Buffer device for placing silicon wafers

Abstract

The application provides a cache device for placing silicon wafers, comprising: a mounting base movably arranged on a lifting module, the lifting module driving the mounting base to move along the height direction of the lifting module; a plurality of cache supports are arranged at intervals and form a containing area for placing silicon wafers, each cache support has a positioning tooth structure on the side facing the containing area, and a positioning groove for accommodating a silicon wafer is formed between two adjacent teeth of the positioning tooth structure, so that a plurality of silicon wafers can be independently placed in different positioning grooves along the extension direction of the positioning tooth structure; the plurality of cache supports are arranged on the mounting base through an adjusting module, and the adjusting module is drivingly connected with the plurality of cache supports to make the plurality of cache supports move closer to or farther away from each other to change the size of the containing area, wherein the movement directions of at least two cache supports among the plurality of cache supports are arranged at an angle. The application solves the problems of low automation and poor adjustment precision of the cache device in the prior art.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of cache device, in particular to a cache device for placing silicon wafers. BACKGROUND

[0002] In the process of battery production, in order to avoid the pollution of the silicon wafer, the silicon wafer will be temporarily stored in the cache device. In order to cache different specifications of silicon wafers, the cache device is mostly designed in the form of adjustable size. At present, when adjusting the size of the cache device, the screw fixing the cache support is manually twisted open, and the position of the cache support is manually adjusted. It cannot be automatically adjusted, and manual adjustment has large error, which needs to be repeatedly adjusted to be adjusted in place.

[0003] That is, the cache device in the prior art has the problems of low automation degree and poor adjustment precision, SUMMARY

[0004] The main purpose of the present application is to provide a cache device for placing silicon wafers, so as to solve the problem of low automation degree and poor adjustment precision of the cache device in the prior art.

[0005] In order to achieve the above purpose, according to one aspect of the present application, a cache device for placing silicon wafers is provided, comprising: a lifting module; a mounting base movably arranged on the lifting module, the lifting module driving the mounting base to move along the height direction of the lifting module; a plurality of cache supports, the plurality of cache supports are arranged at intervals and form a containing area for placing silicon wafers between the plurality of cache supports, each cache support has a positioning tooth structure on the side facing the containing area, and the positioning tooth structure extends along the height of each cache support, the adjacent two teeth of the positioning tooth structure form a positioning groove for accommodating the silicon wafer, so that a plurality of silicon wafers can be independently placed in different positioning grooves along the extension direction of the positioning tooth structure; an adjustment module, the plurality of cache supports are arranged on the mounting base through the adjustment module, and the adjustment module is drivingly connected with the plurality of cache supports, so that the plurality of cache supports are close to or away from each other to change the size of the containing area, wherein the movement direction of at least two cache supports in the plurality of cache supports is arranged at an angle.

[0006] Further, the plurality of cache supports are arranged in pairs to form a cache assembly, the two cache supports in the same group are arranged at an angle on the bottom of the mounting base, the adjustment module comprises a plurality of driving assemblies, and different cache assemblies are driven to move by different driving assemblies, the movement direction of the cache assemblies in different groups is arranged at an angle, and the two cache supports in the cache assembly move towards or away from each other.

[0007] Further, the cache assembly is two groups.

[0008] Further, the three buffer supports are arranged in parallel and at intervals to form a buffer assembly, and the adjusting module drives the two buffer supports in the buffer assembly to move towards or away from each other, and the movement direction of the other buffer support is arranged at an angle to the movement direction of the buffer assembly.

[0009] Further, the plurality of drive assemblies are arranged at intervals along the height direction at the bottom of the mounting base.

[0010] Further, the adjusting module further comprises a connecting plate arranged between the two adjacent drive assemblies, and the connecting plate and / or the bottom surface of the mounting base has a sliding groove structure for guiding the movement of the drive assembly, and at least a part of the drive assembly is arranged in the sliding groove structure.

[0011] Further, the drive assembly comprises: a driving member connected with the connecting plate and / or the mounting base; and at least two driving arms connected with the driving member, the driving member drives the at least two driving arms to move close to or away from each other, and at least a part of the driving arms is located in the sliding groove structure, and the buffer support is connected to the end of the driving arm away from the driving member.

[0012] Further, the connecting plate has an avoiding gap for avoiding the buffer support.

[0013] Further, the adjusting module further comprises a plurality of connecting columns, the two ends of the connecting columns are respectively connected with the bottom surface of the mounting base and the connecting plate, the plurality of connecting columns are arranged at intervals, and at least one group of drive assemblies is located between the connecting plate and the mounting base.

[0014] Further, the mounting base comprises: a fixed seat surrounded by a plurality of vertically arranged plate structures and connected with the lifting module; a base plate connected with the bottom of the fixed seat and horizontally extending away from the lifting module; and a connecting frame, the two adjacent sides of the connecting frame are respectively connected with the upper surfaces of the fixed seat and the base plate.

[0015] Further, the buffer support comprises: a frame extending along the extension direction of the lifting module, and the top of the frame has a bent mounting section connected with the adjusting module, and the bottom of the frame has a supporting plate section horizontally extending towards the containing area; and a supporting frame detachably arranged on the side surface of the frame towards the containing area, and the supporting frame extends along the extension direction of the frame, and the supporting frame has a positioning tooth structure.

[0016] Applying the technical solution of this invention, the mounting base is movably mounted on the lifting module, and multiple cache supports are mounted on the mounting base via an adjustment module. The adjustment module drives the multiple cache supports to move closer to or further away from each other. Thus, the adjustment module drives the cache supports to move, adjusting the size of the receiving area for placing silicon wafers formed between the multiple cache supports. This enables the cache device to cache silicon wafers of different sizes, achieving automatic adjustment, increasing adjustment accuracy, and reducing adjustment time. Attached Figure Description

[0017] The accompanying drawings, which form part of this application, are used to provide a further understanding of the invention. The illustrative embodiments of the invention and their descriptions are used to explain the invention and do not constitute an undue limitation of the invention. In the drawings:

[0018] Figure 1 A schematic diagram of the overall structure of a cache device according to an optional embodiment of the present invention is shown; and

[0019] Figure 2 It shows Figure 1 A view of the cache device from one angle;

[0020] Figure 3 It shows Figure 1 A schematic diagram showing the positional relationship between the mounting base, adjustment module, and buffer bracket;

[0021] Figure 4 It shows Figure 3 Exploded view of the mounting base, adjustment module, and buffer bracket;

[0022] Figure 5 It shows Figure 4 A schematic diagram showing the positional relationship between the drive assembly, the substrate, and the cache support;

[0023] Figure 6 It shows Figure 4 A schematic diagram showing the positional relationship between the drive assembly, the connecting board, and the cache bracket;

[0024] Figure 7 It shows Figure 1 A bottom view of the buffer device;

[0025] Figure 8 It shows Figure 4 A schematic diagram of the middle support frame.

[0026] The above figures include the following reference numerals:

[0027] 10, lifting module; 20, mounting base; 21, fixed seat; 211, first fixed plate segment; 212, connecting plate segment; 213, second fixed plate segment; 22, base plate; 23, connecting frame; 30, buffer support; 31, frame; 311, bending mounting segment; 312, supporting plate segment; 313, vertical plate segment; 314, reinforcing plate segment; 32, supporting frame; 33, positioning groove; 40, containing area; 50, adjusting module; 51, driving assembly; 511, driving piece; 512, driving arm; 513, driving block; 514, driving plate; 515, linear slide rail assembly; 516, air cylinder; 517, air cylinder piston; 518, slide rail; 519, sliding block; 52, connecting plate; 521, avoiding notch; 53, connecting column; 60, sliding groove structure; 70, fixing pin. DETAILED DESCRIPTION

[0028] It should be noted that the embodiments and features in the embodiments in the present application can be combined with each other without conflict. The present application will be described in detail below with reference to the drawings and in combination with the embodiments.

[0029] It should be noted that, unless otherwise specified, all technical and scientific terms used in the present application have the same meaning as generally understood by those skilled in the art to which the present application belongs.

[0030] In the present application, unless otherwise specified, the orientation words such as "up, down, top, bottom" are generally directed to the directions shown in the drawings, or are directed to the vertical, perpendicular or gravity directions of the components themselves; similarly, for the convenience of understanding and description, "inner, outer" refers to the inner and outer relative to the contour of the components themselves, but the above orientation words are not used to limit the present application.

[0031] In order to solve the problems of low automation degree and poor adjustment precision of the existing buffer device, the present application provides a buffer device for placing silicon wafers.

[0032] In the present application, the mounting base 20 is movably arranged on the lifting module 10, and the plurality of buffer supports 30 are arranged on the mounting base 20 through the adjusting module 50, and the adjusting module 50 drives the plurality of buffer supports 30 to move close to or away from each other. In this way, the adjusting module 50 drives the buffer support 30 to move, so as to adjust the size of the containing area 40 for placing silicon wafers formed between the plurality of buffer supports 30, thereby enabling the buffer device to buffer silicon wafers of different sizes, realizing the function of automatic adjustment, increasing the adjustment precision and reducing the adjustment time.

[0033] Embodiment one

[0034] Please refer to Figures 1 to 8 The buffer device for placing silicon wafers comprises a lifting module 10, a mounting base 20, an adjusting module 50 and a plurality of buffer supports 30.

[0035] Mounting base 20 is mounted on lifting module 10, and lifting module 10 drives mounting base 20 to move. Mounting base 20 synchronously drives cache holder 30 to move, so as to cache different silicon wafers into different positions of the cache device. Multiple cache holders 30 are spaced apart from each other, forming a receiving area 40 for placing silicon wafers between multiple cache holders 30. Adjustment module 50 is connected to mounting base 20 and is used to drive cache holders 30 closer or further apart to change the size of receiving area 40 to accommodate silicon wafers of different specifications.

[0036] Among them, such as Figures 1 to 6 As shown, each cache holder 30 has a positioning tooth structure on the side facing the receiving area 40, and the positioning tooth structure extends along the height of each cache holder 30. A positioning groove 33 for accommodating silicon wafers is formed between two adjacent teeth of the positioning tooth structure, allowing multiple silicon wafers to be independently placed in different positioning grooves 33 along the extension direction of the positioning tooth structure. The positioning tooth structures on all cache holders 30 are at the same height, so that the positioning grooves 33 on different cache holders 30 are correspondingly arranged. This allows the positioning grooves 33 at the same height to accommodate the same silicon wafer, while the positioning grooves 33 at different heights accommodate different silicon wafers, effectively reducing scratches between silicon wafers and ensuring the quality of the silicon wafers.

[0037] It should be noted that the shape of the teeth on the positioning tooth structure can be triangular or rectangular. In addition, other shapes of teeth can also be used in this invention.

[0038] like Figure 1 and Figure 2 As shown, the mounting base 20 is movably mounted on the lifting module 10, and the lifting module 10 drives the mounting base 20 to move along the height direction of the lifting module 10. During the operation of the cache device, the lifting module 10 drives the mounting base 20 to move along the height direction of the lifting module, and at the same time, the mounting base 20 drives the cache support 30 to move synchronously, so that the silicon wafer is cached into different positioning slots 33.

[0039] Optionally, during the movement of the lifting module 10 driving the mounting base 20, the mounting base 20 does not move continuously, but rather in a "pulse" motion, with each movement covering the distance between two adjacent teeth. Specifically, this can be achieved by relying on sensors to detect whether there is a silicon wafer in the positioning slot 33. Once a silicon wafer is detected in the positioning slot 33, the lifting module 10 drives the mounting base 20 to move, causing the next positioning slot 33 to move to the assembly position. The movement of the mounting base 20 is the same as that of silicon wafer buffer devices in the prior art, and will not be described in detail here.

[0040] In addition, the movement directions of at least two of the plurality of buffer supports 30 are arranged at an angle. Compared with the prior art, the two buffer supports 30 only move relatively or oppositely, and can only be adjusted in one direction. The buffer supports 30 in the present application can be adjusted in at least two different directions to adjust the size in different directions, thereby increasing the size of the silicon wafer that can be buffered by the buffer device.

[0041] It should be noted that in the present application, relative movement or opposite movement refers to movement in the same direction, and different direction movement refers to movement in two directions with an included angle.

[0042] Specifically, the plurality of buffer supports 30 are arranged in pairs to form a buffer assembly, and the two buffer supports 30 in the same group are arranged at an angle on the bottom of the mounting base 20. The adjustment module 50 includes a plurality of drive assemblies 51, and different buffer assemblies are driven to move by different drive assemblies 51. The movement directions of the buffer assemblies in different groups are arranged at an angle, and the two buffer supports 30 in the buffer assembly move towards or away from each other. One buffer assembly can adjust the size of the containing area 40 in one direction. Specifically, the two buffer supports 30 in the buffer assembly move towards each other, thereby reducing the size of the containing area 40 in that direction. The two buffer supports 30 in the buffer assembly move away from each other, thereby increasing the size of the containing area 40 in that direction. The plurality of buffer assemblies can adjust the size of the containing area 40 in multiple directions, effectively increasing the directions of the containing area 40 adjustment, thereby increasing the size of the silicon wafer.

[0043] Preferably, the buffer assembly is two groups.

[0044] As shown in Figure 4 and Figure 7 , the plurality of drive assemblies 51 are arranged at intervals along the height direction on the bottom of the mounting base 20. This arrangement can separate the plurality of drive assemblies 51, reduce interference between the drive assemblies 51 when driving the buffer assembly to move, and ensure smooth movement of the buffer assembly.

[0045] Specifically, the adjustment module 50 further includes a connecting plate 52 arranged between adjacent two drive assemblies 51. The connecting plate 52 not only separates the plurality of drive assemblies 51, but also supports the drive assemblies 51 to ensure stable movement of the drive assemblies 51.

[0046] Further, the adjustment module 50 further includes a plurality of connecting columns 53, both ends of the connecting column 53 are connected with the bottom surface of the mounting base 20 and the connecting plate 52, and the plurality of connecting columns 53 are arranged at intervals. At least one group of drive assemblies 51 is located between the connecting plate 52 and the mounting base 20. The connecting column 53 not only connects the connecting plate 52 and the mounting base 20 together, but also provides a mounting space for the drive assemblies 51 to ensure stable operation of the drive assemblies 51.

[0047] Optionally, the length of the connecting column 53 is greater than or equal to 30 mm and less than or equal to 50 mm.

[0048] In addition, the bottom surface of the connecting plate 52 and the mounting base 20 has a sliding groove structure 60 for guiding the movement of the driving assembly 51, and at least a part of the driving assembly 51 is arranged in the sliding groove structure 60. The sliding groove structure 60 not only can guide the driving assembly 51, but also can limit the driving assembly 51 to ensure the movement of the driving assembly 51 along the extension direction of the sliding groove structure 60.

[0049] As shown in Figures 4 to 6 , the driving assembly 51 includes a driving piece 511 and a driving arm 512, the driving piece 511 is connected with the connecting plate 52 or the mounting base 20; the driving arm 512 is at least two, the driving arm 512 is connected with the driving piece 511, the driving piece 511 drives the at least two driving arms 512 to move close to or away from each other, and at least a part of the driving arm 512 is located in the sliding groove structure 60, and the buffer support 30 is connected to the end of the driving arm 512 away from the driving piece 511. The driving arm 512 is connected with the buffer support 30 to drive the movement of the buffer support 30, and then change the size of the containing area 40 to accommodate silicon wafers of different sizes.

[0050] Optionally, the driving piece 511 is connected with two driving arms 512, and one buffer support 30 is connected to each of the two driving arms 512 to drive the movement of the buffer support 30, and one driving assembly 51 can simultaneously drive two buffer supports 30 to move towards each other or away from each other.

[0051] In Figure 4 the specific embodiment, the driving arm 512 includes a driving block 513, a driving plate 514 and a linear slide rail assembly 515, the driving block 513 is connected with the driving piece 511, the driving plate 514 is connected with the driving block 513, and the driving plate 514 is located below the driving block 513, the buffer support 30 is connected to the end of the driving plate 514 away from the driving block 513, the linear slide rail assembly 515 is arranged on the driving plate 514, and a part of the linear slide rail assembly 515 extends into the sliding groove structure 60.

[0052] In Figure 4In the shown specific embodiment, the slide rail 518 of the linear slide rail assembly 515 is fixedly connected with the slide groove structure 60, and the sliding block 519 of the linear slide rail assembly 515 is fixedly connected with the driving plate 514. When the driving member 511 moves, the driving plate 514 drives the sliding block 519 to move. The linear slide rail assembly 515 can stabilize the gravity center of the driving plate 514, so that the driving plate 514 moves along the extension direction of the slide rail 518, preventing the driving plate 514 from moving eccentrically due to gravity, avoiding the inclined movement of the buffer support 30, and further reducing the phenomenon of broken silicon wafers due to the inclination of the silicon wafers. In addition, a fixed pin 70 for stopping and limiting the sliding block 519 is arranged outside the slide groove structure 60 to limit the movement range of the sliding block 519.

[0053] Optionally, the driving member 511 includes a cylinder 516 and a cylinder piston 517, and the driving block 513 is connected with the cylinder piston 517. The cylinder is a bidirectional cylinder to drive the two driving arms 512 to move towards or away from each other. When the inlet pipe of the bidirectional cylinder is filled with air, the cylinder pistons 517 on both sides of the bidirectional cylinder move away from each other, and push the driving plate 514 to move. The driving plate 514 drives the sliding block 519 of the linear slide rail assembly 515 to move on the slide rail 518, and at the same time, the driving plate 514 drives the buffer support 30 to move away from each other along the extension direction of the slide rail 518, so as to realize the expansion of the containing area 40. When the outlet pipe of the bidirectional cylinder is filled with air, the cylinder pistons 517 on both sides of the bidirectional cylinder move towards each other, and drive the driving plate 514 to move. At the same time, the driving plate 514 drives the buffer support 30 to move towards each other along the extension direction of the slide rail 518, so as to realize the contraction of the containing area 40. Through the movement of the driving assembly 51, the size of the containing area 40 can be adjusted to adapt to silicon wafers of different sizes.

[0054] In addition, the driving member 511 can be of other structural forms, as long as it can drive at least two driving arms 512 to move close to or away from each other.

[0055] Of course, the driving block 513 and the driving plate 514 can also be of an integral structure, which is not limited here.

[0056] In order to avoid interference between different driving assemblies 51, the connecting plate 52 has a avoiding gap 521 for avoiding the buffer support 30 to ensure stable movement of the buffer support 30.

[0057] In Figure 6 In the shown specific embodiment, the connecting plate 52 is rectangular, and the avoiding gap 521 is arranged at the diagonal positions of the connecting plate 52, and the slide groove structure 60 is arranged at the other two diagonal positions of the connecting plate 52.

[0058] As Figure 4As shown, the mounting base 20 comprises a fixed seat 21, a base plate 22 and a connecting frame 23, the fixed seat 21 is surrounded by a plurality of vertical plate structures and connected with the lifting module 10; the base plate 22 is connected with the bottom of the fixed seat 21 and horizontally extends towards the direction away from the lifting module 10; the adjacent two groups of side edges of the connecting frame 23 are respectively connected with the upper surfaces of the fixed seat 21 and the base plate 22. The connecting frame 23 can increase the connecting strength between the fixed seat 21 and the base plate 22, so as to ensure the stable connection between the fixed seat 21 and the base plate 22. The adjusting module 50 is connected on the side surface of the base plate 22 away from the connecting frame 23, so as to facilitate the silicon wafer storage of the storage support 30.

[0059] In Figure 4 In the specific embodiment shown, the fixed seat 21 comprises a first fixed plate segment 211, a connecting plate segment 212 and a second fixed plate segment 213, the first fixed plate segment 211 and the second fixed plate segment 213 are parallel and spaced apart, the first fixed plate segment 211 and the second fixed plate segment 213 are connected through the connecting plate segment 212, the first fixed plate segment 211 is connected with the lifting module 10, and the second fixed plate segment 213 is connected with the connecting frame 23.

[0060] In this embodiment, the storage device has two driving assemblies 51, one driving assembly 51 is located between the base plate 22 and the connecting plate 52, and the driving assembly 51 is connected with the side surface of the base plate 22 towards the connecting plate 52, and the other driving assembly 51 is connected on the side surface of the connecting plate 52 away from the base plate 22, so as to realize the interval arrangement of the two driving assemblies 51 in the height direction. At the same time, the extension directions of the two driving assemblies 51 are cross arranged, so that different driving assemblies 51 drive the storage support 30 to move in different directions.

[0061] As Figures 4 to 6 As shown, the storage support 30 comprises a frame 31 and a support frame 32, the frame 31 extends along the extension direction of the lifting module 10, and the top of the frame 31 has a bent mounting segment 311 connected with the adjusting module 50, and the bottom of the frame 31 has a supporting plate segment 312 horizontally extending towards the containing area 40; the support frame 32 is detachably arranged on the side surface of the frame 31 towards the containing area 40, and the support frame 32 extends along the extension direction of the frame 31, and the support frame 32 has a positioning tooth structure. The bent mounting segment 311 is used for connecting with the adjusting module 50, and the setting of the supporting plate segment 312 can reduce the collision of other structural members to the support frame 32, and plays a certain protection role for the support frame 32. The detachable connection between the support frame 32 and the frame 31 facilitates the replacement and maintenance of the support frame 32, and different support frames 32 can also be replaced according to the size of the required positioning groove 33.

[0062] Optionally, the frame 31 comprises a bending mounting section 311, a vertical plate section 313 and a supporting plate section 312, the vertical plate section 313 extends along the extending direction of the lifting module 10, the supporting frame 32 is mounted on the vertical plate section 313, the bending mounting section 311 is detachably connected with the top of the vertical plate section 313, and the supporting plate section 312 is detachably connected with the bottom of the vertical plate section 313.

[0063] In Figure 4 In the specific embodiment shown, the frame 31 further comprises a reinforcing plate section 314, which is connected with the vertical plate section 313 and the bending mounting section 311 to increase the structural strength of the vertical plate section 313 and the bending mounting section 311.

[0064] Embodiment Two

[0065] The difference between the embodiment one and the embodiment two is that the number of the buffer supports 30 is different.

[0066] In the embodiment, the buffer supports 30 are three, two of which are arranged in parallel and at intervals to form a buffer assembly, and the adjusting module 50 drives the two buffer supports 30 in the buffer assembly to move towards or away from each other, and the moving direction of the other buffer support 30 is arranged at an angle to the moving direction of the buffer assembly. The two buffer supports 30 in the buffer assembly are used to adjust the "opening" size of the accommodation area 40, and the other single buffer support 30 is used to adjust the "length" of the accommodation area 40. The three buffer supports 30 can also realize the movement in two directions to adjust the size of the accommodation area 40.

[0067] From the above description, it can be seen that the above-mentioned embodiments of the present application achieve the following technical effects:

[0068] 1. The adjusting module 50 is arranged to enable the buffer device to automatically adjust the size of the buffer space, without manual adjustment, thereby reducing the adjustment time and improving the production efficiency.

[0069] 2. Two driving assemblies 51 are adopted to realize automatic adjustment in two directions, thereby increasing the adjustment size.

[0070] Obviously, the above-described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor should fall within the protection scope of the present application.

[0071] It is to be understood that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting, as the scope of the exemplary embodiments of this application is limited only by the appended claims. Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. Also, unless otherwise indicated herein, the materials described herein can be used in a variety of applications.

[0072] It should be noted that the terms "first", "second", and the like, as used in the description and the claims herein are intended to modify a particular disclosed embodiment unless otherwise indicated, but do not imply that the architecture having such designation must be the first or second among its field or order of importance. It is also to be understood that the use of the terms "first", "second", etc., was merely used to parameterize similar objects to distinguish one from another without necessarily causing or implying any actual such limitation in the application.

[0073] The preferred embodiments of the application are described above in detail. The application is not limited to the embodiments described above, but can vary and be modified as required. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the application shall fall within the scope of the application.

Claims

1. A buffer device for placing silicon wafers, characterized in that, include: Lifting module (10); Mounting base (20), which is movably mounted on the lifting module (10), and the lifting module (10) drives the mounting base (20) to move along the height direction of the lifting module (10); Multiple cache holders (30) are spaced apart from each other and form a receiving area (40) for placing the silicon wafer between the multiple cache holders (30). Each cache holder (30) has a positioning tooth structure on one side facing the receiving area (40), and the positioning tooth structure extends along the height of each cache holder (30). A positioning groove (33) for accommodating the silicon wafer is formed between two adjacent teeth of the positioning tooth structure, so that the multiple silicon wafers can be independently placed in different positioning grooves (33) along the extension direction of the positioning tooth structure. An adjustment module (50) is used to mount multiple cache brackets (30) on the mounting base (20). The adjustment module (50) is driven to connect multiple cache brackets (30) so that the multiple cache brackets (30) move closer to or further away from each other to change the size of the receiving area (40). At least two of the multiple cache brackets (30) are angularly positioned in the direction of movement. Multiple cache brackets (30) are paired up to form a cache assembly. Two cache brackets (30) in the same group are arranged diagonally at the bottom of the mounting base (20). The adjustment module (50) includes multiple drive components (51), and different cache assemblies are driven by different drive components (51). The movement directions of cache assemblies in different groups are set at an angle. Two cache brackets (30) in the cache assembly move towards or away from each other. The cache holder (30) includes: The frame (31) extends along the extension direction of the lifting module (10), and the top of the frame (31) has a bent mounting section (311) connected to the adjustment module (50), and the bottom of the frame (31) has a tray section (312) extending horizontally toward the receiving area (40). A support frame (32) is detachably disposed on one side surface of the frame (31) facing the receiving area (40) and the support frame (32) extends along the extension direction of the frame (31) and has the positioning tooth structure.

2. The buffer device for placing silicon wafers according to claim 1, characterized in that, The caching components consist of two groups.

3. The buffer device for placing silicon wafers according to claim 1, characterized in that, When there are three cache brackets (30), two of the cache brackets (30) are arranged in parallel and spaced apart to form a cache assembly. The adjustment module (50) drives two of the cache brackets (30) in the cache assembly to move towards or away from each other, and the movement direction of the other cache bracket (30) is set at an angle to the movement direction of the cache assembly.

4. The buffer device for placing silicon wafers according to claim 1, characterized in that, Multiple drive components (51) are spaced apart along the height direction at the bottom of the mounting base (20).

5. The buffer device for placing silicon wafers according to claim 4, characterized in that, The adjustment module (50) further includes a connecting plate (52) disposed between two adjacent drive components (51). The bottom surface of the connecting plate (52) and / or the mounting base (20) has a groove structure (60) for guiding the movement of the drive components (51). At least a portion of the drive components (51) is disposed within the groove structure (60).

6. The buffer device for placing silicon wafers according to claim 5, characterized in that, The driving component (51) includes: A drive unit (511) is connected to the connecting plate (52) and / or the mounting base (20); The drive arm (512) is at least two, and the drive arm (512) is connected to the drive member (511). The drive member (511) drives at least two of the drive arms (512) to move closer to or further away from each other, and at least a portion of the drive arm (512) is located within the slide structure (60). The buffer bracket (30) is connected to the end of the drive arm (512) away from the drive member (511).

7. The buffer device for placing silicon wafers according to claim 5, characterized in that, The connecting plate (52) has a clearance notch (521) for avoiding the cache support (30).

8. The buffer device for placing silicon wafers according to claim 5, characterized in that, The adjustment module (50) also includes multiple connecting columns (53), the two ends of which are connected to the bottom surface of the mounting base (20) and the connecting plate (52) respectively. The multiple connecting columns (53) are spaced apart, and at least one set of the driving components (51) is located between the connecting plate (52) and the mounting base (20).

9. The buffer device for placing silicon wafers according to claim 4, characterized in that, The mounting base (20) includes: The fixed base (21) is formed by a plurality of upright plate-like structures and is connected to the lifting module (10); The base plate (22) is connected to the bottom of the fixing base (21) and extends horizontally away from the lifting module (10); The connecting frame (23) has two adjacent sets of side edges that are connected to the upper surfaces of the fixing base (21) and the base plate (22), respectively.

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