Substrate, to-can assembly, and packaging method

Abstract

The application relates to the technical field of photoelectric communication, and provides a substrate, a TO-CAN assembly and a packaging method. The substrate is provided with a first conductive layer, the first conductive layer extends to the side surface of the substrate from the front surface of the substrate until the first conductive layer extends to the back surface of the substrate; a fourth conductive layer is arranged on a signal plate connected with the substrate, the fourth conductive layer and the first conductive layer are connected through a connecting agent to realize high-frequency signal line connection between the substrate and the signal plate. In the application, the high-frequency signal line connection is realized in the form of a dielectric transmission line. Compared with the prior art in which a row of parallel gold wires are used to realize high-frequency signal line connection, the process difficulty of the high-frequency signal line connection is reduced, the dependence on a gold wire bonding device is low, and the dielectric transmission line is used to realize the high-frequency signal line connection, so that the parasitic parameters in the high-frequency signal line are reduced.

Description

Technical Field

[0001] This invention relates to the field of optoelectronic communication technology, and provides a substrate, a TO-CAN component, and a packaging method. Background Technology

[0002] Currently in the field of optoelectronic communication, TO-CAN (TO-CAN, laser secondary body module) components of vertical coaxial lasers with coolers are generally packaged using TO-CAN packaging. TO-CAN packaging is a fully enclosed packaging, and it is widely used in optoelectronic device packaging due to its advantages such as simple manufacturing process, low production cost, and flexible use.

[0003] Currently, TO-CAN vertical packaging solutions (single-pillar / double-pillar) with coolers and lasers all use a row of parallel gold wires to connect the laser ceramic substrate and the TO (Transistor Outline) base signal board. In high-frequency signal lines, it is difficult to achieve ideal results in terms of the length, shape, and process consistency of the bonding wires, resulting in high process difficulty and a high dependence on gold wire bonding equipment. Moreover, under the existing bonding process, the close arrangement of parallel gold wires may cause individual gold wires to spring back, resulting in a large parasitic inductance value on the high-frequency signal lines. This leads to a large parasitic parameter in the high-frequency lines and the signal transmission quality is not very ideal.

[0004] Therefore, overcoming the shortcomings of the existing technology is an urgent problem to be solved in this technical field. Summary of the Invention

[0005] The technical problem to be solved by the present invention is to provide a substrate, a TO-CAN component and a packaging method, which solves the problems in the prior art that the process of bonding gold wires in high-frequency signal lines is difficult, the dependence on gold wire bonding equipment is high, and the parasitic parameters in high-frequency signal lines are large.

[0006] The present invention adopts the following technical solution:

[0007] In a first aspect, embodiments of the present invention provide a substrate, wherein a first conductive layer 11 is disposed on the substrate 1, the first conductive layer 11 extends along the front side of the substrate 1 toward the side side of the substrate 1 until the first conductive layer 11 extends to the back side of the substrate 1, and the first conductive layer 11 is used to realize the connection between high frequency signal lines.

[0008] Furthermore, a second conductive layer 12 and a third conductive layer 13 are also provided on the substrate 1, which are used to realize the connection between ordinary circuits.

[0009] In a second aspect, embodiments of the present invention provide a TO-CAN component, the TO-CAN component comprising: a signal board 2, a connecting block 3, and a substrate 1 as described in the first aspect, wherein:

[0010] The length of the substrate 1 is greater than the length of the connecting block 3. The substrate 1 is disposed on the connecting block 3, and both ends of the substrate 1 abut against the signal board 2.

[0011] The signal board 2 is provided with a fourth conductive layer 21, which is connected to the first conductive layer 11 by a connector to realize the high-frequency signal line connection between the substrate 1 and the signal board 2.

[0012] Furthermore, the signal board 2 is provided with a fifth conductive layer 22 and a sixth conductive layer 23. The fifth conductive layer 22 and the second conductive layer 12 are connected by gold wire bonding, and the sixth conductive layer 23 and the third conductive layer 13 are connected by gold wire bonding, so as to realize the ordinary circuit connection between the substrate 1 and the signal board 2.

[0013] Furthermore, the TO-CAN assembly also includes a TO base 4, on which a plurality of TO pins 41 are provided, wherein:

[0014] The connecting block 3 is disposed on the TO base 4, the signal board 2 is disposed on the TO base 4, and the signal board 2 is connected to the corresponding TO pin 41. The connecting block 3 is located between the two signal boards 2.

[0015] Furthermore, the TO-CAN assembly also includes a bracket 5, which is vertically mounted on the TO base 4. The signal board 2 is attached to the side of the bracket 5 and is located between the bracket 5 and the corresponding TO pin 41. The fourth conductive layer 21 and the TO pin 41 are connected by a connector.

[0016] Furthermore, the TO-CAN component also includes a laser chip 6, wherein:

[0017] The laser chip 6 is disposed on the substrate 1, and the laser chip 6 and the substrate 1 are connected by gold wire bonding.

[0018] The connecting block 3 is provided with a first surface 31, the first surface 31 and the fourth conductive layer 21 are located on the same plane, and the substrate 1 is disposed on the first surface 31.

[0019] Furthermore, the TO-CAN assembly also includes a cooler 7, a thermistor 8, an MPD transition block 91, and an MPD chip 92, wherein:

[0020] The cooler 7 is mounted on the TO base 4, the connecting block 3 is mounted on the cooler 7, and the cooler 7 and the two TO pins 41 are connected by gold wire bonding. The cooler 7 is used to dissipate heat for the TO-CAN assembly.

[0021] The connecting block 3 is also provided with a second surface 32, which is inclined to the first surface 31;

[0022] The thermistor 8 is disposed on the second surface 32, and the thermistor 8 and the cooler 7 are connected by gold wire bonding. The thermistor 8 is used to monitor the temperature of the TO-CAN component.

[0023] The MPD transition block 91 is disposed on the second surface 32, and the MPD chip 92 is disposed on the MPD transition block 91. The MPD chip 92 and the TO pin 41 are connected by gold wire bonding. The MPD chip 92 is used to monitor the working status of the laser chip 6.

[0024] Thirdly, embodiments of the present invention provide a packaging method for a TO-CAN component, applied to packaging the TO-CAN component as described in the second aspect, the packaging method comprising:

[0025] A connector is placed at a preset position on the connecting block 3 and the signal board 2;

[0026] The substrate 1 is placed on the connecting block 3, and the substrate 1 and the connecting block 3 are connected by a connector. The first conductive layer 11 and the fourth conductive layer 21 are also connected by a connector, thereby realizing the high-frequency signal line connection between the substrate 1 and the signal board 2.

[0027] Furthermore, the packaging method further includes:

[0028] The laser chip 6 is disposed on the substrate 1;

[0029] The cooler 7 is placed on the TO base 4, and the connecting block 3 is placed on the cooler 7;

[0030] The MPD transition block 91 and the thermistor 8 are placed on the connection block 3, and the MPD chip 92 is mounted on the MPD transition block 91.

[0031] Gold wire bonding connections are made between TO pin 41 and the cooler 7, the MPD chip 92, and the connecting block 3; gold wire bonding connections are also made between the laser chip 6 and the substrate 1, between the signal board 2 and the substrate 1, and between the cooler 7 and the thermistor 8.

[0032] In this embodiment of the invention, a first conductive layer 11 is disposed on the substrate 1. The first conductive layer 11 extends from the front side of the substrate 1 to the side side of the substrate 1 until it reaches the back side of the substrate 1. The first conductive layer 11 is used to realize high-frequency signal line connection, thereby avoiding the use of a row of parallel gold wires for high-frequency signal line connection. In this embodiment of the invention, high-frequency signal line connection is realized in the form of a dielectric transmission line. Compared with the prior art, which uses a row of parallel gold wires for high-frequency signal line connection, this reduces the process difficulty of high-frequency signal line connection, has a low dependence on gold wire bonding equipment, and reduces parasitic parameters in the high-frequency signal line by using a dielectric transmission line for high-frequency signal line connection. Attached Figure Description

[0033] To more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings used in the embodiments of the present invention will be briefly described below. Obviously, the drawings described below are merely some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without any creative effort.

[0034] Figure 1 This is a schematic diagram (front view) of a substrate provided in an embodiment of the present invention;

[0035] Figure 2 This is a schematic diagram (back side) of a substrate provided in an embodiment of the present invention;

[0036] Figure 3 This is a schematic diagram of another substrate structure provided in an embodiment of the present invention;

[0037] Figure 4 This is a schematic diagram of the first structure of a TO-CAN component provided in an embodiment of the present invention;

[0038] Figure 5 This is a schematic diagram of a second structure of a TO-CAN component provided in an embodiment of the present invention;

[0039] Figure 6 This is a schematic diagram showing the setting points of a portion of the connector on a TO-CAN assembly according to an embodiment of the present invention;

[0040] Figure 7 This is a schematic diagram of a third structure of a TO-CAN component provided in an embodiment of the present invention (without a substrate);

[0041] Figure 8 This is a schematic diagram of the fourth structure of a TO-CAN component provided in an embodiment of the present invention (with gold wire bonding completed);

[0042] Figure 9 This is a schematic diagram of a connection block for a TO-CAN component provided in an embodiment of the present invention;

[0043] Figure 10 This is a schematic diagram of the pin definition of a TO-CAN component provided in an embodiment of the present invention;

[0044] Figure 11 This is a schematic diagram illustrating the specific process of a TO-CAN component packaging method provided in an embodiment of the present invention.

[0045] The reference numerals in the attached drawings are as follows: substrate 1; first conductive layer 11; second conductive layer 12; third conductive layer 13; signal board 2; fourth conductive layer 21; fifth conductive layer 22; sixth conductive layer 23; connecting block 3; first surface 31; second surface 32; TO base 4; TO pin 41; first pin 411; second pin 412; third pin 413; fourth pin 414; fifth pin 415; sixth pin 416; bracket 5; laser chip 6; cooler 7; thermistor 8; MPD transition block 91; MPD chip 92; and connector point 10. Detailed Implementation

[0046] To make the objectives, technical solutions, and advantages of this invention clearer, the invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the invention.

[0047] In the description of this invention, the terms "inner", "outer", "longitudinal", "lateral", "upper", "lower", "top", "bottom", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and do not require that this invention must be constructed and operated in a specific orientation. Therefore, they should not be construed as limiting this invention.

[0048] Furthermore, the technical features involved in the various embodiments of the present invention described below can be combined with each other as long as they do not conflict with each other.

[0049] Example 1:

[0050] This embodiment 1 provides a substrate, combined with Figure 1 and Figure 2 A first conductive layer 11 is provided on the substrate 1. The first conductive layer 11 extends from the front side of the substrate 1 to the side side of the substrate 1 until it extends to the back side of the substrate 1. The first conductive layer 11 is used to realize the connection between high-frequency signal lines.

[0051] The first conductive layer 11 extends to a predetermined position on the back side of the substrate 1, so that the first conductive layer 11 can abut against other components that need to be connected, and the first conductive layer 11 does not intersect on the back side of the substrate 1. Figure 1 As shown, on the front side of the substrate 1, there is a dividing line between the two parts of the first conductive layer 11, and the two parts of the first conductive layer 11 are not directly connected. In the prior art, the first conductive layer 11 is only located on the front side of the substrate 1. In this case, multiple gold wires are required to connect the first conductive layer 11 to other components. However, it is difficult to achieve ideal results in terms of the length, shape, and process consistency of the bonding wires. Furthermore, under the existing bonding process, the close arrangement of gold wires may result in individual gold wires springing up, leading to a large parasitic inductance value on the high-frequency signal lines and a less than ideal signal transmission quality.

[0052] In this embodiment, since the first conductive layer 11 extends to the back side of the substrate 1, the substrate 1 can be directly connected to other components through the first conductive layer 11 to complete the connection between high-frequency signal lines in the form of a dielectric transmission line. After the connection is completed, the first conductive layer 11 serves as part of the high-frequency signal line to transmit high-frequency signals. This method greatly shortens the length of the gold wire in the high-frequency signal line, thereby reducing parasitic parameters and ensuring the transmission quality of high-frequency signals.

[0053] To enhance the heat dissipation capability of the substrate 1, in this embodiment, the substrate 1 is a ceramic substrate. Compared to other substrates, ceramic substrates have superior thermal conductivity and insulation properties, and excellent heat dissipation performance, allowing heat to be directly transferred from the circuitry through the ceramic substrate itself. Further, the substrate 1 is specifically an aluminum nitride ceramic substrate. The thermal conductivity of PCB (Printed Circuit Board) substrates varies depending on the material, but the thermal conductivity of a typical PCB substrate is less than 3 W, while the thermal conductivity of ceramic substrates ranges from 25 W to 230 W. Different ceramic media have different thermal conductivity; aluminum nitride ceramic substrates have a thermal conductivity above 170 W, alumina ceramic substrates have a thermal conductivity of around 25 W to 30 W, and silicon nitride ceramic substrates have a thermal conductivity of around 80 W to 90 W. The thermal conductivity of the aluminum nitride ceramic substrate is significantly higher than that of the alumina and silicon nitride ceramic substrates. In this embodiment, the first conductive layer 11 of the substrate 1 is used to transmit high-frequency signal lines. The substrate 1 is used to support components with large heat generation, so it should be made of materials with excellent thermal conductivity. Therefore, in this embodiment, the substrate 1 is selected as an aluminum nitride ceramic substrate. In optional embodiments, considering the different uses of the substrate 1, the substrate 1 can also be selected as an alumina ceramic substrate, a silicon nitride ceramic substrate, or other substrates.

[0054] In order to achieve the connection of ordinary circuits between the substrate 1 and other components, combined with Figure 3 The substrate 1 is further provided with a second conductive layer 12 and a third conductive layer 13, which are used to realize the connection between ordinary circuits.

[0055] The first conductive layer 11, the second conductive layer 12, and the third conductive layer 13 are independent of each other. The second conductive layer 12 is connected to other components by gold wire bonding, and the third conductive layer 13 is connected to other components by gold wire bonding. The ordinary circuit is used for impedance matching and is not used for signal transmission.

[0056] In an optional embodiment, both the second conductive layer 12 and the third conductive layer 13 extend from the front side of the substrate 1 to the side side of the substrate 1 and extend to the back side of the substrate 1. In this case, ordinary circuit connections between the substrate 1 and other components can be directly completed through the second conductive layer 12 and the third conductive layer 13.

[0057] In this embodiment, the first conductive layer 11, the second conductive layer 12, and the third conductive layer 13 are gold-plated layers.

[0058] In this embodiment of the invention, a first conductive layer 11 is disposed on the substrate 1. The first conductive layer 11 extends from the front side of the substrate 1 to the side side of the substrate 1 until it reaches the back side of the substrate 1. The first conductive layer 11 is used to realize high-frequency signal line connection, thereby avoiding the use of a row of parallel gold wires for high-frequency signal line connection. In this embodiment of the invention, high-frequency signal line connection is realized in the form of a dielectric transmission line. Compared with the prior art, which uses a row of parallel gold wires for high-frequency signal line connection, this reduces the process difficulty of high-frequency signal line connection, has a low dependence on gold wire bonding equipment, and reduces parasitic parameters in the high-frequency signal line by using a dielectric transmission line for high-frequency signal line connection.

[0059] Example 2:

[0060] Based on the substrate 1 described in Embodiment 1, this embodiment provides a TO-CAN (TO-CAN, laser secondary body module) assembly, combined with Figure 4 The TO-CAN component includes: a base plate 1, a signal board 2, and a connecting block 3 as described in Embodiment 1. The two signal boards 2 are disposed on both sides of the connecting block 3, and the base plate 1 is disposed on the connecting block 3.

[0061] The length of the substrate 1 is greater than the length of the connecting block 3. The substrate 1 is disposed on the connecting block 3, and both ends of the substrate 1 abut against the signal board 2. A fourth conductive layer 21 is disposed on the signal board 2. The fourth conductive layer 21 and the first conductive layer 11 are connected by a connector to realize the high-frequency signal line connection between the substrate 1 and the signal board 2.

[0062] The substrate 1 is mounted on the connecting block 3 using a connector. The central axis of the substrate 1 overlaps with the central axis of the connecting block 3. The left and right sides of the substrate 1 extend out of the connecting block 3 at equal lengths. The two portions of the substrate 1 extending out of the connecting block 3 correspond to different signal boards 2. A connector is positioned on the fourth conductive layer 21 of the signal board 2. The two sides of the substrate 1 are fixed to the signal board 2 using the connector. The fourth conductive layer 21 and the first conductive layer 11 on the back of the substrate 1 are connected by the connector to achieve a high-frequency signal line connection between the substrate 1 and the signal board 2. The fourth conductive layer 21 and the first conductive layer 11, as part of the high-frequency signal line, are used to transmit high-frequency signals.

[0063] In this embodiment, since the first conductive layer 11 on the substrate 1 extends to the back side of the substrate 1, the first conductive layer 11 and the fourth conductive layer 21 can be directly connected by a bonding agent, thereby achieving the purpose of connecting high-frequency signal lines through a dielectric transmission line. Compared with the prior art of using gold wire to connect high-frequency signal lines, dielectric transmission lines have the advantages of low reflection, low loss and high reliability in high-frequency signal lines. Moreover, it can avoid the problem that the parasitic inductance parameter on the high-frequency signal line is large and the signal transmission quality is not ideal because the shape of the bonding wire does not meet the standard value due to the gold wire bonding process.

[0064] To achieve connection to ordinary lines, combined with Figure 5 In this embodiment, the signal board 2 is provided with a fifth conductive layer 22 and a sixth conductive layer 23. The fifth conductive layer 22 and the second conductive layer 12 are connected by gold wire bonding, and the sixth conductive layer 23 and the third conductive layer 13 are connected by gold wire bonding, so as to realize the ordinary circuit connection between the substrate 1 and the signal board 2.

[0065] The fourth conductive layer 21, the fifth conductive layer 22, and the sixth conductive layer 23 are independent of each other; the ordinary circuit is used for impedance matching and is not used for signal transmission.

[0066] In an optional embodiment, the second conductive layer 12 and the third conductive layer 13 of the substrate 1 both extend from the front side of the substrate 1 to the side side of the substrate 1 and extend to the back side of the substrate 1. In this case, the connection between the fifth conductive layer 22 and the second conductive layer 12, and between the sixth conductive layer 23 and the third conductive layer 13 can be completed by a connector. However, from a technical perspective, this method is generally not used to connect the ordinary lines, because the ordinary lines are used for impedance matching and not for signal transmission. Using a dielectric transmission line to complete the connection of the ordinary lines is not very meaningful. Furthermore, since the areas of the second conductive layer 12 and the third conductive layer 13 are small, the contact surfaces between the second conductive layer 12, the third conductive layer 13 and the fifth conductive layer 22, and the sixth conductive layer 23 are small, making it inconvenient to apply a connector on the contact surface. After the connection is completed with a connector, the second conductive layer 12, the third conductive layer 13, the fifth conductive layer 22 and the sixth conductive layer 23 may connect to the first conductive layer 11 or the fourth conductive layer 21, which will affect the transmission of high-speed signals and may even cause a short circuit. Therefore, gold wire is generally used to connect the fifth conductive layer 22 and the sixth conductive layer 23, as well as the fifth conductive layer 22 and the second conductive layer 12.

[0067] To ensure stable transmission of high-speed signals via the high-speed signal connection line, in this embodiment, the fourth conductive layer 21, the fifth conductive layer 22, and the sixth conductive layer 23 are gold-plated layers, and the signal board 2 is made of ceramic. In an optional embodiment, the fourth conductive layer 21, the fifth conductive layer 22, and the sixth conductive layer 23 are tin-plated layers or silver-plated layers, etc. Compared to other materials, gold plating has advantages such as high stability, resistance to oxidation, high reliability, good conductivity, and low contact resistance, making it more suitable for use as a high-frequency signal connection line.

[0068] In order to achieve the connection between the substrate 1 and the connecting block 3, and between the substrate 1 and the signal board 2 using the connecting agent, in this embodiment, the connecting agent is a sintered pre-placed solder, solder paste, or a highly conductive and thermally conductive adhesive. The positions of the connecting agent points 10 are as follows: Figure 6 As shown, the connector points 10 set at preset positions on the connector block 3 are used to set the connector to connect the connector block 3 and the substrate 1; the connector points 10 set on the signal board 2 are used to set the connector to connect the substrate 1 and the signal board 2; when the substrate 1 and the signal board 2 are connected using solder or solder paste, the connection process is eutectic bonding; when the substrate 1 and the signal board 2 are connected using highly conductive and thermally conductive adhesive, the connection process is adhesive bonding.

[0069] In this embodiment, in order for the TO-CAN component to transmit signals to the outside, in combination Figure 7 and Figure 8 The TO-CAN component also includes a TO (Transistor Outline) base 4, on which a plurality of TO pins 41 are provided. The connecting block 3 is disposed on the TO base 4; the signal board 2 is disposed on the TO base 4, and the signal board 2 is connected to the corresponding TO pin 41, and the connecting block 3 is located between two signal boards 2.

[0070] The TO pin 41 is connected to the internal components of the TO-CAN assembly, and the TO pin 41 is used to connect to external components to transmit signals between the external components and the internal components of the TO-CAN assembly.

[0071] In order to provide support for the signal board 2, combined with Figure 7 and Figure 8 The TO-CAN assembly also includes a bracket 5, which is vertically mounted on the TO base 4. The signal board 2 is attached to the side of the bracket 5 and is located between the bracket 5 and the corresponding TO pin 41. The fourth conductive layer 21 and the TO pin 41 are connected by a connector.

[0072] The system comprises two brackets 5 symmetrically arranged on the TO base 4. The height of each bracket 5 is approximately equal to the height of the signal board 2, facilitating the attachment of the signal board 2 to the bracket 5 along its height. The gap between each bracket 5 and its corresponding TO pin 41 is the same size as the width of the signal board 2, and the signal board 2 is accommodated within the gap to facilitate connection between each signal board 2 and its corresponding TO pin 41. When the signal board 2 is accommodated within the cavity, its fourth conductive layer 21 abuts against the corresponding TO pin 41. To strengthen the connection between the fourth conductive layer 21 and the corresponding TO pin 41, a bonding agent is used to connect them. This bonding agent can be gold-tin solder. The fourth conductive layer 21 and the TO pin 41 are eutectic bonded using the bonding agent to achieve a stable electrical connection between them. The bracket 5 also serves to position the various components inside the TO-CAN assembly, and the connecting block 3 is located between the two brackets 5.

[0073] To facilitate the mounting of components on the connecting block 3, in this embodiment, combined with Figure 5 and Figure 9The connecting block 3 is provided with a first surface 31, the first surface 31 and the fourth conductive layer 21 are located on the same plane, the substrate 1 is disposed on the first surface 31, and the connecting block 3 is also provided with a second surface 32, the second surface 32 being inclined to the first surface 31.

[0074] The first surface 31 is a vertical plane, and its shape is consistent with the shape of the back side of the substrate 1. The first surface 31 is flush with the fourth conductive layer 21 so that when the substrate 1 is placed on the first surface 31, the two sides of the substrate 1 protruding from the connecting block 3 can correspond to the fourth conductive layer 21. The first surface 31 is also used to provide a bonding agent so that the substrate 1 can be fixed on the first surface 31.

[0075] In an optional embodiment, the first surface 31 and the fourth conductive layer 21 may not be flush. The fourth conductive layer 21 may protrude from the first surface 31 or be recessed into the first surface 31. In this case, the shape of the substrate 1 should be adjusted accordingly. For example, the two parts of the substrate 1 that protrude from the connecting block 3 should be thicker or thinner than the part of the substrate 1 disposed on the connecting block 3, so that the shape of the substrate 1 is adapted to the connecting block 3 and the signal board 2.

[0076] In order for the TO-CAN component to emit optical signals, combined with Figure 8 The TO-CAN assembly further includes a laser chip 6, which is disposed on the substrate 1 and connected to the substrate 1 by gold wire bonding. Specifically, the laser chip 6 is positioned at a predetermined location on the substrate 1 and is connected to the first conductive layer 11 by gold wire.

[0077] In order to cool the TO-CAN component, combined with Figure 8 The TO-CAN assembly also includes a cooler 7 and a thermistor 8. The cooler 7 is disposed on the TO base 4, and the connecting block 3 is disposed on the cooler 7. The cooler 7 and the two TO pins 41 are connected by gold wire bonding. The cooler 7 is used to dissipate heat from the TO-CAN assembly. The thermistor 8 is disposed on the second surface 32, and the thermistor 8 and the cooler 7 are connected by gold wire bonding. The thermistor 8 is used to monitor the temperature of the TO-CAN assembly.

[0078] The cooler 7 is an ETC (Thermo Electric Cooler), located between the bracket 5 and the TO pin 41. The connecting block 3 is mounted on the cooler 7, and the substrate 1 with the laser chip 6 is also mounted on the cooler 7 to dissipate heat from the substrate 1 and the laser chip 6. A thermistor 8 is mounted on the connecting block 3 to monitor the temperature at that location. The thermistor 8 can work with the cooler 7 to regulate the temperature of the TO-CAN component. When the thermistor 8 detects an excessively high temperature, it can increase the power of the cooler 7; when the thermistor 8 detects a temperature drop to a normal level, it can decrease the power of the cooler 7.

[0079] In order to monitor the operation of the laser chip 6, combined with Figure 8 The TO-CAN component further includes an MPD transition block 91 (Monitor Photo Detector) and an MPD chip 92. The MPD transition block 91 is disposed on the second surface 32, and the MPD chip 92 is disposed on the MPD transition block 91. The MPD chip 92 and the TO pin 41 are connected by gold wire bonding. The MPD chip 92 is used to monitor the operating status of the laser chip 6.

[0080] The MPD transition block 91 is used to adjust the height and position of the MPD chip 92, enabling the MPD chip 92 to receive the backlight emitted by the laser chip 6. The angle between the second surface 32 and the first surface 31 is an obtuse angle, which is significant because it ensures that the MPD chip 92 and the laser chip 6 form a certain angle, allowing the MPD chip 92 to receive more backlight emitted by the laser chip 6, thus facilitating better monitoring of the laser chip 6's operating status. In an optional embodiment, the angle between the second surface 32 and the first surface 31 may not be obtuse. In this case, the upper surface of the MPD transition block 91 should be tilted, ensuring that the MPD chip 92 and the laser chip 6 form a certain angle.

[0081] In this embodiment, combined with Figure 10The TO pin 41 includes a first pin 411, a second pin 412, a third pin 413, a fourth pin 414, a fifth pin 415, and a sixth pin 416. The first pin 411 and the sixth pin 416 are respectively connected to the corresponding signal board 2. The second pin 412 is connected to the MPD chip 92 through a gold wire. The third pin 413 and the fourth pin 414 are connected to the cooler 7 through a gold wire. The fifth pin 415 is connected to the thermistor 8 through a gold wire, so as to facilitate signal transmission between the components in the TO-CAN and external components through the TO pin 41.

[0082] To enhance the heat dissipation capability of the TO-CAN component, in this embodiment, the connecting block 3 is a tungsten copper block. The tungsten copper block is resistant to high temperature, has high strength and good thermal conductivity, and can effectively transfer heat between the substrate 1 and the cooler 7.

[0083] In order to protect the components mounted on the TO base 4, and to make the TO-CAN assembly appear as a single unit, the TO-CAN assembly also includes a TO cap, which is mounted on the TO base 4. The TO cap contains components such as the connecting block 3, the substrate 1, the signal board 2, the cooler 7, the thermistor 8, and the MPD chip 92.

[0084] In this embodiment, the first conductive layer 11 and the fourth conductive layer 21 are connected to a high-frequency signal line through a bonding agent. The high-frequency signal line connection is achieved in the form of a dielectric transmission line. Compared with the prior art, which uses a row of parallel gold wires to connect high-frequency signal lines, the process difficulty of high-frequency signal line connection is reduced. Since the row of parallel gold wires is reduced, the dependence on gold wire bonding equipment during the connection process is reduced. Furthermore, the use of a dielectric transmission line to achieve high-frequency signal line connection reduces parasitic parameters in the high-frequency signal line.

[0085] Example 3:

[0086] This embodiment provides a packaging method for a TO-CAN component, applied to packaging the TO-CAN component as described in Embodiment 2. The packaging method includes:

[0087] A connector is applied at a predetermined position on the connecting block 3 and the signal board 2; the first conductive layer 11 and the fourth conductive layer 21 are connected by the connector to realize the high-frequency signal line connection between the substrate 1 and the signal board 2.

[0088] The substrate 1 has a pre-drilled mounting position for the laser chip 6, and the laser chip 6 is already positioned in the mounting position before using the substrate 1. The substrate 1 and the signal board 2 are connected by a bonding agent. The bonding agent is a sintered pre-placed solder, solder paste, or a highly conductive and thermally conductive adhesive. When solder or solder paste is used to connect the substrate 1 and the signal board 2, the connection process is eutectic bonding; when highly conductive and thermally conductive adhesive is used to connect the substrate 1 and the signal board 2, the connection process is adhesive bonding.

[0089] To complete the encapsulation of the TO-CAN component, the encapsulation method further includes:

[0090] Step 101: Place the cooler 7 on the TO base 4 and place the connecting block 3 on the cooler 7.

[0091] Wherein, the connecting block 3 is a tungsten copper block, and the cooler 7 is a semiconductor cooler; the laser chip 6 is disposed on the substrate 1, the substrate 1 is disposed on the connecting block 3, and the connecting block 3 is disposed on the cooler 7, so as to dissipate heat from the substrate 1 and the laser chip 6 through the cooler 7, and the connecting block 3 is used to transfer heat between the substrate 1 and the cooler 7.

[0092] Step 102: Place the MPD transition block 91 and the thermistor 8 onto the connection block 3, and mount the MPD chip 92 onto the MPD transition block 91.

[0093] The MPD transition block 91 is used to adjust the height and position of the MPD chip 92 so that the MPD chip 92 can receive the backlight emitted by the laser chip 6; there is a certain angle between the MPD chip 92 and the laser chip 6 so that the MPD chip 92 can receive more of the backlight from the laser chip 6, so that the MPD chip 92 can better monitor the laser chip 6.

[0094] Step 103: Perform gold wire bonding connections between TO pin 41 and the cooler 7, the MPD chip 92, and the connecting block 3; perform gold wire bonding connections between the laser chip 6 and the substrate 1, between the signal board 2 and the substrate 1, and between the cooler 7 and the thermistor 8.

[0095] Among them, the TO pin 41 includes a first pin 411, a second pin 412, a third pin 413, a fourth pin 414, a fifth pin 415 and a sixth pin 416. Among them, the first pin 411 and the sixth pin 416 are respectively connected to the corresponding signal board 2, the second pin 412 is connected to the MPD chip 92 through a gold wire, the third pin 413 and the fourth pin 414 are connected to the cooler 7 through a gold wire, and the fifth pin 415 is connected to the thermistor 8 through a gold wire, so as to complete the signal transmission between each component inside the TO-CAN and external components through the TO pin 41.

[0096] In this embodiment, the TO pin 41 and the bracket 5 have been pre-set on the TO base 4. The packaging method of the TO-CAN component is compatible with the existing TO component packaging method, so that the packaging cost of the TO-CAN component is relatively low.

[0097] In this embodiment, the first conductive layer 11 and the fourth conductive layer 21 are connected by a connecting agent to realize the connection of high-frequency signal lines, and the connection of high-frequency signal lines is realized in the form of a dielectric transmission line. Compared with the prior art in which a row of parallel gold wires is used for the connection of high-frequency signal lines, the process difficulty of the connection of high-frequency signal lines is reduced. Since a row of parallel gold wires is reduced, the dependence on gold wire bonding equipment during the connection process is low, and the connection of high-frequency signal lines is realized in the form of a dielectric transmission line, reducing the parasitic parameters in the high-frequency signal lines.

[0098] The above are only the preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent replacements, and improvements made within the spirit and principle of the present invention shall be included within the protection scope of the present invention.

Claims

1. A TO-CAN component, characterized in that, The TO-CAN assembly includes: a base plate (1), two signal boards (2), and a connecting block (3), wherein: A first conductive layer (11) is provided on the substrate (1). The first conductive layer (11) extends from the front side of the substrate (1) to the side side of the substrate (1) until the first conductive layer (11) extends to the back side of the substrate (1). The first conductive layer (11) is used to realize the connection between high frequency signal lines. The length of the substrate (1) is greater than the length of the connecting block (3). The substrate (1) is disposed on the connecting block (3). The two parts of the substrate (1) extending out of the connecting block (3) correspond to different signal boards (2) respectively, and the two ends of the substrate (1) abut against the signal board (2). The signal board (2) is provided with a fourth conductive layer (21), and a connector is provided at a corresponding position on the fourth conductive layer (21). The fourth conductive layer (21) and the first conductive layer (11) are connected by the connector, and the connection process is eutectic bonding; so as to realize the high-frequency signal line connection between the substrate (1) and the signal board (2).

2. The TO-CAN component according to claim 1, characterized in that, The signal board (2) is provided with a fifth conductive layer (22) and a sixth conductive layer (23). The fifth conductive layer (22) and the second conductive layer (12) on the substrate (1) are connected by gold wire bonding. The sixth conductive layer (23) and the third conductive layer (13) on the substrate (1) are connected by gold wire bonding to realize the ordinary circuit connection between the substrate (1) and the signal board (2).

3. The TO-CAN component according to claim 1, characterized in that, The TO-CAN assembly also includes a TO base (4), on which a plurality of TO pins (41) are provided, wherein: The connecting block (3) is disposed on the TO base (4); the signal board (2) is disposed on the TO base (4), and the signal board (2) is connected to the corresponding TO pin (41), and the connecting block (3) is located between the two signal boards (2).

4. The TO-CAN assembly according to claim 3, characterized in that, The TO-CAN assembly also includes a bracket (5), which is vertically mounted on the TO base (4). The signal board (2) is attached to the side of the bracket (5). The signal board (2) is located between the bracket (5) and the corresponding TO pin (41). The fourth conductive layer (21) and the TO pin (41) are connected by a connector.

5. The TO-CAN assembly according to claim 3, characterized in that, The TO-CAN component also includes a laser chip (6), wherein: The laser chip (6) is disposed on the substrate (1), and the laser chip (6) and the first conductive layer (11) are connected by gold wire bonding. The connecting block (3) is provided with a first surface (31), the first surface (31) and the fourth conductive layer (21) are located on the same plane, and the substrate (1) is disposed on the first surface (31).

6. The TO-CAN assembly according to claim 5, characterized in that, The TO-CAN assembly also includes a cooler (7), a thermistor (8), an MPD transition block (91), and an MPD chip (92), wherein: The cooler (7) is disposed on the TO base (4), the connecting block (3) is disposed on the cooler (7), and the cooler (7) and the two TO pins (41) are connected by gold wire bonding. The cooler (7) is used to dissipate heat for the TO-CAN assembly. The connecting block (3) is also provided with a second surface (32), which is inclined to the first surface (31); The thermistor (8) is disposed on the second surface (32), and the thermistor (8) and the cooler (7) are connected by gold wire bonding. The thermistor (8) is used to monitor the temperature of the TO-CAN component. The MPD transition block (91) is disposed on the second surface (32), the MPD chip (92) is disposed on the MPD transition block (91), the MPD chip (92) and the TO pin (41) are connected by gold wire bonding, and the MPD chip (92) is used to monitor the working status of the laser chip (6).

7. A method for packaging a TO-CAN component, used to package the TO-CAN component according to any one of claims 1 to 6, characterized in that, The encapsulation method includes: A connector is placed at a preset position on the signal board (2) and the connecting block (3); The substrate (1) is placed on the connecting block (3), and the first conductive layer (11) and the fourth conductive layer (21) are connected by a connector to realize the high-frequency signal line connection between the substrate (1) and the signal board (2).

8. The packaging method for the TO-CAN component according to claim 7, characterized in that, The encapsulation method further includes: The cooler (7) is placed on the TO base (4), and the connecting block (3) is placed on the cooler (7); The MPD transition block (91) and the thermistor (8) are placed on the connection block (3), and the MPD chip (92) is mounted on the MPD transition block (91). Gold wire bonding is performed between the TO pin (41) and the cooler (7), the MPD chip (92), and the connecting block (3), and gold wire bonding is performed between the signal board (2) and the substrate (1), and between the cooler (7) and the thermistor (8).

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