A photothermal dual-curable resin containing a benzocyclobutene structure and its preparation method and application

Abstract

The invention discloses a photothermal dual curable resin containing a benzocyclobutene structure, and a preparation method and application thereof. The photothermal dual curable resin containing a benzocyclobutene structure is prepared by polymerizing 4-vinylbenzocyclobutene, styrene, maleic anhydride, and divinylbenzene as monomers to obtain a copolymer, and then adding hydroxy acrylate to obtain a copolymer through a ring-opening reaction. The photothermal dual curable resin containing a benzocyclobutene structure can be photothermally dual cured, and the curing time is short, and has good thermal stability, chemical resistance, mechanical and electrical properties.

Description

Technical Field

[0001] The invention belongs to the technical field of curing resins, and in particular relates to a photo-thermal dual-curable resin containing a benzocyclobutene structure, and a preparation method and application thereof. Background Art

[0002] Benzocyclobutene (BCB) resin is a new type of active resin. It can form both thermoplastic resin and thermosetting resin. It has excellent thermal stability, molding processability, low dielectric constant and low thermal expansion coefficient. Based on these excellent properties, BCB resin has been widely used in military, aerospace and microelectronics industries.

[0003] Rapid vacuum pyrolysis is a relatively mature method for synthesizing BCB. It mainly refers to the rapid decomposition of organic molecules in a very short time (10 -2 s) passes through a high temperature zone (550-800°C) to remove some small molecules from the molecule and close the ring; this reaction is greatly affected by the vacuum degree and pyrolysis temperature, and the route conditions are relatively harsh, which leads to the high cost of benzocyclobutene, and its development and application are greatly restricted.

[0004] With the development of ultra-large-scale integrated circuits and multi-chip modules, the requirements for intermediate layer dielectric materials are becoming higher and higher. The materials must not only have excellent dielectric properties, but also have excellent thermal stability and water resistance. The performance of a single BCB resin material can no longer meet the requirements of these applications, and other groups need to be introduced to improve the performance of BCB resin. The current mainstream method is to introduce structures such as silane, siloxane, silsesquioxane, and polyimide, but they all face the problem of needing to modify benzocyclobutene through multi-step reactions, complicated synthesis methods, and high prices.

[0005] Chinese patent CN 107325287 A synthesizes a benzocyclobutene functionalized cage-type polysiloxane and its resin. The prepared resin has excellent thermal stability, mechanical properties and electrochemical properties, and is suitable for use as an interlayer dielectric film or packaging material in the fields of microelectronics industry, defense aerospace, etc. However, the synthesis route is long, a large amount of toluene is consumed during the separation and purification process, causing pollution, and the precious metal catalyst platinum is used in the preparation process, which is costly.

[0006] Chinese patent CN 105778096A uses silane or siloxane substituted benzocyclobutene monomers and siloxane monomers to prepare a silicone resin with siloxane as the main chain and benzocyclobutene as the side chain through hydrolysis copolymerization. This benzocyclobutene-containing silicone resin has good thermal stability, low dielectric constant and mechanical properties, and a high refractive index after thermal curing. It can be used as a high-performance resin or packaging material in the electrical industry, large-scale integrated circuits, microelectronics industry, aerospace and other fields, but it must be synthesized through multiple steps, the post-processing is complicated, and the thermal curing process is complicated and energy-intensive.

[0007] Chinese patent CN 109180492B synthesizes a free radical polymerizable rosin benzocyclobutene monomer with excellent thermal stability, water resistance and dielectric properties, which enhances the reprocessing and utilization of rosin and reduces the use of petrochemical resources, but has a low glass transition temperature and average mechanical strength. Summary of the invention

[0008] In order to solve the above technical problems, the purpose of the present invention is to provide a photothermal dual-curable resin containing a benzocyclobutene structure and a preparation method and application thereof; the resin can be photothermally dual-cured, and the curing time is short, and it has good thermal stability, chemical resistance, mechanical and electrical properties.

[0009] In order to achieve the above technical objectives and the above technical effects, the present invention is implemented through the following technical solutions:

[0010] A photothermal dual-curable resin containing a benzocyclobutene structure is prepared by polymerizing 4-vinylbenzocyclobutene, styrene, maleic anhydride, and divinylbenzene as monomers to obtain a copolymer, and then adding hydroxyl acrylic acid ester to obtain a copolymer through a ring-opening reaction; the photothermal dual-curable resin has a structural formula as shown in the following formula (I):

[0011]

[0012] Wherein, a, b, c, d are integers of 1 to 100, a+b+c+d is an integer of 4 to 300, and e is an integer of 1 to 7; R2 is a methyl group or a hydrogen atom.

[0013] The present invention further provides a method for preparing a photothermal dual curable resin containing a benzocyclobutene structure, comprising the following steps:

[0014] (1) using 4-vinylbenzocyclobutene, styrene, maleic anhydride and divinylbenzene as monomers for polymerization reaction; the molar ratio of the four monomers is 1-10:1-10:1-10:1-10;

[0015] (2) Adding hydroxy acrylate to the system after the reaction in step (1), and preparing a light-thermal dual-curable resin containing a benzocyclobutene structure through a ring-opening reaction under the action of a catalyst; the molar ratio of hydroxy acrylate to maleic anhydride is 0.5 to 1:1.

[0016] Furthermore, the reaction in step (1) is carried out in a solvent; the solvent is selected from at least one of water, alcohol solvents, ester solvents, ketone solvents, aromatic hydrocarbon solvents, N-methylpyrrolidone, and N,N-dimethylformamide; and the amount of the solvent used is 1 to 10 times the total mass of the four monomers.

[0017] Furthermore, in step (1), a chain transfer agent and an initiator are added; the chain transfer agent is selected from at least one of tert-butyl alcohol, tert-dodecyl mercaptan, mercaptoethanol, thioglycolic acid, 3-mercaptopropionate isooctyl ester, 2,4-diphenyl-4-methyl-1-pentene, and tert-butyl methacrylate, and the amount of the chain transfer agent is 0.1% to 5% of the total mass of the four monomers; the initiator is selected from at least one of azobisisobutyronitrile, dibenzoyl peroxide, diethylhexyl peroxydicarbonate, potassium persulfate, ammonium persulfate, potassium persulfate-sodium hypophosphite, potassium persulfate-sodium bisulfite, boron trifluoride etherate, and trifluoromethanesulfonic acid, and the amount of the initiator is 0.1% to 5% of the total mass of the four monomers.

[0018] Furthermore, the catalyst in step (2) is selected from at least one of triethylamine, 4-dimethylaminopyridine, ethanolamine, ethylenediamine, and potassium carbonate; and the amount of the catalyst used is 0.1% to 5% of the total mass of the four monomers.

[0019] Furthermore, the reaction time of step (1) is 1 to 3 hours, and the reaction temperature is 20 to 80°C; the reaction time of step (2) is 3 to 5 hours, and the reaction temperature is 80 to 150°C.

[0020] The present invention also provides the use of the photothermal dual curing resin containing a benzocyclobutene structure in an interlayer dielectric film or packaging material; specifically: the photothermal dual curing resin containing a benzocyclobutene structure and an initiator are uniformly mixed, and the interlayer dielectric film or packaging material is obtained by curing.

[0021] The beneficial effects of the present invention are:

[0022] The resin containing a benzocyclobutene structure of the present invention can be obtained through two-step reactions. The first step is to polymerize four monomers, 4-vinylbenzocyclobutene, styrene, maleic anhydride and divinylbenzene, through cationic or free radical polymerization to obtain a copolymer, wherein the appropriate addition of a chain transfer agent can effectively adjust and control the molecular weight; the second step is to cause a ring-opening reaction between acrylic acid hydroxy ester and anhydride bonds on the main chain, thereby introducing a photocurable acryloyloxy group on the side chain of the copolymer.

[0023] The benzocyclobutene structure on the side chain of the copolymer can be thermally cured, the introduced acryloxy group can be photocured, and the double bonds of divinylbenzene on the side chain can undergo crosslinking and curing reactions under light or heat conditions. In addition, the resin formed by copolymerization of styrene and maleic anhydride itself has good thermal stability, mechanical and electrical properties. The introduction of divinylbenzene and 4-vinylbenzocyclobutene monomers can further enhance the thermal stability of the resin and further reduce its dielectric constant.

[0024] The resin containing a benzocyclobutene structure can be cured by both light and heat. The obvious advantage of the dual-curing system is that heat curing can help cure non-planar parts, while light curing can increase the cross-linking density, improve the fullness and glossiness of the material, and provide excellent chemical resistance. In addition, the resin containing a benzocyclobutene structure has a short curing time, which can greatly improve production efficiency. After application, it can reduce surface contamination of the parts during the production process and improve the yield rate. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figures 1 to 5 They are infrared spectra of the photo-thermal dual curable resins containing benzocyclobutene structure obtained in Examples 1 to 5 respectively. DETAILED DESCRIPTION

[0026] The technical solutions in the present invention will be described clearly and completely below in conjunction with specific embodiments. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0027] The present invention provides a photothermal dual-curable resin containing a benzocyclobutene structure, which is prepared by polymerizing 4-vinylbenzocyclobutene, styrene, maleic anhydride, and divinylbenzene as monomers to obtain a copolymer, and then adding hydroxyl acrylic acid ester to obtain a copolymer through a ring-opening reaction; the photothermal dual-curable resin has a structural formula as shown in the following formula (I):

[0028]

[0029] Wherein, a, b, c, d are integers of 1 to 100, a+b+c+d is an integer of 4 to 300, and e is an integer of 1 to 7; R2 is a methyl group or a hydrogen atom.

[0030] The preparation method of the photothermal dual curable resin containing a benzocyclobutene structure comprises the following steps:

[0031] (1) Add the solvent for the base into a four-necked flask, install a mechanical stirrer and a condenser, and introduce nitrogen for deoxygenation for 20 minutes; then, after stirring and heating to an appropriate temperature, use a constant pressure dropping funnel to slowly drop maleic anhydride, styrene, 4-vinylbenzocyclobutene, divinylbenzene, four monomer solutions, a chain transfer agent and an initiator, and keep the temperature for a period of time after the dropwise addition is completed, and monitor the reaction progress by infrared spectroscopy;

[0032] The dropping time in step (1) is 1 to 5 hours, the heat preservation reaction time is 1 to 3 hours, and the reaction temperature is 20 to 80° C.;

[0033] (2) adding a measured amount of (meth) acrylate hydroxy ester and a catalyst to the system after the reaction in step (1), adjusting the temperature to a suitable temperature to continue the reaction, monitoring the progress of the reaction by infrared spectroscopy, and removing the reaction solvent in vacuum after the reaction is completed to obtain a colorless to light yellow photothermal dual-curable resin containing a benzocyclobutene structure.

[0034] The synthesis route of the photothermal dual curable resin containing a benzocyclobutene structure is as follows:

[0035]

[0036] wherein a, b, c, d are integers of 1 to 100, a+b+c+d are integers of 4 to 300, and e is an integer of 1 to 7; R2 is a methyl group or a hydrogen atom;

[0037] The reaction time of step (2) is 3 to 5 hours, and the reaction temperature is 80 to 150°C.

[0038] The solvent in step (1) is selected from at least one of water, alcohol solvents, ester solvents, ketone solvents, aromatic hydrocarbon solvents, N-methylpyrrolidone, and N,N-dimethylformamide; and the amount of the solvent used is 1 to 10 times the total mass of the four monomers.

[0039] Wherein, the chain transfer agent in step (1) is selected from at least one of tert-butyl alcohol, tert-dodecyl mercaptan, mercaptoethanol, thioglycolic acid, 3-mercaptopropionate isooctyl ester, 2,4-diphenyl-4-methyl-1-pentene, and tert-butyl methacrylate, and the amount of the chain transfer agent is 0.1% to 5% of the total mass of the four monomers; the initiator is selected from at least one of azobisisobutyronitrile, dibenzoyl peroxide, diethylhexyl peroxydicarbonate, potassium persulfate, ammonium persulfate, potassium persulfate-sodium hypophosphite, potassium persulfate-sodium bisulfite, boron trifluoride etherate, and trifluoromethanesulfonic acid, and the amount of the initiator is 0.1% to 5% of the total mass of the four monomers.

[0040] The catalyst in step (2) is selected from at least one of triethylamine, 4-dimethylaminopyridine, ethanolamine, ethylenediamine and potassium carbonate; the amount of the catalyst used is 0.1% to 5% of the total mass of the four monomers.

[0041] The present invention also provides the use of the photothermal dual curing resin containing a benzocyclobutene structure in an interlayer dielectric film or packaging material; specifically: the photothermal dual curing resin containing a benzocyclobutene structure and an initiator are uniformly mixed, and the interlayer dielectric film or packaging material is obtained by curing.

[0042] Example 1

[0043] 200 mL of anhydrous butanone was added to a 1000 mL three-necked round-bottom flask, a mechanical stirrer and a reflux condenser were installed, and nitrogen was introduced for deoxygenation for 20 minutes, then the stirrer was turned on and heated to 60° C. 10.4 g of styrene, 9.8 g of maleic anhydride, 13.0 g of 4-vinylbenzocyclobutene, 13.0 g of divinylbenzene, 2 g of initiator azobisisobutyronitrile, and 1 g of chain transfer agent mercaptoethanol were dissolved in 200 mL of anhydrous butanone, then transferred to a constant pressure dropping funnel, and slowly added dropwise to the three-necked flask for reaction (addition was completed in about 2 hours), and the reaction was kept warm for 2 hours after the addition was completed.

[0044] After the polymerization reaction is completed, 11.6 g of hydroxyethyl acrylate and 0.5 g of triethylamine as a catalyst are added to the three-necked flask, and the temperature is raised to 100°C for reaction for 5 hours. After the reaction is completed, the solvent is removed in vacuo, and the material is discharged while hot to obtain a photothermal dual-curable resin containing a benzocyclobutene structure.

[0045] The number average molecular weight Mn of the photothermal dual curable resin containing a benzocyclobutene structure obtained in Example 1 is 2710 Daltons, and its infrared spectrum is as follows: Figure 1 The spectrum analysis is shown in Table 1.

[0046] Table 1

[0047]

[0048]

[0049] Example 2

[0050] 200 mL of xylene was added to a 1000 mL three-necked round-bottom flask, a mechanical stirrer and a reflux condenser were installed, and nitrogen was introduced for deoxygenation for 20 minutes, then the stirrer was turned on and heated to 30° C. 10.4 g of styrene, 9.8 g of maleic anhydride, 13.0 g of 4-vinylbenzocyclobutene, 13.0 g of divinylbenzene, 2 g of initiator benzoyl peroxide, and 1 g of chain transfer agent tert-butyl methacrylate were dissolved in 200 mL of xylene, then transferred to a constant pressure dropping funnel, and slowly added dropwise to the three-necked flask for reaction (addition was completed in about 1 hour), and the reaction was kept warm for 2 hours after the addition was completed.

[0051] After the polymerization reaction is completed, 13.1 g of hydroxyethyl methacrylate and 1 g of triethylamine as a catalyst are added to a three-necked flask, and the temperature is raised to 130°C for reaction for 5 hours. After the reaction is completed, the solvent is removed in vacuo, and the material is discharged while hot to obtain a photothermal dual-curable resin containing a benzocyclobutene structure.

[0052] The number average molecular weight Mn of the photothermal dual curable resin containing a benzocyclobutene structure obtained in Example 2 is 2617 Daltons, and its infrared spectrum is as follows: Figure 2 shown.

[0053] Example 3

[0054] 200 mL of anhydrous toluene was added to a 1000 mL three-necked round-bottom flask, a mechanical stirrer and a reflux condenser were installed, and nitrogen was introduced for deoxygenation for 20 minutes, then the stirrer was turned on and heated to 20° C. 10.4 g of styrene, 9.8 g of maleic anhydride, 13.0 g of 4-vinylbenzocyclobutene, 13.0 g of divinylbenzene, 0.5 g of initiator trifluoromethanesulfonic acid, and 1 g of chain transfer agent tert-butyl methacrylate were dissolved in 200 mL of anhydrous toluene, then transferred to a constant pressure dropping funnel, and slowly added dropwise to the three-necked flask for reaction (addition was completed in about 1 hour), and the reaction was kept warm for 2 hours after the addition was completed.

[0055] After the polymerization reaction is completed, 13 grams of hydroxypropyl acrylate and 1 gram of 4-dimethylaminopyridine as a catalyst are added to the three-necked flask, and the temperature is raised to 120°C for reaction for 5 hours. After the reaction is completed, the solvent is removed in vacuo, and the material is discharged while hot to obtain a photothermal dual-curable resin containing a benzocyclobutene structure.

[0056] The number average molecular weight Mn of the photothermal dual curable resin containing a benzocyclobutene structure obtained in Example 3 is 4936 Daltons, and its infrared spectrum is as follows: Figure 3 shown.

[0057] Example 4

[0058] 200 mL of propyl acetate was added to a 1000 mL three-necked round-bottom flask, a mechanical stirrer and a reflux condenser were installed, and nitrogen was introduced for deoxygenation for 20 minutes, then the stirrer was turned on and heated to 80° C. 10.4 g of styrene, 9.8 g of maleic anhydride, 6.5 g of 4-vinylbenzocyclobutene, 13.0 g of divinylbenzene, 2 g of initiator diethylhexyl peroxydicarbonate, and 1 g of chain transfer agent tert-dodecyl mercaptan were dissolved in 200 mL of propyl acetate, then transferred to a constant pressure dropping funnel, and slowly added dropwise to the three-necked flask for reaction (addition was completed in about 2 hours), and the reaction was kept warm for 2 hours after the addition was completed.

[0059] After the polymerization reaction is completed, 14.4 grams of hydroxypropyl methacrylate and 2 grams of triethylamine as a catalyst are added to a three-necked flask, and the temperature is raised to 100°C for reaction for 5 hours. After the reaction is completed, the solvent is removed in vacuo, and the material is discharged while hot to obtain a photothermal dual-curable resin containing a benzocyclobutene structure.

[0060] The number average molecular weight Mn of the photothermal dual curable resin containing a benzocyclobutene structure obtained in Example 4 is 5104 Daltons, and its infrared spectrum is as follows: Figure 4 shown.

[0061] Example 5

[0062] 200 mL of anhydrous butanone was added to a 1000 mL three-necked round-bottom flask, a mechanical stirrer and a reflux condenser were installed, and nitrogen was introduced for deoxygenation for 20 minutes, then the stirrer was turned on and heated to 80° C. 10.4 g of styrene, 4.9 g of maleic anhydride, 13.0 g of 4-vinylbenzocyclobutene, 13.0 g of divinylbenzene, 1 g of initiator boron trifluoride etherate, and 1 g of chain transfer agent tert-butyl methacrylate were dissolved in 200 mL of anhydrous butanone, then transferred to a constant pressure dropping funnel, and slowly added dropwise to the three-necked flask for reaction (addition was completed in about 2 hours), and the reaction was kept warm for 2 hours after the addition was completed.

[0063] After the polymerization reaction is completed, add 7.2 grams of hydroxypropyl methacrylate and 2 grams of triethylamine as a catalyst into a three-necked flask, heat to 100°C and react for 5 hours. After the reaction is completed, remove the solvent in vacuo and discharge the material while hot to obtain a photothermal dual-curable resin containing a benzocyclobutene structure.

[0064] The number average molecular weight Mn of the photothermal dual curable resin containing a benzocyclobutene structure obtained in Example 5 is 1630 Daltons, and its infrared spectrum is as follows: Figure 5 shown.

[0065] Example 6

[0066] 200 mL of anhydrous toluene was added to a 1000 mL three-necked round-bottom flask, a mechanical stirrer and a reflux condenser were installed, and nitrogen was introduced for deoxygenation for 20 minutes, then the stirrer was turned on and heated to 80° C. 22 g of styrene, 4.9 g of maleic anhydride, 13.0 g of 4-vinylbenzocyclobutene, 13.0 g of divinylbenzene, 1.5 g of initiator diethylhexyl peroxydicarbonate, and 1 g of chain transfer agent tert-dodecyl mercaptan were dissolved in 200 mL of anhydrous butanone, then transferred to a constant pressure dropping funnel, and slowly added dropwise to the three-necked flask for reaction (addition was completed in about 2 hours), and the reaction was kept warm for 2 hours after the addition was completed.

[0067] After the polymerization reaction is completed, add 7.2 grams of hydroxypropyl methacrylate and 2 grams of triethylamine as a catalyst into a three-necked flask, heat to 100°C and react for 5 hours. After the reaction is completed, remove the solvent in vacuo and discharge the material while hot to obtain a photothermal dual-curable resin containing a benzocyclobutene structure.

[0068] The number average molecular weight Mn of the photo-thermal dual curable resin containing a benzocyclobutene structure obtained in Example 6 is 5880 Daltons.

[0069] Application performance testing:

[0070] Curing film

[0071] 1. Photocuring process: 95 parts of the resin obtained in Examples 1 to 6, 2.5 parts of ITX initiator (BASF), and 2.5 parts of 907 initiator (BASF) were mixed and stirred evenly, poured into a polytetrafluoroethylene mold, and the bubbles were removed by vacuum in a vacuum drying oven at 70°C, and then irradiated under a 2KW ultraviolet lamp until it was completely cured into a film.

[0072] 2. Thermal curing process: Put the photocured cured film (with a polytetrafluoroethylene mold) into an oven and cure it in 5 stages. In the first stage, slowly heat up to 180°C and keep it for 5 hours, in the second stage, slowly heat up to 200°C and keep it for 5 hours, in the third stage, slowly heat up to 220°C and keep it for 3 hours, in the fourth stage, slowly heat up to 240°C and keep it for 3 hours, in the fifth stage, slowly cool down to 160°C and keep it for 5 hours, and you will get a cured film after dual photocuring and thermal curing.

[0073] Evaluation Method

[0074] 1. Refractive index of cured film

[0075] According to the specified method of the national standard "GB / T 39691-2020 Determination of the refractive index of plastics", the refractive index of the cured film was measured using a 2WAJ monocular Abbe refractometer.

[0076] 2. Hardness of the cured film

[0077] The pencil hardness of the cured film was tested according to the national standard GB / T 6739-2006 Determination of paint film hardness by pencil method for paints and varnishes.

[0078] 3. Dielectric constant Dk and dielectric loss Df of cured film

[0079] The dielectric properties of the cured films of the above embodiments were tested using a split post dielectric resonator (SPDR) method (specifically, the dielectric constant Dk and the dielectric loss Df were tested), wherein the test frequency was 5 GHz.

[0080] 4. Thermogravimetric analysis of cured films

[0081] According to the national standard GB / T 40396-2021 Test method for glass transition temperature of polymer-based composite materials - Dynamic mechanical analysis (DMA) , the glass transition temperature Tg of the cured film was tested using a Mettler DSC 3-differential scanning calorimeter.

[0082] Table 1 below shows the test results of the cured films of various examples.

[0083] Table 1

[0084]

[0085] It can be seen from Table 1 above that the cured films made using the resins of the embodiments of the present invention have better dielectric properties, with relatively low dielectric constants Dk and dielectric loss Df, higher Tg, better heat resistance, and excellent refractive index and hardness.

[0086] The above descriptions are merely embodiments of the present invention and are not intended to limit the patent scope of the present invention. Any modifications or equivalent transformations made using the contents of the present invention specification, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present invention.

Claims

1. A photo-thermal dual curable resin containing a benzocyclobutene structure, It is characterized in that The copolymer is obtained by polymerizing 4-vinylbenzocyclobutene, styrene, maleic anhydride and divinylbenzene as monomers, and then adding hydroxy acrylate to obtain the copolymer through a ring-opening reaction. The structural formula of the light-heat dual curing resin is shown in the following formula (I): wherein a, b, c, d are integers of 1 to 100, a+b+c+d is an integer of 4 to 300, and e is an integer of 1 to 7; R 2 A methyl group or a hydrogen atom.

2. A method for preparing the photo-thermal dual-curable resin containing a benzocyclobutene structure as claimed in claim 1, It is characterized in that The steps include: (1) using 4-vinylbenzocyclobutene, styrene, maleic anhydride and divinylbenzene as monomers for polymerization; (2) Adding hydroxy acrylate to the system after the reaction in step (1), and subjecting it to a ring-opening reaction in the presence of a catalyst, to obtain a photo-thermal dual-curable resin containing a benzocyclobutene structure.

3. The method for preparing the photo-thermal dual curable resin containing a benzocyclobutene structure according to claim 2, It is characterized in that The reaction in step (1) is carried out in a solvent.

4. The method for preparing the photo-thermal dual curable resin containing a benzocyclobutene structure according to claim 3, It is characterized in that The solvent is selected from at least one of water, alcohol solvents, ester solvents, ketone solvents, aromatic hydrocarbon solvents, N-methylpyrrolidone, and N,N-dimethylformamide; the amount of the solvent is 1 to 10 times the total mass of the four monomers.

5. The method for preparing the photo-thermal dual curable resin containing a benzocyclobutene structure according to claim 2, It is characterized in that In step (1), a chain transfer agent and an initiator are added.

6. The method for preparing the photo-thermal dual curable resin containing a benzocyclobutene structure according to claim 5, It is characterized in that The chain transfer agent is selected from at least one of tert-butyl alcohol, tert-dodecyl mercaptan, mercaptoethanol, thioglycolic acid, isooctyl 3-mercaptopropionate, 2,4-diphenyl-4-methyl-1-pentene, and tert-butyl methacrylate, and the amount of the chain transfer agent is 0.1% to 5% of the total mass of the four monomers; the initiator is selected from at least one of azobisisobutyronitrile, dibenzoyl peroxide, diethylhexyl peroxydicarbonate, potassium persulfate, ammonium persulfate, potassium persulfate-sodium hypophosphite, potassium persulfate-sodium bisulfite, boron trifluoride etherate, and trifluoromethanesulfonic acid, and the amount of the initiator is 0.1% to 5% of the total mass of the four monomers.

7. The method for preparing the photo-thermal dual curable resin containing a benzocyclobutene structure according to claim 2, It is characterized in that The catalyst in step (2) is selected from at least one of triethylamine, 4-dimethylaminopyridine, ethanolamine, ethylenediamine and potassium carbonate; the amount of the catalyst used is 0.1% to 5% of the total mass of the four monomers.

8. The method for preparing the photo-thermal dual curable resin containing a benzocyclobutene structure according to claim 2, It is characterized in that The reaction time of step (1) is 1 to 3 hours, and the reaction temperature is 20 to 80° C.; the reaction time of step (2) is 3 to 5 hours, and the reaction temperature is 80 to 150° C.

9. Use of the photo-thermal dual curable resin containing a benzocyclobutene structure as claimed in claim 1 in an interlayer dielectric film or packaging material.

10. Use of the photo-thermal dual curable resin containing a benzocyclobutene structure according to claim 9, It is characterized in that The photo-thermal dual-curable resin containing a benzocyclobutene structure as claimed in claim 1 is mixed evenly with an initiator, and then cured to obtain an interlayer dielectric film or packaging material.

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