Device and process for preparing circuit board protective layer using aluminum nitride

Abstract

The present invention provides an apparatus and a process for preparing a circuit board protective layer by using aluminum nitride, comprising a base, one end of the base is provided with a circuit board positioning mechanism, one side of the circuit board positioning mechanism and the middle part of the base are provided with a cast film filling mechanism, one end of the cast film filling mechanism is provided at the output end of an injection mechanism, and the injection mechanism is fixedly connected to the other end of the base. The invention delivers the cast film slurry after vacuum degassing into the cast film filling needle tube through the injection mechanism, and the cast film slurry is evenly spread on the surface of the circuit board under the sliding control of the cast film filling mechanism, and the cast film slurry will not flow to the other side of the circuit board when clamped by the circuit board positioning mechanism, thereby reducing material waste, improving the casting quality, and greatly facilitating the next step of the process.

Description

Technical Field

[0001] The invention relates to the technical field of circuit board production, and in particular to a device and a process for preparing a circuit board protective layer by using aluminum nitride. Background Art

[0002] Information technology with semiconductor technology as its core technology has brought great changes to people's daily life. In the future development of electronic technology, whether in the field of microelectronics or power electronics, the power density of electronic components will be developed in a larger direction, which puts higher requirements on the heat dissipation efficiency and reliability of electronic component packaging materials. In order to meet the market needs of miniaturization, high reliability, excellent performance and low cost of electronic systems, electronic packaging ceramic substrate materials are gradually developing in the direction of high reliability, high heat dissipation efficiency and affordable price.

[0003] In order to better protect the outer circuit pattern of the circuit board, it is necessary to make an insulating protective layer on the two opposite surfaces of the circuit board in the subsequent process. In the prior art, the first method is to use a layer of film with insulating protection to be hot-pressed on the two opposite surfaces of the circuit board as an insulating protective layer, and the second method is to use a layer of solder mask ink to be printed on the two opposite surfaces of the circuit board as an insulating protective layer. For the first method, since the film needs to be punched out with a stamping machine to punch out a pattern corresponding to the circuit that needs to be exposed in the outer circuit pattern before lamination, its alignment accuracy with the exposed circuit is limited by the stamping accuracy of the stamping machine itself, especially when the punched opening on the film needs to be aligned with the fine circuit and the micro conductive pad, the alignment effect is worse. Therefore, in order to meet the needs of fine circuit and micro-hole production, the second method is generally used to produce the insulating protective layer of the circuit board. However, when the second method is adopted, the prior art requires printing solder mask ink on one surface of the circuit board, and then pre-baking, exposing, developing, and post-baking are performed so that the circuits on the surface to be exposed are not covered by the insulating protective layer; then printing solder mask ink on the other surface of the circuit board, and then pre-baking, exposing, developing, and post-baking are performed so that the circuits on the other surface to be exposed are not covered by the insulating protective layer. This results in a cumbersome manufacturing process for the insulating protective layer of the circuit board, which wastes time, and easily causes the circuit board to be severely deformed by heat after two high-temperature post-baking processes, affecting the quality of the circuit board.

[0004] Aluminum nitride can be stable up to 2200℃. It has high room temperature strength, and its strength decreases slowly with increasing temperature. It has good thermal conductivity and small thermal expansion coefficient, making it a good heat shock resistant material. At the same time, aluminum nitride is also an electrical insulator with good dielectric properties, and it is also promising for use as an electrical component.

[0005] The existing multi-layer metal-coated high thermal conductivity aluminum nitride ceramic substrate has a high cost, and it is wasteful to use it directly as a circuit board. There is an urgent need for a device and method for attaching aluminum nitride to the surface of a traditional circuit board to form a protective layer. Summary of the invention

[0006] In view of the above problems, the present invention provides a device and a process for preparing a circuit board protective layer using aluminum nitride, the purpose of which is to solve the technical problem of attaching aluminum nitride to the surface of a traditional circuit board to form a protective layer proposed in the above background technology.

[0007] To achieve the above-mentioned purpose, the present invention provides the following technical solution: a device for preparing a circuit board protective layer using aluminum nitride, comprising a base (1), one end of the base (1) is provided with a circuit board positioning mechanism (2), one side of the circuit board positioning mechanism (2) and the middle of the base (1) is provided with a cast film filling mechanism (3), one end of the cast film filling mechanism (3) is provided at the output end of an injection mechanism (4), and the injection mechanism (4) is fixedly connected to the other end of the base (1).

[0008] Furthermore, the circuit board positioning mechanism (2) comprises a positioning frame group (21), the lower part of the positioning frame group (21) is slidably connected to the lower part of the positioning base (22), and a centering positioning drive mechanism (23) is provided in the middle of the bottom surface of the positioning base (22).

[0009] Furthermore, the positioning frame group (21) comprises a plurality of short-side positioning frames (211), and two ends of the plurality of short-side positioning frames (211) are respectively slidably connected to one end of the long-side positioning frame (212).

[0010] Furthermore, a plurality of oblique insertion grooves (2111) are respectively provided at both ends of one side of the short side positioning frame (211), and the interiors of the plurality of oblique insertion grooves (2111) are respectively slidably connected to one end of the long side positioning frame (212), and a plurality of short side sliding limit holes (2112) are provided in the middle of the bottom surface of the short side positioning frame (211), and the plurality of short side sliding limit holes (2112) are all slidably connected to the lower part of the positioning base (22).

[0011] Furthermore, oblique plug-in blocks (2121) are respectively provided at both ends of the long side positioning frame (212), and a plurality of the oblique plug-in blocks (2121) are respectively slidably connected to the inside of the oblique plug-in groove (2111); a plurality of long side sliding limit holes (2122) are provided in the middle of the bottom surface of the long side positioning frame (212), and a plurality of the long side sliding limit holes (2122) are all slidably connected to the lower part of the positioning base (22); and a seam sealing strip (2123) is respectively provided at both ends of one side of the long side positioning frame (212).

[0012] Furthermore, the positioning base (22) comprises a positioning table (221), and positioning columns (222) are respectively provided at the four corners of the bottom surface of the positioning table (221), and the bottom surfaces of the plurality of positioning columns (222) are fixedly connected to the top surface of the base (1), and one side of the plurality of positioning columns (222) is respectively provided with a short side sliding limit guide rod (223), and the plurality of short side sliding limit guide rods (223) are respectively slidably connected to the middle part of the short side sliding limit hole (2112), and the other side of the plurality of positioning columns (222) is respectively provided with a long side sliding limit guide rod (224), and the plurality of long side sliding limit guide rods (224) are respectively slidably connected to the inside of the long side sliding limit hole (2122), and one end of the plurality of short side sliding limit guide rods (223) and one end of the plurality of long side sliding limit guide rods (224) are both fixedly connected to the top surface of the base (1).

[0013] Furthermore, the centering positioning drive mechanism (23) comprises a centering rocker (231), the middle part of the centering rocker (231) is rotatably connected to the middle part of the bottom surface of the positioning table (221), the two ends of the centering rocker (231) are respectively rotatably connected to one end of a centering connecting rod (232), the other ends of a plurality of centering connecting rods (232) are respectively rotatably connected to the middle part of the bottom surface of the short side positioning frame (211), one end of the centering rocker (231) is rotatably connected to one end of a centering telescopic cylinder (233), and the other end of the centering telescopic cylinder (233) is rotatably connected to the bottom surface of the positioning table (221).

[0014] Furthermore, the cast film filling mechanism (3) comprises a plurality of cast film filling needle tubes (31), one end of each of the plurality of cast film filling needle tubes (31) is connected to the output end of the injection mechanism (4) through a hose (32), the middle portion of the hose (32) is arranged at the middle portion of the top surface of the cast film filling sliding bracket (33), the plurality of cast film filling needle tubes (31) are arranged at the middle portion of the needle tube flip block (34), the two ends of the needle tube flip block (34) are respectively rotatably connected to the two sides of the top surface of the cast film filling sliding bracket (33), and the middle portion of the needle tube flip block (34) is rotatably connected to the flip block. One end of the flip control telescopic cylinder (35) is rotatably connected to the middle of the top surface of the cast film filling sliding bracket (33), and the other end of the flip control telescopic cylinder (35) is rotatably connected to the middle of the top surface of the cast film filling sliding bracket (33). The two ends of the lower part of the cast film filling sliding bracket (33) are respectively slidably connected to the inside of the cast film filling chute (36), and a plurality of the cast film filling chute (36) are fixedly connected to the middle of the top surface of the base (1). A cast film filling sliding telescopic cylinder (37) is provided on one side of the middle part of the cast film filling sliding bracket (33), and one end of the cast film filling sliding telescopic cylinder (37) is arranged at the other end of the top surface of the base (1).

[0015] Furthermore, the injection mechanism (4) includes an injection motor (41), the injection motor (41) is arranged on the top surface of the base (1), the output end of the injection motor (41) is coaxially connected to the injection screw (42), the injection screw (42) is rotatably connected to the middle part of the injection barrel (43), the injection barrel (43) is arranged on the top surface of the base (1), a feed hopper (44) is provided at one end of the upper part of the injection barrel (43), and the output end of the injection barrel (43) is connected to the plurality of the cast film filling needle tubes (31) through a hose (32).

[0016] Process for preparing circuit board protective layer using aluminum nitride:

[0017] S1. Ingredients: Weigh the modified aluminum nitride powder, sintering aid, dispersant, plasticizer, binder, and ball mill for 12h to 20h to obtain a tape-casting slurry;

[0018] S2. Vacuum defoaming: adding a defoaming agent to the casting slurry for vacuum defoaming;

[0019] S3. Casting attachment: The mixed slurry is attached to the surface of the circuit board by a casting method;

[0020] S4. Debinding: keeping the obtained circuit board green body at 200℃~450℃ for 2~3h;

[0021] S5. Sintering: Sinter the debinded ceramic green body at 1600°C to 1750°C for 4 to 6 hours in a nitrogen atmosphere.

[0022] Compared with the prior art, the present invention has the following beneficial effects:

[0023] The cast film slurry after vacuum degassing is sent into the cast film filling needle tube through the injection mechanism, and the cast film slurry is evenly spread on the surface of the circuit board under the sliding control of the cast film filling mechanism. The cast film slurry will not flow to the other side of the circuit board when clamped by the circuit board positioning mechanism, which reduces the waste of materials and improves the quality of cast film. Compared with the spraying method, it avoids the covering of the slurry on the electrical components on the circuit board, which greatly facilitates the next step of the process. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 It is a schematic diagram of the appearance structure of the present invention;

[0025] Figure 2 It is a top view schematic diagram of the appearance structure of the present invention;

[0026] Figure 3 It is a schematic diagram of the structure of the circuit board positioning mechanism of the present invention;

[0027] Figure 4 It is a schematic cross-sectional view of the positioning frame assembly structure of the present invention;

[0028] Figure 5 It is a schematic diagram of the short side positioning frame structure of the present invention;

[0029] Figure 6 It is a schematic diagram of the long side positioning frame structure of the present invention;

[0030] Figure 7 It is a schematic diagram of the positioning base structure of the present invention;

[0031] Figure 8 It is a structural schematic diagram of the centering positioning drive mechanism of the present invention;

[0032] Fig. 9 This is a schematic diagram of the structure of the casting filling mechanism of the present invention.

[0033] Fig.10 It is a schematic cross-sectional view of the injection mechanism structure of the present invention.

[0034] In the figure: 1, base; 2, circuit board positioning mechanism; 21, positioning frame group; 211, short side positioning frame; 2111, oblique plug-in slot; 2112, short side sliding limit hole; 212, long side positioning frame; 2121, oblique plug-in block; 2122, long side sliding limit hole; 2123, joint sealing strip; 22, positioning base; 221, positioning table; 222, positioning column; 223, short side sliding limit guide rod; 224, long side sliding limit guide rod; 23. Centering positioning drive mechanism; 231. Centering rocker; 232. Centering connecting rod; 233. Centering telescopic cylinder; 3. Cast film filling mechanism; 31. Cast film filling needle tube; 32. Hose; 33. Cast film filling sliding bracket; 34. Needle tube turning block; 35. Turning control telescopic cylinder; 36. Cast film filling chute; 37. Cast film filling sliding telescopic cylinder; 4. Injection mechanism; 41. Injection motor; 42. Injection screw; 43. Injection barrel; 44. Feed hopper. DETAILED DESCRIPTION

[0035] To facilitate understanding of the present invention, the present invention will be described more comprehensively below with reference to the relevant drawings. Several embodiments of the present invention are given in the drawings, but the present invention can be implemented in different forms and is not limited to the embodiments described in the text. On the contrary, these embodiments are provided to make the content disclosed in the present invention more thorough and comprehensive.

[0036] It should be noted that when an element is referred to as being "fixed on" another element, it may be directly on the other element or there may be a central element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. The terms "vertical", "horizontal", "left", "right" and similar expressions used in this article are for illustrative purposes only.

[0037] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly connected by technicians in the technical field to which the present invention belongs. The terminology used in the specification of the present invention is for the purpose of describing specific embodiments and is not intended to limit the present invention. The term "and / or" used herein includes any and all combinations of one or more related listed items.

[0038] For example, please refer to Figure 1-2 A device for preparing a circuit board protective layer using aluminum nitride includes a base 1, one end of the base 1 is provided with a circuit board positioning mechanism 2, one side of the circuit board positioning mechanism 2 and the middle of the base 1 are provided with a cast film filling mechanism 3, one end of the cast film filling mechanism 3 is provided at the output end of an injection mechanism 4, and the injection mechanism 4 is fixedly connected to the other end of the base 1.

[0039] For example, please refer to Figure 3 The circuit board positioning mechanism 2 includes a positioning frame group 21, the lower part of the positioning frame group 21 is slidably connected to the lower part of the positioning base 22, and a centering positioning drive mechanism 23 is provided in the middle of the bottom surface of the positioning base 22. This design drives the positioning frame group 21 to clamp and position the circuit board through the centering positioning drive mechanism 23, and limits the range of the casting slurry.

[0040] For example, please refer to Figure 4 The positioning frame group 21 includes a plurality of short-side positioning frames 211 , and two ends of the plurality of short-side positioning frames 211 are respectively slidably connected to one end of a long-side positioning frame 212 .

[0041] For example, please refer to Figure 5 A plurality of oblique insertion grooves 2111 are respectively provided at both ends of one side of the short side positioning frame 211, and the interiors of the plurality of oblique insertion grooves 2111 are respectively slidably connected to one end of the long side positioning frame 212, and a plurality of short side sliding limit holes 2112 are provided in the middle of the bottom surface of the short side positioning frame 211, and the plurality of short side sliding limit holes 2112 are all slidably connected to the lower part of the positioning base 22.

[0042] For example, please refer to Figure 6, oblique plug-in blocks 2121 are respectively provided at both ends of the long side positioning frame 212, and multiple oblique plug-in blocks 2121 are respectively slidably connected to the inside of the oblique plug-in groove 2111, and multiple long side sliding limit holes 2122 are provided in the middle of the bottom surface of the long side positioning frame 212, and multiple long side sliding limit holes 2122 are all slidably connected to the lower part of the positioning base 22, and seam sealing strips 2123 are respectively provided at both ends of one side of the long side positioning frame 212. This design enables multiple long side positioning frames 212 and multiple short side positioning frames 211 to be linked together through the cooperation of the oblique plug-in groove 2111 and the oblique plug-in block 2121, thereby realizing the clamping and positioning action.

[0043] For example, please refer to Figure 7 The positioning base 22 includes a positioning table 221, and the four corners of the bottom surface of the positioning table 221 are respectively provided with positioning columns 222, and the bottom surfaces of the plurality of positioning columns 222 are fixedly connected to the top surface of the base 1, and one side of the plurality of positioning columns 222 is respectively provided with a short side sliding limit guide rod 223, and the plurality of short side sliding limit guide rods 223 are respectively slidably connected to the middle part of the short side sliding limit hole 2112, and the other side of the plurality of positioning columns 222 is respectively provided with a long side sliding limit The plurality of long side sliding limit guide rods 224 are respectively slidably connected to the inside of the long side sliding limit hole 2122, one end of the plurality of short side sliding limit guide rods 223 and one end of the plurality of long side sliding limit guide rods 224 are fixedly connected to the top surface of the base 1, this design assists the linkage of the plurality of long side positioning frames 212 and the plurality of short side positioning frames 211 through the short side sliding limit guide rod 223 and the long side sliding limit guide rod 224, so that the movement is smoother and the movement jamming is avoided.

[0044] For example, please refer to Figure 8 The centering positioning drive mechanism 23 includes a centering rocker 231, the middle part of the centering rocker 231 is rotatably connected to the middle part of the bottom surface of the positioning table 221, the two ends of the centering rocker 231 are respectively rotatably connected to one end of a centering connecting rod 232, and the other ends of multiple centering connecting rods 232 are respectively rotatably connected to the middle part of the bottom surface of the short side positioning frame 211, one end of the centering rocker 231 is rotatably connected to one end of a centering telescopic cylinder 233, and the other end of the centering telescopic cylinder 233 is rotatably connected to the bottom surface of the positioning table 221. This design drives the centering rocker 231 to rotate through the centering telescopic cylinder 233, and then drives multiple centering connecting rods 232 to move, thereby driving multiple short side positioning frames 211 to move, thereby realizing the control of the opening and closing action of the positioning frame group 21.

[0045] For example, please refer to Fig. 9The cast film filling mechanism 3 includes a plurality of cast film filling needle tubes 31, one end of each of the plurality of cast film filling needle tubes 31 is connected to the output end of the injection mechanism 4 through a hose 32, the middle of the hose 32 is arranged at the middle of the top surface of the cast film filling sliding bracket 33, and the plurality of cast film filling needle tubes 31 are arranged at the middle of the needle tube turning block 34, the two ends of the needle tube turning block 34 are respectively rotatably connected to the two sides of the top surface of the cast film filling sliding bracket 33, the middle of the needle tube turning block 34 is rotatably connected to one end of the turning control telescopic cylinder 35, and the other end of the turning control telescopic cylinder 35 is rotatably connected to the middle of the top surface of the cast film filling sliding bracket 33. The two ends of the lower part of the cast film filling sliding bracket 33 are respectively slidably connected to the inside of the cast film filling chute 36, and the multiple cast film filling chute 36 are fixedly connected to the middle of the top surface of the base 1. A cast film filling sliding telescopic cylinder 37 is provided on one side of the middle part of the cast film filling sliding bracket 33, and one end of the cast film filling sliding telescopic cylinder 37 is arranged at the other end of the top surface of the base 1. This design drives the cast film filling sliding bracket 33 to slide along the cast film filling chute 36 through the cast film filling sliding telescopic cylinder 37, and drives the needle tube flip block 34 and multiple cast film filling needle tubes 31 to rotate through the flip control telescopic cylinder 35, so that the cast film slurry is evenly laid on the surface of the circuit board.

[0046] For example, please refer to Fig.10 The injection mechanism 4 includes an injection motor 41, which is arranged on the top surface of the base 1. The output end of the injection motor 41 is coaxially connected to an injection screw 42, and the injection screw 42 is rotatably connected to the middle part of an injection barrel 43. The injection barrel 43 is arranged on the top surface of the base 1. A feed hopper 44 is provided at one end of the upper part of the injection barrel 43. The output end of the injection barrel 43 is connected to multiple cast film filling needle tubes 31 through a hose 32. This design drives the injection screw 42 to rotate through the injection motor 41, and pushes the cast film slurry added from the feed hopper 44 to the output end of the injection barrel 43, thereby sending the cast film slurry to multiple cast film filling needle tubes 31 through the hose 32.

[0047] Embodiment, the process of preparing the circuit board protective layer using aluminum nitride:

[0048] S1. Ingredients: Weigh the modified aluminum nitride powder, sintering aid, dispersant, plasticizer, binder, and ball mill for 12h to 20h to obtain a tape-casting slurry;

[0049] S2. Vacuum defoaming: adding a defoaming agent to the casting slurry for vacuum defoaming;

[0050] S3. Casting attachment: The mixed slurry is attached to the surface of the circuit board by a casting method;

[0051] S4. Debinding: keeping the obtained circuit board green body at 200℃~450℃ for 2~3h;

[0052] S5. Sintering: Sinter the debinded ceramic green body at 1600℃~1750℃ for 4~6h in nitrogen atmosphere. This design is passed.

[0053] Operation principle: First, the centering rocker 231 is driven to rotate by the centering telescopic cylinder 233, and then the centering connecting rods 232 are driven to move, thereby driving the movement of the multiple short side positioning frames 211, so as to realize the opening and closing action of the positioning frame group 21, clamping and positioning the circuit board, and the casting filling sliding telescopic cylinder 37 drives the casting filling sliding bracket 33 to slide along the casting filling chute 36, and the needle tube turning block 34 and the multiple casting filling needle tubes 31 are driven to rotate by the flip control telescopic cylinder 35, and the output ends of the multiple casting filling needle tubes 31 are turned. It is sent to the top of the circuit board, and the injection screw 42 is driven to rotate by the injection motor 41 to push the casting slurry added from the feed hopper 44 to the output end of the injection cylinder 43, so that the casting slurry is sent to the multiple casting filling needles 31 through the hose 32, and flows out from the output ends of the multiple casting filling needles 31 to the surface of the circuit board. At the same time, the casting filling sliding telescopic cylinder 37 drives the casting filling sliding bracket 33 to move, and then drives the multiple casting filling needles 31 to move above the circuit board, so that the casting slurry is evenly laid on the surface of the circuit board.

[0054] The above is an exemplary description of the present invention in combination with the accompanying drawings. It is obvious that the specific implementation of the present invention is not limited to the above-mentioned method. As long as such non-substantial improvements are made by adopting the method concept and technical solution of the present invention, or the concept and technical solution of the present invention are directly applied to other occasions without improvement, they are all within the protection scope of the present invention.

Claims

1. A device for preparing a circuit board protective layer using aluminum nitride, comprising a base (1), characterized in that: A circuit board positioning mechanism (2) is provided at one end of the base (1); a casting filling mechanism (3) is provided at one side of the circuit board positioning mechanism (2) and in the middle of the base (1); one end of the casting filling mechanism (3) is provided at the output end of the injection mechanism (4); and the injection mechanism (4) is fixedly connected to the other end of the base (1); The cast film filling mechanism (3) comprises a plurality of cast film filling needle tubes (31), one end of each of the plurality of cast film filling needle tubes (31) is connected to the output end of the injection mechanism (4) through a hose (32), the middle portion of the hose (32) is arranged at the middle portion of the top surface of the cast film filling sliding bracket (33), the plurality of cast film filling needle tubes (31) are arranged at the middle portion of a needle tube turning block (34), the two ends of the needle tube turning block (34) are respectively rotatably connected to the two sides of the top surface of the cast film filling sliding bracket (33), and the middle portion of the needle tube turning block (34) is rotatably connected to the turning control The invention relates to a casting filling sliding bracket (33) and a casting filling sliding bracket (33). The casting filling sliding bracket (33) is provided with a casting filling sliding telescopic cylinder (37) on one side of the middle part of the casting filling sliding bracket (33). The other end of the flip control telescopic cylinder (35) is rotatably connected to the middle part of the top surface of the casting filling sliding bracket (33). The two ends of the lower part of the casting filling sliding bracket (33) are respectively slidably connected to the inside of the casting filling chute (36). The plurality of casting filling chute (36) are fixedly connected to the middle part of the top surface of the base (1). The casting filling sliding telescopic cylinder (37) is provided on one side of the middle part of the casting filling sliding bracket (33). One end of the casting filling sliding telescopic cylinder (37) is provided on the other end of the top surface of the base (1).

2. The device for preparing a circuit board protective layer using aluminum nitride according to claim 1, characterized in that: The circuit board positioning mechanism (2) comprises a positioning frame group (21), the lower part of which is slidably connected to the lower part of a positioning base (22), and a centering positioning drive mechanism (23) is provided in the middle of the bottom surface of the positioning base (22).

3. The device for preparing a circuit board protective layer using aluminum nitride according to claim 2, characterized in that: The positioning frame group (21) comprises a plurality of short-side positioning frames (211), and two ends of the plurality of short-side positioning frames (211) are respectively slidably connected to one end of a long-side positioning frame (212).

4. The device for preparing a circuit board protective layer using aluminum nitride according to claim 3, characterized in that: A plurality of oblique insertion grooves (2111) are respectively provided at both ends of one side of the short side positioning frame (211), and the interiors of the plurality of oblique insertion grooves (2111) are respectively slidably connected to one end of the long side positioning frame (212), and a plurality of short side sliding limiting holes (2112) are provided in the middle of the bottom surface of the short side positioning frame (211), and the plurality of short side sliding limiting holes (2112) are all slidably connected to the lower part of the positioning base (22).

5. The device for preparing a circuit board protective layer using aluminum nitride according to claim 4, characterized in that: The two ends of the long side positioning frame (212) are respectively provided with oblique plug-in blocks (2121), and the plurality of oblique plug-in blocks (2121) are respectively slidably connected to the inside of the oblique plug-in groove (2111); the middle part of the bottom surface of the long side positioning frame (212) is provided with a plurality of long side sliding limit holes (2122), and the plurality of long side sliding limit holes (2122) are all slidably connected to the lower part of the positioning base (22); and the two ends of one side of the long side positioning frame (212) are respectively provided with seam sealing strips (2123).

6. The device for preparing a circuit board protective layer using aluminum nitride according to claim 5, characterized in that: The positioning base (22) comprises a positioning table (221), and positioning columns (222) are respectively arranged at the four corners of the bottom surface of the positioning table (221), and the bottom surfaces of the plurality of positioning columns (222) are fixedly connected to the top surface of the base (1), and short-side sliding limit guide rods (223) are respectively arranged on one side of the plurality of positioning columns (222), and the plurality of short-side sliding limit guide rods (223) are respectively slidably connected to the middle part of the short-side sliding limit hole (2112), and long-side sliding limit guide rods (224) are respectively arranged on the other side of the plurality of positioning columns (222), and the plurality of long-side sliding limit guide rods (224) are respectively slidably connected to the inside of the long-side sliding limit hole (2122), and one end of the plurality of short-side sliding limit guide rods (223) and one end of the plurality of long-side sliding limit guide rods (224) are both fixedly connected to the top surface of the base (1).

7. The device for preparing a circuit board protective layer using aluminum nitride according to claim 6, characterized in that: The centering positioning drive mechanism (23) comprises a centering rocker (231), the middle part of the centering rocker (231) is rotatably connected to the middle part of the bottom surface of the positioning table (221), the two ends of the centering rocker (231) are respectively rotatably connected to one end of a centering connecting rod (232), the other ends of a plurality of centering connecting rods (232) are respectively rotatably connected to the middle part of the bottom surface of the short side positioning frame (211), one end of the centering rocker (231) is rotatably connected to one end of a centering telescopic cylinder (233), and the other end of the centering telescopic cylinder (233) is rotatably connected to the bottom surface of the positioning table (221).

8. The device for preparing a circuit board protective layer using aluminum nitride according to claim 1, characterized in that: The injection mechanism (4) comprises an injection motor (41), the injection motor (41) is arranged on the top surface of the base (1), the output end of the injection motor (41) is coaxially connected to the injection screw (42), the injection screw (42) is rotatably connected to the middle part of the injection cylinder (43), the injection cylinder (43) is arranged on the top surface of the base (1), a feed hopper (44) is provided at one end of the upper part of the injection cylinder (43), and the output end of the injection cylinder (43) is connected to the plurality of cast film filling needle tubes (31) via a hose (32).

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