Modular integrated acquisition storage card and computer

Abstract

This invention discloses a modular integrated acquisition and storage card and a computer, belonging to the field of electronic computer technology. The invention includes a PCIe interface, a mounting base, and a side mounting plate. A side-mounted rotating latch allows for quick installation and removal of the PCIe interface. Compared to existing mounting bases where the latches are located at both ends, often obstructed by graphics cards or acquisition and storage card interfaces, this invention solves the problem of existing end-face interfaces not using a spring-loaded structure and relying on friction damping, which requires significant force for installation and removal, easily damaging the PCB and gold fingers, and is difficult to operate.

Description

Technical Field

[0001] This invention belongs to the field of electronic computer technology, and in particular relates to a modular integrated acquisition and storage card and a computer. Background Technology

[0002] The RAID storage module primarily receives instructions and data from the CPU via the PCIe interface, converts them into SATA / SAS protocol instructions and data formats, and then reads and writes data to the SSD array. Simultaneously, the RAID storage module implements RAID control functions to meet the high reliability requirements of data storage. Existing RAID storage modules are costly. While using a PCIe interface for SSD installation can reduce latency, it makes installation and removal of SSDs in confined spaces difficult. Therefore, a new PCIe interface installation method is proposed. Summary of the Invention

[0003] The purpose of this invention is to provide a modular integrated acquisition storage card and computer, which solves the problem of difficulty in disassembling PCIe interfaces in confined spaces in the prior art.

[0004] To solve the above-mentioned technical problems, the present invention is achieved through the following technical solution:

[0005] This invention relates to a modular integrated data acquisition and storage card, comprising a PCIe interface, a mounting base, and side fixing plates. Side fixing plates are provided on both sides of the PCIe interface, and fixing through holes are provided on the side fixing plates. The PCIe interface is mounted on the mounting base, which includes a soldering base with a connector. The connector has a PCIe interface. Fixing plate connectors are provided on both sides of the PCIe interface. Side mounting grooves are provided on the sides of the fixing plate connectors, and side rotating blocks are installed within these grooves. The side rotating blocks are movably mounted on a mounting shaft, which is fixedly mounted within the side mounting grooves. The two ends of the side rotating blocks are a contact fixing head and a pressing adjustment head, respectively. A torsion spring mounting groove is provided in the middle of the side rotating blocks, and a first torsion spring is provided within the groove. The first torsion spring is mounted on the mounting shaft. A torsion spring mounting hole is provided on the side of the torsion spring mounting groove. One end of the first torsion spring is fixedly mounted in the torsion spring mounting hole, and the other end is fixedly mounted on the side mounting groove. When the storage card is installed, the contact fixing head engages with the fixing through hole.

[0006] Furthermore, a contact module is installed below the oxide layer removal column. The contact module includes an insulating central shaft, which is movably mounted on the side of the PCIe interface. Multiple abutting rings are fixedly mounted on the insulating central shaft. The abutting rings abut against the oxide layer removal column. The surface of the oxide layer removal column is provided with a rubber layer. A T-shaped groove is opened in the middle of the abutting ring. One end of the connecting pin is provided with a boss that matches the T-shaped groove and is movably mounted in the T-shaped groove. At the same time, one end of the insulating central shaft is provided with a first side adjustment ring. The first side adjustment ring is provided with a second side abutting boss. One end of the second side abutting boss is located at the upper end of the abutting base plate.

[0007] Furthermore, the mounting base has quick-release plates on both sides, which are movably mounted on the side of the mounting slot via a mounting shaft. A second spring is provided between the side of the mounting slot and the quick-release plate. The expansion box has a mounting slot, and the mounting slot has side positioning grooves on both sides. A first heat sink and a second heat sink are respectively mounted on both sides of the memory card. Thermally conductive silicone is provided on the heating element for auxiliary heat dissipation. Side guide bosses are provided on both sides of the first and second heat sinks, and the side guide bosses are movably mounted in the side positioning grooves. The side fixing plate is mounted on the mounting base. Adjustment post mounting holes are provided on both sides of the mounting slot. A side through hole is provided on the side of the adjustment post mounting hole near the mounting slot. A quick-release post is movably mounted in the adjustment post mounting hole. The quick-release post includes a pressing post. A third spring is provided between the pressing post and the bottom surface of the adjustment post mounting hole. A disassembly plate abutment boss is provided on the side of the pressing post, and the disassembly plate abutment boss is movably mounted in the side through hole. The side of the first abutment slope abuts against the quick-release plate.

[0008] The present invention has the following beneficial effects:

[0009] 1. This invention enables quick disassembly and installation of the PCIe interface by setting a side rotating latch. Compared with the existing mounting base where the switch latches are set at both ends of the base, which is often blocked by the graphics card and memory card interfaces and can only be set on one side, making it difficult to fix the PCB stably, this invention solves the problem that the existing end-face interface does not use a spring clip structure and relies on a friction damping structure, which requires a lot of force for installation and disassembly, easily causing damage to the PCB and gold fingers, and is difficult to operate.

[0010] 2. This invention uses a pressing quick-release column to cause the first contacting inclined surface to squeeze the quick-release plate, causing the quick-release plate to move inward and press the adjusting head, thus completing quick disassembly and installation. This ensures convenient disassembly even in confined spaces where continuous installation is possible. At the same time, the pressing release from above allows for better heat dissipation devices to be set up around the chuck to ensure system temperature control.

[0011] Of course, any product implementing this invention does not necessarily need to achieve all of the advantages described above at the same time. Attached Figure Description

[0012] To more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0013] Figure 1 This is a schematic diagram of the overall structure of an embodiment of this disclosure;

[0014] Figure 2 This is a schematic diagram of the structure of the expansion box according to an embodiment of this disclosure;

[0015] Figure 3 This is a schematic diagram of the internal structure of the expansion box according to an embodiment of this disclosure;

[0016] Figure 4 This is a schematic diagram of the installation structure of the quick-release plate according to an embodiment of the present disclosure;

[0017] Figure 5 This is a schematic diagram of the structure of the extended chuck according to an embodiment of the present disclosure;

[0018] Figure 6 This is an exploded view of the extended chuck according to an embodiment of this disclosure;

[0019] Figure 7 This is a schematic diagram of the structure of the quick-disassembly column according to an embodiment of the present disclosure;

[0020] Figure 8 This is a schematic diagram of the structure of the mounting base according to an embodiment of the present disclosure;

[0021] Figure 9 This is a schematic diagram of the structure of the side rotating block according to an embodiment of the present disclosure;

[0022] Figure 10 This is a schematic diagram of the internal structure of the mounting base according to an embodiment of the present disclosure;

[0023] Figure 11 This is a schematic diagram of the structure of the oxide layer removal column according to an embodiment of the present disclosure;

[0024] Figure 12 This is a schematic diagram of the installation of the adjusting ring according to an embodiment of this disclosure. Detailed Implementation

[0025] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0026] In the description of this invention, it should be understood that the terms "opening", "upper", "lower", "thickness", "top", "middle", "length", "inner", "around", etc., which indicate orientation or positional relationship, are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the components or elements referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as limiting this invention.

[0027] Please see Figure 1-12 As shown, this invention is a modular integrated acquisition and storage module, including an SSD hard disk array module 1 and an acquisition memory card. The SSD hard disk array module 1 includes an expansion box 2, within which multiple expansion cassettes 3 are movably installed. Both the expansion cassettes 3 and the acquisition memory card have PCIe interfaces 34 and side mounting plates 35 on their PCBs. Side mounting plates 35 are located on both sides of the PCIe interfaces 34, and the side mounting plates 35 have through holes 36 for fixing. The expansion cassettes 3 and the acquisition memory card are fixedly mounted on a mounting base 4, which is soldered to the motherboard or SSD converter. On the upper part of the connector board, the mounting base 4 includes a soldering base 41. The soldering base 41 has multiple fixed soldering feet 47 and connecting pins 46 below it. The connecting pins 46 and fixed soldering feet 47 are soldered to the PCB. The soldering base 41 has a connector 42. The connector 42 has a PCIe interface 43. The PCIe interface 43 has a fixing plate connector 44 on both sides. The PCIe interface 34 is installed in the PCIe interface 43. The side fixing plates 35 are installed in the fixing plate connector 44. In this way, the stability of the expansion chuck 3 can be ensured by the side fixing plates 35 on both sides.

[0028] The side of the fixed plate insertion interface 44 has a side mounting groove 45, and a side rotating block 6 is installed in the side mounting groove 45. The side rotating block 6 is movably mounted on the block mounting shaft 61, and the block mounting shaft 61 is fixedly mounted in the side mounting groove 45. The two ends of the side rotating block 6 are respectively the abutting fixing head 64 and the pressing adjustment head 65. The middle of the side rotating block 6 has a torsion spring mounting groove, and a first torsion spring 62 is provided in the torsion spring mounting groove. The first torsion spring 62 is mounted on the block mounting shaft 61. The side of the torsion spring mounting groove has a torsion spring mounting hole 63. One end of the first torsion spring 62 is fixedly mounted in the torsion spring mounting hole 63 and the other end is fixedly mounted in the side mounting groove 45. In this way, the elastic force of the first torsion spring 62 can be used to ensure that the abutting fixing head 64 rotates inward. When the side fixed plate 35 is inserted into the fixed plate insertion interface 44, the abutting fixing head 64 rotates inward and the abutting fixing head 64 is engaged in the fixed through hole 36, thus completing the fixed installation of the PCB.

[0029] The PCIe interface 43 has contact connectors on both sides, which are connected to the connecting pins 46. A contact base plate 77 is movably installed inside the PCIe interface 43, and a first spring 78 is located at the lower end of the contact base plate 77. With this design, when the PCIe interface 34 is installed into the PCIe interface 43, the side fixing plate 35 is installed inside the fixing plate interface 44. During installation, the side fixing plate 35 presses against the contact base plate 77, which in turn compresses the first spring 78. After installation, the contact fixing head 64 engages with the fixing through hole 36, thus completing the PCB fixing installation. When disassembly is required, pressing the adjusting head 65 causes the side fixing head to rotate. The rotating block 6 rotates around the mounting shaft 61. When the side rotating block 6 rotates, the contact fixing head 64 rotates outward. At this time, the contact fixing head 64 releases the fixing of the side fixing plate 35. Under the elastic force of the first spring 78, the contact base plate 77 moves upward and pops out the PCB. This allows for quick disassembly and installation. Compared with the existing mounting base where the switch buckle is set at both ends of the base, it is often difficult to set it on one side due to the obstruction of the graphics card and memory card interface, which is not conducive to the stable fixing of the PCB. At the same time, the side interface does not use a spring clip structure and a friction damping structure, which requires more force for installation and disassembly, which can easily damage the PCB and gold fingers, and the operation is difficult.

[0030] In some disclosures, the fixing plate insertion interface 44 is provided with side mounting grooves 45 on both sides. The side mounting grooves 45 on both sides of the fixing plate insertion interface 44 are distributed in a circular pattern. The side fixing plate 35 is provided with two fixing through holes 36. With this design, the abutting fixing heads 64 on both sides of the fixing plate insertion interface 44 can be inserted into the fixing through holes 36 to complete the fixing of the PCB, thus ensuring the stability of the force on both sides and ensuring the firmness of the fixing.

[0031] In some disclosures, the side rotating block 6 is provided with a limiting contact surface 66 on the side near the mounting base 4. With this design, the limiting contact surface 66 can limit the rotation of the side rotating block 6 to ensure that the position of the contact fixing head 64 is not too close to the inside, which would cause the side fixing plate 35 to jam and have excessive resistance during installation.

[0032] In some disclosures, oxide layer removal posts 8 are installed on both sides of the PCIe interface 43. When the side fixing plate 35 is inserted into the PCIe interface 43, the oxide layer is first removed by friction from the oxide layer removal posts 8. This design avoids the problem of poor conductivity after insertion caused by oxidation of the gold fingers of the side fixing plate 35.

[0033] Furthermore, a contact module 7 is installed below the oxide layer removal column 8. The contact module 7 includes an insulating central shaft 70, which is movably mounted on the side of the PCIe interface 43. Multiple abutment rings 71 are fixedly mounted on the insulating central shaft 70, and the abutment rings 71 abut against the oxide layer removal column 8. The surface of the oxide layer removal column 8 is provided with a rubber layer. A T-shaped groove 72 is formed in the middle of the abutment rings 71. One end of the connecting pin 46 has a boss that matches the T-shaped groove 72, which is movably mounted within the T-shaped groove 72. Simultaneously, one end of the insulating central shaft 70 has a first side adjustment ring 73, on which a second side abutment boss 76 is provided. One end of the second side abutment boss 76 is located on the upper end of the abutment base plate 77. With this design, when the side fixing plate 35 is installed, the side fixing plate 35 abuts against the abutment base plate 77. When the second side abutment protrusion 76 is abutted on both sides, the second side abutment protrusion 76 rotates downward under the abutment of the side fixing plate 35. The downward rotation of the second side abutment protrusion 76 drives the contact module 7 to rotate. The rotation of the contact module 7 causes the abutment ring 71 to slide with the second side adjusting ring 81. This can rub and remove the oxide layer from the part of the abutment ring 71 that is about to contact the gold finger, avoiding the problem of poor conduction after insertion due to the oxidation of the abutment ring 71. When the side fixing plate 35 leaves the PCIe interface 43, the abutment base plate 77 moves upward under the action of the first spring 78. The abutment base plate 77 pushes the second side abutment protrusion 76 to return to its original position and rotate. This can drive the contact module 7 to rotate so that the part of the abutment ring 71 that contacts the gold finger rotates to the position that contacts the oxide layer removal post 8 to prevent air oxidation and remove the oxide layer at the same time.

[0034] Furthermore, the first side adjustment ring 73 is provided with a first side boss 74, and the first side boss 74 is provided with a first waist hole 75. One end of the oxide layer removal column 8 is provided with a second side adjustment ring 81, and the side of the second side adjustment ring 81 is provided with a third side boss 82. The third side boss 82 is provided with a connecting shaft 83, which is movably installed in the first waist hole 75. With this design, the rotation of the first side adjustment ring 73, in conjunction with the engagement of the first waist hole 75 and the connecting shaft 83, drives the rotation of the oxide layer removal column 8. This can counteract the synchronous rotation of the ring 71 and the oxide layer removal column 8 to ensure the oxide layer removal effect.

[0035] In some disclosures, the mounting base 4 has quick-release plates 9 on both sides. The quick-release plates 9 are movably mounted on the side of the mounting slot 21 via a mounting shaft 91. A second spring 92 is provided between the side of the mounting slot 21 and the quick-release plate 9. The expansion box 2 has a mounting slot 21 inside. The mounting slot 21 has side positioning grooves 22 on both sides. The bottom surface of the mounting slot 21 has a middle plate PCB. The mounting base 4 is soldered onto the middle plate PCB. A first heat sink 31 and a second heat sink 32 are respectively mounted on both sides of the expansion chuck 3. The heating element is provided with thermally conductive silicone 33 for auxiliary heat dissipation. Side guide bosses 30 are provided on both sides of the first heat sink 31 and the second heat sink 32. The side guide bosses 30 are movably installed in the side positioning grooves 22. The side fixing plate 35 on the expansion chuck 3 is installed on the mounting base 4. Adjustment post mounting holes 29 are provided on both sides of the mounting slot 21. A side through hole 28 is provided on the side of the adjustment post mounting hole 29 closest to the mounting slot 21. A quick-release post 5 is movably installed in the adjustment post mounting hole 29. The quick-release post 5 includes a pressing mechanism. A third spring 53 is provided between the bottom surface of the pressing column 51 and the mounting hole 29 of the adjusting column. A disassembly plate abutment 52 is provided on the side of the pressing column 51. The disassembly plate abutment 52 is movably installed in the side through hole 28. The side of the first abutment slope 54 abuts against the quick disassembly plate 9. With this design, the side guide boss 30 is movably installed in the side positioning slide groove 22 to complete the positioning and ensure that the side fixing plate 35 is accurately installed on the mounting base 4. At the same time, when it is necessary to disassemble the expansion chuck 3, the pressing plate abutment 52 can be used to disassemble the expansion chuck 3. The quick-release column 5 causes the first contact slope 54 to press the quick-release plate 9, causing the quick-release plate 9 to move inward and press the adjusting head 65. The pressing adjusting head 65, in turn, causes the side rotating block 6 to rotate around the block mounting shaft 61. When the side rotating block 6 rotates, the contact fixing head 64 rotates outward. At this time, the contact fixing head 64 releases its fixation on the side fixing plate 35. Thus, under the elastic force of the first spring 78, the contact base plate 77 moves upward and pops the PCB out, thereby completing the quick disassembly and installation.

[0036] In some disclosures, the mounting slot 21 has an active heat sink mounting slot 23 on its side, and an active heat sink 24 is movably installed in the active heat sink mounting slot 23. A fourth spring 27 is provided between the active heat sink 24 and the bottom surface of the active heat sink mounting slot 23. The active heat sink 24 has clearance abutment protrusions 25 on its upper and lower sides, which are located in the side positioning slide groove 22. The side guide protrusion 30 has an abutment protrusion at one end near the side fixing plate 35. During the installation of the expansion chuck 3, the abutment protrusion abuts against the clearance. The protrusions 25 abut against each other, causing the active heat sink 24 to move inward. This prevents the active heat sink 24 from abutting against the first heat sink 31 and the second heat sink 32. When the expansion chuck 3 moves into position, the abutting protrusions and the yielding abutting protrusions 25 disengage. Under the action of the fourth spring 27, the active heat sink 24 abuts against the first heat sink 31 and the second heat sink 32. The back of the active heat sink 24 is connected to a cooling pipe, so the active heat sink 24 can actively dissipate heat from the expansion chuck 3.

[0037] In some public disclosures, the main component of the acquisition and storage card is a domestically produced FPGA: using Fudan Micro v7-690T, JXC7VX690T is a programmable logic device with very rich internal programmable resources, including 3600 digital signal processors, 1470 36Kb BRAMs, 693120 logic units, 20 CMTs, 3 PCIe 3.0s, 80 GTHs, etc., which can realize high-performance digital signal processing, large-capacity logic operations, and other applications, and has high bandwidth data throughput capabilities. The domestically produced components are fully compatible with the corresponding package model of Xilinx's XQ7VX690T, and the quality level meets the GJB7400N1 level requirements. The chip's moisture sensitivity level is MSL4. DDR cache: It adopts Ziguang DDR3 to cache and accelerate multi-channel SSD data, making multi-channel aggregation more stable. MiniSAS HD interface: It adopts 6 domestic SFF-8643 connectors, one of which realizes SATA3.0x4 interface, with a total of 24 SATA3.0 channels, all of which are used to connect SATASSDs. The independent performance of each channel is no less than 550MB / s. The embedded CPU adopts Phytium D2000 / 4.

[0038] In the description of this specification, references to terms such as "an embodiment," "example," and "specific example" indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the invention. In this specification, illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0039] The preferred embodiments of the present invention disclosed above are merely illustrative of the invention. These preferred embodiments do not exhaustively describe all details, nor do they limit the invention to the specific implementations described. Clearly, many modifications and variations can be made based on the content of this specification. This specification selects and specifically describes these embodiments to better explain the principles and practical applications of the invention, thereby enabling those skilled in the art to better understand and utilize the invention. The invention is limited only by the claims and their full scope and equivalents.

Claims

1. A modular integrated acquisition and storage card, comprising a PCIe interface (34), a mounting base (4), a side fixing plate (35), and an expansion box (2) with a mounting slot (21), characterized in that, The PCIe interface (34) is provided with side fixing plates (35) on both sides. The side fixing plates (35) are provided with fixing through holes (36). The PCIe interface (34) is installed on the mounting base (4). The mounting base (4) includes a welding base (41). The welding base (41) is provided with a plug socket (42). The plug socket (42) is provided with a PCIe interface (43). The PCIe interface (43) is provided with fixing plate plug interfaces (44) on both sides. The fixing plate plug interfaces (44) are provided with side mounting grooves (45) on the side. The side mounting grooves (45) are provided with side rotating blocks (6). The side rotating blocks (6) are movably installed. On the card block mounting shaft (61), the card block mounting shaft (61) is fixedly installed in the side mounting groove (45). The two ends of the side rotating card block (6) are respectively the contact fixing head (64) and the pressing adjustment head (65). The side rotating card block (6) has a torsion spring mounting groove in the middle. The torsion spring mounting groove has a first torsion spring (62). The first torsion spring (62) is installed on the card block mounting shaft (61). The side of the torsion spring mounting groove has a torsion spring mounting hole (63). One end of the first torsion spring (62) is fixedly installed in the torsion spring mounting hole (63) and the other end is fixedly installed on the side mounting groove (45). When the memory card is installed, the contact fixing head (64) is inserted into the fixing through hole (36). The mounting base (4) has quick-release plates (9) on both sides. The quick-release plates (9) are movably mounted on the side of the mounting slot (21) via the disassembly plate mounting shaft (91). A second spring (92) is provided between the side of the mounting slot (21) and the quick-release plate (9). Side positioning grooves (22) are provided on both sides of the mounting slot (21). A first heat sink (31) and a second heat sink (32) are respectively installed on both sides of the memory card. Thermal conductive silicone (33) is provided on the heat-generating components for auxiliary heat dissipation. Side guide bosses (30) are provided on both sides of the first heat sink (31) and the second heat sink (32). The side guide bosses (30) are movably mounted in the side positioning grooves (22). The side fixing plate (35) is installed on the mounting base. On the seat (4), there are adjustment column mounting holes (29) on both sides of the mounting slot (21). The side of the adjustment column mounting hole (29) near the mounting slot (21) is provided with a side through hole (28). A quick release column (5) is movably installed in the adjustment column mounting hole (29). The quick release column (5) includes a pressing column (51). A third spring (53) is provided between the pressing column (51) and the bottom surface of the adjustment column mounting hole (29). A disassembly plate abutment (52) is provided on the side of the pressing column (51). The disassembly plate abutment (52) is movably installed in the side through hole (28). A first abutment slope (54) is provided on the pressing column (51). The side of the first abutment slope (54) abuts against the quick release plate (9).

2. The modular integrated acquisition and storage card according to claim 1, characterized in that, The fixing plate insertion interface (44) is provided with side mounting grooves (45) on both sides. The side mounting grooves (45) on both sides of the fixing plate insertion interface (44) are distributed in a circular manner. The side fixing plate (35) is provided with two fixing through holes (36).

3. A modular integrated acquisition and storage card according to claim 2, characterized in that, Oxide removal posts (8) are installed on both sides of the PCIe interface (43). When the side fixing plate (35) is inserted into the PCIe interface (43), it first passes through the friction of the oxide removal posts (8).

4. A modular integrated acquisition and storage card according to claim 3, characterized in that, A contact module (7) is installed below the oxide layer removal column (8). The contact module (7) includes an insulating central shaft (70). The insulating central shaft (70) is movably installed on the side of the PCIe interface (43). Multiple abutting rings (71) are fixedly installed on the insulating central shaft (70). The abutting rings (71) abut against the oxide layer removal column (8). The surface of the oxide layer removal column (8) is provided with a rubber layer. A T-shaped ring groove (72) is opened in the middle of the abutting ring (71). One end of the connecting pin (46) is provided with a boss that matches the T-shaped ring groove (72) and is movably installed in the T-shaped ring groove (72). At the same time, one end of the insulating central shaft (70) is provided with a first side adjustment ring (73). The first side adjustment ring (73) is provided with a second side abutting boss (76). One end of the second side abutting boss (76) is located on the upper end of the abutting base plate (77).

5. A modular integrated acquisition and storage card according to claim 4, characterized in that, The first side adjustment ring (73) is provided with a first side boss (74), and the first side boss (74) is provided with a first waist hole (75). One end of the oxide layer removal column (8) is provided with a second side adjustment ring (81), and the side of the second side adjustment ring (81) is provided with a third side boss (82). The third side boss (82) is provided with a connecting shaft (83), and the connecting shaft (83) is movably installed in the first waist hole (75).

6. A modular integrated acquisition and storage card according to claim 5, characterized in that, The mounting slot (21) has an active heat dissipation plate mounting slot (23) on its side. An active heat dissipation plate (24) is movably installed in the active heat dissipation plate mounting slot (23). A fourth spring (27) is provided between the active heat dissipation plate (24) and the bottom surface of the active heat dissipation plate mounting slot (23). The active heat dissipation plate (24) has a clearance abutment protrusion (25) on its upper and lower sides. The clearance abutment protrusion (25) is located in the side positioning slide groove (22). The side guide protrusion (30) has an abutment protrusion at one end near the side fixing plate (35). During the installation of the memory card, the abutment protrusion and the clearance abutment protrusion (25) abut against each other, and the active heat dissipation plate (24) moves inward by abutting.

7. A modular integrated acquisition and storage card according to claim 6, characterized in that, The integrated acquisition storage card includes an SSD hard disk array module (1), which includes multiple expansion hard disks (3).

8. A computer, characterized in that, The computer includes the integrated acquisition and storage card as described in any one of claims 1-7.

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