Electronic devices

Abstract

The present invention relates to an electronic device. The subject of the present invention is to adjust the temperature balance between frames and improve the cooling capacity. The electronic device comprises: a first frame, on which a substrate with a processing device installed is mounted; a second frame, on which a battery device is mounted; and a hinge device, which connects the first frame and the second frame so that they can rotate relative to each other. The electronic device also comprises: a back-sealing member made of a heat-conductive material, which extends along a first edge portion of the first frame and a second edge portion of the second frame, and is configured to cover a gap formed between the first edge portion and the second edge portion in a first posture, and to span the first edge portion and the second edge portion in a second posture; a first heat-conducting component, which is disposed on the inner surface of the first frame and contacts the back-sealing member in the second posture; and a second heat-conducting component, which is disposed on the inner surface of the second frame and contacts the back-sealing member in the second posture.

Description

Technical Field

[0001] The present invention relates to an electronic device formed by connecting a plurality of frames by a hinge device. Background Art

[0002] In recent years, foldable electronic devices using flexible displays such as organic EL have been proposed (for example, see Patent Document 1).

[0003] Patent Document 1: Japanese Patent Application Publication No. 2021-015522

[0004] As an electronic device as described above, a substrate (motherboard) on which a CPU and the like are mounted is mounted on one of the left and right frames, and a battery device is mounted on the other. Such a structure has the following advantages: by mounting the substrate and the battery device on different frames, even if a frame is made small and thin, the installation area of ​​the substrate and the battery device can be sufficiently ensured.

[0005] However, in such a structure, the heat generated in the frame on the substrate side where the CPU and other processing devices are installed is significantly greater than the heat generated in the frame on the battery device side, resulting in a temperature difference between the frames. However, due to the influence of miniaturization and thinness of the frames of the above-mentioned electronic devices, it is sometimes difficult to install a cooling device with high cooling capacity. As a result, there is a concern that the performance of the CPU and other electronic devices will be reduced, or a local high temperature portion (hot spot) will be generated on the outer surface of the frame on the substrate side. Summary of the invention

[0006] The present invention has been made in view of the above-mentioned problems in the prior art, and an object of the present invention is to provide an electronic device capable of adjusting the temperature balance between frames and improving the cooling capacity.

[0007] The electronic device involved in the first aspect of the present invention comprises: a first frame body carrying a substrate on which a processing device is mounted; a second frame body disposed adjacent to the first frame body and carrying a battery device; a hinge device that connects the first frame body and the second frame body so as to be relatively rotatable between a first posture in which the first frame body and the second frame body are stacked in a manner overlapping each other in a plane direction, and a second posture in which the first frame body and the second frame body are arranged in a direction perpendicular to the plane direction; a back-sealing member made of a heat-conductive material that extends along a first edge portion of the first frame body adjacent to the second frame body and a second edge portion of the second frame body adjacent to the first frame body, and is configured to cover a gap formed between the first edge portion and the second edge portion in the first posture and to span the first edge portion and the second edge portion in the second posture; a first heat-conducting component disposed on the inner surface of the first frame body and in contact with the back-sealing member in the second posture; and a second heat-conducting component disposed on the inner surface of the second frame body and in contact with the back-sealing member in the second posture.

[0008] According to the above aspect of the present invention, the temperature balance between the frames can be adjusted and the cooling capacity can be improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] Figure 1 This is a perspective view showing a state where the electronic device according to one embodiment is closed and in a 0-degree posture.

[0010] Figure 2 It is a schematic representation of Figure 1 The electronic device is shown in a top view in a state where it is opened at 180 degrees.

[0011] Figure 3 It is schematically indicated Figure 2 A top view of the internal structure of the electronic device shown.

[0012] Figure 4A It is a side cross-sectional view schematically showing the internal structure of the electronic device in a 180-degree posture.

[0013] Figure 4B It means from Figure 4A The state shown is a side cross-sectional view of a state in the middle of starting to rotate the frame bodies to the 0-degree posture.

[0014] Figure 4C Yes Figure 4A The electronic device shown is a side cross-sectional view in a state where the electronic device is in a 0 degree posture.

[0015] Figure 5 It is a side cross-sectional view schematically showing the internal structure of the electronic device according to the first modification example in a state where the electronic device is in a 180-degree posture.

[0016] Figure 6 It is a side cross-sectional view schematically showing the internal structure of the electronic device according to the second modification example in a state where the electronic device is in a 180-degree posture.

[0017] Description of Reference Numerals

[0018] 10, 40, 50…electronic device; 12A…first frame; 12B…second frame; 13A…first bottom cover; 13B…second bottom cover; 14…hinge device; 16…display; 17…substrate; 17a…CPU; 18…battery device; 26…hinge body; 26a…ridge member; 30A…first heat-conducting component; 30B…second heat-conducting component; 31A, 51A…first cushioning component; 31B, 51B…second cushioning component. DETAILED DESCRIPTION

[0019] Hereinafter, the electronic device according to the present invention will be described in detail with reference to the drawings by listing preferred embodiments.

[0020] Figure 1 This is a perspective view showing a state where the electronic device 10 according to one embodiment is closed and in a 0-degree posture. Figure 2 It is a schematic representation of Figure 1 The illustrated electronic device 10 is a plan view showing a state in which the electronic device 10 is opened to a 180-degree posture. Figure 3 It is schematically indicated Figure 2 A top view of the internal structure of the electronic device 10 is shown.

[0021] like Figure 1 to Figure 3 As shown, the electronic device 10 includes a first housing 12A, a second housing 12B, a hinge device 14, and a display 16. In this embodiment, the electronic device 10 is used as a tablet PC or a notebook PC that can be folded like a book. The electronic device 10 may also be a mobile phone, a smart phone, a portable game console, etc.

[0022] Each frame 12A, 12B is arranged adjacent to each other, and the adjacent edges 12Aa, 12Ba are connected to each other so as to be relatively rotatable by a hinge device 14. The first frame 12A is composed of a first bottom cover 13A of a plate shape forming the back side and a vertical wall 13Aa forming the side of three sides other than the first edge 12Aa. The second frame 12B has a second bottom cover 13B of a plate shape forming the back side and a vertical wall 13Ba forming the side of three sides other than the second edge 12Ba. Each frame 12A, 12B is composed of a metal such as a magnesium alloy, stainless steel or an aluminum alloy, or a resin such as polycarbonate. The frames 12A, 12B of this embodiment are magnesium alloys.

[0023] like Figure 3 As shown, the first frame 12A is equipped with a substrate 17. The substrate 17 is a motherboard, for example, electronic components such as a CPU (Central Processing Unit) 17a, a communication module 17b, and an SSD (Solid State Drive) 17c are installed. The CPU 17a is a processing device that performs calculations related to the main control or processing of the electronic device 10. The CPU 17a is the largest heat generating body among the electronic components mounted on the electronic device 10. The communication module 17b is, for example, a device that performs information processing of wireless communications transmitted and received via an antenna mounted on the second frame 12B, for example, corresponding to a wireless WAN or a fifth generation mobile communication system. The SSD 17c is a storage device using a semiconductor memory. In addition to the substrate 17, the first frame 12A is also equipped with various components. The communication module 17b and the SSD 17c are heat generating bodies whose heat generation is second only to that of the CPU 17a.

[0024] The second housing 12B is equipped with a battery device 18. The battery device 18 is a secondary battery that serves as a power source for the electronic device 10. In addition to the battery device 18, various components are also mounted on the second housing 12B. The battery device 18 is connected to the substrate 17 via a flexible substrate or the like that spans the edge portions 12Aa and 12Ba. The heat generated by the battery device 18 is smaller than that of the CPU 17a or the like. Therefore, the heat generated in the first housing 12A of the electronic device 10 is greater than the heat generated in the second housing 12B.

[0025] In the following description of the electronic device 10, the arrangement direction of the frames 12A and 12B is referred to as the X direction, the direction along the edges 12Aa and 12Ba perpendicular thereto is referred to as the Y direction, and the thickness direction of the frames 12A and 12B is referred to as the Z direction. In addition, regarding the angle posture between the frames 12A and 12B, the state in which the frames 12A and 12B are stacked so as to overlap each other in the plane direction is referred to as the 0 degree posture (see Figure 1 and Figure 4C ), the state in which the two sides are arranged in a direction perpendicular to the plane direction (X direction) is called a 180-degree posture (refer to Figure 2 to Figure 4A ) is used for illustration. A posture between 0 and 180 degrees is called an appropriate angle. Figure 4B The posture shown is called a 90-degree posture. These angles are for ease of explanation. Of course, in actual products, there may be situations where the angle position is slightly deviated from the accurate angle position represented by the angle number. In this embodiment, these deviated angle positions are called 0-degree postures for explanation.

[0026] Figure 4A , Figure 4B , Figure 4C The schematic side cross-sectional views of the electronic device 10 are respectively in a 180-degree posture, a 90-degree posture, and a 0-degree posture.

[0027] like Figure 4A to Figure 4C As shown, the frames 12A and 12B are connected by a hinge device 14 so as to be relatively rotatable between two angle positions (in this embodiment, between a 0 degree position and a 180 degree position). Figure 4C In the 0 degree posture shown, the frames 12A and 12B are stacked so as to overlap each other in the plane direction. Figure 4A In the 180-degree posture shown, the frame bodies 12A and 12B are arranged side by side in a direction (X direction) perpendicular to the plane direction.

[0028] The display 16 is a flexible display extending between the housings 12A and 12B. Figure 4CIn the 0-degree posture shown, the display 16 is arranged so that the area RA on the first frame body 12A side faces the area RB on the second frame body 12B side, and the boundary area between the areas RA and RB, that is, the bending area R, is bent into an arc shape. Figure 4A In the 180-degree posture shown, the regions RA, R, and RB of the display 16 are arranged on the XY plane and are in the shape of a flat plate as a whole (see also Figure 2 ).

[0029] The back surface 16a of the display 16 is supported by the housings 12A, 12B and the hinge device 14, and the front surface 16b is used as an image display surface. The display 16 is located at the uppermost part of the housings 12A, 12B in the Z direction. The display 16 is a paper-like structure made of, for example, organic EL or the like.

[0030] The area RA of the display 16 is relatively fixed to the first frame 12A, and the area RB is relatively fixed to the second frame 12B. Specifically, the back surface 16a of the area RA is supported by the first plate 24A and the first support plate 27A, and is fixed to the first frame 12A via the first plate 24A. The back surface 16a of the area RB is supported by the second plate 24B and the second support plate 27B, and is fixed to the second frame 12B via the second plate 24B. The support plates 27A and 27B are components of the hinge device 14.

[0031] The bending region R can move relative to the frame bodies 12A and 12B. In the 180-degree posture, the back surface 16a of the bending region R is supported by the hinge body 26 and the support plates 27A and 27B (see Figure 4A ). In the 0 degree posture, the bending area R is bent into an arc shape, a part of the inner surface 16a is supported by the support plates 27A and 27B, and most of it is separated from the hinge device 14 (refer to Figure 4C ).

[0032] The plates 24A and 24B are plates made of carbon fiber reinforced resin or metal. The plates 24A and 24B are arranged on the left and right sides so as to sandwich the hinge device 14, and support the back surface 16a of the display 16 with their respective surfaces.

[0033] like Figure 3 to Figure 4C As shown, the hinge device 14 of this embodiment includes a hinge body 26, a first support plate 27A, and a second support plate 27B. The hinge device 14 may have other structures as long as it can relatively rotatably connect the frames 12A and 12B and bend the display 16 into a desired bending shape.

[0034] The hinge body 26 is provided at a position straddling the edge portions 12Aa and 12Ba of the frame bodies 12A and 12B (see Figure 4A), extending along the edge portions 12Aa, 12Ba over substantially the entire length in the Y direction (see Figure 1 and Figure 3 The hinge body 26 is a block-shaped member formed of an aluminum alloy or the like. The hinge body 26 is connected to a bracket fixed to the first frame body 12A via a first rotating link 28A (see Figure 3 ) is connected so as to be relatively movable. In addition, the hinge body 26 is connected to the bracket fixed to the second frame body 12B via the second rotating link 28B (see Figure 3 ) are connected so as to be relatively movable. Thus, the hinge body 26 connects the frames 12A and 12B so as to be relatively rotatable. The hinge body 26 is also provided with a gear mechanism for synchronizing the rotational movement between the frames 12A and 12B, a torque mechanism for imparting a predetermined rotational torque to the rotational movement between the frames 12A and 12B, and the like.

[0035] The outer surface of the hinge body 26 is covered by a backing member 26a. The backing member 26a of this embodiment is a substantially U-shaped plate that matches the outer surface shape of the hinge body 26. The backing member 26a is formed of a heat conductive material such as aluminum alloy or stainless steel. The backing member 26a is a decorative cover that improves the quality of the outer surface.

[0036] exist Figure 4A In the 180-degree posture shown, the hinge body 26 is housed in the frames 12A and 12B, and straddles the edges 12Aa and 12Ba that are adjacent to each other in the X direction. Figure 4C In the 0-degree posture shown in FIG. 1 , the hinge body 26 is configured to close the gap G formed between the widely separated edge portions 12Aa and 12Ba. At this time, by arranging the back sealing member 26a at the outermost side, the appearance design of the folded electronic device 10 is prevented from being degraded (see FIG. 1 ). Figure 1 ).

[0037] That is, the back sealing member 26a covers the gap G formed between the frame bodies 12A and 12B in an angle posture other than 180 degrees (for example, a 0 degree posture or a 90 degree posture) (see Figure 1 , Figure 4B as well as Figure 4C ). Thus, the back sealing member 26a prevents the components inside the frame 12A, 12B from being exposed to the outside through the gap G. The back sealing member 26a is arranged to span the edges 12Aa, 12Ba close to each other in the X direction when in the 180-degree posture, and is stored in the frame 12A, 12B (see Figure 4A ).

[0038] For example, when the hinge device 14 is not Figure 3In the case where the back-sealing member 26a is not a structure extending in the Y direction as shown in the figure, but is composed of one or more small parts, the back-sealing member 26a can also be supported by each frame 12A, 12B separately from the hinge device 14. That is, the back-sealing member 26a does not necessarily need to be a component of the hinge device 14, and its structure and installation method are not limited as long as it can cover the gap G at an angle other than 180 degrees. However, in this embodiment, the back-sealing member 26a is a component of the hinge device 14, so there is no need for a separate structure or mechanism for installing the back-sealing member 26a on the frame 12A, 12B, and the structure is simplified.

[0039] The support plates 27A and 27B are plates formed of aluminum alloy or the like, and are mutually symmetrical in shape. The first support plate 27A is arranged on the inner surface 12Ab side of the first frame body 12A, specifically above the inner surface of the first bottom cover 13A, and extends along the edge portion 12Aa in the Y direction over substantially the entire length. One end of the first support plate 27A in the width direction (X direction) is connected to the hinge body 26 so as to be relatively rotatable using a rotating shaft 27Aa. The other end of the first support plate 27A in the width direction is arranged so as to be relatively movably relative to the first frame body 12A, and is adjacent to one end of the first plate 24A. Thus, the first support plate 27A is arranged between the hinge body 26 and the first plate 24A when in a 180-degree posture.

[0040] The second support plate 27B is provided on the inner surface 12Bb side of the second frame 12B (above the inner surface of the second bottom cover 13B), and extends along the edge portion 12Ba in the Y direction over substantially the entire length. One end of the second support plate 27B is connected to the hinge body 26 by a rotating shaft 27Ba so as to be relatively rotatable, and the other end is adjacent to one end of the second plate 24B. Thus, the second support plate 27B is arranged between the hinge body 26 and the second plate 24B when in a 180-degree posture.

[0041] The support plates 27A and 27B move relative to the inner surfaces 12Ab and 12Bb of the frames 12A and 12B in the X direction and the Z direction as the frames 12A and 12B rotate. In the 180-degree posture, the support plates 27A and 27B support the inner surface 16a of the display 16 through their surfaces. In the angle posture other than 180 degrees, the support plates 27A and 27B contact the display 16 with a gap between them or with a small force that does not deform the display 16. The support plates 27A and 27B may be configured to support the bending region R of the display 16 and correct its shape even in the angle posture other than 180 degrees. In this way, the support plates 27A and 27B stably support the bending region R of the display 16 in a flat surface in the 180-degree posture without hindering the bending movement of the bending region R.

[0042] like Figure 3 to Figure 4C As shown, the electronic device 10 includes a first heat conducting member 30A and a first cushioning member 31A provided in a first housing 12A, and a second heat conducting member 30B and a second cushioning member 31B provided in a second housing 12B.

[0043] The heat-conducting components 30A and 30B are sheet-like components formed of a heat-conducting material such as a graphite sheet, a copper sheet, or an aluminum sheet. The heat-conducting components 30A and 30B of the present embodiment are graphite sheets. Graphite sheets are obtained by processing graphite (black lead), which is an allotrope of carbon, into sheets and have a high thermal conductivity. The heat-conducting components 30A and 30B have a thickness of, for example, about 10 μm to 1 mm and are thin and soft sheets. In addition, when a copper sheet or an aluminum sheet is used instead of a graphite sheet, the heat-conducting components 30A and 30B are formed of a thin metal foil of about 10 μm to 1 mm as in the case of the graphite sheet and have flexibility.

[0044] The first heat transfer component 30A is a heat transfer component that transfers heat in the first frame 12A and the first bottom cover 13A to the back cover member 26a. The second heat transfer component 30B is a heat diffusion component that receives heat transferred from the first heat transfer component 30A to the back cover member 26a and dissipates heat into the second frame 12B and the second bottom cover 13B.

[0045] like Figure 4A As shown, the first heat conducting component 30A is attached to the inner surface 12Ab of the first bottom cover 13A. The first heat conducting component 30A is located at a position where the edge portion 30Aa on the first edge portion 12Aa side overlaps with the ridge sealing member 26a in the Z direction. Figure 4A In this case, the first heat conducting member 30A extends over substantially the entire length of the back sealing member 26a in the Y direction (see Figure 3 ), so that a larger surface area contacts the ridge member 26a.

[0046] The first heat conduction member 30A of the present embodiment is provided so as to extend over substantially the entire surface of the inner surface 12Ab (see Figure 3 ). The size (surface area) of the first heat-conducting component 30A is not limited as long as it is located at a position where at least the edge portion 30Aa overlaps with the ridge member 26a. However, in order to more effectively absorb and transport the heat in the first frame 12A, it is preferred that at least the portion other than the edge portion 30Aa of the first heat-conducting component 30A overlaps with the CPU 17a, which is the largest heat-generating body, in the Z direction.

[0047] like Figure 4AAs shown, the second heat conducting component 30B is attached to the inner surface 12Bb of the second bottom cover 13B. The second heat conducting component 30B is located at a position where the edge portion 30Ba on the second edge portion 12Ba side overlaps with the ridge sealing member 26a in the Z direction. The second heat conducting component 30B is also Figure 4A In the 180 degree posture shown, it is in contact with the back sealing member 26a.

[0048] The second heat conduction member 30B of the present embodiment has a shape that is bilaterally symmetrical with the first heat conduction member 30A (see Figure 3 and Figure 4A ). That is, the second heat-conducting component 30B is preferably arranged at the same position and size as the first heat-conducting component 30A. However, the second heat-conducting component 30B only needs to be able to transfer the heat received from the ridge member 26a to at least the second bottom cover 13B. Therefore, the second heat-conducting component 30B only needs to have at least an edge portion 30Ba that can contact the ridge member 26a, and may also have a smaller area than the first heat-conducting component 30A.

[0049] Next, the cushioning members 31A and 31B are formed of a material having flexibility and a certain degree of repulsive force, such as rubber or sponge. The cushioning members 31A and 31B of the present embodiment are foam materials (sponge).

[0050] The first buffer member 31A is disposed between the first heat-conducting member 30A and the inner surface 12Ab of the first frame 12A, and presses the first heat-conducting member 30A against the backing member 26a when in a 180-degree posture. Similarly, the second buffer member 31B is disposed between the second heat-conducting member 30B and the inner surface 12Bb of the second frame 12B, and presses the second heat-conducting member 30B against the backing member 26a when in a 180-degree posture. Therefore, the buffer members 31A and 31B are respectively disposed at positions where at least the edge portions 30Aa and 30Ba of the heat-conducting members 30A and 30B and the backing member 26a overlap in the Z direction, and extend in the Y direction along the edge portions 30Aa and 30Ba.

[0051] If the buffer members 31A and 31B cover the entire surface of the heat conducting members 30A and 30B, for example, the heat transfer between the heat conducting members 30A and 30B and the high temperature air in the frame bodies 12A and 12B will be hindered. Therefore, in the present embodiment, the buffer members 31A and 31B are limited to being provided only at the edge portions 30Aa and 30Ba and their vicinities in the X direction (see Figure 4A ).

[0052] like Figure 4AAs shown, the frame 12A, 12B has a concave portion 12Ac, 12Bc formed by digging down the inner surface 12Ab, 12Bb of the portion close to the edge portion 12Aa, 12Ba. The concave portions 12Ac, 12Bc extend in the Y direction. The buffer components 31A, 31B are respectively arranged in the concave portions 12Ac, 12Bc. Thus, the edge portions 30Aa, 30Bb of the heat conducting components 30A, 30B are prevented from bulging upwards by the thickness of the buffer components 31A, 31B more than other portions.

[0053] The cushioning members 31A and 31B of this embodiment are Figure 4A The side view shown is roughly L-shaped and has protective parts 31Aa and 31Ba covering the end faces of the edge parts 30Aa and 30Ba of the heat-conducting parts 30A and 30B. The heat-conducting parts 30A and 30B formed of graphite sheets are brittle and are prone to powder overflow or breakage. In particular, the end face corners of the edge parts 30Aa and 30Ba are easily damaged due to repeated contact with the ridge member 26a. Therefore, the buffer parts 31A and 31B protect the end faces with protective parts 31Aa and 31Ba to suppress damage to the aged heat-conducting parts 30A and 30B. In addition, the entire surface of the heat-conducting parts 30A and 30B, which are graphite sheets, is covered and protected by, for example, a polyester film (a film made of polyethylene terephthalate).

[0054] Next, the rotation operation and effects of the frames 12A and 12B will be described.

[0055] First, in Figure 4A In the 180-degree posture shown, the panels 24A, 24B, the hinge body 26, and the support panels 27A, 27B are arranged on the same XY plane, and their surfaces are arranged flush, forming a flat panel as a whole. The entire inner surface 16a of the display 16 is supported on the flat panel, forming a large flat screen (see also Figure 2 ). Figure 2 Reference numeral 34 in the figure denotes a frame member, which is a member that covers the inactive region located at the peripheral portion of the surface 16 b of the display 16 in a frame shape.

[0056] Thus, in the 180-degree posture, the electronic device 10 functions as a tablet PC with a large screen. At this time, the CPU 17a generates a large amount of heat depending on the usage state of the electronic device 10 (e.g., streaming playback of animation, etc.). Therefore, there is a concern that the CPU 17a itself may have reduced performance or that hot spots may be generated on the back (outer surface) of the first housing 12A.

[0057] Therefore, the electronic device 10 includes the heat conducting members 30A and 30B and the back cover 26a made of a heat conducting material. Therefore, the heat in the first housing 12A (for example, the heat generated by the CPU 17a) is transferred to the first heat conducting member 30A directly or indirectly via the first bottom cover 13A. Figure 4A Arrows H indicated by dot-dash lines schematically represent the movement of heat.

[0058] After the heat of the CPU 17a and the like transferred to the first heat-conducting component 30A is conducted in the first heat-conducting component 30A, it is transferred from the contact portion between the first heat-conducting component 30A and the back-sealing member 26a to the back-sealing member 26a, and moves in the back-sealing member 26a. Then, the heat moving in the back-sealing member 26a is transferred from the contact portion between the back-sealing member 26a and the second heat-conducting component 30B to the second heat-conducting component 30B. Thus, part of the heat from the first frame body 12A transferred to the second heat-conducting component 30B is diffused by the second heat-conducting component 30B, and the other part is transferred to the second bottom cover 13B and dissipated to the outside of the second frame body 12B. Of course, the heat in the first frame body 12A that is not transferred to the first heat-conducting component 30A is also dissipated to the outside of the first frame body 12A via the first bottom cover 13A and the like.

[0059] In this way, the electronic device 10 of the present embodiment is provided with heat-conducting components 30A, 30B and a back-sealing member 26a made of a heat-conducting material, thereby being able to utilize the second frame 12B having a smaller heat generation than the first frame 12A to efficiently dissipate heat. Therefore, the electronic device 10 promotes the cooling of the CPU 17a and the like by maintaining the temperature balance between the left and right frames 12A and 12B, and suppresses the generation of hot spots and the like. That is, the electronic device 10 enables the frames 12A and 12B to function as a heat storage device and a radiator as a whole through the heat-conducting components 30A, 30B and the back-sealing member 26a, and can obtain sufficient cooling capacity even if no other high-performance cooling device is installed in the frames 12A and 12B. In addition, since the electronic device 10 can transfer heat in the frames 12A and 12B, it is not necessary to set, for example, a leather cover covering the outer surface (back) of the frames 12A and 12B, and set a heat-conducting component on the leather cover.

[0060] In the electronic device 10, the heat conducting components 30A, 30B and the backing member 26a extend substantially over the entire length of the housings 12A, 12B in the Y direction. Therefore, the contact area between the heat conducting components 30A, 30B and the backing member 26a is increased, and the heat transfer between them can be ensured.

[0061] Furthermore, the electronic device 10 has the cushioning members 31A and 31B for pressing the heat conducting members 30A and 30B against the backing member 26a in the 180-degree posture. As a result, the electronic device 10 makes the heat conducting members 30A and 30B and the backing member 26a reliably in close contact, and the efficiency of heat transfer between them is improved.

[0062] Next, the case where the frame bodies 12A and 12B rotate from the 180-degree position to the 0-degree position will be described. In this case, as the frame bodies 12A and 12B open, the support plates 27A and 27B swing around the rotation axes 27Aa and 27Ba and move relative to the frame bodies 12A and 12B (see FIG. Figure 4A to Figure 4C ). The frames 12A and 12B move relatively in the directions away from the support plates 27A and 27B in the X direction. At this time, the plates 24A and 24B move integrally with the frames 12A and 12B. Therefore, the bending region R of the display 16 fixed to the plates 24A and 24B gradually opens.

[0063] exist Figure 4C In the 0 degree posture shown, the frames 12A and 12B are in a folded state with a high design appearance, with the surfaces of the frames 12A and 12B being stacked approximately parallel to each other. At this time, the display 16 is formed into a bell shape with the bending region R bent at a desired curvature. That is, the display 16 is bent into the desired bell shape in the bending region R by means of the plates 24A and 24B stacked in parallel with a predetermined gap. As a result, the electronic device 10 makes the frames 12A and 12B as thin as possible and suppresses damage to the display 16 when it is bent. In addition, when the frames 12A and 12B are rotated from the 180 degree posture to the 0 degree posture, as shown in FIG. Figure 4B and Figure 4C As shown, the thermally conductive components 30A, 30B are separated from the ridge member 26a.

[0064] Next, when the frames 12A and 12B are rotated from the 0-degree position to the 180-degree position, the opposite action is performed. Moreover, when the frames 12A and 12B are finally in the 180-degree position, the heat-conducting components 30A and 30B are in contact with the back-sealing member 26a again. At this time, the inner sides of the heat-conducting components 30A and 30B are supported by the buffer components 31A and 31B, so that they are reliably in close contact with the back-sealing member 26a. As a result, the electronic device 10 is in a state of close contact between the heat-conducting components 30A and 30B and the back-sealing member 26a, and the cooling effect brought by the heat transfer between the frames 12A and 12B can be obtained.

[0065] In addition, the heat conducting components 30A and 30B are thin graphite sheets or copper sheets, both of which are flexible, so that even if the frames 12A and 12B are repeatedly rotated, the generation of impact noise caused by the contact between the heat conducting components 30A and 30B and the backing member 26a and damage to the backing member 26a can be suppressed.

[0066] The buffer components 31A and 31B may be omitted. However, in this case, the metal bottom covers 13A and 13B and the metal backing member 26a only sandwich the thin graphite sheet (heat-conducting components 30A and 30B) and abut against each other. Therefore, in the electronic device 10, the buffer components 31A and 31B are preferably used from the viewpoints of the close contact between the heat-conducting components 30A and 30B and the backing member 26a, the impact sound when abutting against each other, and the like.

[0067] Figure 5 It is a side cross-sectional view schematically showing the internal structure of the electronic device 40 according to the first modification example in a state where the electronic device 40 is in a 180-degree posture.

[0068] Figure 5 The electronic device 40 is shown with Figure 4A Compared with the electronic device 10 shown in FIG. 1 , the shapes and arrangements of the heat conducting components 30A, 30B and the buffer components 31A, 31B are different. In the electronic device 40, the entire surface of the heat conducting components 30A, 30B including the edge portions 30Aa, 30Ba is attached to the inner surfaces 12Ab, 12Bb of the frame bodies 12A, 12B. The buffer components 31A, 31B are Figure 4A The arrangement shown is an arrangement in which the top and bottom are turned upside down. Thus, the buffer members 31A and 31B cover the edges 30Aa and 30Ba of the heat conducting members 30A and 30B and the surfaces of the peripheral portions thereof.

[0069] In the electronic device 40, the buffer components 31A and 31B are arranged between the backing member 26a and the heat-conducting components 30A and 30B, and the buffer components 31A and 31B are in contact with the backing member 26a. Therefore, the buffer components 31A and 31B need to be able to efficiently transfer the heat of the heat-conducting components 30A and 30B to the backing member 26a. The buffer components 31A and 31B need to be formed of a heat-conducting material such as a rubber material with a high thermal conductivity, so-called thermal rubber. In other words, in the electronic device 40, the buffer components 31A and 31B are used as heat-conducting components to supplement the heat-conducting components 30A and 30B that transfer heat with the backing member 26a.

[0070] Thus, the heat conducting components 30A and 30B made of graphite sheets or the like of the electronic device 40 do not directly contact the metal ridge member 26a. As a result, the electronic device 40 has the advantage that even when the housings 12A and 12B are repeatedly rotated, the heat conducting components 30A and 30B can be more reliably prevented from being damaged.

[0071] Figure 6 It is a side cross-sectional view schematically showing the internal structure of the electronic device 50 according to the second modification example in a state in which the electronic device 50 is in a 180-degree posture.

[0072] Figure 6 The electronic device 50 is shown with Figure 4A Compared with the electronic device 10 shown in the figure, the heat conducting components 30A and 30B are omitted, and the buffer components 51A and 51B are provided instead of the buffer components 31A and 31B. The first buffer component 51A is arranged in the concave portion 12Ac, between the inner surface 12Ab of the first frame body 12A and the back sealing member 26a. Similarly, the second buffer component 51B is arranged in the concave portion 12Bc, between the inner surface 12Bb of the second frame body 12B and the back sealing member 26a.

[0073] In the electronic device 50, the heat in the first frame 12A is transferred to the first buffer part 51A via the first bottom cover 13A, and is transferred from the first buffer part 51A to the back cover member 26a. The heat transferred to the back cover member 26a is transferred to the second bottom cover 13B via the second buffer part 51B, and is diffused and dissipated. That is, in the electronic device 50, since the buffer parts 51A and 51B are also in contact with the back cover member 26a, the buffer parts 51A and 51B need to be formed of a thermally conductive material such as thermal rubber. In other words, in the electronic device 50, the buffer parts 51A and 51B are used as thermally conductive parts instead of the thermally conductive parts 30A and 30B that transfer heat to the back cover member 26a. As a result, the electronic device 50 can omit the thermally conductive parts 30A and 30B composed of graphite sheets, etc., and the component cost is reduced.

[0074] In the electronic device 50, as Figure 6As shown by the double-dashed line, the heat-conducting components 30A and 30B such as graphite sheets may be attached in a manner that covers a portion of the buffer components 51A and 51B from the inner surfaces 12Ab and 12Bb of the frame bodies 12A and 12B. That is, this is because the heat-conducting efficiency of the bottom covers 13A and 13B made of magnesium alloy, for example, is much lower than that of the heat-conducting components 30A and 30B which are graphite sheets, and the efficiency of heat transfer via the ridge member 26a is improved when the heat-conducting components 30A and 30B are used. In particular, when the frame bodies 12A and 12B (bottom covers 13A and 13B) are made of a low-thermal-conducting material such as resin, the heat-conducting components 30A and 30B are important for heat transfer in any of the electronic devices 10, 40, and 50 of each structural example.

[0075] In addition, the present invention is not limited to the above-mentioned embodiment, and it is of course possible to freely change it within the scope not departing from the gist of the present invention.

[0076] The electronic devices 10, 40, and 50 may also be equipped with a cooling device for cooling the CPU 17a. Examples of the cooling device include a heat sink such as a copper plate or an aluminum plate, a heat spreader, and cooling fins and a blower fan connected thereto.

[0077] In the above, electronic devices 10, 40, 50 that can be folded in half like a book are illustrated. However, in addition to the structure in which frames of the same shape are folded in half, the present invention can also be applied to various structures such as a double-door structure in which a small frame is foldably connected to the left and right edges of a large frame, an S-shaped folding structure in which frames with different folding directions are respectively connected to the left and right edges of a frame, and a J-shaped folding structure in which a small frame is foldably connected to the left and right edges of a large frame. The number of connected frames can also be 4 or more.

Claims

1. An electronic device, characterized in that: have: A first frame body is provided with a substrate on which a processing device is mounted; A second frame body is disposed adjacent to the first frame body and is equipped with a battery device; A hinge device that connects the first frame and the second frame so as to be relatively rotatable between a first posture in which the first frame and the second frame are stacked in a manner overlapping each other in a plane direction and a second posture in which the first frame and the second frame are arranged in a direction perpendicular to the plane direction; a ridge sealing member made of a heat conductive material, extending along a first edge portion of the first frame body adjacent to the second frame body and a second edge portion of the second frame body adjacent to the first frame body, and configured to cover a gap formed between the first edge portion and the second edge portion in the first posture, and to span the first edge portion and the second edge portion in the second posture; A first heat-conducting component is disposed on the inner surface of the first frame body and is in contact with the ridge sealing member in the second posture; as well as The second heat conducting component is provided on the inner surface of the second frame body and is in contact with the back sealing member in the second posture.

2. The electronic device according to claim 1, characterized in that: The first heat-conducting component and the second heat-conducting component are graphite sheets or metal sheets.

3. The electronic device according to claim 2, characterized in that: Also available: a first buffer component, disposed between the first heat-conducting component and the inner surface of the first frame, and pressing the first heat-conducting component against the ridge sealing member in the second posture; and The second buffer member is provided between the second heat conducting member and the inner surface of the second frame body, and presses the second heat conducting member against the backrest member in the second posture.

4. The electronic device according to claim 2, characterized in that: Also available: A first buffer component made of a heat-conducting material, disposed on a surface of the first heat-conducting component, and pressed against the ridge sealing member in the second posture; and A second buffer member made of a heat conductive material is provided on a surface of the second heat conductive member and is pressed against the ridge sealing member in the second posture.

5. The electronic device according to claim 1, characterized in that: The first heat conduction member and the second heat conduction member are buffer members made of a heat conduction material and are pressed against the ridge sealing member in the second posture.

6. The electronic device according to any one of claims 1 to 5, characterized in that: The first heat conduction member overlaps with the processing device in a thickness direction of the first frame.

7. The electronic device according to any one of claims 1 to 5, characterized in that: The first heat conducting component and the second heat conducting component extend along a length direction of the ridge sealing member.

8. The electronic device according to any one of claims 1 to 5, characterized in that: The electronic device further includes a display extending between the first frame and the second frame and having a bending region that is bent as the first frame and the second frame rotate relative to each other. The hinge device has: a hinge body extending along the first edge portion and the second edge portion, and configured to straddle the first edge portion and the second edge portion in the second posture to support the back surface of the display; A first support plate extending along the first edge portion on the inner surface side of the first frame body and connected to the hinge body so as to be relatively rotatable, supporting the inner surface of the display; as well as The second support plate extends along the second edge portion on the inner surface side of the second frame body and is connected to the hinge body so as to be relatively rotatable, supporting the inner surface of the display. The back sealing member is a component of the hinge body.

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