155] The first encapsulating adhesive 92 is located in the first groove 22 and the third groove 52, and the second encapsulating adhesive 93 is located in the second groove 42 and the fourth groove 62. The first encapsulating adhesive 92 and the second encapsulating adhesive 93 are both transparent adhesives with a light transmittance greater than 90%.

[0156] In this embodiment, the surface of the first encapsulant 92 away from the support sheet 30 is substantially flush with the surface of the first solder mask layer 70 away from the support sheet 30, and the surface of the second encapsulant 93 away from the support sheet 30 is substantially flush with the surface of the second solder mask layer 71 away from the support sheet 30. The first encapsulant 92 is used to fix the first photosensitive chip 80 and the first wire 90, and the second encapsulant 93 is used to fix the second photosensitive chip 81 and the second wire 91.

[0157] In actual application, a first lens (not shown) and a second lens (not shown) are respectively installed on one side of the first photosensitive chip 80 and one side of the second photosensitive chip 81 of the circuit board 100, so that the first lens is opposite to the first photosensitive chip 80 and the second lens is opposite to the second photosensitive chip 81, thereby obtaining a lens module.

[0158] The present application saves space inside the electronic device by setting the supporting sheet 30 in the through hole 11 of the first circuit substrate 10, and respectively installing the first photosensitive chip 80 and the second photosensitive chip 81 on the first surface 301 and the second surface 302 of the supporting sheet 30 so as to install two optical lenses, thereby making the lens module prepared by the circuit board 100 have a smaller thickness.

[0159] In addition, the present application sets the first welding pad 2021 and the second welding pad 4021 in the middle layer of the circuit board 100, and sets the first wire 90 and the second wire 91 on the first welding pad 2021 and the second welding pad 4021 respectively. Compared with the prior art solution of setting the welding pad on the outermost layer of the circuit board, it is beneficial to reduce the thickness of the circuit board 100 when filling the first packaging glue 92 and the second packaging glue 93 later.

[0160] The above description is merely an optimized specific implementation of the present application, but in actual application, it cannot be limited to this implementation.

Claims

1. A method for manufacturing a circuit board for a lens module, characterized in that: include: Providing a first circuit substrate, the first circuit substrate comprising a base layer and a first conductive circuit layer and a second conductive circuit layer respectively provided on two opposite surfaces of the base layer, wherein a through hole is provided in the first circuit substrate; A second circuit substrate is formed on a surface of the first conductive circuit layer, the second circuit substrate comprising a first adhesive layer and a third conductive circuit layer disposed on a surface of the first adhesive layer, the first adhesive layer having a first opening, the first adhesive layer comprising a first bonding area surrounding the first opening, the orthographic projection of the first bonding area on the third conductive circuit layer being within the range of the orthographic projection of the through hole on the third conductive circuit layer; Providing a support sheet, the support sheet comprising a first surface and a second surface disposed opposite to each other; placing the support sheet in the through hole and bonding the first surface to the first bonding area; A third circuit substrate is formed on the surface of the second conductive circuit layer, the third circuit substrate comprising a second adhesive layer and a fourth conductive circuit layer disposed on the surface of the second adhesive layer, the second adhesive layer having a second opening, the second adhesive layer comprising a second bonding area surrounding the second opening, the orthographic projection of the second bonding area on the fourth conductive circuit layer being within the range of the orthographic projection of the through hole on the fourth conductive circuit layer, and the second surface being bonded to the second bonding area; A first groove corresponding to the first opening is formed in the second circuit substrate, and a second groove corresponding to the second opening is formed in the third circuit substrate, thereby exposing a portion of the first surface and a portion of the second surface; forming a fourth circuit substrate on the surface of the third conductive circuit layer, the fourth circuit substrate comprising a third adhesive layer and a fifth conductive circuit layer disposed on the surface of the third adhesive layer, the third adhesive layer having a third opening, the inner diameter of the third opening being larger than the inner diameter of the first groove; A fifth circuit substrate is formed on the surface of the fourth conductive circuit layer, the fifth circuit substrate comprising a fourth adhesive layer and a sixth conductive circuit layer disposed on the surface of the fourth adhesive layer, the fourth adhesive layer having a fourth opening, the inner diameter of the fourth opening being larger than the inner diameter of the second groove; A third groove corresponding to the third opening is formed in the fourth circuit substrate, and a fourth groove corresponding to the fourth opening is formed in the fifth circuit substrate, thereby exposing a portion of the first surface and a portion of the second surface again, wherein a portion of the third conductive circuit layer is exposed in the third groove to form a first solder pad, and a portion of the fourth conductive circuit layer is exposed in the fourth groove to form a second solder pad; as well as A first photosensitive chip and a second photosensitive chip are respectively installed on the exposed portion of the first surface and the portion of the second surface, and the first photosensitive chip and the second photosensitive chip are respectively electrically connected to the first welding pad and the second welding pad, thereby obtaining the circuit board.

2. The method for manufacturing a circuit board for a lens module according to claim 1, wherein: Also includes: Providing a first wire, and electrically connecting the first wire to the first photosensitive chip and the first bonding pad; as well as A second wire is provided to electrically connect the second photosensitive chip and the second bonding pad.

3. The method for manufacturing a circuit board for a lens module according to claim 2, wherein: Also includes: Filling the first groove and the third groove with a first packaging glue; as well as The second groove and the fourth groove are filled with a second packaging glue.

4. The method for manufacturing a circuit board for a lens module according to claim 1, wherein: The second circuit substrate includes a plurality of the third conductive circuit layers, and the first adhesive layer is provided between two adjacent third conductive circuit layers. The third circuit substrate includes a plurality of the fourth conductive circuit layers, and the second adhesive layer is provided between two adjacent fourth conductive circuit layers.

5. The method for manufacturing a circuit board for a lens module according to claim 4, wherein: The fourth circuit substrate includes a plurality of the fifth conductive circuit layers, and the third adhesive layer is provided between two adjacent fifth conductive circuit layers. The fifth circuit substrate includes a plurality of the sixth conductive circuit layers, and the fourth adhesive layer is provided between two adjacent sixth conductive circuit layers.

6. A circuit board for a lens module, characterized in that: include: A first circuit substrate, the first circuit substrate comprising a base layer and a first conductive circuit layer and a second conductive circuit layer respectively provided on two opposite surfaces of the base layer, wherein the first circuit substrate is provided with a through hole; a second circuit substrate, the second circuit substrate being located on a surface of the first conductive circuit layer, the second circuit substrate comprising a first adhesive layer and a third conductive circuit layer disposed on a surface of the first adhesive layer, the first adhesive layer defining a first opening, the first adhesive layer comprising a first bonding region surrounding the first opening, the orthographic projection of the first bonding region on the third conductive circuit layer being located within the range of the orthographic projection of the through hole on the third conductive circuit layer, and the second circuit substrate defining a first slot corresponding to the first opening; a support sheet, the support sheet comprising a first surface and a second surface opposite to each other, the support sheet being located in the through hole and the first surface being bonded to the first bonding area; a third circuit substrate, the third circuit substrate being located on a surface of the second conductive circuit layer, the third circuit substrate comprising a second adhesive layer and a fourth conductive circuit layer disposed on a surface of the second adhesive layer, the second adhesive layer being provided with a second opening, the second adhesive layer comprising a second bonding region surrounding the second opening, the orthographic projection of the second bonding region on the fourth conductive circuit layer being located within the range of the orthographic projection of the through hole on the fourth conductive circuit layer, the second surface being bonded to the second bonding region, and the third circuit substrate being provided with a second groove corresponding to the second opening; a fourth circuit substrate, located on a surface of the third conductive circuit layer, the fourth circuit substrate comprising a third adhesive layer and a fifth conductive circuit layer disposed on a surface of the third adhesive layer, the third adhesive layer defining a third opening, the inner diameter of the third opening being greater than the inner diameter of the first groove, the fourth circuit substrate defining a third groove corresponding to the third opening, a portion of the first surface being exposed to the first groove and the third groove, and a portion of the third conductive circuit layer being exposed to the third groove to form a first solder pad; a fifth circuit substrate, located on a surface of the fourth conductive circuit layer, the fifth circuit substrate comprising a fourth adhesive layer and a sixth conductive circuit layer disposed on a surface of the fourth adhesive layer, the fourth adhesive layer defining a fourth opening, the inner diameter of the fourth opening being greater than the inner diameter of the second groove, the fifth circuit substrate defining a fourth groove corresponding to the fourth opening, a portion of the second surface being exposed to the second groove and the fourth groove, and a portion of the fourth conductive circuit layer being exposed to the fourth groove to form a second solder pad; a first photosensitive chip, wherein the first photosensitive chip is mounted on the exposed portion of the first surface, and the first photosensitive chip is electrically connected to the first pad; as well as A second photosensitive chip is mounted on the exposed portion of the second surface, and the second photosensitive chip is electrically connected to the second pad.

7. The circuit board for a lens module according to claim 6, wherein: Also includes: a first wire, the first wire being used to electrically connect the first photosensitive chip and the first bonding pad; as well as A second wire, the second wire is used to electrically connect the second photosensitive chip and the second bonding pad.

8. The circuit board for a lens module according to claim 7, wherein: Also includes: a first packaging adhesive located in the first slot and the third slot; as well as The second packaging glue is located in the second groove and the fourth groove.

9. The circuit board for a lens module according to claim 6, wherein: The second circuit substrate includes a plurality of the third conductive circuit layers, and the first adhesive layer is provided between two adjacent third conductive circuit layers. The third circuit substrate includes a plurality of the fourth conductive circuit layers, and the second adhesive layer is provided between two adjacent fourth conductive circuit layers.

10. The circuit board for the lens module according to claim 9, wherein: The fourth circuit substrate includes a plurality of the fifth conductive circuit layers, and the third adhesive layer is provided between two adjacent fifth conductive circuit layers. The fifth circuit substrate includes a plurality of the sixth conductive circuit layers, and the fourth adhesive layer is provided between two adjacent sixth conductive circuit layers.

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