Image sensor driving device, camera device and electronic equipment

Abstract

The present invention provides an image sensor driving device, a camera device and an electronic device capable of suppressing the temperature rise of a movable part. The image sensor driving device (100) comprises: a fixed part including a frame, the interior of the frame having a storage space; a movable part accommodated in the storage space, fixing an image sensor part and supported by a supporting mechanism to be movable relative to the fixed part; and an FPC (8) connecting the outside of the frame with the image sensor part, a heat transfer sheet (200) being attached to the FPC (8), and the heat transfer sheet (200) being in contact with the frame.

Description

Technical Field

[0001] The present invention relates to an image sensor driving device, a camera device and an electronic device used in electronic devices such as smart phones. Background Art

[0002] A camera device having a sensor shift OIS (Optical Image Stabilization) function includes an AF unit (auto focus unit) that moves a lens along its optical axis and an OIS unit that moves an image sensor in a plane orthogonal to the optical axis.

[0003] Prior art literature

[0004] Patent Literature

[0005] Patent document 1: Chinese Patent Application Publication No. 112415708. Summary of the invention

[0006] (Problems to be solved by the invention)

[0007] In the OIS section of the above-mentioned conventional camera device, the heat generating element such as the image sensor is arranged on a movable part supported by a suspension wire, and the movable part is not in direct contact with the fixed part, i.e., the frame. Therefore, in the conventional image sensor driving device for driving the image sensor, there is a problem that heat is difficult to dissipate from the movable part supporting the heat generating element, and the temperature of the movable part is easy to rise.

[0008] An object of the present invention is to provide an image sensor driving device, a camera device, and an electronic device capable of suppressing a temperature rise in a movable portion.

[0009] (Solutions to solve problems)

[0010] In order to solve the above-mentioned problems, as a preferred embodiment of the present invention, an image sensor driving device is characterized in that it includes: a fixed part including a frame, the frame having a shell and a bottom cover combined with the shell and having a storage space inside; and a movable part, which is stored in the storage space and has a sensor substrate and a flexible printed circuit for fixing the image sensor, and is supported by a support mechanism so as to be movable relative to the fixed part; the FPC (flexible printed circuit) has: a bottom part for fixing the sensor substrate, a side part that rises vertically from the edge of the bottom part and extends horizontally, and an external connection part that is bent at the end of the side part and extends outward, and electrically connects the outside of the frame with the sensor substrate, the support mechanism has a suspension wire, the front end of the suspension wire is fixed to the fixed part, and the rear end is fixed to the movable part, so as to suspend the movable part, the front face of the bottom face of the flexible printed circuit is fixed to the rear face of the coil substrate, the front peripheral edge of the sensor substrate and the Hall IC are fixed to the rear face of the bottom face, the coil substrate is provided with a coil, and the Hall IC is used to make current flow through the wire A driving power source for the coil, a heat transfer sheet is attached to the FPC, the heat transfer sheet having a first heat transfer sheet and a second heat transfer sheet formed of graphite, silicone, propylene or polyolefin, the first heat transfer sheet is attached so as to extend continuously from the outer side surface of the side surface of the flexible printed circuit adjacent to the bottom surface portion to the front of the external connection portion without interruption, and the first heat transfer sheet is attached so as to cover the sensor substrate and the Hall IC in a manner of extending continuously from the outer side surface of the side surface portion without interruption, and the first heat transfer sheet at the boundary area between the outer side surface of the side surface portion and the front of the external connection portion contacts the shell of the frame, the second heat transfer sheet is attached so as to extend continuously from the inner side surface of the side surface portion of the flexible printed circuit adjacent to the bottom surface portion to the rear of the external connection portion, and the second heat transfer sheet is attached so as to cover the front of the coil substrate in a manner of extending continuously from the inner side surface of the side surface portion without interruption, and the second heat transfer sheet at the boundary area between the inner side surface of the side surface portion and the rear of the external connection portion contacts the bottom cover of the frame.

[0011] In this method, a coil substrate and a Hall IC are fixed to the bottom portion of the FPC, a coil is arranged on the coil substrate, the Hall IC is a driving power source for causing current to flow through the coil, the heat transfer sheet is in contact with at least one of the coil substrate and the Hall IC, and is continuously connected to the external connection portion via the side portion, and the heat transfer sheet is in contact with the frame.

[0012] Furthermore, the heat transfer sheet may extend beyond the FPC on the bottom surface side of the sensor substrate to be in contact with the bottom surface of the sensor substrate.

[0013] In addition, the heat transfer sheet may also be attached to both sides of the FPC.

[0014] The device may further include a coil portion and a driving power source, wherein the coil portion and the driving power source for supplying current to the coil portion are fixed to the movable portion, and the heat transfer sheet extends beyond the FPC and contacts at least one of the coil portion and the driving power source.

[0015] In addition, the sensor substrate may not be in contact with the bottom cover of the frame body.

[0016] Furthermore, the supporting mechanism may include a suspension wire, a front end of which is fixed to the fixed portion, and a rear end of which is fixed to the movable portion, so as to suspend the movable portion.

[0017] A camera device as another preferred embodiment of the present invention is characterized by comprising: the above-mentioned image sensor driving device; and a lens driving device fixed to the fixing portion to focus light from a photographic subject and incident on the image sensor.

[0018] In this aspect, the lens driving device may be fixed to a front portion in the storage space, and the movable portion may be arranged directly behind the lens driving device in a non-contact manner with the lens driving device.

[0019] An electronic device as another preferred embodiment of the present invention is characterized by including the above-mentioned camera device.

[0020] (Effects of the Invention)

[0021] The image sensor driving device according to the present invention comprises: a fixed part including a frame, the interior of the frame having a storage space; a movable part, which is stored in the storage space and fixes the image sensor part, and is supported by a support mechanism so as to be movable relative to the fixed part; and an FPC, which connects the outside of the frame with the image sensor part, and a heat transfer sheet is attached to the FPC, and the heat transfer sheet is in contact with the frame. Therefore, according to the present invention, the heat transfer sheet attached to the FPC and in contact with the frame can efficiently dissipate the heat generated in the movable part to the frame, thereby suppressing the temperature rise of the movable part. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 1 is a front view of a smartphone 109 equipped with a camera device 101 including an image sensor driving device 100 according to an embodiment of the present invention.

[0023] Figure 2 yes Figure 1 A stereoscopic view of the camera device 101.

[0024] Figure 3 yes Figure 2 An exploded perspective view of the camera device 101.

[0025] Figure 4 yes Figure 3 A three-dimensional view of FPC 8 and sensor substrate 9.

[0026] Figure 5 Viewed from another direction Figure 3 A three-dimensional view of FPC 8 and sensor substrate 9.

[0027] Figure 6 yes Figure 1 A rear perspective view of the camera device 101. DETAILED DESCRIPTION

[0028] like Figure 1 As shown, a camera device 101 including an image sensor driving device 100 as an embodiment of the present invention is accommodated in a frame of a smart phone 109. The camera device 101 has a lens driving device 102, an image sensor 107, and the image sensor driving device 100. The lens driving device 102 has a lens body 110, and performs AF (Auto Focus) control by driving the lens body 110 in a direction parallel to the optical axis. That is, the light from the photographed object and incident on the image sensor 107 is focused. The image sensor 107 converts the light guided through the lens body 110 into an image signal and outputs it. The image sensor driving device 100 fixes the lens driving device 102 and drives the image sensor 107 in a direction orthogonal to the optical axis of the lens body 110 of the lens driving device 102 and in a direction rotating around the optical axis.

[0029] Hereinafter, the structure of the image sensor driving device 100 is described by setting an XYZ orthogonal coordinate system consisting of a Z axis parallel to the optical axis direction of the lens body 110 and an X axis and a Y axis orthogonal to each other and to the Z axis. In addition, in the following description, the +Z side on the side of the photographic object viewed from the lens body 110 is sometimes referred to as the front side, and the -Z side on the opposite side (the image sensor 107 side) is sometimes referred to as the rear side.

[0030] like Figure 2As shown, the image sensor driving device 100 has a housing 1 that is roughly in the shape of a rectangular parallelepiped. The housing 1 can also be formed of metal. A rectangular through hole 1b is provided on the front side wall 1a (the surface on the +Z side) of the housing 1. The lens driving device 102 is accommodated in the housing 1 in a manner exposed from the through hole 1b. An FPC (Flexible printed circuits) 1021 is connected to the lens driving device 102. The FPC 1021 is led out from the rear end of the lens driving device 102 through the through hole 1b to the outside of the housing 1, extends along the front side wall 1a of the housing 1 to the -Y side end of the housing 1, bends to the -Z side and extends to the -Z side end of the housing 1, and then bends to the -Y side and is led out to the -Y side. The driving part that drives the lens body 110 in the lens driving device 102 is powered via the FPC 1021.

[0031] like Figure 3 As shown, the image sensor driving device 100 includes: a housing 1, two support leaf springs 2, a holder 3, four suspension wires 4, a support plate 5, four magnets 6, a coil substrate 7, an FPC 8, a sensor substrate 9 supporting the image sensor 107, and a flat bottom cover 10. The housing 1 and the bottom cover 10 are combined to form a frame, and the rear end of the side wall of the housing 1 and the peripheral edge of the bottom cover 10 are fixed to each other. The frame is formed with a storage space for accommodating the support leaf spring 2, the holder 3, the suspension wire 4, the support plate 5, the magnet 6, the coil substrate 7, the FPC 8, and the sensor substrate 9. The bottom cover 10 has two notch portions 10a, which are combined with the housing 1 to form a slit, and the slit has the minimum size required to lead the FPC 8 from the inside of the storage space to the outside. The bottom cover 10 can also be formed of metal.

[0032] The housing 1, bottom cover 10, holder 3, support plate 5 and magnet 6 constitute the fixed part, and the coil substrate 7, FPC 8 and sensor substrate 9 constitute the movable part. The support leaf spring 2 and suspension wire 4 connect the fixed part and the movable part, forming a support mechanism that supports the movable part to be movable relative to the fixed part.

[0033] The holder 3 is a square frame, and its front end face is fixed to the rear of the front side wall 1a of the housing 1. When viewed from the optical axis direction, the through hole 1b of the housing 1 is roughly consistent with the space on the inner circumference of the holder 3. The lens driving device 102 is accommodated and fixed in the space on the inner circumference of the holder 3. The outer peripheral portion of the front end of the holder 3 is formed with a surface one level lower than the front end face, and the support leaf spring 2 is fixed here.

[0034] A support plate 5 having a substantially square shape and a circular through hole 5a is fixed to the rear of the holder 3. The through hole 5a allows light passing through the lens body 110 of the lens driving device 102 to pass through. In each of the four sides of the rear of the support plate 5, an elongated magnet 6 is fixed along each side.

[0035] The coil substrate 7 as the coil portion is a substantially square substrate having a substantially square through hole. Two coils 7a are arranged on each of the four sides of the coil substrate 7 to face the magnet 6. The coil portion may be a portion where the coils 7a are simply arranged at predetermined positions.

[0036] FPC8 has a bottom portion 8a, side portions 8b1 and 8b2, and external connection portions 8c1 and 8c2. The bottom portion 8a is in a roughly square shape with a through hole 8a1 formed in a roughly square shape. The side portions 8b1 and 8b2 rise vertically from the edge of the bottom portion 8a, extend horizontally in the X direction in a manner of surrounding the bottom portion 8a, and further extend horizontally in the Y direction. The external connection portions 8c1 and 8c2 are bent at the ends of the side portions 8b1 and 8b2 and extend outward. FPC8 extends to the outside of the frame between the side portion 8b1 and the external connection portion 8c1 and between the side portion 8b2 and the external connection portion 8c2. The group of the side portion 8b1 and the external connection portion 8c1 and the group of the side portion 8b2 and the external connection portion 8c2 are arranged point-symmetrically.

[0037] Connectors 8e1 and 8e2 are arranged behind the external connection parts 8c1 and 8c2. These connectors 8e1 and 8e2 are electrically connected to the image sensor 107 via FPC8. The external control circuit not shown in the figure supplies power to the image sensor 107 via the connectors 8e1 and 8e2, and obtains image signals from the image sensor 107. The front of the bottom part 8a of FPC8 is fixed to the back of the coil substrate 7, and the coil substrate 7 is electrically connected to FPC8. In addition, a Hall IC20 is provided behind the bottom part 8a, and the Hall IC20 is a driving power supply for causing current to flow through the coil 7a. The Hall IC20 is a driving power supply and also a driver IC.

[0038] The image sensor 107 is fixed to the front center of the sensor substrate 9 to form the image sensor section. The front peripheral edge of the sensor substrate 9 is fixed to the rear of the bottom surface 8a of the FPC 8 in a state where the image sensor 107 is exposed from the through hole 8a1 and is electrically connected to the FPC 8. The sensor substrate 9 is formed in a shape that avoids the Hall IC 20. In addition, a heat sink 9a is provided at the rear of the sensor substrate 9. In this way, in the movable section, the coil substrate 7, the bottom surface 8a of the FPC 8, and the sensor substrate 9 are fixed to each other.

[0039] The support leaf spring 2 has a generally square shape and has through holes at the four corners. In addition, the portion corresponding to the central portion of each side is fixed to the retaining frame 3, and the other portion floats in the air because the retaining frame 3 is hollowed out inward. In addition, the coil substrate 7 has through holes at the four corners. The suspension wires 4 are inserted into the through holes of the support leaf spring 2 and the coil substrate 7, respectively. That is, the front end of the suspension wire 4 is inserted into the through hole of the support leaf spring 2 and fixed by welding. The rear end of the suspension wire 4 is inserted into the through hole of the sensor substrate 9 and fixed by welding. In this way, the movable portion supporting the image sensor 107 is supported on the fixed portion via the four suspension wires 4 and the two support leaf springs 2. The movable portion is arranged on the rear side of the lens driving device 102 in a non-contact manner with the lens driving device 102, and the sensor substrate 9 of the image sensor portion does not contact the bottom cover 10. Therefore, the movable portion can move relative to the housing 1.

[0040] The Hall IC 20 is electrically connected to the coil 7a of the coil substrate 7 via the FPC 8. The Hall IC 20 detects the relative position of the movable part with respect to the fixed part by detecting the magnetic field generated by the magnet 6 through the built-in Hall element. Moreover, based on the detection result, the Hall IC 20 controls the current flowing through the coil 7a of the coil substrate 7, thereby performing OIS control. One Hall IC 20 is provided corresponding to the two coils 7a facing each other across the through hole of the coil substrate 7. The Hall IC 20 is arranged directly behind any one of the two coils 7a facing each other across the through hole of the coil substrate 7.

[0041] Here, the image sensor 107, the Hall IC 20 and the coil 7a of the coil substrate 7 are heating elements. The heating element is thermally connected to the frame through the suspension wire 4, the FPC 8 and the air, but the heat generated is difficult to dissipate, which easily causes the temperature to rise. Therefore, in this embodiment, in order to make it easy for the heat to dissipate from the heating element, a heat transfer sheet 200 is attached to the FPC 8 and is in contact with the frame. The heat transfer sheet 200 is a sheet with excellent thermal conductivity such as a graphite sheet. The heat transfer sheet 200 can also be formed of a resin such as silicone, propylene, polyolefin, etc. In addition, ceramic fillers or metal fillers can also be mixed. In addition, the heat transfer sheet 200 is preferably flexible and has excellent adhesion.

[0042] In FPC 8, the front of bottom portion 8a, the inner side of side portions 8b1 and 8b2, and the rear of external connection portions 8c1 and 8b2 form a continuous surface. In addition, the rear of bottom portion 8a, the outer side of side portions 8b1 and 8b2, and the front of external connection portions 8c1 and 8b2 form a continuous surface. In this embodiment, heat transfer sheet 200 is attached so as to be continuous and uninterrupted from the inner side of side portions 8b1 and 8b2 adjacent to bottom portion 8a to the rear of external connection portions 8c1 and 8b2. The heat transfer sheet 200 is attached to almost the entire inner side of side portions 8b1 and 8b2, and is attached to the front of connectors 8e1 and 8e2 on the rear of external connection portions 8c1 and 8b2. In addition, since coil substrate 7 is fixed to the front of bottom portion 8a, heat transfer sheet 200 is attached so as to cover the front of coil substrate 7 in a continuous and uninterrupted manner from the inner side of side portions 8b1 and 8b2. In this case, the effect can be seen even if heat transfer sheet 200 is simply attached so as to be in contact with coil substrate 7 .

[0043] In addition, the heat transfer sheet 200 is attached so as to be continuous from the adjacent part of the outer side surface of the side surface 8b1 and 8b2 to the front of the external connection part 8c1 and 8b2 without interruption. The outer side surface of the side surface 8b1 and 8b2 is attached to almost the entire surface, and the front end of the external connection part 8c1 and 8b2 is attached. In addition, the sensor substrate 9 and the Hall IC 20 are fixed to the back of the bottom surface 8a, so the heat transfer sheet 200 is attached so as to cover the sensor substrate 9 and the Hall IC 20 without interruption from the outer side surface of the side surface 8b1 and 8b2. In this case, the effect can also be seen by attaching the heat transfer sheet 200 in a manner of contacting at least one of the sensor substrate 9 and the Hall IC 20. In addition, it is preferably attached in a manner of contacting the heat sink 9a of the sensor substrate 9. The heat transfer sheet 200 is manufactured as a whole in accordance with the shape of the FPC 8, so it is not necessary to attach it to the FPC 8. For example, in this embodiment, a plurality of substantially rectangular heat transfer sheets 200 are slightly overlapped with each other and attached in an uninterrupted and continuous manner.

[0044] In this embodiment, when the FPC 8 is housed in the frame, the heat transfer sheet 200 located in the boundary area between the outer side surface of the side surface 8b1 and the front of the external connection portion 8c1, and the heat transfer sheet 200 located in the boundary area between the outer side surface of the side surface 8b2 and the front of the external connection portion 8c2 are in contact with the housing 1. In addition, the heat transfer sheet 200 located in the boundary area between the inner side surface of the side surface 8b1 and the rear of the external connection portion 8c1, and the heat transfer sheet 200 located in the boundary area between the inner side surface of the side surface 8b2 and the rear of the external connection portion 8c2 are in contact with the bottom cover 10. Therefore, the heat generated by the image sensor 107, the Hall IC 20, and the coil 7a is dissipated to the housing 1 and the bottom cover 10 through the contact portion between the heat transfer sheet 200, the housing 1, and the bottom cover 10. The heat dissipated to the housing 1 is further dissipated to the bottom cover 10, and the heat dissipated to the bottom cover 10 escapes to the main body of the smartphone 109. Therefore, the temperature rise caused by the heat generated by the active part can be suppressed. According to the inventor's experiments, the temperature of the heating element is reduced by about 10° C. by attaching the heat transfer sheet 200 .

[0045] As described above, the image sensor driving device 100 according to the present embodiment includes: a fixed part including a frame body, and having a storage space inside the frame body; a movable part, which is stored in the storage space, fixes the image sensor part, and is supported by a support mechanism so as to be movable relative to the fixed part; and an FPC 8, which connects the outside of the frame body and the image sensor part, and a heat transfer sheet 200 is attached to the FPC 8, and the heat transfer sheet 20 is in contact with the frame body. Therefore, according to the present embodiment, the heat transfer sheet 200 attached to the FPC 8 and in contact with the frame body can effectively dissipate the heat generated in the movable part to the frame body, thereby suppressing the temperature rise of the movable part.

[0046] (Number Description)

[0047] 100 image sensor driving device; 101 camera device; 102 lens driving device; 107 image sensor; 109 smart phone; 110 lens body; 1 shell; 1a front side wall; 1b through hole; 2 supporting leaf spring; 3 retaining frame; 4 suspension wire; 5 supporting plate; 5a through hole; 6 magnet; 7 coil substrate; 7a coil; 8, 1021FPC; 8a bottom portion; 8a1 through hole; 8b, 8b1, 8b2 side portion; 8c1, 8c2 external connection portion; 8e1, 8e2 connector; 9 sensor substrate; 9a heat sink; 10 bottom cover; 10a notch; 20 Hall IC; 200 heat transfer sheet.

Claims

1. An image sensor driving device, characterized in that: include: The fixing part includes a frame body, wherein the frame body has a shell and a bottom cover combined with the shell body and has a receiving space inside; as well as The movable part is accommodated in the accommodation space, has a sensor substrate and a flexible printed circuit for fixing the image sensor, and is supported by a supporting mechanism so as to be movable relative to the fixed part. The flexible printed circuit has a bottom portion for fixing the sensor substrate, a side portion vertically rising from an edge of the bottom portion and extending horizontally, and an external connection portion bent at an end of the side portion and extending outward, electrically connecting the outside of the frame body and the sensor substrate. The supporting mechanism has a suspension wire, the front end of which is fixed to the fixed part, and the rear end of which is fixed to the movable part, so as to suspend the movable part. The front of the bottom portion of the flexible printed circuit is fixed to the back of the coil substrate, and the front peripheral portion of the sensor substrate and the Hall IC are fixed to the back of the bottom portion. The coil substrate is provided with a coil, and the Hall IC is a driving power source for causing current to flow through the coil. A heat transfer sheet is attached to the flexible printed circuit, wherein the heat transfer sheet includes a first heat transfer sheet and a second heat transfer sheet formed of graphite, silicone, propylene or polyolefin. The first heat transfer sheet is attached so as to extend continuously from the outer surface of the side surface of the flexible printed circuit and the adjacent portion of the bottom surface to the front of the external connection portion without interruption, and the first heat transfer sheet is attached so as to cover the sensor substrate and the Hall IC in a manner of extending continuously from the outer surface of the side surface without interruption, and the first heat transfer sheet at the boundary area between the outer surface of the side surface and the front of the external connection portion contacts the shell of the frame body, The second heat transfer sheet is attached so as to be connected uninterruptedly from the inner side surface of the side portion of the flexible printed circuit to the adjacent portion of the bottom surface portion to the back of the external connection portion, and the second heat transfer sheet is attached so as to cover the front of the coil substrate in a manner that is uninterrupted and continuous from the inner side surface of the side portion, and the second heat transfer sheet located in the boundary area between the inner side surface of the side portion and the back of the external connection portion is in contact with the bottom cover of the frame.

2. The image sensor driving device according to claim 1, wherein: The sensor substrate does not contact the bottom cover of the frame.

3. A camera device, characterized in that: have: The image sensor driving device according to claim 1; and a lens driving device fixed to the fixing portion to focus light from a photographic object and incident on the image sensor.

4. The camera device according to claim 3, wherein: The lens driving device is fixed to the front portion of the accommodation space, and the movable portion is arranged directly behind the lens driving device in a non-contact manner with the lens driving device.

5. An electronic device, characterized in that: A camera device according to claim 3.

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