Low resistance copper film glass and method of manufacturing the same

Abstract

The application discloses a low-resistance copper film glass and a manufacturing method thereof, which comprises a molybdenum metal film between a glass plate and a copper metal film, and a butadiene styrene rubber layer is adhered to the outside of the copper metal film through glue, an elastic capsule for storing alcohol is clamped between the butadiene styrene rubber layer and the copper metal film, the elastic capsule and a regulating box are communicated through a first hose, a second hose with a liquid feeding plug is communicated with the middle part of the regulating box, and a liquid receiving socket which is detachably communicated with the liquid feeding plug is arranged on a gas permeation groove of the butadiene styrene rubber layer. The molybdenum metal film is arranged to significantly optimize the adhesion and surface resistivity of the copper metal film, the butadiene styrene rubber layer is arranged to avoid the problem that the copper metal film is easily broken due to external force impact, and the alcohol is sent to the inside of the butadiene styrene rubber layer through the elastic capsule, so that the glue loses the adhesion, and the butadiene styrene rubber layer is convenient for being torn off by the staff.

Description

Technical Field

[0001] The present invention relates to the technical field of glass coating, in particular to a low-resistance copper film glass and a manufacturing method thereof. Background Art

[0002] Direct brazing of metallized glass to metal is already widely used. This method typically involves first depositing a thin metal film on the glass surface through various coating techniques, such as vapor deposition, magnetron sputtering, solution spin coating, and vacuum evaporation, to achieve metallization. The glass is then directly brazed to the metal plate. This thin metal film not only improves the wettability of the brazing material on the glass surface but also promotes interfacial reactions, facilitating the formation of reliable and stable joints. Vacuum sputtering coating technology, due to its high target temperature, is particularly suitable for preparing high-melting-point, high-purity metal and dielectric films.

[0003] At present, glass copper plating is more and more widely used in circuit board etching circuits, but the low bonding strength of the copper layer is a major factor restricting its application. The existing glass copper plating method mainly vacuum sputters titanium or nickel as a transition layer, and then performs magnetron sputtering copper plating. The main defect is that the bonding force formed between titanium and the glass surface is relatively weak, which makes the copper film layer have less bonding strength and easy to peel off. The easy peeling of the copper film layer also leads to the problem of unstable and large surface resistance. In addition, a layer of tape is affixed to the low-resistance copper film glass for protection to prevent the glass and its film layer from falling off and cracking due to external impact and vibration during storage and transportation. However, the subsequent process of tearing off the tape and scraping off the glue is time-consuming and labor-intensive, and can easily damage the surface film layer of the glass. Summary of the Invention

[0004] The object of the present invention is to provide a low-resistance copper film glass and a method for manufacturing the same, so as to solve the problems raised in the above background technology.

[0005] To achieve the above object, the present invention provides the following technical solutions:

[0006] A low-resistance copper film glass comprises a glass plate and a copper metal film, wherein the glass plate and the copper metal film are fixedly adhered by a molybdenum metal film, and a protective mechanism is provided outside the copper metal film, wherein the protective mechanism comprises a styrene-butadiene rubber layer covering the outside of the copper metal film, and the styrene-butadiene rubber layer and the copper metal film are adhered by glue that loses its adhesion under the action of alcohol, and an elastic capsule for storing alcohol is sandwiched between the styrene-butadiene rubber layer and the copper metal film, an adjustment box is provided outside the styrene-butadiene rubber layer, and one end of the adjustment box is connected to the elastic capsule by a first hose, and a liquid baffle is provided in the adjustment box which approaches or moves away from the first hose when pulled by a threaded pull rod, and a threaded hole is provided at the other end of the adjustment box for the threaded pull rod to threadably engage and extend, and a touch pressure switch that is squeezed and engaged with the liquid baffle is fixedly provided on the inner side of one end of the adjustment box having the threaded hole;

[0007] The touch pressure switch signal is connected with a bidirectional direct current power supply for supplying power to the semiconductor assembly, and the semiconductor assembly comprises a first semiconductor abutting against the adjusting box, a second semiconductor away from the adjusting box, and an electrical connector electrically connecting the first semiconductor and the second semiconductor, and the touch pressure switch is pressed to switch the first semiconductor from refrigeration to heating, a second hose is communicated with the middle part of the adjusting box, and a liquid feeding plug is communicated with the end of the second hose away from the adjusting box, a gas permeation groove extending towards the elastic bag and penetrating through the SBR layer is formed in the outer wall of the SBR layer, and a liquid receiving socket detachably connected with the liquid feeding plug is fixedly connected with the outer wall of the SBR layer.

[0008] Preferably, the liquid blocking plate is a disc abutting against the inner wall of the adjusting box, and the threaded pull rod is fixedly connected with the center of the liquid blocking plate.

[0009] Preferably, the end of the adjusting box with the threaded hole is also provided with a communication port penetrating through the end wall of the adjusting box.

[0010] Preferably, the outer wall of the SBR layer is fixedly connected with a fixed socket detachably connected with the liquid feeding plug.

[0011] Preferably, the end of the threaded pull rod extending out of the adjusting box is fixedly connected with a rotating handle.

[0012] Preferably, the SBR layer extends to the side of the glass plate away from the molybdenum metal film, and a gap is left between the ends of the SBR layer extending to the side of the glass plate away from the molybdenum metal film.

[0013] Preferably, the first semiconductor, the electrical connector and the second semiconductor are annular bodies electrically connected in sequence from inside to outside, and the inner wall of the first semiconductor is fixedly adhered to the outer wall of the adjusting box.

[0014] A manufacturing method for manufacturing the low-resistance copper film glass comprises the following steps:

[0015] S101, processing the glass plate: acid etching the glass plate, and alkali washing and drying the acid-etched glass plate;

[0016] S102, sputtering a molybdenum metal layer: in a sputtering plating equipment, using argon as a gas source and a molybdenum target as a target source, sputtering a molybdenum metal film on the glass plate;

[0017] S103, sputtering a copper metal layer: in a sputtering plating equipment, using argon as a gas source and a copper target as a target source, sputtering a copper metal film on the molybdenum metal film;

[0018] S104, externally attaching a protection mechanism to the copper metal film.

[0019] Preferably, the acid etching of the glass plate, and alkali washing and drying of the acid-etched glass plate specifically include the following steps:

[0020] 1) Acid etching: Use plasma water to clean the glass plate, and then send the cleaned glass plate into a strong acid solution for acid etching, and then send the acid-etched glass plate into the AP machine for ozone cleaning;

[0021] 2) Alkali cleaning: using a strong alkaline solution and an alkali-resistant brush to perform alkaline cleaning on the glass plate treated in step 1);

[0022] 3) Drying: The glass plate treated in step 2) is sent to a UV oven for drying.

[0023] Preferably, the alkali cleaning of the glass plate treated in step 1) using a strong alkali solution and an alkali-resistant brush specifically includes:

[0024] 201) placing the glass plate in a potassium hydroxide aqueous solution for a first alkali cleaning, and using an alkali-resistant brush to evenly scrape the surface of the glass plate. After the first alkali cleaning is completed, placing the glass plate in plasma water for bubbling cleaning and drying;

[0025] 202) The glass plate treated in step 201) is placed with the coated surface facing upward, and an alkali-resistant mesh film is attached to the middle of the coated surface of the glass plate, so that a plurality of exposed portions and blocking portions are formed on the coated surface of the glass plate. An alkali-resistant brush is dipped in a potassium hydroxide aqueous solution and the potassium hydroxide aqueous solution is evenly brushed on the plurality of exposed portions to perform a second alkaline cleaning. After the second alkaline cleaning is completed, the alkali-resistant mesh film is removed, and the glass plate is placed in plasma water for bubbling cleaning and drying.

[0026] 203) The glass plate treated in step 202) is placed with the coated surface facing upward, an alkali-resistant mesh film is again attached to the middle of the coated surface of the glass plate, and an alkali-resistant cover film covering the entire coated surface of the glass plate is attached to the alkali-resistant mesh film. Cracks are scratched in the overlapping area of ​​the alkali-resistant mesh film and the alkali-resistant cover film to expose the coated surface of the glass plate. An alkali-resistant brush is dipped in a potassium hydroxide aqueous solution and the potassium hydroxide aqueous solution is evenly brushed on the multiple cracks to perform a third alkaline cleaning. After the third alkaline cleaning is completed, the alkali-resistant mesh film and the alkali-resistant cover film are torn off, and the glass plate is placed in plasma water for bubbling cleaning and drying.

[0027] 204) The glass plate treated in step 203) is placed with the coated surface facing upward, and an alkali-resistant outer frame film is attached to the edge of the coated surface of the glass plate. An alkali-resistant brush is dipped in a potassium hydroxide aqueous solution and the potassium hydroxide aqueous solution is evenly brushed on the inner side of the alkali-resistant outer frame film to perform a fourth alkali cleaning. After the fourth alkali cleaning is completed, a cutting tool is used to cut out the glass plate not covered by the alkali-resistant outer frame film, and the cut glass plate is placed in plasma water for bubbling cleaning;

[0028] The concentration of the potassium hydroxide aqueous solution is 0.5-2%, the second alkali cleaning time is the same as the third alkali cleaning time, and the first alkali cleaning time, the second alkali cleaning time, and the fourth alkali cleaning time decrease in sequence.

[0029] Compared with the prior art, the present invention has the following beneficial effects:

[0030] The low-resistance copper film glass and its manufacturing method of the present invention significantly optimize the adhesion and surface resistivity of the copper metal film by adding a molybdenum metal film between the glass plate and the copper metal film, and avoid the problem of the copper metal film being easily detached and broken due to external force impact by providing a styrene-butadiene rubber layer. In addition, the glue loses its viscosity by transporting alcohol to the inside of the styrene-butadiene rubber layer through an elastic bag, making it easier for workers to tear off the styrene-butadiene rubber layer. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] Figure 1 is a three-dimensional schematic diagram of the glass plate and its coating structure in the present invention;

[0032] Figure 2 Schematic cross-sectional view of the protective mechanism attached to the copper metal film of the present invention;

[0033] Figure 3 for Figure 2 An enlarged schematic diagram of the middle elastic sac and its connecting structure;

[0034] Figure 4 for Figure 3 An enlarged schematic diagram of the middle regulating box and its connection structure;

[0035] Figure 5 for Figure 3 Schematic diagram of the state of the elastic sac discharging alcohol;

[0036] Figure 6 for Figure 5 Schematic diagram of the connection between the middle liquid delivery plug and the liquid receiving socket;

[0037] Figure 7 This is a schematic diagram of the styrene-butadiene rubber layer extending to the lower side of the glass plate in the present invention.

[0038] Figure numerals: 1 glass plate, 2 copper metal film, 3 molybdenum metal film, 4 styrene-butadiene rubber layer, 41 breathable groove, 5 elastic bag, 6 first hose, 7 adjustment box, 71 communication port, 8 liquid baffle, 9 threaded pull rod, 10 touch switch, 11 first semiconductor, 12 second semiconductor, 13 electrical connector, 14 second hose, 15 liquid delivery plug, 16 liquid connection socket, 17 fixed socket, 18 rotating handle. DETAILED DESCRIPTION

[0039] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0040] See also Figure 1-7 , the present invention provides a technical solution:

[0041] A low-resistance copper film glass comprises a glass plate 1 and a copper metal film 2, wherein the glass plate 1 and the copper metal film 2 are fixedly bonded by a molybdenum metal film 3. Specifically, a layer of molybdenum metal film 3 is first sputtered on the upper end surface of the glass plate 1, and then a layer of copper metal film 2 is sputtered on the upper end surface of the molybdenum metal film 3. A protective mechanism is provided on the outside of the copper metal film 2, and the protective mechanism comprises a styrene-butadiene rubber layer 4 covering the outside of the copper metal film 2, that is, the styrene-butadiene rubber layer 4 covers the upper end surface of the copper metal film 2. In this embodiment, the thickness of the styrene-butadiene rubber layer 4 is 3 cm, so that the styrene-butadiene rubber layer 4 protects the copper metal film 2, thereby avoiding the problem of the copper metal film 2 being damaged by external force during storage and transportation, and the arrangement of the styrene-butadiene rubber layer 4 is also To prevent the copper metal film 2 from being corroded during storage, the styrene-butadiene rubber layer 4 and the copper metal film 2 are bonded together by glue that loses its adhesiveness under the action of alcohol. The glue can be transparent glue or white latex, which loses its adhesiveness under the action of alcohol. An elastic capsule 5 with alcohol stored inside is sandwiched between the styrene-butadiene rubber layer 4 and the copper metal film 2. The elastic capsule 5 filled with alcohol improves the shock-absorbing and buffering effect of the styrene-butadiene rubber layer 4, thereby further improving the protection effect of the copper metal film 2. When the external temperature is high, the alcohol vaporizes when heated and absorbs the heat accumulated in the styrene-butadiene rubber layer 4, thereby avoiding the problem that the styrene-butadiene rubber layer 4 melts due to excessive heat accumulation, thereby causing the styrene-butadiene rubber layer 4 to fall off from the copper metal film 2.

[0042] A regulating box 7 corresponding to the elastic bag 5 is provided above the styrene-butadiene rubber layer 4, and the lower end of the regulating box 7 is communicated with the elastic bag 5 through a first hose 6. Specifically, the lower end of the first hose 6 is fixedly connected to the elastic bag 5 and extends into the elastic bag 5. The upper end of the first hose 6 slides upward through the styrene-butadiene rubber layer 4 and is fixedly connected to the lower end of the regulating box 7. A liquid baffle 8 is provided in the regulating box 7, which approaches or moves away from the first hose 6 when pulled by the threaded pull rod 9, and a threaded hole is provided at the upper end of the regulating box 7 for the threaded pull rod 9 to threadably cooperate with the threaded pull rod 9 to extend. The threaded pull rod 9 remains stable under the self-locking action of the thread with the threaded hole, thereby keeping the liquid baffle 8 stable. The cam 8 is fixedly connected to the inner wall of the regulating box 7 and the threaded pull rod 9 is fixedly connected to the center of the cam 8. The cam 8 can be spirally moved upward or downward by rotating the threaded pull rod 9. Of course, the cam 8 is a square plate that fits the inner wall of the regulating box 7, and the lower end of the threaded pull rod 9 is rotatably connected to the cam 8. It is also possible to set it up so that the threaded pull rod 9 extends out of the upper end of the regulating box 7 and is fixedly connected to the rotating handle 18. The setting of the rotating handle 18 makes it easy for the staff to rotate the threaded pull rod 9, so that the threaded pull rod 9 drives the liquid baffle 8 to move up and down together.

[0043] The inner side of one end of the regulating box 7 is provided with a threaded hole, and a touch pressure switch 10 is fixedly provided with a pressure switch 10 that is squeezed and matched with the liquid baffle 8. In this embodiment, the pressure switch 10 is fixedly provided by being fixedly connected to the inner wall of the upper end of the regulating box 7, and the pressure portion of the pressure switch 10 is arranged downward. The middle of the regulating box 7 is connected with a second hose 14. During the storage and transportation of the low-resistance copper-film glass, the pressure switch 8 stays below the connection between the regulating box 7 and the second hose 14 under the self-locking action of the threaded pull rod 9. The pressure switch 8 blocks the connection between the two and prevents the alcohol in the elastic bag 5 from entering the second hose 14. At this time, the pressure switch 8 is located below the pressure switch 10 and cannot press the pressure switch 10. When the styrene-butadiene rubber layer 4 needs to be removed due to the use of low-resistance coated glass, the threaded pull rod 9 is rotated so that the threaded pull rod 9 drives the pressure switch 8 to move upward together until the pressure switch 8 moves to the top of the connection between the regulating box 7 and the second hose and presses on the pressure portion of the pressure switch 10, so that the alcohol in the elastic bag 5 enters the second hose 14 through the first hose 6 and the regulating box 7.

[0044] The touch pressure switch 10 is connected with a bidirectional direct current power supply for supplying power to the semiconductor assembly. The touch pressure switch 10 is a low-power remote control switch with a model number of FS50+JN1Q, and the bidirectional direct current power supply is a positive and negative voltage adjustable control power module with a model number of HRA12250D-6W. One end of the adjusting box 7, which is provided with a threaded hole, is also provided with a communication port 71 penetrating the end wall of the adjusting box 7. The communication port 71 is arranged to facilitate signal transmission. When the liquid blocking plate 8 does not press the touch pressure switch 10 upward, the touch pressure switch 10 does not send a signal to the bidirectional direct current power supply, so that the bidirectional direct current power supply outputs a forward current. When the liquid blocking plate 8 presses the touch pressure switch 10 upward, the touch pressure switch 10 is energized and sends a signal to the bidirectional direct current power supply under external pressure, so that the bidirectional direct current power supply outputs a reverse current. The semiconductor assembly includes a first semiconductor 11 abutting against the outside of the adjusting box 7, a second semiconductor 12 away from the adjusting box 7, and an electrical connector 13 electrically connecting the two. During the storage and transportation of the low-resistance copper film glass, the liquid blocking plate 8 does not press the touch pressure switch 10, and the bidirectional direct current power supply outputs a forward current, so that the second semiconductor 12 emits heat, the first semiconductor 12 emits cold and cools the adjusting box 7, the alcohol in the elastic capsule 5 is vaporized by heat and enters the adjusting box 7 through the first soft tube 6, the adjusting box 7 cooled by the first semiconductor 12 absorbs the heat released by the alcohol gas, and the alcohol gas is liquefied again and flows back to the elastic capsule 5. The cold alcohol flowing back to the elastic capsule 5 absorbs the heat accumulated in the butadiene styrene rubber layer 4 again, thereby avoiding the problem that the butadiene styrene rubber layer 4 is melted by the excessive heat accumulated in the butadiene styrene rubber layer 4, and then the butadiene styrene rubber layer 4 is detached from the copper metal film 2.

[0045] The end of the second hose 14 away from the regulating box 7 is connected to a liquid feeding plug 15, and the outer wall of the styrene-butadiene rubber layer 4 is provided with a ventilation groove 41 extending toward the elastic bag 5 and penetrating the styrene-butadiene rubber layer 4. The outer wall of the styrene-butadiene rubber layer 4 is fixedly connected with a liquid receiving socket 16 which is detachably connected to the liquid feeding plug 15, and the liquid receiving socket 16 is wrapped on the outer side of the end of the opening of the ventilation groove 41 on the outer wall of the styrene-butadiene rubber layer 4. During the storage and transportation of the low-resistance copper-film glass, the liquid feeding plug 15 is not inserted into the liquid receiving socket 16, and the liquid receiving socket 16 is exposed to the external environment, so that the air from the external environment enters the ventilation groove 41 and takes out the heat in the styrene-butadiene rubber layer 4, thereby improving the heat dissipation effect of the styrene-butadiene rubber layer 4, and the more heat accumulated in the styrene-butadiene rubber layer 4, the greater the vaporization degree of the alcohol in the elastic bag 5, the greater the expansion volume of the elastic bag 5, and the elastic bag 5 expands and enlarges the inner diameter gap of the ventilation groove 41, thereby further improving the heat exchange effect between the styrene-butadiene rubber layer 4 and the outside world. When it is necessary to remove the styrene-butadiene rubber layer 4, the liquid feeding plug 15 is inserted into the liquid receiving socket 16, and then the liquid baffle 8 is pulled upward by the threaded pull rod 9, so that the liquid baffle 8 no longer blocks the connection between the regulating box 7 and the second hose 14, and is pressed on the touch-pressure part of the touch-pressure switch 10. The alcohol in the elastic bag 5 enters the second hose 14 through the first hose 6 and the regulating box 7 under the pressure of the styrene-butadiene rubber layer 4, and enters the inner side of the styrene-butadiene rubber layer 4 through the liquid feeding plug 15, the liquid receiving socket 16 and the air-permeable groove 41. The alcohol reacts with the glue on the inner wall of the styrene-butadiene rubber layer 4, causing the glue to lose its viscosity, thereby making it convenient for the staff to tear off the styrene-butadiene rubber layer 4. In addition, the liquid baffle 8 presses the touch-pressure switch 10 so that the bidirectional DC power supply outputs a reverse current, thereby causing the first semiconductor 11 to heat the alcohol passing through the regulating box 7. The heated alcohol enters the inner side of the styrene-butadiene rubber layer 4 and reacts with the glue, further reducing the adhesion performance of the glue, thereby making it further convenient for the staff to tear off the styrene-butadiene rubber layer 4.

[0046] Furthermore, the outer wall of the styrene-butadiene rubber layer 4 is fixedly connected to a fixed socket 17 that is detachably connected to the liquid feeding plug 15. When the liquid baffle 8 blocks the connection between the regulating box 7 and the second hose 14, the liquid feeding plug 15 is inserted into the fixed socket 17 for fixation, thereby preventing the second hose 14 from shaking due to lack of fixation.

[0047] Furthermore, the styrene-butadiene rubber layer 4 extends to the side of the glass plate 1 away from the molybdenum metal film 3, so that the styrene-butadiene rubber layer 4 also protects the back of the glass plate 1, thereby improving the safety of the low-resistance copper film glass during storage and transportation. A gap is left between the ends of the styrene-butadiene rubber layer 4 extending to the side of the glass plate 1 away from the molybdenum metal film 3, which makes it convenient for staff to tear off the styrene-butadiene rubber layer 4.

[0048] Furthermore, the first semiconductor 11, the electrical connector 13 and the second semiconductor 12 are a ring body electrically connected in sequence from the inside to the outside, and the inner wall of the first semiconductor 11 is fixedly adhered to the outer wall of the regulating box 7. By setting the first semiconductor 11 into a ring structure attached to the outer wall of the regulating box 7, the cooling or heating effect of the first semiconductor 11 on the regulating box 7 is further improved.

[0049] Working Principle: During the storage and transportation of low-resistance copper-film glass, the liquid baffle 8 does not press the touch switch 10, the bidirectional DC power supply outputs a forward current, the first semiconductor 12 generates cold energy and cools the regulating box 7, the alcohol in the elastic capsule 5 evaporates due to the heat and enters the regulating box 7 through the first hose 6. The regulating box 7, cooled by the first semiconductor 12, absorbs the heat released by the alcohol gas, which is then liquefied again and flows back down into the elastic capsule 5. The cold alcohol flowing back into the elastic capsule 5 again absorbs the heat accumulated in the styrene-butadiene rubber layer 4.

[0050] When the styrene-butadiene rubber layer 4 needs to be removed due to the use of low-resistance coated glass, the liquid feeding plug 15 is inserted into the liquid receiving socket 16, and then the liquid baffle 8 is pulled upward by the threaded pull rod 9, so that the liquid baffle 8 no longer blocks the connection between the regulating box 7 and the second hose 14, and is pressed on the touch-pressure part of the touch-pressure switch 10. Under the pressure of the styrene-butadiene rubber layer 4, the alcohol in the elastic bag 5 passes through the first hose 6 and the regulating box 7 into the second hose 14, the liquid feeding plug 15, the liquid receiving socket 16 and the air-permeable groove 41 to enter the inner side of the styrene-butadiene rubber layer 4, and the liquid baffle 8 presses the touch-pressure switch 10 so that the bidirectional DC power supply outputs a reverse current, thereby causing the first semiconductor 11 to heat the alcohol passing through the regulating box 7. The heated alcohol enters the inner side of the styrene-butadiene rubber layer 4 and reacts with the glue, reducing the adhesion performance of the glue, making it easier for the staff to tear off the styrene-butadiene rubber layer 4.

[0051] Regarding how to manufacture low-resistance copper-film glass with low resistance and high adhesion, this application provides five embodiments, as follows:

[0052] Example 1:

[0053] A method for manufacturing low-resistance copper-film glass comprises the following steps: first, placing a glass plate 1 in plasma water for bubbling cleaning for 3 minutes, then drying the cleaned glass plate and placing it in a sputtering coating apparatus, wherein the glass plate 1 is made of soda-lime glass, the internal temperature of the coating apparatus is 80 degrees Celsius, and the argon gas flow rate is 30 standard milliliters per minute. First, a molybdenum metal film 3 is sputtered on the glass plate 1 using a molybdenum target as a target source, and then a copper metal film 2 with a thickness of 3 microns is sputtered on the molybdenum metal film using a copper target as a target source;

[0054] To determine the optimal sputtering thickness of the molybdenum metal film 3, seven embodiments with different thicknesses of the molybdenum metal film, i.e. 0.01 micron, 0.02 micron, 0.03 micron, 0.04 micron, 0.05 micron, 0.06 micron and 0.07 micron, and one comparative example without sputtering the molybdenum metal film are provided, and then the adhesion of the copper metal film sputtered on the molybdenum metal film with different thicknesses is tested by using 3M tape, as follows:

[0055] Table 1: Influence of thickness of molybdenum metal film on adhesion of copper metal film

[0056] Molybdenum metal film thickness (micrometers) 0 0.01 0.02 0.03 0.04 0.05 0.06 0.07 The percentage of copper metal film falling off when attached with 3M tape 40％ 15％ 10％ 0％ 5％ 10％ 10％ 20％

[0057] It can be seen that the adhesion of the copper metal film 2 is significantly improved by adding the molybdenum metal film 3 between the copper metal film and the glass plate 1, and the thickness of the molybdenum metal film 3 is preferably 0.01-0.07 micron, and most preferably 0.03 micron.

[0058] Example Two:

[0059] On the basis of the most preferred embodiment of Example One, the amount of argon gas introduced is optimized in Example Two. To determine the optimal amount of argon gas introduced, six embodiments with the amount of argon gas introduced being 50 standard cubic centimeters per minute, 70 standard cubic centimeters per minute, 80 standard cubic centimeters per minute, 90 standard cubic centimeters per minute, 100 standard cubic centimeters per minute and 110 standard cubic centimeters per minute respectively are provided under the same conditions of the molybdenum metal film 3 with a sputtering thickness of 0.03 micron, and the most preferred embodiment of the molybdenum metal film 3 with a thickness of 0.03 micron and the amount of argon gas introduced being 30 standard cubic centimeters per minute in Example One is taken as a comparative example, and then the copper metal films obtained in the embodiments are tested by using the grid test, wherein the embodiment with the amount of argon gas introduced being 80 standard cubic centimeters per minute can achieve the effect of 2B except that the demolding is serious at the position area of 10 cm above and below the copper metal film 2, and then the surface resistivity of the copper metal film 2 in the embodiments is analyzed and compared, as follows:

[0060] Table 2: Influence of amount of argon gas introduced on surface resistivity of copper metal film

[0061] Argon gas flow rate (standard ml per minute) 30 50 70 80 90 100 110 Surface resistivity of copper metal film (ohm per square meter) 0.15 0.13 0.13 0.10 0.14 0.15 0.18

[0062] It can be seen that the adhesion and surface resistivity of the copper metal film 2 can be significantly improved by changing the amount of argon gas introduced, and the preferred amount of argon gas introduced in this embodiment is 50-100 standard cubic centimeters per minute, and most preferably 80 standard cubic centimeters per minute.

[0063] Example Three:

[0064] Example 3 Based on the most preferred embodiment of Example 2, the copper target structure is optimized, that is, the baffles at the upper and lower positions of the copper target are shortened and then placed in the sputtering coating equipment as a target source. Through research and analysis, it is found that the baffles at the upper and lower positions of the copper target are too long, which seriously affects the bombardment of the target material by the injected ions under the action of the electric field, making it difficult for the neutral atoms or molecules on the surface of the target material to obtain sufficient kinetic energy to escape from the target surface and deposit on the molybdenum metal film to form a thin film. Therefore, in this embodiment, the baffles at the upper and lower positions of the copper metal film are shortened, and three implementation methods of shortening the baffle by one-third, shortening the baffle by one-half, and shortening the baffle by two-thirds are given. The most preferred embodiment of Example 2 is used as a comparative example, and then the copper metal films obtained by each implementation method are subjected to a hundred-grid test and a surface resistivity test, as follows:

[0065] Table 3: Effect of the shortening of the baffles at the upper and lower positions of the copper target on the surface resistivity of the copper metal film

[0066] Shortening amount of baffles at upper and lower positions of copper target 0 1 / 3 1 / 2 2 / 3 Surface resistivity of copper metal film (ohm per square meter) 0.10 0.07 0.06 0.065 Copper metal film 100-grid test 1B 2B 2B 2B

[0067] It can be seen that after the baffles at the upper and lower positions of the copper target are shortened, the adhesion and surface resistivity of the copper metal film 2 in the 10 cm position area above and below can be significantly improved. In this embodiment, the shortening amount of the baffles at the upper and lower positions of the copper target is preferably 1 / 3-2 / 3, and most preferably 1 / 2.

[0068] Example 4:

[0069] Example 4 Based on the most preferred embodiment of Example 3, the heating temperature during the coating process is optimized. Different coating temperatures will affect the growth of copper during copper plating. Different deposited copper particle sizes will cause different surface roughness of the copper film, thereby affecting the surface resistivity and adhesion of the copper metal film. To determine the optimal heating temperature, this example provides six embodiments with heating temperatures of 100 degrees Celsius, 150 degrees Celsius, 200 degrees Celsius, 220 degrees Celsius, 230 degrees Celsius, and 250 degrees Celsius, respectively. The most preferred embodiment of Example 3 is used as a comparative example, and the surface resistivity of the copper metal films obtained in each embodiment is tested, as shown below.

[0070] Table 4: Effect of heating temperature on surface resistivity of copper metal film

[0071] Heating temperature (degrees Celsius) 80 100 150 200 220 230 250 Surface resistivity of copper metal film (ohm per square meter) 0.06 0.06 0.05 0.04 0.03 0.05 0.05

[0072] It can be seen that the surface resistivity of the copper metal film 2 can be significantly improved by changing the heating temperature. In this embodiment, the heating temperature is preferably 150-250 degrees Celsius, and in the embodiments where the heating temperature is 200, 220 and 230 degrees Celsius, the 100-grid test of the copper metal film 2 all achieves a 4B effect. Therefore, the heating temperature in this embodiment is more preferably 200-230 degrees Celsius, and most preferably 220 degrees Celsius.

[0073] Embodiment 5:

[0074] Example 5 optimizes the cleaning of the glass plate 1 based on Examples 1 to 4, thereby improving the adhesion of the subsequent molybdenum metal sputtering on the glass plate 1 and better achieving 4B after the copper metal film is 100 grids. Specifically, the glass plate 1 is acid-etched, and the acid-etched glass plate 1 is alkaline-washed and dried, including the following steps:

[0075] 1) Acid etching: The glass plate 1 is cleaned with plasma water to remove dust and dirt adhered to the surface of the glass plate 1, and the cleaned glass plate 1 is sent to a strong acid solution for acid etching. In this embodiment, the strong acid solution is a hydrofluoric acid solution with a concentration of 1-5%. The hydrofluoric acid solution is used to acid-etch the surface of the glass plate 1. The protruding sharp portions of the surface of the glass plate 1 have a larger surface area and adhere to more hydrofluoric acid solution. The hydrofluoric acid solution corrodes the protruding sharp portions of the surface of the glass plate 1, thereby improving the flatness of the surface of the glass plate 1, thereby improving the adhesion of subsequent platinum metal sputtering on the glass plate 1. The glass plate 1 after acid etching is then sent to an AP machine for ozone cleaning. The ozone cleaning is used to disinfect the surface of the glass plate 1 and decompose and remove organic matter on the surface of the glass plate 1, further improving the adhesion of subsequent platinum metal sputtering on the glass plate 1.

[0076] 2) Alkali washing: using a strong alkali solution and an alkali-resistant brush to perform alkali washing on the glass plate 1 treated in step 1), wherein the strong alkali solution is a potassium hydroxide aqueous solution with a concentration of 0.5-2%. The potassium hydroxide aqueous solution and the strong acid solution remaining on the glass plate 1 after acid etching undergo a neutralization reaction to form a soluble salt that separates from the glass plate 1, thereby avoiding the problem of residual strong acid solution on the glass plate 1. The potassium hydroxide aqueous solution corrodes the surface of the glass plate 1. The protruding sharp portions of the glass plate 1 have a larger surface area and are attached with more potassium hydroxide aqueous solution. The potassium hydroxide aqueous solution corrodes the protruding sharp portions of the glass plate 1, thereby further improving the flatness of the surface of the glass plate 1, thereby further improving the adhesion of subsequent molybdenum metal sputtering on the glass plate 1. During the alkali washing process, the alkali-resistant brush is used to rub and clean the surface of the glass plate 1, thereby brushing off dirt and reactants on the surface of the glass plate 1, thereby further improving the adhesion of subsequent molybdenum metal sputtering on the glass plate 1. The alkali-resistant brush is a PBT brush filament that is resistant to strong alkali;

[0077] 3) drying: the glass plate 1 treated in step 2) is sent into a UV furnace for drying, the glass plate 1 is treated by using the UV furnace drying mode, the ultraviolet rays of the UV furnace decompose the organic matter remained on the glass plate 1 while drying the glass plate 1, thereby improving the adhesion of the subsequent molybdenum metal sputtering on the glass plate 1;

[0078] Further, the alkali washing process specifically includes the following steps:

[0079] 201) the glass plate 1 is sent into a 0.5-2% potassium hydroxide aqueous solution for the first alkali cleaning, the first alkali cleaning time is 3 minutes, and an alkali-resistant brush is used to uniformly scratch the surface of the glass plate 1, so as to remove the strong acid solution remained on the glass plate 1, and to corrode and remove the protruding sharp parts on the surface of the glass plate 1 to improve the flatness of the glass plate 1, after the first alkali cleaning, the glass plate 1 is sent into the plasma water for bubbling cleaning for 1 minute and then dried;

[0080] 202) the glass plate 1 treated in step 201) is arranged with the film-coated surface upward, an alkali-resistant grid film made of PET is pasted in the middle of the film-coated surface of the glass plate 1, so that the film-coated surface of the glass plate 1 forms a plurality of exposed parts and blocked parts, the alkali-resistant brush is dipped in the 0.5-2% potassium hydroxide aqueous solution, and the potassium hydroxide aqueous solution is uniformly brushed on the plurality of exposed parts, so as to perform the second alkali cleaning, so that a plurality of grooves are formed in the middle of the glass plate 1, the second alkali cleaning time is 2 minutes, so as to avoid the problem that the depth of the grooves is too large and affects the subsequent sputtering of the molybdenum metal film, after the second alkali cleaning, the alkali-resistant grid film is torn off, and the glass plate 1 is sent into the plasma water for bubbling cleaning for 1 minute and then dried;

[0081] 203) The coated surface of the glass plate 1 treated in step 202) is placed upward, and an alkali-resistant mesh film is pasted again on the middle of the coated surface of the glass plate 1, and an alkali-resistant covering film covering the entire coated surface of the glass plate 1 is pasted on the alkali-resistant mesh film. Cracks are scratched in the overlapping area of ​​the alkali-resistant mesh film and the alkali-resistant covering film to expose the coated surface of the glass plate 1. An alkali-resistant brush is dipped in a potassium hydroxide aqueous solution with a concentration of 0.5-2%, and the potassium hydroxide aqueous solution is evenly brushed on multiple cracks to perform a third alkali cleaning, so that a connecting groove connecting adjacent grooves is formed in the middle of the glass plate 1. Through the coordinated implementation of steps 202) and 203), the glass plate 1 is cleaned. A plurality of adjacent grooves connected by connecting grooves are formed in the middle of the glass plate 1, thereby increasing the surface area of ​​the glass plate 1 and improving the adhesion of the subsequent molybdenum metal sputtering on the glass plate 1. The grooves and connecting grooves are formed step by step through steps 202) and 203). Compared with integral molding, the problem of the potassium hydroxide aqueous solution flowing when the potassium hydroxide aqueous solution is added is avoided. This also provides a favorable basis for the precise addition of the potassium hydroxide aqueous solution for alkaline cleaning. The third alkaline cleaning time is also 2 minutes. After the third alkaline cleaning is completed, the alkali-resistant mesh film and alkali-resistant cover film are torn off, and the glass plate 1 is placed in plasma water for bubbling cleaning for 1 minute and then dried.

[0082] 204) The coated surface of the glass plate 1 treated in step 203) is placed upward, and an alkali-resistant outer frame film is pasted on the edge of the coated surface of the glass plate 1. An alkali-resistant brush is dipped with a potassium hydroxide aqueous solution with a concentration of 0.5-2%, and the potassium hydroxide aqueous solution is evenly brushed on the inner side of the alkali-resistant outer frame film to perform the fourth alkali cleaning. By dripping potassium hydroxide aqueous solution on the coated surface area of ​​the glass plate 1 inside the alkali-resistant outer frame film, more potassium hydroxide aqueous solution is attached to the sharp edges of the grooves and connecting grooves. The potassium hydroxide aqueous solution corrodes the sharp edges of the grooves and connecting grooves, so that the edges of the grooves and connecting grooves have a smooth transition on the coated surface of the glass plate 1, thereby improving the adhesion of subsequent molybdenum metal sputtering on the glass plate 1. The fourth alkali cleaning time is 1 minute. After the fourth alkali cleaning is completed, a cutting tool is used to cut out the glass plate 1 not covered by the alkali-resistant outer frame film according to the required size of the coated glass plate 1, and the cut glass plate 1 is sent into plasma water for bubbling cleaning for 1 minute.

[0083] While embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions, and variations may be made to these embodiments without departing from the principles and spirit of the invention, and that the scope of the invention is defined by the appended claims and their equivalents.

Claims

1. A low-resistance copper film glass comprising a glass plate (1) and a copper metal film (2), characterized in that: The glass plate (1) and the copper metal film (2) are fixedly bonded by a molybdenum metal film (3), and a protective mechanism is provided outside the copper metal film (2), wherein the protective mechanism comprises a styrene-butadiene rubber layer (4) covering the outside of the copper metal film (2), and the styrene-butadiene rubber layer (4) and the copper metal film (2) are bonded by glue that loses its adhesiveness under the action of alcohol, and an elastic bag (5) containing alcohol is sandwiched between the styrene-butadiene rubber layer (4) and the copper metal film (2), and the styrene-butadiene rubber layer (4) and the copper metal film (2) are fixedly bonded by a molybdenum metal film (3), and a protective mechanism is provided outside the copper metal film (2), wherein the protective mechanism comprises a styrene-butadiene rubber layer (4) covering the outside of the copper metal film (2), and the styrene-butadiene rubber layer (4) and the copper metal film (2) are bonded by glue that loses its adhesiveness under the action of alcohol, and an elastic bag (5) containing alcohol is sandwiched between the styrene-butadiene rubber layer (4) and the copper metal film (2). An adjustment box (7) is provided outside the adhesive layer (4), and one end of the adjustment box (7) is connected to the elastic bag (5) through a first hose (6), and a liquid baffle (8) is provided in the adjustment box (7) and moves closer to or away from the first hose (6) when pulled by a threaded pull rod (9), and a threaded hole for threaded engagement with the threaded pull rod (9) is provided at the other end of the adjustment box (7), and a touch pressure switch (10) that is pressed and engaged with the liquid baffle (8) is fixedly provided on the inner side of one end of the adjustment box (7) where the threaded hole is provided; The touch-pressure switch (10) is signal-connected to a bidirectional DC power supply for supplying power to the semiconductor component, and the semiconductor component includes a first semiconductor (11) abutting against the outside of the regulating box (7), a second semiconductor (12) away from the regulating box (7), and an electrical connector (13) electrically connecting the two. When the touch-pressure switch (10) is pressed, the first semiconductor (11) switches from cooling to heating. A second hose (14) is connected to the middle of the regulating box (7), and one end of the second hose (14) away from the regulating box (7) is connected to a liquid supply plug (15). The outer wall of the styrene-butadiene rubber layer (4) is provided with a ventilation groove (41) extending toward the elastic bag (5) and penetrating the styrene-butadiene rubber layer (4). The outer wall of the styrene-butadiene rubber layer (4) is fixedly connected to a liquid receiving socket (16) that is detachably connected to the liquid supply plug (15), and the liquid receiving socket (16) is wrapped outside the end of the ventilation groove (41) opened on the outer wall of the styrene-butadiene rubber layer (4).

2. The low-resistance copper film glass according to claim 1, characterized in that: The liquid baffle (8) is a circular disc that fits closely with the inner wall of the regulating box (7), and the threaded pull rod (9) is fixedly connected to the center of the liquid baffle (8).

3. The low-resistance copper film glass according to claim 1, characterized in that: The end of the regulating box (7) where the threaded hole is provided is also provided with a communication port (71) that passes through the end wall of the regulating box (7).

4. The low-resistance copper film glass according to claim 1, wherein: The outer wall of the styrene-butadiene rubber layer (4) is fixedly connected with a fixed socket (17) which is detachably connected to the liquid feeding plug (15).

5. The low-resistance copper film glass according to claim 1, characterized in that: One end of the threaded pull rod (9) extending out of the regulating box (7) is fixedly connected to a rotating handle (18).

6. The low-resistance copper film glass according to claim 1, characterized in that: The styrene-butadiene rubber layer (4) extends to the side of the glass plate (1) away from the molybdenum metal film (3), and a gap is left between the ends of the styrene-butadiene rubber layer (4) extending to the side of the glass plate (1) away from the molybdenum metal film (3).

7. The low-resistance copper film glass according to claim 1, characterized in that: The first semiconductor (11), the electrical connector (13) and the second semiconductor (12) form a ring body electrically connected in sequence from the inside to the outside, and the inner wall of the first semiconductor (11) is fixedly adhered to the outer wall of the regulating box (7).

8. A manufacturing method for manufacturing the low-resistance copper film glass according to any one of claims 1 to 7, characterized in that: The steps include: S101, treating the glass plate (1): etching the glass plate (1) with acid, and then alkali-washing and drying the acid-etched glass plate (1); S102, sputtering a molybdenum metal layer: in a sputtering coating device, using argon as a gas source and a molybdenum target as a target source, sputtering a molybdenum metal film (3) on the glass plate (1); S103, sputtering a copper metal layer, using argon as a gas source and a copper target as a target source in a sputtering coating device, to sputter a copper metal film (2) on a molybdenum metal film (3); S104, attaching a protective mechanism outside the copper metal film (2).

9. The manufacturing method according to claim 8, characterized in that The acid etching of the glass plate (1), and alkali washing and drying of the acid-etched glass plate (1) specifically include the following steps: 1) Acid etching: using plasma water to clean the glass plate (1), and sending the cleaned glass plate (1) into a strong acid solution for acid etching, and then sending the acid-etched glass plate (1) into an AP machine for ozone cleaning; 2) Alkali cleaning: using a strong alkaline solution and an alkali-resistant brush to perform alkaline cleaning on the glass plate (1) treated in step 1); 3) Drying: The glass plate (1) treated in step 2) is placed in a UV oven for drying.

10. The manufacturing method according to claim 9, characterized in that: The method of using a strong alkaline solution and an alkali-resistant brush to perform alkali cleaning on the glass plate (1) treated in step 1) specifically includes: 201) placing the glass plate (1) in a potassium hydroxide aqueous solution for a first alkaline cleaning, and using an alkali-resistant brush to evenly scrape the surface of the glass plate (1). After the first alkaline cleaning is completed, placing the glass plate (1) in plasma water for bubbling cleaning and drying; 202) The coated surface of the glass plate (1) treated in step 201) is placed upward, and an alkali-resistant mesh film is attached to the middle of the coated surface of the glass plate (1), so that a plurality of exposed portions and blocking portions are formed on the coated surface of the glass plate (1). An alkali-resistant brush is dipped in a potassium hydroxide aqueous solution, and the potassium hydroxide aqueous solution is evenly brushed on the plurality of exposed portions to perform a second alkali cleaning. After the second alkali cleaning is completed, the alkali-resistant mesh film is torn off, and the glass plate (1) is placed in plasma water for bubbling cleaning and drying; 203) The coated surface of the glass plate (1) treated in step 202) is placed upward, an alkali-resistant mesh film is pasted again on the middle of the coated surface of the glass plate (1), and an alkali-resistant covering film covering the entire coated surface of the glass plate (1) is pasted on the alkali-resistant mesh film, cracks are made on the overlapping area of ​​the alkali-resistant mesh film and the alkali-resistant covering film to expose the coated surface of the glass plate (1), an alkali-resistant brush is dipped in a potassium hydroxide aqueous solution, and the potassium hydroxide aqueous solution is evenly brushed on the multiple cracks to perform a third alkali cleaning, and after the third alkali cleaning is completed, the alkali-resistant mesh film and the alkali-resistant covering film are torn off, and the glass plate (1) is placed in plasma water for bubbling cleaning and drying; 204) The coated surface of the glass plate (1) treated in step 203) is placed upward, an alkali-resistant outer frame film is attached to the edge of the coated surface of the glass plate (1), an alkali-resistant brush is dipped in a potassium hydroxide aqueous solution, and the potassium hydroxide aqueous solution is evenly brushed on the inner side of the alkali-resistant outer frame film, thereby performing a fourth alkali cleaning. After the fourth alkali cleaning is completed, a cutting tool is used to cut out the glass plate (1) not covered by the alkali-resistant outer frame film, and the cut glass plate (1) is sent into plasma water for bubbling cleaning; The concentration of the potassium hydroxide aqueous solution is 0.5-2%, the second alkali cleaning time is the same as the third alkali cleaning time, and the first alkali cleaning time, the second alkali cleaning time, and the fourth alkali cleaning time decrease in sequence.

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