A chip temperature measurement system and method

Abstract

The application discloses a kind of chip temperature measurement system and method, the system includes: high temperature sorting machine, chip to be measured, lead frame, temperature sensor, test board and single-chip microcomputer;Chip to be measured, lead frame, temperature sensor are encapsulated in high temperature sorting machine, temperature sensor is connected with the first target pin of lead frame, chip to be measured is connected with the second target pin of lead frame;Temperature sensor is used to collect the temperature data of chip to be measured;The gold finger of first target pin connected on lead frame is connected with the first slot of test board, and cable connection is used between test board and single-chip microcomputer.This scheme connects temperature sensor with the lead frame connected with chip to be measured, so that the internal temperature of chip to be measured can be truly collected, and the gold finger connected with temperature sensor is connected with test board, test board is connected with single-chip microcomputer, so that the dynamic temperature under chip operation can be reflected in real time, improve detection precision and accuracy.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of semiconductor testing, and in particular to a chip temperature measurement system and method. BACKGROUND

[0002] Currently, chips mainly include consumer-grade, industrial-grade, automotive-grade, and aerospace-grade chips. According to the packaging industry standards for integrated circuits, automotive-grade and aerospace-grade integrated circuit chips generally need to be tested in a high-temperature environment, and the electrical performance of the chips needs to be tested at different high-temperature levels. Different chips have different temperature requirements for the test environment, and the standard temperatures are generally 80°, 100°, 125°, and 150° for different levels. By placing the chips in a high-temperature environment and performing related electrical performance tests, the operation of the chips in an actual high-temperature environment is simulated, thereby screening out products that meet the temperature requirements and improving the reliability of the products.

[0003] High-temperature environment testing is an important condition for screening whether a chip can work normally in a high-temperature environment, and therefore, it is crucial to ensure the accuracy and stability of the high-temperature environment for chip testing. Generally, a high-temperature handler is used to provide the high-temperature environment required for testing the chips.

[0004] Currently, the high-temperature detection method of the existing high-temperature handler mainly involves installing temperature sensors at specific positions in the high-temperature area of the handler for detecting the environmental temperature of the heating area and the test area. However, this method only detects the environmental temperature at one point or one area. Another method involves using a third-party temperature detection device to detect and verify the high-temperature area. For example, a commonly used temperature detection table. This method also only detects the temperature at specific points and specific areas.

[0005] The above two methods can only superficially detect the static temperature that can be achieved by the fixed area and specific point devices of the high-temperature handler, but they cannot truly reflect whether the required temperature has been reached inside the chip, nor can they reflect the dynamic temperature of the chip under operation, resulting in low precision and accuracy of the measurement. SUMMARY

[0006] The present application aims to at least solve the technical problems existing in the prior art. To this end, the present application proposes, in a first aspect, a chip temperature measurement system, which comprises: a high-temperature handler, a chip to be tested, a lead frame, a temperature sensor, a test board, and a single-chip microcomputer.

[0007] The chip to be tested, the lead frame, and the temperature sensor are packaged in the high-temperature handler, the temperature sensor is connected to a first target pin of the lead frame, the chip to be tested is connected to a second target pin of the lead frame, and the temperature sensor is used to collect temperature data of the chip to be tested.

[0008] The gold finger connected with the first target pin on the lead frame is connected with the first slot of the test board, and the test board is connected with the single-chip microcomputer through a cable; the test board is used for transmitting temperature data collected by the temperature sensor to the single-chip microcomputer, and the single-chip microcomputer is used for processing and displaying the temperature data.

[0009] Optionally, the lead frame is in an MSOP packaging mode, the lead frame includes eight pins, and the temperature sensor includes two pins of an input end and an output end; the first target pin is any two pins of the eight pins.

[0010] Optionally, the lead frame is in an LQFP packaging mode, the lead frame includes at least 100 pins, and the temperature sensor includes two pins of an input end and an output end; the first target pin is any two pins of the at least 100 pins.

[0011] Optionally, the temperature sensor is a PT100 platinum thermal resistance temperature sensor.

[0012] Optionally, the gold finger connected with the second target pin on the lead frame is connected with the second slot of the test board, and the test board is further used for transmitting test data of the to-be-tested chip to the single-chip microcomputer; and the single-chip microcomputer is further used for processing and displaying the test data.

[0013] The second aspect of the present application provides a chip temperature measurement method, which is applied to the chip temperature measurement system of the first aspect, and the method comprises the following steps of:

[0014] In the process that the high-temperature sorting machine tests the electrical performance of the to-be-tested chip, the temperature sensor collects temperature data in real time.

[0015] The temperature sensor transmits the temperature data to the test board through a gold finger.

[0016] The test board transmits the temperature data to the single-chip microcomputer through a cable.

[0017] The single-chip microcomputer processes and displays the temperature data.

[0018] Optionally, the product flow channel of the high-temperature sorting machine includes a to-be-tested chip in a static state, and the temperature sensor collects temperature data in real time, including the following steps of:

[0019] The temperature sensor collects the static temperature of the to-be-tested chip.

[0020] Optionally, the high-temperature sorting machine includes a plurality of running test chips in the product flow channel, each of the test chips is connected with one temperature sensor on the lead frame, and the temperature sensor collects temperature data in real time, including:

[0021] Each temperature sensor collects dynamic temperature of the corresponding test chip in operation.

[0022] Optionally, the single-chip microcomputer processes and displays the temperature data, including:

[0023] The single-chip microcomputer acquires a timestamp corresponding to the dynamic temperature and displays the dynamic temperature in the form of a temperature curve.

[0024] The technical scheme provided by the embodiment of the application has at least the following beneficial effects:

[0025] The chip temperature measurement system and method provided by the embodiment of the application include a high-temperature sorting machine, a test chip, a lead frame, a temperature sensor, a test board and a single-chip microcomputer; the test chip, the lead frame and the temperature sensor are packaged in the high-temperature sorting machine, the temperature sensor is connected with a first target pin of the lead frame, and the test chip is connected with a second target pin of the lead frame; the temperature sensor is used to collect temperature data of the test chip; a gold finger connected with the first target pin on the lead frame is connected with a first slot of the test board, and the test board is connected with the single-chip microcomputer through a cable; the test board is used to transmit the temperature data collected by the temperature sensor to the single-chip microcomputer, and the single-chip microcomputer is used to process and display the temperature data. The temperature sensor is connected with the lead frame connected with the test chip, so that the internal temperature of the test chip can be truly collected, the gold finger connected with the temperature sensor is connected with the test board, and the test board is connected with the single-chip microcomputer, so that the dynamic temperature of the chip in operation can be reflected in real time, and the detection precision and accuracy are improved. BRIEF DESCRIPTION OF DRAWINGS

[0026] Figure 1 A schematic diagram of a chip temperature measurement system provided by the application;

[0027] Figure 2 A structure schematic diagram of an MSOP sample temperature sensor on a lead frame provided by the embodiment of the application;

[0028] Figure 3 A structure schematic diagram of an LQFP sample temperature sensor on a lead frame provided by the embodiment of the application;

[0029] Figure 4 A structure schematic diagram of an MSOP sample test board provided by the embodiment of the application;

[0030] Figure 5 A structure schematic diagram of a LQFP sample test board provided by the embodiment of the present application is shown in the figure.

[0031] Figure 6 A step flow chart of a chip temperature measuring method provided by the embodiment of the present application is shown in the figure.

[0032] Figure 7 An internal structure diagram of a high-temperature sorting machine provided by the embodiment of the present application is shown in the figure. DETAILED DESCRIPTION

[0033] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the present application.

[0034] Figure 1 A schematic diagram of a chip temperature measuring system provided by the embodiment of the present application is shown in the figure.

[0035] As shown in the figure, the system comprises a high-temperature sorting machine 1, a test board 2, a single-chip microcomputer 3, and a to-be-tested chip, a lead frame and a temperature sensor packaged in the high-temperature sorting machine. Figure 1

[0036] Among them, the test board and the single-chip microcomputer are connected by a cable 4; the test board 2 is used to transmit temperature data collected by the temperature sensor to the single-chip microcomputer 3, and the single-chip microcomputer 3 is used to process and display the temperature data.

[0037] Figure 2 A structure schematic diagram of a MSOP sample temperature sensor in a lead frame provided by the embodiment of the present application is shown in the figure.

[0038] As shown in the figure, a temperature sensor 5 is connected with a first target pin 7 of a lead frame 6, wherein the first target pin is a fourth pin 71 and an eighth pin 72 in Figure 2 The to-be-tested chip is connected with a second target pin (not shown in the figure) of the lead frame 6, and the second target pin can be other pins except the fourth pin and the eighth pin. Figure 2 Figure 2 The temperature sensor 5 and the to-be-tested chip are located on the same lead frame 6, and the temperature sensor 5 can collect temperature data of the to-be-tested chip.

[0039] The temperature sensor 5 and the to-be-tested chip are located on the same lead frame 6, and the temperature sensor 5 can collect temperature data of the to-be-tested chip.

[0040] ​​The gold finger of the second target pin on the lead frame 6 is connected with the first slot of the test board 2. The pin is a lead wire from the inside of the integrated circuit, which is generally welded with the external circuit, i.e. the test board. The gold finger is the port of the temperature sensor 5 for data exchange with the test board 2, and the gold finger is connected with the slot on the test board 2, so that the temperature data collected by the temperature sensor 5 can be transmitted to the test board 2. The test board 2 is connected with the external single-chip microcomputer 3, so that the temperature data can be further transmitted to the single-chip microcomputer 3, so that the single-chip microcomputer 3 processes and displays the temperature data.

[0041] In a possible implementation, the lead frame is in an MSOP packaging mode, the lead frame includes 8 pins, and the temperature sensor includes two pins of an input end and an output end; the first target pin is any two pins of the 8 pins.

[0042] The MSOP (Miniature Small Outline Package) packaging mode is a packaging form of a lead frame, which is a packaging form of a surface-mounted component with wing-shaped or J-shaped short leads on both sides. The MSOP has packaging modes of 8 pins, 10 pins, and 12 pins.

[0043] Referring to Figure 2 The MSOP packaging mode is 8 pins, wherein 5 is a temperature sensor, and 6 is a lead frame. The temperature sensor 5 includes two pins of an input end 8 and an output end 9, and the two pins of the temperature sensor can be connected with any two pins of the 8 pins of the lead frame. Figure 2 The temperature sensor in the MSOP packaging mode is connected with the fourth pin 71 and the eighth pin 72 of the lead frame.

[0044] In a possible implementation, the lead frame is in an LQFP packaging mode, the lead frame includes at least 100 pins, and the temperature sensor includes two pins of an input end and an output end; the first target pin is any two pins of the at least 100 pins.

[0045] The LQFP (Quad Flat Package) packaging mode is another packaging mode of a lead frame. The distance between the pins of the CPU chip realized by the technology is very small, and the pin is very thin. Generally, a large-scale or super-large-scale integrated circuit adopts this packaging form, and at least includes 100 pins.

[0046] Figure 3 The LQFP sample temperature sensor provided by the embodiment of the application is a structural schematic view of a lead frame.

[0047] As Figure 3As shown, the LQFP package mode is at least 100 pins, wherein 5 is a temperature sensor, and 6 is a lead frame. Two pins of the temperature sensor 5 can be connected with any two pins of the at least 100 pins of the lead frame 6.

[0048] In a possible implementation, the temperature sensor is a PT100 platinum thermal resistance temperature sensor.

[0049] The PT100 temperature sensor is an instrument for converting temperature variables into a standardized output signal that can be transmitted. It is usually composed of two parts: a sensor and a signal converter. The sensor is mainly a thermocouple or a thermal resistance; and the signal converter is mainly composed of a measurement unit, a signal processing and conversion unit.

[0050] The PT100 temperature sensor has a wide temperature measurement range, and due to the stable characteristics of platinum, it will not cause physical or chemical changes due to high and low temperatures.

[0051] In a possible implementation, the gold finger connected with the first target pin on the lead frame is connected with the second slot of the test board, and the test board is further used to transmit test data of the chip to be tested to the single-chip microcomputer, and the single-chip microcomputer is further used to process and display the test data.

[0052] The scheme places the chip to be tested in a high-temperature sorting machine, simulates the operation of the chip in an actual high-temperature environment, tests the electrical performance of the chip, and selects products meeting the temperature requirements, thereby improving the reliability of the products.

[0053] Specifically, the chip to be tested is connected with the second target pin of the lead frame, and the gold finger connected with the second target pin on the lead frame is connected with the second slot of the test board. In this way, the test board can receive test data of the chip to be tested in the electrical performance test process, and transmit the test data to the single-chip microcomputer, so that the single-chip microcomputer processes and displays the test data.

[0054] Figure 4 A structure schematic diagram of an MSOP sample test board provided for an embodiment of the present application is shown.

[0055] As shown in the figure, the test board of the MSOP package mode has independently arranged pads 10, and the pads 10 are connected with the interface 12 of the test board through metal welding wires 11. Figure 4

[0056] Specifically, the gold finger connected with the first target pin is connected with the first slot of the test board, and the gold finger connected with the second target pin is connected with the second slot of the test board.

[0057] Figure 5 A structure schematic diagram of an LQFP sample test board provided for an embodiment of the present application is shown.​

[0058] As shown in Figure 5 , the test board in LQFP packaging mode has a square arrangement of pads 10, and the pads 10 are connected to the interface 12 of the test board through metal wires 11.

[0059] The temperature sensor is connected to the lead frame connected to the chip to be tested, and the temperature detection and verification of the high-temperature sorting machine in almost all packaging forms can be realized, the accuracy and stability of the temperature can be verified under dynamic operation, the temperature characteristic curve of the chip under the running state can be more truly simulated, the chip test with high precision requirement on temperature is met, and the chip has more stable high-temperature temperature characteristics. The scheme can meet the product test requirements with high requirements and high accuracy, and is accurate, convenient, high in precision and wide in application range.

[0060] In summary, the chip temperature measurement system provided by the embodiment of the application comprises a high-temperature sorting machine, a chip to be tested, a lead frame, a temperature sensor, a test board and a single-chip microcomputer; the chip to be tested, the lead frame and the temperature sensor are packaged in the high-temperature sorting machine, the temperature sensor is connected to a first target pin of the lead frame, and the chip to be tested is connected to a second target pin of the lead frame; the temperature sensor is used for collecting temperature data of the chip to be tested; a gold finger connected to the first target pin on the lead frame is connected to a first slot of the test board, and the test board is connected to the single-chip microcomputer through a cable; the test board is used for transmitting the temperature data collected by the temperature sensor to the single-chip microcomputer, and the single-chip microcomputer is used for processing and displaying the temperature data. The temperature sensor is connected to the lead frame connected to the chip to be tested, so that the internal temperature of the chip to be tested can be truly collected, the gold finger connected to the temperature sensor is connected to the test board, and the test board is connected to the single-chip microcomputer, so that the dynamic temperature of the chip under operation can be reflected in real time, and the detection precision and accuracy are improved.

[0061] Figure 6 A step flow chart of a chip temperature measurement method provided by the embodiment of the application.

[0062] The chip temperature measurement method is applied to Figure 1 the chip temperature measurement system, as shown in Figure 6 , the method comprises the following steps.

[0063] Step 101, in the process of performing electrical performance test on the chip to be tested by the high-temperature sorting machine, the temperature sensor collects temperature data in real time;

[0064] Step 102, the temperature sensor transmits the temperature data to the test board through a gold finger;

[0065] Step 103, the test board transmits the temperature data to the single-chip microcomputer through a cable;

[0066] Step 104, the single-chip microcomputer processes and displays the temperature data.

[0067] In steps 101-104, the temperature sensor collects temperature data in real time during the electrical performance test of the chip to be tested in the high-temperature sorting machine. The temperature sensor and the chip to be tested are located on the same lead frame, and the temperature data collected by the temperature sensor is the temperature data of the chip to be tested. The temperature sensor is connected with the first target pin on the lead frame, the gold finger connected with the first target pin on the lead frame is connected with the first slot of the test board. The gold finger is the port for the temperature sensor to exchange data with the test board, and the gold finger is connected with the slot on the test board, so that the temperature data collected by the temperature sensor can be transmitted to the test board. The test board is connected with the external single-chip microcomputer, so that the temperature data can be further transmitted to the single-chip microcomputer for processing and display.

[0068] In a possible implementation, the product flow channel of the high-temperature sorting machine includes the chip to be tested in a static state, and the temperature sensor collects temperature data in real time, including: the temperature sensor collects the static temperature of the chip to be tested.

[0069] Figure 7 An internal structure diagram of the high-temperature sorting machine is provided for the embodiment of the application.

[0070] As shown in Figure 7 The temperature sensor is packaged in the product plastic package, the product is placed in the high-temperature wall of the high-temperature sorting machine, and the product and the test board are connected through the gold finger.

[0071] A plurality of products to be tested are placed in the product flow channel, the product flow channel is a channel for the chip to be tested to flow, and the running state of the chip to be tested is controlled through the movement of the belt pulley, including the static state and the running state.

[0072] When the belt pulley is static, the chip to be tested is in a static state, and the temperature sensor collects the static temperature of the chip to be tested.

[0073] In a possible implementation, the product flow channel of the high-temperature sorting machine includes a plurality of chips to be tested in a running state, and each lead frame of the chip to be tested is connected with one temperature sensor, and the temperature sensor collects temperature data in real time, including: each temperature sensor collects the dynamic temperature of the corresponding chip to be tested in the running state.

[0074] When the belt pulley is running, the chip to be tested is in a running state, and the temperature sensor collects the dynamic temperature of the chip to be tested.

[0075] The scheme verifies the accuracy and stability of the temperature under the dynamic operation, and can more truly simulate the temperature characteristic curve of the chip under the running state.

[0076] In a possible implementation, the single-chip microcomputer processes and displays the temperature data, including:

[0077] The single-chip microcomputer acquires the time stamp corresponding to the dynamic temperature, and displays the dynamic temperature in the form of a temperature curve.

[0078] The scheme displays the dynamic temperature in the form of a temperature curve, which can intuitively show the temperature change of the chip under the running state, so that the chip meeting the temperature requirement can be more accurately and efficiently screened, and the reliability of the chip product is improved.

[0079] To sum up, the chip temperature measurement method provided by the application, in the process of the high-temperature sorting machine testing the electrical performance of the chip, the temperature sensor acquires temperature data in real time; the temperature sensor transmits the temperature data to the test board through a golden finger; the test board transmits the temperature data to the single-chip microcomputer through a cable; and the single-chip microcomputer processes and displays the temperature data. The scheme connects the temperature sensor with the lead frame connected with the chip to be tested, so that the internal temperature of the chip to be tested can be truly acquired, and the temperature sensor transmits the temperature data to the test board through a golden finger, and the test board transmits the temperature data to the single-chip microcomputer through a cable, so that the dynamic temperature of the chip under the running state can be reflected in real time, and the detection precision and accuracy are improved.

[0080] The technical features of the above embodiments can be combined in any manner, and to make the description concise, not all possible combinations of the technical features in the above embodiments are described, however, as long as the combinations of the technical features do not exist contradictions, they should be considered as the scope of the disclosure.

[0081] Other embodiments of the disclosure will be apparent to those skilled in the art from consideration of the specification and practice of the application disclosed herein. This application is intended to cover any variations, uses or adaptations of the disclosure other than those expressly disclosed herein and including modifications and equivalents of the functional techniques disclosed herein. The specification and examples are to be regarded as exemplary only, and the true scope and spirit of the disclosure are indicated by the following claims.

[0082] It should be understood that the present disclosure is not limited to the precise structures described and shown in the accompanying drawings, and various modifications and changes can be made without departing from the scope thereof. The scope of the present disclosure is limited only by the appended claims.

Claims

1. A chip temperature measurement system, characterized by, The system comprises a high-temperature sorting machine, a chip to be tested, a lead frame, a temperature sensor, a test board and a single-chip microcomputer; The chip to be tested, the lead frame and the temperature sensor are packaged in the high-temperature sorting machine, the temperature sensor is connected with a first target pin of the lead frame, and the chip to be tested is connected with a second target pin of the lead frame; the temperature sensor is used to collect temperature data of the chip to be tested; A gold finger connected with the first target pin on the lead frame is connected with a first slot of the test board, and the test board is connected with the single-chip microcomputer through a cable; the test board is used to transmit the temperature data collected by the temperature sensor to the single-chip microcomputer, and the single-chip microcomputer is used to process and display the temperature data; The product flow channel of the high-temperature sorting machine comprises a plurality of chips to be tested in operation, one temperature sensor is connected to the lead frame of each chip to be tested, and each temperature sensor collects dynamic temperature of the corresponding chip to be tested in operation; The single-chip microcomputer acquires a timestamp corresponding to the dynamic temperature and displays the dynamic temperature in the form of a temperature curve.

2. The system of claim 1, wherein, The lead frame is in an MSOP packaging mode, the lead frame comprises eight pins, and the temperature sensor comprises two pins of an input end and an output end; the first target pin is any two pins of the eight pins.

3. The system of claim 1, wherein, The lead frame is in an LQFP packaging mode, the lead frame comprises at least 100 pins, and the temperature sensor comprises two pins of an input end and an output end; the first target pin is any two pins of the at least 100 pins.

4. The system of claim 1, wherein, The temperature sensor is a PT100 platinum thermal resistance temperature sensor.

5. The system of claim 1, wherein, A gold finger connected with the second target pin on the lead frame is connected with a second slot of the test board, and the test board is further used to transmit test data of the chip to be tested to the single-chip microcomputer, and the single-chip microcomputer is further used to process and display the test data.

6. A method of measuring the temperature of a chip, characterized by, The method is applied to the chip temperature measurement system of any one of claims 1-5, and the method comprises: During electrical performance testing of the chip to be tested by the high-temperature sorting machine, the temperature sensor collects temperature data in real time; The temperature sensor transmits the temperature data to the test board through a gold finger; The test board transmits the temperature data to the single-chip microcomputer through a cable; The single-chip microcomputer processes and displays the temperature data; The product flow channel of the high-temperature sorting machine comprises a plurality of chips to be tested in operation, one temperature sensor is connected to the lead frame of each chip to be tested, and each temperature sensor collects dynamic temperature of the corresponding chip to be tested in operation; The single-chip microcomputer acquires a timestamp corresponding to the dynamic temperature and displays the dynamic temperature in the form of a temperature curve.

7. The method of claim 6, wherein, The product flow channel of the high-temperature sorting machine comprises a chip to be tested in a static state, and the temperature sensor collects temperature data in real time, comprising: The temperature sensor collects static temperature of the chip to be tested.

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