Piezoelectric module, method for manufacturing piezoelectric module, electronic component, and electronic device

Abstract

The present disclosure relates to a piezoelectric module, a method of manufacturing the same, an electronic component, and an electronic device. The piezoelectric module includes a first piezoelectric layer group including an organic piezoelectric thin film and a first electrode layer stacked with the organic piezoelectric thin film, and a second piezoelectric layer group stacked with the first piezoelectric layer group, the second piezoelectric layer group including a piezoelectric ceramic and a second electrode layer stacked with the piezoelectric ceramic.

Description

TECHNICAL FIELD

[0001] The present disclosure relates to the technical field of terminals, and in particular, to a piezoelectric module, a preparation method thereof, an electronic component, and an electronic device. BACKGROUND

[0002] In order to enrich the user experience, the display panel of some electronic devices can vibrate to make sound. In the related art, a piezoelectric material can be arranged on the non-display side of the display panel of the electronic device, and the piezoelectric material is driven to vibrate to drive the display panel to vibrate and thus to make sound. SUMMARY

[0003] The present disclosure provides a piezoelectric module, a preparation method thereof, an electronic component, and an electronic device to solve the problems in the related art.

[0004] According to a first aspect of an embodiment of the present disclosure, a piezoelectric module is provided, comprising:

[0005] a first piezoelectric layer group, the first piezoelectric layer group comprising an organic piezoelectric film and a first electrode layer stacked with the organic piezoelectric film;

[0006] a second piezoelectric layer group, the second piezoelectric layer group stacked with the first piezoelectric layer group, the second piezoelectric layer group comprising a piezoelectric ceramic and a second electrode layer stacked with the piezoelectric ceramic.

[0007] Optionally, the piezoelectric module comprises at least one group of adjacently arranged first piezoelectric layer groups and second piezoelectric layer groups.

[0008] The surfaces of the organic piezoelectric film and the piezoelectric ceramic arranged oppositely are connected to opposite sides of the same first electrode layer or the same second electrode layer.

[0009] Optionally, the piezoelectric module further comprises:

[0010] a first conductive adhesive layer, one side of the first conductive adhesive layer connected with the first electrode layer and the other side connected with the piezoelectric ceramic, or one side of the first conductive adhesive layer connected with the second electrode layer and the other side connected with the organic piezoelectric film.

[0011] Optionally, the piezoelectric module comprises at least one group of adjacently arranged first piezoelectric layer groups and second piezoelectric layer groups, and the piezoelectric module further comprises:

[0012] an insulating adhesive layer, the insulating adhesive layer arranged between the first electrode layer and the second electrode layer arranged oppositely.

[0013] Optionally, the thickness of the insulating adhesive layer is greater than or equal to 5 microns and less than or equal to 50 microns.

[0014] Optionally, the piezoelectric module comprises at least one set of first piezoelectric layer set and second piezoelectric layer set arranged adjacently; the piezoelectric module further comprises:

[0015] A second conductive adhesive layer is arranged between the first electrode layer and the second electrode layer arranged oppositely and having the same polarity.

[0016] Optionally, the first electrode layer and the second electrode layer respectively comprise a body and a bump connected to the edge of the body, the body is arranged corresponding to the organic piezoelectric film and the piezoelectric ceramic, the bump protrudes from the organic piezoelectric film and the piezoelectric ceramic, and the bump is used for conducting to a circuit board.

[0017] Optionally, the thickness of the organic piezoelectric film is greater than or equal to 10 microns.

[0018] Optionally, the thickness of the piezoelectric ceramic is greater than or equal to 10 nanometers and less than or equal to 1000 nanometers.

[0019] Optionally, the thickness of the electrode layer is greater than or equal to 0.01 microns and less than or equal to 50 microns.

[0020] According to a second aspect of the embodiments of the present disclosure, an electronic component is provided, comprising the piezoelectric module according to any one of the above embodiments.

[0021] According to a third aspect of the embodiments of the present disclosure, an electronic device is provided, comprising the electronic component according to any one of the above embodiments.

[0022] According to a third aspect of the embodiments of the present disclosure, a preparation method of a piezoelectric module is provided, comprising:

[0023] forming a first piezoelectric layer set, the first piezoelectric layer set comprising an organic piezoelectric film and a first electrode layer stacked with the organic piezoelectric film;

[0024] forming a second piezoelectric layer set, the second piezoelectric layer set stacked with the first piezoelectric layer set, the second piezoelectric layer set comprising a piezoelectric ceramic and a second electrode layer stacked with the piezoelectric ceramic, to obtain a piezoelectric module.

[0025] Optionally, the forming of the first piezoelectric layer set comprises:

[0026] obtaining an organic piezoelectric film;

[0027] forming the first electrode layer on the opposite two surfaces of the organic piezoelectric film, respectively.

[0028] Optionally, the forming of the second piezoelectric layer set comprises:

[0029] obtaining a piezoelectric ceramic;

[0030] The second electrode layer is formed on the opposite surfaces of the piezoelectric ceramic respectively;

[0031] A glue layer is coated on the surface of any of the first electrode layer and / or any of the second electrode layer;

[0032] The first electrode layer and the second electrode layer are bonded.

[0033] Optionally, when the first electrode layer and the second electrode layer coated with the glue layer have the same polarity, the glue layer comprises a conductive glue layer or an insulating glue layer;

[0034] When the first electrode layer and the second electrode layer coated with the glue layer have different polarities, the glue layer comprises an insulating glue layer.

[0035] Optionally, the forming of the first piezoelectric layer group comprises:

[0036] An organic piezoelectric film is formed on the surface of the second electrode layer;

[0037] The first electrode layer is formed on the surface of the organic piezoelectric film away from the second electrode layer.

[0038] Optionally, the forming of the second piezoelectric layer group comprises:

[0039] A piezoelectric ceramic is formed on the surface of the first electrode layer;

[0040] The second electrode layer is formed on the surface of the piezoelectric ceramic away from the first electrode layer.

[0041] Optionally, the forming of the first piezoelectric layer group comprises:

[0042] A conductive glue layer is coated on the surface of the second electrode layer and / or the surface of the organic piezoelectric film;

[0043] The second electrode layer and the organic piezoelectric film are bonded.

[0044] Optionally, the forming of the second piezoelectric layer group comprises:

[0045] A conductive glue layer is coated on the surface of the first electrode layer and / or the surface of the piezoelectric ceramic;

[0046] The first electrode layer and the piezoelectric ceramic are bonded.

[0047] The technical scheme provided by the embodiments of the present disclosure can have the following beneficial effects:

[0048] As can be seen from the above embodiments, in the technical solution of the present disclosure, the same piezoelectric module can simultaneously include an organic piezoelectric film and a piezoelectric ceramic, so that on the one hand, the high piezoelectric performance of the piezoelectric ceramic can be utilized to improve the piezoelectric performance of the piezoelectric module 1 as a whole, and on the other hand, the high flexibility of the organic piezoelectric film can be utilized to improve the flexibility of the piezoelectric module as a whole, and to reduce the irreversible deformation of the piezoelectric module.

[0049] It should be understood that the foregoing general description and the following detailed description are only exemplary and explanatory, and are not limiting to the present disclosure. BRIEF DESCRIPTION OF DRAWINGS

[0050] The accompanying drawings, which are incorporated into and form part of the specification, illustrate embodiments consistent with the present disclosure and, together with the description, serve to explain the principles of the disclosure.

[0051] Figure 1 is a front view of a piezoelectric module according to an exemplary embodiment.

[0052] Figure 2 is a cross-sectional view of a piezoelectric module according to an exemplary embodiment.

[0053] Figure 3 is a cross-sectional view of another piezoelectric module according to an exemplary embodiment.

[0054] Figure 4 is a cross-sectional view of yet another piezoelectric module according to an exemplary embodiment.

[0055] Figure 5 is a cross-sectional view of still another piezoelectric module according to an exemplary embodiment.

[0056] Figure 6 is a cross-sectional view of yet another piezoelectric module according to an exemplary embodiment.

[0057] Figure 7 is a flowchart of a method for manufacturing a piezoelectric module according to an exemplary embodiment.

[0058] Figure 8 is a flowchart of another method for manufacturing a piezoelectric module according to an exemplary embodiment.

[0059] Figure 9 is a flowchart of yet another method for manufacturing a piezoelectric module according to an exemplary embodiment.

[0060] Figure 10 is a flowchart of still another method for manufacturing a piezoelectric module according to an exemplary embodiment. DETAILED DESCRIPTION

[0061] The exemplary embodiments will be described in detail herein with reference to the attached drawings. The description herein refers to the accompanying drawings, which show by way of illustration various

[0062] The terminology used in the present disclosure is for the purpose of describing particular embodiments only and is not intended to be limiting of the present disclosure. As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that the terms "and / or", as used herein, refers to and encompasses any and all possible combinations of one or more of the associated listed items.

[0063] It is to be understood that the singular forms "a", "an", and "the" include plural referents unless the context clearly dictates otherwise. It is to be understood that the term "and / or" as used herein encompasses all possible combinations of one or more of the associated listed items and that terms, such as "comprises", "comprising", "includes", "including", "contains", "containing" or "wherein" are to be construed in an open-ended way, i.e. meaning "including, but not limited to".

[0064] Figure 1 is a front view of a piezoelectric module 100 according to an exemplary embodiment, Figure 2 is a cross-sectional view of a piezoelectric module 100 according to an exemplary embodiment, as Figure 1 and Figure 2 As shown in the embodiments of FIGS. 1A and 1B, the piezoelectric module 100 can include a first piezoelectric layer set 1 and a second piezoelectric layer set 2 stacked together. The first piezoelectric layer set 1 can include an organic piezoelectric film 11 and a first piezoelectric layer 111 stacked with the organic piezoelectric film 11. In the embodiment shown in FIG. 1A, the first piezoelectric layer set 1 can include two first electrode layers 12 stacked on opposite sides of the organic piezoelectric film 11 and connected to two opposite surfaces of the organic piezoelectric film 11, one of which can serve as a positive electrode tab and the other of which can serve as a negative electrode tab. Figure 2 As shown in the embodiments of FIGS. 1A and 1B, the piezoelectric module 100 can include a first piezoelectric layer set 1 and a second piezoelectric layer set 2 stacked together. The first piezoelectric layer set 1 can include an organic piezoelectric film 11 and a first piezoelectric layer 111 stacked with the organic piezoelectric film 11. In the embodiment shown in FIG. 1A, the first piezoelectric layer set 1 can include two first electrode layers 12 stacked on opposite sides of the organic piezoelectric film 11 and connected to two opposite surfaces of the organic piezoelectric film 11, one of which can serve as a positive electrode tab and the other of which can serve as a negative electrode tab. Figure 2 As shown in the embodiments of FIGS. 1A and 1B, the piezoelectric module 100 can include a first piezoelectric layer set 1 and a second piezoelectric layer set 2 stacked together. The first piezoelectric layer set 1 can include an organic piezoelectric film 11 and a first piezoelectric layer 111 stacked with the organic piezoelectric film 11. In the embodiment shown in FIG. 1A, the first piezoelectric layer set 1 can include two first electrode layers 12 stacked on opposite sides of the organic piezoelectric film 11 and connected to two opposite surfaces of the organic piezoelectric film 11, one of which can serve as a positive electrode tab and the other of which can serve as a negative electrode tab. Figure 2The embodiment shown is only illustrative, and the stacking and connection of the first piezoelectric layer group 1 and the second piezoelectric layer group 2 can also be implemented in other manners, which will be described in detail later.

[0065] Based on this, in the technical scheme of the present disclosure, the same piezoelectric module 100 can simultaneously include an organic piezoelectric film 11 and a piezoelectric ceramic 21, so on the one hand, the high piezoelectricity of the piezoelectric ceramic 21 can be utilized to improve the piezoelectric performance of the piezoelectric module 100 as a whole, and on the other hand, the high flexibility of the organic piezoelectric film 11 can be utilized to improve the flexibility of the piezoelectric module 100 as a whole, and reduce the irreversible deformation of the piezoelectric module 100. Among them, the organic piezoelectric film 11 can include a high-molecular organic piezoelectric film, such as the organic piezoelectric film 11 can include one or more materials of polyvinylidene fluoride, polyvinylidene fluoride-co-trifluoroethylene, polyvinylidene cyanide, polyamide, polyvinyl chloride and polyphosphazene, and the thickness of the organic piezoelectric film 11 can be greater than or equal to 10 microns to ensure the strength of the organic piezoelectric film 11; the piezoelectric ceramic 21 can include PZT, BaTiO3 or PbTiO3, and the thickness of the piezoelectric ceramic 21 can be greater than or equal to 10 nanometers and less than or equal to 1000 nanometers to ensure the strength of the piezoelectric ceramic 21 while avoiding the influence of the flexibility of the piezoelectric module 100 caused by the excessive thickness of the piezoelectric ceramic 21; the first electrode layer 12 and the second electrode layer 22 can each include a metal electrode layer, such as the metal electrode layer can include one or more materials of gold, silver, copper, platinum, nickel, chromium, aluminum and titanium, and the thickness of the metal electrode layer can be greater than or equal to 0.01 microns and less than or equal to 50 microns to avoid excessive increase in the thickness of the piezoelectric module 100.

[0066] In Figure 1 and Figure 2 In the embodiment shown, the piezoelectric module 100 includes a single first piezoelectric layer group 1 and a single second piezoelectric layer group 2, but in fact, in other embodiments, the piezoelectric module 100 can also include multiple first piezoelectric layer groups 1 or multiple second piezoelectric layer groups 2, which is not limited by the present disclosure. It can be understood that no matter how many first piezoelectric layer groups 1 and second piezoelectric layer groups 2 the piezoelectric module 100 includes, there are at least one group of first piezoelectric layer groups 1 and second piezoelectric layer groups 2 arranged adjacently in the piezoelectric module 100. In some cases, the piezoelectric module 100 can also include at least one group of first piezoelectric layer groups 1 arranged adjacently; in another some cases, the piezoelectric module 100 can also include at least one group of second piezoelectric layer groups 2 arranged adjacently. In the embodiments provided by the present disclosure, the connection mode between the first piezoelectric layer group 1 and the second piezoelectric layer group 2 arranged adjacently is described, and the connection mode between the first piezoelectric layer group 1 arranged adjacently and the second piezoelectric layer group 2 arranged adjacently can refer to the embodiments provided in the present disclosure, which will not be described separately in the present disclosure.

[0067] In some embodiments, the adjacent first piezoelectric layer group 1 and the second piezoelectric layer group 2 may share the same electrode layer. For example, Figure 2 As shown, the two opposing surfaces of the organic piezoelectric film 11 and the piezoelectric ceramic 21 are both connected to opposite sides of the same first electrode layer 12. Of course, in other embodiments, the two opposing surfaces of the organic piezoelectric film 11 and the piezoelectric ceramic 21 may also be connected to opposite sides of the same second electrode layer 22; this disclosure does not impose any limitations on this. By having adjacent first piezoelectric layer groups 1 and second piezoelectric layer groups 2 share the same first electrode layer 12 or the same second electrode layer 22, it is beneficial to reduce the thickness of the piezoelectric module 100 and simultaneously reduce the number of metal contacts from the piezoelectric module 100 used for electrical connection with the circuit board, facilitating the connection and conduction of the internal circuitry of the piezoelectric module 100.

[0068] Based on this, in some cases, such as Figure 2 As shown, the metal thin film 11 and the piezoelectric ceramic 21 can be directly connected to opposite sides of the same first electrode layer 12, or in other embodiments, the metal thin film 11 and the piezoelectric ceramic 21 can be directly connected to opposite sides of the same second electrode layer 22. In some other cases, such as... Figure 3 As shown, the adjacent first piezoelectric layer group 1 and the second piezoelectric layer group 2 can share the same first electrode layer 12. The piezoelectric module 100 may also include a first conductive adhesive layer 3. One side of the first conductive adhesive layer 3 can be connected to the first electrode layer 12, and the other side can be connected to the piezoelectric ceramic 21. This allows the electrical signal from the first electrode layer 12 to be conducted to various areas on the surface of the piezoelectric ceramic 21 through the first conductive adhesive layer 3. Of course, in some other embodiments, such as... Figure 4 As shown, when the adjacent first piezoelectric layer group 1 and second piezoelectric layer group 2 can share the same second electrode layer 22, one side of the first conductive adhesive layer 3 can be connected to the second electrode layer 22 and the other side can be connected to the organic piezoelectric film 11. This allows the electrical signal of the second electrode layer 22 to be conducted to various areas on the surface of the organic piezoelectric film 11 through the first conductive adhesive layer 3. The first conductive adhesive layer 3 may include a conductive adhesive layer, which can stably connect the first piezoelectric layer group 1 and the second piezoelectric layer group 2 while achieving conductivity. Connecting the first piezoelectric layer group 1 and the second piezoelectric layer group 2 through the first conductive adhesive layer 3 provides the possibility of independently processing the first piezoelectric layer group 1 and the second piezoelectric layer group 2, and then assembling them. This is a significant improvement over traditional piezoelectric layer layer layer 1. Figure 2 In the embodiments, for a scheme that requires processing one of the first piezoelectric layer group 1 and the second piezoelectric layer group 2 while processing the other, the cost of errors can be reduced.

[0069] In the above embodiments, the first piezoelectric layer group 1 and the second piezoelectric layer group 2 are taken as an example to be shared with the same first electrode layer 12 or the same second electrode layer 22, and in other implementations, the first piezoelectric layer group 1 and the second piezoelectric layer group 2 can also not be shared with the same first electrode layer 12 or the same second electrode layer 22. For example, as shown in Figure 5 The piezoelectric module 100 can further include an insulating adhesive layer 4, which can be arranged between the oppositely arranged first electrode layer 12 and second electrode layer 22. The opposite sides of the insulating adhesive layer 4 can be connected to the first electrode layer 12 and the second electrode layer 22 with the same polarity, such as both the first electrode layer 12 and the second electrode layer 22 being positive or negative, or the first electrode layer 12 and the second electrode layer 22 can also have different polarities, such as the first electrode layer 12 being positive and the second electrode layer 22 being negative, or the first electrode layer 12 being negative and the second electrode layer 22 being positive, which is not limited by the present disclosure. The thickness of the insulating adhesive layer 4 can be greater than or equal to 5 microns and less than or equal to 50 microns.

[0070] In some embodiments, as shown in Figure 6 The piezoelectric module 100 can further include a second conductive adhesive layer 5, which can be arranged between the oppositely arranged first electrode layer 12 and second electrode layer 22 with the same polarity. For example, in the embodiment shown in Figure 6 The first electrode layer 12 and the second electrode layer 22 can both be positive or negative, so that the first electrode layer 12 and the second electrode layer 22 can be connected through the second conductive adhesive layer 5, realizing the electrical connection between the first electrode layer 12 and the second electrode layer 22, which is conducive to reducing the number of metal contacts of the piezoelectric module 100 for electrical connection with the circuit board, and facilitating the connection and conduction of the internal circuit of the piezoelectric module 100.

[0071] It should be noted that in the embodiments provided in the present disclosure, the connection mode between each group of adjacent first piezoelectric layer group 1 and second piezoelectric layer group 2 included in the piezoelectric module 100 is described; in fact, when the piezoelectric module 100 includes multiple groups of adjacent first piezoelectric layer group 1 and second piezoelectric layer group 2, the connection mode between each group of adjacent first piezoelectric layer group 1 and second piezoelectric layer group 2 can refer to the foregoing embodiments, and the connection mode between multiple groups of adjacent first piezoelectric layer group 1 and second piezoelectric layer group 2 can be the same or different, and the present disclosure does not limit this. In each of the above embodiments, the organic piezoelectric film 11 is arranged between the electrode layer with positive polarity and the electrode layer with negative polarity, and the piezoelectric ceramic 21 is also arranged between the electrode layer with positive polarity and the electrode layer with negative polarity, and whether the two side electrode layers of the organic piezoelectric film 11 are the first electrode layer or the second electrode layer or the first electrode layer and the second electrode layer can be implemented according to the foregoing embodiments as needed; similarly, whether the two side electrode layers of the organic piezoelectric film 11 are the first electrode layer or the second electrode layer or the first electrode layer and the second electrode layer can be implemented according to the foregoing embodiments as needed.

[0072] In each of the above embodiments, still taking Figure 6 As shown in the figure, the first electrode layer 12 and the second electrode layer 22 can respectively include a body and a bump connected to the edge of the body; for example, the first electrode layer 12 can include a first body 121 and a first bump 122, and the second electrode layer 22 can include a second body 221 and a second bump 222, the first body 121 and the second body 221 can be arranged in a stack corresponding to the organic piezoelectric film 11 and the piezoelectric ceramic 21, the first bump 122 and the second bump 222 can be arranged protruding from the organic piezoelectric film 11 and the piezoelectric ceramic 21, and the first bump 122 and the second bump 222 can be connected to the circuit board to realize electrical conduction.

[0073] Based on the piezoelectric module 100 provided in the present disclosure, the present disclosure further provides an electronic component, which can include the piezoelectric module described in any one of the above embodiments. For example, the electronic component can include a piezoelectric sensor, a speaker component, an earpiece component, a microphone component, a sound box, etc., and the present disclosure does not limit this.

[0074] The present disclosure further provides an electronic device, which can include the electronic device described in any one of the above embodiments. For example, the electronic device can include a mobile phone terminal, a tablet terminal, or a wearable terminal, etc., and the present disclosure does not limit this.

[0075] In the technical solutions of the present disclosure, a preparation method of the piezoelectric module 100 is also provided, as shown in the figure, the preparation method can include: Figure 7

[0076] ​Step 701, forming a first piezoelectric layer group 1, the first piezoelectric layer group 1 includes an organic piezoelectric film 11 and a first electrode layer 12 stacked with the organic piezoelectric film 11.

[0077] Step 702, forming a second piezoelectric layer group 2, the second piezoelectric layer group 2 is stacked with the first piezoelectric layer group 1, and the second piezoelectric layer group 2 includes a piezoelectric ceramic 21 and a second electrode layer 22 stacked with the piezoelectric ceramic 21, to obtain a piezoelectric module 100.

[0078] In this embodiment, the first piezoelectric layer group 1 can be formed independently of the second piezoelectric layer group 2, and then the first piezoelectric layer group 1 and the second piezoelectric layer group 2 are connected to obtain the piezoelectric module 100 or the piezoelectric module 100 includes part of the structure; or, the second piezoelectric layer group 2 can be formed based on the structure of the first piezoelectric layer group 1, or the first piezoelectric layer group 1 can be formed based on the structure of the second piezoelectric layer group 2, and the present disclosure does not limit this. Among them,

[0079] Based on this, in the technical scheme of the present disclosure, the same piezoelectric module 100 can simultaneously include an organic piezoelectric film 11 and a piezoelectric ceramic 21, so that on the one hand the high piezoelectricity of the piezoelectric ceramic 21 can be utilized to improve the piezoelectric performance of the piezoelectric module 100 as a whole, and on the other hand the high flexibility of the organic piezoelectric film 11 can be utilized to improve the toughness of the piezoelectric module 100 as a whole, and reduce the irreversible deformation of the piezoelectric module 100. Among them, the organic piezoelectric film 11 can include a high-molecular organic piezoelectric film, such as the organic piezoelectric film 11 can include one or more materials of polyvinylidene fluoride, polyvinylidene fluoride-co-trifluoroethylene, polyvinylidene cyanide, polyamide, polyvinyl chloride and polyphosphazene, and the thickness of the organic piezoelectric film 11 can be greater than or equal to 10 microns to ensure the strength of the organic piezoelectric film 11; the piezoelectric ceramic 21 can include PZT, BaTiO3 or PbTiO3, and the thickness of the piezoelectric ceramic 21 can be greater than or equal to 10 nanometers and less than or equal to 1000 nanometers to ensure the strength of the piezoelectric ceramic 21 while avoiding the influence of the toughness of the piezoelectric module 100 due to the excessive thickness of the piezoelectric ceramic 21; the first electrode layer 12 and the second electrode layer 22 can each include a metal electrode layer, such as the metal electrode layer can include one or more materials of gold, silver, copper, platinum, nickel, chromium, aluminum and titanium, and the thickness of the metal electrode layer can be greater than or equal to 0.01 microns and less than or equal to 50 microns to avoid excessive increase in the thickness of the piezoelectric module 100.

[0080] In an embodiment, an organic piezoelectric film can be obtained; the first electrode layer is formed on the opposite surfaces of the organic piezoelectric film respectively; further, a piezoelectric ceramic is obtained; the second electrode layer is formed on the opposite surfaces of the piezoelectric ceramic respectively; a glue layer is coated on the surface of any of the first electrode layer and / or any of the second electrode layer; the first electrode layer and the second electrode layer are bonded. When the first electrode layer and the second electrode layer coated with the glue layer are of the same polarity, the glue layer comprises a conductive glue layer or an insulating glue layer; when the first electrode layer and the second electrode layer coated with the glue layer are of different polarities, the glue layer comprises an insulating glue layer.

[0081] In another embodiment, the second piezoelectric layer group can be formed first, and then the organic piezoelectric film is formed on the surface of the second electrode layer of the second piezoelectric layer group; the first electrode layer is formed on the surface of the side of the organic piezoelectric film away from the second electrode layer. Alternatively, the second piezoelectric layer group can be formed first, and then a conductive glue layer is coated on the surface of the second electrode layer of the second piezoelectric layer group and / or the surface of the organic piezoelectric film; the second electrode layer and the organic piezoelectric film are bonded.

[0082] In still another embodiment, the first piezoelectric layer group can be formed first, and then the piezoelectric ceramic is formed on the surface of the first electrode layer; the second electrode layer is formed on the surface of the side of the piezoelectric ceramic away from the first electrode layer. Alternatively, a conductive glue layer can be coated on the surface of the first electrode layer of the first piezoelectric layer group and / or the surface of the piezoelectric ceramic; the first electrode layer and the piezoelectric ceramic are bonded.

[0083] Figure 8 is a flow chart of a preparation method of a piezoelectric module 100 according to an exemplary embodiment. As shown in Figure 8 , the preparation method can comprise:

[0084] Step 801: obtaining an organic piezoelectric film 11.

[0085] In this embodiment, based on a previously prepared substrate, the organic piezoelectric film 11 can be formed on the substrate by coating or doctor blading, and then the substrate coated with the organic piezoelectric film 11 is baked to shape the organic piezoelectric film, and then the organic piezoelectric film 11 can be obtained by tearing off from the substrate.

[0086] Step 802: forming the first electrode layer 12 on the opposite surfaces of the organic piezoelectric film 11 respectively.

[0087] In this embodiment, the first electrode layer 12 can include a metal electrode layer, and the first electrode layer 12 with positive polarity can be formed on one side of the organic piezoelectric film 11, and the first electrode layer 12 with negative polarity can be formed on the opposite side. Specifically, any one or more of sputtering, evaporation, coating and silk printing can be used to form the first electrode layer 12 on the surface of the organic piezoelectric film 11.

[0088] Step 803: Obtain the piezoelectric ceramic 21.

[0089] In this embodiment, the piezoelectric ceramic 21 can be formed on a substrate prepared in advance by a sputtering process or an evaporation process.

[0090] It should be noted that the piezoelectric ceramic 21 can be polarized after being obtained, and the organic piezoelectric film 11 can be polarized after being obtained, so that the piezoelectric ceramic 21 and the organic piezoelectric film 11 can be polarized separately, and the problem of difficult polarization of the powder mixture caused by the different polarization methods of the piezoelectric ceramic 21 and the organic piezoelectric film 11 is solved.

[0091] Step 804: Form the second electrode layer 22 on the opposite surfaces of the piezoelectric ceramic 21.

[0092] In this embodiment, the second electrode layer 22 can include a metal electrode layer, and the second electrode layer 22 with positive polarity can be formed on one side of the organic piezoelectric film 11, and the second electrode layer 22 with negative polarity can be formed on the opposite side. Specifically, any one or more of sputtering, evaporation, coating and silk printing can be used to form the second electrode layer 22 on the surface of the organic piezoelectric film 11.

[0093] Step 805: Coat a glue layer on the surface of any one of the first electrode layer 12 and / or any one of the second electrode layer 22.

[0094] Step 806: Bond the first electrode layer 12 and the second electrode layer 22 coated with the glue layer to obtain the piezoelectric module 100.

[0095] In this embodiment, after the first electrode layer 12 and the second electrode layer 22 are bonded by the coated glue layer, the connection and fixation between the first piezoelectric layer group 1 and the second piezoelectric layer group 2 arranged adjacent to each other can be realized. When the first electrode layer 12 and the second electrode layer 22 coated with the glue layer have the same polarity, the glue layer can include a conductive glue layer or an insulating glue layer; when the first electrode layer 12 and the second electrode layer 22 coated with the glue layer have different polarities, the glue layer can include an insulating glue layer to insulate the first electrode layer 12 and the second electrode layer 22, so as to avoid short circuit. Figure 8In the illustrated embodiment, the order of forming the first piezoelectric layer group 1 and the second piezoelectric layer group 2 is not limited, and the first piezoelectric layer group 1 can be processed first and then the second piezoelectric layer group 2, or the second piezoelectric layer group 2 can be processed first and then the first piezoelectric layer group 1, or the first piezoelectric layer group 1 and the second piezoelectric layer group 2 can be processed simultaneously.

[0096] As shown in the Figure 9 embodiment, the present disclosure also provides a preparation method of the piezoelectric module 100. As shown in the Figure 9 embodiment, the preparation method can include:

[0097] Step 901: Obtain an organic piezoelectric film 11.

[0098] Step 902: Form a first electrode layer 12 on the opposite surfaces of the organic piezoelectric film 11, respectively.

[0099] In this embodiment, steps 901 and 902 can refer to steps 801 and 802 in the foregoing embodiment.

[0100] Step 903: Form a piezoelectric ceramic 21 on the surface of any first electrode layer 12.

[0101] In this embodiment, the piezoelectric ceramic 21 can be formed on the surface of any first electrode layer 12 by a sputtering or evaporation process.

[0102] Among them, the polarization process can be performed on the organic piezoelectric film 11 after the organic piezoelectric film 11 is formed, and then the polarized powder is used as a raw material to form the piezoelectric ceramic 21 by evaporation or sputtering based on the first electrode layer 12. In this way, independent polarization processes of the piezoelectric ceramic 21 and the organic piezoelectric film 11 can be realized.

[0103] Step 904: Form a second electrode layer 22 on the surface of the piezoelectric ceramic 21 away from the first electrode layer 12.

[0104] In this embodiment, any one or more of sputtering, evaporation, coating, and silk printing processes can be used to form the second electrode layer 22 on the surface of the piezoelectric ceramic 21 away from the organic piezoelectric film 11.

[0105] It should be noted that, in Figure 9In the embodiment shown, the first piezoelectric layer group 1 including the organic piezoelectric film 11 and the first electrode layer 12 is first formed, and then the piezoelectric ceramic 21 is formed on the surface of the first electrode layer 12 based on the first electrode layer 12. In other embodiments, the piezoelectric ceramic 21 and the second electrode layer 22 connected to the opposite surfaces of the piezoelectric ceramic 21 can be first formed, and then the organic piezoelectric film 11 is formed on any one of the second electrode layers 22 by coating, and then the first electrode layer 12 is formed based on the organic piezoelectric film 11. Similarly, the piezoelectric ceramic 21 can be polarized after being formed, or the powder for forming the piezoelectric ceramic 21 can be polarized in advance, and the powder for forming the organic piezoelectric film 11 can be polarized in advance, so as to realize separate polarization of the piezoelectric ceramic 21 and the organic piezoelectric film 11.

[0106] As shown in the embodiment, Figure 10 The present disclosure also provides a preparation method of the piezoelectric module 100. As shown in the embodiment, Figure 10 The preparation method can include:

[0107] Step 1001: Obtain the piezoelectric ceramic 21.

[0108] Step 1002: Form the second electrode layer 22 on the opposite surfaces of the piezoelectric ceramic 21.

[0109] In this embodiment, steps 1001 and 1002 can refer to steps 803 and 804 in the foregoing embodiments, which will not be repeated here.

[0110] Step 1003: Coating a conductive adhesive layer on the surface of any one of the second electrode layers 22.

[0111] Step 1004: Obtain the organic piezoelectric film 11.

[0112] Step 1005: Form the first electrode layer 12 on one side of the organic piezoelectric film 11.

[0113] In this embodiment, the organic piezoelectric film 11 can be formed independently of the piezoelectric ceramic 21 and based on a pre-prepared substrate, and then any one or more of sputtering, evaporation, coating, and silk printing processes is used to form the first electrode layer 12 on any surface of the organic piezoelectric film 11.

[0114] Step 1006: Bond the side of the organic piezoelectric film 11 away from the first electrode layer 12 and the second electrode layer 22 coated with the conductive adhesive layer.

[0115] In this embodiment, the side of the organic piezoelectric film 11 away from the first electrode layer 12 and the second electrode layer 22 can be bonded through the conductive adhesive layer, so as to realize the connection and fixation between the first piezoelectric layer group 1 and the second piezoelectric layer group 2.

[0116] In which, independent polarization processes can be carried out for the piezoelectric ceramic 21 and the organic piezoelectric film 11, and specific reference can be made to the foregoing embodiments.

[0117] In Figure 10 In the embodiment shown, the conductive adhesive layer is coated on the surface of the second electrode layer 22, in other embodiments, the conductive adhesive layer can also be coated on the surface of the organic piezoelectric film 11, or the conductive adhesive layer is coated on the surface of both the second electrode layer 22 and the organic piezoelectric film 11, which is not limited by the present disclosure. In the embodiment, the second electrode layer 22 is formed on both sides of the piezoelectric ceramic 21, and then one of the second electrode layers 22 is bonded to the organic piezoelectric film 11, in other embodiments, the first electrode layer 12 can also be formed on the opposite sides of the organic piezoelectric film 11, and then one of the first electrode layers 12 is connected to the piezoelectric ceramic 21 through the conductive adhesive layer, wherein the conductive adhesive layer can be coated on the first electrode layer 12, or the piezoelectric ceramic 21, or both the first electrode layer 12 and the piezoelectric ceramic 21, which can be designed as needed, and the present disclosure is not limited thereto.

[0118] Other embodiments of the present disclosure will be readily apparent to those skilled in the art upon considering the specification and practice of the disclosure disclosed herein. The present disclosure is intended to cover any variations, uses or adaptive changes of the present disclosure following the general principles of the present disclosure and including common knowledge or conventional technical means in the art which are not disclosed by the present disclosure. The specification and embodiments are only regarded as exemplary, and the true scope and spirit of the present disclosure are indicated by the following claims.

[0119] It should be understood that the present disclosure is not limited to the precise structures described above and shown in the drawings, and various modifications and changes can be made without departing from the scope thereof. The scope of the present disclosure is limited only by the appended claims.

Claims

1. A piezoelectric module, characterized in that, include: A first piezoelectric layer group, the first piezoelectric layer group including an organic piezoelectric thin film and a first electrode layer stacked with the organic piezoelectric thin film; A second piezoelectric layer group is stacked with the first piezoelectric layer group, and the second piezoelectric layer group includes a piezoelectric ceramic and a second electrode layer stacked with the piezoelectric ceramic. A second conductive adhesive layer is disposed between the first electrode layer and the second electrode layer, which are disposed opposite to each other and have the same polarity.

2. The piezoelectric module according to claim 1, characterized in that, The piezoelectric module includes at least one set of adjacently arranged first piezoelectric layer groups and second piezoelectric layer groups; the piezoelectric module further includes: An insulating adhesive layer is disposed between the first electrode layer and the second electrode layer, which are disposed opposite to each other.

3. The piezoelectric module according to claim 2, characterized in that, The thickness of the insulating adhesive layer is greater than or equal to 5 micrometers and less than or equal to 50 micrometers.

4. The piezoelectric module according to claim 1, characterized in that, The first electrode layer and the second electrode layer each include a body and a bump connected to the edge of the body. The body is disposed corresponding to the organic piezoelectric film and the piezoelectric ceramic. The bump protrudes from the organic piezoelectric film and the piezoelectric ceramic and is used to conduct to the circuit board.

5. The piezoelectric module according to claim 1, characterized in that, The thickness of the organic piezoelectric film is greater than or equal to 10 micrometers.

6. The piezoelectric module according to claim 1, characterized in that, The thickness of the piezoelectric ceramic is greater than or equal to 10 nanometers and less than or equal to 1000 nanometers.

7. The piezoelectric module according to claim 1, characterized in that, The thickness of the electrode layer is greater than or equal to 0.01 micrometers and less than or equal to 50 micrometers.

8. An electronic component, characterized in that, Includes the piezoelectric module as described in any one of claims 1-7.

9. An electronic device, characterized in that, Includes the electronic components as described in claim 8.

10. A method for preparing a piezoelectric module, characterized in that, include: A first piezoelectric layer group is formed, the first piezoelectric layer group including an organic piezoelectric thin film and a first electrode layer stacked with the organic piezoelectric thin film; A second piezoelectric layer group is formed, which is stacked with the first piezoelectric layer group. The second piezoelectric layer group includes a piezoelectric ceramic and a second electrode layer stacked with the piezoelectric ceramic to obtain a piezoelectric module. The formation of the first piezoelectric layer group includes: Obtain organic piezoelectric thin films; The first electrode layer is formed on two opposing surfaces of the organic piezoelectric thin film; The formation of the second piezoelectric layer group includes: Obtaining piezoelectric ceramics; The second electrode layer is formed on two opposing surfaces of the piezoelectric ceramic. A glue layer is coated on the surface of any of the first electrode layers and / or any of the second electrode layers; The first electrode layer and the second electrode layer are bonded together.

11. The method for preparing a piezoelectric module according to claim 10, characterized in that, When the first electrode layer and the second electrode layer coated with the adhesive layer have the same polarity, the adhesive layer includes a conductive adhesive layer or an insulating adhesive layer; When the first electrode layer and the second electrode layer coated with the adhesive layer have different polarities, the adhesive layer includes an insulating adhesive layer.

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