A plate absorption cooling device and control method for servers

Abstract

This invention discloses a plate-type absorption cooling device and control method for servers, featuring a multi-layered stacked structure including a generating plate, a solution heat exchange plate assembly, an absorption plate assembly, an evaporation plate assembly, and a condensing plate assembly. The generating plate, solution heat exchange plate assembly, absorption plate assembly, evaporation plate assembly, and condensing plate assembly are identical in shape and size in the horizontal direction and stacked vertically. The solution heat exchange plate assembly is located between and communicates with both the generating plate and absorption plate assemblies. The evaporation plate assembly is positioned above the absorption plate assembly and communicates with both the absorption plate assembly and the condensing plate assembly. The condensing plate assembly is positioned above the evaporation plate assembly and communicates with the generating plate. This invention is small in size and compact in structure, which is beneficial for installing absorption cooling devices within the limited space of a server.

Description

Technical Field

[0001] This invention relates to the field of data center server heat dissipation technology, and in particular to a plate-type absorption cooling device and control method for servers. Background Technology

[0002] With the rapid development of information technology, the scale and energy consumption of data centers continue to increase, and the power density of servers continues to rise. Blade servers, which are designed specifically for high-density data centers, generate more heat per unit area than rack servers and tower servers. The heat dissipation problem caused by high power and high heat flux density is more prominent. Therefore, in order to keep servers at the optimal operating temperature and ensure the operating performance and efficiency of data centers, it is essential to carry out efficient heat dissipation for data center servers.

[0003] However, traditional data center servers rely on air cooling or indirect contact liquid cooling for heat dissipation. Air cooling is noisy and cannot meet the cooling demands of high power consumption, while indirect contact liquid cooling occupies a large amount of internal space, requires a large amount of coolant, and carries the risk of leakage, failing to meet the high integration and security requirements of data center servers. Compared to traditional air cooling and liquid cooling technologies, phase change cooling technology is one of the most widely researched thermal control technologies, especially small and micro-sized absorption cooling devices, which can be widely used in high-power heat dissipation applications such as servers and mobile devices.

[0004] Absorption refrigeration systems mainly consist of a generator, absorber, condenser, and evaporator. Driven by a heat source, these systems continuously produce heat exchange fluid at temperatures above or below 0°C, depending on the working medium, providing efficient cooling for high-power, high-heat-flux-density electronic components. Furthermore, employing high-efficiency heat exchangers can improve the overall efficiency of the absorption refrigeration system. However, current common absorption refrigeration systems typically employ a design approach where components are manufactured separately, connected via additional piping, and assembled onto an external frame. This approach suffers from drawbacks such as large space requirements, installation difficulties, and the risk of piping leaks. These drawbacks make it unsuitable for installation within the limited space of servers and limit its application in the cooling of high-power, high-heat-flux-density data center servers. Summary of the Invention

[0005] In order to overcome the shortcomings and deficiencies of the existing technology, the purpose of this invention is to provide a plate-type absorption cooling device and control method for servers, simplifying the structure of conventional absorption cooling devices, thereby enabling the installation of absorption cooling devices in the limited rack space of servers, and providing efficient cooling and heat dissipation for high-power, high-heat-flux-density servers in data centers.

[0006] The present invention adopts the following technical solution:

[0007] A plate-type absorption cooling device for servers has a multi-layered stacked structure, including a generating plate, a solution heat exchange plate assembly, an absorption plate assembly, an evaporation plate assembly, and a condensing plate assembly. The generating plate, solution heat exchange plate assembly, absorption plate assembly, evaporation plate assembly, and condensing plate assembly are identical in shape and size in the horizontal direction and are stacked in the vertical direction. The solution heat exchange plate assembly is located between the generating plate and the absorption plate assembly and is connected to both the generating plate and the absorption plate assembly. The evaporation plate assembly is located above the absorption plate assembly and is connected to both the absorption plate assembly and the condensing plate assembly. The condensing plate assembly is located above the evaporation plate assembly and is connected to the generating plate.

[0008] Furthermore, the generating plate includes a generating chamber located in the center of the plate, a concentrated absorbent outlet disposed on the generating plate and communicating with the generating chamber, a refrigerant vapor outlet located on one side of the generating chamber and communicating with the condenser plate assembly, and a diluted absorbent inlet located on one side of the generating chamber and communicating with the solution heat exchange plate assembly.

[0009] Furthermore, the solution heat exchange plate assembly includes at least one heat exchange unit, which is composed of a concentrated solution substrate and a dilute solution substrate.

[0010] Furthermore, the absorption plate assembly includes at least one reaction unit, which is composed of an absorption substrate and an absorption cooling substrate. The absorption substrate includes an absorption chamber located in the center of the substrate, a concentrated absorbent inlet, a secondary refrigerant vapor inlet, a diluted absorbent outlet, and a refrigerant vapor channel located on both sides of the absorption chamber and communicating with the absorption chamber. The absorption cooling substrate includes a heat exchange chamber located in the center of the substrate, a coolant inlet and a coolant outlet located on both sides of the heat exchange chamber and communicating with the heat exchange chamber, a refrigerant vapor channel, and a secondary refrigerant vapor channel.

[0011] Furthermore, the condenser plate assembly includes a condenser plate cover and at least one reaction unit body composed of a condenser substrate and a condenser cooling substrate.

[0012] Furthermore, the condensing substrate includes a condensing chamber located in the center of the substrate, a liquid refrigerant outlet and a refrigerant vapor inlet located on both sides of the condensing chamber and communicating with the condensing chamber; the condensing cooling substrate includes a heat exchange chamber located in the center of the substrate, a coolant inlet and a coolant outlet located on both sides of the heat exchange chamber and communicating with the heat exchange chamber; the condensing cooling substrate is disposed above the condensing substrate.

[0013] Furthermore, the liquid refrigerant outlet is also equipped with an expansion structure.

[0014] Furthermore, the evaporator plate assembly includes at least one reaction unit composed of an evaporator substrate and an evaporator heat exchange substrate; the evaporator substrate includes an evaporation chamber located in the center of the substrate, a liquid refrigerant inlet and a secondary refrigerant vapor outlet located on both sides of the evaporator chamber and communicating with the evaporator chamber, and a refrigerant vapor flow channel; the evaporator heat exchange substrate includes a heat exchange chamber located in the center of the substrate, a heat exchange inlet and a heat exchange outlet located on both sides of the heat exchange chamber and communicating with the heat exchange chamber.

[0015] Furthermore, the evaporation substrate is disposed above the evaporation heat exchange substrate, and heat exchange occurs between the evaporation chamber of the evaporation substrate and the heat exchange chamber of the evaporation heat exchange substrate, thereby achieving heat dissipation from the heat source inside the server.

[0016] A control method based on a plate absorption cooling device for servers includes:

[0017] The refrigerant circulation path, the absorbent circulation path, the external coolant circulation path, and the internal heat source circulation path of the server.

[0018] Refrigerant circulation path: The generating plate absorbs heat from the external heat source, causing the refrigerant in the diluted absorbent to change from a liquid to a gaseous state, forming refrigerant vapor. The refrigerant vapor then enters the condensing plate assembly, where it condenses into liquid refrigerant under the action of the coolant provided by the external cold source. This liquid refrigerant then enters the evaporating plate assembly to exchange heat with the internal heat source of the server. After absorbing heat from the internal heat source, the liquid refrigerant changes from a liquid to a gaseous state, forming secondary refrigerant vapor. The secondary refrigerant vapor finally flows back into the absorption plate assembly and is absorbed by the concentrated absorbent. The heat released in this process is also absorbed by the coolant provided by the external cold source.

[0019] The absorption liquid circulation path is as follows: the original diluted absorption liquid in the generating plate absorbs heat from the external heat source and becomes concentrated absorption liquid. Under the action of the circulation pump, the concentrated absorption liquid first enters the solution heat exchange plate assembly, and then enters the absorption plate assembly to become diluted absorption liquid. This diluted absorption liquid enters the solution heat exchange plate assembly, exchanges heat with the concentrated absorption liquid from the generating plate, and then flows back into the generating plate; thus realizing the circulation of absorption liquid between the generating plate, the solution heat exchange plate assembly, and the absorption plate assembly.

[0020] The external coolant circulation path is as follows: the coolant provided by the external cold source flows into the absorption plate assembly to cool it. Then, the coolant flows out of the absorption plate assembly and into the condenser plate assembly, where it absorbs heat from the refrigerant vapor, causing it to change from a gaseous state to a liquid state, becoming a liquid refrigerant. Finally, the coolant flows out of the condenser plate assembly and back to the external cold source. This external coolant circulation path transports the heat generated by the server's plate absorption refrigeration device to the external cold source, where it is ultimately released into the environment.

[0021] Meanwhile, the internal heat source circulation path of the server is as follows: the internal heat source flows into the evaporator assembly, then flows out of the evaporator assembly and back to the server; the internal heat source circulation path transports the heat from the internal heat source to the absorption cooling device for the server, thereby achieving heat dissipation of the internal heat source.

[0022] The beneficial effects of this invention are:

[0023] (1) The plate-type absorption cooling device for servers has a multi-thin plate stacked structure. Compared with conventional absorption cooling devices, it simplifies the structure of absorption cooling devices, is small in size and compact in structure, which is conducive to installing absorption cooling devices in the limited layout space of servers.

[0024] (2) The microchannel structure is introduced into the plate absorption refrigeration device for servers, which expands the heat transfer area of ​​each chamber, improves the heat exchange capacity between the device and the external environment, and effectively improves the refrigeration efficiency of the device.

[0025] (3) The plate absorption cooling device for servers introduces liquid coolant and liquid heat exchanger, which improves the heat exchange power between the device and the external environment and between the device and the heat source, and improves the cooling capacity of the device. It can continuously and stably provide cooling and heat dissipation for the server, which is conducive to solving the heat dissipation problem of data center servers under high power and high heat flux density conditions. Attached Figure Description

[0026] Figure 1 This is a schematic diagram of a plate-type absorption cooling device for servers provided in an embodiment of the present invention;

[0027] Figure 2 This is a schematic diagram of the structure of a plate-type absorption cooling device for servers provided in an embodiment of the present invention;

[0028] Figure 3 This is an exploded structural diagram of a plate-type absorption cooling device for servers provided in an embodiment of the present invention;

[0029] Figure 4This is a diagram showing the circulation flow path of the refrigerant, absorbent, internal heat source, and external coolant in a plate absorption refrigeration device for servers provided in this embodiment of the invention. Detailed Implementation

[0030] The present invention will be further described in detail below with reference to the embodiments and accompanying drawings, but the embodiments of the present invention are not limited thereto.

[0031] See Figure 1 This application provides a plate absorption cooling device for servers. The plate absorption cooling device for servers mainly includes a generating plate 1, a solution heat exchange plate assembly 2, an absorption plate assembly 3, an evaporating plate assembly 4, a condensing plate assembly 5, an external heat source 6, an external cold source 7, an internal server heat source 8, and a circulating pump 9.

[0032] A plate-type absorption cooling device for servers includes a refrigerant circulation path, an absorbent circulation path, an external coolant circulation path, and an internal server heat source circulation path. Specifically, the refrigerant circulation path is as follows: A generating plate 1 stores a diluted absorbent containing refrigerant (where the refrigerant's boiling point is much lower than the absorbent's). The generating plate 1 absorbs heat from an external heat source 6, causing the refrigerant in the diluted absorbent to change from a liquid state to a gaseous state, forming refrigerant vapor. The refrigerant vapor then enters the condenser plate assembly 5, where it is cooled by the coolant provided by an external cold source 7. The refrigerant condenses into a liquid state; the liquid refrigerant expands from a high-pressure liquid to a low-temperature, low-pressure liquid through an expansion valve, and continues to enter the evaporator assembly 4. The evaporator assembly 4 exchanges heat with the internal heat source 8 of the server. After absorbing the heat from the internal heat source 8 of the server, the liquid refrigerant changes from a liquid state to a gaseous state, forming secondary refrigerant vapor. The secondary refrigerant vapor finally flows back into the absorption plate assembly 3 and is absorbed by the concentrated absorption liquid. The heat released in this process is also absorbed by the coolant provided by the external cold source 7. The refrigerant circulation path realizes the cooling function and exchanges heat with the internal heat source 8 of the server.

[0033] On the other hand, the absorption liquid circulation path is as follows: the original diluted absorption liquid in generating plate 1 absorbs heat from external heat source 6 and becomes concentrated absorption liquid. Under the action of circulation pump 9, the concentrated absorption liquid first enters solution heat exchange plate assembly 2, and then enters absorption plate assembly 3. At this time, the concentrated absorption liquid in absorption plate assembly 3 absorbs secondary refrigerant vapor from the refrigerant circulation path and becomes diluted absorption liquid again. This diluted absorption liquid enters solution heat exchange plate assembly 2 and exchanges heat with the concentrated absorption liquid from generating plate 1, and then flows back into generating plate 1; thus realizing the circulation of absorption liquid between generating plate 1, solution heat exchange plate assembly 2 and absorption plate assembly 3.

[0034] Meanwhile, the external coolant circulation path is as follows: the coolant provided by the external cold source 7 flows into the absorption plate assembly 3, absorbing the heat released by the concentrated absorbent liquid absorbing the secondary refrigerant vapor, thereby cooling the absorption plate assembly 3 and promoting the continuous and stable reaction within the absorption plate assembly 3; then the coolant flows out of the absorption plate assembly 3; next, the coolant flows into the condenser plate assembly 5, absorbing the heat of the refrigerant vapor within the condenser plate assembly 5, causing the refrigerant to change from a gaseous state to a liquid state, becoming a liquid refrigerant; then the coolant flows out of the condenser plate assembly 5 and flows back to the external cold source 7; the external coolant circulation path transports the heat generated by the operation of the server plate absorption refrigeration device to the external cold source 7, and finally releases it into the environment through the external cold source 7;

[0035] Meanwhile, the internal heat source circulation path of the server is as follows: the internal heat source 8 of the server flows into the evaporator plate assembly 4, and the heat of the internal heat source 8 of the server in the evaporator plate assembly 4 is absorbed by the liquid refrigerant; the internal heat source 8 of the server then flows out of the evaporator plate assembly and flows back to the server; the internal heat source circulation path of the server transports the heat of the internal heat source 8 of the server to the absorption cooling device for the server, thereby realizing the heat dissipation of the internal heat source 8 of the server.

[0036] See Figure 2 A plate-type absorption cooling device for servers has a multi-layered stacked structure, wherein the plates are thin plates with a thickness of approximately 10 mm, including a generating plate 1, a solution heat exchange plate assembly 2, an absorption plate assembly 3, an evaporation plate assembly 4, and a condensing plate assembly 5. All the thin plates are identical in shape and size in the horizontal direction and are stacked vertically. The upper and lower surfaces of each plate are sealed together by gaskets or brazing. The solution heat exchange plate assembly 2 is located between the generating plate 1 and the absorption plate assembly 3 and is connected to the interior of both the generating plate 1 and the absorption plate assembly 3. The evaporation plate assembly 4 is located above the absorption plate assembly 3 and is connected to the interior of both the absorption plate assembly 3 and the condensing plate assembly 5. The condensing plate assembly 5 is located above the evaporation plate assembly 4 and is connected to the interior of the generating plate 1.

[0037] Figure 3 This is an exploded structural diagram of a plate absorption cooling device for servers according to an embodiment of the present invention.

[0038] The generating plate 1 includes a generating chamber 11 located in the center of the plate, a concentrated absorbent outlet 12 located on the side of the generating plate 1 and communicating with the generating chamber 11, a refrigerant vapor outlet 13 located on one side of the generating chamber 11 and communicating with the condenser plate assembly 5, and a dilution absorbent inlet 14 located on one side of the generating chamber 11 and communicating with the solution heat exchange plate assembly 2.

[0039] The solution heat exchange plate assembly 2 includes at least one heat exchange unit composed of a concentrated solution substrate 21 and a dilute solution substrate 22. The concentrated solution substrate 21 includes a heat exchange chamber 211 located in the center of the substrate, a concentrated solution outlet 212 and a concentrated solution inlet 213 located on both sides of the heat exchange chamber 211 and communicating with the heat exchange chamber 211, a refrigerant vapor channel 214, and a dilute solution channel 215. The dilute solution substrate 22 includes a heat exchange chamber 221 located in the center of the substrate, a dilute solution inlet 222 and a dilute solution outlet 223 located on both sides of the heat exchange chamber 221 and communicating with the heat exchange chamber 221, and a refrigerant vapor channel 224. The concentrated solution substrate 21 is located above the dilute solution substrate 22, and heat exchange occurs between the heat exchange chambers 211 and 221 of the concentrated solution substrate 21 and the dilute solution substrate 22. Specifically, the dilute absorbent in the dilute solution substrate 22 absorbs heat from the concentrated absorbent in the concentrated solution substrate 21, causing its temperature to rise. This process achieves preheating of the dilute absorbent.

[0040] The absorber plate assembly 3 includes at least one reaction unit consisting of an absorber substrate 31 and an absorber cooling substrate 32; wherein, the absorber substrate 31 includes an absorber chamber 311 located in the center of the substrate, a concentrated absorbent liquid inlet 312 located on both sides of the absorber chamber 311 and communicating with the absorber chamber 311, a secondary refrigerant vapor inlet 313, a diluted absorbent liquid outlet 314, and a refrigerant vapor channel 315; the absorber cooling substrate 32 includes a heat exchange chamber 321 located in the center of the substrate, and a cooling substrate located on both sides of the heat exchange chamber 321 and communicating with the heat exchange chamber 321. The system includes a refrigerant inlet 322, a refrigerant outlet 323, a refrigerant vapor channel 324, and a secondary refrigerant vapor channel 325. The absorption cooling substrate 32 is disposed above the absorption substrate 31. Specifically, the refrigerant flows into the heat exchange chamber 321 of the absorption cooling substrate 32 from the refrigerant inlet 322, absorbs heat from the absorption chamber 311 of the absorption substrate 31, and then flows out of the absorption cooling substrate 32 from the refrigerant outlet 323, thereby achieving cooling of the absorption chamber 311 in the absorption substrate 31 and promoting the continuous and stable reaction in the absorption chamber 311 of the absorption substrate 31.

[0041] The evaporator plate assembly 4 includes at least one reaction unit composed of an evaporator substrate 41 and an evaporator heat exchange substrate 42. The evaporator substrate 41 includes an evaporation chamber 411 located at the center of the substrate, a liquid refrigerant inlet 412 located on both sides of the evaporator chamber 411 and communicating with it, a secondary refrigerant vapor outlet 413, and a refrigerant vapor channel 414. The evaporator heat exchange substrate 42 includes a heat exchange chamber 421 located at the center of the substrate, a heat exchange inlet 422 located on both sides of the heat exchange chamber 421 and communicating with it. The evaporator substrate 41 is disposed above the evaporator heat exchange substrate 42. Heat exchange occurs between the evaporation chamber 411 of the evaporation heat exchange substrate 42 and the heat exchange chamber 421 of the evaporation heat exchange substrate 42, thereby dissipating heat from the heat source 8 inside the server. Specifically, the heat exchanger of the heat source 8 inside the server flows into the heat exchange chamber 421 of the evaporation heat exchange substrate 42 through the heat exchange inlet 422. The heat exchanger in the heat exchange chamber 421 absorbs heat from the liquid refrigerant in the evaporation chamber 411, and its temperature decreases. Then, it flows out of the evaporation heat exchange substrate 42 from the heat exchange outlet 423 and flows back into the server. At the same time, the liquid refrigerant in the evaporation chamber 411 of the evaporation substrate 41 absorbs heat from the heat source 8 inside the server and changes from liquid to gas, forming secondary refrigerant vapor.

[0042] The condenser plate assembly 5 includes at least one reaction unit consisting of a condenser plate 51 and a condenser cooling plate 52, and a condenser plate cover 53 for sealing the condenser plate assembly 5. The condenser plate 51 includes a condenser chamber 511 located in the center of the plate, a liquid refrigerant outlet 512 located on both sides of the condenser chamber 511 and communicating with the condenser chamber 511, and a refrigerant vapor inlet 513. The condenser cooling plate 52 includes a heat exchange chamber 521 located in the center of the plate, and a coolant outlet 522 located on both sides of the heat exchange chamber 521 and communicating with the heat exchange chamber 521. A coolant inlet 523 is provided; a condensation cooling substrate 52 is disposed above a condensation substrate 51; specifically, coolant flows into the heat exchange chamber 521 of the condensation cooling substrate 52 from the coolant inlet 523, absorbs heat from the cooling chamber 511 of the condensation substrate 51, and then flows out of the condensation cooling substrate 52 from the coolant outlet 522; refrigerant vapor entering the condensation chamber 511 of the condensation substrate 51 from the refrigerant vapor inlet 513 is heated by the coolant and changes from a gaseous state to a liquid state, forming a liquid refrigerant, which flows out from the liquid refrigerant outlet 512.

[0043] Furthermore, foamed metal or microchannel arrays are placed in the generating chamber 11 of the generating plate 1, the heat exchange chambers 211 and 221 of the solution heat exchange plate assembly 2, the absorption chamber 311 and heat exchange chamber 321 of the absorption plate assembly 3, the evaporation chamber 411 and heat exchange chamber 421 of the evaporation plate assembly 4, or the condensation chamber 511 and heat exchange chamber 521 of the condensation plate assembly 5 to increase the heat transfer area of ​​the chambers and improve the heat transfer capacity of the chambers. In this embodiment, microchannel structures are provided in each chamber, and the microchannel structure is composed of a row of rectangular grooves of a certain depth spaced at a certain distance.

[0044] Furthermore, the liquid refrigerant outlet 512 of the condenser plate assembly 5 is also provided with an expansion structure, such as porous foam metal, porous microchannels, or capillary channels, which has a throttling effect and serves to... Figure 1 The function of the expansion valve is to balance the pressure on both sides of the liquid refrigerant outlet 512 and prevent refrigerant vapor from passing through;

[0045] Specifically, the expansion structure of the liquid refrigerant outlet 512 has a porous microstructure. Under capillary action, the liquid refrigerant in the condensation chamber 511 of the condensation substrate 51 enters and fills the liquid refrigerant outlet 512, and then enters the evaporation chamber 411 of the evaporation substrate 41 from the liquid refrigerant inlet 412 on the evaporation plate assembly 4. The pressure in the condensation chamber 511 of the condensation substrate 51 is greater than the pressure in the evaporation chamber 411 of the evaporation substrate 41. Due to capillary action, the liquid refrigerant flows into and fills the liquid refrigerant outlet 512, preventing refrigerant vapor from passing through the liquid refrigerant outlet 512, and allowing the liquid refrigerant to pass through the liquid refrigerant outlet 512, thereby realizing the throttling function of the liquid refrigerant outlet 512.

[0046] Furthermore, refrigerant vapor channels 214, 224, 315, 324, 414 and 424 are respectively provided on the solution heat exchange plate assembly 2, the absorption plate assembly 3 and the evaporation plate assembly 4. The refrigerant vapor outlet 13 on the generating plate 1 and the refrigerant vapor inlet 513 on the condensing plate assembly 5 are interconnected through the refrigerant vapor channels.

[0047] Furthermore, secondary refrigerant vapor channels 425 and 325 are respectively provided on the evaporation heat exchange substrate 42 and the absorption cooling substrate 32, and the secondary refrigerant vapor outlet 413 on the evaporation plate assembly 4 and the secondary refrigerant vapor inlet 313 on the absorption plate assembly 3 are interconnected through the secondary refrigerant vapor channels.

[0048] Integrating the refrigerant vapor channel and the secondary refrigerant vapor channel onto the substrate helps reduce the use of additional connecting pipes and reduces the size of the plate absorption cooling unit for servers.

[0049] Furthermore, the plate absorption refrigeration unit for servers also includes a circulation pump 9; the circulation pump 9 is independently located outside the plate absorption refrigeration unit for servers, and is connected to the concentrated absorbent outlet 12 of the generating plate 1 and the concentrated solution inlet 213 of the solution heat exchange plate assembly 2, respectively, driving the concentrated absorbent from the generating plate 1 into the solution heat exchange plate assembly 2; the independent location of the circulation pump 9 outside the plate absorption refrigeration unit for servers facilitates pump maintenance and connection to an external power source.

[0050] Furthermore, the absorbent stored within the generating plate 1 and the absorbent plate assembly 3 is a refrigerant solution composed of a low-boiling-point refrigerant and a high-boiling-point absorbent. The absorbent can use water as the refrigerant, for example: water-lithium bromide, water-lithium chloride, water-lithium iodide, water-calcium chloride, etc.; the absorbent can also use ammonia as the refrigerant, for example: ammonia-water, ethylamine-water, methylamine-water, sodium thiocyanate-ammonia, etc.; the absorbent can also use alcohol as the refrigerant, for example: methanol-lithium bromide, methanol-zinc bromide, methanol-lithium bromide-zinc bromide, etc.

[0051] The working process of this embodiment is as follows:

[0052] See Figure 4 When a server operates using a plate-type absorption refrigeration unit, there are circulation paths for the absorbent liquid, refrigerant, external coolant, and the internal heat source of the server.

[0053] On one hand, the circulation path of the absorbent is as follows: Under the heating action of the external heat source 6, the diluted absorbent in the generating plate 1 absorbs heat, and the refrigerant in the diluted absorbent changes from liquid to gas, forming refrigerant vapor. The original diluted absorbent becomes concentrated absorbent. Driven by the circulation pump 9, the concentrated absorbent flows from the concentrated absorbent outlet 12 of the generating plate 1 to the concentrated solution inlet 213 of the solution heat exchange plate assembly 2, then flows into the heat exchange chamber 211 of the concentrated solution substrate 21, then flows out from the concentrated solution outlet 212, and then flows into the absorption chamber 311 from the concentrated absorbent inlet 312 of the absorption substrate 31 to mix with the original diluted absorbent. Finally, it flows out from the diluted absorbent outlet 31. 4. Outflow; thereafter, the diluted absorbent in the absorbent substrate 31 flows downward under the action of gravity through the dilute solution channel 215 on the concentrated solution substrate 21, then flows into the dilute solution inlet 222 of the dilute solution substrate 22 and then into the heat exchange chamber 221, then flows out from the dilute solution outlet 223, and then flows into the generating chamber 11 from the diluted absorbent inlet 14 on the generating plate 1; during this process, heat exchange occurs between the heat exchange chambers of the concentrated solution substrate 21 and the dilute solution substrate 22 on the solution heat exchange plate assembly 2, the concentrated absorbent releases heat and the temperature decreases, and the diluted absorbent absorbs heat and the temperature increases. This process is mainly used to recover the heat of the concentrated absorbent and preheat the diluted absorbent.

[0054] On the other hand, the refrigerant circulation path is as follows: the refrigerant vapor generated in the generating plate 1 flows out of the generating plate 1 from the refrigerant vapor outlet 13, flows through the refrigerant vapor channels 224, 214, 315, 324, 424, and 414 on the solution heat exchange plate assembly 2, the absorption plate assembly 3, and the evaporation plate assembly 4 in sequence, and then enters the condensing chamber 511 from the refrigerant vapor inlet 513 of the condensing substrate 51. Heat exchange occurs between the condensing chamber 511 of the condensing substrate 51 and the heat exchange chamber 521 of the condensing cooling substrate 52. The refrigerant vapor in the condensing chamber 511 of the condensing substrate 51 is cooled by the coolant in the heat exchange chamber 521 of the condensing cooling substrate 52, changing from a gaseous state to a liquid state, becoming a liquid refrigerant.

[0055] Liquid refrigerant in the condensation chamber 511 of the condensation substrate 51 flows out from the liquid refrigerant outlet 512 and enters the evaporation chamber 411 from the liquid refrigerant inlet 412 of the evaporation substrate 41. Heat exchange occurs between the evaporation chamber 411 of the evaporation substrate 41 and the heat exchange chamber 421 of the evaporation heat exchange substrate 42. The liquid refrigerant in the evaporation chamber 411 of the evaporation substrate 41 absorbs heat from the heat source 8 inside the server in the heat exchange chamber 421 of the evaporation heat exchange substrate 41, and its temperature rises, changing from liquid to gas and becoming secondary refrigerant vapor. At the same time, the temperature of the heat source 8 inside the server decreases, flows out of the evaporation heat exchange substrate 42 from the heat exchange outlet 426, and flows back into the server. This process achieves heat dissipation for the server.

[0056] Secondary refrigerant vapor in the evaporation chamber 411 of the evaporation substrate 41 flows out from the secondary refrigerant vapor outlet 413, passes sequentially through the secondary refrigerant vapor channels 425 and 325 on the evaporation heat exchange substrate 42 and the absorption cooling substrate 32, and then flows into the absorption chamber 311 from the secondary refrigerant vapor inlet 313 of the absorption substrate 31. At this time, concentrated absorbent enters the absorption chamber 311 from the concentrated absorbent inlet 312 of the absorption substrate 31, absorbs the secondary refrigerant vapor, changes the refrigerant from a gaseous state to a liquid state, reduces the concentration of the concentrated absorbent, and turns the original concentrated absorbent into a diluted absorbent. The heat released in this process is also absorbed by the coolant provided by the external cold source 7. Heat exchange occurs between the absorption chamber 311 of the absorption substrate 31 and the heat exchange chamber 321 of the absorption cooling substrate 32, and the absorption chamber 311 is cooled.

[0057] Meanwhile, the external coolant circulation path is as follows: the coolant provided by the external cold source 7 first flows into the heat exchange chamber 321 from the coolant inlet 322 of the absorption cooling substrate 32, then flows out from the coolant outlet 323, then flows into the heat exchange chamber 521 from the coolant inlet 523 of the condensation cooling substrate 52, and then flows out from the coolant outlet 522 and flows back to the external cold source 7.

[0058] Meanwhile, the internal heat source circulation path of the server is as follows: the internal heat source 8 flows into the heat exchange chamber 421 from the heat exchange inlet 422 of the evaporation heat exchange substrate 42, and then flows out from the heat exchange outlet 423 and flows back into the server.

[0059] The above process completes the refrigerant circulation, absorbent circulation, external coolant circulation, and internal heat source circulation of the server plate absorption cooling device provided in this embodiment. By absorbing and cooling, the heat inside the server is transported to the external cold source and finally released into the environment, thereby achieving heat dissipation for high-power, high-heat-flux-density servers.

Claims

1. A plate absorption cooling device for servers, characterized in that, It has a multi-layered stacked structure, including a generating plate, a solution heat exchange plate assembly, an absorption plate assembly, an evaporation plate assembly, and a condensing plate assembly; the generating plate, solution heat exchange plate assembly, absorption plate assembly, evaporation plate assembly, and condensing plate assembly are identical in shape and size in the horizontal direction and are stacked in the vertical direction. The solution heat exchange plate assembly is located between the generating plate and the absorption plate assembly and is connected to both the generating plate and the absorption plate assembly. The evaporation plate assembly is located above the absorption plate assembly and is connected to both the absorption plate assembly and the condensing plate assembly. The condensing plate assembly is located above the evaporation plate assembly and is connected to the generating plate. The solution heat exchange plate assembly includes at least one heat exchange unit, which is composed of a concentrated solution substrate and a dilute solution substrate. The server plate absorption intelligent cooling device includes a refrigerant circulation path, an absorbent circulation path, an external coolant circulation path, and an internal server heat source circulation path.

2. The plate absorption cooling device for servers according to claim 1, characterized in that, The generating plate includes a generating chamber located in the center of the plate, a concentrated absorbent outlet disposed on the generating plate and communicating with the generating chamber, a refrigerant vapor outlet located on one side of the generating chamber and communicating with the condenser plate assembly, and a diluted absorbent inlet located on one side of the generating chamber and communicating with the solution heat exchange plate assembly.

3. The plate absorption cooling device for servers according to claim 1, characterized in that, The absorption plate assembly includes at least one reaction unit, which is composed of an absorption substrate and an absorption cooling substrate. The absorption substrate includes an absorption chamber located in the center of the substrate, a concentrated absorbent inlet, a secondary refrigerant vapor inlet, a diluted absorbent outlet, and a refrigerant vapor channel located on both sides of the absorption chamber and communicating with the absorption chamber. The absorption cooling substrate includes a heat exchange chamber located in the center of the substrate, a coolant inlet and a coolant outlet located on both sides of the heat exchange chamber and communicating with the heat exchange chamber, a refrigerant vapor channel, and a secondary refrigerant vapor channel.

4. The plate absorption cooling device for servers according to claim 1, characterized in that, The condenser plate assembly includes a condenser plate cover and at least one reaction unit composed of a condenser substrate and a condenser cooling substrate.

5. The plate absorption cooling device for servers according to claim 4, characterized in that, The condensing substrate includes a condensing chamber located in the center of the substrate, a liquid refrigerant outlet and a refrigerant vapor inlet located on both sides of the condensing chamber and communicating with the condensing chamber; the condensing cooling substrate includes a heat exchange chamber located in the center of the substrate, a coolant inlet and a coolant outlet located on both sides of the heat exchange chamber and communicating with the heat exchange chamber; the condensing cooling substrate is disposed above the condensing substrate.

6. The plate absorption cooling device for servers according to claim 5, characterized in that, The liquid refrigerant outlet is also equipped with an expansion structure.

7. The plate absorption cooling device for servers according to claim 1, characterized in that, The evaporator plate assembly includes at least one reaction unit consisting of an evaporator substrate and an evaporator heat exchange substrate; the evaporator substrate includes an evaporation chamber located in the center of the substrate, a liquid refrigerant inlet and a secondary refrigerant vapor outlet located on both sides of the evaporation chamber and communicating with the evaporation chamber, and a refrigerant vapor flow channel; the evaporator heat exchange substrate includes a heat exchange chamber located in the center of the substrate, a heat exchange inlet and a heat exchange outlet located on both sides of the heat exchange chamber and communicating with the heat exchange chamber.

8. The plate absorption cooling device for servers according to claim 7, characterized in that, The evaporation substrate is disposed above the evaporation heat exchange substrate, and heat exchange occurs between the evaporation chamber of the evaporation substrate and the heat exchange chamber of the evaporation heat exchange substrate, thereby dissipating heat from the internal heat source of the server.

9. A control method for a plate absorption cooling device for servers according to any one of claims 1-8, characterized in that, include: The refrigerant circulation path, the absorbent circulation path, the external coolant circulation path, and the internal heat source circulation path of the server. Refrigerant circulation path: The generating plate absorbs heat from the external heat source, causing the refrigerant in the diluted absorbent to change from a liquid to a gaseous state, forming refrigerant vapor. The refrigerant vapor then enters the condensing plate assembly, where it condenses into liquid refrigerant under the action of the coolant provided by the external cold source. This liquid refrigerant then enters the evaporating plate assembly to exchange heat with the internal heat source of the server. After absorbing heat from the internal heat source, the liquid refrigerant changes from a liquid to a gaseous state, forming secondary refrigerant vapor. The secondary refrigerant vapor finally flows back into the absorption plate assembly and is absorbed by the concentrated absorbent. The heat released in this process is also absorbed by the coolant provided by the external cold source. The absorption liquid circulation path is as follows: the original diluted absorption liquid in the generating plate absorbs heat from the external heat source and becomes concentrated absorption liquid. Under the action of the circulation pump, the concentrated absorption liquid first enters the solution heat exchange plate assembly, and then enters the absorption plate assembly to become diluted absorption liquid. This diluted absorption liquid enters the solution heat exchange plate assembly, exchanges heat with the concentrated absorption liquid from the generating plate, and then flows back into the generating plate; thus realizing the circulation of absorption liquid between the generating plate, the solution heat exchange plate assembly, and the absorption plate assembly. The external coolant circulation path is as follows: the coolant provided by the external cold source flows into the absorption plate assembly to cool the absorption plate assembly. Then the coolant flows out of the absorption plate assembly and into the condenser plate assembly. The coolant absorbs the heat of the refrigerant vapor, causing the refrigerant to change from a gaseous state to a liquid state, becoming a liquid refrigerant. Then the coolant flows out of the condenser plate assembly and returns to the external cold source; the external coolant circulation path transports the heat generated by the plate absorption refrigeration device of the server to the external cold source, and finally releases it into the environment through the external cold source. Meanwhile, the internal heat source circulation path of the server is as follows: the internal heat source flows into the evaporator assembly, then flows out of the evaporator assembly and back to the server; the internal heat source circulation path transports the heat from the internal heat source to the absorption cooling device for the server, thereby achieving heat dissipation of the internal heat source.

Images