A direct cooling refrigerator refrigeration device and control method

Abstract

The present invention discloses a direct cooling refrigerator refrigeration device and control method, comprising a cold storage room and a freezing room, and also comprising a compression refrigeration mechanism and a semiconductor refrigeration mechanism, the semiconductor refrigeration mechanism comprising a semiconductor refrigeration plate, one side of the semiconductor refrigeration plate faces the refrigeration evaporator and is equipped with a heat dissipation mechanism one; the side of the semiconductor refrigeration plate away from the heat dissipation mechanism one is equipped with a heat dissipation mechanism two; the two sides of the semiconductor refrigeration plate are respectively connected with switch devices to form an H-bridge circuit; a control mechanism, the control mechanism comprises a control board, an ambient temperature sensor, a refrigeration defrost sensor, a refrigeration sensor and a freezing sensor; the refrigeration device of the present invention can solve the problem that the temperature of the cold storage compartment is low and the freezing compartment is high under low ambient temperature or when the freezing heat load increases, and the temperature of the freezing compartment is too low and the temperature of the cold storage compartment is high under high ambient temperature or when the refrigeration heat load increases, and the compressor does not stop for a long time.

Description

Technical Field

[0001] The present invention relates to the technical field of refrigeration devices, and in particular to a direct-cooling refrigerator refrigeration device and a control method thereof. Background Art

[0002] The refrigeration system of a two-temperature zone direct cooling refrigerator is generally a compression single-cycle and compression double-cycle refrigeration system. The double cycle realizes independent temperature control of refrigeration and freezing through valve switching. However, since the double cycle requires switching valves during the refrigeration process, the switching valves have problems such as poor reliability, valve leakage, many welding points and high cost. Therefore, the two-temperature zone direct cooling refrigerators on the market generally use a single-cycle refrigeration system.

[0003] The cycle of the single-cycle refrigeration system is as follows: the low-temperature and low-pressure refrigerant is compressed into high-temperature and high-pressure gas in the compressor, discharged from the compressor outlet, condensed and cooled by the condenser, and then throttled and reduced in pressure by a single capillary tube, and then evaporated and absorbed heat by the freezing evaporator and the refrigeration evaporator to become a low-temperature and low-pressure gas, and finally returned to the compressor to form a complete compression refrigeration cycle. This type of single-cycle direct cooling refrigerator is generally designed to match the size of the refrigeration and freezing evaporators at a specific ambient temperature, adjust the appropriate refrigerant, and meet the national standard GB8059 test requirements for power consumption and storage temperature.

[0004] But in fact, the user's usage conditions are complex, the external environment temperature changes, the number of times users open the refrigerator and freezer door at different times, the load load changes, etc., all of which will affect the heat load of the refrigerator's refrigeration and freezer compartments, so the refrigeration demand ratio of the refrigerator and freezer compartment will also change. The disadvantage of this single-cycle direct cooling refrigerator is that when the ambient temperature is lower than a certain level or the freezing load is large, in order to ensure that the freezer compartment reaches the appropriate temperature, the temperature of the refrigerator compartment will be low, and the room temperature of the refrigerator compartment will be too low to freeze. At high ambient temperatures or when the refrigeration load is large, in order to ensure the refrigeration and preservation effect, the temperature of the freezer compartment will be too low, and the compressor will not stop for a long time, resulting in energy waste and affecting the user experience.

[0005] In order to solve the above problems, the authorized utility model patent CN 206001777 U discloses a refrigerator, which adds a fan in the refrigeration chamber, sets a refrigeration air duct, and controls the fan in series through an ambient temperature magnetic control switch, automatically adjusts the fan start and stop according to the ambient temperature, and adjusts the distribution of refrigeration and freezing temperatures. The above method can alleviate the problem of refrigeration and freezing temperature distribution under high and low ambient temperatures to a certain extent, but it cannot dynamically adjust the refrigeration and freezing cold distribution for changes in refrigeration and freezing load caused by user use.

[0006] The authorized invention patent CN 104654646 B discloses a refrigeration control method for a reversible direct cooling system, which adds a four-way reversing valve at the rear end of the evaporator and the front end of the throttling device (capillary tube), switches the four-way reversing valve according to the ambient temperature, adjusts the flow direction of the refrigerant between the refrigeration evaporator and the freezing evaporator, and solves the evaporator area matching problem of the refrigerator under different ambient temperatures. The above method can well solve the cooling demand under different loads of refrigeration and freezing, but it needs to add a throttling capillary tube and a four-way reversing valve, the number of welding points of the refrigeration system pipeline increases significantly, and the valve itself may leak, which greatly increases the risk of leakage of the entire refrigeration system, affecting the refrigeration reliability of the product. Summary of the invention

[0007] The object of the present invention is to provide a direct cooling refrigerator refrigeration device and control method to solve the following technical problems:

[0008] In existing single-cycle direct cooling refrigerators, when the ambient temperature is low or the freezing heat load increases, the temperature of the refrigerating compartment is too low and the freezing temperature is too high. When the ambient temperature is high or the refrigerating heat load increases, the temperature of the freezing compartment is too low and the refrigerating compartment is too high, and the compressor does not stop for a long time.

[0009] The purpose of the present invention can be achieved through the following technical solutions:

[0010] A direct cooling refrigerator refrigeration device, comprising a refrigerating chamber and a freezing chamber, and also comprising

[0011] A compression refrigeration mechanism, wherein the compression refrigeration system comprises a compressor, an anti-condensation tube is connected in series after the compressor, a condenser is connected in series after the anti-condensation tube, a filter is connected in series after the condenser, a capillary tube is connected in series after the filter, a freezing evaporator arranged in the freezing chamber is connected in series after the capillary tube, a refrigeration evaporator arranged in the refrigeration chamber is connected in series after the freezing evaporator, and the refrigeration evaporator is connected to the compressor to form a circulation system;

[0012] A semiconductor refrigeration mechanism, the semiconductor refrigeration mechanism comprises a semiconductor refrigeration sheet, one side of the semiconductor refrigeration sheet faces the refrigeration evaporator and is installed with a heat dissipation mechanism 1; a side of the semiconductor refrigeration sheet away from the heat dissipation mechanism 1 is installed with a heat dissipation mechanism 2; both sides of the semiconductor refrigeration sheet are respectively connected to the switch device to form an H-bridge circuit;

[0013] The control mechanism includes a control board arranged on the box body, an ambient temperature sensor arranged outside the box body for detecting the external environment temperature of the refrigerator, a refrigeration defrost sensor arranged on the refrigeration evaporator for detecting the temperature of the refrigeration evaporator, a refrigeration sensor arranged inside the refrigeration chamber for detecting the internal temperature of the refrigeration chamber, and a freezing sensor arranged inside the freezing chamber for detecting the internal temperature of the freezing chamber; the ambient temperature sensor, the refrigeration defrost sensor, the refrigeration sensor and the freezing sensor are all electrically connected to the control board.

[0014] In a further embodiment: the first heat dissipation mechanism includes a first radiator and a first heat dissipation fan, the first radiator is installed on the side of the semiconductor refrigeration plate facing the refrigeration evaporator, and the first heat dissipation fan is installed on the first radiator; the second heat dissipation mechanism includes a second radiator and a second heat dissipation fan, the second radiator is installed on the side of the semiconductor refrigeration plate away from the refrigeration evaporator, and the second heat dissipation fan is installed on the second radiator.

[0015] In a further solution: the first cooling fan, the second cooling fan and the semiconductor cooling plate are all electrically connected to the control board.

[0016] In a further solution: the first heat sink and the second heat sink are both mounted on the semiconductor refrigeration plate by screws, and are in contact with the heat conductive block for heat conduction through heat conductive adhesive.

[0017] In a further solution: a heat preservation channel is provided at a side end of the first radiator, and the heat preservation channel is made of a heat preservation material.

[0018] In a further solution: the switching device is a MOS tube or a relay.

[0019] A control method for a direct cooling refrigerator refrigeration device as described above is characterized by comprising the following steps:

[0020] S1: Turn on the refrigerator and read the ambient temperature sensor temperature TH, the refrigeration and defrosting sensor temperature TZ, the refrigeration sensor temperature TC and the freezing sensor temperature TD through the control board;

[0021] S2: Compare TC with TCon (set refrigeration start-up point temperature), TD with TDon (set freezing start-up point temperature), if TC≥TCon and TD≥TDon, go to S3, if TC≥TCon, TD<TDon, go to S4, if TC<TCon, TD≥TDon, go to S6;

[0022] S3: Determine TH. If TH ≥ 32°C, go to S4; if not, go to S5;

[0023] S4: The compressor runs, the semiconductor refrigeration mechanism starts running, and the forward circuit is connected;

[0024] S5: judge TH, if TH≤16℃, go to S6; if not, go to S7;

[0025] S6: The compressor runs, the semiconductor refrigeration mechanism starts running, and the negative circuit is connected;

[0026] S7: Determine TH. If 16°C < TH < 32°C, the compressor operates and the semiconductor refrigeration mechanism does not operate.

[0027] S8: If TC≤TCoff (the set refrigeration shutdown point temperature) and TD≤TDoff (the set freezing shutdown point temperature), the compressor stops and the semiconductor refrigeration mechanism stops running;

[0028] S9: Calculate the cumulative compressor running time N and determine whether N ≥ 48h, that is, determine whether TZ < 3°C. If so, switch to S refrigeration sensor, if not, switch to S freezing sensor;

[0029] S10: The semiconductor refrigeration mechanism starts to operate and the forward circuit is connected;

[0030] S11: The semiconductor refrigeration mechanism stops running.

[0031] Beneficial effects of the present invention:

[0032] (1) The present invention adds a semiconductor refrigeration mechanism near the evaporator of the cold storage room, combines the direct cooling single cycle system, and the two rooms cause a large fluctuation in the refrigeration and freezing heat load ratio under different user usage conditions. The present invention makes full use of the sensors in each room to collect and judge the refrigeration needs of the two rooms. Combined with the characteristics of the semiconductor refrigeration plate in the semiconductor refrigeration mechanism that the hot and cold sides can be switched, the evaporation temperature of the direct cooling compression refrigeration mechanism is changed, and the system evaporation temperature and the heat exchange temperature difference between the refrigeration room and the evaporation temperature and the heat exchange temperature difference between the freezing room are indirectly controlled to meet the different cooling requirements of the refrigeration and freezing rooms. When the refrigerator is at a low ambient temperature or when the freezing heat load increases, the temperature of the cold storage room is low and the freezing room is high. When the refrigerator is at a high ambient temperature or when the refrigeration heat load increases, the temperature of the freezing room is too low and the temperature of the cold storage room is high. The compressor does not stop for a long time. It is more in line with user needs and can achieve energy saving and freshness preservation effects.

[0033] (2) The present invention does not need to add welding points or valves to the refrigeration system pipeline in the compression refrigeration mechanism, thereby reducing the risk of leakage in the refrigeration system and improving the safety and reliability of the product. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] The present invention will be further described below in conjunction with the accompanying drawings.

[0035] Figure 1 It is a structural schematic diagram of an embodiment of the present invention;

[0036] Figure 2 is a schematic diagram of a compression refrigeration system in one embodiment of the present invention;

[0037] Figure 3 It is a structural schematic diagram of a semiconductor refrigeration mechanism in one embodiment of the present invention;

[0038] Figure 4 This is a schematic diagram of the switching control principle of a semiconductor refrigeration mechanism in one embodiment of the present invention;

[0039] Figure 5 It is a flow chart of a control method of a refrigeration device in one embodiment of the present invention.

[0040] The numbers in the figure represent:

[0041] 1. Refrigerating chamber; 2. Freezing chamber; 3. Compressor; 4. Refrigerating evaporator; 5. Refrigerating evaporator; 6. Semiconductor refrigeration mechanism; 61. First radiator; 62. First cooling fan; 63. Second radiator; 64. Second cooling fan; 65. Semiconductor refrigerating sheet; 66. Insulating channel; 7. Control panel; 8. Ambient temperature sensor; 9. Refrigerating defrosting sensor; 10. Refrigerating sensor; 11. Freezing sensor. DETAILED DESCRIPTION

[0042] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0043] See also Figure 1-4 As shown, the present invention is a direct cooling refrigerator refrigeration device, including a refrigerator compartment 1 and a freezer compartment 2, wherein the refrigerator compartment 1 is arranged above the freezer compartment 2; and also includes a compression refrigeration mechanism, wherein the compression refrigeration system includes a compressor 3, an anti-condensation tube is connected in series after the compressor 3, a condenser is connected in series after the anti-condensation tube, a filter is connected in series after the condenser, a capillary tube is connected in series after the filter, a freezing evaporator 4 arranged inside the freezer compartment 2 is connected in series after the capillary tube, a refrigeration evaporator 5 arranged inside the refrigerator compartment 1 is connected in series after the freezing evaporator 4, and the refrigeration evaporator 5 is connected to the compressor 3 to form a circulation system.

[0044] A semiconductor refrigeration mechanism 6 is provided inside the cold storage chamber 1, and the semiconductor refrigeration mechanism 6 includes a semiconductor refrigeration sheet 65, one side of the semiconductor refrigeration sheet 65 faces the refrigeration evaporator 5 and is installed with a heat dissipation mechanism 1; a heat dissipation mechanism 2 is installed on the side of the semiconductor refrigeration sheet 65 away from the heat dissipation mechanism 1; the two sides of the semiconductor refrigeration sheet 65 are respectively connected to the switching device to form an H-bridge circuit; the model of the switching device is not specifically limited, and it only needs to meet the actual application requirements. For example, in an embodiment of the present invention, the switching device is a MOS tube or a relay.

[0045] The refrigeration device also includes a control mechanism, which includes a control board 7 arranged on the box body, an ambient temperature sensor 8 arranged outside the box body for detecting the external environmental temperature of the refrigerator, a refrigeration defrost sensor 9 arranged on the refrigeration evaporator 5 for detecting the temperature of the refrigeration evaporator 5, a refrigeration sensor 10 arranged inside the refrigeration chamber 1 for detecting the internal temperature of the refrigeration chamber 1, and a freezing sensor 11 arranged inside the freezing chamber 2 for detecting the internal temperature of the freezing chamber 2; the ambient temperature sensor 8, the refrigeration defrost sensor 9, the refrigeration sensor 10 and the freezing sensor 11 are all electrically connected to the control board 7.

[0046] Furthermore, the heat dissipation mechanism 1 includes a first radiator 61 and a first heat dissipation fan 62, the first radiator 61 is installed on the side of the semiconductor refrigeration plate 65 facing the refrigeration evaporator 5, and the first heat dissipation fan 62 is installed on the first radiator 61; the heat dissipation mechanism 2 includes a second radiator 63 and a second heat dissipation fan 64, the second radiator 63 is installed on the side of the semiconductor refrigeration plate 65 away from the refrigeration evaporator 5, and the second heat dissipation fan 64 is installed on the second radiator 63.

[0047] Furthermore, the first cooling fan 62 , the second cooling fan 64 and the semiconductor cooling sheet 65 are all electrically connected to the control board 7 .

[0048] Furthermore, the first heat sink 61 and the second heat sink 63 are both mounted on the semiconductor cooling plate 65 by screws, and are in contact with the heat conductive block through thermal conductive adhesive for heat conduction, and the cold side cooling capacity and hot side heat flow of the semiconductor cooling plate 65 are respectively transferred to the cold side heat sink and the hot side heat sink for heat dissipation enhanced by fans.

[0049] It should be noted that the cold side and the hot side of the semiconductor refrigeration plate 65 are not fixed to one side. When the connection mode of the H-bridge circuit is changed through the switching device, the cold and hot sides of the semiconductor refrigeration plate 65 are switched accordingly.

[0050] Furthermore, a heat preservation channel 66 is provided at a side end of the first radiator 61, and the heat preservation channel 66 is made of a heat preservation material.

[0051] There is no specific limitation on the insulation material of the insulation channel 66 , and it only needs to meet the actual insulation requirements. For example, in an embodiment of the present invention, the insulation material is polyurethane foam material or EPS foam.

[0052] See also Figure 5 The present invention also includes a control method for the direct cooling refrigerator refrigeration device as described above, comprising the following steps:

[0053] S1: The refrigerator is powered on, and the control board 7 reads the temperature TH of the ambient temperature sensor 8, the temperature TZ of the refrigeration and defrosting sensor 9, the temperature TC of the refrigeration sensor 10, and the temperature TD of the freezing sensor 11;

[0054] S2: Compare TC with TCon (the set refrigeration start-up point temperature), TD with TDon (the set freezing start-up point temperature). If TC≥TCon and TD≥TDon, go to S3; if TC≥TCon and TD<TDon, go to S4; if TC<TCon and TD≥TDon, go to S6;

[0055] S3: Determine TH. If TH ≥ 32°C, go to S4; if not, go to S5;

[0056] S4: The compressor 3 starts running, the semiconductor refrigeration mechanism 6 starts running, and the forward circuit is connected;

[0057] S5: judge TH, if TH≤16℃, go to S6; if not, go to S7;

[0058] S6: The compressor 3 starts running, the semiconductor refrigeration mechanism 6 starts running, and the negative circuit is connected;

[0059] S7: Determine TH. If 16°C < TH < 32°C, the compressor 3 operates and the semiconductor refrigeration mechanism 6 does not operate.

[0060] S8: If TC≤TCoff (the set refrigeration shutdown point temperature) and TD≤TDoff (the set freezing shutdown point temperature), the compressor 3 stops, and the semiconductor refrigeration mechanism 6 stops running;

[0061] S9: Calculate the running time N of the compressor 3 cumulatively, and determine whether N≥48h, that is, determine whether TZ<3°C. If so, turn to S refrigeration sensor 10, if not, turn to S freezing sensor 11;

[0062] S refrigeration sensor 10: semiconductor refrigeration mechanism 6 starts running, and the forward circuit is connected;

[0063] S freezing sensor 11: The semiconductor refrigeration mechanism 6 stops operating.

[0064] The working principle of the present invention is:

[0065] When the refrigerator is running at a high ambient temperature or the load of the cold storage room 1 is large, that is, the heat leakage of the cold storage room 1 is large, and the refrigeration demand of the cold storage room 1 is large, the evaporation area of ​​the cold storage room 1 is small, and the compression refrigeration mechanism is automatically adjusted to lower TZ to ensure the refrigeration capacity Qc = KAΔTc, where ΔTc = TC-TZ. Because the cold capacity demand of the freezing room 2 is Qd = KAΔTd, ΔT = Td-TZ, the reduction of TZ further reduces the temperature of the freezing room 2. Because the refrigerant first enters the freezing evaporator 4 and then enters the refrigeration evaporator 5, the temperature of the freezing room 2 is reduced, resulting in more refrigerant in the freezing evaporator 4, the heat exchange of the freezing room 2 is increased, and the heat exchange of the refrigeration evaporator 5 is further deteriorated, and the temperature difference between the upper and lower spaces of the cold storage room 1 is increased (the upper part is hot and the lower part is cold);

[0066] At this time, the semiconductor refrigeration mechanism 6 is started, and the H-bridge circuit is switched to the forward path through the switch device. The first radiator 61 end, that is, the hot side, is used to heat the refrigeration evaporator 5, increase TZ, and improve the circulation efficiency of the compression refrigeration mechanism, so as to increase the temperature of the freezing chamber 2. At the same time, the cold side cold energy of the second radiator 63 end is blown into the refrigerating chamber 1 through the first cooling fan 62, so as to reduce the temperature of the refrigerating chamber 1. By adjusting the efficiency of the compression refrigeration mechanism and the refrigeration capacity transmission direction of the semiconductor refrigeration mechanism 6, the refrigeration capacity of the freezing chamber 2 is reduced and the refrigeration capacity of the refrigerating chamber 1 is increased, thereby solving the problem of large refrigeration demand of the refrigerating chamber 1.

[0067] On the contrary, when the refrigerator is running at a low ambient temperature or the load of the freezer compartment 2 is large, that is, the heat leakage of the freezer compartment 2 is large, and the refrigeration demand of the freezer compartment 2 is large, the evaporation area of ​​the freezer compartment 2 is relatively large, and the compression refrigeration mechanism automatically adjusts to increase TZ. At this time, the heat exchange temperature difference ΔT=Td-TZ of the freezer compartment 2 is small, and the cooling demand of the freezer compartment 2 cannot be met;

[0068] At this time, the semiconductor refrigeration mechanism 6 is started, and the hot and cold sides of the semiconductor refrigeration plate 65 are switched. The first radiator 61 end, that is, the cold side, is used to cool the refrigeration evaporator 5, reduce the evaporation temperature of the compression refrigeration mechanism, increase ΔT, and improve the air heat exchange efficiency between the freezing evaporator 4 and the freezing chamber 2, and reduce the temperature of the freezing chamber 2. At the same time, the hot side heat of the second radiator 63 end is blown into the cold storage room through the second cooling fan 64, raising the temperature of the cold storage room 1, further increasing the start time of the compressor 3, and improving the heat exchange efficiency through the heat exchange temperature difference of the freezing chamber 2; the cooling capacity of the cold storage room 1 and the freezing chamber 2 is adjusted by switching the heating capacity delivery direction of the semiconductor refrigeration plate 65, thereby solving the problem of large cooling capacity demand in the freezing chamber 2.

[0069] In the description of the present invention, it should be understood that the terms "upper", "lower", "left", "right", etc. indicate directions or positional relationships based on the directions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific direction, and a specific direction structure and operation, and therefore, cannot be understood as a limitation on the present invention. In addition, "first" and "second" are only for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present invention, unless otherwise specified, "multiple" means two or more.

[0070] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", etc. should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be an indirect connection through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0071] The above is a detailed description of an embodiment of the present invention, but the content is only a preferred embodiment of the present invention and cannot be considered to limit the scope of implementation of the present invention. All equivalent changes and improvements made within the scope of the present invention should still fall within the scope of the patent coverage of the present invention.

Claims

1. A control method for a direct cooling refrigerator refrigeration device, characterized in that: The direct cooling refrigerator refrigeration device comprises a refrigerating chamber (1) and a freezing chamber (2), and further comprises: A compression refrigeration mechanism, the compression refrigeration mechanism comprising a compressor (3), an anti-condensation tube connected in series after the compressor (3), a condenser connected in series after the anti-condensation tube, a filter connected in series after the condenser, a capillary tube connected in series after the filter, a freezing evaporator (4) arranged in the freezing chamber (2) connected in series after the capillary tube, a refrigeration evaporator (5) arranged in the refrigeration chamber (1) connected in series after the freezing evaporator (4), the refrigeration evaporator (5) connected in series with the compressor (3), forming a circulation system; A semiconductor refrigeration mechanism (6), the semiconductor refrigeration mechanism (6) comprising a semiconductor refrigeration sheet (65), one side of the semiconductor refrigeration sheet (65) facing the refrigeration evaporator (5) and having a first heat dissipation mechanism installed on the side; a second heat dissipation mechanism is installed on the side of the semiconductor refrigeration sheet (65) away from the first heat dissipation mechanism; and both sides of the semiconductor refrigeration sheet (65) are respectively connected to a switch device to form an H-bridge circuit; A control mechanism, the control mechanism comprising a control panel (7) arranged on the box body, an ambient temperature sensor (8) arranged outside the box body for detecting the external environment temperature of the refrigerator, a refrigeration and defrosting sensor (9) arranged on the refrigeration evaporator (5) for detecting the temperature of the refrigeration evaporator (5), a refrigeration sensor (10) arranged inside the refrigeration chamber (1) for detecting the internal temperature of the refrigeration chamber (1), and a freezing sensor (11) arranged inside the freezing chamber (2) for detecting the internal temperature of the freezing chamber (2); the ambient temperature sensor (8), the refrigeration and defrosting sensor (9), the refrigeration sensor (10) and the freezing sensor (11) are all electrically connected to the control panel (7); The specific steps of the control method of the direct cooling refrigerator refrigeration device are as follows: S1: The refrigerator is powered on, and the temperature TH of the ambient temperature sensor (8), the temperature TZ of the refrigeration and defrosting sensor (9), the temperature TC of the refrigeration sensor (10), and the temperature TD of the freezing sensor (11) are read through the control board (7); S2: Compare TC with the set refrigeration start-up point temperature TCon, TD with the set freezing start-up point temperature TDon, if TC≥TCon and TD≥TDon, go to S3, if TC≥TCon and TD<TDon, go to S4, if TC<TCon and TD≥TDon, go to S6; S3: Determine TH. If TH ≥ 32°C, go to S4; if not, go to S5; S4: The compressor (3) starts running, the semiconductor refrigeration mechanism (6) starts running, and the forward circuit is connected; S5: Determine TH. If TH≤16°C, go to S6; if not, go to S7; S6: The compressor (3) starts running, the semiconductor refrigeration mechanism (6) starts running, and the negative circuit is connected; S7: judging TH, if 16°C<TH<32°C, the compressor (3) operates and the semiconductor refrigeration mechanism (6) does not operate; S8: if it is determined that TC is less than or equal to the set refrigeration shutdown point temperature TCoff and TD is less than or equal to the set freezing shutdown point temperature TDoff, the compressor (3) is shut down and the semiconductor refrigeration mechanism (6) stops operating; S9: cumulatively calculate the running time N of the compressor (3), and determine whether N ≥ 48h, that is, determine whether TZ < 3°C. If so, proceed to S10; if not, proceed to S11; S10: The semiconductor refrigeration mechanism (6) starts to operate and the forward circuit is connected; S11: The semiconductor refrigeration mechanism (6) stops operating.

2. The control method of a direct cooling refrigerator refrigeration device according to claim 1, characterized in that: The first heat dissipation mechanism comprises a first heat sink (61) and a first heat dissipation fan (62), wherein the first heat sink (61) is installed on a side of the semiconductor refrigeration plate (65) facing the refrigeration evaporator (5), and the first heat dissipation fan (62) is installed on the first heat sink (61); the second heat dissipation mechanism comprises a second heat sink (63) and a second heat dissipation fan (64), wherein the second heat sink (63) is installed on a side of the semiconductor refrigeration plate (65) away from the refrigeration evaporator (5), and the second heat dissipation fan (64) is installed on the second heat sink (63).

3. The control method of a direct cooling refrigerator refrigeration device according to claim 2, characterized in that: The first heat dissipation fan (62), the second heat dissipation fan (64) and the semiconductor cooling plate (65) are all electrically connected to the control board (7).

4. The control method of a direct cooling refrigerator refrigeration device according to claim 2, characterized in that: The first heat sink (61) and the second heat sink (63) are both mounted on the semiconductor cooling plate (65) by means of screws, and are in contact with the heat conducting block for heat conduction via heat conducting glue.

5. The control method of a direct cooling refrigerator refrigeration device according to claim 4, characterized in that: A heat preservation channel (66) is provided at the side end of the first radiator (61), and the heat preservation channel (66) is made of a heat preservation material.

6. The control method of a direct cooling refrigerator refrigeration device according to claim 1, characterized in that: The switch device is a MOS tube or a relay.

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