A treatment method for effectively inhibiting surface oxidation of bonding copper wire

Abstract

A treatment method for effectively inhibiting the surface oxidation of bonding copper wire belongs to the field of bonding copper wire. The specific steps are: weighing an appropriate amount of organic corrosion inhibitor, measuring ultrapure water, configuring a solution with a concentration of 0.05 wt%~0.5 wt%, and fully stirring; weighing an appropriate amount of rare earth inorganic salt, measuring ultrapure water, configuring a solution with a concentration of 0.2 wt%~0.4 wt%, and fully stirring; the bonding copper wire passes through the organic corrosion inhibitor solution, forming a uniform film on the surface, and air-drying; the air-dried bonding copper wire passes through the rare earth inorganic salt solution, air-drying, and a uniform organic-inorganic composite corrosion inhibition film is formed on the surface, which effectively inhibits oxidation.

Description

Technical Field

[0001] The invention belongs to the technical field of bonding copper wires, and in particular relates to a treatment method for effectively inhibiting surface oxidation of bonding copper wires. Background Art

[0002] As the inner lead for packaging, bonding wire is one of the essential basic raw materials for integrated circuits, discrete semiconductor devices and LED light source devices in the packaging manufacturing process. As the welding lead between the chip and the bracket, it undertakes the key electrical connection function between the chip and the outside world. The earliest developed and most commonly used bonding gold wire has excellent electrical, thermal conductivity, mechanical properties and excellent chemical stability. It can adapt to different bonding models and bonding processes to prepare products of different grades and characteristics. It is mainly used in various semiconductor devices such as transistors, integrated circuits, and large-scale integrated circuits. However, since the price of gold began to rise sharply in 2007, and the price fluctuated greatly in the short term, most packaging companies have begun to use other materials to replace gold wires, or reduce the amount of gold from the perspective of cost and stable supply channels. With the development of packaging technology and the expansion of application fields, the material of bonding wire has developed from a single material to gold, silver, copper, and aluminum related composite materials. It has become an inevitable trend to study bonding copper wires with excellent electrical and thermal conductivity, low cost, and good stability to replace bonding gold wires and bonding silver wires. Although bonding copper wire has the above advantages, it also has some shortcomings. There are still defects such as oxidation that is difficult to control and prevent during the drawing process. In particular, the oxidation phenomenon during the drawing process will affect the stability and yield of the subsequent palladium plating process and packaging process. Summary of the invention

[0003] The present invention aims to provide a treatment method for effectively inhibiting the surface oxidation of bonding copper wires. The preparation method comprises the following steps:

[0004] (1) Weigh an appropriate amount of organic corrosion inhibitor and ultrapure water to prepare a solution with a concentration of 0.05 wt%~0.5 wt%, and stir thoroughly;

[0005] (2) Weigh an appropriate amount of rare earth inorganic salt and ultrapure water to prepare a solution with a concentration of 0.2 wt% to 0.4 wt%, and stir thoroughly;

[0006] (3) The bonding copper wire passes through an organic corrosion inhibitor solution to form a uniform film on the surface and then air-dry;

[0007] (4) The air-dried bonding copper wire passes through a rare earth inorganic salt solution and is air-dried to form a uniform organic-inorganic composite corrosion inhibition film on the surface;

[0008] In the present invention, the organic corrosion inhibitor described in step (1) is one of benzotriazole (BTA), sodium carboxymethyl cellulose (CMC), and sodium ethylenediaminetetraacetate (EDTA); the rare earth inorganic salt in step (2) is Ce(NO3)3•6H2O or La(NO3)3•6H2O, and the stirring method is magnetic stirring or ultrasonic stirring.

[0009] The present invention has the following beneficial effects:

[0010] After being treated by the method, the surface of the bonding copper wire is smooth, uniform and dense, and has a good effect of inhibiting oxidation. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] Figure 1 is the SEM morphology of the surface composite film (0.4 wt% BTA + 0.3 wt% Ce(NO3)3•6H2O) of Example 1;

[0012] Figure 2 is the SEM morphology of the surface composite film (0.2 wt% CMC + 0.3 wt% Ce(NO3)3•6H2O) of Example 2;

[0013] Figure 3 This is the SEM morphology of the surface composite film of Example 3 (0.3 wt% EDTA+0.3 wt% Ce(NO3)3•6H2O). DETAILED DESCRIPTION

[0014] Implementation Case 1:

[0015] Weigh an appropriate amount of BTA and ultrapure water to prepare a solution with a concentration of 0.4 wt%, and stir thoroughly; weigh an appropriate amount of Ce(NO3)3•6H2O and ultrapure water to prepare a solution with a concentration of 0.3 wt%, and stir thoroughly; the bonding copper wire passes through the organic corrosion inhibitor BTA solution to form a uniform film on the surface, and then air-dry; the air-dried bonding copper wire passes through the Ce(NO3)3•6H2O solution, air-dry, and an organic-inorganic composite corrosion inhibition film is formed on the surface, which effectively inhibits oxidation.

[0016] Implementation Case 2:

[0017] Weigh an appropriate amount of CMC and ultrapure water to prepare a solution with a concentration of 0.2 wt%, and stir thoroughly; weigh an appropriate amount of Ce(NO3)3•6H2O and ultrapure water to prepare a solution with a concentration of 0.3 wt%, and stir thoroughly; the bonding copper wire passes through the organic corrosion inhibitor CMC solution to form a uniform film on the surface and air-dry; the air-dried bonding copper wire passes through the Ce(NO3)3•6H2O solution and air-dry to form an organic-inorganic composite corrosion inhibition film on the surface, which effectively inhibits oxidation.

[0018] Implementation Case 3:

[0019] Weigh an appropriate amount of EDTA, measure ultrapure water, prepare a solution with a concentration of 0.3 wt%, and stir thoroughly; weigh an appropriate amount of Ce(NO3)3•6H2O, measure ultrapure water, prepare a solution with a concentration of 0.3 wt%, and stir thoroughly; the bonding copper wire passes through the organic corrosion inhibitor EDTA solution to form a uniform film on the surface, and then air-dry; the air-dried bonding copper wire passes through the Ce(NO3)3•6H2O solution, air-dry, and an organic-inorganic composite corrosion inhibition film is formed on the surface, which effectively inhibits oxidation.

[0020] Implementation Case 4:

[0021] Weigh an appropriate amount of CMC and ultrapure water to prepare a solution with a concentration of 0.05 wt%, and stir thoroughly; weigh an appropriate amount of La(NO3)3•6H2O and ultrapure water to prepare a solution with a concentration of 0.4 wt%, and stir thoroughly; the bonding copper wire passes through the organic corrosion inhibitor CMC solution to form a uniform film on the surface and air-dry; the air-dried bonding copper wire passes through the La(NO3)3•6H2O solution and air-dry to form an organic-inorganic composite corrosion inhibition film on the surface, which effectively inhibits oxidation.

[0022] Implementation Case 5:

[0023] Weigh an appropriate amount of BTA and ultrapure water to prepare a solution with a concentration of 0.5 wt%, and stir thoroughly; weigh an appropriate amount of La(NO3)3•6H2O and ultrapure water to prepare a solution with a concentration of 0.2 wt%, and stir thoroughly; the bonding copper wire passes through the organic corrosion inhibitor BTA solution to form a uniform film on the surface, and then air-dry; the air-dried bonding copper wire passes through the La(NO3)3•6H2O solution, air-dry, and an organic-inorganic composite corrosion inhibition film is formed on the surface, which effectively inhibits oxidation.

[0024] Implementation Case 6:

[0025] Weigh an appropriate amount of EDTA, measure ultrapure water, prepare a solution with a concentration of 0.3 wt%, and stir thoroughly; weigh an appropriate amount of La(NO3)3•6H2O, measure ultrapure water, prepare a solution with a concentration of 0.3 wt%, and stir thoroughly; the bonding copper wire passes through the organic corrosion inhibitor EDTA solution to form a uniform film on the surface, and then air-dry; the air-dried bonding copper wire passes through the La(NO3)3•6H2O solution, air-dry, and an organic-inorganic composite corrosion inhibition film is formed on the surface, which effectively inhibits oxidation.

Claims

1. A treatment method for effectively inhibiting the oxidation of the bonding copper wire surface, characterized in that The specific steps are as follows: 1) Weigh an appropriate amount of organic corrosion inhibitor and ultrapure water to prepare a solution with a concentration of 0.05 wt%~0.5 wt% and stir thoroughly; 2) Weigh an appropriate amount of rare earth inorganic salt and ultrapure water to prepare a solution with a concentration of 0.2 wt%~0.4 wt% and stir thoroughly; 3) The bonding copper wire passes through an organic corrosion inhibitor solution to form a uniform film on the surface and then air-dry; 4) The air-dried bonding copper wire passes through a rare earth inorganic salt solution and is air-dried to form a uniform organic-inorganic composite corrosion inhibition film on the surface; In the present invention, the organic corrosion inhibitor described in step (1) is one of benzotriazole (BTA), sodium carboxymethyl cellulose (CMC), and sodium ethylenediaminetetraacetate (EDTA); the rare earth inorganic salt in step (2) is Ce(NO3)3•6H2O or La(NO3)3•6H2O; and the stirring method is magnetic stirring or ultrasonic stirring.

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