Power supply circuit module

Abstract

A power supply circuit module (101) is provided with a power supply circuit including: a lower substrate (30); an upper substrate (40) parallel to the lower substrate (30); an inductor element (20), a chip component (32), or the like mounted to the lower substrate (30); a switching circuit component (11, 12), a chip component (42), or the like mounted to the upper substrate (40); and a plurality of inter-substrate connecting members (51A to 51H, 52A to 52G, 53A, 53K, 54A), or the like, electrically and mechanically connecting the lower substrate (30) and the upper substrate (40), a part of the plurality of inter-substrate connecting members being an inductor constituting a part of the power supply circuit or a part of an inductor constituting a part of the power supply circuit.

Description

Technical Field

[0001] This invention relates to a power circuit module mounted on a circuit board or the like in electronic devices. Background Technology

[0002] Patent Document 1 shows a so-called double-layer stacked mounting structure, which includes: a plurality of substrates whose main surfaces are arranged parallel to each other; a substrate connecting member that connects the substrates to each other; and a member connecting the members, which has a columnar parallel portion arranged parallel to the main surface of at least one substrate in the long side direction, the other end of the parallel portion being arranged to extend along the end of the member's main surface, one end being connected to a member connecting electrode formed on the main surface of the substrate, and a member arranged with its main surfaces orthogonal to each other on the main surface of the substrate being connected to the other end of the parallel portion.

[0003] Prior art literature

[0004] Patent documents

[0005] Patent Document 1: Japanese Patent Application Publication No. 2010-225699 Summary of the Invention

[0006] The problem the invention aims to solve

[0007] According to the stacked mounting structure described in Patent Document 1, a component configured orthogonal to the main surface of the substrate can be connected to the other end of the parallel portion. Therefore, other components can be easily and densely connected to the stacked mounting structure.

[0008] However, when modularizing power supply circuits such as DC-DC converter circuits, it is desirable not only to achieve high density through the aforementioned two-layer structure, but also to have good electrical characteristics.

[0009] Therefore, the object of the present invention is to provide a power circuit module that achieves miniaturization and good electrical characteristics by adopting a two-layer structure.

[0010] means for solving problems

[0011] The power supply circuit module, as an example of this disclosure, is characterized by having a power supply circuit including a lower substrate, an upper substrate parallel to the lower substrate, a lower substrate side component mounted on the lower substrate, an upper substrate side component mounted on the upper substrate, and a plurality of substrate connecting members electrically and mechanically connecting the lower substrate and the upper substrate, wherein a portion of the plurality of substrate connecting members is an inductor constituting part of the power supply circuit or a portion of an inductor constituting part of the power supply circuit.

[0012] Invention Effects

[0013] According to the present invention, miniaturization is achieved by having an upper substrate and a lower substrate on which components are respectively mounted, and parasitic components generated by the inter-substrate connection members are effectively utilized to obtain a power circuit module with good electrical characteristics. Attached Figure Description

[0014] Figure 1 This is a perspective view of the power supply circuit module 101 of the first embodiment.

[0015] Figure 2 From Figure 1 The image shown is a perspective view of the state in which the upper substrate 40, together with the upper substrate side components and the upper substrate side resin layer 41, has been removed.

[0016] Figure 3 From Figure 2 The diagram shown is a perspective view of a state in which the inter-substrate connecting members 52A-52G and 54A-54G have been removed.

[0017] Figure 4 This is a 3D view of inductor element 20.

[0018] Figure 5 From Figure 3 The diagram shown is a 3D view of the state in which the inductor element 20 has been removed.

[0019] Figure 6 This is a perspective view showing the positional relationship between the upper substrate 40 and the inductor element 20 connected to the upper substrate 40.

[0020] Figure 7 This is a perspective view showing the lower surface of the upper substrate 40.

[0021] Figure 8 This is a bottom view of the lower substrate 30.

[0022] Figure 9 It is a three-dimensional view of multiple power circuit modules mounted on the mounting base plate.

[0023] Figure 10 It is part of the structure and Figure 1 The diagram shows three-dimensional views of different power circuit modules.

[0024] Figure 11 This is a circuit diagram of the power supply circuit formed by the power supply circuit module 101 in the first embodiment.

[0025] Figure 12 This is a diagram showing the configuration relationship between the switching circuit components 11 and 12 and the inductor element 20.

[0026] Figure 13This is a perspective view of the inductor element 20 disposed in the power supply circuit module of the second embodiment.

[0027] Figure 14 (A) Figure 14 (B) is a front view of the main part of the power supply circuit module of the third embodiment.

[0028] Figure 15 This is a perspective view of the power supply circuit module 104A according to the fourth embodiment.

[0029] Figure 16 This is a perspective view of another power supply circuit module 104B in the fourth embodiment.

[0030] Figure 17 This is a perspective view of the power supply circuit module 105 according to the fifth embodiment.

[0031] Figure 18 This is a perspective view of the power supply circuit module 106 according to the sixth embodiment.

[0032] Figure 19 yes Figure 18 The power circuit module 106 shown is shown in a front perspective view of its upper part.

[0033] Figure 20 This is a perspective view of the power supply circuit module 107 according to the seventh embodiment.

[0034] Figure 21 yes Figure 20 The power circuit module 107 shown is shown in a front perspective view of its upper part.

[0035] Figure 22 This is a perspective view of the power supply circuit module 108 according to the eighth embodiment.

[0036] Figure 23 yes Figure 22 The power circuit module 108 shown is a front perspective view of its upper part.

[0037] Figure 24 This is a perspective view of the power supply circuit module 109 according to the ninth embodiment.

[0038] Figure 25 From Figure 24 The image shown is a perspective view of the state in which the upper substrate 40 has been removed.

[0039] Figure 26 From Figure 25 The diagram shown is a perspective view of a state in which the low-side source interconnect 80 and the inter-substrate interconnect 52A-52E, 54A-54C have been removed.

[0040] Figure 27This is a circuit diagram of the power supply circuit formed in the power supply circuit module 109 of the ninth embodiment.

[0041] Figure 28 This is a circuit diagram of another power supply circuit formed by the power supply circuit module in the ninth embodiment. Detailed Implementation

[0042] Hereafter, with reference to the accompanying drawings and several specific examples, various methods for implementing the invention will be illustrated. The same reference numerals are used for the same parts in each drawing. For ease of explanation and understanding, the embodiments are shown in multiple ways, but partial substitutions or combinations of the structures shown in different embodiments are possible. From the second embodiment onwards, descriptions of matters common to the first embodiment are omitted, and only the differences are described. In particular, the same effects produced by the same structure are not mentioned repeatedly in each embodiment.

[0043] First Implementation Method

[0044] Figure 1 This is a perspective view of the power circuit module 101 according to the first embodiment. The power circuit module 101 includes a power circuit comprising a lower substrate 30, an upper substrate 40 parallel to the lower substrate 30, and a plurality of inter-substrate connecting members electrically and mechanically connecting the lower substrate 30 and the upper substrate 40. The lower substrate 30 and the upper substrate 40 each have a mounting surface on their upper surfaces, and the mounting surfaces of the lower substrate 30 and the upper substrate 40 are parallel to each other. Furthermore, in the thickness direction of the substrates, the upper surface of the lower substrate 30 and the lower surface of the upper substrate 40 face each other.

[0045] Chip components 32 and inductor elements 20 are mounted on the lower substrate 30. These chip components 32 and inductor elements 20 are lower substrate-side components. Chip components 42 and switching circuit components 11 and 12 are mounted on the upper substrate 40. These chip components 42 and switching circuit components 11 and 12 are the aforementioned substrate-side components. A lower substrate-side resin layer 31 is coated on the lower substrate 30. An upper substrate-side resin layer 41 is coated on the upper substrate 40. Figure 1 (in the middle, shown later) Figure 2 , Figure 3 (The same applies in the diagram), the lower substrate side resin layer 31 and the upper substrate side resin layer 41 are shown in a transparent form.

[0046] Figure 2 From Figure 1 The image shown is a perspective view of the state in which the upper substrate 40, along with the upper substrate-side components and the upper substrate-side resin layer 41, has been removed. Figure 1 , Figure 2As indicated, a plurality of inter-substrate connecting members 51A-51H, 52A-52G, 53A, 54A-54G, etc., are provided between the lower substrate 30 and the upper substrate 40 to electrically and mechanically connect the lower substrate 30 and the upper substrate 40. These inter-substrate connecting members are cylindrical metal bodies such as copper pins.

[0047] Figure 3 From Figure 2 The diagram shown is a perspective view of a state in which the inter-substrate connecting members 52A-52G and 54A-54G have been removed. Figure 4 This is a 3D view of inductor element 20. Figure 5 From Figure 3 The diagram shown is a 3D view of the state in which inductor element 20 has been removed.

[0048] The inductor element 20 is generally rectangular in shape, and has input-side terminals 21 and 23 and output-side terminals 22 and 24 on its sides. For example... Figure 3 , Figure 4 , Figure 5 As indicated, terminal 21 of inductor element 20 is connected to substrate connection member 53H, and terminal 23 is connected to substrate connection member 51H. In addition, terminal 22 of inductor element 20 is connected to substrate connection members 51I, 51J, and 51K, and terminal 24 is connected to substrate connection members 53I, 53J, and 53K.

[0049] Figure 6 This is a perspective view showing the positional relationship between the upper substrate 40 and the inductor element 20 connected to the upper substrate 40. Figure 7 This is a perspective view showing the lower surface of the upper substrate 40. However, in Figure 6 , Figure 7 In the middle, the state is represented by the top and bottom reversed.

[0050] like Figure 6 , Figure 7 As shown, the input side terminals 21 and 23 of the inductor element 20 are connected to the electrodes 40E1 and 40E3 of the upper substrate 40, respectively, and the output side terminals 22 and 24 are connected to the electrodes 40E2 and 40E4 of the upper substrate 40, respectively.

[0051] An inter-substrate connection member is formed by the input-side terminal 21 of the inductor element 20 and the inter-substrate connection member 53H, which electrically and mechanically connects the lower substrate 30 and the upper substrate 40. Similarly, an inter-substrate connection member is formed by the input-side terminal 23 and the inter-substrate connection member 51H. Furthermore, an inter-substrate connection member is formed by the output-side terminal 22 of the inductor element 20 and the inter-substrate connection members 51I, 51J, and 51K, which electrically and mechanically connect the lower substrate 30 and the upper substrate 40. Similarly, an inter-substrate connection member is formed by the output-side terminal 24 and the inter-substrate connection members 53I, 53J, and 53K. As will be shown later, the input-side terminals 21 and 23 and the output-side terminals 22 and 24 of the inductor element 20 utilize their parasitic inductance as passive components. Additionally, the lower ends of the input-side terminals 21 and 23 and the output-side terminals 22 and 24 are respectively connected to the electrodes of the lower substrate 30. The upper ends of the input side terminals 21 and 23 and the output side terminals 22 and 24 are respectively connected to the electrodes of the upper substrate 40.

[0052] Similarly, aside from the terminals of the aforementioned inductors, the connecting portions of the inter-substrate connection members are electrically and mechanically connected by welding and conductive adhesive. For example, the lower surfaces of inter-substrate connection members 51A-51K and 53A-53K are connected to the electrodes of the lower substrate 30. Furthermore, the lower surfaces of inter-substrate connection members 52A-52G and 54A-54G are connected to the upper surfaces of inter-substrate connection members 51A-51G and 53A-53G, and the upper surfaces of inter-substrate connection members 52A-52G and 54A-54G are connected to the electrodes of the upper substrate 40.

[0053] Figure 8 This is a bottom view of the lower substrate 30. Multiple electrodes are arranged on the lower surface of the lower substrate 30. These electrodes are connected to a mounting substrate by means of soldering or the like, thereby mounting the power circuit module 101 onto the mounting substrate.

[0054] like Figure 1 As shown, a chip component 42, other than the two switching circuit components 11 and 12, is disposed between them. The chip component 42 is, for example, a capacitor that forms part of a DC-DC converter circuit. These chip components 42, other than the switching circuit components 11 and 12, generate less heat, and furthermore, they thermally cut off the two switching circuit components 11 and 12. Furthermore, the two switching circuit components 11 and 12 are distributed on the upper substrate 40. Therefore, excessive temperature rise of the switching circuit components 11 and 12 is suppressed.

[0055] like Figure 1As shown, the upper substrate 40 includes an upper substrate-side resin layer 41 that seals the chip component 42 and the switching circuit components 11, 12. The upper substrate-side resin layer 41 has a flat upper surface. This facilitates adsorption during the manufacturing process. Furthermore, heat dissipation components such as heat sinks can be mounted on the surface, thus easily achieving good heat dissipation.

[0056] Figure 9 This is a perspective view of multiple power circuit modules mounted on a mounting base. However, the mounting base is not shown. In this example, heat sinks 60 are mounted on the upper surfaces of the four power circuit modules 101A, 101B, 101C, and 101D. Figure 9 The heat sink 60 is shown in a transparent form in the diagram. No upper substrate-side resin layer is formed on the upper substrate of the power circuit modules 101A, 101B, 101C, and 101D. Therefore, the switching circuit components 11 and 12 of the power circuit modules 101A, 101B, 101C, and 101D are directly thermally coupled to the heat sink 60, effectively dissipating heat from the switching circuit components 11 and 12.

[0057] Figure 10 It is part of the structure and Figure 1 The diagram shows a perspective view of different power circuit modules. In this example, the space between the lower substrate-side resin layer 31 and the upper substrate 40 is filled by an inter-substrate mold 70 formed of insulating resin. Therefore, the terminals 21-24 of the inductor element 20 and the respective inter-substrate connection members adjacent to these terminals are filled with the aforementioned insulating resin. This construction further ensures the electrical insulation between the terminals 21-24 of the inductor 2 and the inter-substrate connection members.

[0058] Figure 11 This is a circuit diagram of a power supply circuit formed by the power supply circuit module 101 in the first embodiment. This power supply circuit is a DC-DC converter comprising a switching circuit 10, an inductor element 20, and smoothing capacitors Co1, Co2, and Ci. In this example, the switching circuit 10 is a two-phase half-bridge circuit, and the inductor element 20 is connected between the output of the half-bridge circuit and the load (resistor RL).

[0059] The switching circuit 10 includes switching circuit components 11 and 12. Switching circuit component 11 includes a high-side switching element Q1, a low-side switching element Q2, and a drive circuit for driving them. Similarly, switching circuit component 12 includes a high-side switching element Q3, a low-side switching element Q4, and a drive circuit for driving them. It should be noted that switching circuit component 11 may also include a control circuit for controlling switching elements Q1 and Q2. Similarly, switching circuit component 12 may also include a control circuit for controlling switching elements Q3 and Q4.

[0060] Inductor element 20 is a coupled inductor including coils L1 and L2 that are magnetically coupled to each other with a specified coupling coefficient. Figure 11 The inductors L3 and L4 shown are represented by circuit notation to indicate the leakage inductance caused by the non-coupling of coils L1 and L2. Additionally, inductors L21 and L23 are represented by circuit notation to indicate the parasitic inductances generated at input terminals 21 and 23, respectively. Similarly, inductors L22 and L24 are represented by circuit notation to indicate the parasitic inductances generated at output terminals 22 and 24, respectively. Inductors L21 and L22 are connected in series with inductor L3; therefore, the circuit constituting their combined inductance is connected to the output of switching circuit component 11. Similarly, inductors L23 and L24 are connected in series with inductor L4; therefore, the circuit constituting their combined inductance is connected to the output of switching circuit component 12.

[0061] The switching elements Q1, Q2, Q3, and Q4 of the switching circuit components 11 and 12 are driven in two phases with a 180-degree phase difference. Smoothing capacitors Co1 and Co2 are connected in parallel to smooth fluctuations in the output voltage Vout. Smoothing capacitor Ci smooths the input voltage Vin. Figure 11 In the diagram, the resistor RL represents the load connected to the output of the power supply circuit module 101.

[0062] In this embodiment, since it is a two-phase DC-DC converter in which the inductors of the two DC-DC converters are magnetically coupled to each other, the output voltage ripple is effectively suppressed. Furthermore, because the voltage applied to coils L1 and L2 is smaller due to the magnetically coupled transformers, the inductance of coils L1 and L2 can be reduced. This, in turn, improves the responsiveness to load changes.

[0063] exist Figure 11 In this context, the meanings of the power supply and signals relative to the input and output of the switching circuit 10 are as follows.

[0064] Vin: Input power cord

[0065] GND: Ground

[0066] Vcc: Power supply voltage line for the control circuit of switching circuit components 11 and 12.

[0067] AGND: Grounding of the control circuit for switching circuit components 11 and 12

[0068] Isense1: The detection signal of the current flowing in inductor L3

[0069] Isense2: The detection signal of the current flowing in inductor L4

[0070] PWM1: Switching control signal for switching elements Q1 and Q2

[0071] PWM2: Switching control signal for switching elements Q3 and Q4

[0072] here, Figures 1-5 The relationship between the inter-substrate connection components shown and the aforementioned power lines and signal lines is as follows.

[0073] GND: 51E, 51F, 51G, 52E, 52F, 52G, 53F, 54F

[0074] Vin: 53E, 54E

[0075] Vcc: 53G, 54G

[0076] In addition, signals such as Isense1, Isense2, PWM1, and PWM2 are transmitted through inter-substrate connection components 51A-51D and 52A-52D.

[0077] Therefore, for the input terminals 21 and 23 of the inductor element 20, grounding wires and power lines are placed nearby, or the terminals are surrounded by grounding wires and power lines. The input terminals 21 and 23 of the inductor element 20, where voltage changes are large, are shielded by grounding wires and power lines. As a result, unwanted radiation from the inductor element 20 is effectively suppressed.

[0078] It should be noted that the inter-substrate connection members 51A-51D and 52A-52D, through which signals pass, preferably reduce the influence of the input and output currents of the inductor. Therefore, a shielding member such as a metal plate may be provided between the terminals 21-24 of the inductor element 20 and the inter-substrate connection members 51A-51D and 52A-52D. This shielding member is not limited to a metal plate and may also be a columnar conductor. In addition, the shielding member may also be connected to ground.

[0079] Figure 12 This is a diagram showing the arrangement of switching circuit components 11, 12 and inductor element 20. Figure 1 In the top-view perspective view showing the mounting surfaces of the lower substrate 30 and the upper substrate 40 orthogonal to each other, terminals 21-24 of the inductor element 20 overlap with switching circuit components 11 and 12. The inductor element 20 has four terminals: input-side terminals 21 and 23, and output-side terminals 22 and 24, symmetrically arranged with respect to the center point O of the inductor element 20. Switching circuit components 11 and 12 are arranged side-by-side with the input-side terminals and output-side terminals rotated 180 degrees relative to each other.

[0080] exist Figure 12In the example shown, the input terminal 21 of inductor element 20 is close to the output terminal SWout1 of switch circuit component 11, and the input terminal 23 of inductor element 20 is close to the output terminal SWout2 of switch circuit component 12. Therefore, the parasitic resistance in the connection path between switch circuit components 11, 12 and inductor element 20 is minimized.

[0081] In addition, Figure 12 In the example shown, the power input terminal Vin1 of the switching circuit component 11 and the power input terminal Vin2 of the switching circuit component 12 are close together. Therefore, the connection lines between these power input terminals Vin1 and Vin2 are shortened equally, suppressing the total parasitic resistance in the lines connected to the power input terminals Vin1 and Vin2. Furthermore, the smoothing capacitor Ci connected to these power input terminals Vin1 and Vin2 can be constructed from a single component. It should be noted that if the output terminals SWout1 and SWout2 of the switching circuit components 11 and 12 are arranged close together, the smoothing capacitors Co1 and Co2 can be constructed from a single component.

[0082] Second Implementation Method

[0083] In the second embodiment, a power circuit module with a characteristic structure at the terminals of the inductor is illustrated.

[0084] Figure 13 This is a perspective view of the inductor element 20 disposed in the power supply circuit module of the second embodiment. The inductor element 20 has input side terminals 21, 23 and output side terminals 22, 24.

[0085] Output side terminals 22 and 24 have connections formed on the upper substrate (in) Figure 1 The example shown shows a wide section where the electrodes on the lower surface of the upper substrate 40 are connected. Electrodes connecting to the output terminals 22 and 24 of the inductor element 20 are formed on the lower surface of the upper substrate. Therefore, the electrical and mechanical connections between the output terminals 22 and 24 of the inductor element 20 and the electrodes on the upper substrate side connected to the output terminals 22 and 24 are robust. Figure 13 In the example shown, wide portions are provided at output-side terminals 22 and 24, but wide portions can also be provided at input-side terminals 21 and 23. Alternatively, wide portions can be provided at all terminals 21 to 24.

[0086] Third Implementation Method

[0087] In the third embodiment, several other examples of inter-substrate connection members are shown. Figure 14 (A) Figure 14(B) is a front view of the main part of the power supply circuit module of the third embodiment.

[0088] exist Figure 14 In the example shown in (A), a plurality of inter-substrate connection members are formed between the lower substrate 30 and the upper substrate 40, but the chip components 55 in these inter-substrate connection members are connected in series between the electrodes formed on the upper surface of the lower substrate 30 and the electrodes formed on the lower surface of the upper substrate 40. The chip components 55 are, for example, chip capacitors, chip inductors, and chip resistors, constituting part of the circuit of the power supply circuit module.

[0089] exist Figure 14 In the example shown in (B), a plurality of inter-substrate connection members are formed between the lower substrate 30 and the upper substrate 40, but one of these inter-substrate connection members is composed of chip components 56A and 56B. Chip component 56A is mounted on the upper surface of the lower substrate 30, and chip component 56B is mounted on the lower surface of the upper substrate 40. In addition, chip components 56A and 56B are electrically and mechanically connected to each other. Chip components 56A and 56B are connected in parallel, and this parallel circuit is connected to the electrodes formed on the upper surface of the lower substrate 30 and the electrodes formed on the lower surface of the upper substrate 40. Chip components 56A and 56B are, for example, chip capacitors, chip inductors, and chip resistors, forming part of the circuit of the power supply circuit module.

[0090] As shown in this embodiment, the inter-substrate connection member is not limited to the terminal of the component, but may also be a passive component or part of a passive component that constitutes part of the power supply circuit.

[0091] Fourth Implementation Method

[0092] Figure 15 This is a perspective view of the power supply circuit module 104A according to the fourth embodiment. Figure 16 This is a perspective view of another power circuit module 104B according to the fourth embodiment. These power circuit modules 104A and 104B include a lower substrate 30, an upper substrate 40 parallel to the lower substrate 30, and a plurality of inter-substrate connecting members that electrically and mechanically connect the lower substrate 30 and the upper substrate 40.

[0093] The lower substrate 30 is composed of multiple substrates and has chip components and inductor components 20 mounted on it. Chip components and switching circuit components 11 and 12 are mounted on the upper substrate 40. The upper substrate 40 is covered with an upper substrate side resin layer 41.

[0094] exist Figure 15In the example shown, multiple inter-substrate connection members 52G, 54A to 54G are illustrated, which electrically and mechanically connect the lower substrate 30 and the upper substrate 40. Adjacent inter-substrate connection members are connected to each other via an insulating resin body 71. That is, the insulating resin body 71 is located between adjacent inter-substrate connection members. These resin bodies 71 are formed by coating. Other general structures are as shown in the first embodiment.

[0095] exist Figure 16 The diagram shows a plurality of inter-substrate connecting members 52G, 54A to 54D that electrically and mechanically connect the lower substrate 30 and the upper substrate 40. These inter-substrate connecting members are buried at a predetermined height position in an insulating resin body 72. That is, each inter-substrate connecting member penetrates the insulating resin body 72. Other general structures are as shown in the first embodiment.

[0096] By employing such a structure, the relative positions of the multiple inter-substrate connection members and the relative positions of the inter-substrate connection members and the terminals of the inductor element 20 can be fixed, thus ensuring reliable electrical insulation between them. For example, it is possible to prevent short circuits caused by contact between the multiple inter-substrate connection members or contact between the inter-substrate connection members and the terminals of the inductor element 20 due to relative positional misalignment during manufacturing.

[0097] Fifth Implementation Method

[0098] Figure 17 This is a perspective view of the power supply circuit module 105 according to the fifth embodiment. The power supply circuit module 105 includes a lower substrate 30, an upper substrate 40 parallel to the lower substrate 30, and a plurality of substrate connection members that electrically and mechanically connect the lower substrate 30 and the upper substrate 40.

[0099] exist Figure 17 In the example shown, multiple inter-substrate connecting members 52G, 54A to 54G are illustrated, which electrically and mechanically connect the lower substrate 30 and the upper substrate 40. The area of ​​the lower surface of these inter-substrate connecting members 52G, 54A to 54G is larger than the area of ​​the upper surface. By adopting such a structure, the center of gravity of the power circuit module 105 is lowered, thus suppressing tipping over due to vibration or other factors during manufacturing and improving productivity.

[0100] The Sixth Implementation Method

[0101] In the sixth embodiment, a power circuit module having a metal plate for protection and heat dissipation in the resin layer on the upper substrate side is exemplified.

[0102] Figure 18 This is a perspective view of the power supply circuit module 106 according to the sixth embodiment. Figure 19 yes Figure 18 The power circuit module 106 shown is shown in a front perspective view of its upper part.

[0103] The power circuit module 106 includes a lower substrate 30, an upper substrate 40 parallel to the lower substrate 30, and a plurality of inter-substrate connecting members 52A to 52G, 54G, etc., that electrically and mechanically connect the lower substrate 30 and the upper substrate 40.

[0104] The lower substrate 30 is composed of multiple substrates and has chip components and inductor elements 20 mounted on it.

[0105] like Figure 19 This indicates that multiple chip components and switching circuit components 11 and 12 are mounted on the upper substrate 40. Furthermore, an upper substrate-side resin layer 41 is coated on the upper surface of the upper substrate 40. A metal plate 43, exposed on its outer surface, is disposed on this upper substrate-side resin layer 41. This metal plate 43 is bonded to the switching circuit components 11 and 12 via a thermally conductive TIM (Thermal Interface Material). The metal plate 43 is, for example, a copper plate with low thermal resistance.

[0106] According to the power circuit module 106, since the metal plate 43 is disposed on the surface of the resin layer 41 on the upper substrate side, the stress applied to the mounting components (switching circuit components 11, 12, etc.) mounted on the upper substrate 40 by external force is suppressed.

[0107] In addition, since the metal plate 43 with low thermal resistance is disposed on the surface of the resin layer 41 on the upper substrate side, the heat dissipation of the switching circuit components 11 and 12, which are heat-generating components, is high, as are the heat dissipation of the heat-generating components and the heat dissipation of the upper substrate 40.

[0108] The Seventh Implementation Method

[0109] In the seventh embodiment, a power circuit module having a metal plate for protection and heat dissipation in the resin layer on the upper substrate side, similar to the sixth embodiment, is exemplified.

[0110] Figure 20 This is a perspective view of the power supply circuit module 107 according to the seventh embodiment. Figure 21 yes Figure 20 The power circuit module 107 shown is shown in a front perspective view of its upper part.

[0111] The power circuit module 107 includes a lower substrate 30, an upper substrate 40 parallel to the lower substrate 30, and a plurality of inter-substrate connecting members 52A to 52G, 54G, etc., that electrically and mechanically connect the lower substrate 30 and the upper substrate 40.

[0112] The lower substrate 30 is composed of multiple substrates and has chip components and inductor elements 20 mounted on it.

[0113] like Figure 21 This indicates that multiple chip components and switching circuit components 11 and 12 are mounted on the upper substrate 40. Furthermore, an upper substrate-side resin layer 41 is coated on the upper surface of the upper substrate 40. A metal plate 43, exposed on its outer surface, is disposed on this upper substrate-side resin layer 41. This metal plate 43 is bonded to the switching circuit components 11 and 12 via a thermally conductive TIM (Thermal Interface Material). The metal plate 43 is, for example, a copper plate with low thermal resistance.

[0114] and Figure 19 Unlike the example shown, the metal plate 43 has a tapered portion TP at its edge. The direction of this tapered portion is to prevent the metal plate 43 from protruding onto the outer surface of the upper substrate-side resin layer 41. Although the coefficients of thermal expansion (coefficients of linear expansion) of the metal plate 43 and the upper substrate-side resin layer 41 are different, the metal plate 43 engages with the upper substrate-side resin layer 41 at the tapered portion at its edge, thus preventing the metal plate 43 from floating or detaching from the upper substrate-side resin layer 41.

[0115] According to the power circuit module 107, it has high resistance to stress, which is generated by the difference in the coefficient of thermal expansion between the external force and the mounting components (switching circuit components 11, 12, etc.) mounted on the upper substrate 40.

[0116] In addition, since the switching circuit components 11 and 12, which are heat-generating components, have high heat dissipation, the heat dissipation of the heat-generating components and the heat dissipation of the upper substrate 40 are also high.

[0117] The Eighth Implementation Method

[0118] In the eighth embodiment, a power circuit module having a metal plate for protection and heat dissipation in the resin layer on the upper substrate side, similar to the sixth embodiment, is exemplified.

[0119] Figure 22 This is a perspective view of the power supply circuit module 108 according to the eighth embodiment. Figure 23 yes Figure 22 The power circuit module 108 shown is a front perspective view of its upper part.

[0120] The power circuit module 108 includes a lower substrate 30, an upper substrate 40 parallel to the lower substrate 30, and a plurality of inter-substrate connecting members 52A to 52G, 54G, etc., that electrically and mechanically connect the lower substrate 30 and the upper substrate 40.

[0121] The lower substrate 30 is composed of multiple substrates and has chip components and inductor elements 20 mounted on it.

[0122] like Figure 23 This indicates that multiple chip components and switching circuit components 11 and 12 are mounted on the upper substrate 40. Furthermore, an upper substrate-side resin layer 41 is coated on the upper surface of the upper substrate 40. A metal plate 43, exposed on its outer surface, is disposed on this upper substrate-side resin layer 41. This metal plate 43 is bonded to the switching circuit components 11 and 12 via a thermally conductive TIM (Thermal Interface Material). The metal plate 43 is, for example, a copper plate with low thermal resistance.

[0123] and Figure 19 The example shown is different; the exposed portion 43E, which is part of the edge of the metal plate 43, is exposed on the side of the resin layer 41 on the upper substrate side.

[0124] At the exposed portion 43E at the edge of the metal plate 43, the metal plate 43 engages with the upper substrate side resin layer 41, thereby suppressing the metal plate 43 from floating or detaching from the upper substrate side resin layer 41.

[0125] The aforementioned metal plate 43 is integrally formed over multiple power circuit modules. That is, before the multiple power circuit modules are separated, the metal plate 43 is a single unit. Furthermore, the multiple power circuit modules are separated into individual power circuit modules 108 by separating a portion of the metal plate 43. The exposed portion 43E at the edge of the metal plate 43 is the part exposed by separating the multiple power circuit modules into individual power circuit modules 108.

[0126] According to the power circuit module 108, it has high resistance to stress, which is generated by the difference in the coefficient of thermal expansion between the external force and the mounting components (switching circuit components 11, 12, etc.) mounted on the upper substrate 40.

[0127] In addition, the switching circuit components 11 and 12, which are heat-generating components, have high heat dissipation performance. Therefore, the heat dissipation performance of the heat-generating components and the upper substrate 40 are both high.

[0128] Ninth Implementation Method

[0129] In the ninth embodiment, a power circuit module with a characteristic connection structure between the drain of the switching element and the electrode of the lower substrate is illustrated.

[0130] Figure 24 This is a perspective view of the power supply circuit module 109 according to the ninth embodiment. The power supply circuit module 109 includes a lower substrate 30 and an upper substrate 40 parallel to the lower substrate 30.

[0131] Figure 25 From Figure 24 The diagram shown is a perspective view of the state in which the upper substrate 40 has been removed. The power circuit module 109 includes multiple substrate connection members 52A to 52E, 54A to 54C, etc., that electrically and mechanically connect the lower substrate 30 and the upper substrate 40.

[0132] Figure 26 From Figure 25 The view shown is a perspective view of the state in which the low-side source connection member 80 and the inter-substrate connection members 52A-52E and 54A-54C, which will be described later, have been removed. The lower substrate 30 is composed of a multilayer substrate and has chip components and inductor elements 20 mounted on it.

[0133] Figure 27 This is a circuit diagram of a power supply circuit formed in the power supply circuit module 109 of the ninth embodiment. This power supply circuit is a DC-DC converter comprising a switching circuit 10, an inductor element 20, and smoothing capacitors Co1, Co2, and Ci. In this example, the switching circuit 10 is a circuit obtained by configuring two buck converter circuits in parallel, and there are two pairs of switching circuits composed of half-bridge connected MOS-FETs. The inductor element 20 is connected between the mid-voltage of the half-bridge connection and the load (resistor RL).

[0134] The switching circuit 10 includes switching circuit components 11 and 12. Switching circuit component 11 includes a high-side switching element Q1, a low-side switching element Q2, and a drive circuit for driving them. Similarly, switching circuit component 12 includes a high-side switching element Q3, a low-side switching element Q4, and a drive circuit for driving them.

[0135] and Figure 1 Similarly, in the illustrated power circuit module 101, switching circuit components 11 and 12 and a chip component 42 are mounted on the upper surface of the upper substrate 40. Figure 24 In the diagram, region A11 is the mounting area for switch circuit component 11, and region A12 is the mounting area for switch circuit component 12.

[0136] An electrode connected to the drain of the low-side switching element Q2 of the switching circuit component 11 is formed in the low-side drain connection portion LD within region A11. Similarly, an electrode connected to the drain of the low-side switching element Q4 of the switching circuit component 12 is formed in the low-side drain connection portion LD within region A12. Furthermore, an electrode connected to the source of the low-side switching element Q2 of the switching circuit component 11 is formed in the low-side source connection portion LS within region A11. Similarly, an electrode connected to the source of the low-side switching element Q4 of the switching circuit component 12 is formed in the low-side source connection portion LS within region A12.

[0137] An electrode connected to the drain of the high-side switching element Q1 of the switching circuit component 11 is formed in the high-side drain connection HD within region A11. Similarly, an electrode connected to the drain of the high-side switching element Q3 of the switching circuit component 12 is formed in the high-side drain connection HD within region A12. Furthermore, an electrode connected to the source of the high-side switching element Q1 of the switching circuit component 11 is formed in the high-side source connection HS within region A11. Similarly, an electrode connected to the source of the high-side switching element Q3 of the switching circuit component 12 is formed in the high-side source connection HS within region A12.

[0138] The aforementioned low-side source connection LS, low-side drain connection LD, high-side source connection HS, and high-side drain connection HD correspond to respectively Figure 27 (LS, LD, HS, HI shown).

[0139] like Figure 24 , Figure 25 The low-side source connection member 80 has an abutment surface 80S that abuts against the back side of the upper substrate 40, a leg 80F extending from the abutment surface 80S towards the lower substrate 30, and a bent portion 80B between the abutment surface 80S and the leg 80F. The abutment surface 80S, the leg 80F, and the bent portion 80B are integral. The low-side source connection member 80 is a molded copper plate, and its thickness is greater than that of the conductor pattern formed on the lower substrate 30 and the upper substrate 40; therefore, its resistance value is lower than that of the conductor pattern.

[0140] like Figure 24 , Figure 25 This indicates that a portion of the low-side source connection member 80 is connected to the low-side source connection portion LS in region A11 and region A12 of the upper substrate 40.

[0141] like Figures 24-26 As indicated, the input-side terminal 21 of the inductor element 20 is connected to the low-side drain connection LD and the high-side source connection HS in region A11 of the upper substrate 40. Similarly, the input-side terminal 23 of the inductor element 20 is connected to the low-side drain connection LD and the high-side source connection HS in region A12 of the upper substrate 40.

[0142] The circuit structure of the power supply circuit module 109 in this embodiment is the same as that in the first embodiment. Figure 11 The circuit structure shown is the same. However, in this embodiment, the sources of switching elements Q2 and Q4 are connected to... Figure 24 The electrode connection of the low-side source connection portion LS of the upper substrate 40 shown is connected, and this low-side source connection member 80 is connected to the vicinity of the GND electrode. Therefore, the resistive component from the source of the switching elements Q2 and Q4 to the input / output terminal electrodes of GND is small.

[0143] Furthermore, in this embodiment, the source of switching element Q1 and the drain of switching element Q2 are connected to the input-side terminal 21 of inductor element 20 with the shortest possible distance. Therefore, the resistive component from the source of switching element Q1 and the drain of switching element Q2 to the input-side terminal 21 of inductor element 20 is small. Similarly, the source of switching element Q3 and the drain of switching element Q4 are connected to the input-side terminal 23 of inductor element 20 with the shortest possible distance. Therefore, the resistive component from the source of switching element Q3 and the drain of switching element Q4 to the input-side terminal 23 of inductor element 20 is small.

[0144] According to this embodiment, the switching elements Q1 to Q4 are connected to the low-side source connection member 80 with the shortest distance. Therefore, the resistance of the current path connected to the source of the switching elements Q1 to Q4 is small, which can suppress the power efficiency decrease caused by the resistance.

[0145] In the example shown above, the sources of the low-side switching elements Q2 and Q4 are connected to the low-side source connection member 80 with the shortest distance, but the same high-side drain connection member as the low-side source connection member 80 can also be provided. Figure 28 This is the circuit diagram of the power supply circuit module in this case. In this way, the drains of the high-side switching elements 01 and Q3 can be connected to the high-side drain connection member with the shortest distance.

[0146] Finally, the present invention is not limited to the embodiments described above. Modifications and alterations can be appropriately made by those skilled in the art. The scope of the present invention is defined by the claims, not the embodiments described above. Furthermore, within the scope of the present invention, modifications and alterations from the embodiments equivalent to those described in the claims are included.

[0147] For example, the connecting member between the substrates is not limited to a cylindrical shape, but can also be prismatic. Furthermore, the arrangement of the components relative to the lower substrate 30 and the upper substrate 40 is, of course, not limited to the embodiments described herein.

[0148] Explanation of reference numerals in the attached figures

[0149] Areas A11, A12…

[0150] Co1, Co2, Ci… smoothing capacitors;

[0151] HD…High-side drain connection;

[0152] HS…High-edge source junction;

[0153] L1, L2… coils;

[0154] L21, L22, L23, L24… Inductors;

[0155] L3, L4... Inductors;

[0156] LD…low-side drain connection;

[0157] LS…low-side source connection

[0158] Q1, Q2, Q3, Q4… switching elements;

[0159] SWout1, SWout2… output terminals;

[0160] TP…cone section;

[0161] Vin…Input voltage;

[0162] Vin1, Vin2... Power input terminals;

[0163] Vout…output voltage;

[0164] 10…Switching circuit;

[0165] 11, 12… Switching circuit components;

[0166] 20…Inductor components;

[0167] 21, 23… Input side terminals;

[0168] 22, 24… Output side terminals;

[0169] 30...lower base plate;

[0170] 31…Resin layer on the lower substrate side;

[0171] 32…chip components;

[0172] 40...upper base plate;

[0173] 41…Resin layer on the upper substrate side;

[0174] 42…chip components;

[0175] 43… metal plate;

[0176] 43E…exposed area;

[0177] 51A~51K… Inter-substrate connection components;

[0178] 52A~52G… Inter-substrate connection components;

[0179] 53A~53K… Inter-substrate connection components;

[0180] 54A~54G… Inter-substrate connection components;

[0181] 55, 56A, 56B… chip components;

[0182] 60… Radiator;

[0183] 70…Inter-substrate mold;

[0184] 71, 72… resin body;

[0185] 80…low-side source connection component;

[0186] 80S…butt joint surface;

[0187] 101, 101A, 101B, 101C, 101D, 104A, 104B, 105, 106, 107, 108, 109… power supply circuit modules.

Claims

1. A power supply circuit module, comprising a power supply circuit, The power supply circuit includes a lower substrate, an upper substrate parallel to the lower substrate, a lower substrate side component mounted on the lower substrate, an upper substrate side component mounted on the upper substrate, and a plurality of substrate connection components that electrically and mechanically connect the lower substrate and the upper substrate. A portion of the inter-substrate connection components is an inductor constituting part of the power supply circuit, or a portion of an inductor constituting part of the power supply circuit. The lower substrate side component includes a cuboid-shaped inductor element with terminals on its side, the terminals of which are part of the inter-substrate connection member. The terminals of the inductor element have a wide portion that connects to an electrode formed on the lower surface of the upper substrate.

2. The power supply circuit module according to claim 1, wherein, The power circuit module has an upper substrate side resin layer that is in contact with the upper substrate, seals the upper substrate side components, and has a flat upper surface.

3. The power supply circuit module according to claim 2, wherein, A metal plate is provided that is exposed on the outer surface of the resin layer on the upper substrate side. The edge of the metal plate is tapered to suppress protrusion toward the outer surface of the resin layer on the upper substrate side.

4. The power supply circuit module according to claim 2, wherein, A metal plate is provided that is exposed on the outer surface of the resin layer on the upper substrate side. The edge of the metal plate is exposed on the side of the resin layer on the upper substrate side.

5. The power supply circuit module according to any one of claims 1 to 4, wherein, The inter-substrate connecting members are connected to each other via an insulating resin body.

6. The power supply circuit module according to any one of claims 1 to 4, wherein, The inter-substrate connecting member has an upper surface and a lower surface, and the area of ​​the lower surface of the inter-substrate connecting member is larger than the area of ​​the upper surface of the inter-substrate connecting member.

7. The power supply circuit module according to claim 1, wherein, The inter-substrate connection member and the terminal, which are close to the terminal of the inductor element, are connected via an insulating resin body.

8. The power supply circuit module according to claim 1 or 7, wherein, The upper substrate side component includes a switching circuit component, which comprises a switching element and a driving circuit for the switching element to form a switching circuit. The lower substrate side component includes a smoothing capacitor. The power supply circuit is a DC-DC converter that includes the switching circuit, the inductor element, and the smoothing capacitor.

9. The power supply circuit module according to claim 8, wherein, The inter-substrate connection member among the plurality of inter-substrate connection members that is close to the terminal of the inductor element connected to the switching circuit component is connected to the ground of the switching circuit.

10. The power supply circuit module according to claim 8, wherein, The terminals of the inductor element overlap with the switching circuit component when viewed from above on the upper substrate and the lower substrate.

11. The power supply circuit module according to claim 8, wherein, The power circuit module has a heat sink that is in thermal contact with the switching circuit component.

12. The power supply circuit module according to claim 8, wherein, There are two of the aforementioned switching circuit components. The inductor element consists of two inductor elements respectively connected to the two switching circuit components. The two switching circuit components each include a high-side switching element, a low-side switching element, and the driving circuit for these switching elements.

13. The power supply circuit module according to claim 12, wherein, Two of the aforementioned switch circuit components are arranged side by side on the upper substrate, and an upper substrate side component other than the two switch circuit components is disposed between the two switch circuit components.

14. The power supply circuit module according to claim 12 or 13, wherein, The two switch circuit components are arranged side by side with their input-side terminals and output-side terminals rotated 180 degrees relative to each other.

15. The power supply circuit module according to claim 12 or 13, wherein, The two inductor elements are coupled inductors that include coils that are magnetically coupled to each other.

16. The power supply circuit module according to claim 15, wherein, The coupling inductor has four terminals with input and output terminals symmetrically arranged, and the two switching circuit components are arranged side by side with a 180-degree rotational position relative to each other.

17. The power supply circuit module according to claim 12 or 13, wherein, The power supply circuit module includes: A drain connection member made of a metal plate has an abutting surface that abuts against the back of the upper substrate, a leg extending from the abutting surface toward the lower substrate, and a curved portion located between the abutting surface and the leg. as well as A semiconductor switching element is mounted on the upper substrate. Electrodes connected to the semiconductor switching element are formed on the upper substrate. The contact surface is in contact with the electrode connected to the semiconductor switching element.

18. The power supply circuit module according to claim 1, wherein, The terminals of the inductor element also have narrow portions, which together with the wide portions form an L-shape.

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