LED array ceramic substrate splitting machine and splitting process

Abstract

The application discloses a kind of LED array ceramic substrate crack machine and crack process, the crack machine of the application includes LED array ceramic substrate crack strip system and strip-shaped LED ceramic substrate crack particle system;LED array ceramic substrate crack strip system includes first pushing device, positioning device and crack strip device;Positioning device is used to press down LED array ceramic substrate, and crack strip device is used to break LED array ceramic substrate into strip-shaped LED ceramic substrate with single column LED;Strip-shaped LED ceramic substrate crack particle system includes seat, and seat is equipped with conveying channel, second pushing device and crack particle device, and second pushing device is used to push strip-shaped LED ceramic substrate to the working position of crack particle device along conveying channel, when strip-shaped LED ceramic substrate is pushed out from the discharge port of conveying channel, can be pressed by the lower end of the die of crack particle device, so that strip-shaped LED ceramic substrate breaks into granular LED ceramic substrate with single particle LED.The crack speed of the application is fast, crack precision is high, and does not need to use cutter disc cutting.

Description

Technical Field

[0001] This invention relates to the field of ceramic substrate cleaving equipment, and particularly to a ceramic substrate cleaving machine and cleaving process for LED arrays. Background Technology

[0002] Ceramic substrates are high-performance LED substrate materials. They possess sufficiently high mechanical strength, high insulation resistance and insulation breakdown voltage, low dielectric constant, low dielectric loss, stable performance under high temperature and humidity conditions, high reliability, high thermal conductivity, excellent heat resistance, and good chemical stability. For example... Figure 14 As shown, during the packaging process, LED101 is packaged on a ceramic substrate in a rectangular array to form an LED array ceramic substrate 100. Multiple rows and columns of LEDs are neatly arranged on each LED array ceramic substrate. The LED array ceramic substrate needs to be cut to divide it into granular LED ceramic substrates with individual LEDs.

[0003] In existing technologies, LED array ceramic substrates are all cut using a dicing machine. During the dicing process, a UV film is first adhered to the lower side of the LED array ceramic substrate. Then, a circular cutter head (with a blade width of 0.15mm) is aligned with the LED array ceramic substrate and cuts horizontally and vertically. Cutting fluid is sprayed onto the cutting area during the process. This dicing machine method for cutting LED array ceramic substrates has the following technical problems: First, the cutting speed is slow, only 5-8 LED array ceramic substrates can be cut per hour; second, the cost of replacing the cutter head is high, requiring a new LED array ceramic substrate after cutting an average of 6 substrates to meet the cutting accuracy requirements; third, the need to adhere the LED array ceramic substrate with a UV film results in high consumable costs.

[0004] In the prior art, there are also devices that use rolling to cleave ceramic plates. For example, Chinese patent document CN114851411A discloses a brittle plate cleaving machine and cleaving process. The roller device of this cleaving machine can directly roll the ceramic plate and can roll the ceramic plate from different directions to cleave it. However, since the upper side of the LED array ceramic substrate has LEDs packaged in a rectangular array, the roller device of the existing cleaving machine will destroy the rectangular array of LEDs during the rolling process. The existing ceramic plate cleaving machine is not suitable for cleaving LED array ceramic substrates. Summary of the Invention

[0005] The technical problem to be solved by this invention is to provide an LED array ceramic substrate dicing machine that, based on the shortcomings of the prior art, offers high dicing speed, high dicing precision, and eliminates the need for changing the cutter head and UV consumables. Furthermore, this invention also provides a dicing process utilizing this LED array ceramic substrate dicing machine.

[0006] To solve the first technical problem mentioned above, the technical solution of the present invention is: an LED array ceramic substrate slicing machine, including a machine base, on which an LED array ceramic substrate slicing strip system and a strip LED ceramic substrate granulation system are installed; The LED array ceramic substrate splitting system includes a base plate, a first pushing device mounted on one end of the base plate, and a positioning device and a splitting device mounted side by side on the other end of the base plate. The first pushing device is used to push the LED array ceramic substrate to move, so that one row of LEDs on the LED array ceramic substrate is located below the splitting device, and the remaining rows of LEDs on the LED array ceramic substrate are located below the positioning device. The positioning device is used to press down the LED array ceramic substrate, and the splitting device is used to break the LED array ceramic substrate into strip-shaped LED ceramic substrates with a single row of LEDs. The strip LED ceramic substrate splitting system includes a base, on which a conveying channel, a second pushing device, and a splitting device are provided. The conveying channel is used to convey the strip LED ceramic substrate, and the second pushing device is used to push the strip LED ceramic substrate along the conveying channel to the working position of the splitting device. The splitting device includes a die head, which is located outside the outlet of the conveying channel. When the strip LED ceramic substrate is pushed out from the outlet of the conveying channel, it is subjected to the pressing action of the lower end of the die head, causing the strip LED ceramic substrate to break into granular LED ceramic substrates with single LEDs.

[0007] Preferably, the positioning device includes a positioning cylinder and a positioning block. The telescopic rod of the positioning cylinder extends downward and connects to the upper end of the positioning block. The lower end of the positioning block has multiple positioning strips arranged at equal intervals. The positioning strips can press onto the ceramic substrate of the LED array ceramic substrate. There is a clearance between adjacent positioning strips that allows the LEDs of the LED array ceramic substrate to extend into the LEDs without contact.

[0008] Preferably, the strip-splitting device includes a strip-splitting cylinder and a strip-splitting pressing block. The telescopic rod of the strip-splitting cylinder extends downward and connects to the upper end of the strip-splitting pressing block. The strip-splitting pressing block is located on one side of the positioning pressing block. Multiple strip-splitting bars are arranged at equal intervals on the lower end of the strip-splitting pressing block near the positioning pressing block. The positions of the strip-splitting bars correspond to and match the positioning pressing bars. The strip-splitting bars can press onto the ceramic substrate of the LED array ceramic substrate. There is a clearance between adjacent strip-splitting bars that allows the LEDs of the LED array ceramic substrate to extend into the LED array ceramic substrate without contact.

[0009] Preferably, the base plate includes a main base plate and a secondary base plate, with a first pushing gap and a discharge groove between the main base plate and the secondary base plate. The discharge groove is located at the upper end of the first pushing gap, and the width of the discharge groove is greater than the width of the first pushing gap. The discharge groove is used for discharging strip-shaped LED ceramic substrates. The positioning device is installed above the end of the main base plate, the strip splitting device is installed above the secondary base plate, and the strip splitting pressure strip is located above the discharge groove.

[0010] Preferably, the first pushing device includes a first pushing motor, a push rod, a first pushing slider, a pushing plate, and a first guide rail. The power output end of the first pushing motor is connected to the push rod, and one end of the push rod is connected to the first pushing slider. There are two first guide rails, which are parallel to each other and installed on the main base plate. The two ends of the first pushing slider are slidably installed on the corresponding first guide rails, and the middle part of the first pushing slider is connected to the pushing plate. The first pushing device also includes two limiting strips, which are installed on the main base plate. The two limiting strips are located between the two first guide rails and on both sides of the pushing plate. One end of the two limiting strips extends below the positioning block, and the inner distance between the ends of the two limiting strips away from the positioning block is greater than the inner distance between the ends of the two limiting strips close to the positioning block.

[0011] Preferably, the discharge trough between the main base plate and the auxiliary base plate is connected to the conveying channel, and the second pushing device can pass through the first pushing gap to push the strip LED ceramic substrate in the discharge trough into the conveying channel, and then push it out from the discharge port of the conveying channel.

[0012] Preferably, the base includes a lower side plate, a left side plate, a right side plate, and an upper side plate. The left side plate is mounted on the left side of the lower side plate, the right side plate is mounted on the right side of the lower side plate, and the upper side plate is mounted on the left and right side plates. The upper side plate has a through-groove for pushing materials. The conveying channel is mounted on the upper side plate, and the other end of the base plate of the LED array ceramic substrate splitting system is mounted on the upper side plate.

[0013] Preferably, the second pushing device includes a second pushing motor, a lead screw, a second pushing slider, a pushing plate, and a second guide rail. The power output end of the second pushing motor is connected to one end of the lead screw, and the other end of the lead screw moves through the second pushing slider and is in transmission cooperation with the second pushing slider. The second guide rail is installed on the lower side plate, and the second pushing slider is slidably installed on the second guide rail. The pushing plate is vertically installed on the upper end of the second pushing slider, and the upper end of the pushing plate moves upward through the pushing groove and can move back and forth along the length of the pushing groove.

[0014] Preferably, the side of the conveying channel has a first channel plate and a second channel plate, and a second pushing gap is provided between the first channel plate and the second channel plate. The conveying channel is located at the upper end of the second pushing gap, and the width of the conveying channel is greater than the width of the second pushing gap. The conveying channel is used for the passage of strip-shaped LED ceramic substrates. The upper end of the pushing piece can move upward through the second pushing gap and extend into the conveying channel.

[0015] To solve the second technical problem mentioned above, the technical solution of the present invention is: utilizing the dicing process of the LED array ceramic substrate dicing machine, including the following process steps: S1. Laser slits are made on the ceramic substrate of the LED array ceramic substrate using a laser cutting machine. The slit depth is 5% to 60% of the thickness of the ceramic substrate. The slits include transverse slits and longitudinal slits. Multiple square grids are formed between the transverse slits and longitudinal slits. Each square grid contains one LED. S2. Place the laser-cut LED array ceramic substrate in the working position of the first feeding device, and ensure that the LEDs and the slits of the LED array ceramic substrate face upwards. S3. The first feeding device pushes the LED array ceramic substrate to move. One column of LEDs on the LED array ceramic substrate is located below the splitting device, and the remaining LEDs on the LED array ceramic substrate are all located below the positioning device. S4. The positioning device operates, pressing down the LED array ceramic substrate; S5. The strip-breaking device operates to break the LED array ceramic substrate into strip-shaped LED ceramic substrates with a single row of LEDs; S6. The second feeding device operates to send the strip-shaped LED ceramic substrate broken by the strip-breaking device into the conveying channel, and push the strip-shaped LED ceramic substrate along the conveying channel to the bottom of the particle-breaking device. S7. When the strip-shaped LED ceramic substrate is pushed out from the outlet of the conveying channel, it is pressed by the lower end of the die head, and the strip-shaped LED ceramic substrate breaks into granular LED ceramic substrates with single LEDs.

[0016] The beneficial effects of this invention are as follows: First, this invention has an LED array ceramic substrate slicing system and a strip LED ceramic substrate granulation system. The LED array ceramic substrate slicing system can first break the LED array ceramic substrate into strip LED ceramic substrates with a single row of LEDs, and the strip LED ceramic substrate granulation system can break the strip LED ceramic substrate into granular LED ceramic substrates with a single LED. The slicing speed is more than 20 pieces per hour, which is fast, has high slicing accuracy, and does not require replacement of the cutting disc and UV consumables. Second, the LED array ceramic substrate slicing system of this invention includes a base plate, a first pushing device, a positioning device, and a slicing device. The first pushing device pushes the LED array ceramic substrate, the positioning device positions the LED array ceramic substrate, and finally the slicing device slices the LED array ceramic substrate, realizing the breaking of the whole LED array ceramic substrate into strip LED ceramic substrates with a single row of LEDs. The slicing process has a high degree of automation, high speed, high efficiency, and no damage to the LEDs. Thirdly, the strip LED ceramic substrate granulation system of the present invention includes a base, a conveying channel, a second pushing device, and a granulation device. The second pushing device pushes the strip LED ceramic substrate along the conveying channel to the working position of the granulation device. The die head of the granulation device applies pressure to the strip LED ceramic substrate, causing it to break into granular LED ceramic substrates with individual LEDs. The granulation process is highly automated, fast, efficient, and causes no damage to the LEDs. Fourthly, the present invention combines the granulation process of this LED array ceramic substrate granulator with laser cutting technology, which can significantly improve the efficiency and accuracy of laser cutting, reduce the impact of the laser beam on the product positioning seat, and achieve a high granulation success rate and high granulation efficiency. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the overall structure of the present invention.

[0018] Figure 2 This is a schematic diagram of the overall structure of the present invention after the front cover is removed.

[0019] Figure 3 This is one of the combined state diagrams of the LED array ceramic substrate cracking system and the strip LED ceramic substrate cracking particle system.

[0020] Figure 4 This is the second combination diagram of the LED array ceramic substrate cracking system and the strip LED ceramic substrate cracking particle system.

[0021] Figure 5 This is a structural diagram of the LED array ceramic substrate crack system.

[0022] Figure 6 This is one of the dispersion structure diagrams of a cracked strip system for an LED array ceramic substrate.

[0023] Figure 7 This is the second diagram showing the dispersed structure of the LED array ceramic substrate crack system.

[0024] Figure 8 This is a structural diagram of the positioning pressure block.

[0025] Figure 9 This is a structural diagram of the cracked bar compression block.

[0026] Figure 10 This is a structural diagram of the chipping system for a strip-shaped LED ceramic substrate.

[0027] Figure 11 This is a diagram showing the dispersion structure of a split-particle system for a strip LED ceramic substrate.

[0028] Figure 12 This is a schematic diagram of the overall structure of the particle splitting device.

[0029] Figure 13 This is a side view of the combined state of the first channel plate and the second channel plate.

[0030] Figure 14 This is a schematic diagram of the structure of an LED array ceramic substrate.

[0031] Figure 15 This is a process diagram of the dicing process of the present invention. Detailed Implementation

[0032] The structural and working principles of the present invention will be further described in detail below with reference to the accompanying drawings.

[0033] like Figures 1-4 As shown, in conjunction with reference Figure 14 and Figure 15 This invention relates to an LED array ceramic substrate dicing machine, comprising a machine base 1, a frame 2 outside the machine base, and a housing 3 mounted on the frame; an LED array ceramic substrate dicing strip system 4 and a strip-shaped LED ceramic substrate dicing particle system 5 are mounted on the machine base 1; a control system 6 is provided inside the frame 1 for controlling the operation of the LED array ceramic substrate dicing strip system 4 and the strip-shaped LED ceramic substrate dicing particle system 5; a display 7 is mounted outside the frame to display information such as the working status of the LED array ceramic substrate dicing strip system 4 and the strip-shaped LED ceramic substrate dicing particle system 5; and a conveyor belt 8 is provided on the machine base 1 for outputting the processed granular LED ceramic substrates.

[0034] like Figures 3-13 As shown, in conjunction with reference Figure 14 and Figure 15The LED array ceramic substrate splitting system 4 includes a base plate 41. A first pushing device 42 is mounted on one end of the base plate 41, and a positioning device 43 and a splitting device 44 are mounted side by side on the other end of the base plate 41. The first pushing device 42 is used to push the LED array ceramic substrate 100 to move, so that one row of LEDs of the LED array ceramic substrate 100 is located below the splitting device 44, and the remaining LEDs of the LED array ceramic substrate 100 are all located below the positioning device 43. The positioning device 43 is used to press down the LED array ceramic substrate 100, and the splitting device 44 is used to break the LED array ceramic substrate 100 into strip-shaped LED ceramic substrates 110 with a single row of LEDs. The strip LED ceramic substrate splitting system 5 includes a base 51, on which a conveying channel 52, a second pushing device 53, and a splitting device 54 are provided. The conveying channel 52 is used to convey the strip LED ceramic substrate 110. The second pushing device 53 is used to push the strip LED ceramic substrate 110 along the conveying channel 52 to the working position of the splitting device 54. The splitting device 54 includes a die head 541, which is located outside the outlet of the conveying channel 52. When the strip LED ceramic substrate 110 is pushed out from the outlet of the conveying channel 52, it can be pressed by the lower end of the die head 541, causing the strip LED ceramic substrate 110 to break into granular LED ceramic substrates 120 with single LEDs.

[0035] like Figures 3-9 As shown, the positioning device 43 includes a positioning cylinder 431 and a positioning block 432. The telescopic rod of the positioning cylinder 431 extends downward and connects to the upper end of the positioning block 432. Multiple positioning strips 433 are evenly spaced at the lower end of the positioning block 432. The positioning strips 433 can press against the ceramic substrate of the LED array ceramic substrate 100. Adjacent positioning strips 433 have clearance gaps 4331 that allow LEDs to extend into the LED array ceramic substrate 100 without contact. The positioning block 432 of the present invention, with its positioning strips 433 and clearance gaps 4331, can prevent the positioning block 432 from damaging the LEDs on the LED array ceramic substrate 100.

[0036] like Figures 3-9As shown, the splitting device 44 includes a splitting cylinder 441 and a splitting pressing block 442. The telescopic rod of the splitting cylinder 441 extends downward and connects to the upper end of the splitting pressing block 442. The splitting pressing block 442 is located on one side of the positioning pressing block 432. Multiple splitting pressing strips 443 are arranged at equal intervals on the lower end of the splitting pressing block 442 near the positioning pressing block 432. The positions of the splitting pressing strips 443 and the positioning pressing strips 433 correspond and match. The splitting pressing strips 443 can press against the ceramic substrate of the LED array ceramic substrate 100. There is a clearance 4431 between adjacent splitting pressing strips 100 to allow LEDs to extend into the LED array ceramic substrate 100 without contact. The lower end of the splitting pressing block 443 is also provided with a limiting side 444 for limiting the end position of the LED array ceramic substrate 100. The cracking block 442 of the present invention is provided with a cracking block 443 and a clearance gap 4431, which can prevent the cracking block 442 from damaging the LEDs on the LED array ceramic substrate 100. The cracking block 443 of the present invention is provided with a limiting side 444, which can make the cracking block 442 fit precisely into the ceramic substrate with a row of LEDs. Each time the cracking block 442 is pressed down, it can precisely break one strip of LED ceramic substrate 110. In addition, the lower end of the cracking block 442 is provided with a guide rod 445, which can play a guiding role and improve the pressing accuracy of the cracking block 442.

[0037] like Figures 5-7 As shown, the base plate 41 includes a main base plate 411 and a secondary base plate 412. A first pushing gap 413 and a discharge groove 414 are located between the main base plate 411 and the secondary base plate 412. The discharge groove 413 is located at the upper end of the first pushing gap 414, and the width of the discharge groove 413 is greater than the width of the first pushing gap 414. The discharge groove 413 is used for discharging the strip-shaped LED ceramic substrate 110. The positioning device 43 is installed above the end of the main base plate 411, the strip-breaking device 44 is installed above the secondary base plate 412, and the strip-breaking pressure block 443 is located above the discharge groove 413. The strip-shaped LED ceramic substrate 110 broken by the strip-breaking pressure block 443 can fall into the discharge groove 413. A first support frame 45 is provided on the main base plate 411 and the secondary base plate 412, and the positioning device 43 and the strip-breaking device 44 are respectively fixed on the first support frame 45.

[0038] like Figures 3-7As shown, the first pushing device 42 includes a first pushing motor 421, a push rod 422, a first pushing slider 423, a pushing plate 424, and a first guide rail 425. The power output end of the first pushing motor 421 is connected to the push rod 422, and one end of the push rod 422 is connected to the first pushing slider 423. There are two first guide rails 425, which are parallel to each other and installed on the main base plate 411. The two ends of the first pushing slider 423 are slidably installed on the corresponding first guide rails 425, and the middle part of the first pushing slider 423 is connected to the pushing plate 424. The first pushing device 42 also includes two limiting strips 426. These two limiting strips 426 are mounted on the main base plate 411, located between the two first guide rails 425 and on both sides of the pushing plate 424. One end of each limiting strip extends below the positioning block 432, and the distance between the inner sides of the ends of the two limiting strips 426 furthest from the positioning block 432 is greater than the distance between the inner sides of the ends closer to the positioning block 432. By setting the limiting strip structure 426, the positions of the LED array ceramic substrate 100 on both sides can be restricted, allowing the LED array ceramic substrate 100 to accurately enter below the positioning device 43 and the strip-breaking device 44.

[0039] like Figures 3-7 , Figure 10 and Figure 11 As shown, the discharge trough 413 between the main base plate 411 and the secondary base plate 412 is connected to the conveying channel 52. The second pushing device 53 can pass through the first pushing gap 414 to push the strip LED ceramic substrate 110 in the discharge trough 413 into the conveying channel 53, and then push it out from the discharge port of the conveying channel 52. In this way, the strip LED ceramic substrate 110 that falls into the discharge trough 413 can be directly pushed into the conveying channel 53 by the second pushing device 53, and the operation of the LED array ceramic substrate splitting system 4 and the strip LED ceramic substrate splitting system 5 is connected.

[0040] like Figure 3 , Figure 4 , Figure 10 and Figure 11As shown, the base 51 includes a lower side plate 511, a left side plate 512, a right side plate 513, and an upper side plate 514. The left side plate 512 is installed on the left side of the lower side plate 511, the right side plate 513 is installed on the right side of the lower side plate 511, and the upper side plate 514 is installed on the left side plate 512 and the right side plate 513. The upper side plate 514 has a vertically penetrating pusher groove 5141. The conveying channel 52 is installed on the upper side plate 514, and the other end of the base plate 41 of the LED array ceramic substrate splitting system 4 is installed on the upper side plate 514. The second pushing device 53 includes a second pushing motor 531, a lead screw 532, a second pushing slider 533, a pushing plate 534, and a second guide rail 535. The power output end of the second pushing motor 531 is connected to one end of the lead screw 532, and the other end of the lead screw 532 moves through the second pushing slider 533 and is in a transmission cooperation with the second pushing slider 533. The second guide rail 535 is mounted on the lower side plate 511, and the second pushing slider 533 is slidably mounted on the second guide rail 535. The pushing plate 534 is vertically mounted on the upper end of the second pushing slider 533, and the upper end of the pushing plate 534 moves upward through the pushing groove 5141 and can move back and forth along the length of the pushing groove 5141.

[0041] like Figure 13 As shown, the side of the conveying channel 52 has a first channel plate 521 and a second channel plate 522. A second pushing gap 523 is provided between the first channel plate 521 and the second channel plate 522. The conveying channel 52 is located at the upper end of the second pushing gap 523, and the width of the conveying channel 52 is greater than the width of the second pushing gap 523. The conveying channel 52 is used for the passage of the strip LED ceramic substrate 110. The upper end of the pushing piece 534 can move upward through the second pushing gap 523 and extend into the conveying channel 52. The cross-sectional shape of the conveying channel 52 is "┴" shaped, with a horizontal groove portion 524 and a vertical groove portion 525. The horizontal groove portion 524 is used for the passage of the ceramic substrate of the strip LED ceramic substrate 110, and the vertical groove portion 525 is used for the passage of the LED of the strip LED ceramic substrate 110. The conveying channel 52 adopts such a structure, which can both restrict the position of the ceramic substrate of the strip LED ceramic substrate 110 and avoid damage to the LED.

[0042] like Figure 3 , Figure 4 , Figures 10-12As shown, the pelletizing device 54 includes a second support frame 543 and a die head height adjustment mechanism 542. The second support frame 543 is mounted on one end of the base 51 near the discharge port of the conveying channel 52. The die head height adjustment mechanism 542 is mounted on the second support frame 543, and its lower end is connected to the die head 541. The die head height adjustment mechanism 542 can adjust the height position of the die head 541. The die head height adjustment mechanism 542 is an adjusting cylinder, and the telescopic rod of the adjusting cylinder extends downward and connects to the die head 541.

[0043] like Figure 3 , Figure 4 , Figures 10-12 As shown, the lower end of the die head 541 is provided with an LED clearance groove 5411, which is aligned with the conveying direction of the conveying channel 52 to prevent the lower end of the die head 541 from touching the LEDs of the strip LED ceramic substrate 110. The lower side of the die head 541 is provided with a die head pressing surface 5412. When the strip LED ceramic substrate 110 is pushed out of the outlet of the conveying channel 52, the lowest point of the die head pressing surface 5412 is lower than the height of the upper surface of the ceramic substrate of the strip LED ceramic substrate 110, thereby creating a pressing effect on the strip LED ceramic substrate 110. The die head pressing surface 5412 is an inclined surface or an arc surface.

[0044] The cleaving process of the LED array ceramic substrate cleaving machine of the present invention includes the following process steps: S1. Laser-cut slits are made in the ceramic substrate of the LED array ceramic substrate 100 using a laser cutting machine. The depth of the slits 200 is 5% to 60% of the thickness of the ceramic substrate. The slits 200 include transverse slits 210 and longitudinal slits 220, which form multiple square grids. Each square grid contains one LED 101. See [link to documentation]. Figure 15 (b); S2. Place the laser-cut LED array ceramic substrate in the working position of the first feeding device, and ensure that the LEDs and the slits of the LED array ceramic substrate face upwards. S3. The first feeding device pushes the LED array ceramic substrate to move. One column of LEDs on the LED array ceramic substrate is located below the splitting device, and the remaining LEDs on the LED array ceramic substrate are all located below the positioning device. S4. The positioning device operates, pressing down the LED array ceramic substrate; S5. The strip-breaking device operates, breaking the LED array ceramic substrate into strip-shaped LED ceramic substrates with single rows of LEDs. See [link / reference]. Figure 15 (c); S6. The second feeding device operates to send the strip-shaped LED ceramic substrate broken by the strip-breaking device into the conveying channel, and push the strip-shaped LED ceramic substrate along the conveying channel to the bottom of the particle-breaking device. S7. When the strip-shaped LED ceramic substrate is pushed out of the discharge port of the conveying channel, it is pressed by the lower end of the die head, causing the strip-shaped LED ceramic substrate to break into granular LED ceramic substrates with individual LEDs. See [link to relevant documentation]. Figure 15 (d)

[0045] The above description is merely a preferred embodiment of the present invention. Any minor modifications, equivalent changes, and alterations made to the above embodiments based on the technical solution of the present invention shall fall within the scope of the technical solution of the present invention.

Claims

1. A ceramic substrate dicing machine for LED arrays, characterized in that: Includes a machine base, on which are installed an LED array ceramic substrate slicing system and a strip LED ceramic substrate particle slicing system; The LED array ceramic substrate splitting system includes a base plate, with a first pushing device mounted on one end of the base plate, and a positioning device and a splitting device mounted side-by-side on the other end of the base plate. The first pushing device is used to move the LED array ceramic substrate, so that one row of LEDs on the LED array ceramic substrate is located below the splitting device, and the remaining rows of LEDs on the LED array ceramic substrate are located below the positioning device. The positioning device is used to press the LED array ceramic substrate, and the positioning device includes a positioning block. Multiple positioning strips are evenly spaced at the lower end of the positioning block. The positioning strips can press against the ceramic substrate of the LED array ceramic substrate, and there are LEDs between adjacent positioning strips that can extend into the LED array ceramic substrate without contact. The device includes a gap-avoiding space; the strip-breaking device is used to break an LED array ceramic substrate into strip-shaped LED ceramic substrates with a single row of LEDs. The strip-breaking device includes a strip-breaking pressing block, which is located on one side of a positioning pressing block. Multiple strip-breaking pressing blocks are evenly spaced on the lower end of the strip-breaking pressing block near the positioning pressing block. The positions of the strip-breaking pressing blocks correspond to and match the positioning pressing blocks. The strip-breaking pressing blocks can press against the ceramic substrate of the LED array ceramic substrate. There is a gap-avoiding space between adjacent strip-breaking pressing blocks to allow LEDs to extend into the LED array ceramic substrate without contact. The lower end of the strip-breaking pressing block is also provided with a limiting side for limiting the end position of the LED array ceramic substrate. The limiting side allows the strip-breaking pressing block to be precisely placed into the ceramic substrate with a single row of LEDs. The strip LED ceramic substrate splitting system includes a base, on which a conveying channel, a second pushing device, and a splitting device are provided. The conveying channel is used to convey the strip LED ceramic substrate, and the second pushing device is used to push the strip LED ceramic substrate along the conveying channel to the working position of the splitting device. The splitting device includes a die head located outside the outlet of the conveying channel. When the strip LED ceramic substrate is pushed out from the outlet of the conveying channel, it is subjected to the pressing action of the lower end of the die head, causing the strip LED ceramic substrate to break into granular LED ceramic substrates with single LEDs. The lower end of the die head has an LED clearance groove, which is consistent with the conveying direction of the conveying channel, to prevent the lower end of the die head from touching the LEDs of the strip LED ceramic substrate. The lower side of the die head has a die head pressing surface. When the strip LED ceramic substrate is pushed out from the outlet of the conveying channel, the lowest point of the die head pressing surface is lower than the height of the upper side of the strip LED ceramic substrate, so as to form a pressing action on the strip LED ceramic substrate.

2. The LED array ceramic substrate dicing machine according to claim 1, characterized in that: The positioning device includes a positioning cylinder, the telescopic rod of which extends downward and connects to the upper end of the positioning block.

3. The LED array ceramic substrate dicing machine according to claim 2, characterized in that: The strip-splitting device includes a strip-splitting cylinder, the telescopic rod of which extends downward and connects to the upper end of the strip-splitting pressure block.

4. The LED array ceramic substrate dicing machine according to claim 3, characterized in that: The base plate includes a main base plate and a secondary base plate. A first pushing gap and a discharge groove are provided between the main base plate and the secondary base plate. The discharge groove is located at the upper end of the first pushing gap, and the width of the discharge groove is greater than the width of the first pushing gap. The discharge groove is used for discharging strip-shaped LED ceramic substrates. The positioning device is installed above the end of the main base plate, the strip splitting device is installed above the secondary base plate, and the strip splitting pressure strip is located above the discharge groove.

5. The LED array ceramic substrate dicing machine according to claim 4, characterized in that: The first pushing device includes a first pushing motor, a push rod, a first pushing slider, a pushing plate, and a first guide rail. The power output end of the first pushing motor is connected to the push rod, and one end of the push rod is connected to the first pushing slider. There are two first guide rails, which are parallel to each other and installed on the main base plate. The two ends of the first pushing slider are slidably installed on the corresponding first guide rails, and the middle part of the first pushing slider is connected to the pushing plate. The first pushing device also includes two limiting strips, which are installed on the main base plate. The two limiting strips are located between the two first guide rails and on both sides of the pushing plate. One end of the two limiting strips extends below the positioning block, and the distance between the inner sides of the two limiting strips at the ends away from the positioning block is greater than the distance between the inner sides of the ends of the two limiting strips at the ends closer to the positioning block.

6. The LED array ceramic substrate dicing machine according to claim 5, characterized in that: The discharge trough between the main base plate and the auxiliary base plate is connected to the conveying channel. The second pushing device can pass through the first pushing gap to push the strip LED ceramic substrate in the discharge trough into the conveying channel, and then push it out from the discharge port of the conveying channel.

7. The LED array ceramic substrate dicing machine according to claim 1, characterized in that: The base includes a lower side plate, a left side plate, a right side plate, and an upper side plate. The left side plate is mounted on the left side of the lower side plate, the right side plate is mounted on the right side of the lower side plate, and the upper side plate is mounted on the left and right side plates. The upper side plate has a through-flow pusher groove. The conveying channel is mounted on the upper side plate, and the other end of the base plate of the LED array ceramic substrate cracking system is mounted on the upper side plate.

8. The LED array ceramic substrate dicing machine according to claim 7, characterized in that: The second pushing device includes a second pushing motor, a lead screw, a second pushing slider, a pushing plate, and a second guide rail. The power output end of the second pushing motor is connected to one end of the lead screw, and the other end of the lead screw moves through the second pushing slider and is in transmission cooperation with the second pushing slider. The second guide rail is installed on the lower side plate, and the second pushing slider is slidably installed on the second guide rail. The pushing plate is vertically installed on the upper end of the second pushing slider, and the upper end of the pushing plate moves upward through the pushing groove and can move back and forth along the length of the pushing groove.

9. The LED array ceramic substrate dicing machine according to claim 8, characterized in that: The side of the conveying channel has a first channel plate and a second channel plate, and there is a second pushing gap between the first channel plate and the second channel plate. The conveying channel is located at the upper end of the second pushing gap, and the width of the conveying channel is greater than the width of the second pushing gap. The conveying channel is used for the passage of strip LED ceramic substrates. The upper end of the pushing piece can move upward through the second pushing gap and extend into the conveying channel.

10. A cleaving process using the LED array ceramic substrate cleaving machine according to any one of claims 1-9, characterized in that, The process includes the following steps: S1. Laser slits are made on the ceramic substrate of the LED array ceramic substrate using a laser cutting machine. The slit depth is 5% to 60% of the thickness of the ceramic substrate. The slits include transverse slits and longitudinal slits. Multiple square grids are formed between the transverse slits and longitudinal slits. Each square grid contains one LED. S2. Place the laser-cut LED array ceramic substrate in the working position of the first feeding device, and ensure that the LEDs and the slits of the LED array ceramic substrate face upwards. S3. The first feeding device pushes the LED array ceramic substrate to move. One column of LEDs on the LED array ceramic substrate is located below the splitting device, and the remaining LEDs on the LED array ceramic substrate are all located below the positioning device. S4. The positioning device operates, pressing down the LED array ceramic substrate; S5. The strip-breaking device operates to break the LED array ceramic substrate into strip-shaped LED ceramic substrates with a single row of LEDs; S6. The second feeding device operates to send the strip-shaped LED ceramic substrate broken by the strip-breaking device into the conveying channel, and push the strip-shaped LED ceramic substrate along the conveying channel to the bottom of the particle-breaking device. S7. When the strip-shaped LED ceramic substrate is pushed out from the outlet of the conveying channel, it is pressed by the lower end of the die head, and the strip-shaped LED ceramic substrate breaks into granular LED ceramic substrates with single LEDs.

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