Multilayer ceramic electronic component

Abstract

The present disclosure provides a multilayer ceramic electronic component including a ceramic main body having a first surface and a second surface opposite to each other in a first direction, a third surface and a fourth surface opposite to each other in a second direction, and a fifth surface and a sixth surface opposite to each other in a third direction, and an external electrode disposed on one of the third surface and the fourth surface and extending onto the first surface and the second surface. A relationship 0.9 ≤ A / BW < 1.0 is satisfied, where "A" represents a shortest distance in the second direction from an end portion of the ceramic main body on which the external electrode is disposed to an end portion of the external electrode disposed on one of the first surface and the second surface, and "BW" represents a longest distance in the second direction from the end portion of the ceramic main body to the end portion of the external electrode.

Description

[0001] This application is a divisional application of the invention patent application "Multilayer Ceramic Electronic Assembly" with the application date of September 22, 2020 and the application number of 202011001213.8. TECHNICAL FIELD

[0002] The present disclosure relates to a multilayer ceramic electronic assembly, and more particularly, to a multilayer ceramic electronic assembly having excellent reliability. BACKGROUND

[0003] Recently, as electronic products are miniaturized, thinned, and multifunctionalized, chip assemblies of the electronic products are also required to be miniaturized, and mounting of the electronic assemblies has become highly integrated.

[0004] A multilayer ceramic capacitor, a type of electronic assembly, is mounted on a circuit board of various electronic products such as display devices (e.g., liquid crystal display (LCD), plasma display panel (PDP), etc.), computers, personal digital assistants (PDAs), mobile phones, etc. for charging and discharging.

[0005] Such a multilayer ceramic capacitor is usable as an assembly of various electronic devices due to its advantages such as small size, high capacitance, and ease of mounting.

[0006] In addition, as industrial interest in electronic assemblies has increased recently, the multilayer ceramic capacitor is also required to have high reliability and high strength characteristics so as to be used for automotive or infotainment systems.

[0007] In particular, since the multilayer ceramic capacitor requires high bending strength characteristics, it is necessary to improve the internal structure and the external structure to improve the bending characteristics. SUMMARY

[0008] An aspect of the present disclosure is to provide a multilayer ceramic electronic assembly, and more particularly, to provide a multilayer ceramic electronic assembly having improved reliability.

[0009] According to an aspect of the disclosure, a multilayer ceramic electronic component includes a ceramic main body including dielectric layers and a plurality of internal electrodes disposed opposite each other, the dielectric layers being interposed between the plurality of internal electrodes disposed opposite each other, and the ceramic main body having a first surface and a second surface opposite each other in a first direction, a third surface and a fourth surface connected to the first surface and the second surface and opposite each other in a second direction, and a fifth surface and a sixth surface connected to the first surface to the fourth surface and opposite each other in a third direction; and an external electrode disposed on one of the third surface and the fourth surface opposite each other in the second direction and connected to an internal electrode exposed from the one of the third surface and the fourth surface among the plurality of internal electrodes. The external electrode extends onto the first surface and the second surface of the ceramic main body. A relationship 0.9 ≤ A / BW < 1.0 is satisfied, where "A" denotes a shortest distance in the second direction from an end of the ceramic main body on which the external electrode is disposed to an end of the external electrode disposed on one of the first surface and the second surface of the ceramic main body, and "BW" denotes a longest distance in the second direction from the end of the ceramic main body on which the external electrode is disposed to the end of the external electrode disposed on the one of the first surface and the second surface of the ceramic main body.

[0010] According to an aspect of the disclosure, a multilayer ceramic electronic component includes a ceramic main body including dielectric layers and a plurality of internal electrodes disposed opposite to each other, the dielectric layers being interposed between the plurality of internal electrodes disposed opposite to each other, and the ceramic main body having a first surface and a second surface opposite to each other in a first direction, a third surface and a fourth surface connected to the first surface and the second surface and opposite to each other in a second direction, and a fifth surface and a sixth surface connected to the first surface to the fourth surface and opposite to each other in a third direction; and an external electrode disposed on one of the third surface and the fourth surface and connected to an internal electrode exposed from the one of the third surface and the fourth surface among the plurality of internal electrodes. The external electrode extends onto the first surface and the second surface of the ceramic main body. A ratio BW / L satisfies 0.2 ≤ BW / L ≤ 0.3, where "BW" represents a longest distance in the second direction from an end portion of the ceramic main body on which the external electrode is disposed to an end portion of the external electrode disposed on one of the first surface and the second surface of the ceramic main body, and "L" represents a length of the ceramic main body. A central portion of the extension of the external electrode on the one of the first surface and the second surface in the third direction has a length in the second direction that is less than a length in the second direction of an edge portion of the extension of the external electrode on the one of the first surface and the second surface in the third direction. BRIEF DESCRIPTION OF DRAWINGS

[0011] The above and other aspects, features, and advantages of the disclosure will be more clearly understood from the following detailed description taken in conjunction with the accompanying drawings, in which:

[0012] Figure 1 is a perspective view illustrating a multilayer ceramic electronic component according to an exemplary embodiment of the disclosure;

[0013] Figure 2 is a schematic view illustrating a ceramic main body according to an exemplary embodiment;

[0014] Figure 3 is a plan view schematically illustrating a multilayer ceramic electronic component in a C direction of Figure 1 ;

[0015] Figure 4 is a cross-sectional view taken along line I-I' of Figure 1 ;

[0016] Figure 5 is an enlarged view of a "B" area of Figure 4 ; DETAILED DESCRIPTION

[0017] The present disclosure can be implemented in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the application to those skilled in the art. Thus, in the drawings, the shapes and sizes of elements can be exaggerated for clarity, and the same reference numerals will be used for similar or identical elements, throughout.

[0018] Also, throughout the specification, unless explicitly described to the contrary, the word "comprise" or "comprises," and variations such as "comprising" or "includes" means including, but not limited to, the stated elements.

[0019] For clarity of the present application, portions unrelated to the description will be omitted, and the thickness is exaggerated for the purpose of clearly indicating several layers and regions, and like reference numerals are used for like parts throughout the specification.

[0020] Values for parameters describing one-dimensional (1-D) dimensions of elements (including, but not limited to, "length," "width," "thickness," "diameter," "distance," "gap," and / or "size"), two-dimensional (2-D) dimensions of elements (including, but not limited to, "area" and / or "size"), three-dimensional (3-D) dimensions of elements (including, but not limited to, "volume" and / or "size"), and properties of elements (including, but not limited to, "roughness," "density," "weight," "weight ratio," and / or "molar ratio") can be obtained by the methods and / or tools described in the present disclosure. However, the present disclosure is not limited thereto. Other methods and / or tools known to those of ordinary skill in the art can be used even if not described in the present disclosure.

[0021] Hereinafter, preferred embodiments of the present disclosure will be described with reference to the accompanying drawings.

[0022] Figure 1 is a perspective view illustrating a multilayer ceramic electronic assembly according to an exemplary embodiment of the present disclosure.

[0023] Figure 2 is a schematic view illustrating a ceramic main body according to an exemplary embodiment.

[0024] Figure 3 is a plan view schematically illustrating a multilayer ceramic electronic assembly in a C direction of Figure 1

[0025] Figure 4 is a cross-sectional view taken along line I-I' of Figure 1

[0026] Based on Figures 1 to 4 ​​A multilayer ceramic electronic component 100 according to exemplary embodiments includes a ceramic main body 110 including a dielectric layer 111 and a plurality of internal electrodes 121 and 122 disposed opposite each other with the dielectric layer 111 interposed therebetween, and having a first surface S1 and a second surface S2 opposite each other in a first direction, a third surface S3 and a fourth surface S4 connected to the first and second surfaces S1 and S2 and opposite each other in a second direction, and a fifth surface S5 and a sixth surface S6 connected to the first through fourth surfaces and opposite each other in a third direction, and first and second external electrodes 131 and 132 disposed on the third and fourth surfaces S3 and S4 opposite each other in the second direction, respectively, and electrically connected to the internal electrodes 121 and 122.

[0027] Hereinafter, a multilayer ceramic electronic component according to exemplary embodiments in the present disclosure will be described. In particular, the multilayer ceramic electronic component will be described as a multilayer ceramic capacitor, but is not limited thereto.

[0028] In the multilayer ceramic capacitor according to exemplary embodiments of the present disclosure, a "length direction" refers to an "L" direction, a "width direction" refers to a "W" direction, and a "thickness direction" refers to a "T" direction. Here, the "thickness direction" can be the same as the direction in which the dielectric layers are stacked.

[0029] In exemplary embodiments, the shape of the ceramic main body 110 is not particularly limited, but can be a hexahedron as shown in the drawings.

[0030] The ceramic main body 110 can include a first surface S1 and a second surface S2 opposite each other in a first direction, a third surface S3 and a fourth surface S4 connected to the first and second surfaces S1 and S2 and opposite each other in a second direction, and a fifth surface S5 and a sixth surface S6 connected to the first through fourth surfaces and opposite each other in a third direction.

[0031] The first surface S1 and the second surface S2 are surfaces opposite each other in the first direction (the thickness direction of the ceramic main body 110). The third surface S3 and the fourth surface S4 can be defined as surfaces opposite each other in the second direction (the length direction), and the fifth surface S5 and the sixth surface S6 can be defined as surfaces opposite each other in the third direction (the width direction).

[0032] End portions of the plurality of internal electrodes 121 and 122 formed in the ceramic main body 110 can be exposed to the third and fourth surfaces S3 and S4 of the ceramic main body.

[0033] The internal electrodes 121 and 122 can be a pair of first and second internal electrodes 121 and 122 having different polarities from each other.

[0034] One end of the first internal electrode 121 can be exposed to the third surface S3, and one end of the second internal electrode 122 can be exposed to the fourth surface S4.

[0035] The other end of the first internal electrode 121 and the other end of the second internal electrode 122 are formed at a distance from the fourth surface or the third surface S3. Details thereof will be described below.

[0036] The first external electrode 131 and the second external electrode 132 are formed on the third surface S3 and the fourth surface S4 of the ceramic body to be electrically connected to the internal electrodes.

[0037] According to an exemplary embodiment, a raw material forming the dielectric layer 111 is not particularly limited as long as sufficient capacitance can be obtained; for example, a barium titanate-based material, a lead complex perovskite-based material, a strontium titanate-based material, or the like can be used.

[0038] The dielectric layer 111 can be formed by adding various ceramic additives, organic solvents, plasticizers, binders, dispersants, or the like to a powder such as a barium titanate (BaTiO3) powder, according to the intended use.

[0039] The ceramic body 110 can include an effective portion as a portion contributing to the capacitance of the capacitor, and upper and lower cover portions formed as upper and lower edge portions, respectively, on the upper and lower surfaces of the effective portion.

[0040] The effective portion can be formed by repeatedly stacking the plurality of first and second internal electrodes 121 and 122 with the dielectric layer 111 interposed therebetween.

[0041] The upper and lower cover portions can have the same material and configuration as those of the dielectric layer 111 except that the internal electrodes are not included therein.

[0042] That is, the upper and lower cover portions can include a ceramic material, such as a barium titanate (BaTiO3)-based ceramic material.

[0043] The upper and lower cover portions can be formed by stacking a single dielectric layer or two or more dielectric layers in the vertical direction on the upper and lower surfaces of the effective portion, respectively. The upper and lower cover portions can be substantially used to prevent damage to the internal electrodes due to physical or chemical stress.

[0044] A material for forming the first and second internal electrodes 121 and 122 is not particularly limited, but can be, for example, a conductive paste including at least one of silver (Ag), lead (Pd), platinum (Pt), nickel (Ni), and copper (Cu).

[0045] The multilayer ceramic capacitor according to an exemplary embodiment can include a first external electrode 131 electrically connected to the first internal electrode 121 and a second external electrode 132 electrically connected to the second internal electrode 122.

[0046] The first external electrode 131 and the second external electrode 132 can be electrically connected to the first internal electrode 121 and the second internal electrode 122, respectively, to generate capacitance, and the second external electrode 132 can be connected to a different potential from a potential of the first external electrode 131.

[0047] The first external electrode 131 and the second external electrode 132 can be disposed on a third surface S3 and a fourth surface S4 of the ceramic main body 110 in a second direction (length direction), respectively, and can extend to a first surface S1 and a second surface S2 in a first direction (thickness direction).

[0048] In addition, the first external electrode 131 and the second external electrode 132 can extend to a fifth surface S5 and a sixth surface S6 of the ceramic main body 110 in a third direction (width direction).

[0049] The first external electrode 131 and the second external electrode 132 can be formed of the same conductive material as that of the internal electrode, but are not limited thereto, and can be formed of, for example, Cu, Ag, Ni, or the like.

[0050] The first external electrode 131 and the second external electrode 132 can be formed by applying and firing a conductive paste prepared by adding a glass frit to a metal powder.

[0051] Based on Figure 3 When a shortest distance from both ends of the ceramic main body 110 in the second direction to end portions of the external electrodes 131 and 132 disposed on the first surface S1 and the second surface S2 of the ceramic main body is denoted by "A" and a longest distance is denoted by "BW", the multilayer ceramic capacitor according to an exemplary embodiment satisfies 0.9 ≤ A / BW < 1.0.

[0052] When a shortest distance from both ends of the ceramic main body 110 in the second direction to end portions of the external electrodes 131 and 132 disposed on the first surface S1 and the second surface S2 of the ceramic main body is denoted by "A" and a longest distance is denoted by "BW", by satisfying 0.9 ≤ A / BW < 1.0, the bending strength can be improved, thereby also improving reliability.

[0053] Although Figure 3 It is shown that both the external electrodes 131 and 132 satisfy the above relationship 0.9 ≤ A / BW < 1.0, but the embodiment is not limited thereto. In another example, when only one of the external electrodes 131 and 132 satisfies the above relationship, the effect of improving the bending strength and reliability can also be achieved.

[0054] Because the paste for the external electrode partially flows along the ceramic body 110 before being dried to form the external electrodes 131 and 132, resulting in the external electrodes having an uneven shape, the shortest distance A and the longest distance BW from both ends of the ceramic body 110 in the second direction to the ends of the external electrodes 131 and 132 disposed on the first and second surfaces S1 and S2 of the ceramic body can be generated.

[0055] The external electrodes can have various irregular (uneven) shapes. For example, as shown in FIG. 1A, the paste for the external electrode can flow in the length direction along the edge of the ceramic body 110. For example, the paste for the external electrode can flow along the edge of the ceramic body 110 toward the end of the ceramic body 110, thereby shortening the length of the paste for the external electrode on the edge of the ceramic body 110. Figure 3

[0056] The multilayer ceramic capacitor according to the exemplary embodiment is an electronic component, and in order to significantly improve the bending strength, when the shortest distance from both ends of the ceramic body 110 in the second direction to the ends of the external electrodes 131 and 132 disposed on the first and second surfaces S1 and S2 of the ceramic body 110 is denoted by "A" and the longest distance is denoted by "BW", the relational expression 0.9 ≤ A / BW < 1.0 can be satisfied.

[0057] When the ratio A / BW of the shortest distance A to the longest distance BW from both ends of the ceramic body 110 to the ends of the external electrodes 131 and 132 is less than 0.9, the surface area to which the bending stress is applied is reduced, thereby reducing the bending strength.

[0058] In addition, when the ratio A / BW is equal to 1.0, the external electrode can have a shape on which the external electrode paste does not flow, thereby maximizing the surface area to which the bending stress is applied and desirably improving the bending strength; however, this can not be easily achieved due to process characteristics.

[0059] The method according to the exemplary embodiment allowing the external electrode to have a uniform shape is not particularly limited. For example, an easily removable organic substance coating film can be used, and by controlling the external electrode to significantly reduce the formation of uneven regions, the external electrode can have a uniform shape.

[0060] The first and second external electrodes 131 and 132 can be formed by coating and then firing a conductive paste prepared by adding a glass frit to a metal powder.

[0061] The above-described method allows an easily removable organic substance coating film to be formed on the surface of the ceramic body 110 before the first and second external electrodes 131 and 132 are formed in the ceramic body 110.​

[0062] Then, the organic coating film on the portions of the ceramic body 110 where the first and second external electrodes 131 and 132 are to be formed is removed.

[0063] The conductive paste for the external electrodes is applied to the surface of the ceramic body 110 to form the first and second external electrodes 131 and 132.

[0064] Finally, the organic coating film is removed from the surface of the ceramic body 110 on which the first and second external electrodes 131 and 132 have been formed, thereby removing the portion of the conductive paste for the external electrodes that has flowed and adhered to the organic coating film.

[0065] The shortest distance A from both ends of the ceramic body 110 in the second direction to the ends of the external electrodes 131 and 132 disposed on the first and second surfaces S1 and S2 of the ceramic body 110 can be measured at the edge region of the ceramic body 110 in the third direction.

[0066] According to an exemplary embodiment, since the shape of the external electrodes 131 and 132 can have a shape in which the external electrodes 131 and 132 flow along the edges of the ceramic body 110 in the length direction, the shortest distance A from both ends of the ceramic body 110 in the second direction to the ends of the external electrodes 131 and 132 disposed on the first and second surfaces S1 and S2 of the ceramic body 110 can be measured at the edge region of the ceramic body 110 in the third direction.

[0067] In addition, the longest distance BW from both ends of the ceramic body 110 in the second direction to the ends of the external electrodes 131 and 132 disposed on the first and second surfaces S1 and S2 of the ceramic body 110 can be measured in the central region of the ceramic body 110 in the third direction.

[0068] As described above, since the shape of the external electrodes 131 and 132 can have a shape in which the external electrodes 131 and 132 flow along the edges of the ceramic body 110 in the length direction, the longest distance BW from both ends of the ceramic body 110 in the second direction to the ends of the external electrodes 131 and 132 disposed on the first and second surfaces S1 and S2 of the ceramic body 110 can be measured in the central region of the ceramic body 110 in the third direction.

[0069] According to an exemplary embodiment, the ratio BW / L of the longest distance BW from both ends of the ceramic body 110 in the second direction to the ends of the external electrodes 131 and 132 disposed on the first and second surfaces S1 and S2 of the ceramic body 110 to the length L of the ceramic body 110 can satisfy 0.2 ≤ BW / L ≤ 0.3.

[0070] By adjusting the ratio BW / L of the longest distance BW from both ends of the ceramic body 110 in the second direction to the ends of the outer electrodes 131 and 132 disposed on the first surface S1 and the second surface S2 of the ceramic body 110 to the length L of the ceramic body 110 to satisfy 0.2≤BW / L≤0.3, the bending strength can be improved while suppressing arc generation.

[0071] Although Figure 3 The case where both of the outer electrodes 131 and 132 satisfy the above-described relationship 0.2≤BW / L≤0.3 is shown, but the embodiment is not limited thereto. In another example, when only one of the outer electrodes 131 and 132 satisfies the above-described relationship, the effects of improving the bending strength and the reliability can also be achieved.

[0072] Arc generation refers to generation of an arc due to electric field concentration at a high voltage in the range of 1 KV to 5 KV when the outer electrodes are closely disposed to each other, which reduces the reliability of the multilayer ceramic electronic component.

[0073] According to the exemplary embodiment, the bending strength and the reliability can be improved by adjusting the ratio BW / L of the longest distance BW from both ends of the ceramic body 110 in the second direction to the ends of the outer electrodes 131 and 132 disposed on the first surface S1 and the second surface S2 of the ceramic body 110 to the length L of the ceramic body 110.

[0074] When the ratio BW / L of the longest distance BW from both ends of the ceramic body 110 in the second direction to the ends of the outer electrodes 131 and 132 disposed on the first surface S1 and the second surface S2 of the ceramic body 110 to the length L of the ceramic body 110 is greater than 0.3, an arc can be generated due to electric field concentration. When the ratio is less than 0.2, a plating solution can penetrate into the ceramic body, or the adhesion strength of the outer electrode can be reduced, thereby causing a reduction in the bending strength. In addition, the width of the ceramic body 110 is W.

[0075] An additional plating layer can be provided at the upper portions of the outer electrodes 131 and 132, and the plating layer can be in the form in which a nickel (Ni) plating layer and a tin (Sn) plating layer are arranged in order.

[0076] Figure 5 is Figure 4 An enlarged view of the "B" area of FIG. 1.

[0077] Based on Figure 5 With regard to the multilayer ceramic electronic component according to the exemplary embodiment, the thickness td of the dielectric layer 111 and the thickness te of the inner electrodes 121 and 122 can satisfy td>2×te.

[0078] That is, according to the exemplary embodiment, the thickness td of the dielectric layer 111 is greater than twice the thickness te of the inner electrodes 121 and 122.

[0079] Generally, high-voltage electronic components involve critical reliability problems according to a decrease in dielectric breakdown voltage in a high-voltage environment.

[0080] The thickness td of the dielectric layer 111 of the multilayer ceramic capacitor according to an exemplary embodiment is greater than twice the thickness te of the internal electrodes 121 and 122 to prevent a decrease in dielectric breakdown voltage in a high-voltage environment. This will obtain improved breakdown voltage characteristics by increasing the thickness of the dielectric layer, which is the distance between the internal electrodes.

[0081] When the thickness td of the dielectric layer 111 is less than or equal to twice the thickness te of the internal electrodes 121 and 122, the thickness of the dielectric layer 111, which is the distance between the internal electrodes 121 and 122, is thin, and the dielectric breakdown voltage can decrease.

[0082] The thickness te of the internal electrodes 121 and 122 is less than 1 µm, and the thickness td of the dielectric layer 111 is less than 2.8 µm, but is not limited thereto. The thickness td of the dielectric layer 111 can refer to the average thickness of the dielectric layer 111 disposed between the first internal electrode 121 and the second internal electrode 122. The thickness te of each of the internal electrodes 121 and 122 can refer to the average thickness of the internal electrodes 121 and 122.

[0083] Hereinafter, a method for manufacturing a multilayer ceramic capacitor according to an exemplary embodiment will be described, but is not limited thereto.

[0084] The method for manufacturing a multilayer ceramic capacitor according to an exemplary embodiment includes coating a slurry formed to include a powder such as a BaTiO3 powder, etc. onto a carrier film and drying the slurry to prepare a plurality of ceramic green sheets, thereby forming a dielectric layer.

[0085] The ceramic green sheet is manufactured by preparing a slurry by mixing a ceramic powder, a binder, and a solvent, and preparing the slurry into a sheet shape having a thickness of several micrometers (µm) using a doctor blade method.

[0086] The conductive paste for the internal electrode is prepared to include 40 to 50 parts by weight of nickel particles having an average particle diameter of 0.1 to 0.2 µm.

[0087] The conductive paste for the internal electrode is coated onto the ceramic green sheet using a screen printing method to form the internal electrode, and the ceramic green sheet on which the internal electrode pattern is disposed is stacked to form a ceramic body 110.

[0088] Subsequently, an external electrode including glass and at least one conductive metal selected from the group consisting of copper (Cu), silver (Ag), nickel (Ni), and alloys thereof can be formed on the outer side of the ceramic body.

[0089] Although the glass is not particularly limited, a material having the same components as those of a glass used to manufacture an external electrode of a general multilayer ceramic capacitor can be used.

[0090] The external electrodes formed on the upper and lower surfaces of the ceramic main body and at the end portions can be electrically connected to the first and second internal electrodes.

[0091] The electrode layer can include at least 5 vol% of a glass based on the electrically conductive metal.

[0092] To measure the frequency of occurrence of a bending crack, samples of the multilayer ceramic capacitor were mounted on a substrate, and the distance by which the central portion was bent under pressure was set to 6 mm, and 20 samples were measured and observed to see if the bending strength was guaranteed, respectively.

[0093] The multilayer ceramic capacitor was manufactured to have a 3225 size (length x width, 3.2 mm x 2.5 mm).

[0094] [Table 1]

[0095] Sample BW (mm) A (mm) A / BW 6mm bend strength defect count 1 0.75 0.72 0.96 0 / 20 2 0.75 0.71 0.95 0 / 20 3 0.75 0.70 0.93 0 / 20 4 0.75 0.69 0.92 0 / 20 5 0.75 0.68 0.91 0 / 20 *6 0.75 0.67 0.89 1 / 20 *7 0.75 0.66 0.88 1 / 20 *8 0.75 0.65 0.87 2 / 20 *9 0.75 0.63 0.84 4 / 20 *10 0.75 0.60 0.80 3 / 20 *11 0.75 0.57 0.76 5 / 20 *12 0.75 0.55 0.73 7 / 20 *13 0.75 0.50 0.67 7 / 20

[0096] * Comparative Example

[0097] Referring to Table 1 above, it can be understood that Samples 1 to 5 (the ratio A / BW of the shortest distance A from both ends of the ceramic main body 110 to the end portions of the external electrodes 131 and 132 to the longest distance BW satisfies the range of 0.9 ≤ A / BW < 1.0) satisfy the bending strength characteristics at a distance of 6 mm.

[0098] In contrast, Samples 6 to 13 (comparative examples, outside the range of the present disclosure) do not satisfy the bending strength characteristics at a distance of 6 mm.

[0099] As described above, the multilayer ceramic electronic assembly according to the exemplary embodiments can have improved bending strength and thus improved reliability by adjusting the ratio of the longest distance to the shortest distance from both ends of the ceramic main body to the end portions of the external electrodes.

[0100] While the exemplary embodiments have been shown and described above, it will be apparent to those skilled in the art that modifications and changes can be made without departing from the scope of the present disclosure defined by the appended claims.

Claims

1. A multilayer ceramic electronic component, comprising: A ceramic body includes a dielectric layer and a plurality of internal electrodes disposed opposite to each other, the dielectric layer being disposed between the plurality of internal electrodes disposed opposite to each other, and the ceramic body having a first surface and a second surface opposite to each other in a first direction, a third surface and a fourth surface connected to the first surface and the second surface and opposite to each other in a second direction, and a fifth surface and a sixth surface connected to the first surface to the fourth surface and opposite to each other in a third direction, and the length of the ceramic body in the second direction is greater than the length of the ceramic body in the third direction; as well as An external electrode is an inner electrode disposed on at least one of the third and fourth surfaces and connected to one of the plurality of inner electrodes, which is exposed from a corresponding surface of the third and fourth surfaces. The external electrode extends onto both the first and second surfaces of the ceramic body. The relation 0.9 ≤ A / BW < 1.0 is satisfied, where A represents the shortest distance in the second direction from the end of the ceramic body where the external electrode is disposed to the end of the external electrode disposed on at least one of the first and second surfaces of the ceramic body, and BW represents the longest distance in the second direction from the end of the ceramic body where the external electrode is disposed to the end of the external electrode disposed on at least one of the first and second surfaces of the ceramic body. Wherein, the ratio BW / L satisfies 0.2≤BW / L≤0.3, and L is the length of the ceramic body in the second direction.

2. The multilayer ceramic electronic component according to claim 1, wherein, The shortest distance A is measured at the edge region of the ceramic body in the third direction.

3. The multilayer ceramic electronic component according to claim 1, wherein, The longest distance BW is measured at the central region of the ceramic body in the third direction.

4. The multilayer ceramic electronic component according to claim 1, wherein, The multilayer ceramic electronic component has a length of 3.2 mm in the second direction and a width of 2.5 mm in the third direction.

5. The multilayer ceramic electronic component according to claim 1, wherein, The thickness te of at least one of the plurality of internal electrodes is less than 1 μm.

6. The multilayer ceramic electronic component according to claim 1, wherein, The thickness td of the dielectric layer is less than 2.8 μm.

7. The multilayer ceramic electronic component according to claim 6, wherein, The thickness td of the dielectric layer and the thickness te of at least one of the plurality of internal electrodes satisfy td > 2 × te.

8. A multilayer ceramic electronic component, comprising: A ceramic body includes a dielectric layer and a plurality of internal electrodes disposed opposite to each other, the dielectric layer being disposed between the plurality of internal electrodes disposed opposite to each other, and the ceramic body having a first surface and a second surface opposite to each other in a first direction, a third surface and a fourth surface connected to the first surface and the second surface and opposite to each other in a second direction, and a fifth surface and a sixth surface connected to the first surface to the fourth surface and opposite to each other in a third direction, and the length of the ceramic body in the second direction is greater than the length of the ceramic body in the third direction; as well as An external electrode is an inner electrode disposed on at least one of the third and fourth surfaces and connected to one of the plurality of inner electrodes, which is exposed from a corresponding surface of the third and fourth surfaces. The external electrode extends onto the first and second surfaces of the ceramic body, and The ratio BW / L satisfies 0.2 ≤ BW / L ≤ 0.3, where BW represents the longest distance in the second direction from the end of the ceramic body where the external electrode is disposed to the end of the external electrode disposed on at least one of the first surface and the second surface of the ceramic body, and L represents the length of the ceramic body in the second direction. The length of the central portion of the extension of the outer electrode on at least one of the first and second surfaces in the third direction in the second direction is greater than the length of the edge portion of the extension of the outer electrode on at least one of the first and second surfaces in the third direction in the second direction.

9. The multilayer ceramic electronic component according to claim 8, wherein, The longest distance BW is the length of the central portion of the extension of the outer electrode on one of the first and second surfaces in the third direction in the second direction.

10. The multilayer ceramic electronic component according to claim 8, wherein, The thickness te of at least one of the plurality of internal electrodes is less than 1 μm.

11. The multilayer ceramic electronic component according to claim 10, wherein, The thickness td of the dielectric layer is less than 2.8 μm.

12. The multilayer ceramic electronic component according to claim 11, wherein, The thickness td of the dielectric layer and the thickness te of at least one of the plurality of internal electrodes satisfy td > 2 × te.

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