An electronic component solder joint reliability simulation method and system

Abstract

The application discloses a kind of electronic component solder joint reliability simulation method and system, comprising: according to component size parameter and component packaging drawing to establish three-dimensional entity simulation model;Through material parameter test, obtain the material parameter of component required for simulation, carry out network division, boundary constraint application, load constraint application and solving calculation;Reliability test and PCB sample dynamic test are carried out;Matching is carried out to simulation response data extracted after simulation processing and measured response data, and simulation model is corrected according to matching result;Simulation solder joint life and test solder joint life are matched, and according to the matching result, the life prediction model is corrected, and the solidification life prediction method is formed.The application can comprehensively evaluate the solder joint reliability of electronic component by combining test and simulation, reduce the error caused by test and simulation in the application of rail transit electronic products, and improve the simulation technology in the design and reliability evaluation application of rail transit electronic products.

Description

Technical Field

[0001] This invention relates to the field of solder joint reliability analysis technology, and in particular to a method and system for simulating the reliability of solder joints in electronic components. Background Technology

[0002] Currently, solder joints are the main weak link in electronic components in electronic product applications. For solder joint reliability assessment, fatigue life testing is mainly used to evaluate the life level of solder joints. However, there are many process factors that affect solder joints, resulting in complex test designs with multiple factors and levels. This makes fatigue life testing time-consuming, costly, and the analysis factors incomplete, and cannot effectively and accurately assess the reliability of solder joints.

[0003] Finite element method (FEM) simulation, as an emerging analytical technique, is widely used in various fields such as mechanical manufacturing, aerospace, electronics, and railways. Currently, in China, FEM is mostly applied in academic research, with limited practical applications in electronic products. Quantitatively describing the applications of FEM in electronic products remains a major challenge for the electronics industry, as it suffers from significant errors. Summary of the Invention

[0004] This invention provides a method and system for simulating the reliability of solder joints in electronic components, in order to solve the aforementioned technical problems existing in the background art.

[0005] To achieve the above objectives, embodiments of the present invention provide a method for simulating the reliability of solder joints in electronic components, comprising:

[0006] The component size parameters are calibrated based on the PCB prototype, and a three-dimensional solid simulation model is established based on the component size parameters and component packaging drawings.

[0007] Material parameter tests were performed on each component of the PCB prototype to obtain the component material parameters;

[0008] The materials of each component in the three-dimensional solid simulation model are set according to the component material parameters. After the three-dimensional solid simulation model is divided into networks, boundary constraints are applied and loads are applied, the simulation results are obtained by solving the problem.

[0009] The PCB prototype was subjected to a reliability test. The stress and strain data of the solder joints were monitored by online sensors, and dynamic testing of the PCB prototype was carried out during the reliability test to obtain the measured response data of the PCB prototype.

[0010] The simulation response data of the PCB prototype is extracted from the simulation results, matched with the measured response data, and the three-dimensional solid simulation model is determined based on the first matching result.

[0011] After determining that the three-dimensional solid simulation model does not need to be modified based on the first matching result, the stress and strain data of the dangerous weld points are extracted from the simulation results and input into the preset life prediction model to obtain the life of the simulated weld points. The life of the simulated weld points is matched with the life of the test weld points, and the life prediction model is determined based on the second matching result.

[0012] When it is determined from the second matching result that the modified lifetime prediction model is not needed, the lifetime prediction model is used to predict the solder joint lifetime, and the lifetime prediction model is associated with and stored with the PCB template.

[0013] Optionally, the step of calibrating the component size parameters based on the PCB template and establishing a three-dimensional solid simulation model based on the component size parameters and component packaging drawings includes:

[0014] Obtain a PCB sample and perform preliminary testing on the PCB sample;

[0015] After preliminary testing confirmed that the solder joints were welded well, the dimensional parameters of each component were obtained; the components of the PCB prototype include the PCB substrate, solder joints, and components.

[0016] A three-dimensional solid simulation model is constructed based on the dimensional parameters and packaging drawings of the PCB substrate, the solder joints, and the components.

[0017] Optionally, the component material parameters include the Young's modulus of the PCB substrate, the Young's modulus of the solder, the viscoplasticity parameters of the solder, the coefficient of thermal expansion of the main component materials, and the physical parameters of other component materials.

[0018] The process of testing the material parameters of each component of the PCB prototype to obtain the component material parameters includes:

[0019] The Young's modulus of the PCB substrate was obtained by dynamic mechanical analysis equipment and three-point bending test method, and the Young's modulus of the solder was obtained by universal tensile testing equipment and tensile testing method.

[0020] Solder samples were prepared and tensile tests were performed on a tensile testing machine at different temperatures and strain rates. The stress-strain data obtained from the tensile tests were then nonlinearly fitted to obtain the viscoplastic parameters of the solder.

[0021] The coefficients of thermal expansion of the main component materials were obtained using a thermomechanical analyzer.

[0022] The physical parameters of other component materials are obtained by testing them according to national standards related to their physical parameters.

[0023] Optionally, the step of testing the material parameters of each component of the PCB sample to obtain the component material parameters includes:

[0024] Based on the obtained component material parameters, each component in the three-dimensional solid simulation model is matched and set with its corresponding material;

[0025] Set the mesh division method, and perform mesh division on the three-dimensional solid simulation model according to the mesh division method;

[0026] Boundary constraints and load constraints are set according to the PCB prototype test, and the boundary constraints and load constraints are applied to the three-dimensional solid simulation model;

[0027] A solution algorithm is set up, and the solution algorithm is used to solve the three-dimensional solid simulation model to obtain simulation results.

[0028] Optionally, the reliability test includes temperature cycling test and environmental stress screening test; the dynamic test of the PCB prototype includes displacement test and strain test.

[0029] Optionally, the step of extracting the simulation response data of the PCB prototype from the simulation results, matching it with the measured response data, and determining whether to correct the three-dimensional solid simulation model based on the first matching result includes:

[0030] The simulation response data extracted from the simulation results is matched with the measured response data, and a first matching result is obtained.

[0031] If the first matching result is that the simulation response data is outside the range of the measured response data, then the three-dimensional solid simulation model is corrected by the response surface optimization method.

[0032] If the first matching result is that the simulation response data is within the range of the measured response data, then it is determined that there is no need to modify the three-dimensional solid simulation model.

[0033] Optionally, the step of modifying the three-dimensional solid simulation model using response surface methodology includes:

[0034] Using the size and material parameters of key components as input parameters and the simulation response data of the PCB prototype as output parameters, optimization parameters are obtained through sensitivity analysis.

[0035] The optimized parameters are sampled using the experimental design method to obtain sampling points, and the output parameters corresponding to the sampling points are obtained by calling the original three-dimensional solid simulation model.

[0036] A response surface is constructed using the sampling points and the output parameters, and regression error analysis is performed on the response surface to obtain the goodness of fit of the response surface;

[0037] When the goodness of fit of the response surface is greater than a preset goodness of fit threshold, an objective function is constructed;

[0038] The objective function is iteratively calculated using a multi-objective genetic algorithm to obtain the optimal solution, and the optimal solution is substituted into the original three-dimensional solid simulation model to obtain the modified three-dimensional solid simulation model.

[0039] Optionally, the step of extracting stress-strain data of the critical weld points from the simulation results, inputting it into a preset life prediction model to obtain the simulated weld point life, matching it with the experimental weld point life, and determining whether to correct the life prediction model based on the second matching result includes:

[0040] The stress and strain data of the dangerous weld points are extracted from the simulation results, the stress and strain data are input into the life prediction model, and the simulated weld point life output by the model is obtained.

[0041] The stress and strain data of the weld joint obtained from the reliability test are input into the life prediction model, and the test weld joint life is obtained from the model output.

[0042] The simulated solder joint lifespan is matched with the experimental solder joint lifespan to obtain a second matching result;

[0043] If the second matching result is that the error value between the simulated solder joint life and the test solder joint life is less than or equal to a preset threshold, then it is determined that there is no need to correct the life prediction model.

[0044] If the second matching result is that the error value between the simulated solder joint life and the test solder joint life is greater than a preset threshold, then the life prediction model is corrected according to the error value.

[0045] Furthermore, embodiments of the present invention also provide an electronic component solder joint reliability simulation system, comprising:

[0046] The simulation model building module is used to calibrate the component size parameters based on the PCB template and to build a three-dimensional solid simulation model based on the component size parameters and component packaging drawings.

[0047] The material parameter acquisition module is used to test the material parameters of each component of the PCB sample and acquire the component material parameters.

[0048] The simulation test module is used to set the materials of each component in the three-dimensional solid simulation model according to the component material parameters, and to obtain the simulation results by solving the network, applying boundary constraints and loads to the three-dimensional solid simulation model.

[0049] The testing module is used to conduct reliability tests on the PCB prototype, monitor the stress and strain data of the solder joints through online sensors, and perform dynamic testing on the PCB prototype during the reliability test to obtain the measured response data of the PCB prototype.

[0050] The first matching and judgment module is used to extract the simulation response data of the PCB prototype from the simulation results, match it with the measured response data, and determine whether to correct the three-dimensional solid simulation model based on the first matching result.

[0051] The second matching judgment module is used to extract the stress and strain data of the dangerous weld points from the simulation results and input them into a preset life prediction model after determining that there is no need to modify the three-dimensional solid simulation model based on the first matching result. The simulated weld point life is then matched with the test weld point life, and the life prediction model is determined based on the second matching result.

[0052] The output module is used to predict the solder joint lifetime using the lifetime prediction model when it is determined from the second matching result that there is no need to modify the lifetime prediction model, and to associate and store the lifetime prediction model with the PCB template.

[0053] As described above, the electronic component solder joint reliability simulation method and system provided in this invention first establishes a three-dimensional solid simulation model based on the component size parameters and component packaging drawings in the PCB prototype; then, the material parameters of the components required for simulation are obtained through material parameter testing, and mesh generation, boundary constraint application, load constraint application, and solution calculation are performed; simultaneously, reliability tests and dynamic tests of the PCB prototype are conducted; next, the simulation response data extracted after simulation processing is matched with the measured response data, and the three-dimensional solid simulation model is corrected according to the first matching result; finally, the simulated solder joint lifetime is matched with the experimental solder joint lifetime, and the lifetime prediction model is corrected according to the second matching result, forming a curing lifetime prediction method. This invention comprehensively evaluates the solder joint reliability of electronic components by combining testing and simulation. Through four main aspects—component material parameter testing in the early stage of testing, effectiveness of pre-simulation processing including mesh quality checking and consistency of boundary load constraints with the test, correction of the three-dimensional solid simulation model, and correction of the lifetime prediction model—it reduces the errors caused by testing and simulation in the application of rail transit electronic products, thereby improving the accuracy of solder joint reliability assessment and enhancing the application of simulation technology in the design and reliability assessment of rail transit electronic products. Attached Figure Description

[0054] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0055] Figure 1This is a flowchart illustrating a method for simulating the reliability of solder joints of electronic components in one embodiment of the present invention.

[0056] Figure 2 This is a schematic diagram of the structure of an electronic component solder joint reliability simulation system according to an embodiment of the present invention. Detailed Implementation

[0057] To make the technical problems, technical solutions, and beneficial effects of this invention clearer, the invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.

[0058] like Figure 1 As shown, an embodiment of the present invention provides a method for simulating the reliability of solder joints of electronic components, which specifically includes the following steps:

[0059] Step S10: Establish a three-dimensional solid simulation model: Based on the PCB template, calibrate the component size parameters and establish a three-dimensional solid simulation model according to the component size parameters and component packaging drawings.

[0060] As a preferred option, taking a PCB sample in rail transit electronic products as an example, step S10 includes the following steps:

[0061] Step S101: Obtain a PCB sample and perform preliminary tests on the PCB sample; the preliminary tests include X-ray inspection, scanning electron microscopy inspection and metallographic section inspection, etc.

[0062] In step S101, the X-ray inspection first uses two-dimensional X-rays to inspect the overall appearance of the PCB sample and check whether the solder joints are connected; then it inspects a part of the PCB sample to check whether there are any abnormalities such as solder joint displacement or voids; finally, it determines whether to perform a tomographic scan based on the solder joint inspection results.

[0063] Scanning electron microscopy (SEM) inspection first involves encapsulating the PCB sample with adhesive. Then, the encapsulated PCB sample is successively ground, polished, etched, and rinsed. Finally, the solder joints are qualitatively and quantitatively analyzed using a scanning electron microscope.

[0064] Metallographic section inspection first involves sealing the PCB sample with adhesive, then taking sections from the sealed PCB sample; next, the sections are successively ground with sandpaper and micro-etched with liquid, and then the solder joints in the sections are inspected to check whether the solder joints are well welded.

[0065] Step S102: After confirming that the solder joints are welded well through preliminary testing, obtain the dimensional parameters of each component. The components of the PCB sample include the PCB substrate, solder joints, and components.

[0066] Step S103: Construct a three-dimensional solid simulation model based on the dimensional parameters of the PCB substrate, solder joints, and components, and the packaging drawings.

[0067] Understandably, during the construction of a 3D solid simulation model, some components in the PCB template can be simplified according to preset simplification rules. Optionally, the preset simplification rules are to remove detailed features such as sharp edges, chamfers, small bosses, and small grooves without affecting the accuracy of the finite element analysis.

[0068] It should be noted that the preset simplification rules can refer to the relevant standards of general rules for finite element mechanical analysis.

[0069] Understandably, this embodiment performs preliminary testing and dimensional parameter calibration for rail transit electronic products, and establishes a three-dimensional solid simulation model in conjunction with packaging drawings. The simulation model can accurately and effectively reflect the characteristics of rail transit electronic products.

[0070] Step S20: Conduct material parameter testing: Perform material parameter testing on each component of the PCB prototype to obtain the component material parameters.

[0071] In this embodiment, material parameter tests are performed on components such as the PCB substrate, solder joints, and components according to relevant national standards to obtain their material parameters. These component material parameters include the Young's modulus of the PCB substrate, the Young's modulus of the solder, the viscoplasticity parameters of the solder, the coefficient of thermal expansion of the main component materials, the physical parameters of other component materials, and general component material parameters. The physical parameters of other component materials include density and thermal conductivity; general component materials include silicon for chips and copper or copper alloys for component leads.

[0072] Preferably, step S20 includes the following steps:

[0073] Step S201, Young's modulus test: The Young's modulus of the PCB substrate is obtained by using dynamic mechanical analysis equipment and three-point bending test method, and the Young's modulus of the solder is obtained by using universal tensile testing equipment and tensile testing method.

[0074] Step S202, Solder viscoplasticity parameter test: Prepare solder samples, perform tensile tests on a tensile testing machine at different temperatures and strain rates, and obtain the viscoplasticity parameters of the solder by nonlinear fitting of the stress-strain data obtained from the tensile tests.

[0075] Step S203, thermal expansion coefficient test: The thermal expansion coefficient of the main component materials is obtained using a thermomechanical analyzer. Understandably, for anisotropic materials, it is necessary to test the thermal expansion coefficient in three directions.

[0076] Step S204, Physical parameter testing: Test other component materials according to national standards related to physical parameters to obtain the physical parameters of other component materials.

[0077] In this embodiment, the Young's modulus test, solder viscoplasticity parameter test, and coefficient of thermal expansion test are all based on national standards related to material parameter testing.

[0078] Furthermore, step S20 also includes: for some general component materials, the parameters of the general component materials can be calibrated based on the data provided by the material supplier.

[0079] It should be noted that steps S201 to S204 can be implemented in any order.

[0080] In this embodiment, before conducting PCB prototype testing, the material parameters of the obtained PCB prototype are tested to determine the material parameters of each component. This allows for accurate calibration of the material parameters of rail transit electronic products, which helps reduce the error rate of testing and simulation.

[0081] Step S30: Conduct finite element simulation test: Set the materials of each component in the three-dimensional solid simulation model according to the component material parameters, and after performing network division, boundary constraint application and load application on the three-dimensional solid simulation model, obtain the simulation results by solving the problem.

[0082] In this embodiment, firstly, based on the acquired component material parameters, the materials of each component in the 3D solid simulation model are matched and set. Secondly, the mesh generation method, boundary constraints, load constraints, solution algorithm, and other conditions are set. Finally, finite element simulation is performed on the 3D solid simulation model to obtain simulation results. The simulation results include overall displacement, equivalent stress, equivalent plastic strain, strain energy density, etc.; other conditions include the setting of relevant parameters such as large deformation, weak springs, and damping coefficients. It should be noted that other conditions are set according to requirements.

[0083] Furthermore, in this embodiment, when dividing the three-dimensional solid simulation model into meshes according to the set mesh division method, the divided meshes need to be quality checked to ensure good network quality. In addition, the boundary constraints of the three-dimensional solid simulation model need to be consistent with the PCB template constraint effect in the PCB template test (i.e., step S40), and the load constraints of the three-dimensional solid simulation model need to be consistent with the test conditions in the PCB template test.

[0084] Preferably, step S30 includes the following steps:

[0085] Step S301: Based on the obtained component material parameters, match and set the materials of each component in the three-dimensional solid simulation model with the corresponding materials.

[0086] In step S301, the component material parameters are obtained through step S20 or steps S201 to S204.

[0087] Step S302: Set the mesh generation method and perform mesh generation on the 3D solid simulation model according to the mesh generation method.

[0088] Step S303: Set boundary constraints and load constraints according to the PCB prototype test, and apply boundary constraints and load constraints to the three-dimensional solid simulation model.

[0089] In step S303, the boundary constraints applied to different PCB template tests vary. For example, for temperature cycling tests, a Z-direction displacement constraint is applied at the center node on the back of the PCB template; for random vibration tests, a fixed constraint is applied to the surfaces of the four holes on the edge of the PCB template.

[0090] For the applied load constraints, the load constraints can be load spectra. For example, when the load constraint is a temperature spectrum, the temperature spectrum is applied to the entire three-dimensional solid simulation model; when the load constraint is a vibration spectrum, the vibration spectrum is applied at the vibration boundary constraints.

[0091] Step S304: Set the solution algorithm and use the solution algorithm to solve the three-dimensional solid simulation model to obtain the simulation results.

[0092] Step S40, Simultaneously conduct PCB prototype testing: Conduct reliability testing on the PCB prototype, monitor the stress and strain data of the solder joints through online sensors, and perform dynamic testing on the PCB prototype during the reliability testing process to obtain the measured response data of the PCB prototype.

[0093] In this embodiment, reliability testing includes temperature cycling testing, environmental stress screening testing (e.g., random vibration testing), etc.; dynamic testing of PCB prototypes includes displacement, strain, and other response tests.

[0094] As a preferred approach, while conducting finite element simulation tests, reliability tests such as temperature cycling and environmental stress screening are carried out according to the performance testing methods and qualification requirements for surface mount solder joints. Furthermore, online sensors, such as online resistors, are used to monitor the stress and strain data of the solder joints in real time, and the test solder joint lifespan is obtained based on this data. During the reliability tests, dynamic response tests of the PCB prototype, including displacement and strain measurements, are also conducted to obtain measured response data for local areas of the PCB prototype.

[0095] Furthermore, the stress-strain data of the solder joints and the measured response data of the PCB prototype can be used as test results.

[0096] It should be noted that, in this embodiment, reliability tests can be conducted according to other standards related to reliability testing.

[0097] Step S50, PCB prototype response data matching: Extract the simulation response data of the PCB prototype from the simulation results, match it with the measured response data, and determine whether to correct the three-dimensional solid simulation model based on the first matching result.

[0098] In this embodiment, the first matching result is either the simulated response data is within the range of the measured response data or the simulated response data is outside the range of the measured response data.

[0099] Specifically, in the post-simulation processing, simulation response data of the same area of ​​the PCB prototype and the PCB prototype test are extracted from the simulation results. The simulation response data is then matched with the measured response data, i.e., it is determined whether the simulation response data is within the range of the measured response data. If the simulation response data is within the range of the measured response data, it is determined that there is no need to modify the three-dimensional solid simulation model, and the next step of predicting the solder joint life based on the three-dimensional solid simulation model can be performed. However, if the simulation response data is outside the range of the measured response data, it is determined that the three-dimensional solid simulation model should be modified, and the process returns to step S30. The simulation test is then performed again based on the modified three-dimensional solid simulation model until the simulation response data of the PCB prototype extracted from the simulation results is within the range of the measured response data. Then, the next step of predicting the solder joint life based on the three-dimensional solid simulation model is performed.

[0100] Preferably, step S50 includes the following steps:

[0101] Step S501 involves matching the simulation response data extracted from the simulation results with the measured response data to obtain the first matching result.

[0102] Step S502: If the first matching result indicates that the simulation response data is outside the range of the measured response data, then the three-dimensional solid simulation model is corrected using the response surface optimization method, and the process returns to step S30. Based on the corrected three-dimensional solid simulation model, the finite element simulation test is re-performed. Further, correcting the three-dimensional solid simulation model using the response surface optimization method includes the following steps:

[0103] Step S5021: Using the size and material parameters of key components as input parameters and the simulation response data of the PCB prototype as output parameters, obtain optimization parameters through sensitivity analysis;

[0104] Step S5022: Sample points are obtained by sampling the optimization parameters through the experimental design method, and the output parameters corresponding to the sample points are obtained by calling the three-dimensional solid simulation model to be corrected.

[0105] Step S5023: Construct a response surface using sampling points and output parameters, and perform regression error analysis on the response surface to obtain the goodness of fit of the response surface;

[0106] Step S5024: When the goodness of fit of the response surface is greater than the preset goodness of fit threshold, construct the objective function; wherein, the goodness of fit threshold is set according to the requirements.

[0107] Step S5025: The multi-objective genetic algorithm is used to iteratively calculate the constructed objective function to obtain the optimal solution, and the optimal solution is substituted into the three-dimensional solid simulation model to be corrected to obtain the corrected three-dimensional solid simulation model.

[0108] In this embodiment, sensitivity analysis is performed on the simulation response data extracted from the simulation results using the size and material parameters of key components to obtain optimized parameters. The optimal solution is then found through experimental design and optimization iteration experiments, and the optimal solution is used to correct the three-dimensional solid simulation model.

[0109] Step S503: If the first matching result is that the simulation response data is within the range of the measured response data, then it is determined that there is no need to correct the three-dimensional solid simulation model, and proceed to step S60.

[0110] In this embodiment, the three-dimensional solid simulation model is continuously corrected by comparing the simulated response data and the measured response data, so that the simulation results output by the three-dimensional solid simulation model match the experimental results better, thereby improving the accuracy of the simulation model.

[0111] Step S60, Solder joint life result matching: After determining that the three-dimensional solid simulation model does not need to be modified based on the first matching result, the stress and strain data of the dangerous solder joints are extracted from the simulation results and input into the preset life prediction model to obtain the simulated solder joint life. The simulated solder joint life is matched with the test solder joint life, and the life prediction model is determined based on the second matching result.

[0112] In this embodiment, the second matching result is that the error value between the simulated solder joint life and the test solder joint life is less than or equal to a preset threshold, or the error value between the simulated solder joint life and the test solder joint life is greater than a preset threshold.

[0113] Specifically, after determining the 3D solid simulation model that does not require correction based on the first matching result, the stress and strain data of the dangerous solder joints are extracted from the simulation results. The stress and strain data are input into the preset life prediction model, and the simulated solder joint life is obtained from the model output. Then, the stress and strain data of the solder joints obtained from the reliability test are input into the life prediction model, and the test solder joint life is obtained from the model output. Next, the simulated solder joint life and the test solder joint life are matched to obtain the second matching result. If the second matching result is that the error value between the simulated solder joint life and the test solder joint life is less than or equal to a preset threshold, then the life prediction model does not need to be corrected, and the process proceeds to step S70. However, if the second matching result is that the error value between the simulated solder joint life and the test solder joint life is greater than the preset threshold, then the relevant unknown parameters and empirically recommended values ​​of the life prediction model are fitted and corrected according to the error value, so that the corrected life prediction model matches the rail transit electronic product.

[0114] Preferably, the lifetime prediction model is either a strain-based lifetime prediction model or an energy-based lifetime prediction model. Optionally, the strain-based lifetime prediction model can be the Coffin-Manson model; the energy-based lifetime prediction model can be the Darveaux model.

[0115] Step S70, Model Storage: When it is determined that there is no need to modify the life prediction model based on the second matching result, the life prediction model is used to predict the solder joint life, and the life prediction model is associated with and stored with the PCB prototype.

[0116] In other words, after obtaining a life prediction model that does not require correction, the life prediction model can be used to predict the solder joint life of the same type of rail transit electronic products associated with the PCB prototype. By associating and storing the life prediction model and the PCB prototype, a solidified life prediction method for the same type of rail transit electronic products associated with the PCB prototype can be formed.

[0117] As described above, the electronic component solder joint reliability simulation method and system provided in this embodiment first establishes a three-dimensional solid simulation model based on the component size parameters and component packaging drawings in the PCB prototype; then, the material parameters of the components required for simulation are obtained through material parameter testing, and mesh generation, boundary constraint application, load constraint application, and solution calculation are performed; simultaneously, reliability tests and dynamic tests of the PCB prototype are conducted; next, the simulation response data extracted after simulation processing is matched with the measured response data, and the three-dimensional solid simulation model is corrected according to the first matching result; finally, the simulated solder joint lifetime is matched with the experimental solder joint lifetime, and the lifetime prediction model is corrected according to the second matching result, thereby forming a solidified lifetime prediction method. This embodiment comprehensively evaluates the solder joint reliability of electronic components by combining experiments and simulations. Through component material parameter testing in the early stage of the experiment, the effectiveness of the pre-simulation processing includes four main aspects: mesh quality detection, consistency between boundary load constraints and experiments, simulation model correction, and lifetime prediction model correction. This reduces the errors caused by experiments and simulations in the application of rail transit electronic products, thereby improving the accuracy of solder joint reliability assessment and enhancing the application of simulation technology in the design and reliability assessment of rail transit electronic products.

[0118] In addition, such as Figure 2 As shown, an embodiment of the present invention also provides a simulation system for the reliability of solder joints of electronic components, including a simulation model establishment module 110, a material parameter acquisition module 120, a simulation testing module 130, an experimental module 140, a first matching judgment module 150, a second matching judgment module 160, and an output module 170. Detailed descriptions of each functional module are as follows:

[0119] The simulation model building module 110 is used to calibrate the component size parameters based on the PCB template and to build a three-dimensional solid simulation model based on the component size parameters and component packaging drawings.

[0120] The material parameter acquisition module 120 is used to test the material parameters of each component of the PCB prototype and acquire the component material parameters.

[0121] The simulation test module 130 is used to set the materials of each component in the three-dimensional solid simulation model according to the component material parameters, and to obtain the simulation results by solving the network, applying boundary constraints and loads to the three-dimensional solid simulation model.

[0122] The test module 140 is used to conduct reliability tests on PCB prototypes. It monitors the stress and strain data of solder joints through online sensors and performs dynamic tests on PCB prototypes during the reliability test to obtain the measured response data of PCB prototypes.

[0123] The first matching and judgment module 150 is used to extract the simulation response data of the PCB prototype from the simulation results, match it with the measured response data, and determine whether to correct the three-dimensional solid simulation model based on the first matching result.

[0124] The second matching judgment module 160 is used to extract the stress and strain data of the dangerous weld points from the simulation results and input them into the preset life prediction model after determining that the three-dimensional solid simulation model does not need to be corrected based on the first matching result, to obtain the life of the simulated weld points, match it with the life of the test weld points, and determine whether to correct the life prediction model based on the second matching result.

[0125] The output module 170 is used to predict the solder joint lifetime using the lifetime prediction model when it is determined from the second matching result that no correction of the lifetime prediction model is required, and to associate and store the lifetime prediction model with the PCB template.

[0126] Furthermore, the simulation model building module 110 includes the following units, and the detailed description of each functional unit is as follows:

[0127] The preliminary testing unit is used to obtain PCB samples and perform preliminary tests on the PCB samples;

[0128] The dimension parameter calibration unit is used to obtain the dimension parameters of each component after confirming that the solder joints are well soldered through preliminary testing. The components of the PCB sample include the PCB substrate, solder joints, and components.

[0129] The simulation model building unit is used to construct a three-dimensional solid simulation model based on the dimensional parameters of the PCB substrate, solder joints, and components, as well as the packaging drawings.

[0130] Furthermore, the material parameter acquisition module 120 includes the following units, and the detailed description of each functional unit is as follows:

[0131] The Young's modulus testing unit is used to obtain the Young's modulus of the PCB substrate through dynamic mechanical analysis equipment and three-point bending test method, and to obtain the Young's modulus of the solder through universal tensile testing equipment and tensile testing method.

[0132] The viscoplasticity parameter testing unit is used to prepare solder samples, perform tensile tests on a tensile testing machine at different temperatures and strain rates, and obtain the viscoplasticity parameters of the solder by nonlinear fitting of the stress-strain data obtained from the tensile tests.

[0133] The thermal expansion coefficient testing unit is used to obtain the thermal expansion coefficient of the main component materials through a thermomechanical analyzer.

[0134] The physical parameter testing unit is used to test other component materials according to national standards related to physical parameters, and to obtain the physical parameters of other component materials.

[0135] Furthermore, the simulation test module 130 includes the following units, and the detailed description of each functional unit is as follows:

[0136] The material parameter setting unit is used to match and set the materials of each component in the three-dimensional solid simulation model with the corresponding materials based on the obtained component material parameters.

[0137] Mesh generation unit, used to set the mesh generation method and perform mesh generation on the 3D solid simulation model according to the mesh generation method;

[0138] The constraint application unit is used to set boundary constraints and load constraints according to the PCB prototype test, and to apply boundary constraints and load constraints to the three-dimensional solid simulation model;

[0139] The simulation solving unit is used to set the solving algorithm and use the solving algorithm to solve the 3D solid simulation model to obtain simulation results.

[0140] Furthermore, the first matching judgment module 150 includes the following units, and the detailed description of each functional unit is as follows:

[0141] The response data comparison unit is used to match the simulation response data extracted from the simulation results with the measured response data and obtain the first matching result.

[0142] The simulation model correction unit is used to correct the three-dimensional solid simulation model by means of response surface optimization if the first matching result is that the simulation response data is outside the range of the measured response data.

[0143] The simulation model output unit is used to determine that no correction is needed for the three-dimensional solid simulation model if the first matching result is that the simulation response data is within the range of the measured response data.

[0144] Furthermore, the simulation model correction unit includes the following units, and the detailed description of each functional unit is as follows:

[0145] The optimization parameter acquisition unit is used to obtain optimization parameters through sensitivity analysis by taking the size and material parameters of key components as input parameters and the simulation response data of the PCB prototype as output parameters.

[0146] The experimental design unit is used to sample the optimized parameters using the experimental design method to obtain sampling points, and to obtain the output parameters corresponding to the sampling points through the three-dimensional solid simulation model before correction.

[0147] The response surface construction unit is used to construct a response surface using sampling points and output parameters, and to perform regression error analysis on the response surface to obtain the goodness of fit of the response surface.

[0148] The objective function construction unit is used to construct the objective function when the goodness of fit of the response surface is greater than a preset goodness of fit threshold;

[0149] The simulation model optimization unit is used to iteratively calculate the objective function using a multi-objective genetic algorithm to obtain the optimal solution, and then substitute the optimal solution into the original 3D solid simulation model to obtain the corrected 3D solid simulation model.

[0150] Furthermore, the second matching judgment module 160 includes the following units, and the detailed description of each functional unit is as follows:

[0151] The simulated weld joint life prediction unit is used to extract stress and strain data of dangerous weld joints from simulation results, input the stress and strain data into the life prediction model, and obtain the simulated weld joint life output by the model.

[0152] The test solder joint life prediction unit is used to input the stress and strain data of the solder joint obtained from the reliability test into the life prediction model and obtain the test solder joint life output by the model.

[0153] The solder joint life comparison unit is used to match the simulated solder joint life with the experimental solder joint life to obtain a second matching result;

[0154] The lifetime prediction model correction unit is used to determine that no correction of the lifetime prediction model is needed if the error value between the simulated solder joint lifetime and the test solder joint lifetime is less than or equal to a preset threshold in the second matching result.

[0155] The lifetime prediction model output unit is used to correct the lifetime prediction model based on the error value if the error value between the simulated solder joint lifetime and the test solder joint lifetime is greater than a preset threshold in the second matching result.

[0156] The apparatus described above is used to implement the corresponding methods in the foregoing embodiments and has the beneficial effects of the corresponding method embodiments, which will not be repeated here.

[0157] Those skilled in the art should understand that the discussion of any of the above embodiments is merely exemplary and is not intended to imply that the scope of the invention (including the claims) is limited to these examples; within the framework of the invention, the technical features of the above embodiments or different embodiments can also be combined, the steps can be implemented in any order, and there are many other variations of different aspects of the embodiments of the invention as described above, which are not provided in detail for the sake of brevity.

[0158] The embodiments of this invention are intended to cover all such substitutions, modifications, and variations falling within the broad scope of the appended claims. Therefore, any omissions, modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the embodiments of this invention should be included within the protection scope of this invention.

Claims

1. A method for simulating the reliability of solder joints in electronic components, characterized in that, include: The component size parameters are calibrated based on the PCB prototype, and a three-dimensional solid simulation model is established based on the component size parameters and component packaging drawings. Material parameter tests were performed on each component of the PCB prototype to obtain the component material parameters; The materials of each component in the three-dimensional solid simulation model are set according to the component material parameters. After the three-dimensional solid simulation model is divided into networks, boundary constraints are applied and loads are applied, the simulation results are obtained by solving the problem. The PCB prototype was subjected to a reliability test. The stress and strain data of the solder joints were monitored by online sensors, and dynamic testing of the PCB prototype was carried out during the reliability test to obtain the measured response data of the PCB prototype. The simulation response data of the PCB prototype is extracted from the simulation results, matched with the measured response data, and the three-dimensional solid simulation model is determined based on the first matching result. After determining that the three-dimensional solid simulation model does not need to be modified based on the first matching result, the stress and strain data of the dangerous weld points are extracted from the simulation results and input into the preset life prediction model to obtain the life of the simulated weld points. The life of the simulated weld points is matched with the life of the test weld points, and the life prediction model is determined based on the second matching result. When it is determined from the second matching result that there is no need to modify the lifetime prediction model, the lifetime prediction model is used to predict the solder joint lifetime, and the lifetime prediction model is associated with and stored with the PCB template.

2. The electronic component solder joint reliability simulation method according to claim 1, characterized in that, The The component size parameters are calibrated based on the PCB prototype, and a 3D solid simulation model is built based on the component size parameters and component packaging drawings, including: Obtain a PCB sample and perform preliminary testing on the PCB sample; After confirming that the solder joints are welded well through preliminary testing, the dimensional parameters of each component are obtained. The components of the PCB sample include a PCB substrate, solder joints, and components. A three-dimensional solid simulation model is constructed based on the dimensional parameters and packaging drawings of the PCB substrate, the solder joints, and the components.

3. The electronic component solder joint reliability simulation method according to claim 2, characterized in that, The component material parameters include the Young's modulus of the PCB substrate, the Young's modulus of the solder, the viscoplasticity parameters of the solder, the coefficient of thermal expansion of the main component materials, and the physical parameters of other component materials. The process of testing the material parameters of each component of the PCB prototype to obtain the component material parameters includes: The Young's modulus of the PCB substrate was obtained by dynamic mechanical analysis equipment and three-point bending test method, and the Young's modulus of the solder was obtained by universal tensile testing equipment and tensile testing method. Solder samples were prepared and tensile tests were performed on a tensile testing machine at different temperatures and strain rates. The stress-strain data obtained from the tensile tests were then nonlinearly fitted to obtain the viscoplastic parameters of the solder. The coefficients of thermal expansion of the main component materials were obtained using a thermomechanical analyzer. The physical parameters of other component materials are obtained by testing them according to national standards related to their physical parameters.

4. The electronic component solder joint reliability simulation method according to claim 1, characterized in that, The process of testing the material parameters of each component of the PCB prototype to obtain the component material parameters includes: Based on the obtained component material parameters, each component in the three-dimensional solid simulation model is matched and set with its corresponding material; Set the mesh division method, and perform mesh division on the three-dimensional solid simulation model according to the mesh division method; Boundary constraints and load constraints are set according to the PCB prototype test, and the boundary constraints and load constraints are applied to the three-dimensional solid simulation model; A solution algorithm is set up, and the solution algorithm is used to solve the three-dimensional solid simulation model to obtain simulation results.

5. The electronic component solder joint reliability simulation method according to claim 1, characterized in that, The reliability tests include temperature cycling tests and environmental stress screening tests; the dynamic tests of the PCB prototypes include displacement tests and strain tests.

6. The electronic component solder joint reliability simulation method according to claim 1, characterized in that, The step of extracting the simulation response data of the PCB prototype from the simulation results, matching it with the measured response data, and determining whether to correct the three-dimensional solid simulation model based on the first matching result includes: The simulation response data extracted from the simulation results is matched with the measured response data, and a first matching result is obtained; If the first matching result is that the simulation response data is outside the range of the measured response data, then the three-dimensional solid simulation model is corrected by the response surface optimization method. If the first matching result is that the simulation response data is within the range of the measured response data, then it is determined that there is no need to modify the three-dimensional solid simulation model.

7. The electronic component solder joint reliability simulation method according to claim 6, characterized in that, The modification of the three-dimensional solid simulation model using response surface methodology includes: Using the size and material parameters of key components as input parameters and the simulation response data of the PCB prototype as output parameters, optimization parameters are obtained through sensitivity analysis. The optimization parameters are sampled using the experimental design method to obtain sampling points, and the output parameters corresponding to the sampling points are obtained using the three-dimensional solid simulation model before correction. A response surface is constructed using the sampling points and the output parameters, and regression error analysis is performed on the response surface to obtain the goodness of fit of the response surface; When the goodness of fit of the response surface is greater than a preset goodness of fit threshold, an objective function is constructed; The objective function is iteratively calculated using a multi-objective genetic algorithm to obtain the optimal solution, and the optimal solution is substituted into the original three-dimensional solid simulation model to obtain the modified three-dimensional solid simulation model.

8. The method for simulating the reliability of solder joints of electronic components according to claim 1, characterized in that, The step of extracting stress and strain data of dangerous weld points from the simulation results, inputting them into a preset life prediction model to obtain the simulated weld point life, matching it with the experimental weld point life, and determining whether to correct the life prediction model based on the second matching result includes: The stress and strain data of the dangerous weld points are extracted from the simulation results, the stress and strain data are input into the life prediction model, and the simulated weld point life output by the model is obtained. The stress and strain data of the solder joint obtained from the reliability test are input into the life prediction model, and the test solder joint life is obtained from the model output. The simulated solder joint lifespan is matched with the experimental solder joint lifespan to obtain a second matching result; If the second matching result is that the error value between the simulated solder joint life and the test solder joint life is less than or equal to a preset threshold, then it is determined that there is no need to correct the life prediction model. If the second matching result is that the error value between the simulated solder joint life and the test solder joint life is greater than a preset threshold, then the life prediction model is corrected according to the error value.

9. A simulation system for the reliability of solder joints of electronic components, characterized in that, include: The simulation model building module is used to calibrate the component size parameters based on the PCB template and to build a three-dimensional solid simulation model based on the component size parameters and component packaging drawings. The material parameter acquisition module is used to test the material parameters of each component of the PCB sample and acquire the component material parameters. The simulation test module is used to set the materials of each component in the three-dimensional solid simulation model according to the component material parameters, and to obtain the simulation results by solving the network, applying boundary constraints and loads to the three-dimensional solid simulation model. The testing module is used to conduct reliability tests on the PCB prototype, monitor the stress and strain data of the solder joints through online sensors, and perform dynamic testing on the PCB prototype during the reliability test to obtain the measured response data of the PCB prototype. The first matching and judgment module is used to extract the simulation response data of the PCB prototype from the simulation results, match it with the measured response data, and determine whether to correct the three-dimensional solid simulation model based on the first matching result. The second matching judgment module is used to extract the stress and strain data of the dangerous weld points from the simulation results and input them into a preset life prediction model after determining that there is no need to modify the three-dimensional solid simulation model based on the first matching result. The simulated weld point life is then matched with the test weld point life, and the life prediction model is determined based on the second matching result. The output module is used to predict the solder joint lifetime using the lifetime prediction model when it is determined from the second matching result that there is no need to modify the lifetime prediction model, and to associate and store the lifetime prediction model with the PCB template.

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