Display panel and preparation method thereof

Abstract

The application discloses a display panel and a preparation method thereof. The display panel comprises a driving back plate, a first surface of the driving back plate is provided with a plurality of normal bonding areas and a plurality of redundant bonding areas; wherein a first spacing between at least part of two adjacent normal bonding areas is greater than a second spacing between at least part of the normal bonding area and the redundant bonding area, and the normal bonding area and the adjacent redundant bonding area constitute a bonding group; a light-emitting layer is located on the first surface and comprises a plurality of sub-pixels, the sub-pixels are electrically connected with the normal bonding area or the redundant bonding area, and the normal bonding area or the redundant bonding area in the same bonding group is used for electrically connecting with the sub-pixel of the same light-emitting color. In the above manner, the application can improve the Micro-LED mass transfer yield and repair yield.

Description

Technical Field

[0001] This application belongs to the field of display technology, specifically relating to a display panel and its manufacturing method. Background Technology

[0002] Micro-LED, as a novel display technology, is receiving increasing attention. However, the current yield rate of Micro-LED mass transfer technology is relatively low, requiring subsequent defective pixel repair to meet display standards. Due to the dense arrangement of Micro-LEDs, improving both mass transfer and repair yields are pressing technical challenges. Summary of the Invention

[0003] This application provides a display panel and a method for manufacturing the same, in order to improve the yield of mass transfer and repair of Micro-LEDs.

[0004] To solve the above-mentioned technical problems, one technical solution adopted in this application is: providing a display panel, including: a driving backplate, wherein a first surface of the driving backplate is provided with a plurality of normal bonding areas and a plurality of redundant bonding areas; wherein a first spacing between at least partially adjacent two normal bonding areas is greater than a second spacing between at least partially adjacent normal bonding areas and redundant bonding areas, and the normal bonding areas and adjacent redundant bonding areas form a bonding group; an emissive layer, located on the first surface, including a plurality of sub-pixels, wherein the sub-pixels are electrically connected to the normal bonding areas or the redundant bonding areas, and the normal bonding areas or the redundant bonding areas within the same bonding group are used to be electrically connected to sub-pixels of the same emitting color.

[0005] To solve the above-mentioned technical problems, another technical solution adopted in this application is: providing a method for manufacturing a display panel, comprising: providing a driving backplate; wherein, a first surface of the driving backplate is provided with a plurality of normal bonding areas and a plurality of redundant bonding areas; a first spacing between at least partially adjacent two normal bonding areas is greater than a second spacing between adjacent normal bonding areas and redundant bonding areas, and the normal bonding areas and adjacent redundant bonding areas constitute a bonding group; sub-pixels are disposed on the normal bonding areas of the driving backplate; in response to a sub-pixel bonded to the normal bonding area being determined to be a bad pixel, a repair sub-pixel with the same emission color is introduced on the redundant bonding area within the same bonding group.

[0006] Unlike existing technologies, the advantages of this application are as follows: Firstly, the display panel provided in this application has multiple normal bonding areas and multiple redundant bonding areas on its driving backplane. The normal bonding areas and adjacent redundant bonding areas can form a bonding group, and a sub-pixel is electrically connected to a normal bonding area or a redundant bonding area within a bonding group. In practical applications, when a sub-pixel bonded to a normal bonding area is determined to be a defective pixel, a repair sub-pixel with the same emission color can be introduced onto a redundant bonding area within the same bonding group. That is, the redundant repair method introduced in this application increases the repair yield compared to in-situ repair. Secondly, in this application, the first spacing between at least some of two adjacent normal bonding areas is greater than the second spacing between adjacent normal bonding areas and redundant bonding areas. During mass transfer, when bonding subpixels in the normal bonding area, the above design method can increase the spacing between adjacent subpixels, reduce interference between adjacent subpixels, and reduce the probability of subpixel rotation or offset, thereby improving the transfer yield. In addition, this design method can appropriately increase the protrusion area of ​​the transfer head of the transferred subpixel to increase the tolerance for subpixel offset and improve the transfer yield. Attached Figure Description

[0007] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort, wherein:

[0008] Figure 1 This is a schematic diagram of the structure of one embodiment of the display panel of this application;

[0009] Figure 2 for Figure 1 A partial top view of a previous embodiment of defect repair for a central display panel;

[0010] Figure 3 for Figure 2 A top view of one embodiment of the corresponding pixel driving circuit and related traces;

[0011] Figure 4 for Figure 1 A partial top view of another embodiment before defect repair of the display panel;

[0012] Figure 5 for Figure 1 A partial top view of another embodiment before defect repair of the display panel;

[0013] Figure 6 for Figure 5A top view of one embodiment of the corresponding pixel driving circuit and related traces;

[0014] Figure 7 for Figure 1 A partial top view of another embodiment before defect repair of the display panel;

[0015] Figure 8 for Figure 1 A partial top view of another embodiment before defect repair of the display panel;

[0016] Figure 9 for Figure 1 A partial top view of another embodiment before defect repair of the display panel;

[0017] Figure 10 for Figure 1 A partial top view of another embodiment before defect repair of the display panel;

[0018] Figure 11 for Figure 1 A partial top view of another embodiment before defect repair of the display panel;

[0019] Figure 12 for Figure 1 A partial top view of another embodiment before defect repair of the display panel;

[0020] Figure 13 for Figure 1 A partial top view of another embodiment before defect repair of the display panel;

[0021] Figure 14 for Figure 1 A partial top view of another embodiment before defect repair of the display panel;

[0022] Figure 15 This is a schematic flowchart of one embodiment of the method for manufacturing the display panel of this application;

[0023] Figure 16 for Figure 2 A schematic diagram of a structural embodiment of the repaired display panel;

[0024] Figure 17 for Figure 2 A schematic diagram of another embodiment of the display panel after repair. Detailed Implementation

[0025] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of the embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this application.

[0026] Please see Figure 1 and Figure 2 , Figure 1 This is a schematic diagram of the structure of one embodiment of the display panel of this application. Figure 2 for Figure 1 This is a partial top view of a previous embodiment of defect repair for a display panel, which can be a Micro-LED display panel or the like. Specifically, the display panel 1 includes a driving backplate 10 and a light-emitting layer 12 located on a first surface 100 of the driving backplate 10.

[0027] Among them, such as Figure 2 As shown, the first surface 100 of the drive backplane 10 is provided with a plurality of normal bonding areas 1020 and a plurality of redundant bonding areas 1022; and the first spacing D1 between at least partially adjacent normal bonding areas 1020 is greater than the second spacing D2 between at least partially adjacent normal bonding areas 1020 and redundant bonding areas 1022, and the normal bonding areas 1020 and adjacent redundant bonding areas 1022 form a bonding group 102. Optionally, the first spacing D1 can be the spacing between the edges of two adjacent normal bonding areas 1020, and the second spacing D2 can be the spacing between the edges of adjacent normal bonding areas 1020 and the edges of redundant bonding areas 1022. Alternatively, the first spacing D1 can be the spacing between the center points of two adjacent normal bonding areas 1020, and the second spacing D2 can be the spacing between the center points of adjacent normal bonding areas 1020 and the center points of redundant bonding areas 1022. Optionally, a normal binding area 1020 may form a binding group 102 with an adjacent redundant binding area 1022; of course, in other embodiments, a normal binding area 1020 may also form a binding group 102 with a plurality of adjacent redundant binding areas 1022.

[0028] The light-emitting layer 12 includes a plurality of sub-pixels 120, which can be Micro-LEDs, etc., and can emit red light, green light, or blue light, etc.; and the sub-pixels 120 are electrically connected to the normal bonding area 1020 or the redundant bonding area 1022, and the normal bonding area 1020 or the redundant bonding area 1022 within the same bonding group 102 is used to electrically connect to the sub-pixels 120 of the same light-emitting color.

[0029] In this embodiment, the normal bonding area 1020 and the redundant bonding area 1022 can have the same appearance structure. The main difference between the normal bonding area 1020 and the redundant bonding area 1022 lies in the different priorities of the normal bonding area 1020 and the redundant bonding area 1022 when bonding with the sub-pixels 120 in the light-emitting layer 12. Generally, during mass transfer, sub-pixel 120 is preferentially bonded to the normal bonding area 1020 within the bonding group 102. When a sub-pixel 120 bonded to the normal bonding area 1020 is determined to be a bad sub-pixel, the bad sub-pixel is removed; or, when the bad sub-pixel is open-circuited, the bad sub-pixel is retained. A repair sub-pixel is introduced on the redundant bonding area 1022 within the same bonding group 102. The emission color of the repair sub-pixel is the same as the emission color of the bad sub-pixel when it emits light normally. That is, the bonding time of the sub-pixel 120 electrically connected to the normal bonding area 1020 is earlier than the bonding time of the sub-pixel 120 electrically connected to the redundant bonding area 1022. The normal bonding area 1020 within the same bonding group 102 is preferentially bonded to the sub-pixel 120 over the redundant bonding area 1022.

[0030] Optionally, in this embodiment, only one sub-pixel 120 is provided on the normal bonding area 1020 or the redundant bonding area 1022 within the same bonding group 102. Alternatively, one sub-pixel 120 is provided on both the normal bonding area 1020 and the redundant bonding area 1022 within the same bonding group 102, and the sub-pixel 120 on the normal bonding area 1020 is disconnected from the corresponding pixel driving circuit, while the sub-pixel 120 on the redundant bonding area 1022 is electrically connected to the corresponding pixel driving circuit. Figure 2 yes Figure 1 A partial schematic diagram of the display panel 1 before defect repair, therefore it can be considered that... Figure 2 The area covered by the sub-pixel 120 is the normal bonding area 1020; and the area size of the normal bonding area 1020 and the redundant bonding area 1022 can be the same as the area size of the sub-pixel 120.

[0031] Furthermore, generally speaking, the number of sub-pixels 120 electrically connected to the normal bonding area 1020 on a display panel 1 is greater than the number of sub-pixels 120 electrically connected to the redundant bonding area 1022; for example, the ratio of the number of sub-pixels 120 electrically connected to the normal bonding area 1020 to the number of sub-pixels 120 electrically connected to the redundant bonding area 1022 may be much greater than 100. Optionally, all sub-pixels 120 are electrically connected to the normal bonding area 1020. Optionally, at least one of the multiple redundant bonding areas 1022 is not electrically connected to the sub-pixels 120.

[0032] On the one hand, this application introduces a redundant repair method, which reduces the repair difficulty and increases the repair yield compared to in-situ repair. On the other hand, in this application, the first spacing D1 between at least some of the two adjacent normal bonding regions 1020 is greater than the second spacing D2 between the adjacent normal bonding region 1020 and the redundant bonding region 1022. During the mass transfer process, when the sub-pixel 120 is bonded in the normal bonding region 1020, the above design can increase the spacing between adjacent sub-pixels 120, reduce the interference between adjacent sub-pixels 120, and reduce the probability of sub-pixels 120 rotating or shifting, thereby improving the transfer yield; and this design can also allow the protrusion area of ​​the transfer head of the transferred sub-pixel 120 to be appropriately increased, thereby increasing the tolerance for sub-pixel 120 shifting and improving the transfer yield.

[0033] In one implementation, such as Figure 2 As shown, a plurality of normal bonding regions 1020 and a plurality of redundant bonding regions 1022 are arranged in an array along a first direction X and a second direction Y, and the first direction X and the second direction Y intersect each other. Optionally, the first direction X and the second direction Y are perpendicular to each other. Wherein, the first spacing D1 between two normal bonding regions 1020 that are at least partially adjacent in the first direction X is greater than the second spacing D2 between normal bonding regions 1020 and redundant bonding regions 1022 that are at least partially adjacent in the first direction X or the second direction Y. Alternatively, the first spacing D1 between two normal bonding regions 1020 that are at least partially adjacent in the second direction Y is greater than the second spacing D2 between normal bonding regions 1020 and redundant bonding regions 1022 that are at least partially adjacent in the first direction X or the second direction Y. In some cases, such as... Figure 2 As shown, two adjacent normal bonding regions 1020 can also be located in an oblique direction, i.e., with Figure 2 In the direction where the first direction X or the second direction Y intersects, the first spacing D1 between at least partially adjacent normal bonding areas 1020 in the diagonal direction is greater than the second spacing D2 between at least partially adjacent normal bonding areas 1020 and redundant bonding areas 1022 in the first direction X or the second direction Y. The arrangement of the plurality of normal bonding areas 1020 and the plurality of redundant bonding areas 1022 is relatively regular and easy to fabricate. Optionally, in this embodiment, the emission colors of the sub-pixels 120 bonded by the two adjacent normal bonding areas 1020 mentioned above can be the same or different, and this application does not limit this.

[0034] Furthermore, such as Figure 2As shown, in the first direction X or the second direction Y, a redundant bonding area 1022 is provided between at least two partially adjacent normal bonding areas 1020. This design can increase the first spacing D1 between two adjacent normal bonding areas 1020. During mass transfer, when the sub-pixel 120 is bonded by the normal bonding area 1020, the above design can further reduce the interference between adjacent sub-pixels 120, reduce the probability of sub-pixels 120 rotating or shifting, and improve the transfer yield; and can increase the protrusion area of ​​the transfer head of the transferred sub-pixel to increase the tolerance to sub-pixel shift.

[0035] Please continue reading. Figure 2 A plurality of adjacent sub-pixels 120 constitute a pixel unit (not shown), and a plurality of bonding groups 102 electrically connected to the pixel unit constitute a combination unit 104. In the first direction X, the plurality of normal bonding areas 1020 and the plurality of redundant bonding areas 1022 within the combination unit 104 are arranged in two rows, with the normal bonding areas 1020 and the redundant bonding areas 1022 alternating between the two rows (i.e., alternating vertically) in the two rows. This design allows for a larger distance between adjacent normal bonding areas 1020. During mass transfer, when the normal bonding areas 1020 bond the sub-pixels 120, this design can further reduce interference between adjacent sub-pixels 120, reducing the probability of sub-pixels 120 rotating or shifting, thereby improving transfer yield. Furthermore, it increases the protrusion area of ​​the transfer head of the transferred sub-pixels, increasing tolerance to sub-pixel shifting.

[0036] Optionally, such as Figure 2 As shown, the number of adjacent sub-pixels 120 arranged in the diagonal direction is greater than the number of adjacent sub-pixels 120 arranged in the same row in the first direction X or the second direction Y; wherein, the diagonal direction intersects the first direction X and the second direction Y. For example, with Figure 2 Taking three sub-pixels 120 at position 104 of a combination unit as an example, the red sub-pixel R and the green sub-pixel G are adjacent in the first diagonal direction, and the green sub-pixel G and the blue sub-pixel B are adjacent in the second diagonal direction. The first diagonal direction and the second diagonal direction are different, but both intersect with the first direction X and the second direction Y. The above design can maximize the spacing between two adjacent sub-pixels 120.

[0037] In one embodiment, the driving backplane 10 further includes multiple pixel driving circuits (not shown), with the normal bonding area 1020 and redundant bonding area 1022 within the same bonding group 102 electrically connected to the same pixel driving circuit. This design can save routing space for the pixel driving circuit and is more suitable for high PPI or densely packed sub-pixel arrangements. Optionally, in this embodiment, the structure of the pixel driving circuit can be any of the existing technologies, such as 2T1C, 7T1C, etc., and this application does not limit it.

[0038] Optionally, the sub-pixel 120 can be a horizontal light-emitting element, and each sub-pixel 120 has a first electrode (not shown) and a second electrode (not shown) on the side facing the first surface 100. Please continue reading. Figure 2 Each normal bonding region 1020 or redundant bonding region 1022 includes a first electrode bonding region 1060 for electrical connection with the first electrode and a second electrode bonding region 1062 for electrical connection with the second electrode; for example... Figure 2 The first electrode corresponding to the first electrode bonding region 1060 marked in the figure is a P electrode. Figure 2 The second electrode corresponding to the second electrode bonding area 1062 indicated is an N-electrode. Of course, in other embodiments, the first electrode corresponding to the first electrode bonding area 1060 can also be an N-electrode, and the second electrode corresponding to the second electrode bonding area 1062 can also be a P-electrode. Furthermore, the two first electrode bonding areas 1060 within the same bonding group 102 are electrically connected to the output terminal of the same pixel driving circuit; that is, the normal bonding area 1020 and the redundant bonding area 1022 within the same bonding group 102 are electrically connected to the same pixel driving circuit, and the sub-pixels set in the normal bonding area 1020 and the repair sub-pixels set in the redundant bonding area 1022 can be driven by the same pixel driving circuit. This design can save the routing space of the pixel driving circuit and is more suitable for high PPI or tightly arranged sub-pixel layouts.

[0039] In an application scenario, such as Figure 2 As shown, the normal bonding area 1020 and the redundant bonding area 1022 within the same bonding group 102 are arranged adjacently along the first direction X, and the multiple bonding groups 102 within the same combination unit 104 are arranged at intervals along the second direction Y. In the above design, the redundant bonding area 1022 is designed on the first direction X of the normal bonding area 1020. This structural design is relatively simple and the process is easy to implement.

[0040] Optionally, in this embodiment, as Figure 2As shown, in the second direction Y, multiple normal bonding areas 1020 and multiple redundant bonding areas 1022 are arranged alternately in the same row; and in the first direction X, the upper and lower rows of normal bonding areas 1020 and redundant bonding areas 1022 are arranged in opposite ways, and the upper and lower rows are aligned with each other.

[0041] Based on this, such as Figure 2 As shown, in the first direction X, two first electrode bonding regions 1060 within the same bonding group 102 are arranged opposite to each other and spaced apart, and the two first electrode bonding regions 1060 within the same bonding group 102 are located between two second electrode bonding regions 1062; that is, in the first direction X, the second electrode bonding regions 1062, first electrode bonding regions 1060, and second electrode bonding regions 1062 are arranged sequentially and spaced apart in the same bonding group 102. At this time, in the first direction X, the orthographic projection of the output terminal of the pixel driving circuit on the first surface 100 (e.g., Figure 2 (As indicated by the dashed box marked 108) is located between the two first electrode bonding regions 1060. The above structural design is relatively simple and easy to fabricate.

[0042] Optionally, please refer to Figure 2 and Figure 3 , Figure 3 for Figure 2 A top view schematic diagram of the corresponding pixel driving circuit and related wiring in one embodiment. In this embodiment, the driving backplate 10 includes a thin-film transistor layer and an insulating layer located above the thin-film transistor layer; wherein, the pixel driving circuit 103 is located within the thin-film transistor layer, and a first surface 100 is formed on the side of the insulating layer facing away from the thin-film transistor layer. The first electrode bonding region 1060 and the second electrode bonding region 1062 can be exposed from the first surface 100 of the driving backplate 10 to be bonded to the sub-pixel 120. At this time, a conductive hole (i.e., a conductive hole) can be provided at the position of the output terminal of the pixel driving circuit 103 on the insulating layer. Figure 2 and Figure 3 (As indicated by the dashed box marked 108), the conductive via is further electrically connected to the two first electrode bonding areas 1060 on both sides via metal traces. From Figure 2 and Figure 3 As can be seen, the output terminals of the pixel driving circuit 103 are arranged at intervals along the second direction Y, which allows the pixel driving circuit 103 to be repeatedly arranged in the second direction Y, reducing the layout difficulty of the pixel driving circuit 103.

[0043] Please continue reading. Figure 2 , Figure 2The intermediate pixel unit includes three adjacent sub-pixels 120 (red sub-pixel R, green sub-pixel G, and blue sub-pixel B), and the corresponding combination unit 104 includes three bonding groups 102 electrically connected to the sub-pixels 120 in the pixel unit. Three normal bonding areas 1020 in the combination unit 104 are arranged alternately vertically, and three redundant bonding areas 1022 in the combination unit 104 are arranged alternately vertically. Furthermore, the display panel has multiple repeating units 106; in the second direction Y, two adjacent combination units 104 constitute a repeating unit 106, and multiple normal bonding areas 1020 within the repeating unit 106 are arranged alternately vertically, and multiple redundant bonding areas 1022 within the repeating unit 106 are arranged alternately vertically. This design of the repeating unit 106 can reduce the complexity of the manufacturing process of the display panel 1.

[0044] Of course, in other implementations... Figure 2 The arrangement of the intermediate unit 104 can also be other. For example, please refer to... Figure 4 , Figure 4 for Figure 1 A partial top view of another embodiment of the display panel before defective pixel repair. Figure 4 The middle pixel unit includes three adjacent sub-pixels 120 (red sub-pixel R, green sub-pixel G, and blue sub-pixel B), and the corresponding combination unit 104 includes three bonding groups 102 electrically connected to the sub-pixels 120 in the pixel unit. In the first direction X, at least two partially adjacent combination units 104 are arranged axially symmetrically, and at least some of the normal bonding areas 1020 corresponding to the same emission color sub-pixels in the two axially symmetrically arranged combination units 104 are adjacent. This design allows two sub-pixels 120 located at the normal bonding areas 1020 positions within two partially adjacent bonding groups 102 in the first direction X to be transferred and bonded simultaneously, thereby improving bonding efficiency; and during the bonding transfer process, they are not affected by the sub-pixels 120 on the remaining normal bonding areas 1020, thereby improving bonding yield. For example, Figure 4 Two blue sub-pixels that are adjacent in the first direction X and separated by no redundant binding area 1022 in the middle can be transferred and bound simultaneously. Due to the presence of the surrounding redundant binding area 1022, they will not be squeezed or collided with the adjacent red and green sub-pixels during the binding process.

[0045] Optionally, such as Figure 4As shown, in the first direction X, the third distance D3 between two adjacent normal bonding areas 1020 originating from two adjacent combination units 104 is smaller than the fourth distance D4 between two adjacent normal bonding areas 1020 within the same combination unit 104. This design can increase the pixel density to improve the display effect. Optionally, the third distance D3 and the fourth distance D4 can be the spacing between the edges of two adjacent normal bonding areas 1020. Alternatively, the third distance D3 and the fourth distance D4 can be the spacing between the center points of two adjacent normal bonding areas 1020. Another option is... Figure 4 As shown, four adjacent combination units 104 (four adjacent combination units 104 in the top, bottom, left, and right directions) in the first direction X and the second direction Y constitute a repeating unit 106; in the second direction Y, normal bonding regions 1020 and redundant bonding regions 1022 located in the same row within the repeating unit 106 are arranged alternately. This design can reduce the difficulty of process fabrication.

[0046] In another application scenario, such as Figure 5 As shown, Figure 5 for Figure 1 This is a partial top view of another embodiment of the display panel before defect repair. Normal bonding areas 1020 and redundant bonding areas 1022 within the same bonding group 102 are arranged at intervals along the second direction Y. Multiple bonding groups 102 within the same assembly unit 104 are arranged in two rows along the first direction X, with the two rows of bonding groups 102 staggered relative to each other. Optionally, the stagger between the two rows of bonding groups 102 is one redundant bonding area 1022 or one normal bonding area 1020. In the above design, the redundant bonding area 1022 is designed on the second direction Y of the normal bonding area 1020. This structural design is relatively simple and the manufacturing process is easy to implement.

[0047] Optionally, such as Figure 5 As shown, in the second direction Y, multiple normal bonding areas 1020 and multiple redundant bonding areas 1022 are arranged alternately in the same row; and in the first direction X, the upper and lower rows of normal bonding areas 1020 and redundant bonding areas 1022 are arranged alternately in the same way, with the upper and lower rows staggered.

[0048] Based on this, such as Figure 5 As shown, in the second direction Y, two first electrode bonding regions 1060 within the same bonding group 102 are arranged opposite to each other and spaced apart, and two second electrode bonding regions 1062 within the same bonding group 102 are arranged opposite to each other and spaced apart. There is a gap (not shown) between the two rows of bonding groups 102 within the same combination unit 104, and the output terminal of the pixel driving circuit is projected onto the orthographic projection of the first surface 100 (e.g., ...). Figure 5(As indicated by the dashed box marked 108) is located within the gap and between the two first electrode bonding regions 1060 within the same bonding group 102. This design reduces wiring complexity and fabrication difficulty. Optional, such as Figure 5 As shown, in the second direction Y, there is an intermediate region 105 between the two first electrode bonding regions 1060 within the same bonding group 102, and the output terminal of the pixel driving circuit is projected onto the first surface 100 (e.g., Figure 5 (As shown by the dashed box marked 108) and the middle region 105 are spaced apart in the first direction X.

[0049] Optionally, please refer to the following as well. Figure 5 and Figure 6 , Figure 6 for Figure 5 A top view schematic diagram of the corresponding pixel driving circuit and related wiring in one embodiment. In this embodiment, the driving backplate 10 includes a thin-film transistor layer and an insulating layer located above the thin-film transistor layer; wherein, the pixel driving circuit is located within the thin-film transistor layer, and a first surface 100 is formed on the side of the insulating layer facing away from the thin-film transistor layer. The first electrode bonding region 1060 and the second electrode bonding region 1062 can be exposed from the first surface 100 of the driving backplate 10 to be bonded to the sub-pixel 120. At this time, a conductive hole (i.e., a conductive hole) can be provided at the position of the output terminal of the pixel driving circuit on the insulating layer. Figure 5 and Figure 6 (As indicated by the dashed box marked 108), the conductive via is further electrically connected to the first electrode bonding areas 1060 on both sides via metal traces. From Figure 5 and Figure 6 As can be seen, the output terminals of the pixel driving circuit 103 are arranged at intervals along the second direction Y, which allows the pixel driving circuit 103 to be repeatedly arranged in the second direction Y, reducing the layout difficulty of the pixel driving circuit 103.

[0050] Please continue reading. Figure 5 , Figure 5The intermediate pixel unit includes three adjacent sub-pixels 120 (red sub-pixel R, green sub-pixel G, and blue sub-pixel B), and the corresponding combination unit 104 includes three bonding groups 102 electrically connected to the sub-pixels 120 in the pixel unit. Three normal bonding areas 1020 in the combination unit 104 are arranged alternately vertically, and three redundant bonding areas 1022 in the combination unit 104 are arranged alternately vertically. Furthermore, the display panel has multiple repeating units 106; in the second direction Y, two adjacent combination units 104 constitute a repeating unit 106, and multiple normal bonding areas 1020 within the repeating unit 106 are arranged alternately vertically, and multiple redundant bonding areas 1022 within the repeating unit 106 are arranged alternately vertically. This design of the repeating unit 106 can reduce the complexity of the manufacturing process of the display panel 1.

[0051] Of course, in other implementations... Figure 5 The arrangement of the intermediate unit 104 can also be other. For example, please refer to... Figure 7 , Figure 7 for Figure 1 A partial top view of another embodiment of the display panel before defective pixel repair. Figure 7 The middle pixel unit includes three adjacent sub-pixels 120 (red sub-pixel R, green sub-pixel G, and blue sub-pixel B), and the corresponding combination unit 104 includes three bonding groups 102 electrically connected to the sub-pixels 120 in the pixel unit. In the first direction X, at least two partially adjacent combination units 104 are arranged axially symmetrically, and at least some of the normal bonding areas 1020 corresponding to the same emission color sub-pixels in the two axially symmetrically arranged combination units 104 are adjacent. This design allows two sub-pixels 120 located at the normal bonding areas 1020 positions within two partially adjacent bonding groups 102 in the first direction X to be transferred and bonded simultaneously, thereby improving bonding efficiency; and during the bonding transfer process, they are not affected by the sub-pixels 120 on the remaining normal bonding areas 1020, thereby improving bonding yield. For example, Figure 7 Two blue sub-pixels that are adjacent in the first direction X and separated by no redundant binding area 1022 in the middle can be transferred and bound simultaneously. Due to the presence of the surrounding redundant binding area 1022, they will not be squeezed or collided with the adjacent red and green sub-pixels during the binding process.

[0052] Optionally, such as Figure 7As shown, in the first direction X, the third distance D3 between two adjacent normal bonding areas 1020 originating from two adjacent combination units 104 is smaller than the fourth distance D4 between two adjacent normal bonding areas 1020 within the same combination unit 104. This design increases the pixel density, thereby improving the display effect. Optionally, the third distance D3 and the fourth distance D4 can be the spacing between the edges of two adjacent normal bonding areas 1020. Alternatively, the third distance D3 and the fourth distance D4 can be the spacing between the center points of two adjacent normal bonding areas 1020.

[0053] Alternatively, such as Figure 7 As shown, the display panel has multiple repeating units 106. Four adjacent combination units 104 (four adjacent combination units 104 in the top, bottom, left, and right directions) in the first direction X and the second direction Y constitute a repeating unit 106. In the second direction Y, normal bonding areas 1020 and redundant bonding areas 1022 located in the same row within the repeating unit 106 are arranged alternately. This design can reduce the difficulty of process fabrication.

[0054] In the above embodiments, the normal bonding area 1020 and the redundant bonding area 1022 in the same combination unit 104 are arranged alternately in the vertical direction; in other embodiments, the normal bonding area 1020 and the redundant bonding area 1022 in the same combination unit 104 can be arranged in the same row.

[0055] In one application scenario, please refer to Figure 8 , Figure 8 for Figure 1 This is a partial top view of another embodiment of a display panel before defective pixel repair. Multiple adjacent sub-pixels 120 constitute a pixel unit 122, and multiple bonding groups 102 electrically connected to the pixel unit 122 constitute a combination unit 104. Normal bonding areas 1020 and redundant bonding areas 1022 within the same bonding group 102 are arranged along a first direction X, and multiple normal bonding areas 1020 within the combination unit 104 are arranged adjacently in the same row along a second direction Y. Multiple redundant bonding areas 1022 within the combination unit 104 are also arranged adjacently in the same row along the second direction Y. Specifically, in the first direction X and the second direction Y, a row of redundant bonding areas 1022 is provided between two rows of normal bonding areas 1020 in two adjacent combination units 104. This structural design is relatively simple and the process is easy to implement. Furthermore, during the bonding process of the normal bonding area 1020 with the sub-pixel 120, the transfer head can simultaneously pick up three sub-pixels 120 bonded to the same combination unit 104, thereby improving bonding efficiency.

[0056] Based on this, such as Figure 8As shown, the driving backplane includes multiple pixel driving circuits (not shown). Normal bonding areas 1020 and redundant bonding areas 1022 within the same bonding group 102 can be electrically connected to the output terminal of the same pixel driving circuit. Optionally, in the first direction X, two first electrode bonding areas 1060 within the same bonding group 102 are arranged opposite to each other and spaced apart, with the two first electrode bonding areas 1060 located between two second electrode bonding areas 1062; that is, in the first direction X, the same bonding group 102 is arranged sequentially with second electrode bonding areas 1062, first electrode bonding areas 1060, and second electrode bonding areas 1062 spaced apart. At this time, in the first direction X, the orthographic projection of the output terminal of the pixel driving circuit on the first surface (e.g., ...) Figure 8 (As indicated by the dashed box marked 108) is located between the two first electrode bonding regions 1060. The above structural design is relatively simple and easy to fabricate. Figure 8 The corresponding pixel driving circuit and related traces can be seen as follows Figure 3 As shown in the image.

[0057] also, Figure 8 The middle pixel unit 122 includes three adjacent sub-pixels 120 (red sub-pixel R, green sub-pixel G, and blue sub-pixel B), and the corresponding combination unit 104 includes three bonding groups 102 electrically connected to the sub-pixels 120 in the pixel unit 122. The three normal bonding areas 1020 in the combination unit 104 are located in the same row, and the three redundant bonding areas 1022 in the combination unit 104 are located in the same row. Furthermore, the display panel has multiple repeating units 106; in the second direction Y, two adjacent combination units 104 constitute a repeating unit 106, and the two rows of normal bonding areas 1020 in the two combination units 104 within the repeating unit 106 are arranged alternately vertically. This design of the repeating unit 106 can reduce the complexity of the display panel manufacturing process.

[0058] Alternatively, please continue reading Figure 8 The number of adjacent pixel units 122 arranged diagonally is greater than the number of adjacent pixel units 122 arranged in the same row in the first direction X or the second direction Y; wherein, the diagonal direction intersects the first direction X and the second direction Y, and all sub-pixels 120 in each of the aforementioned adjacent pixel units 122 are arranged in the same row along the first direction X or the second direction Y; if the sub-pixels 120 in a certain pixel unit 122 are not arranged in the same row, they are not included in the number statistics. For example, with Figure 8For example, the pixel unit 122 corresponding to the upper left corner combination unit 104 is adjacent to the pixel unit 122 corresponding to the upper right corner combination unit 104 in the first diagonal direction, and the pixel unit 122 corresponding to the upper left corner combination unit 104 is adjacent to the pixel unit 122 corresponding to the lower right corner combination unit 104 in the second diagonal direction; the first diagonal direction and the second diagonal direction are different, but both intersect with the first direction X and the second direction Y. The above design can maximize the spacing between two adjacent pixel units 122.

[0059] Of course, in other embodiments... Figure 8 The arrangement of the combination unit 104 can also be other. For example, please refer to Figure 9 , Figure 9 for Figure 1 A partial top view of another embodiment of the display panel before defective pixel repair. Figure 9 The intermediate pixel unit 122 includes three adjacent sub-pixels 120 (red sub-pixel R, green sub-pixel G, and blue sub-pixel B), and the combination unit 104 includes three bonding groups 102 electrically connected to the sub-pixels 120 in the pixel unit 122. The three normal bonding areas 1020 in the combination unit 104 are located in the same row, and the three redundant bonding areas 1022 in the combination unit 104 are located in the same row. In the first direction X, at least two partially adjacent combination units 104 are arranged axially symmetrically, and the normal bonding areas 1020 of the corresponding light-emitting color sub-pixels in the two axially symmetrically arranged combination units 104 are arranged opposite each other.

[0060] Optionally, such as Figure 9 As shown, the display panel has multiple repeating units 106. Four adjacent combination units 104 (four adjacent combination units 104 vertically and horizontally) in the first direction X and the second direction Y constitute one repeating unit 106. In the second direction Y, the redundant bonding areas 1022 and the normal bonding areas 1020 within two adjacent combination units 104 of the repeating unit 106 are arranged in opposite ways. This design reduces the difficulty of fabrication. For another application scenario, please refer to... Figure 10 , Figure 10 for Figure 1 A partial top view of another embodiment of the display panel before defective pixel repair. Figure 10 Zhongyu Figure 8 The difference in the embodiment is that only in the first direction X, a row of redundant bonding areas 1022 is provided between the two rows of normal bonding areas 1020 in two adjacent combination units 104; while in the second direction Y, the two rows of normal bonding areas 1020 in two adjacent combination units 104 are arranged adjacently, that is, located on the same straight line. This structural design is relatively simple and the process is easy to implement.

[0061] also, Figure 10The middle pixel unit includes three adjacent sub-pixels 120 (red sub-pixel R, green sub-pixel G, and blue sub-pixel B), and the corresponding combination unit 104 includes three bonding groups 102 electrically connected to the sub-pixels 120 in the pixel unit. At this time, one combination unit 104 forms a repeating unit 106. The design of the repeating unit 106 can reduce the complexity of the manufacturing process of the display panel.

[0062] Of course, in other embodiments... Figure 10 The arrangement of the modular units can also be other. For example, please refer to... Figure 11 , Figure 11 for Figure 1 A partial top view of another embodiment of the display panel before defect repair. In the first direction X, at least two partially adjacent combination units 104 are arranged symmetrically, and the normal bonding areas 1020 of the sub-pixels with the same emission color in the two symmetrically arranged combination units 104 are arranged adjacently; furthermore, a plurality of repeating units 106 are provided on the display panel, and two adjacent combination units 104 in the first direction X constitute a repeating unit 106.

[0063] Please refer to it again. Figure 2 or Figure 4 or Figure 5 or Figure 7 or Figure 8 In the second direction Y, all normal bonding areas 1020 and redundant bonding areas 1022 located in the same row have their second electrode bonding areas 1062 on the same straight line, and all second electrode bonding areas 1062 on the same straight line are electrically connected to the same power supply voltage line 101. This design can save the trace area of ​​the pixel driving circuit, and is especially suitable for high PPI or densely packed display pixel arrangements.

[0064] Optionally, such as Figure 2 or Figure 4 or Figure 5 or Figure 7 or Figure 8 As shown, in the first direction X, the power supply voltage line 101 is located between two rows of second electrode bonding areas 1062, and the power supply voltage line 101 is electrically connected to the two adjacent rows of second electrode bonding areas 1062. This design can further save the wiring area of ​​the pixel driving circuit, and is especially suitable for high PPI or closely arranged display pixel layout scenarios.

[0065] Alternatively, such as Figure 2 or Figure 4 or Figure 5 or Figure 7 or Figure 8As shown, when the second electrode bonding region 1062, which is electrically connected to the power supply voltage line 101, is used for bonding to the N electrode, the power supply voltage line 101 can provide a low power supply voltage VSS. Of course, when the second electrode bonding region 1062, which is electrically connected to the power supply voltage line 101, is used for bonding to the P electrode, the power supply voltage line 101 can provide a high power supply voltage VDD, and this application does not limit this.

[0066] In addition, please continue to refer to Figure 2 The sub-pixel 120 includes a first axis of symmetry L1, the extension direction of which is parallel to the first direction X. Of course, in other embodiments, the extension direction of the first axis of symmetry L1 of the sub-pixel 120 may also intersect the first direction X, and the angle of intersection may be 30°, 45°, or 90°, etc.

[0067] For example, please see Figure 12 , Figure 12 for Figure 1 A partial top view of another embodiment of the display panel before defective pixel repair. Figure 12 The first axis of symmetry L1 of all sub-pixels 120 is intersected by the first direction X, and the first axes of symmetry L1 of all sub-pixels 120 are parallel to each other. At this time, Figure 2 The positions of the first electrode bonding area 1060 and the second electrode bonding area 1062 on the redundant bonding area 1022 and the normal bonding area 1020 will also be rotated to adapt to the position of the sub-pixel 120. Figure 10 The above design is relatively simple and easy to implement.

[0068] For example, please see Figure 13 , Figure 13 for Figure 1 A partial top view of another embodiment of the display panel before defective pixel repair. Figure 13 The first axis of symmetry L1 of all sub-pixels 120 is intersected with the first direction X; and in the first direction X, the extension directions of the first axis of symmetry L1 of adjacent rows of sub-pixels 120 intersect each other. Optionally, in the first direction X, the angle between the extension directions of the first axis of symmetry L1 of adjacent rows of sub-pixels 120 and the first direction X is equal. The above design is relatively simple and easy to implement.

[0069] Please continue reading. Figure 2 The orthographic projection of subpixel 120 onto the first surface is a rectangle. Or, as... Figure 14 As shown, Figure 14 for Figure 1This is a partial top view of another embodiment of the display panel before defective pixel repair. The orthographic projection of sub-pixel 120 on the first surface is a rounded rectangle. Of course, in other embodiments, the orthographic projection of sub-pixel 120 on the first surface can also be a circle, ellipse, triangle, trapezoid, pentagon, hexagon, or other irregular shape, etc., and this application does not limit this. The sub-pixel 120 of the above shape is easy to obtain through manufacturing processes. And as... Figure 14 As shown, the distance L1 between the center points of the sub-pixels 120 set on two adjacent normal bonding areas 1020 is greater than the distance L2 between the center points of the sub-pixels 120 set on the adjacent normal bonding area 1020 and the redundant bonding area 1022.

[0070] Please see Figure 15 , Figure 15 This is a flowchart illustrating one embodiment of the method for manufacturing the display panel according to this application. The manufacturing method specifically includes:

[0071] S101: Provide a drive backplane; wherein, a first surface of the drive backplane is provided with a plurality of normal bonding areas and a plurality of redundant bonding areas; a first spacing between at least some of two adjacent normal bonding areas is greater than a second spacing between adjacent normal bonding areas and redundant bonding areas, and the normal bonding areas and adjacent redundant bonding areas form a bonding group.

[0072] Specifically, in this embodiment, the structure of the drive backplane can be referred to in any of the above embodiments, and will not be repeated here.

[0073] S102: Set a subpixel on the normal bonding area of ​​the driving backplane.

[0074] Specifically, multiple sub-pixels can be simultaneously transferred to the normal bonding area at corresponding positions using a mass transfer device, and the sub-pixels and the normal bonding area can be bonded together using materials such as solder. Optionally, in this embodiment, the illustration corresponding to step S102 can be found above. Figure 2 .

[0075] S103: In response to a sub-pixel that is bonded to a normal bonding area being identified as a bad sub-pixel, a repair sub-pixel with the same emission color is introduced on a redundant bonding area within the same bonding group.

[0076] Specifically, in this embodiment, after step S102, a lighting test can be performed on the sub-pixels in the normal bonding area by driving the backplane. If the brightness of the sub-pixel is abnormal (including brightness below a first threshold or brightness exceeding a second threshold), the sub-pixel is identified as a bad pixel. Subsequently, the bad pixel can be removed from the normal bonding area by means of laser or other methods, and a repair sub-pixel with the same emission color is set on the redundant bonding area within the same bonding group to replace the original sub-pixel in the normal bonding area. For example, please refer to... Figure 16 , Figure 16 for Figure 2 A schematic diagram of one embodiment of the repaired display panel. Assume that after a power-on test, it is found that... Figure 2 If the green sub-pixel G in the upper left of the middle is a bad sub-pixel, then after removing the bad sub-pixel, a repair sub-pixel 120a is introduced on the corresponding redundant bonding area. The repair sub-pixel 120a can emit green light.

[0077] Alternatively, if the defective subpixel is a broken subpixel, it can be retained, and a patch subpixel with the same emission color can be set on the redundant bonding area within the same bonding group to replace the subpixel on the original normal bonding area. For example, please refer to... Figure 17 , Figure 17 for Figure 2 A schematic diagram of another embodiment of the repaired display panel. Assume that after a power-on test, it is found that... Figure 2 The green sub-pixel G in the upper left of the middle is a bad sub-pixel, and the bad sub-pixel is a broken sub-pixel, which cannot emit green light normally; then the bad sub-pixel is retained, and a repair sub-pixel 120a is introduced on the corresponding redundant bonding area, which can emit green light.

[0078] The above description is merely an embodiment of this application and does not limit the patent scope of this application. Any equivalent structural or procedural transformations made using the content of this application's specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of this application.

Claims

1. A display panel, characterized in that, include: A drive backplane, wherein a first surface of the drive backplane is provided with a plurality of normal bonding areas and a plurality of redundant bonding areas; wherein a first spacing between at least partially adjacent two normal bonding areas is greater than a second spacing between at least partially adjacent normal bonding areas and redundant bonding areas, and the normal bonding areas and adjacent redundant bonding areas form a bonding group. A light-emitting layer, located on the first surface, includes a plurality of sub-pixels, wherein the sub-pixels are electrically connected to the normal bonding area or the redundant bonding area, and the normal bonding area and the redundant bonding area within the same bonding group are used to be electrically connected to sub-pixels of the same light-emitting color; The plurality of normal bonding regions and the plurality of redundant bonding regions are arranged in an array along a first direction and a second direction, and the first direction and the second direction intersect each other; a plurality of adjacent sub-pixels constitute a pixel unit, and a plurality of bonding groups electrically connected to the pixel unit constitute a combination unit; in the first direction, the plurality of normal bonding regions and the plurality of redundant bonding regions in the combination unit are arranged in two rows, and the plurality of normal bonding regions in the combination unit are alternately arranged in the two rows, and the plurality of redundant bonding regions in the combination unit are alternately arranged in the two rows; Meanwhile, the pixel unit includes three sub-pixels, and the combination unit includes three bonding groups; in the first direction, at least two adjacent combination units are arranged symmetrically, and the normal bonding areas of at least some of the adjacent combination units arranged symmetrically are arranged adjacently, corresponding to sub-pixels of the same emission color.

2. The display panel according to claim 1, characterized in that, At least one of the plurality of redundant binding regions is not electrically connected to the sub-pixel; and / or The normal bonding region within the same bonding group is electrically connected to the sub-pixel prior to the redundant bonding region; and / or, The number of sub-pixels electrically connected to the normal bonding region is greater than the number of sub-pixels electrically connected to the redundant bonding region; and / or, All of the sub-pixels are electrically connected to the normal bonding area.

3. The display panel according to claim 1, characterized in that, The plurality of normal bonding regions and the plurality of redundant bonding regions are arranged in an array along a first direction and a second direction, and the first direction and the second direction intersect each other; Wherein, the first spacing between two normally bonded regions that are at least partially adjacent in the first direction is greater than the second spacing between the normally bonded regions and the redundant bonded regions that are at least partially adjacent in the first direction or the second direction; and / or, the first spacing between two normally bonded regions that are at least partially adjacent in the second direction is greater than the second spacing between the normally bonded regions and the redundant bonded regions that are at least partially adjacent in the first direction or the second direction.

4. The display panel according to claim 3, characterized in that, In the first direction and / or the second direction, a redundant bonding region is provided between at least two partially adjacent normal bonding regions.

5. The display panel according to claim 1, characterized in that, The number of adjacent sub-pixels arranged in the diagonal direction is greater than the number of adjacent sub-pixels arranged in the same row in the first direction or the second direction; wherein the diagonal direction intersects the first direction and the second direction.

6. The display panel according to claim 1, characterized in that, The normal bonding area and the redundant bonding area within the same bonding group are arranged along the first direction, and the multiple bonding groups within the same combination unit are arranged at intervals along the second direction. Alternatively, the normal bonding area and the redundant bonding area within the same bonding group are arranged at intervals along the second direction, and the multiple bonding groups within the same combination unit are arranged in two rows along the first direction, with the two rows of bonding groups being staggered from each other.

7. The display panel according to claim 1, characterized in that, In the first direction, the third distance between two adjacent normal bonding regions originating from two adjacent combined units is less than the fourth distance between two adjacent normal bonding regions within the same combined unit.

8. The display panel according to claim 1, characterized in that, Four adjacent combination units in the first direction and the second direction constitute a repeating unit; and in the repeating unit in the second direction, the normal bonding area and the redundant bonding area located in the same row are arranged alternately.

9. The display panel according to claim 1, characterized in that, The plurality of normal bonding regions and the plurality of redundant bonding regions are arranged in an array along a first direction and a second direction, and the first direction and the second direction intersect each other; A plurality of adjacent sub-pixels constitute a pixel unit, and a plurality of bonding groups electrically connected to the pixel unit constitute a combined unit; the normal bonding area and the redundant bonding area within the same bonding group are arranged along the first direction, and a plurality of normal bonding areas within the combined unit are arranged adjacently in the same row along the second direction, and a plurality of redundant bonding areas within the combined unit are arranged adjacently in the same row along the second direction. In the first direction and / or the second direction, a row of redundant bonding areas is provided between two rows of normal bonding areas in two adjacent combined units.

10. The display panel according to claim 9, characterized in that, The number of adjacent pixel units arranged in the diagonal direction is greater than the number of adjacent pixel units arranged in the same row in the first direction or the second direction; wherein the diagonal direction intersects the first direction and the second direction, and all the sub-pixels in each of the adjacent pixel units are arranged in the same row.

11. The display panel according to claim 1, characterized in that, The driving backplane also includes multiple pixel driving circuits, and the normal bonding area and the redundant bonding area within the same bonding group are electrically connected to the same pixel driving circuit.

12. The display panel according to claim 11, characterized in that, Each sub-pixel has a first electrode and a second electrode on the side facing the first surface. Each normal bonding area or redundant bonding area includes a first electrode bonding area for electrical connection with the first electrode and a second electrode bonding area for electrical connection with the second electrode. The two first electrode bonding areas in the same bonding group are electrically connected to the output terminal of the same pixel driving circuit.

13. The display panel according to claim 12, characterized in that, The plurality of normal bonding areas and the plurality of redundant bonding areas are arranged in an array along a first direction and a second direction, and the first direction and the second direction intersect each other; in the second direction, the second electrode bonding areas of all the normal bonding areas and the redundant bonding areas located in the same row are located on the same straight line, and all the second electrode bonding areas located on the same straight line are electrically connected to the same power supply voltage line.

14. The display panel according to claim 13, characterized in that, In the first direction, the power supply voltage line is located between two rows of second electrode bonding areas, and the power supply voltage line is electrically connected to the two adjacent rows of second electrode bonding areas.

15. The display panel according to claim 12, characterized in that, In the first direction, two first electrode bonding regions within the same bonding group are arranged opposite to each other and spaced apart, and the two first electrode bonding regions within the same bonding group are located between two second electrode bonding regions; wherein, in the first direction, the orthographic projection of the output terminal of the pixel driving circuit on the first surface is located between the two first electrode bonding regions. Alternatively, in the second direction, two first electrode bonding regions within the same bonding group are arranged opposite to each other and spaced apart, and two second electrode bonding regions within the same bonding group are arranged opposite to each other and spaced apart; wherein, in the first direction, there is a gap between two rows of bonding groups within the same combination unit, and the orthographic projection of the output terminal of the pixel driving circuit on the first surface is located within the gap and between two first electrode bonding regions within the same bonding group.

16. A method for manufacturing a display panel, characterized in that, The preparation method is applied to a display panel comprising any one of claims 1 to 15, the preparation method comprising: A drive backplane is provided; wherein, the first surface of the drive backplane is provided with a plurality of normal bonding areas and a plurality of redundant bonding areas, and the normal bonding areas and the adjacent redundant bonding areas form a bonding group. Sub-pixels are disposed on the normal bonding area of ​​the driving backplate; When a sub-pixel bonded to the normal bonding area is determined to be a bad sub-pixel, a repair sub-pixel with the same emission color is introduced on the redundant bonding area within the same bonding group.

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