Substrate processing apparatus and substrate processing method

Abstract

An apparatus for processing a substrate and a substrate processing method are provided, the apparatus including a processing vessel having a processing space; a support unit for supporting and rotating a substrate in the processing space; a liquid supply unit for supplying a processing liquid to the substrate supported by the support unit; and a heating unit for heating the substrate, wherein the support unit includes a spin chuck; a rotation driver for rotating the spin chuck; a chuck pin mounted on the spin chuck so as to rotate together with the spin chuck; and a chuck pin moving unit for moving the chuck pin between a contact position in which the chuck pin is in contact with a side portion of the substrate and an open position in which the chuck pin is spaced apart from the side portion of the substrate, and the chuck pin moving unit moves the chuck pin while the substrate is rotated by the spin chuck.

Description

[0001] Cross Reference to Related Applications

[0002] This application claims priority to and the benefit of Korean Patent Application No. 10-2021-0136380, filed on October 14, 2021, in the Korean Intellectual Property Office, the entire contents of which are incorporated herein by reference. TECHNICAL FIELD

[0003] The present application relates to a substrate processing apparatus and a substrate processing method. BACKGROUND

[0004] In order to manufacture a semiconductor device or a liquid crystal display, various processes such as photographing, ashing, ion implantation, thin film deposition, and cleaning are performed on a substrate. Among them, an etching process or a cleaning process is a process that removes unnecessary areas of a thin film formed on a substrate, or etches or cleans foreign substances, particles, and the like, and requires a thin film to have high selectivity, high etching rate, and etching uniformity, and since a semiconductor device is highly integrated, a higher level of etching selectivity and etching uniformity is required.

[0005] Generally, in a substrate etching process or a cleaning process, a treatment liquid treatment operation, a rinsing treatment operation, and a drying treatment operation are sequentially performed. In one example, in the treatment liquid treatment operation, a treatment liquid for etching a thin film formed on a substrate or removing foreign substances on a substrate is supplied to the substrate to form a puddle, and then the treatment liquid puddle is heated to facilitate etching by the treatment liquid, and in the rinsing treatment operation, a rinsing liquid such as pure water is supplied to the substrate.

[0006] The above-mentioned treatment liquid treatment operation is performed by placing a substrate on a support unit and supplying a treatment liquid to the substrate while rotating the support unit. The support unit is provided with chuck pins for supporting a side portion of the substrate to prevent the substrate from moving in a lateral direction of the support unit during rotation. The chuck pins move between a standby position that provides a space for the substrate to be placed when the substrate is loaded or unloaded onto the support unit, and a support position that comes into contact with the side portion of the substrate while the substrate placed on the support unit is rotated as the process is performed. Accordingly, the space provided between the chuck pins placed in the standby position is wider than the space provided between the chuck pins placed in the support position.

[0007] Generally, when a puddle is formed on a substrate, a problem occurs in that the treatment liquid flows down along the chuck pins due to contact between the substrate and the chuck pins. In addition, there is a problem in that it is difficult to maintain a certain amount of liquid film due to the phenomenon that the treatment liquid flows down along the chuck pins. SUMMARY

[0008] The present invention aims to provide a substrate processing apparatus and a substrate processing method that can effectively process substrates.

[0009] The present invention also aims to provide a support unit in which a chuck pin can move freely during a process of rotating a substrate, as well as a substrate processing apparatus and a method of using the same.

[0010] The purpose of this invention is not limited thereto, and other unmentioned purposes will be clearly understood by those skilled in the art from the following description.

[0011] An exemplary embodiment of the present invention provides an apparatus for processing a substrate, the apparatus comprising: a processing container having a processing space; a support unit for supporting and rotating the substrate in the processing space; a liquid supply unit for supplying processing liquid to the substrate supported by the support unit; and a heating unit for heating the substrate, wherein the support unit comprises: a spin chuck; a rotation driver for rotating the spin chuck; a chuck pin mounted on the spin chuck and rotating together with the spin chuck; and a chuck pin moving unit for moving the chuck pin between a contact position in which the chuck pin contacts a side portion of the substrate and an open position in which the chuck pin is spaced apart from the side portion of the substrate, and the chuck pin moving unit moves the chuck pin while the substrate is rotated by the spin chuck.

[0012] The chuck pin moving unit may include: a cam ring; a cam ring driver for rotating the cam ring; and a slip ring assembly for providing power to the cam ring driver.

[0013] The slip ring assembly may include: a ring member that rotates together with a spin chuck; a brush member that is movable relative to the ring member; and a moving member for moving the brush member in a direction close to or away from the ring member.

[0014] The brush component can be configured to selectively contact the ring component by moving the component.

[0015] The cam ring may include a protrusion projecting from the outer surface, and the chuck pin moving unit may include a lever member having one end coupled to the chuck pin and another end in contact with the protrusion.

[0016] The protrusion may include a first inclined surface having a first angle relative to the outer surface of the cam ring, and a second inclined surface having a second angle greater than the first angle, and the other end of the rod member may be configured to be movable along the first inclined surface of the protrusion.

[0017] The protrusion may include a first position closest to the outer surface of the cam ring on the first inclined surface and a second position located furthest from the outer surface of the cam ring on the first inclined surface, and the other end of the rod member may move between the first position and the second position.

[0018] When the other end of the lever member is in the first position, the chuck pin may be in the contact position, and when the other end of the lever member is in the second position, the chuck pin may be in the open position.

[0019] The spin chuck is rotatable, causing the substrate to rotate at a first speed or a second speed faster than the first speed, and when the substrate rotates at the first speed, the chuck pin moving unit can position the chuck pin in the open position.

[0020] The spin chuck is rotatable, causing the substrate to rotate at a first speed or a second speed faster than the first speed. When the substrate rotates at the first speed, the brush member can contact the ring member, while when the substrate rotates at the second speed, the brush member can not contact the ring member.

[0021] When the brush component is in contact with the ring component, the slip ring assembly can provide power to the cam ring driver; when the brush component is not in contact with the ring component, the slip ring assembly can not provide power to the cam ring driver.

[0022] The spin chuck may have a through hole that penetrates in the vertical direction, and the heating unit may heat the bottom surface of the substrate through the through hole.

[0023] The heating unit may include a laser.

[0024] A spin chuck may include: a main body; and an extension extending upward from the upper end of the main body, wherein the area of ​​the extension may gradually increase toward the top.

[0025] Another exemplary embodiment of the present invention provides a method for processing a substrate, the method comprising: a first liquid supply operation, supplying a first liquid to a substrate rotating at a first speed in an open state where a chuck pin for supporting a side portion of the substrate is located in an open position spaced apart from the side portion of the substrate, and forming a first liquid film on the substrate; a liquid film heating operation following the first liquid supply operation, heating the first liquid film formed on the substrate in the open state; and a second liquid supply operation following the liquid film heating operation, supplying a second liquid to a substrate rotating at a second speed faster than the first speed in a contact state where the chuck pin is located in a contact position where the chuck pin contacts the side portion of the substrate to support the side portion of the substrate, wherein a change from an open state to a contact state is performed simultaneously with the rotation of the substrate.

[0026] The first liquid and the second liquid can be the same, and the first liquid can be an aqueous solution of phosphoric acid.

[0027] In the second liquid supply operation, the amount of the second liquid supplied per unit time can be greater than the amount of the first liquid supplied per unit time in the first liquid supply operation.

[0028] In the liquid film heating operation, the substrate can rotate at a first speed, and the first liquid may not be supplied to the substrate.

[0029] The chuck pin can be configured to move between an open position and an engaged position via a chuck pin moving unit, and the chuck pin moving unit may include: a cam ring; a cam ring driver for rotating the cam ring; and a slip ring assembly for supplying power to the cam ring driver, and the slip ring assembly may include: a ring member; a brush member configured to move relative to the ring member; and a moving member for moving the brush member in a direction close to or away from the ring member.

[0030] Another exemplary embodiment of the present invention provides a method for processing a substrate using a substrate processing apparatus, the method comprising: a first liquid supply operation, supplying a first liquid to a substrate rotating at a first speed in an open state with the chuck pin in an open position, and forming a first liquid film on the substrate; a liquid film heating operation following the first liquid supply operation, heating the first liquid film formed on the substrate in the open state with the chuck pin in an open position; and a second liquid supply operation following the liquid film heating operation, supplying a second liquid to a substrate rotating at a second speed faster than the first speed in a contact state with the chuck pin in a contact position, wherein the chuck pin changes from an open state to a contact state while the substrate is rotating.

[0031] According to an exemplary embodiment of the present invention, it is possible to efficiently process the substrate.

[0032] Furthermore, according to an exemplary embodiment of the present invention, the chuck pin can move freely while the process is performed by rotating the substrate.

[0033] Furthermore, according to an exemplary embodiment of the present invention, it is possible to prevent the processing fluid from flowing down to the chuck pin.

[0034] Furthermore, according to an exemplary embodiment of the present invention, the processing liquid pool formed on the substrate can be maintained as a predetermined amount or more of liquid film.

[0035] Furthermore, according to an exemplary embodiment of the present invention, the chuck pin can move normally regardless of whether the support unit of the support substrate rotates.

[0036] Furthermore, according to an exemplary embodiment of the invention, it is possible to adjust the travel of the chuck pin during the process.

[0037] Furthermore, according to exemplary embodiments of the present invention, it is possible to maximize wear resistance, durability, and lifespan via a slip ring assembly formed by brush members configured to be individually movable relative to the ring members.

[0038] Furthermore, according to an exemplary embodiment of the present invention, various types of heat sources and cooling systems for various heat sources can be applied via the support unit that forms a hollow space.

[0039] The effects of the present invention are not limited to those described above, and those skilled in the art can clearly understand the effects not mentioned from this specification and the accompanying drawings. Attached Figure Description

[0040] Figure 1 This is a top plan view illustrating a substrate processing facility according to an exemplary embodiment of the present invention.

[0041] Figure 2 The illustration shows an embodiment of the present invention. Figure 1 A cross-sectional view of the substrate processing equipment provided in the process chamber.

[0042] Figure 3 This is a cross-sectional view illustrating a chuck pin and a chuck pin moving unit according to an exemplary embodiment of the present invention.

[0043] Figure 4 This is a top plan view illustrating a chuck pin and a chuck pin moving unit according to an exemplary embodiment of the present invention.

[0044] Figure 5 This is a schematic diagram illustrating an example of a slip ring assembly according to an embodiment of the present invention.

[0045] Figure 6 This is a schematic diagram illustrating the chuck pin moving unit when the chuck pin is in the contact position according to an embodiment of the present invention.

[0046] Figure 7 This is a schematic diagram illustrating the state of the slip ring assembly when the chuck pin is in the open position according to an embodiment of the present invention.

[0047] Figure 8 and Figure 9 This is a schematic diagram illustrating the process of moving the chuck pin from the contact position to the open position according to an embodiment of the present invention.

[0048] Figure 10 This is a schematic diagram illustrating the state of the slip ring assembly when the chuck pin is in the contact position according to an embodiment of the present invention.

[0049] Figure 11 and Figure 12 This is a schematic diagram illustrating the process of moving the chuck pin from the open position to the contact position according to an embodiment of the present invention.

[0050] Figure 13 This is a flowchart of a substrate processing method according to an embodiment of the present invention.

[0051] Figures 14 to 17 It is a sequence icon Figure 13 A diagram of the substrate processing method.

[0052] Symbol Explanation

[0053] 1: Substrate processing facility; 10: Index module; 12: First direction

[0054] 14: Second direction; 16: Third direction; 18: Carrier; 20: Processing module

[0055] 120: Loading port; 140: Transfer frame; 142: Index track.

[0056] 144: Indexing robot arm; 144a: Base; 144b: Main body; 144c: Indexing arm

[0057] 220: Buffer unit; 240: Transfer chamber; 242: Guide rail; 244: Main manipulator

[0058] 244a: Base; 244b: Main body; 244c: Main arm; 260: Process chamber

[0059] 300: Substrate processing equipment; 310: Chamber; 315: Fan filter unit

[0060] 320: Processing container; 321: First recycling container; 321b: First recycling pipeline

[0061] 322: Second recycling container; 322a: Second inlet; 322b: Second recycling pipeline

[0062] 324: Second protection section; 324a: First entrance; 326: First protection section

[0063] 340: Substrate support unit; 342: Spin chuck; 342a: Through hole

[0064] 346: Chuck pin; 347: Support pin; 348: Window component; 349: Rotary actuator

[0065] 360: Lifting unit; 362: Support bracket; 364: Moving axis; 366: Driver.

[0066] 390: Liquid supply unit; 400: Chuck pin moving unit; 410: Cam ring

[0067] 412: Main body; 414: Protrusion; 416: Connecting part; 420: Cam ring driver

[0068] 430: Slip ring assembly; 432: Ring component; 434: Brush component; 436: Moving component

[0069] 440: Rod component; 442: Ball component; 500: Heating unit / laser beam emitting component

[0070] 3421: Main body; 3422: Extension; 4142: First inclined surface

[0071] 4144: Second inclined surface; 4322: Rotating component; 4324: Conductive ring

[0072] 4326: Wire / signal transmitting component; 4342: Brush; 4344: Support component

[0073] A: Angle C1: First liquid film C2: Second liquid film P1: First position

[0074] P2: Second position S100: Substrate alignment operation

[0075] S200: First liquid supply operation; S300: Liquid film heating operation

[0076] S400: Second liquid supply operation V1: First speed

[0077] V2: Second velocity W: Substrate Detailed Implementation

[0078] Exemplary embodiments of the invention will now be described more fully with reference to the accompanying drawings, which illustrate exemplary embodiments of the invention. However, the invention may be implemented in various ways and is not limited to the following exemplary embodiments. Furthermore, in describing exemplary embodiments of the invention in detail, detailed descriptions of well-known functions or configurations will be omitted if it is determined that such detailed descriptions would unnecessarily obscure the essential points of the invention. Additionally, the same reference numerals are used throughout the drawings for parts having similar functions and effects.

[0079] Furthermore, unless explicitly stated otherwise, the word "comprise" and variations such as "comprises" or "comprising" will be construed as including the stated elements but not excluding any other elements. It should be understood that the terms "including" and "having" are intended to specify the presence of features, numbers, operations, calculations, constituent elements, and components or combinations thereof described in the specification, and do not preclude the possibility of the prior presence or addition of one or more other features, numbers, operations, calculations, constituent elements, and components or combinations thereof.

[0080] The singular expressions used in this article include plural expressions unless their meaning is explicitly the opposite in the context. Therefore, the shape, size, and similar features of elements in the diagram may be exaggerated for clarity.

[0081] The expression "and / or" includes references to each item in the project and all combinations including one or more items in the project. Furthermore, in this specification, "connected" means not only when component A and component B are directly connected, but also when component A and component B are indirectly connected by inserting component C between component A and component B.

[0082] The exemplary embodiments of the present invention can be modified in various forms, and the scope of the invention should not be construed as limited to the following exemplary embodiments. These exemplary embodiments are provided to explain the invention more fully to those skilled in the art. Therefore, the shapes of elements in the figures are exaggerated for clearer illustration.

[0083] In this exemplary embodiment, a process of etching a substrate using a processing liquid will be described as an example. However, this exemplary embodiment is not limited to etching processes and is applicable in many ways to substrate processing processes using liquids, such as cleaning processes, ashing processes, and developing processes.

[0084] Here, "substrate" is a general concept, encompassing all substrates used in the manufacture of semiconductor devices, flat panel displays (FPDs), and other articles on which circuit patterns are formed on thin films. Examples of substrate W include silicon wafers, glass substrates, and organic substrates.

[0085] The following will be referenced Figures 1 to 17 Examples of the present invention will be described in detail.

[0086] Figure 1 This is a top plan view illustrating a substrate processing facility 1 according to an exemplary embodiment of the present invention. (Reference) Figure 1 The substrate processing facility 1 includes an indexing module 10 and a process processing module 20.

[0087] The index module 10 includes a loading port 120 and a transfer frame 140. The loading port 120, the transfer frame 140, and the process processing module 20 can be configured sequentially. Hereinafter, the direction in which the loading port 120, the transfer frame 140, and the process processing module 20 are configured is referred to as the first direction 12, the direction perpendicular to the first direction 12 when viewed from the top is referred to as the second direction 14, and the direction perpendicular to the plane including the first direction 12 and the second direction 14 is referred to as the third direction 16.

[0088] A carrier 18, housing the substrate W, rests on a loading port 120. Multiple loading ports 120 are provided, and the multiple loading ports 120 are arranged in series in the second direction 14. The number of loading ports 120 may be increased or decreased depending on the process efficiency and floor space requirements of the process module 20, and similar factors. Multiple slots (not shown) may be formed in the carrier 18 for accommodating multiple substrates W in a horizontally positioned state relative to the ground. A front-opening unified pod (FOUP) may be used as the carrier 18.

[0089] The transfer frame 140 transfers the substrate W between the carrier 18, which is seated on the loading port 120, and the buffer unit 220. The transfer frame 140 provides an index track 142 and an indexing robot 144. The longitudinal direction of the index track 142 is arranged parallel to a second direction 14. The indexing robot 144 is mounted on the index track 142 and moves linearly along the index track 142 in the second direction 14. The indexing robot 144 includes a base 144a, a body 144b, and an indexing arm 144c. The base 144a is mounted to be movable along the index track 142. The body 144b is coupled to the base 144a. The body 144b is configured to be movable on the base 144a in a third direction 16. Furthermore, the body 144b is configured to be rotatable on the base 144a. The indexing arm 144c is coupled to the body 144b and configured to be movable forward and backward relative to the body 144b. Multiple index arms 144c are configured to be driven individually. The index arms 144c are arranged in a stacked, spaced-apart configuration on a third-direction 16. A portion of the index arms 144c can be used when the substrate W is transferred from the process module 20 to the carrier 18, while another portion of the multiple index arms 144c can be used when the substrate W is transferred from the carrier 18 to the process module 20. This prevents particles generated on the substrate W before process loading and unloading by the indexing robot 144 from adhering to the substrate W after process loading.

[0090] The process module 20 includes a buffer unit 220, a transfer chamber 240, and a process chamber 260.

[0091] A buffer unit 220 is disposed between the transfer frame 140 and the transfer chamber 240. The buffer unit 220 provides a space in which the substrate W rests before being transferred between the transfer chamber 240 and the transfer frame 140. The buffer unit 220 has internal slots (not shown) for placing the substrate W. Multiple slots (not shown) are spaced apart from each other in a third direction 16. The buffer unit 220 has an open side facing the transfer frame 140. The buffer unit 220 has an open side facing the transfer chamber 240.

[0092] The transfer chamber 240 is positioned such that its longitudinal direction is parallel to the first direction 12. The transfer chamber 240 may include one side of the transfer chamber 240 and another side positioned relative to said one side. A plurality of process chambers 260 may be disposed on one or the other side of the transfer chamber 240. A plurality of process chambers 260 may be disposed on both sides of the transfer chamber 240. A plurality of process chambers 260 disposed on one side of the transfer chamber 240 and a plurality of process chambers 260 disposed on the other side of the transfer chamber 240 may be arranged symmetrically relative to the transfer chamber 240. Some of the plurality of process chambers 260 may be disposed along the longitudinal direction of the transfer chamber 240. Furthermore, some of the plurality of process chambers 260 may be disposed stacked on top of each other in a third direction 16. That is, on one side of the transfer chamber 240, the process chambers 260 may be configured in an A×B configuration. Here, A refers to the number of process chambers 260 provided in a row along the first direction 12, and B refers to the number of process chambers 260 provided in a row along the third direction 16. For example, when four or six process chambers 260 are provided on one side of the transfer chamber 240, the multiple process chambers 260 can be configured in a 2×2 or 3×2 configuration. The number of process chambers 260 can be increased or decreased. The number of process chambers 260 can be provided in various numbers depending on the floor area or process efficiency. Unlike the above, process chambers 260 may be provided only on one side of the transfer chamber 240. In addition, process chambers 260 may be provided as a single layer on one or both sides of the transfer chamber 240.

[0093] The transfer chamber 240 transfers substrate W between the buffer unit 220 and the process chamber 260, and between the process chambers 260. A guide rail 242 and a main robot 244 are configured to form the transfer chamber 240. The guide rail 242 is positioned such that its longitudinal direction is parallel to a first direction 12. The main robot 244 is mounted on the guide rail 242 and moves linearly along the first direction 12 on the guide rail 242. The main robot 244 includes a base 244a, a body 244b, and a main arm 244c. The base 244a is mounted to be movable along the guide rail 242. The body 244b is coupled to the base 244a. The body 244b is configured to be movable on the base in a third direction 16. Furthermore, the body 244b is configured to be rotatable on the base 244a. The main arm 244c is coupled to the body 244b and configured to be movable forward and backward relative to the body 244b. Multiple main arms 244c are configured to be driven individually. The main arms 244c are arranged to be stacked on a third-party axis 16 in a spaced-apart state.

[0094] A substrate processing apparatus 300 for performing liquid processing processes on a substrate W is provided to a process chamber 260. The substrate processing apparatus 300 may have different structures depending on the type of liquid processing process to be performed. Conversely, the substrate processing apparatus 300 within each process chamber 260 may have the same structure. Optionally, multiple process chambers 260 may be divided into multiple groups, and the substrate processing apparatus 300 within the same group of process chambers 260 may have the same structure, while the substrate processing apparatus 300 within different groups of process chambers 260 may have different structures.

[0095] Figure 2 The illustration shows an embodiment of the present invention. Figure 1 A cross-sectional view of the substrate processing equipment provided in the process chamber.

[0096] refer to Figure 2 The substrate processing equipment 300 includes a processing container 320, a substrate support unit 340, a lifting unit 360, a liquid supply unit 390, and a heating unit 500.

[0097] The substrate processing apparatus 300 may include a chamber 310. The chamber 310 provides a sealed internal space. A processing container 320 is disposed within the internal space of the chamber 310. A fan filter unit 315 is mounted on the upper portion of the chamber 310. The fan filter unit 315 generates a vertical airflow within the chamber 310. The fan filter unit 315 generates a downward airflow within the chamber 310. The fan filter unit 315 is a device that modularizes a filter and an air supply fan into a single unit; it filters high-humidity outdoor air and supplies the filtered air to the interior of the chamber 310. The high-humidity outdoor air passes through the fan filter unit 315 and is supplied to the chamber 310, forming a vertical airflow within the internal space of the chamber 310. This vertical airflow provides a uniform airflow in the upper portion of the substrate W. Contaminants generated during the process of processing the substrate W (e.g., fumes) are discharged to the outside of the processing container 320 along with the air included in the vertical airflow, thereby maintaining a high level of cleanliness inside the processing container 320.

[0098] The processing container 320 has a cylindrical shape with an open top. The processing container 320 includes a first recycling container 321 and a second recycling container 322. The first recycling container 321 and the second recycling container 322 recycle different processing solutions in the processing solution used in the process. The first recycling container 321 is provided in a ring-like shape surrounding the substrate support unit 340. The second recycling container 322 is provided in a ring-like shape surrounding the substrate support unit 340. In an exemplary embodiment, the first recycling container 321 is provided in a ring-like shape surrounding the second recycling container 322. The second recycling container 322 can be provided by insertion into the first recycling container 321. The height of the second recycling container 322 may be greater than the height of the first recycling container 321. The second recycling container 322 may include a first protective portion 326 and a second protective portion 324. The first protective portion 326 may be provided at the top of the second recycling container 322. The first protective portion 326 is formed to extend toward the substrate support unit 340, and the first protective portion 326 may be formed to slope upward toward the substrate support unit 340. In the second recycling container 322, a second protective portion 324 may be provided at a position spaced downward from the first protective portion 326. The second protective portion 324 is formed to extend toward the substrate support unit 340, and the second protective portion 324 may be formed to slope upward toward the substrate support unit 340. The space between the first protective portion 326 and the second protective portion 324 serves as a first inlet 324a through which the processing liquid flows. A second inlet 322a is provided at the lower portion of the second protective portion 324. The first inlet 324a and the second inlet 322a may be located at different heights. An opening (not shown) is formed in the second protective portion 324, allowing the processing liquid flowing into the first inlet 324a to flow into a second recycling line 322b provided in the lower portion of the second recycling container 322. The opening (not shown) in the second protective portion 324 may be formed at the lowest height position in the second protective portion 324. The treated liquid recovered to the first recovery container 321 is configured to flow into a first recovery line 321b connected to the bottom surface of the first recovery container 321. The treated liquid introduced into the first recovery container 321 and the second recovery container 322 can be provided to an external treated liquid regeneration system (not shown) via the first recovery line 321b and the second recovery line 322b, respectively, for reuse.

[0099] The lifting unit 360 linearly moves the processing container 320 up and down. As an example, the lifting unit 360 is coupled to a second recycling container 322 of the processing container 320 and moves the second recycling container 322 up and down, thereby changing the relative height of the processing container 320 relative to the substrate support unit 340. The lifting unit 360 includes a bracket 362, a moving shaft 364, and a driver 366. The bracket 362 is fixedly mounted on the outer wall of the processing container 320, while the moving shaft 364, which moves vertically by the driver 366, is fixedly coupled to the bracket 362. The second recycling container 322 of the processing container 320 is lowered, causing the upper portion of the substrate support unit 340 to protrude towards the upper portion of the processing container 320. Specifically, when the substrate W is loaded into or removed from the substrate support unit 340, the protrusion is higher than the first protective portion 326. Furthermore, during the process, the height of the processing container 320 is adjusted to introduce the processing liquid into predetermined recovery containers (321 and 322) according to the type of processing liquid supplied to the substrate W. Optionally, the lifting unit 360 may also move the substrate support unit 340 instead of the processing container 320 in the vertical direction. Optionally, the lifting unit 360 may move the entire processing container 320, allowing it to move up and down in the vertical direction. The lifting unit 360 is configured to adjust the relative height between the processing container 320 and the substrate support unit 340, and if the relative height between the processing container 320 and the substrate support unit 340 is adjustable, exemplary embodiments of the processing container 320 and the lifting unit 360 may be provided in various structures and methods according to the design.

[0100] The liquid supply unit 390 is configured to discharge a chemical liquid from the upper portion of the substrate W to the substrate W, and may include one or more chemical liquid discharge nozzles. The liquid supply unit 390 may pump the chemical liquid stored in a storage tank (not shown) to discharge the chemical liquid to the substrate W via the chemical liquid discharge nozzles. The liquid supply unit 390 may include a drive unit (not shown) movable between a process position facing the central region of the substrate W and a standby position outside the substrate W.

[0101] The chemical liquid supplied from the liquid supply unit 390 to the substrate W can vary depending on the substrate processing process. When the substrate processing process is a silicon nitride thin film etching process, the chemical liquid may include a phosphoric acid (H3PO4) chemical liquid. The liquid supply unit 390 may further include a deionized water (DIW) supply nozzle for rinsing the surface of the substrate after the etching process, and an isopropyl alcohol (IPA) discharge nozzle and a nitrogen (N2) discharge nozzle for performing a drying process after rinsing. Although not shown, the liquid supply unit 390 may include a nozzle moving member (not shown) capable of supporting and moving the chemical liquid discharge nozzle. The nozzle moving member (not shown) may include a support shaft (not shown), an arm (not shown), and a driver (not shown). The support shaft (not shown) is located on one side of the processing container 320. The support shaft (not shown) has a rod shape with its longitudinal direction facing the third direction 16. The support shaft (not shown) is configured to be rotatable by the driver (not shown). An arm (not shown) is coupled to the upper end of a support shaft (not shown). The arm (not shown) can extend vertically from the support shaft (not shown). A chemical liquid discharge nozzle is fixedly coupled to a remote end of the arm (not shown). Depending on the rotation of the support shaft (not shown), the chemical liquid discharge nozzle can swing together with the arm (not shown). The chemical liquid discharge nozzle can swing to a process position and a standby position. Optionally, the support shaft (not shown) can be configured to move vertically. Furthermore, the arm (not shown) can be configured to move forward and backward in its longitudinal direction.

[0102] The substrate support unit 340 supports the substrate W and rotates the substrate W during the process. The substrate support unit 340 includes a spin chuck 342, a window member 348, a rotary driver 349, a chuck pin 346, and a chuck pin moving unit 400.

[0103] A chuck pin 346 is coupled to a spin chuck 342. The substrate W is spaced apart from the upper surface of the spin chuck 342 by the chuck pin 346 coupled to the spin chuck 342. The substrate W rotates together with the spin chuck 342 and is supported by the chuck pin 346 coupled to the spin chuck 342.

[0104] The spin chuck 342 is provided in the shape of a can with an open top and an open bottom. The spin chuck 342 includes a through-hole 342a penetrating both the upper and lower surfaces. The spin chuck 342 includes a through-hole 342a penetrating in a vertical direction. In this case, the vertical direction may refer to the axial direction of the spin chuck 342, or it may refer to a direction parallel to the rotational axis of the spin chuck 342. The heating unit 500, to be described later, is disposed in the through-hole 342a.

[0105] The spin chuck 342 includes a main body portion 3421 and an extension portion 3422 extending upward from the main body portion 3421. The main body portion 3421 and the extension portion 3422 are integrally formed. A through hole 342a is formed to pass through both the main body portion 3421 and the extension portion 3422. The main body portion 3421 is formed to have the same area. The main body portion 3421 is formed to have the same inner diameter. The through hole 342a in the main body portion 3421 is formed to have the same diameter. The extension portion 3422 is formed to gradually increase in area in the upper direction from the main body portion 3421. The inner diameter of the extension portion 3422 is formed to increase in the upper direction. The through hole 342a in the extension portion 3422 is formed to increase in diameter in the upper direction. A heating unit 500, which will be described later, is disposed within the main body portion 3421, and a laser beam generated by the heating unit 500 is emitted to the substrate W through the extension portion 3422. The extension portion 3422 can be configured to not interfere with the size of the laser beam. Thus, the laser beam generated by the heating unit 500 can be emitted to the substrate W without interference from the spin chuck 342.

[0106] The spin chuck 342 can be positioned below the window member 348. The spin chuck 342 can support the edge region of the window member 348. The connection between the spin chuck 342 and the window member 348 can have a sealing structure so that the chemical liquid supplied to the substrate W will not permeate into the heating unit 500.

[0107] Window member 348 is located below substrate W. Window member 348 is disposed below substrate W, which is supported on chuck pin 346. Window member 348 is disposed below substrate W, which is supported by chuck pin 346. Window member 348 may be provided substantially corresponding to the shape of substrate W. For example, when substrate W is a circular wafer, window member 348 may be provided in a substantially circular shape. Window member 348 may have a diameter larger than that of substrate W. However, the invention is not limited thereto, and window member 348 may have the same diameter as substrate W, or may be formed to have a smaller diameter than substrate W.

[0108] A hole 3481 is formed in the window member 348, and a chuck pin 346 is disposed in the hole 3481. The chuck pin 346 can pass through the hole 3481 of the window member 348. The diameter of the hole 3481 of the window member 348 can be larger than the diameter of the chuck pin 346. Thus, the chuck pin 346 can move inside the hole 3481 of the window member 348. At this time, the chuck pin 346 moves in a direction perpendicular to the rotation axis of the spin chuck 342.

[0109] Window member 348 can be made of a material with high light transmittance. Therefore, the laser beam emitted by the self-heating unit 500 can pass through window member 348. Window member 348 can be made of a material with excellent corrosion resistance, thus not reacting with chemical liquids. For example, window member 348 can be provided with materials such as quartz, glass, or sapphire. Window member 348 is a configuration that allows the laser beam to pass through and reach the substrate W, and protects the substrate support unit 340 from the effects of chemical liquids, and can be provided in various sizes and shapes according to design.

[0110] Support pins 347 may be coupled to window member 348. Multiple support pins 347 may be provided. Support pins 347 may be provided in the edge region of window member 348. Multiple support pins 347 may be arranged to be spaced apart from each other along the edge region of window member 348. Support pins 347 may be configured to project upward from the upper surface of window member 348. Support pins 347 may support the lower surface of substrate W to separate substrate W from window member 348.

[0111] A rotary actuator 349 rotates a spin chuck 342. The rotary actuator 349 can be any component capable of rotating the spin chuck 342. As an example, the rotary actuator 349 can be provided as a hollow motor. According to an embodiment, the rotary actuator 349 may include a stator (not shown) and a rotor (not shown). The stator may be configured to be fixed in one position, while the rotor may be coupled to the spin chuck 342. The rotor may be coupled to the bottom of the spin chuck 342 to rotate the spin chuck 342. When a hollow motor is used as the rotary actuator 349, the narrower the bottom of the spin chuck 342, the smaller the hollowness of the selected hollow motor. Therefore, manufacturing costs can be reduced. According to an embodiment, a cover member (not shown) may be further included for protecting the rotary actuator 349 from chemical liquids.

[0112] A chuck pin 346 is mounted on a spin chuck 342. The chuck pin 346 can be disposed on the spin chuck 342, thus protruding from the upper surface of the spin chuck 342. The chuck pin 346 can be mounted in an extension 3422 of the spin chuck 342. The chuck pin 346 rotates together with the spin chuck 342. Multiple chuck pins 346 can be provided. The multiple chuck pins 346 can be spaced apart from each other. The multiple chuck pins 346 can be arranged in a circular shape when combined. The multiple chuck pins 346 can be disposed along the edge of a through hole 342a formed in the extension 3422. The chuck pin 346 supports a side portion of the substrate W. The chuck pin 346 grips the side portion of the substrate W. The chuck pin 346 separates the substrate W from the window member 348 by a predetermined distance. At least a portion of the chuck pin 346 can be received in a hole 3481 of the window member 348. The chuck pin 346 may be configured to be movable within the hole 3481 of the window member 348. The chuck pin 346 may be coupled to the chuck pin moving unit 400, which will be described later. The chuck pin 346 may be movably configured via the chuck pin moving unit 400. The chuck pin 346 may be configured to move between a contact position in which the chuck pin contacts the side of the substrate W and an open position spaced apart from the side of the substrate W.

[0113] Figure 3 This is a cross-sectional view illustrating a chuck pin and a chuck pin moving unit according to an exemplary embodiment of the present invention, and Figure 4 This is a top plan view illustrating a chuck pin and a chuck pin moving unit according to an exemplary embodiment of the present invention.

[0114] A chuck pin moving unit 400 moves a chuck pin 346. The chuck pin moving unit 400 is coupled to one end of the chuck pin 346 to move the chuck pin 346. The chuck pin moving unit 400 moves the chuck pin 346 in a direction perpendicular to the rotation axis of the spin chuck 342. The chuck pin moving unit 400 moves the chuck pin 346 between a contact position where the chuck pin 346 contacts the side portion of the substrate W and an open position where the chuck pin 346 is spaced apart from the side portion of the substrate W. The chuck pin moving unit 400 moves the chuck pin 346 while the spin chuck 342 is screwed on. The chuck pin moving unit 400 can be configured to electrically move the chuck pin 346 of the rotating spin chuck 342 during normal operation.

[0115] refer to Figure 3 The chuck pin moving unit 400 includes a cam ring 410, a cam ring driver 420, and a slip ring assembly 430.

[0116] The cam ring 410 is rotatable. The cam ring 410 is rotatable to move the chuck pin 346 between an engaged position and an open position. The cam ring 410 may be disposed inside the spinner chuck 342. (Reference) Figure 4The cam ring 410 may include a body 412 and a protrusion 414. The body 412 may be formed in an annular shape. The body 412 may be provided with an annular structure having a diameter larger than the diameter of the through hole 342a of the spin chuck 342. The body 412 may be disposed inside the spin chuck 342. The body 412 may be positioned inside the spin chuck 342 surrounding the spin chuck 342. The body 412 may be positioned around the inner surface of the spin chuck 342.

[0117] The protrusion 414 may protrude from the body 412. The protrusion 414 may protrude from the outer surface of the body 412. The protrusion 414 may protrude from the body 412 in a direction away from the rotational axis of the spin chuck 342. Multiple protrusions 414 may be included. The multiple protrusions 414 may be spaced apart from each other. The multiple protrusions 414 may be provided in a number corresponding to the number of chuck pins 346. The rod member 440 may contact the protrusion 414.

[0118] The protrusion 414 may include a first inclined surface 4142 and a second inclined surface 4244. The first inclined surface 4142 may be formed to have a first angle of inclination relative to the outer surface of the body 412. The second inclined surface 4144 may be formed to have a second angle of inclination relative to the outer surface of the body 412 that is greater than the first angle of inclination. The first inclined surface 4142 and the second inclined surface 4144 may be connected. The first inclined surface 4142 may be formed to be gentler than the second inclined surface 4144. The second inclined surface 4144 may be formed to be steeper than the first inclined surface 4142.

[0119] The cam ring 410 may include a connecting portion 416. The connecting portion 416 may be electrically connected to the cam ring driver 420, which will be described later. The connecting portion 416 may be provided between two adjacent protrusions 414 of a plurality of protrusions 414. The connecting portion 416 may protrude from the body 412. The connecting portion 416 may protrude longer than the protrusions 414. This prevents the protrusions 414 from interfering with the connecting portion 416 or the protrusions 414 and the cam ring driver 420. The connecting portion 416 may include one connecting portion 416. However, the invention is not limited thereto, and multiple connecting portions 416 may be provided. Furthermore, the number of connecting portions 416 may be provided to correspond to the number of cam ring drivers 420.

[0120] A cam ring driver 420 rotates a cam ring 410. The cam ring driver 420 is electrically connected to the cam ring 410. The cam ring driver 420 is electrically connected to the connection portion 416 of the cam ring 410. The cam ring driver 420 is electrically connected to a slip ring assembly 430. For example, the cam ring driver 420 can be connected to the slip ring assembly 430 via wires. The cam ring driver 420 can receive power from the slip ring assembly 430. The cam ring driver 420 can transmit power to the cam ring 410. The cam ring driver 420 can receive power from the slip ring assembly 430 and transmit the received power to the cam ring 410. Alternatively, the cam ring driver 420 can physically contact the cam ring 410 to transmit power supplied from the slip ring assembly 430 to the cam ring 410. When the cam ring driver 420 transmits power to the cam ring 410, the cam ring 410 can rotate. The cam ring driver 420 can be provided as a coil or a small motor. In this case, the coil can be provided as a solenoid. When the cam ring driver 420 is provided as a solenoid, one end of the solenoid is connected to the connection portion 416 of the cam ring 410, while the other end of the solenoid can be connected to the wire 4326 of the slip ring assembly 430. The foregoing has described the case where the cam ring driver 420 is provided as a coil or a small motor, but the invention is not limited thereto, and various power transmission components capable of transmitting electricity can be applied.

[0121] The slip ring assembly 430 provides power to the cam ring driver 420. The slip ring assembly 430 provides power to the cam ring driver 420, allowing the chuck pin 346 to move between an open position and an engaged position while the spin chuck 342 rotates.

[0122] Figure 5 This is a schematic diagram illustrating an example of a slip ring assembly according to an embodiment of the present invention. (Reference) Figure 5 The slip ring assembly 430 includes a ring member 432, a brush member 434, and a moving member 436.

[0123] A ring member 432 is provided rotatably. The ring member 432 rotates together with the spin chuck 342. The ring member 432 is coaxial with the rotation axis of the spin chuck 342. The ring member 432 rotates coaxially with the rotation axis of the spin chuck 342. The ring member 432 is provided rotatably. The ring member 432 rotates together with the spin chuck 342. The ring member 432 can be coupled to the spin chuck 342 to rotate together with it. Alternatively, the ring member 432 can be rotated by receiving power from a rotary actuator 349, which rotates the spin chuck 342. The ring member 432 is configured to surround the spin chuck 342. The ring member 432 can be coupled to the spin chuck 342. The ring member 432 can be disposed outside the spin chuck 342. The ring member 432 can be configured to surround the spin chuck 342. The ring member 432 may be configured to surround the main body 3421 of the spin chuck 342.

[0124] The ring member 432 may include a rotating member 4322 and a conductive ring 4324. The rotating member 4322 may be formed in a ring shape. The rotating member 4322 is arranged to surround the spin chuck 342. The rotating member 4322 is positioned to surround the body portion 3421 of the spin chuck 342 from the outside of the body portion 3421. The rotating member 4322 may have a hole penetrating its interior. The inner diameter of the rotating member 4322 may be larger than the outer diameter of the body portion 3421 of the spin chuck 342. Therefore, a spaced interval at a predetermined distance can be formed between the inner surface of the rotating member 4322 and the outer surface of the body portion 3421 of the spin chuck 342.

[0125] A conductive ring 4324 may be fixed to a rotating member 4322. The conductive ring 4324 may be coupled to the outer circumferential surface of the rotating member 4322. The conductive ring 4324 may contact the outer circumferential surface of the rotating member 4322. The conductive ring 4324 may be configured as a conductive member. Multiple conductive rings 4324 may be coupled to the rotating member 4322. The multiple conductive rings 4324 may be spaced apart from each other by a predetermined distance from the outer circumferential surface of the rotating member 4322. For example, the conductive ring 4324 may be configured as a coil, and the coil may be wound around the outer circumferential surface of the rotating member 4322. The conductive ring 4324 rotates together with the rotating member 4322.

[0126] A signal transmitting member 4326 for transmitting electrical signals may be disposed inside the rotating member 4322. The signal transmitting member 4326 is disposed within a hole in the rotating member 4322. The signal transmitting member 4326 is disposed in the space between the inner surface of the rotating member 4322 and the outer surface of the main body portion 3421 of the spin chuck 342. For example, the signal transmitting member 4326 may be a wire 4326. The wire 4326 may include multiple wires 4326. One end of the wire 4326 is connected to a conductive ring 4324, and the other end is connected to a cam ring driver 420. The wire 4326 can transmit power generated by the slip ring assembly 430 to the cam ring driver 420.

[0127] Brush member 434 includes brush 4342 and support member 4344 supporting brush 4342. Brush 4342 may be provided with a conductive material electrically connectable to conductive ring 4324. Brush member 434 is configured to be movable relative to ring member 432. Brush member 434 is configured to be movable by movable member 436. As an example, movable member 436 may include a motor.

[0128] The brush member 434 is movable either in a direction close to or away from the ring member 432. The brush member 434 is configured to selectively contact the ring member 432 via the movable member 436. When the spin chuck 342 rotates, the brush member 434 is movable either in a direction close to or away from the ring member 432. When the spin chuck 342 rotates, the brush member 434 can selectively contact the ring member 432. Therefore, the chuck pin 346 can be configured to open and close during normal operation, even when the substrate W is rotating.

[0129] As the brush member 434 moves toward the ring member 432, the brush 4342 comes into contact with the conductive ring 4324. When the brush 4342 contacts the conductive ring 4324, it is electrically connected to the conductive ring 4324. In this state, the slip ring assembly 430 is energized, and power is supplied to the cam ring driver 420 via wire 4326. The cam ring driver 420 transmits the received power to the cam ring 410, causing the cam ring 410 to rotate.

[0130] When brush member 434 moves away from ring member 432, brush 4342 does not contact conductive ring 4324. Since brush 4342 is spaced apart from conductive ring 4324, brush 4342 is electrically disconnected from conductive ring 4324. In this case, the slip ring assembly 430 is powered off, and power supply to cam ring driver 420 is stopped. When power supply to cam ring 410 is stopped, cam ring 410 returns to its original position via built-in elastic member.

[0131] The chuck pin moving unit 400 includes a lever member 440. One end of the lever member 440 is coupled to a chuck pin 346, while the other end is in contact with a cam ring 410. The other end of the lever member 440 contacts a protrusion 414 of the cam ring 410. The other end of the lever member 440 contacts a first inclined surface 4142 of the protrusion 414 of the cam ring 410. The other end of the lever member 440 is configured to be movable along the first inclined surface 4142 of the protrusion 414. A ball member 442 for minimizing friction during movement may be provided at the other end of the lever member 440. The lever member 440 may include a plurality of lever members 440, and the plurality of lever members 440 may be connected to each other.

[0132] The following will describe in detail the process of moving the chuck pin 346 by the chuck pin moving unit 400 with reference to the drawings.

[0133] Figure 6 This is a schematic diagram illustrating the chuck pin moving unit when the chuck pin is in the contact position according to an embodiment of the present invention. Figure 7 This diagram schematically illustrates the state of the slip ring assembly when the chuck pin is in the open position according to an embodiment of the present invention. Figure 8 and Figure 9 This diagram schematically illustrates the process by which the chuck pin moves from the contact position to the open position according to an embodiment of the present invention. Figure 10 This is a schematic diagram illustrating the state of the slip ring assembly when the chuck pin is in the contact position according to an embodiment of the present invention, and Figure 11 and Figure 12 This is a schematic diagram illustrating the process of moving the chuck pin from the open position to the contact position according to an embodiment of the present invention.

[0134] refer to Figure 6The protrusion 414 has a first position P1 located on the first inclined surface 4142 closest to the outer surface of the body 412 of the cam ring 410, and a second position P2 located on the first inclined surface 4142 furthest from the outer surface of the body 412 of the cam ring 410. The lever member 440 moves along the first inclined surface 4142 of the protrusion 414. The other end of the lever member 440 moves between the first position P1 and the second position P2 on the first inclined surface 4142. In this case, the lever member 440 does not move directly, but as the cam ring 410 rotates, the lever member 440 contacts the first inclined surface 4142 of the protrusion 414 in a direction closer to the rotation axis of the spin chuck 342 or in a direction farther from the rotation axis of the spin chuck 342 due to the inclination of the first inclined surface 4142. When the other end of the lever member 440 is in the first position P1 or adjacent to the first position P1, the chuck pin 346 coupled to one end of the lever member 440 is in the contact position to grip the side portion of the substrate W. When the other end of the lever member 440 is in the second position P2 or adjacent to the second position P2, the chuck pin 346 coupled to one end of the lever member 440 is in the open position to be spaced apart from the side portion of the substrate W.

[0135] refer to Figure 7 The spin chuck 342 rotates the substrate W at a first speed v1 or a second speed v2, which is faster than the first speed v1. During the rotation of the substrate W at the first speed v1, the chuck pin moving unit 400 moves the chuck pin 346, causing the chuck pin 346 to be in the open position. At this time, the slip ring assembly 430 supplies power to the cam ring driver 420, causing the cam ring 410 to rotate within a predetermined range. Specifically, the moving member 436 moves the brush member 434 in a direction toward the ring member 432, causing the brush 4342 to contact and connect with the conductive ring 4324. When the brush 4342 contacts and connects with the conductive ring 4324, power is supplied to the cam ring driver 420 via the wire 4326, and the cam ring driver 420 supplies power to the connection portion 416 of the cam ring 410. The cam ring 410, receiving power, rotates within the predetermined range.

[0136] refer to Figure 8 and Figure 9 The cam ring 410, powered by the slip ring assembly 430, rotates within a predetermined angular range. For example, the cam ring 410 rotates within an angular range, wherein the other end of the lever member 440 moves within a first inclined surface 4142. The cam ring 410 rotates at an angle A formed by the first position P1 and the second position P2 of the protrusion 414 and the central axis C of the cam ring 410. This defines the range of motion of the lever member 440.

[0137] The cam ring 410 can rotate clockwise or counterclockwise. When the cam ring 410 rotates in one direction to move the chuck pin 346 to the open position, the cam ring 410 rotates in the opposite direction to move the chuck pin 346 to the contact position. In this case, the rotation in one direction is performed by electricity supplied by the slip ring assembly 430, while the rotation in the opposite direction is performed by the restoring force of an elastic member (not shown) mounted on the cam ring 410. Figure 8 and Figure 9 In the illustration, the cam ring 410 rotates clockwise by a predetermined angle A by receiving electrical power from the slip ring assembly 430, and rotates counterclockwise by a predetermined angle A by the elastic force of the elastic member (not shown). However, the invention is not limited to this, and the rotation direction of the cam ring 410 can be applied in various ways depending on the tilt direction of the protrusion 414.

[0138] refer to Figure 8 When the cam ring 410 rotates at a predetermined angle A via the slip ring assembly 430, the other end of the lever member 440, located at the first position P1, moves to the second position P2 along the first inclined surface 4142. In this case, since the first inclined surface 4142 is configured as an upwardly inclined surface in the direction from the first position P1 to the second position P2, the chuck pin 346 coupled to one end of the lever member 440 moves from the contact position to the open position.

[0139] refer to Figure 10 The spin chuck 342 rotates the substrate W at a first speed v1 or a second speed v2, which is faster than the first speed v1. During the rotation of the substrate W at the second speed v2, the chuck pin moving unit 400 moves the chuck pin 346 such that the chuck pin 346 is in a contact position. In this case, the slip ring assembly 430 stops supplying power to the cam ring driver 420. Specifically, the moving member 436 moves the brush member 434 in a direction away from the ring member 432, such that the brush 4342, which was in contact with the conductive ring 4324, is spaced away from the conductive ring 4324. When the brush 4342 is spaced away from the conductive ring 4324, the supply of power to the cam ring driver 420 stops. The cam ring 410, with its power supply stopped, returns to its original position by the restoring force of the elastic member (not shown).

[0140] refer to Figure 11 and Figure 12When the cam ring 410 rotates counterclockwise by a predetermined angle A via the restoring force of this elastic member (not shown), the other end of the lever member 440, located at the second position P2, moves along the first inclined surface 4142 to the first position P1. In this case, since the first inclined surface 4142 is configured as a downwardly inclined surface in the direction from the second position P2 to the first position P1, the chuck pin 346 coupled to one end of the lever member 440 moves from the open position to the contact position.

[0141] Reference Return Figure 2 The substrate processing apparatus 300 includes a heating unit 500. The heating unit 500 is configured to emit a laser beam onto a substrate W. The heating unit 500 may be located on a surface of a substrate support unit 340 that is lower than a window member 348. The heating unit 500 emits the laser beam toward the substrate W located on the substrate support unit 340. The laser beam emitted from the heating unit 500 can pass through the window member 348 of the substrate support unit 340 to be emitted onto the substrate W. Therefore, the substrate W can be heated to a set temperature. The heating unit 500 may include a laser beam generating member (not shown), a laser beam emitting member 500, and a laser beam transmitting member. The laser beam generating member (not shown) may be disposed outside a chamber 310. The laser beam emitting member 500 may include, for example, a lens. The laser beam emitting member 500 may include multiple lenses. The laser beam emitting member 500 may be disposed inside a spin chuck 342. The laser beam transmission member can be configured as a conduit connecting the laser beam generating member (not shown) and the laser beam emitting member 500. The laser beam transmission member can transmit the laser beam generated from the laser beam generating member (not shown) to the laser beam emitting member 500. The laser beam emitting member 500, which receives the laser beam through the laser beam transmission member, can emit the laser beam to the substrate W. While the heating unit 500 has been described above as being configured to emit a laser beam, the invention is not limited thereto, and the heating unit 500 can be configured as various heat sources capable of heating the substrate W. For example, the heating unit 500 can be configured as an LED or a halogen heater.

[0142] The following will be referenced Figures 13 to 17 A method for processing a substrate according to an embodiment of the present invention is described. Figure 13 This is a flowchart of a substrate processing method according to an embodiment of the present invention, and Figures 14 to 17 It is a sequence icon Figure 13 A diagram of the substrate processing method.

[0143] refer to Figure 13 According to an embodiment of the present invention, the substrate processing method includes a substrate alignment operation (S100), a first liquid supply operation (S200), a liquid film heating operation (S300), and a second liquid supply operation (S400).

[0144] Figure 14 This diagram illustrates the substrate alignment operation prior to the start of the substrate processing method according to an embodiment of the present invention. (Reference) Figure 14 Before the process begins, substrate W is transferred to substrate support unit 340. After substrate W is transferred to the upper portion of spin chuck 342, the center of substrate W is aligned with the center of spin chuck 342 or window member 348. In this case, chuck pin 346 is in the open position. When the center of substrate W is aligned with the center of spin chuck 342 or window member 348, chuck pin 346 moves to the contact position to support the side portion of substrate W. In this case, chuck pin 346 is moved by chuck pin moving unit 400.

[0145] Figure 15 The illustration shows a process for forming a molten pool of processing liquid on a substrate according to an embodiment of the present invention. (Reference) Figure 15 With the substrate W supported by the chuck pin 346 of the substrate support unit 340, the spin chuck 342 rotates the substrate W at a first speed v1. The liquid supply unit 390 supplies a first liquid to the substrate W rotating at the first speed v1 to form a first liquid film C1 on the upper surface of the substrate W. The first liquid film C1 may be a molten pool with a predetermined thickness. When the first liquid is supplied to the substrate W, the chuck pin 346 is in the open position. That is, the first liquid film C1 is formed by supplying the first liquid to the substrate W rotating at the first speed v1 while the chuck pin 346 is in the open position, spaced apart from the side portion of the substrate W. When the first liquid film C1 is formed, and when the chuck pin 346 is in the contact position where the chuck pin 346 contacts the side portion of the substrate W, there is a problem that the first liquid flows down the chuck pin 346, making it difficult to maintain a certain amount of liquid film. However, according to the substrate processing method of an exemplary embodiment of the present invention, when the first liquid film C1 is formed, it is formed in an open position where the chuck pin 346 is spaced apart from the side portion of the substrate W, thereby preventing the first liquid from flowing down and maintaining a certain amount of liquid film. Furthermore, since the chuck pin 346 is spaced apart from the side portion of the substrate W, there is an advantage that the first liquid film (molten pool) can be easily formed by the surface tension of the first liquid film C1.

[0146] Figure 16 This diagram illustrates the operation of heating the first liquid film according to a substrate processing method based on an embodiment of the present invention. (Reference) Figure 16When a first liquid film C1 of predetermined thickness is formed, the rotation of the substrate W stops, and the first liquid supply from the liquid supply unit 390 stops. As a result, the surface of the substrate W is covered by the first liquid film C (forming a processing liquid pool). Here, the processing liquid can be an aqueous solution of phosphoric acid. The substrate W and the first liquid film C1 are heated to a temperature suitable for processing the substrate W. The substrate W and the first liquid film C1 can be heated by the heating unit 500. At this time, the chuck pin 346 is in the open position. A laser, LED, or halogen heater can be provided as the heat source for the heating unit 500. The substrate W is processed (for example, an etching process (wet etching process)) by maintaining the surface of the substrate W covered by the first liquid film C1 of the heated processing liquid for a predetermined time period. At this time, the spin chuck 342 rotates the substrate W at a first speed v1. The first liquid on the substrate W is stirred by rotating the substrate W about half a turn in both the forward and reverse rotation directions. As a result, etching is promoted, and the in-plane uniformity of the etching amount is improved.

[0147] Figure 17 This is a diagram illustrating a second liquid supply operation according to an embodiment of the present invention. (Reference) Figure 17 After heating the first liquid film C1, a second liquid is supplied to the substrate W to form a second liquid film C2. At this time, the spin chuck 342 rotates the substrate W at a second speed v2. Furthermore, the chuck pin moving unit 400 moves the chuck pin 346 to a contact position where the chuck pin 346 contacts the side portion of the substrate W. The second liquid can be the same liquid as the first liquid. The second liquid can be an aqueous solution of phosphoric acid. The thickness of the second liquid film C2 can be less than the thickness of the first liquid film C1. The second speed v2 can be faster than the first speed v1. For example, the rotation at the first speed v1 can be a low-speed rotation, while the rotation at the second speed v2 can be a high-speed rotation. For example, the first speed v1 can be equal to or less than 20 RPM.

[0148] according to Figures 15 to 17 The substrate processing can be repeated multiple times. When according to Figures 14 to 17 After the substrate processing is completed, a rinsing process is performed, in which a rinsing solution is supplied to the substrate W to remove byproducts generated by the reaction with the processing solution from the surface of the substrate W. The rinsing solution can be pure water (DIW).

[0149] According to the substrate processing method of an exemplary embodiment of the present invention, in the first liquid supply operation and the liquid film heating operation, the chuck pin 346 is moved to the open position, and in the second liquid supply operation, the chuck pin 346 is moved to the contact position. At this time, according to a general spin chuck structure that moves the chuck pin between the open and contact positions using a 90-degree rotatable rotary cylinder, the chuck pin can only move when the spin chuck stops. Therefore, whenever each operation of the substrate processing method is performed, when the spin chuck must be stopped and the chuck pin must be moved, the process takes a long time and the process efficiency decreases. Furthermore, when the spin chuck stops in each process operation due to stopping the spin chuck and moving the chuck pin, a liquid film with uniform thickness may not be obtained, or the liquid film may become over-hardened, leading to liquid film rupture. Furthermore, when the substrate processing reaches the state where the chuck pin contacts the side portion of the substrate, the chuck is not stopped in each operation of the substrate processing method in the spin chuck structure in the related art. As mentioned above, there is a problem that the liquid film flows along the surface of the chuck pin and thus cannot form a certain amount of liquid film. Moreover, since the contact area between the chuck pin and the side portion of the substrate will reduce the surface tension of the liquid film, it is difficult to form a liquid film of a certain thickness.

[0150] However, according to an embodiment of the invention, even when the spin chuck 342 is rotating, the chuck pin 346 can be moved by using the slip ring assembly 430, wherein normal contact and non-contact functions are implemented via a separately driveable brush member 434, thereby solving the above-mentioned problem.

[0151] Furthermore, in the case of a typical slip ring assembly, the brush is fixed in contact with the ring member. However, the slip ring assembly 430 according to the invention can be configured such that the brush member 434 only contacts the ring member 432 when power needs to be supplied to the cam ring 410, because the brush member 434 is provided separately and movably relative to the ring member 432. In this case, it is possible to overcome the disadvantage of the limited wear resistance of a typical slip ring assembly due to high-speed rotation. That is, there is an advantage in maximizing the durability and lifespan of the slip ring assembly 430.

[0152] Meanwhile, the substrate processing apparatus and substrate processing method according to the above exemplary embodiments can be controlled and executed by a controller (not shown). The configuration, storage, and management of the controller can be implemented in the form of hardware, software, or a combination of hardware and software. The configuration data and / or software of the controller can be stored in volatile or non-volatile storage devices, such as read-only memory (ROM); or memory, such as, for example, random access memory (RAM), memory chips, devices, or integrated circuits, or storage media, such as compact disks (CDs), digital versatile discs (DVDs), magnetic disks, or magnetic tapes, which are optically or magnetically recordable and machine-readable (for example, computers).

[0153] The detailed description above illustrates the present invention. Furthermore, the description is intended to depict exemplary or various exemplary embodiments for carrying out the technical spirit of the invention, and the invention can be used in various other combinations, modifications, and environments. That is, the description can be modified or corrected within the scope of the inventive concepts disclosed in this specification, the equivalent scope of the disclosure, and / or the scope of technology or knowledge in the art. Therefore, the above detailed description of the invention is not intended to limit the invention to the disclosed exemplary embodiments. Furthermore, the appended claims should be interpreted to include other exemplary embodiments as well. Such modified embodiments should not be interpreted separately from the technical spirit or concept of the invention.

Claims

1. An apparatus for processing a substrate, the apparatus comprising: A processing container with processing space; Support unit for supporting and rotating the substrate in the processing space; A liquid supply unit for supplying processing liquid to the substrate supported by the support unit; and A heating unit for heating the substrate. The support unit includes: Spin chuck; A rotary drive for rotating the spin chuck; A plurality of chuck pins mounted on the spin chuck and rotating together with the spin chuck; and A chuck pin moving unit for simultaneously moving all the plurality of chuck pins between a contact position where the plurality of chuck pins contact the side portion of the substrate and an open position where the plurality of chuck pins are spaced apart from the side portion of the substrate. The chuck pin moving unit includes: Cam ring; A cam ring driver for rotating the cam ring; and Slip ring assembly for providing power to the cam ring driver The slip ring assembly includes: A ring member that rotates together with the spin chuck; and A brush member configured to be movable relative to the ring member; and A moving member for moving the brush member in a direction close to or away from the ring member.

2. The device according to claim 1, wherein the chuck pin moving unit moves the plurality of chuck pins while the substrate is rotated by the spin chuck.

3. The device of claim 1, wherein the brush member is configured to selectively contact the ring member via the movable member.

4. The device according to claim 1, wherein the cam ring includes a protrusion projecting from its outer surface, and The chuck pin moving unit includes a rod member having one end coupled to the chuck pin and another end in contact with the protrusion.

5. The device of claim 4, wherein the protrusion comprises a first inclined surface having a first angle relative to the outer surface of the cam ring, and a second inclined surface having a second angle greater than the first angle, and The other end of the rod member is configured to move along the first inclined surface of the protrusion.

6. The device of claim 5, wherein the protrusion comprises a first position on the first inclined surface closest to the outer surface of the cam ring, and a second position on the first inclined surface furthest from the outer surface of the cam ring, and The other end of the rod member moves between the first position and the second position.

7. The device of claim 6, wherein when the other end of the rod member is in the first position, the chuck pin is in the contact position, and When the other end of the rod member is in the second position, the chuck pin is in the open position.

8. The apparatus of claim 7, wherein the spin chuck rotates such that the substrate rotates at a first speed or a second speed faster than the first speed, and When the substrate rotates at the first speed, the chuck pin moving unit positions the chuck pin in the open position.

9. The apparatus of claim 7, wherein the spin chuck rotates such that the substrate rotates at a first speed or a second speed faster than the first speed. When the substrate rotates at the first speed, the brush member contacts the ring member, and When the substrate rotates at the second speed, the brush member does not contact the ring member.

10. The device of claim 9, wherein when the brush member contacts the ring member, the slip ring assembly provides power to the cam ring driver, and When the brush member is not in contact with the ring member, the slip ring assembly does not provide power to the cam ring driver.

11. The device of claim 1, wherein the spin chuck has a through hole penetrating in the vertical direction, and The heating unit heats the bottom surface of the substrate via the through hole.

12. The device of claim 11, wherein the heating unit comprises a laser.

13. The device of claim 12, wherein the spin chuck comprises: Main body; and An extension portion extending upward from the upper end of the main body portion, and The area of ​​the extended portion gradually increases towards the top.

14. A method for processing a substrate, the method comprising the following steps: A first liquid supply operation supplies a first liquid to a substrate that is rotating at a first speed in an open state where a chuck pin for supporting a side portion of the substrate is in an open position spaced apart from the side portion of the substrate, and forms a first liquid film on the substrate. The liquid film heating operation following the first liquid supply operation heats the first liquid film formed on the substrate in the open state; and The second liquid supply operation following the liquid film heating operation supplies the second liquid to the substrate, which is rotating at a second speed faster than the first speed, in a contact state where the chuck pin is in contact with the side portion of the substrate to support the side portion of the substrate. The change from the open state to the contact state is performed while the substrate is rotating.

15. The method of claim 14, wherein the first liquid and the second liquid are the same, and The first liquid is an aqueous solution of phosphoric acid.

16. The method of claim 14, wherein the amount of second liquid supplied per unit time in the second liquid supply operation is greater than the amount of first liquid supplied per unit time in the first liquid supply operation.

17. The method of claim 14, wherein during the liquid film heating operation, the substrate rotates at the first speed and the first liquid is not supplied to the substrate.

18. The method according to any one of claims 14 to 17, wherein the chuck pin is configured to move between the open position and the contact position via the chuck pin moving unit, and The chuck pin moving unit includes: Cam ring; Cam ring driver for rotating the cam ring; and The slip ring assembly is used to provide power to the cam ring driver, and The slip ring assembly includes: Ring components; A brush member configured to move relative to the ring member; and A moving member for moving the brush member in a direction close to or away from the ring member.

19. A method for processing a substrate using the apparatus for processing a substrate according to claim 1, the method comprising the steps of: A first liquid supply operation supplies a first liquid to a substrate that is rotating at a first speed in the open state where the chuck pin is in the open position, and forms a first liquid film on the substrate. The liquid film heating operation following the first liquid supply operation heats the first liquid film formed on the substrate in the open state when the chuck pin is in the open position; and The second liquid supply operation following the liquid film heating operation supplies a second liquid to the substrate, which is rotating at a second speed faster than the first speed, in a contact state where the chuck pin is in the contact position. The change of the chuck pin from the open state to the contact state is performed while the substrate is rotating.

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