Quartz resonant beam chip patch parallelism measuring device and measuring method

Abstract

The application discloses a quartz resonant beam chip patch parallelism measuring device, which comprises a carrier table, a detection head fixing support and a displacement detection device; the carrier table is arranged on the detection head fixing support; the TO component is fixed; the laser spot of the displacement detection device is always on the annular sealing surface of the TO component during one rotation of the carrier table; and the laser spot of the displacement detection device is always on the quartz resonant beam chip during one rotation of the carrier table; the detection head fixing support is used for fixing the displacement detection device; the displacement detection device is arranged above the carrier table and on the detection head fixing support, and does not contact the TO component on the carrier table. The application further provides a quartz resonant beam chip patch parallelism measuring method. The quartz resonant beam chip patch parallelism is measured in a non-contact mode, so that the quartz resonant beam chip is not damaged, and the quartz resonant beam chip patch parallelism is not affected.

Description

TECHNICAL FIELD

[0001] The application relates to a measuring device, in particular to a quartz resonant beam chip patch parallelism measuring device and a measuring method. BACKGROUND

[0002] The quartz resonant beam accelerometer is a sensor for converting measured acceleration into inherent frequency variation of the quartz resonant beam by using the resonant measurement principle, and has the advantages of large range, high precision, small size, low power consumption, frequency digital pulse output, etc., and can be widely used in fields such as tactical missile attitude control, inertial navigation and earth resource exploration, and has important military and civil values. At present, in order to reduce common mode noise and eliminate coupling errors in the non-sensitive axis direction, the quartz resonant beam accelerometer generally adopts a differential structure. The differential structure is to use two pieces of quartz resonant beam chips processed by MEMS technology, and the two pieces of quartz resonant beam chips are pasted and packaged through a differential layout. For example, the US patent US5962786A entitled Single chip acceleration sensor. If the two pieces of quartz resonant beam chips in the differential structure layout are not parallel during the pasting and packaging process, the common mode noise and the coupling error in the non-sensitive axis direction cannot be greatly reduced. In addition, after the existing quartz resonant beam chip is pasted, the structure glue is first solidified, and then the three coordinates are used to respectively mark the ring-shaped sealing surface of the TO component and the upper surface of the quartz resonant beam chip to determine the planes, and then the parallelism of the two planes is calculated. Since the quartz resonant beam chip is pasted with the TO base by using structural glue with small viscosity, the existing contact measurement scheme is used before the glue is solidified. During the measurement process, not only the parallelism of the pasted chip is damaged, but also the surface of the quartz resonant beam chip may be damaged by contact measurement. SUMMARY

[0003] The application aims to provide a quartz resonant beam chip patch parallelism measuring device and a measuring method, which measures the quartz resonant beam chip patch parallelism in a non-contact manner, avoids the damage to the surface of the quartz resonant beam chip caused by contact measurement, and does not damage the parallelism of the pasted quartz resonant beam chip.

[0004] The technical scheme adopted by the application is as follows:

[0005] A quartz resonant beam chip patch parallelism measuring device comprises a stage, a detection head fixing support and a displacement detection device.

[0006] The object table is arranged on the detection head fixing support; the TO component is fixed; when the plane of the annular sealing surface of the TO component is measured, the laser spot of the displacement detection device always hits the annular sealing surface of the TO component during one rotation of the object table; when the plane of the upper surface of the quartz resonant beam chip is measured, the laser spot of the displacement detection device always hits the quartz resonant beam chip during one rotation of the object table.

[0007] The detection head fixing support is used for fixing the displacement detection device and adjusting the horizontal and vertical positions of the precision displacement probe of the displacement detection device.

[0008] The displacement detection device is arranged above the object table and on the detection head fixing support, does not contact the TO component on the object table, is used for measuring the displacement data of the plane of the annular sealing surface of the TO component and the plane of the upper surface of the quartz resonant beam chip, and calculating the parallelism error.

[0009] According to the above scheme, the object table comprises a precision turntable, a four-dimensional adjustment mechanism, a TO component fixing part, an upper computer, and a turntable controller; the precision turntable is arranged on the bottom plate of the detection head fixing support; the four-dimensional adjustment mechanism is arranged above the precision turntable and can be adjusted in two horizontal directions and tilted around two horizontal direction axes; the TO component fixing part is arranged on the four-dimensional adjustment mechanism and is used for fixing the TO component; the upper computer controls the work of the turntable controller, and then the turntable controller controls the work of the built-in driving motor of the precision turntable, so as to control the rotation of the precision turntable, and the four-dimensional adjustment mechanism and the TO component fixing part rotate together with the precision turntable.

[0010] According to the above scheme, the TO component fixing part comprises a vacuum chuck; the vacuum chuck comprises a chuck body and circumferential and radial vacuum suction grooves arranged on the chuck body, and the central hole of the chuck body is connected with a vacuum pipeline; the TO component is arranged on the chuck body and is fixed on the vacuum chuck through the circumferential and radial vacuum suction grooves.

[0011] According to the above scheme, the four-dimensional adjustment mechanism comprises two horizontal direction line displacement adjustment handles and two tilt adjustment handles around two horizontal direction axes.

[0012] According to the above scheme, the detection head fixing support comprises a bottom plate, a support rod, a support plate, a two-dimensional adjustment platform, an adapter plate, and a detection head clamping seat; the support rod is fixed on the bottom plate, the support plate is arranged on the support rod, and the two-dimensional adjustment platform is arranged on the support plate; the detection head clamping seat is fixed on the two-dimensional adjustment platform through the adapter plate.

[0013] According to the scheme, the two-dimensional adjustment platform comprises a horizontal direction adjusting screw rod and a vertical direction adjusting screw rod; the vertical direction adjusting screw rod of the two-dimensional adjustment platform adjusts the reference distance of the precision displacement probe of the displacement detection device; and the upper surface of the quartz resonant beam chip of the TO component is located in the measurement area of the precision displacement probe.

[0014] According to the scheme, the two-dimensional adjustment platform is connected with the support plate through an L-shaped fixing seat.

[0015] According to the scheme, the support rod is fixed on the bottom plate through a support rod base.

[0016] According to the scheme, the displacement detection device comprises a precision displacement probe and a displacement measurement controller; the precision displacement probe is arranged on the detection head clamping seat of the detection head fixing support; the precision displacement probe transmits the collected displacement data of the TO component to the displacement measurement controller; and the displacement measurement controller transmits the received data to the host computer of the object table.

[0017] In the present application, the driving motor (matching with a circular grating) in the precision turntable is connected with the suspension main shaft, and the precision turntable can be stably rotated with high precision through the suspension main shaft, so that the precision turntable is rotated with high precision, without friction and wear.

[0018] The displacement measurement mode of the precision displacement probe of the displacement detection device is non-contact, which can be a laser coaxial displacement sensor, a CMOS laser displacement sensor or a CCD laser displacement sensor or other non-contact precision displacement detectors.

[0019] The present application also provides a quartz resonant beam chip patch parallelism measurement method, which adopts the quartz resonant beam chip patch parallelism measurement device; and mainly comprises the following steps:

[0020] (1) placing the TO component after the quartz resonant beam chip patch on the object table and fixing it through a vacuum chuck;

[0021] (2) adjusting the horizontal and vertical linear displacement degrees of freedom of the two-dimensional adjustment platform and the linear displacement degrees of freedom of the two horizontal planes of the four-dimensional adjustment mechanism, so that the annular sealing surface of the TO component is located in the measurement area of the precision displacement probe during one rotation of the precision turntable (when measuring the plane of the annular sealing surface of the TO component, the laser spot of the displacement detection device always hits the annular sealing surface of the TO component during one rotation of the object table);

[0022] (3) rotating the precision turntable for one circle, measuring the multi-point displacement (at least 3 points) of the annular sealing surface of the TO component by the precision displacement probe, and determining the annular sealing surface of the TO component; and adjusting the two inclination degrees of freedom of the four-dimensional adjustment mechanism, so that the annular sealing surface of the TO component is in a horizontal state;

[0023] (4) Adjusting the horizontal linear displacement degree of freedom of the two-dimensional adjustment platform, so that the upper surface of the quartz resonator beam chip on the TO component is in the measurement area of the precision displacement probe during one rotation of the precision turntable (when measuring the plane in which the upper surface of the quartz resonator beam chip is located, the laser spot of the displacement detection device is always on the quartz resonator beam chip during one rotation of the object table);

[0024] (5) Rotating the precision turntable for one revolution, and measuring the displacement of the upper surface of the quartz resonator beam chip on the TO component at multiple points (at least 3 points) by the precision displacement probe, to determine the upper surface of the quartz resonator beam chip;

[0025] (6) Determining the plane in which the annular sealing surface of the TO component is located, and defining it as the reference plane, and determining the plane in which the upper surface of the quartz resonator beam chip is located, and defining the plane boundary with the maximum outer diameter of the quartz resonator beam chip, defining the chip plane, and calculating the parallelism of the quartz resonator beam chip relative to the annular sealing surface of the TO base through the reference plane and the chip plane.

[0026] The beneficial effects of the present application are:

[0027] The two-dimensional adjustment platform has two linear displacement degrees of freedom, which are used for adjusting the displacement in the horizontal and vertical directions, respectively.

[0028] The displacement measurement method of the precision displacement probe of the displacement detection device is non-contact, and there is no contact between the measured part (TO component) and the displacement probe during measurement, which avoids contact measurement damage to the surface of the quartz resonator beam chip (avoids scratching or damaging the quartz resonator beam chip). Moreover, since it is a non-contact measurement, it can be used for online detection during the quartz resonator beam chip patching process, which facilitates real-time adjustment of the parallelism error of the patch, and there is no need to worry about the influence of contact measurement on the patching process itself. The parallelism measurement device has high measurement efficiency and is suitable for process detection and measurement in mass production process. Moreover, it will not damage the parallelism of the quartz resonator beam chip patch, and ensure the accuracy of the results. BRIEF DESCRIPTION OF DRAWINGS

[0029] The present application will be further described below in conjunction with the drawings and examples. In the drawings:

[0030] Figure 1 is a schematic diagram of the overall structure of the quartz resonator beam chip patch parallelism measurement device;

[0031] Figure 2 is a schematic diagram of the structure of the quartz resonator beam chip patch parallelism measurement device (without turntable controller, displacement measurement controller, and upper computer);

[0032] Figure 3 is a schematic diagram of the connection structure of the vacuum chuck and the TO component;

[0033] Figure 4 is a schematic diagram of parallelism calculation;

[0034] In the figure: 1 - stage, 1.1 - precision turntable, 1.2 - four-dimensional adjustment mechanism, 1.2.1 - linear displacement adjustment handle, 1.2.2 - tilt adjustment handle, 1.3 - vacuum chuck, 1.3.1 - circumferential vacuum suction groove, 1.3.2 - radial vacuum suction groove, 1.4 - turntable controller, 1.5 - upper computer, 2 - detection head fixed support, 2.1 - bottom plate, 2.2 - support rod base, 2.3 - support rod, 2.4 - support plate, 2.5 - L-shaped fixed seat, 2.6 - two-dimensional adjustment platform, 2.6.1 - horizontal direction adjusting screw, 2.6.2 - vertical direction adjusting screw, 2.7 - adapter plate, 2.8 - probe head clamping seat, 3 - displacement detection device, 3.1 - displacement measurement controller, 3.2 - precision displacement probe; 4 - TO component, 4.1 - TO component annular sealing surface, 4.2 - upper surface of quartz resonant beam chip; 5.1 - reference plane, 5.2 - chip plane, 5.3 and 5.4 - parallel planes. DETAILED DESCRIPTION

[0035] In order to make the purpose, technical scheme and advantages of the present application more clear, the present application is further described in detail below in combination with the drawings and examples. It should be understood that the specific examples described herein are only used to explain the present application and do not limit the present application.

[0036] Reference Figures 1-3 A quartz resonant beam chip patch parallelism measurement device, comprising a stage 1, a detection head fixed support 2 and a displacement detection device 3.

[0037] The object table 1 comprises a precision turntable 1.1, a four-dimensional adjustment mechanism 1.2, a vacuum chuck 1.3, an upper computer 1.5, and a turntable controller 1.4. The precision turntable 1.1 is arranged on the bottom plate 2.1 of the detection head fixing support 2, and the built-in drive motor (matching a circular grating) of the precision turntable 1.1 is connected with the suspended main shaft. The four-dimensional adjustment mechanism 1.2 is arranged above the precision turntable 1.1, and comprises two horizontal linear displacement adjustment handles 1.2.1 and two tilt adjustment handles 1.2.2 arranged around two horizontal axes, so as to adjust the displacement in two horizontal directions and the tilt around the two horizontal axes, respectively. The vacuum chuck 1.3 is arranged on the four-dimensional adjustment mechanism 1.2, and is used for fixing the TO component 4, and comprises a chuck body and a circumferential vacuum suction groove 1.3.1 and a radial vacuum suction groove 1.3.2 arranged on the chuck body. The central hole of the chuck body is connected with a vacuum pipeline. The TO component 4 is arranged on the chuck body, and is fixed on the vacuum chuck through the circumferential vacuum suction groove 1.3.1 and the radial vacuum suction groove 1.3.2. The upper computer 1.5 controls the work of the turntable controller 1.4, and then the turntable controller 1.4 controls the work of the built-in drive motor of the precision turntable 1.1, so as to control the rotation of the precision turntable 1.1. The four-dimensional adjustment mechanism 1.2 and the vacuum chuck 1.3 rotate together with the precision turntable 1.1.

[0038] The detection head fixing support 2 comprises a bottom plate 2.1, a support rod 2.3, a support plate 2.4, a two-dimensional adjustment platform 2.6, an adapter plate 2.7, and a probe head clamping seat 2.8. The support rod 2.3 is fixed on the bottom plate 2.1 through a support rod base 2.2. The support plate 2.4 is arranged on the support rod 2.3. The two-dimensional adjustment platform 2.6 is fixed on the support plate 2.4 through an L-shaped fixing seat 2.5. The probe head clamping seat 2.8 is fixed on the two-dimensional adjustment platform 2.6 through the adapter plate 2.7. The two-dimensional adjustment platform 2.6 comprises a horizontal direction adjustment screw 2.6.1 and a vertical direction adjustment screw 2.6.2. The vertical direction adjustment screw 2.6.2 adjusts the reference distance of the precision displacement probe 3.2 of the displacement detection device 3. The horizontal direction adjustment screw 2.6.1 adjusts the horizontal position of the precision displacement probe 3.2 of the displacement detection device 3.

[0039] The displacement detection device 3 comprises a precision displacement probe 3.2 and a displacement measurement controller 3.1. The precision displacement probe 3.2 is arranged above the TO component 4, and is arranged on the probe head clamping seat 2.8 without contacting the TO component 4. The precision displacement probe 3.2 transmits the collected displacement data (the plane where the annular sealing surface 4.1 of the TO component is located, and the plane where the upper surface 4.2 of the quartz resonant beam chip is located) of the TO component 4 to the displacement measurement controller 3.1. The displacement measurement controller 3.1 transmits the received data to the upper computer 1.5 of the object table 1. The upper computer 1.5 calculates the parallelism error.

[0040] In the application, the object table 1 is used to fix the TO component 4, and when measuring the plane where the annular sealing surface 4.1 of the TO component is located, the laser spot of the precision displacement probe 3.2 is always on the annular sealing surface 4.1 of the TO component during the rotation of the object table 1 (that is, the annular sealing surface 4.1 of the TO component is in the measurement area of the precision displacement probe 3.2); and when measuring the plane where the upper surface 4.2 of the quartz resonant beam chip is located, the laser spot of the precision displacement probe 3.2 is always on the quartz resonant beam chip during the rotation of the object table 1 (that is, the upper surface 4.2 of the quartz resonant beam chip on the TO component 4 is in the measurement area of the precision displacement probe 3.2). The detection head fixing support 2 is used to fix the displacement detection device 3 and adjust the horizontal and vertical positions of the precision displacement probe 3.2 of the displacement detection device 3.

[0041] The precision displacement probe 3.2 can be a non-contact precision displacement detector such as a laser coaxial displacement sensor, a CMOS laser displacement sensor or a CCD laser displacement sensor.

[0042] The precision turntable 1.1 is fixed on the bottom plate 2.1 by screws. The bottom plate 2.1, the support rod 2.3, the support plate 2.4, the L-shaped fixing seat 2.5, the two-dimensional adjustment platform 2.6, the adapter plate 2.7 and the detection head clamping seat 2.8 of the detection head fixing support 2 are connected by screws.

[0043] Referring to Figure 4 A quartz resonant beam chip patch parallelism measurement method, which adopts the quartz resonant beam chip patch parallelism measurement device described above; mainly includes the following steps:

[0044] First step: TO component fixation:

[0045] The vacuum chuck 1.3 is made of aluminum alloy material, and the surface roughness of the upper surface is better than Ra0.04, and the flatness is better than 0.005mm;

[0046] The TO component 4 (TO component after the quartz resonant beam chip patch) is placed in the center of the vacuum chuck 1.3, and the vacuum system is started, and the TO component 4 is adsorbed and fixed through the axial vacuum suction groove 1.3.1 and the radial vacuum suction groove 1.3.2;

[0047] Second step: TO component 4 measurement alignment

[0048] The precision displacement probe 3.2 adopts a laser coaxial displacement meter, and the precision is better than 0.2μm, the measurement range is greater than 3mm, and the reference distance is greater than 20mm;

[0049] Adjust the horizontal position of the precision displacement probe 3.2 by the horizontal adjustment screw 2.6.1 of the two-dimensional adjustment platform 2.6, so that the laser spot is indicated on the TO component annular sealing surface 4.1; then adjust the reference distance of the precision displacement probe 3.2 to the TO component annular sealing surface 4.1 by the vertical adjustment screw 2.6.2, to meet the reference distance requirement in the vertical direction;

[0050] Third step: displacement measurement

[0051] The precision turntable 1.1 adopts a high-precision air floatation turntable, whose end face runout is less than 0.1 μm, and the positioning accuracy is better than 20"; the horizontal adjustment range of the four-dimensional adjustment mechanism 1.2 is greater than 5 mm, and the horizontal adjustment accuracy is better than 10 μm; the tilt adjustment range is greater than 1°, and the tilt adjustment accuracy is better than 20";

[0052] Turn on the precision turntable 1.1, drive the vacuum chuck 1.3 to rotate one circle, observe the laser spot of the precision displacement probe 3.2, and adjust the displacement adjustment handle 1.2.1, so that the laser spot is always on the TO component annular sealing surface 4.1 during the rotation of the precision turntable 1.1; turn on the precision displacement probe 3.2, and the host computer continuously collects the displacement of the TO component annular sealing surface 4.1 during the rotation of the precision turntable 1.1, which is displayed as an inclined straight line through data processing; adjust the tilt adjustment handle 1.2.2, so that the inclined straight line is displayed as a horizontal straight line, and record the accurate displacement of the TO component annular sealing surface 4.1 during the rotation of the precision turntable 1.1;

[0053] Adjust the horizontal position of the precision displacement probe 3.2 by the horizontal adjustment screw 2.6.1 of the two-dimensional adjustment platform 2.6, so that the laser spot is always on the quartz resonant beam chip during the rotation of the precision turntable 1.1, and record the accurate displacement of the upper surface 4.2 of the quartz resonant beam chip during the rotation of the precision turntable 1.1;

[0054] Fourth step: parallelism error calculation

[0055] The multi-point accurate displacement measurement data of the TO component annular sealing surface 4.1 is linearly fitted by the least square method to determine the plane where the TO component annular sealing surface 4.1 is located, and define it as the reference plane 5.1; the multi-point accurate displacement measurement data of the upper surface 4.2 of the quartz resonant beam chip is linearly fitted by the least square method to determine the plane where the upper surface 4.2 of the quartz resonant beam chip is located, and define the plane boundary by the maximum outer diameter of the quartz resonant beam chip, and finally define the chip plane 5.2;

[0056] The parallel planes 5.3 and 5.4 are parallel to the reference plane 5.1, and the chip plane 5.2 must be clamped between the parallel planes 5.3 and 5.4, and the distance t between the parallel planes 5.3 and 5.4 is calculated, which is the parallelism error.

[0057] With reference to Figure 4 The reference plane 5.1 is a plane defined by the TO component annular sealing surface 4.1 displacement measurement data processed by a certain algorithm. The chip plane 5.2 is a plane defined by the quartz resonator beam chip upper surface 4.2 displacement measurement data processed by a certain algorithm. The parallel planes 5.3 and 5.4 are parallel to the reference plane 5.1, and the chip plane 5.2 is exactly sandwiched between the parallel planes 5.3 and 5.4.

[0058] It should be understood that modifications or variations can be made according to the above description by those of ordinary skill in the art, and all such modifications and variations are intended to be within the scope of the present application as defined by the claims.

Claims

1. A quartz resonator beam chip patch parallelism measuring device, characterized by: The device comprises a stage, a detection head fixing support and a displacement detection device; The stage is arranged on the detection head fixing support and is used for fixing the TO component; when measuring the plane of the annular sealing surface of the TO component, the laser spot of the displacement detection device always hits the annular sealing surface of the TO component during one rotation of the stage; when measuring the plane of the upper surface of the quartz resonant beam chip, the laser spot of the displacement detection device always hits the upper surface of the quartz resonant beam chip during one rotation of the stage. The detection head fixing support is used for fixing the displacement detection device and adjusting the horizontal and vertical positions of the precision displacement probe of the displacement detection device. The displacement detection device is arranged above the stage and on the detection head fixing support, does not contact the TO component on the stage, is used for measuring the displacement data of the plane of the annular sealing surface of the TO component and the plane of the upper surface of the quartz resonant beam chip and calculating the parallelism error.

2. The quartz resonator beam chip paster parallelism measuring device according to claim 1, characterized in that: The stage comprises a precision turntable, a four-dimensional adjustment mechanism, a TO component fixing part, an upper computer and a turntable controller; the precision turntable is arranged on the bottom plate of the detection head fixing support; the four-dimensional adjustment mechanism is arranged above the precision turntable and can be adjusted in two horizontal directions and can be tilted around two horizontal direction axes; the TO component fixing part is arranged on the four-dimensional adjustment mechanism and is used for fixing the TO component; the upper computer controls the work of the turntable controller, and then the turntable controller controls the work of the built-in driving motor of the precision turntable, so as to control the rotation of the precision turntable, and the four-dimensional adjustment mechanism and the TO component fixing part rotate with the precision turntable.

3. The quartz resonator beam chip paster parallelism measuring device according to claim 2, characterized by, The TO component fixing part comprises a vacuum chuck; the vacuum chuck comprises a chuck body and circumferential and radial vacuum suction grooves arranged on the chuck body; the central hole of the chuck body is connected with a vacuum pipeline; the TO component is arranged on the chuck body and is fixed on the vacuum chuck through the circumferential and radial vacuum suction grooves.

4. The quartz resonator beam chip paster parallelism measuring device according to claim 2, characterized in that: The four-dimensional adjustment mechanism comprises two horizontal linear displacement adjustment handles and two tilt adjustment handles around two horizontal direction axes.

5. The quartz resonator beam chip paster parallelism measuring device according to claim 1, characterized in that: The detection head fixing support comprises a bottom plate, a support rod, a support plate, a two-dimensional adjustment platform, an adapter plate and a detection head clamping seat; the support rod is fixed on the bottom plate, the support plate is arranged on the support rod, and the two-dimensional adjustment platform is arranged on the support plate; the detection head clamping seat is fixed on the two-dimensional adjustment platform through the adapter plate.

6. The quartz resonator beam chip paster parallelism measuring device according to claim 5, characterized in that: The two-dimensional adjustment platform comprises horizontal and vertical adjustment screws; the vertical adjustment screw of the two-dimensional adjustment platform adjusts the reference distance of the precision displacement probe of the displacement detection device; the upper surface of the quartz resonant beam chip of the TO component is in the measurement area of the precision displacement probe.

7. The quartz resonator beam chip paster parallelism measuring device according to claim 5, characterized in that: The two-dimensional adjustment platform is connected with the support plate through an L-shaped fixing seat.

8. The quartz resonator beam chip paster parallelism measuring device according to claim 5, characterized in that: The support rod is fixed on the bottom plate through a support rod base.

9. The quartz resonator beam chip paster parallelism measuring device according to claim 1, characterized in that: The displacement detection device comprises a precision displacement probe and a displacement measurement controller; the precision displacement probe is arranged on the detection head clamping seat of the detection head fixing support; the precision displacement probe transmits the collected displacement data of the TO component to the displacement measurement controller; the displacement measurement controller transmits the received data to the upper computer.

10. A method for measuring the parallelism of a quartz resonator beam chip patch, characterized in that: The method adopts the quartz resonant beam chip patch parallelism measuring device in any one of claims 1-9; The method comprises the following steps: (1) placing the TO component after the quartz resonant beam chip patch on the object table and fixing by vacuum chuck; (2) adjusting the horizontal and vertical linear displacement degrees of freedom of the two-dimensional adjustment platform and the linear displacement degrees of freedom of the two horizontal planes of the four-dimensional adjustment mechanism, so that the annular sealing surface of the TO component is in the measuring area of the precision displacement probe during one rotation of the precision turntable; (3) rotating the precision turntable for one rotation, measuring the multi-point displacement of the annular sealing surface of the TO component by the precision displacement probe, and determining the annular sealing surface of the TO component; adjusting the two inclination degrees of freedom of the four-dimensional adjustment mechanism, so that the annular sealing surface of the TO component is in a horizontal state; (4) adjusting the horizontal linear displacement degree of freedom of the two-dimensional adjustment platform, so that the upper surface of the quartz resonant beam chip on the TO component is in the measuring area of the precision displacement probe during one rotation of the precision turntable; (5) rotating the precision turntable for one rotation, measuring the multi-point displacement of the upper surface of the quartz resonant beam chip on the TO component by the precision displacement probe, and determining the upper surface of the quartz resonant beam chip; (6) determining the plane where the annular sealing surface of the TO component is located, defining it as the reference plane, and determining the plane where the upper surface of the quartz resonant beam chip is located, defining the plane boundary with the maximum outer diameter of the quartz resonant beam chip, defining the chip plane, and calculating the parallelism of the quartz resonant beam chip relative to the annular sealing surface of the TO base through the reference plane and the chip plane.

Images