A method for manufacturing a copper-based boss plate

Abstract

This invention provides a method for manufacturing a copper-based boss board, comprising the following steps: S1: Material preparation: copper foil with a thickness of 0.035mm, PP prepreg with a thickness of 0.1mm, and copper plate with a thickness of 1.0mm, cut into panel sizes; S2: Pressing: pressing the copper foil, PP, and copper plate under high temperature and pressure to form a copper substrate; S3: Routing: using a depth-controlled router to router a depth-controlled blind groove at the designed position of the boss copper; the router is a depth-controlled router, and the depth is controlled to penetrate the dielectric layer to ensure that the bottom surface of the blind groove is inside the copper plate, and the depth of the blind groove is controlled at 0.160±0.025mm; S4: Electroless copper plating: performing PTH chemical electroless copper plating on the wall of the tank, and then plating a thin layer of copper on the whole. The present invention provides a method for manufacturing a copper-based boss plate. By using the above-mentioned manufacturing method, the plate after lamination can be processed, reducing the previous processes such as PP, copper foil windowing, and riveting. It avoids quality problems in the lamination and adhesive removal processes, and eliminates the need to etch copper to make the boss, thus reducing costs.

Description

Technical Field

[0001] This invention relates to the field of copper substrates, and more particularly to a method for manufacturing a copper-based boss plate. Background Technology

[0002] Copper substrates are the most expensive type of metal substrates. Their thermal conductivity is many times better than that of aluminum and iron substrates. They are suitable for high-frequency circuits, areas with large temperature variations, heat dissipation of precision communication equipment, and the building decoration industry.

[0003] Currently, this type of copper-based boss product mainly involves first fabricating a copper plate with bosses, then creating windows in the PP and copper foil at the corresponding boss positions, and finally laminating them together to form a copper substrate with bosses. Finally, the copper foil layer is used to complete the pattern circuitry, thus achieving functional fabrication. However, the height of the bosses and the thickness of the PP dielectric vary during the manufacturing process. When the boss height exceeds 30µm beyond the combined thickness of the PP dielectric and copper foil, delamination and board bursting may occur around the boss due to pressure loss. If the boss height is less than 30µm beyond the combined thickness of the PP and copper foil, a thick layer of excess adhesive on the top of the boss is difficult to remove. Brushing and polishing can expose the substrate around the boss, making copper plating prone to blistering. High alignment is required for the slotting and bossing; misalignment can cause cracks on the boss edges. Furthermore, the presence of chemicals during the manufacturing process can contaminate the equipment and chemicals, leading to cross-contamination between boards.

[0004] Therefore, it is necessary to provide a method for manufacturing a copper-based boss plate to solve the above-mentioned technical problems. Summary of the Invention

[0005] This invention provides a method for manufacturing a copper-based boss board, solving the problems of fluctuations in boss height and PP dielectric thickness. Specifically, when the boss height exceeds 30µm beyond the combined thickness of the PP dielectric and copper foil, delamination and board bursting occur around the boss due to pressure loss. Conversely, when the boss height is less than 30µm beyond the combined thickness of the PP dielectric and copper foil, a thick layer of excess adhesive remains on the top of the boss, which is difficult to remove. Brushing and polishing can expose the substrate around the copper boss, hindering quality control. To address these technical problems, [the following method is provided].

[0006] The present invention provides a method for manufacturing a copper-based boss plate, comprising the following steps:

[0007] S1: Material preparation: copper foil thickness 0.035mm, PP prepreg thickness 0.1mm, copper plate (pure copper plate) thickness 1.0mm, cut into panel sizes;

[0008] S2: Lamination: Copper foil, PP, and copper plate are pressed together under high temperature and pressure to form a copper substrate;

[0009] S3: Routing groove: A depth-controlled router is used to router a blind groove at the design position of the raised copper. The router is a depth-controlled router, and the depth is controlled to penetrate the dielectric layer to ensure that the bottom surface of the blind groove is inside the copper plate. The depth of the blind groove is controlled at 0.160±0.025mm.

[0010] S4: Electroless Copper Plating: PTH chemical electroless copper plating is performed on the tank wall, and then a thin layer of copper is plated on the whole; first, the adhesive is removed to remove the residual adhesive residue on the tank wall; then a layer of chemical copper is deposited in the PTH tank with a thickness of 0.3-0.5um; then another layer of copper is plated with a thickness of 3-5um.

[0011] S5: Dry film: A layer of photosensitive film is attached to the tank surface. Through the principle of exposure and development, the dry film is opened at the tank position; the alignment accuracy of the exposure machine is required to be ≤50um, and the window opening is compensated outward by 50um.

[0012] S6: Pattern plating: Use a pattern plating line to fill the blind tank; use a hole-filling plating line with a current of 12-15 ASF and a plating time of 320 min.

[0013] S7: Film Removal: The dry film is peeled off through the film removal line; the film removal solution used is a 5% NaOH solution;

[0014] S8: Grinding plate: Use ceramic grinding plate line to flatten the copper surface at the protruding copper position; ensure that the height difference between the protruding copper position and the surrounding area is ≤20um;

[0015] S9: Graphic Circuit: Create graphic circuits on the copper foil surface to complete the functional design;

[0016] S10: Solder mask, text: According to customer requirements, the production of protective green paint and text markings on the online surface is a normal PCB process;

[0017] S11: Forming: The normal process of forming the board into the pcs board required by the customer by the milling machine.

[0018] Preferably, a cutting device is required for cutting in S1. The cutting device includes a worktable, and grooves are provided on both sides of the worktable. A slider is slidably connected inside the groove.

[0019] Preferably, a telescopic rod is fixedly installed on the outer side of the slider, and a connecting column is fixedly installed at the output end of the telescopic rod.

[0020] Preferably, the connecting column has a connecting groove inside, and a hollow slider is slidably connected inside the connecting groove. Connecting frames are fixedly installed on both sides of the hollow slider.

[0021] Preferably, a motor is fixedly installed on the top of the connecting frame, and a hollow fixing plate is fixedly installed on the bottom of the connecting frame and at the bottom of the connecting column.

[0022] Preferably, the bottom of the hollow fixing plate is provided with a circular groove, and both sides inside the circular groove are slidably connected with arc-shaped sliders.

[0023] Preferably, a rotating disk is fixedly installed at the bottom of the arc-shaped slider, the top of the rotating disk is fixedly installed at one end of the motor output shaft, and a cutting device is fixedly installed on the left side of the rotating disk.

[0024] Preferably, fixing holes are provided at the top and bottom of both sides of the connecting frame, and pulleys are fixedly installed on the front and back sides of both sides of the connecting column, with belts provided on the surface of the pulleys.

[0025] Preferably, the belt passes through the fixing hole and is connected to another pulley for transmission, and limit rings are fixedly installed on both sides of the top of the belt and on the outside of the connecting frame.

[0026] Preferably, a dual-axis motor is fixedly installed on the right side of the connecting column, and one end of the output shaft of the dual-axis motor is fixedly installed to the inner side of the pulley.

[0027] Compared with related technologies, the method for manufacturing a copper-based boss plate provided by the present invention has the following advantages:

[0028] This invention provides a method for manufacturing a copper-based boss plate. By using the above-described manufacturing method, the plate after lamination can be processed, reducing the preceding processes such as PP, copper foil windowing, and riveting. It avoids quality problems in the lamination and adhesive removal processes, and eliminates the need to etch copper to create the boss, thus reducing costs. Attached Figure Description

[0029] Figure 1 This is a schematic diagram of a preferred embodiment of a method for manufacturing a copper-based boss plate provided by the present invention.

[0030] Figure 2 A schematic diagram of the cutting device for a method of manufacturing a copper-based boss plate provided by the present invention;

[0031] Figure 3 for Figure 2 The diagram shows the external three-dimensional structure.

[0032] Figure 4 for Figure 2 The diagram shows the structure of the connecting column;

[0033] Figure 5 for Figure 2 The diagram shows the structure of the bottom of the hollow fixing plate.

[0034] Figure 6A schematic diagram of the second embodiment of the cutting device for a method of manufacturing a copper-based boss plate provided by the present invention;

[0035] Figure 7 for Figure 6 The diagram shows the overall top structure.

[0036] The diagram labels are as follows: 1. Workbench; 2. Slide rail; 3. Slider; 4. Telescopic rod; 5. Connecting column; 6. Connecting slide rail; 7. Hollow slider; 8. Connecting frame; 9. Motor; 10. Hollow fixing plate; 11. Circular slide rail; 12. Arc-shaped slider; 13. Rotary disk; 14. Cutting device; 15. Fixing hole; 16. Pulley; 17. Dual-axis motor; 18. Belt; 19. Limit ring.

[0037] 20. Through hole; 21. Movable frame; 22. Second telescopic rod; 23. Fixing plate; 24. Mounting hole; 25. Threaded rod; 26. Pressure plate; 27. Threaded block. Detailed Implementation

[0038] The present invention will be further described below with reference to the accompanying drawings and embodiments.

[0039] Please refer to the following: Figure 1 , Figure 2 , Figure 3 , Figure 4 and Figure 5 ,in, Figure 1 This is a schematic diagram of a preferred embodiment of a method for manufacturing a copper-based boss plate provided by the present invention. Figure 2 A schematic diagram of the cutting device for a method of manufacturing a copper-based boss plate provided by the present invention; Figure 3 for Figure 2 The diagram shows the external three-dimensional structure. Figure 4 for Figure 2 The diagram shows the structure of the connecting column; Figure 5 for Figure 2 The diagram shows the structural bottom of the hollow fixing plate. A method for manufacturing a copper-based boss plate includes the following steps:

[0040] S1: Material preparation: copper foil thickness 0.035mm, PP prepreg thickness 0.1mm, copper plate (pure copper plate) thickness 1.0mm, cut into panel sizes;

[0041] S2: Lamination: Copper foil, PP, and copper plate are pressed together under high temperature and pressure to form a copper substrate;

[0042] S3: Routing groove: A depth-controlled router is used to router a blind groove at the design position of the raised copper. The router is a depth-controlled router, and the depth is controlled to penetrate the dielectric layer to ensure that the bottom surface of the blind groove is inside the copper plate. The depth of the blind groove is controlled at 0.160±0.025mm.

[0043] S4: Electroless Copper Plating: PTH chemical electroless copper plating is performed on the tank wall, and then a thin layer of copper is plated on the whole; first, the adhesive is removed to remove the residual adhesive residue on the tank wall; then a layer of chemical copper is deposited in the PTH tank with a thickness of 0.3-0.5um; then another layer of copper is plated with a thickness of 3-5um.

[0044] S5: Dry film: A layer of photosensitive film is attached to the tank surface. Through the principle of exposure and development, the dry film is opened at the tank position; the alignment accuracy of the exposure machine is required to be ≤50um, and the window opening is compensated outward by 50um.

[0045] S6: Pattern plating: Use a pattern plating line to fill the blind tank; use a hole-filling plating line with a current of 12-15 ASF and a plating time of 320 min.

[0046] S7: Film Removal: The dry film is peeled off through the film removal line; the film removal solution used is a 5% NaOH solution;

[0047] S8: Grinding plate: Use ceramic grinding plate line to flatten the copper surface at the protruding copper position; ensure that the height difference between the protruding copper position and the surrounding area is ≤20um;

[0048] S9: Graphic Circuit: Create graphic circuits on the copper foil surface to complete the functional design;

[0049] S10: Solder mask, text: According to customer requirements, the production of protective green paint and text markings on the online surface is a normal PCB process;

[0050] S11: Forming: The normal process of forming the board into the pcs board required by the customer by the milling machine.

[0051] The cutting process in S1 requires the use of a cutting device, which includes a workbench 1. Both sides of the workbench 1 are provided with sliding grooves 2, and a slider 3 is slidably connected inside the sliding grooves 2.

[0052] A telescopic rod 4 is fixedly installed on the outer side of the slider 3, and a connecting column 5 is fixedly installed on the output end of the telescopic rod 4.

[0053] The connecting column 5 has a connecting groove 6 inside, and a hollow slider 7 is slidably connected inside the connecting groove 6. Connecting brackets 8 are fixedly installed on both sides of the hollow slider 7.

[0054] A motor 9 is fixedly installed on the top of the connecting frame 8, and a hollow fixing plate 10 is fixedly installed on the bottom of the connecting frame 8 and at the bottom of the connecting column 5.

[0055] The bottom of the hollow fixing plate 10 is provided with a circular groove 11, and both sides of the circular groove 11 are slidably connected to arc-shaped sliders 12.

[0056] The interaction between the arc-shaped slider 12 and the circular groove 11 can prevent all the gravity of the rotating disk 13 and the cutting device 14 from acting on the output shaft of the motor 9, thus avoiding a shortened service life.

[0057] A rotating disk 13 is fixedly installed at the bottom of the arc-shaped slider 12, and the top of the rotating disk 13 is fixedly installed at one end of the output shaft of the motor 9. A cutting device 14 is fixedly installed on the left side of the rotating disk 13.

[0058] Fixing holes 15 are provided at the top and bottom of both sides of the connecting frame 8. Pulleys 16 are fixedly installed on the front and back sides of both sides of the connecting column 5. A belt 18 is provided on the surface of the pulley 16.

[0059] The belt 18 passes through the fixing hole 15 and is connected to the other pulley 16 for transmission. Limiting rings 19 are fixedly installed on both sides of the top of the belt 18 and on the outside of the connecting frame 8.

[0060] Since the connecting frame 8 has two fixing holes 15, and the belt 18 passes through the fixing holes 15 in the lateral position, the rotation of the belt 18 will not be affected by the connecting frame 8. Since the limiting rings 19 are fixedly installed on both sides of the top surface of the belt 18 and on both sides of the connecting frame 8, the belt 18 drives the limiting rings 19 to move and thus drives the moving frame 18 to move. The dual-axis motor 17 is a servo motor that can rotate in different directions, so the connecting frame 8 can move longitudinally and laterally on the connecting column 5, thus allowing the cutting device 14 to perform longitudinal position adjustment.

[0061] A dual-axis motor 17 is fixedly installed on the right side of the connecting column 5, and one end of the output shaft of the dual-axis motor 17 is fixedly installed on the inner side of the pulley 16.

[0062] The working principle of the method for manufacturing a copper-based boss plate provided by this invention is as follows:

[0063] By placing the object on the worktable 1, the motor 9 can be started according to the actual shape required for cutting. The rotation of the motor 9 drives the rotating disk 13 to rotate, which in turn drives the arc-shaped slider 12 to slide inside the circular groove 11. The rotation of the rotating disk 13 drives the cutting device 14 to rotate until the cutting device 14 is adjusted to the appropriate working direction.

[0064] Simultaneously, the dual-axis motor 17 can be started, and the rotation of the dual-axis motor 17 drives the pulley 16 to rotate, which in turn drives the belt 18 to rotate. Subsequently, the rotation of the belt 18 changes the position of the limiting ring 19, thereby causing the connecting frame 8 located between the limiting rings 19 to move. The movement of the connecting frame 8 drives the hollow slider 7, causing the hollow slider 7 to slide inside the connecting groove 6. This causes the motor 9, hollow fixing plate 10, rotating disk 13, cutting device 14, and other related structures to move until the cutting device 14 moves to the appropriate position. In this state, the longitudinal position of the cutting device 14 is adjusted.

[0065] At the same time, the cutting device 14 can be activated, and the subsequent cutting work is carried out by the rotation of the cutting device 14. At the same time, the telescopic rod 4 can be activated, and the connecting column 5 is moved downward by the retraction of the telescopic rod 4, which will cause the cutting device 14 to come into contact with the object and carry out the cutting.

[0066] Then, by pushing the slider 3, it can be made to move laterally inside the groove 2, thus driving the telescopic rod 4 to move synchronously. Subsequently, it will drive the connecting column 5 and all the structures installed on the connecting column 5 to move laterally synchronously, thus performing the transverse cutting work.

[0067] Compared with related technologies, the method for manufacturing a copper-based boss plate provided by the present invention has the following advantages:

[0068] By using the above manufacturing method, the laminated board can be processed, reducing the previous processes such as PP and copper foil windowing and riveting, avoiding quality problems in the lamination and adhesive removal processes, and eliminating the need to create bosses by etching copper, thus reducing costs.

[0069] The cutting equipment can be easily cut by the cooperation of the following structures: workbench 1, slide 2, slider 3, telescopic rod 4, connecting column 5, connecting slide 6, hollow slider 7, connecting frame 8, motor 9, hollow fixing plate 10, circular slide 11, arc slider 12, rotating disk 13, cutting device 14, fixing hole 15, pulley 16, dual-axis motor 17, belt 18, and limiting ring 19. This allows for convenient cutting of different shapes, thus improving the overall practicality of the cutting equipment.

[0070] Second Embodiment

[0071] Please refer to the following: Figure 6 and Figure 7Based on the method for manufacturing a copper-based boss plate provided in the first embodiment of this application, the second embodiment of this application proposes another method for manufacturing a copper-based boss plate. The second embodiment is merely a preferred embodiment of the first embodiment, and the implementation of the second embodiment will not affect the separate implementation of the first embodiment.

[0072] Specifically, the difference in the manufacturing method of a copper-based boss plate provided in the second embodiment of this application is that, in the manufacturing method of a copper-based boss plate, through holes 20 are provided on all four sides of the inside of the workbench 1, a movable frame 21 is provided inside the through holes 20, a second telescopic rod 22 is fixedly installed at the bottom of the movable frame 21, the output end of the second telescopic rod 22 is fixedly installed at the bottom of the workbench 1, and a fixing plate 23 is fixedly installed at the top of the movable frame 21 and located at the top of the workbench 1, and the fixing plate 23 has mounting holes 24 inside.

[0073] A rubber pad is fixedly installed at the bottom of the pressure plate 26, which prevents the pressure plate 26 from damaging objects during operation.

[0074] A threaded rod 25 is provided inside the mounting hole 24. A threaded block 27 is fitted on the surface of the threaded rod 25. The inner side of the threaded block 27 is rotatably connected to the outer side of the fixing plate 23. A pressure plate 26 is fixedly installed on one end of the inner side of the threaded rod 25.

[0075] Because the pressure plate 26 has a long service length, it can adapt to different objects. At the same time, because of its long service length, the rotation of the threaded block 27 will not cause the threaded rod 25 to rotate too much, which would prevent the pressure plate 26 from working properly. And when the threaded block 27 is rotated, the pressure plate 26 can be controlled to not rotate.

[0076] The working principle of the method for manufacturing a copper-based boss plate provided by this invention is as follows:

[0077] When it is necessary to press an object onto the worktable 1, the object can be placed on the worktable 1, and then the threaded blocks 27 on both sides can be manually rotated in sequence according to the actual length of the object. As the threaded blocks 27 can only rotate, the threaded rod 25 will move laterally inside the threaded blocks 27 and inside the mounting hole 24. The lateral movement of the threaded rod 25 will drive the pressure plate 26 to move.

[0078] Therefore, the position of the pressure plate 26 is changed until it is above the object. Then, the second telescopic rod 22 is activated, and the extension of the second telescopic rod 22 drives the moving frame 21 to move downward. The moving frame 21 moves downward inside its through hole 20, and at the same time, it drives the fixed plate 23 and all the structures installed on the fixed plate 23 to move downward. Thus, the pressure plate 26 presses the object onto the worktable 1.

[0079] Compared with related technologies, the method for manufacturing a copper-based boss plate provided by the present invention has the following advantages:

[0080] Through the cooperation of the through hole 20, the movable frame 21, the second telescopic rod 22, the fixed plate 23, the mounting hole 24, the threaded rod 25, the pressure plate 26, the threaded block 27 and other structures, copper-based convex and concave plates of different sizes can be pressed onto the worktable for cutting. Therefore, the stability of the cutting work can be improved, and the structure is simple and easy to operate.

[0081] The above description is merely an embodiment of the present invention and does not limit the patent scope of the present invention. Any equivalent structural or procedural transformations made based on the content of the present invention specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of the present invention.

Claims

1. A method for manufacturing a copper-based boss plate, characterized in that, Includes the following steps: S1: Material preparation: copper foil thickness 0.035mm, PP prepreg thickness 0.1mm, copper plate (pure copper plate) thickness 1.0mm, cut into panel sizes; S2: Lamination: Copper foil, PP, and copper plate are pressed together under high temperature and pressure to form a copper substrate; S3: Routing groove: A depth-controlled router is used to router a blind groove at the design position of the raised copper. The router is a depth-controlled router, and the depth is controlled to penetrate the dielectric layer to ensure that the bottom surface of the blind groove is inside the copper plate. The depth of the blind groove is controlled at 0.160±0.025mm. S4: Electroless Copper Plating: PTH chemical electroless copper plating is performed on the tank wall, and then a thin layer of copper is plated on the whole; first, the adhesive is removed to remove the residual adhesive residue on the tank wall; then a layer of chemical copper is deposited in the PTH tank with a thickness of 0.3~0.5um; then another layer of copper is plated with a thickness of 3~5um. S5: Dry film: A layer of photosensitive film is attached to the tank surface. Through the principle of exposure and development, the dry film is opened at the tank position; the alignment accuracy of the exposure machine is required to be ≤50um, and the window opening is compensated outward by 50um. S6: Pattern plating: Use a pattern plating line to fill the blind tank; use a hole-filling plating line with a current of 12~15ASF and a plating time of 320min. S7: Film Removal: The dry film is peeled off through the film removal line; the film removal solution used is a 5% NaOH solution; S8: Grinding plate: Use ceramic grinding plate line to flatten the copper surface at the protruding copper position; ensure that the height difference between the protruding copper position and the surrounding area is ≤20um; S9: Graphic Circuit: Create graphic circuits on the copper foil surface to complete the functional design; S10: Solder mask, text: According to customer requirements, the production of protective green paint and text markings on the online surface is a normal PCB process; S11： Forming: The normal process is to use a milling machine to mill the board into pcs boards as required by the customer, which are copper-based boards. The cutting process in S1 requires the use of a cutting device, which includes a worktable. Both sides of the worktable are provided with sliding grooves, and a slider is slidably connected inside the sliding grooves. A telescopic rod is fixedly installed on the outer side of the slider, and a connecting column is fixedly installed on the output end of the telescopic rod; The connecting column has a connecting groove inside, and a hollow slider is slidably connected inside the connecting groove. Connecting brackets are fixedly installed on both sides of the hollow slider. A motor is fixedly installed on the top of the connecting frame, and a hollow fixing plate is fixedly installed on the bottom of the connecting frame and at the bottom of the connecting column. The bottom of the hollow fixing plate is provided with a circular groove, and both sides inside the circular groove are slidably connected to arc-shaped sliders. A rotating disk is fixedly installed at the bottom of the arc-shaped slider, the top of the rotating disk is fixedly installed at one end of the motor output shaft, and a cutting device is fixedly installed on the left side of the rotating disk. Fixing holes are provided at the top and bottom of both sides of the inside of the connecting frame. Pulleys are fixedly installed on the front and back sides of both sides of the connecting column, and belts are provided on the surface of the pulleys. The belt passes through the fixing hole and is connected to the other pulley for transmission. Limiting rings are fixedly installed on both sides of the top of the belt and on the outside of the connecting frame. A dual-axis motor is fixedly installed on the right side of the connecting column, and one end of the output shaft of the dual-axis motor is fixedly installed to the inner side of the pulley.

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