Plate-shaped connector, double-arm serial connector and chip testing assembly

Abstract

The present invention discloses a plate-shaped connector, a double-arm serial connector and a chip test assembly. The plate-shaped connector includes a plurality of double-arm serial connectors arranged at intervals from each other and an insulating layer. Each double-arm serial connector includes a carrier, a first cantilever and a second cantilever extending from the carrier and arranged in a coplanar manner, and a first top support column and a second top support column extending from the first cantilever and the second cantilever in opposite directions, respectively. The insulating layer connects the carriers of the plurality of double-arm serial connectors, and the first top support column and the second top support column of each double-arm serial connector protrude from opposite sides of the insulating layer, respectively. Each double-arm serial connector abuts against two plates, respectively, through its first top support column and the second top support column. Accordingly, the chip test assembly can be easily disassembled from each other by adopting the plate-shaped connector, so as to facilitate subsequent inspection and maintenance.

Description

Technical Field

[0001] The invention relates to a testing assembly, in particular to a plate-shaped connector and its double-arm serial connection piece and a chip testing assembly. Background Art

[0002] The conventional wafer testing device includes a testing circuit board electrically coupled to the testing machine and a signal transmission board disposed on the testing circuit board, and the signal transmission board is welded and fixed to the testing circuit board in the conventional wafer testing device. However, during the welding and fixing process of the signal transmission board and the testing circuit board, the conventional wafer testing device is easily damaged by thermal shock. Moreover, the signal transmission board and the testing circuit board welded and fixed to each other are not conducive to subsequent inspection and maintenance of the same.

[0003] Therefore, the inventors believe that the above defects can be improved, and have devoted themselves to research and applied scientific principles, and finally proposed the present invention which has a reasonable design and effectively improves the above defects. Summary of the invention

[0004] The purpose of the embodiments of the present invention is to provide a plate-shaped connector and a double-arm serial connector and a chip testing assembly, which can effectively improve the defects that may occur in the existing chip testing device.

[0005] The embodiment of the present invention discloses a chip test assembly, which includes a signal transmission board, a test circuit board and a plate-shaped connector. The signal transmission board includes a plurality of connection pads, and the signal transmission board is used to connect to a probe head; a test circuit board includes a plurality of metal pads arranged at intervals, and the test circuit board is used to electrically couple to a test machine; a plate-shaped connector is clamped between the signal transmission board and the test circuit board; wherein the plate-shaped connector includes a plurality of double-arm serial connectors and an insulating layer. The plurality of double-arm serial connectors are arranged at intervals from each other and each includes a carrier, a first cantilever and a second cantilever, a first top support column and a second top support column. A first cantilever and a second cantilever extend from the inner side wall of a carrier and are arranged in the same plane as the carrier; a first top support column is formed by extending from the first cantilever along a first direction; a second top support column is formed by extending from the second cantilever along a second direction opposite to the first direction; an insulating layer connects the carrier of a plurality of double-arm type serial connectors, and the first top support column and the second top support column of each double-arm type serial connector protrude from opposite sides of the insulating layer respectively; wherein the first top support columns of the plurality of double-arm type serial connectors respectively support a plurality of connection pads of a signal transmission board, and the second top support columns of the plurality of double-arm type serial connectors respectively support a plurality of metal pads of a test circuit board; wherein the signal transmission board and the test circuit board can be electrically coupled to each other through a plate-shaped connector.

[0006] Preferably, in any double-arm serial connector, the first cantilever includes a first lever arm portion connected to the inner side wall and a first free end portion extending from the first lever arm portion, the first top support column is integrally connected to the first free end portion, and the first top support column is spaced apart from the inner side wall portion from which it extends by a distance between 100 microns (μm) and 600 microns, and the second cantilever includes a second lever arm portion connected to the inner side wall and a second free end portion extending from the second lever arm portion, the second top support column is integrally connected to the second free end portion, and the second top support column is spaced apart from the inner side wall portion from which it extends by a distance between 100 microns and 600 microns.

[0007] Preferably, in any double-arm serial connector, the first arm portion is formed with a first adjustment hole extending from the first free end to the inner wall and penetrating therethrough, and the second arm portion is formed with a second adjustment hole extending from the second free end to the inner wall and penetrating therethrough.

[0008] Preferably, in any double-arm serial connector, the first top support column has a first thickness compared to the first free end, and the first thickness is 100% to 300% of the thickness of the first free end, and the second top support column has a second thickness compared to the second free end, and the second thickness is 100% to 300% of the thickness of the second free end.

[0009] Preferably, the chip testing assembly further includes a screw set, and the signal transmission board, the plate-shaped connector and the test circuit board are fixed through the screw set to maintain relative positions with each other; any electrical transmission path between the test circuit board, the plate-shaped connector and the signal transmission board is not achieved by any welding material.

[0010] Preferably, the insulating layer is formed with a plurality of through-holes, each double-arm serial connector includes at least one residual arm extending from the supporting body, and the free end of at least one residual arm of each double-arm serial connector is exposed in a truncated hole.

[0011] Preferably, in any double-arm serial connection member, the carrier is annular, and the first cantilever and the second cantilever are staggered with each other, so that the inner side wall of the carrier, the first cantilever and the second cantilever together surround and form an S-shaped space.

[0012] Preferably, in any double-arm type serial connector, the signal transmission board and the test circuit board are pressed against the first top support column and the second top support column of the plate-shaped connector so that the first cantilever and the second cantilever are elastically bent, and the two ends of any one of the first top support column and the second top support column protrude from opposite sides of the insulating layer respectively.

[0013] An embodiment of the present invention also discloses a plate-like connector, which is used to be clamped between two plates so that the two plates can be electrically coupled to each other. The plate-like connector includes: a plurality of double-arm type serial connectors, which are arranged at intervals from each other and each includes: a carrier; a first cantilever and a second cantilever, which extend from the inner side wall of the carrier and are arranged in the same plane as the carrier; a first top support column, which is formed by extending from the first cantilever along a first direction; and a second top support column, which is formed by extending from the second cantilever along a second direction opposite to the first direction; and an insulating layer, which connects the carriers of the plurality of double-arm type serial connectors, and the first top support column and the second top support column of each double-arm type serial connector respectively protrude from opposite sides of the insulating layer; wherein the first top support columns of the plurality of double-arm type serial connectors abut against one of the two plates, and the second top support columns of the plurality of double-arm type serial connectors abut against the other of the two plates.

[0014] An embodiment of the present invention further discloses a double-arm serial connector of a plate-like connector, which is used to clamp between two plates so that the two plates can be electrically coupled to each other, and the double-arm serial connector includes: a carrier; a first cantilever and a second cantilever, extending from the inner side wall of the carrier and arranged in the same plane as the carrier; a first top support column, formed by extending from the first cantilever along a first direction; and a second top support column, formed by extending from the second cantilever along a second direction opposite to the first direction; wherein the first top support column of the double-arm serial connector abuts against one of the two plates, and the second top support column of the double-arm serial connector abuts against the other of the two plates.

[0015] In summary, the plate-shaped connector, its double-arm serial connector, and the chip test assembly disclosed in the embodiment of the present invention use the first abutting column and the second abutting column to be respectively matched with the first cantilever and the second cantilever to elastically abut against two plates (such as the signal transmission board and the test circuit board), so there is no need to use welding. Furthermore, since the double-arm serial connector is detachably crimped to the two plates, the components of the chip test assembly can be easily disassembled from each other, so as to facilitate the subsequent inspection and maintenance of the chip test assembly.

[0016] Furthermore, in the plate-like connector and its double-arm serial connector and chip testing assembly disclosed in the embodiments of the present invention, the first cantilever and the second cantilever are structurally designed to be coplanar with the carrier, which not only helps to improve the production yield, but also when the first cantilever (or the second cantilever) is bent under force, the stress will be evenly dispersed in the first cantilever (or the second cantilever), thereby effectively reducing the probability of the first cantilever or the second cantilever breaking from the carrier.

[0017] To further understand the features and technical contents of the present invention, please refer to the following detailed description and drawings of the present invention. However, such description and drawings are only used to illustrate the present invention and are not intended to limit the protection scope of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 FIG. 4 is a cross-sectional schematic diagram of a wafer testing assembly according to an embodiment of the present invention.

[0019] Figure 2 for Figure 1 The exploded diagram of the probe head is omitted.

[0020] Figure 3 for Figure 1 An enlarged schematic diagram of site III.

[0021] Figure 4 for Figure 3 An enlarged schematic diagram of another method.

[0022] Figure 5 FIG. 4 is a schematic three-dimensional diagram of a plate-shaped connector according to an embodiment of the present invention.

[0023] Figure 6 for Figure 5 Schematic top view of .

[0024] Figure 7 for Figure 5 A partial three-dimensional schematic diagram of .

[0025] Figure 8 FIG. 1 is a three-dimensional schematic diagram of another implementation of the plate-shaped connector according to an embodiment of the present invention.

[0026] Fig. 9 It is a three-dimensional schematic diagram of another implementation manner of the plate-shaped connector according to an embodiment of the present invention.

[0027] Fig.10 FIG. 1 is a schematic top view of yet another implementation manner of the plate-shaped connector according to an embodiment of the present invention.

[0028] Fig.11 It is a three-dimensional schematic diagram of another implementation manner of the double-arm serial connection member of the plate-shaped connector according to an embodiment of the present invention. DETAILED DESCRIPTION

[0029] The following is an explanation of the implementation methods of the "plate-shaped connector and its two-arm serial connector and chip test assembly" disclosed in the present invention through specific embodiments. Those skilled in the art can understand the advantages and effects of the present invention from the contents disclosed in this specification. The present invention can be implemented or applied through other different specific embodiments, and the details in this specification can also be modified and changed in various ways based on different viewpoints and applications without departing from the concept of the present invention. In addition, the drawings of the present invention are only simple schematic illustrations and are not depicted according to actual dimensions. It is stated in advance. The following implementation methods will further explain the relevant technical contents of the present invention in detail, but the disclosed contents are not intended to limit the scope of protection of the present invention.

[0030] It should be understood that, although the terms "first", "second", "third", etc. may be used herein to describe various components or signals, these components or signals should not be limited by these terms. These terms are mainly used to distinguish one component from another component, or one signal from another signal. In addition, the term "or" used herein may include any one or more combinations of the associated listed items depending on the actual situation.

[0031] See also Figures 1 to 11 As shown, it is an embodiment of the present invention. Among them, Figures 1 to 11 The sizes and quantities of components shown in the figure are for illustration only and may be adjusted and varied according to design requirements (eg, the length of the components may be extended outwards, or the number of components may be increased) and are not limited to the figures.

[0032] like Figures 1 to 4 As shown, this embodiment discloses a chip testing assembly 100, which includes a signal transmission board (space transformer) 1, a test circuit board 2 spaced apart from the signal transmission board 1, a plate-shaped connector 3 located between the signal transmission board 1 and the test circuit board 2, a probe head 4 connected to the signal transmission board 1, and a screw set 5.

[0033] In this embodiment, the signal transmission board 1, the plate-shaped connector 3 and the test circuit board 2 are fixed by the screw group 5 to maintain relative positions with each other, so that any electrical transmission path between the test circuit board 2, the plate-shaped connector 3 and the signal transmission board 1 can be achieved without any welding material, but the present invention is not limited to this. For example, in other embodiments not shown in the present invention, the chip test assembly 100 can also omit the screw group 5 or replace the screw group 5 with other components (such as: the various components of the chip test assembly 100 are fixed by bonding).

[0034] It should be noted that, although the plate-shaped connector 3 is described in this embodiment in combination with the signal transmission board 1, the test circuit board 2, the probe head 4 and the screw group 5, the present invention is not limited thereto. For example, in other embodiments of the present invention, the plate-shaped connector 3 can also be used alone (e.g., sold) or used in combination with other components (e.g., the plate-shaped connector 3 is used to clamp between two boards so that the two boards can be electrically coupled to each other). The following will introduce the structure of each component of the chip test assembly 100 in this embodiment and its connection relationship.

[0035] like Figure 1 and Figure 2 As shown, the signal transmission board 1 has a top surface 11 and a bottom surface 12 located on opposite sides, and the top surface 11 of the signal transmission board 1 is used to connect to the probe head 4, and the bottom surface 12 of the signal transmission board 1 faces the plate-shaped connector 3. The signal transmission board 1 is provided with a plurality of connection pads 13 on the bottom surface 12, and the plurality of connection pads 13 can be electrically coupled to the probe head 4. In addition, in other embodiments not shown in the present invention, the signal transmission board 1 can also be a multi-layer structure, for example: the signal transmission board 1 can further include a functional board with an impedance matching effect.

[0036] The test circuit board 2 is used to be electrically coupled to a test machine (not shown), and the test circuit board 2 has a surface (e.g. Figure 2 The top surface of the test circuit board 2 in the figure includes a plurality of metal pads 21 arranged at intervals, and the arrangement of the plurality of metal pads 21 of the test circuit board 2 roughly corresponds to the arrangement of the plurality of connection pads 13 of the signal transmission board 1, but the present invention is not limited to this. Accordingly, the plurality of metal pads 21 are electrically coupled to the test machine to analyze the signal received by the test circuit board 2 through the test machine. It should be noted that the electrical coupling method between the test circuit board 2 and the test machine can be adjusted and changed according to design requirements. For example, in other embodiments not shown in the present invention, the test circuit board 2 can also be directly integrated into the test machine.

[0037] The plate-shaped connector 3 is clamped between the signal transmission board 1 and the test circuit board 2, so that the signal transmission board 1 and the test circuit board 2 can be electrically coupled to each other through the plate-shaped connector 3. The force of clamping the plate-shaped connector 3 by the signal transmission board 1 and the test circuit board 2 can be adjusted by the screw group 5; that is, the distance between the signal transmission board 1 and the test circuit board 2 can be adjusted by the screw group 5, so as to control the force of clamping the plate-shaped connector 3.

[0038] In more detail, Figures 2 to 4 As shown, the plate-shaped connector 3 includes a plurality of double-armed serial connectors 31 spaced apart from each other and an insulating layer 32 for fixing the plurality of double-armed serial connectors 31. It should be noted that the plate-shaped connector 3 in this embodiment is illustrated by a plurality of the double-armed serial connectors 31 in combination with the insulating layer 32, but the present invention is not limited thereto. For example, in other embodiments not shown in the present invention, the double-armed serial connector 31 may also be used alone (e.g., sold) or used in combination with other components (e.g., the double-armed serial connector 31 may be used in combination with serial connectors of different structures; or, the double-armed serial connector 31 may be used to be clamped between two plates so that the two plates can be electrically coupled to each other).

[0039] Furthermore, since the structures of the multiple double-armed serial connectors 31 are substantially the same in this embodiment, for the sake of convenience, the following only introduces the structure of one of the double-armed serial connectors 31, but the present invention is not limited thereto. For example, in other embodiments not shown in the present invention, the structures of the multiple double-armed serial connectors 31 may also be different. The following will first describe the structure of the double-armed serial connector 31 when it is not subjected to external force.

[0040] like Figures 5 to 7 As shown, the double-arm serial connector 31 is an integrally formed single-piece conductive component in this embodiment, and the outer surface of the double-arm serial connector 31 is preferably plated with a nickel-gold layer, but the present invention is not limited thereto. The double-arm serial connector 31 includes a carrier 311 in an annular shape (e.g., a square ring shape), a first cantilever 312 and a second cantilever 313 extending from the inner side wall 3111 of the carrier 311, a first top support column 314 extending from the first cantilever 312, a second top support column 315 extending from the second cantilever 313, and at least one residual arm 316 extending from the carrier 311 (outer side wall), but the present invention is not limited thereto.

[0041] For example, in other embodiments not shown in the present invention, the double-arm serial connection member 31 may also omit at least one of the residual arms 316. Figure 8 As shown, the first cantilever 312 and the second cantilever 313 are connected to the same side of the inner wall 3111; or Fig. 9 As shown, the first cantilever 312 and the second cantilever 313 are connected to the same side of the inner wall 3111, and the supporting body 311 is a non-annular structure.

[0042] It should be noted that in a corresponding case which is different from the present invention and not shown, a carrier is angularly connected to at least one inclined cantilever. When at least one of the inclined cantilever is bent by force, stress will be concentrated at the connection between at least one of the inclined cantilever and the carrier, which may easily cause at least one of the inclined cantilever to break from the above-mentioned connection.

[0043] However, in this embodiment, if Figures 5 to 7 As shown, the first cantilever 312 and the second cantilever 313 are defined to be coplanar with the carrier 311; that is, the upper surface of the first cantilever 312 and the upper surface of the second cantilever 313 are coplanar with the upper surface of the carrier 311, and the lower surface of the first cantilever 312 and the lower surface of the second cantilever 313 are coplanar with the lower surface of the carrier 311.

[0044] Accordingly, the first cantilever 312 and the second cantilever 313 in this embodiment are designed to be coplanar with the carrier 311, which not only helps to improve the production yield, but also when the first cantilever 312 (or the second cantilever 313) is bent by force, the stress will be evenly distributed in the first cantilever 312 (or the second cantilever 313), thereby effectively reducing the probability of the first cantilever 312 or the second cantilever 313 breaking from the carrier 311. In other words, any cantilever that is not coplanar with the carrier is different from the first cantilever 312 or the second cantilever 313 referred to in this embodiment.

[0045] In more detail, Figures 5 to 7 As shown, the first cantilever 312 and the second cantilever 313 are staggered with each other in this embodiment (e.g., the first cantilever 312 and the second cantilever 313 are respectively connected to the opposite sides of the inner wall 3111), so that the inner wall 3111 of the carrier 311, the first cantilever 312 and the second cantilever 313 together surround and form an S-shaped space 317. That is to say, the first cantilever 312, the second cantilever 313 and the carrier 311 in this embodiment can be arranged in approximately 180 rotational symmetry (2-fold rotational symmetry), but the present invention is not limited thereto. For example, in other embodiments not shown in the present invention, the first cantilever 312 and the second cantilever 313 can have different lengths according to design requirements; or, as Fig.10 As shown, the space surrounded by the inner wall 3111 , the first cantilever 312 and the second cantilever 313 is not S-shaped.

[0046] Furthermore, if Figures 5 to 7As shown, the first top support column 314 is formed by extending from (the upper surface of) the first cantilever 312 along a first direction D1, and the second top support column 315 is formed by extending from (the lower surface of) the second cantilever 313 along a second direction D2 opposite to the first direction D1, and the outer shape of the first top support column 314 and the outer shape of the second top support column 315 are substantially equal in this embodiment, but the present invention is not limited to this.

[0047] Further, in order to enable the double-armed serial connector 31 to correspond to the signal transmission board 1 and the test circuit board 2, and to have better mechanical properties and electrical transmission effects, the double-armed serial connector 31 preferably meets at least one of the following conditions, but the present invention is not limited thereto. That is to say, in other embodiments not shown in the present invention, the double-armed serial connector 31 may not meet any of the following conditions.

[0048] The first cantilever 312 has an equal thickness and includes a first lever portion 3121 connected to the inner side wall 3111 and a first free end portion 3122 extending from the first lever portion 3121, and the first lever portion 3121 is formed with a first adjustment hole 3123 extending from the first free end portion 3122 to the inner side wall 3111 and penetrating, but the present invention is not limited thereto. For example, in other embodiments not shown in the present invention, the first adjustment hole 3123 may also be separated from the first free end portion 3122 (or the inner side wall 3111) by a distance.

[0049] Accordingly, the first arm portion 3121 is divided into two arms by the first adjustment hole 3123, thereby providing a better balance for the first free end portion 3122. Furthermore, the first arm portion 3121 can effectively control the elasticity performance it can provide by changing the size and shape of the first adjustment hole 3123, thereby meeting different design requirements.

[0050] The first top support column 314 is integrally connected to the first free end portion 3122, and the first top support column 314 is spaced from the inner side wall 3111 where it extends by a distance D314 ranging from 100 μm to 600 μm; that is, the length of the first force arm portion 3121 can be approximately between 100 μm and 600 μm, but the present invention is not limited thereto. Furthermore, the first top support column 314 has a first thickness T1 compared to the first free end portion 3122, and the first thickness T1 is 100% to 300% of the thickness T3122 of the first free end portion 3122.

[0051] The second cantilever 313 has an equal thickness and includes a second lever portion 3131 connected to the inner side wall 3111 and a second free end portion 3132 extending from the second lever portion 3131. The second lever portion 3131 is formed with a second adjustment hole 3133 extending from the second free end portion 3132 to the inner side wall 3111 and penetrating therethrough, but the present invention is not limited thereto. For example, in other embodiments not shown in the present invention, the second adjustment hole 3133 may also be separated from the second free end portion 3132 (or the inner side wall 3111) by a distance.

[0052] Accordingly, the second arm portion 3131 is divided into two arms by the second adjustment hole 3133, thereby providing a better balance for the second free end portion 3132. Furthermore, the second arm portion 3131 can effectively control the elasticity performance it can provide by changing the size and shape of the second adjustment hole 3133, thereby meeting different design requirements.

[0053] The second top support column 315 is integrally connected to the second free end portion 3132, and the second top support column 315 is separated from the inner side wall 3111 from which it extends by a distance D315 ranging from 100 microns to 600 microns; that is, the length of the second force arm portion 3131 can be approximately between 100 microns and 600 microns, but the present invention is not limited thereto. The second top support column 315 has a second thickness T2 compared to the second free end portion 3132, and the second thickness T2 is 100% to 300% of the thickness T3132 of the second free end portion 3132.

[0054] In addition, the double-arm serial connector 31 can be respectively pressed against two boards (such as the signal transmission board 1 and the test circuit board 2) through the first pressing column 314 and the second pressing column 315, and the end edge of the first pressing column 314 and the end edge of the second pressing column 315 used to press against the above two boards are arc surfaces in this embodiment, but they can be adjusted and changed according to design requirements and are not limited to this embodiment. For example, in other embodiments not shown in the present invention, the end edge of the first pressing column 314 (or the second pressing column 315) can be a slope; or, as Fig.11 As shown, the end edge of the first abutting column 314 (or the second abutting column 315) may include a plurality of protrusion structures.

[0055] In this embodiment, the insulating layer 32 is made of a high temperature resistant material, for example, the insulating layer 32 can be made of plastic that can withstand temperatures above 300 degrees Celsius. The insulating layer 32 connects the carrier 311 and the residual arm 316 of each of the two-arm serial connectors 31. In this embodiment, the insulating layer 32 can be connected to the carrier 311 and the residual arm 316 of each of the two-arm serial connectors 31 by molding or gluing, so that at least a portion of the carrier 311 of each of the two-arm serial connectors 31 and the residual arm 316 are equivalent to being buried in the insulating layer 32. Furthermore, the first top support column 314 and the second top support column 315 of each of the two-arm serial connectors 31 can protrude from opposite sides of the insulating layer 32, respectively.

[0056] In more detail, the insulating layer 32 is formed with a plurality of through-shaped cut-off holes 321, and there is one cut-off hole 321 between any two adjacent two-arm serial connectors 31, and the free end of at least one residual arm 316 of each two-arm serial connector 31 is exposed in one cut-off hole 321. In other words, before the plurality of cut-off holes 321 are formed in the insulating layer 32 of the plate-shaped connector 3, at least two residual arms 316 of any two adjacent two-arm serial connectors 31 are connected to each other, so as to facilitate the production of a plurality of two-arm serial connectors 31; and then, by forming a plurality of cut-off holes 321 in the insulating layer 32, at least two residual arms 316 of any two adjacent two-arm serial connectors 31 are disconnected from each other and can be electrically isolated from each other.

[0057] The above is a structural description of the signal transmission board 1, the test circuit board 2 and the plate-shaped connector 3. The following is an introduction to the connection relationship between the signal transmission board 1, the test circuit board 2 and the plate-shaped connector 3. Among them, the first abutting columns 314 of the multiple double-armed serial connectors 31 respectively abut against the multiple connection pads 13 of the signal transmission board 1, and the second abutting columns 315 of the multiple double-armed serial connectors 31 respectively abut against the multiple metal pads 21 of the test circuit board 2. In other words, the first abutting column 314 of any double-armed serial connector 31 abuts against one of the two plates, and the second abutting column 315 of any double-armed serial connector 31 abuts against the other of the two plates.

[0058] Furthermore, in any of the double-arm serial connectors 31 of the present embodiment, the signal transmission board 1 and the test circuit board 2 are pressed against the first top support column 314 and the second top support column 315 of the plate-shaped connector 3, so that the first cantilever 312 and the second cantilever 313 are elastically bent, and the two ends of any one of the first top support column 314 and the second top support column 315 protrude from the opposite sides of the insulating layer 32 (e.g., Figure 4 ), thereby effectively reducing the overall thickness of the plate-shaped connector 3, but the present invention is not limited thereto. For example, the force of the plate-shaped connector 3 being pressed by the signal transmission board 1 and the test circuit board 2 can be adjusted according to design requirements (e.g.: Figure 3 ).

[0059] like Figure 1 As shown, the probe head 4 is disposed on the top surface 11 of the signal transmission board 1, and the probe head 4 can be electrically coupled to the test circuit board 2 through the signal transmission board 1 and the plate-shaped connector 3. The probe head 4 includes a positioning seat 41 and a plurality of conductive probes 42 passing through and set in the positioning seat 41. One end of each conductive probe 42 (e.g.: Figure 1 The bottom end of the conductive probe 42 in the conductive probe 42 passes through the positioning seat 41 and abuts against the top surface 11 of the signal transmission board 1, and the other end of each conductive probe 42 (such as: Figure 1 The top end of the conductive probe 42 in the conductive probe 42 passes through the positioning base 41 and is used to abut against an object to be tested (such as a semiconductor chip).

[0060] It should be noted that the conductive probe 42 in this embodiment is a conductive and flexible long strip structure, but the conductive probe 42 of the present invention is not limited to a rectangular conductive probe, a circular conductive probe, or a conductive probe of other structures. In addition, the probe head 4 in this embodiment is described as a vertical probe head, but the specific structure of the probe head 4 can be adjusted and changed according to design requirements, and the present invention is not limited here.

[0061] [Technical Effects of Embodiments of the Invention]

[0062] In summary, in the plate-shaped connector and its double-arm serial connector and the chip test assembly disclosed in the embodiment of the present invention, the first abutting column and the second abutting column are respectively matched with the first cantilever and the second cantilever to elastically abut against two plates (such as the signal transmission board and the test circuit board), so there is no need to use welding. Furthermore, since the double-arm serial connector is detachably crimped to the two plates, the components of the chip test assembly can be easily disassembled from each other, so as to facilitate the subsequent inspection and maintenance of the chip test assembly.

[0063] Furthermore, in the plate-like connector and its double-arm serial connector and chip testing assembly disclosed in the embodiments of the present invention, the first cantilever and the second cantilever are structurally designed to be coplanar with the carrier, which not only helps to improve the production yield, but also when the first cantilever (or the second cantilever) is bent under force, the stress will be evenly dispersed in the first cantilever (or the second cantilever), thereby effectively reducing the probability of the first cantilever or the second cantilever breaking from the carrier.

[0064] The contents disclosed above are only preferred feasible embodiments of the present invention, and are not intended to limit the patent scope of the present invention. Therefore, all equivalent technical changes made using the contents of the present invention description and drawings are included in the patent scope of the present invention.

Claims

1. A wafer testing assembly, characterized in that: The wafer testing assembly comprises: a signal transmission board including a plurality of connection pads, and the signal transmission board is used to connect to a probe head; A test circuit board includes a plurality of metal pads arranged at intervals, and the test circuit board is used to be electrically coupled to a test machine; and A plate-shaped connector, clamped between the signal transmission board and the test circuit board; wherein the plate-shaped connector includes: A plurality of double-arm serial connection members are arranged at intervals from each other and each comprises: a carrier; A first cantilever and a second cantilever extend from the inner side wall of the carrier and are arranged in the same plane as the carrier; a first abutment column, formed by extending from the first cantilever along a first direction; and a second abutment post extending from the second cantilever along a second direction opposite to the first direction; and An insulating layer, connecting the carriers of the plurality of double-arm serial connectors, wherein the first top support column and the second top support column of each double-arm serial connector protrude from opposite sides of the insulating layer respectively; Wherein, the first abutting columns of the plurality of double-armed serial connectors respectively abut against the plurality of connection pads of the signal transmission board, and the second abutting columns of the plurality of double-armed serial connectors respectively abut against the plurality of metal pads of the test circuit board; The signal transmission board and the test circuit board can be electrically coupled to each other through the plate-shaped connector.

2. The wafer testing assembly according to claim 1, characterized in that: In any of the double-arm serial connectors, the first cantilever includes a first force arm portion connected to the inner side wall and a first free end portion extending from the first force arm portion, the first top support column is integrally connected to the first free end portion, and the first top support column is spaced apart from the inner side wall portion to which it extends by a distance between 100 microns and 600 microns, and the second cantilever includes a second force arm portion connected to the inner side wall and a second free end portion extending from the second force arm portion, the second top support column is integrally connected to the second free end portion, and the second top support column is spaced apart from the inner side wall portion to which it extends by a distance between 100 microns and 600 microns.

3. The wafer testing assembly according to claim 2, characterized in that: In any of the double-arm serial connectors, the first arm portion is formed with a first adjustment hole extending from the first free end portion to the inner side wall and penetrating therethrough, and the second arm portion is formed with a second adjustment hole extending from the second free end portion to the inner side wall and penetrating therethrough.

4. The wafer testing assembly according to claim 2, wherein: In any of the double-arm serial connectors, the first top support column has a first thickness compared to the first free end, and the first thickness is 100% to 300% of the thickness of the first free end; the second top support column has a second thickness compared to the second free end, and the second thickness is 100% to 300% of the thickness of the second free end.

5. The wafer testing assembly according to claim 1, wherein: The chip testing assembly further includes a screw set, and the signal transmission board, the plate-shaped connector and the test circuit board are fixed through the screw set to maintain relative positions with each other; any electrical transmission path between the test circuit board, the plate-shaped connector and the signal transmission board is not achieved by any welding material.

6. The wafer testing assembly according to claim 1, wherein: The insulating layer is formed with a plurality of through-shaped cut-off holes, each of the two-arm serial connectors includes at least one residual arm extending from the carrier, and a free end of at least one residual arm of each of the two-arm serial connectors is exposed in one of the cut-off holes.

7. The wafer testing assembly according to claim 1, wherein: In any of the double-arm serial connectors, the carrier is annular, and the first cantilever and the second cantilever are staggered with each other so that the inner side wall of the carrier, the first cantilever and the second cantilever together surround an S-shaped space.

8. The wafer testing assembly according to claim 1, wherein: In any one of the double-arm serial connectors, the signal transmission board and the test circuit board are pressed against the first top support column and the second top support column of the plate-shaped connector so that the first cantilever and the second cantilever are elastically bent, and the two ends of any one of the first top support column and the second top support column protrude from the opposite sides of the insulating layer respectively.

9. A plate-shaped connector, characterized in that: The plate-shaped connector is used to be clamped between two plates so that the two plates can be electrically coupled to each other, and the plate-shaped connector includes: A plurality of double-arm serial connection members are arranged at intervals from each other and each comprises: a carrier; A first cantilever and a second cantilever extend from the inner side wall of the carrier and are arranged in the same plane as the carrier; a first abutment column, formed by extending from the first cantilever along a first direction; and a second abutment post extending from the second cantilever along a second direction opposite to the first direction; and An insulating layer, connecting the carriers of the plurality of double-arm serial connectors, wherein the first top support column and the second top support column of each double-arm serial connector protrude from opposite sides of the insulating layer respectively; Wherein, the first abutting columns of the plurality of double-arm serial connectors abut against one of the two plates, and the second abutting columns of the plurality of double-arm serial connectors abut against the other of the two plates.

10. A double-arm serial connector of a plate-shaped connector, characterized in that: The double-arm serial connector of the plate-shaped connector is used to be clamped between two plates so that the two plates can be electrically coupled to each other. The double-arm serial connector includes: a carrier; A first cantilever and a second cantilever extend from the inner side wall of the carrier and are arranged in the same plane as the carrier; a first abutting post extending from the first cantilever along a first direction; and A second abutment column extending from the second cantilever along a second direction opposite to the first direction; Wherein, the first abutting column of the double-arm serial connector abuts against one of the two plates, and the second abutting column of the double-arm serial connector abuts against the other of the two plates.

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