A heater assembly and a chemical vapor deposition apparatus

Abstract

The present invention discloses a heater assembly and a chemical vapor deposition device. The heater assembly is used to heat a wafer tray in the chemical vapor deposition device and includes: a heating component that can heat the wafer tray when an electric current flows through its interior; the heating component includes a plurality of heating arc segments; a plurality of support assemblies, each support assembly includes at least one support rod for supporting adjacent heating arc segments; a flexible component connected to the end of the support rod away from the heating arc segment for controlling the displacement and deformation direction of the heating arc segment; and a conduction component electrically connected to adjacent heating arc segments and / or to the support rods for enabling the electric current to flow between adjacent heating arc segments. The present invention can enable the electric current to flow between adjacent heating arc segments along the conduction component, so that the electric current flowing through the flexible component is small or even zero, thereby effectively reducing the temperature of the flexible component and its thermal creep, and thus reducing the deformation and displacement of the heating arc segments.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor manufacturing, and particularly to a heater assembly and a chemical vapor deposition (CVD) device. Background Art

[0002] In the chemical vapor deposition (CVD) process, a heater heats a wafer tray placed above it to heat the wafers in the wafer tray, so that the temperature of the wafers can reach a set process temperature, enabling a film to be deposited on the wafer surface under the action of process gases.

[0003] Since materials such as tungsten and rhenium used as heating components are difficult to directly process into an integrally formed circular ring-shaped heating component, it is not only difficult to find tungsten-rhenium alloy plates that meet the processing requirements but also causes material waste. Usually, several heating arc segments cut from a whole tungsten or rhenium plate are used to form the heating component. Therefore, adjacent heating arc segments need to be supported by support components and provided with a current conduction path. To provide space and flexibility for the thermal expansion and deformation of the heating component and guide the heating component to expand and deform in the desired direction during design, a flexible component is also provided on the support component, and the flexible components of adjacent heating components are also connected and fixed through connecting components; the main elastic deformation direction of the flexible component is the radial direction, so that the heating component mainly undergoes displacement and deformation in the radial direction during thermal expansion.

[0004] During the process of heating the wafer tray, the temperature of the heating component is as high as 2000°C - 2200°C, and the heating current flows between adjacent heating arc segments along the support component, the flexible component, and the connecting component. As a result, the support component, the flexible component, and the connecting component are not only affected by the heat conduction of the heating component but also heated by their own currents, and their temperatures can reach about 1000°C, which is higher than the high-temperature creep temperature of their materials. Among them, the flexible component is the main deformation component, and its creep is the most obvious; when the flexible component undergoes creep, the heating component will be affected by the deformation of the flexible component and undergo deformation and displacement during the cooling and spring-back process, resulting in the heating component being unable to return to its original position. After the heating component undergoes deformation and displacement, the shape and displacement after reheating are different from the initial state, ultimately leading to a change in the temperature field, affecting the process result and the yield rate of wafers. Therefore, it is necessary to modify or adjust the structure of the heater. Summary of the Invention

[0005] The purpose of the present invention is to provide a heater assembly and a chemical vapor deposition (CVD) device, which can enable the current to flow between adjacent heating arc segments along the conduction component, so that the current flowing through the flexible component is small or even zero, thereby effectively reducing the temperature of the flexible component and reducing its thermal creep.

[0006] To achieve the above purpose, the present invention is realized through the following technical solutions:

[0007] A heater assembly for heating a wafer tray in a chemical vapor deposition apparatus, comprising:

[0008] A heating component that can heat the wafer tray when an electric current flows through it; the heating component includes a plurality of heating arc segments;

[0009] A plurality of support assemblies, each support assembly includes at least one support rod for supporting adjacent heating arc segments; a flexible component connected to one end of the support rod away from the heating arc segment for controlling the displacement and deformation direction of the heating arc segment;

[0010] A conduction component electrically connected to adjacent heating arc segments and / or to the support rod for enabling an electric current to flow between adjacent heating arc segments.

[0011] Preferably, each support assembly further includes: a connection component connected to the flexible component in the same support assembly for restricting the displacement of the flexible component along the circumferential direction of the heating component.

[0012] Preferably, the number of support rods in each support assembly is 1; the conduction component is a first conduction component, and the first conduction component is fixedly connected to the support rod and the adjacent heating arc segment respectively.

[0013] Preferably, the resistance of the first conduction component is less than the sum of the resistances of the support rod, the flexible component, and the connection component in the same support assembly.

[0014] Preferably, the number of flexible components in each support assembly is 2, and the two flexible components are fixedly connected to the two side surfaces of one end of the support rod away from the heating arc segment in the same support assembly, and the two flexible components are arranged oppositely.

[0015] Preferably, each support assembly includes 2 support rods; and each support rod is fixedly connected to adjacent heating arc segments.

[0016] Preferably, the conduction component is a second conduction component, and the second conduction component is fixedly connected to adjacent heating arc segments.

[0017] Preferably, the resistance of the second conduction component is less than the sum of the resistances of the support rod, the flexible component, and the connection component in the same support assembly.

[0018] Preferably, the conduction component is a third conduction component, and the third conduction component is fixedly connected to all the support rods in the same support assembly.

[0019] Preferably, the resistance of the third conduction component is less than the sum of the resistances of the flexible component and the connection component in the same support assembly.

[0020] Preferably, the conduction component is a fourth conduction component, and the fourth conduction component is fixedly connected to all the support rods and the adjacent heating arc segments in the same support assembly respectively.

[0021] Preferably, the resistance of the fourth conduction component is less than the sum of the resistances of the support rod, the flexible component and the connection component in the same support assembly.

[0022] Preferably, the number of the flexible components is the same as that of the support rods in each support assembly; each flexible component is fixedly connected to one end of a support rod away from the heating arc segment in the same support assembly, and all the flexible components are arranged oppositely.

[0023] Preferably, the heater assembly further includes: a plurality of isolation components; each isolation component is correspondingly arranged between the support rod and the flexible component to insulate the support rod and the flexible component.

[0024] Preferably, the heating arc segments are arranged at intervals along the circumferential direction of the circle.

[0025] Preferably, the flexible component is one or any combination of a U-shaped spring and a leaf spring.

[0026] Preferably, the materials of the conduction component, the support rod, the flexible component and the connection component are one or any combination of tungsten, molybdenum, rhenium or their alloys.

[0027] On the other hand, the present invention also provides a vapor deposition device, including: a vapor deposition reaction chamber and the heater assembly as described above; and the heater assembly is arranged in the vapor deposition reaction chamber.

[0028] The present invention has at least one of the following advantages compared with the prior art:

[0029] In the heater assembly and the vapor deposition device provided by the present invention, the heating component can be composed of a plurality of heating arc segments, the support rods in the support assembly can support the adjacent heating arc segments, and the flexible component can control the deformation and displacement of the heating arc segments along the radial direction of the heating component.

[0030] In the present invention, current can flow between adjacent heating arc segments along the conduction component, or can also flow between adjacent heating arc segments along the support rod, flexible component, and connection component in the same support assembly. Since the resistance of the path where the conduction component is located is smaller than the resistance of the path where the flexible component is located, the current flowing through the conduction component is larger, and the current flowing through the flexible component is smaller, such that the heat generated by the current on the flexible component is smaller, which can effectively reduce the temperature of the flexible component, reduce its thermal creep, and thus reduce the deformation and displacement of the heating arc segment.

[0031] In the present invention, by providing an isolation component, insulation can be achieved between the support rod and the flexible component, so that current cannot flow from the support rod to the flexible component, and further current cannot flow between adjacent heating arc segments along the support rod, flexible component, and connection component in the same support assembly, in order to reduce the temperature of the flexible component. At the same time, the isolation component can also reduce the heat conduction rate between the support rod and the flexible component, thereby further reducing the temperature of the flexible component. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] Figure 1 Schematic structural diagram of a heater assembly provided in Embodiment 1 of the present invention;

[0033] Figure 2 Schematic structural diagram of a heater assembly provided in Embodiment 2 of the present invention;

[0034] Figure 3 Schematic structural diagram of a heater assembly provided in Embodiment 3 of the present invention. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0035] The following further elaborates in detail on a heater assembly and a chemical vapor deposition device proposed by the present invention in conjunction with the accompanying drawings and specific embodiments. According to the following description, the advantages and features of the present invention will be clearer. It should be noted that the accompanying drawings are in a very simplified form and all use non-precise scales, only for conveniently and clearly assisting in explaining the purpose of the embodiments of the present invention. In order to make the purpose, features, and advantages of the present invention more obvious and understandable, please refer to the accompanying drawings. It should be known that the structures, scales, sizes, etc. shown in the drawings of this specification are only used to cooperate with the content disclosed in the specification for those skilled in this technology to understand and read, and are not used to limit the limiting conditions for the implementation of the present invention. Therefore, they do not have technical essential meanings. Any modification of the structure, change of the proportional relationship, or adjustment of the size, without affecting the effects that the present invention can produce and the purposes that can be achieved, should still fall within the scope covered by the technical content disclosed by the present invention.

[0036] It should be noted that in this text, relational terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the terms "comprising", "including" or any other variant thereof are intended to cover non-exclusive inclusion, such that a process, method, article or device comprising a series of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article or device. Without further limitation, an element defined by the statement "comprising an..." does not exclude the presence of additional identical elements in the process, method, article or device comprising the element.

[0037] Embodiment 1

[0038] Combined with the attached Figure 1 As shown, this embodiment provides a heater assembly for heating a wafer tray 100 in a chemical vapor deposition apparatus, comprising: a heating component 110 that can heat the wafer tray 100 when an electric current flows through its interior; the heating component 110 includes a plurality of heating arc segments 111; a plurality of support assemblies 120, each support assembly 120 includes at least one support rod 121 for supporting adjacent heating arc segments 111; a flexible component 122 connected to an end of the support rod 121 away from the heating arc segment 111 for controlling the displacement and deformation direction of the heating arc segment 111; a conduction component 131 electrically connected to adjacent heating arc segments 111 and / or to the support rod 121 for enabling an electric current to flow between adjacent heating arc segments 111.

[0039] Please continue to refer to Figure 1 , the heating arc segments 111 are arranged at intervals along the circumferential direction of the circumference.

[0040] Specifically, in this embodiment, the overall shape of the heating component 110 is circular, corresponding to the shape of the wafer tray 100, so as to be able to uniformly heat the wafer tray 100, thereby uniformly heating the wafers in the wafer tray 100. The heating component 110 is usually prepared from high-temperature resistant materials (such as tungsten, molybdenum, rhenium or their alloys, etc.); taking the preparation of a tungsten-rhenium alloy material as an example, if directly processed into an integrated circular heating component, it is not only difficult to find a tungsten-rhenium alloy plate that meets the processing requirements, but also causes waste of materials. Therefore, the heating component 110 is usually composed of a plurality of heating arc segments 111 cut from the same tungsten-rhenium alloy plate, so as to reduce the processing difficulty of the heating component 110 and improve the utilization rate of the preparation materials, but the present invention is not limited thereto.

[0041] Please continue to refer toFigure 1 , the number of the support rods 121 in each of the support assemblies 120 is 1; the conduction component is the first conduction component 131, and the first conduction component 131 is fixedly connected to the support rod 121 and the adjacent heating arc segment 111 respectively.

[0042] Specifically, in this embodiment, the number of the support assemblies 120 is the same as the number of the heating arc segments 111; since each of the support assemblies 120 only includes 1 support rod 121, one end of the support rod 121 close to the heating arc segment 111 can be fixedly connected to the lower side of the first conduction component 131, and both upper ends of the first conduction component 131 can be fixedly connected to the adjacent heating arc segments 111 respectively, that is, the first conduction component 131 is located between the support rod 121 and the heating arc segment 111, so that the support rod 121 can support the adjacent heating arc segment 111 through the first conduction component 131. Preferably, the support rod 121 is fixedly connected to the middle of the lower side of the first conduction component 131 to make the first conduction component 131 evenly stressed, so that the support rod 121 can stably support the adjacent heating arc segment 111, but the present invention is not limited thereto.

[0043] In another embodiment, the first conduction component 131 can be located above the heating arc segment 111; and both lower ends of the first conduction component 131 can be fixedly connected to the adjacent heating arc segments 111 respectively, and the middle of the lower side of the first conduction component 131 can be fixedly connected to the support rod 121, but the present invention is not limited thereto.

[0044] Please continue to refer to Figure 1 , the number of the flexible components 122 in each of the support assemblies 120 is 2, and the two flexible components 122 are fixedly connected to both side surfaces of one end of the support rod 121 in the same support assembly away from the heating arc segment 111, and the two flexible components 122 are arranged oppositely.

[0045] It can be understood that, in some other embodiments, each of the support assemblies 120 further includes: a connection component 123, which is connected to the flexible component 122 in the same support assembly, and the connection component 123 is fixed on a water-cooled plate horizontally arranged in the vapor deposition device (the water-cooled plate is indirectly fixed to the cavity of the vapor deposition device and is located below the heat insulation plate at the bottom layer of the heating component), serving as the final fixing component of the flexible component 122.

[0046] In some embodiments, the flexible component 122 is one or any combination of a U-shaped spring and a leaf spring.

[0047] Specifically, in this embodiment, in the same support component 120, each flexible component 122 can be correspondingly disposed below a heating arc segment 111 to control the deformation and displacement of the support rod 121 along the radial direction of the heating component 110, thereby controlling the deformation and displacement of the heating arc segment 111 along the radial direction of the heating component 110. At the same time, the connecting component 123 serves as the final fixing component of the flexible component 122. When the heating arc segment 111 undergoes thermal creep along the radial direction due to heat, the flexible component 122 can deform with it. However, the flexible component 122 has better elasticity and can return to its original position when the temperature decreases, thereby driving the heating arc segment 111 back to its original position and preventing the treatment effect drift under the same process conditions. Preferably, the flexible component 122 is a U-shaped spring, but the present invention is not limited thereto.

[0048] Please continue to refer to Figure 1 , the materials of the conducting component, the support rod 121, the flexible component 122, and the connecting component 123 are one or any combination of tungsten, molybdenum, rhenium, or their alloys.

[0049] It can be understood that in some other embodiments, the resistance of the first conducting component 131 is less than the sum of the resistances of the support rod 121, the flexible component 122, and the connecting component 131 in the same support component.

[0050] Specifically, in this embodiment, since the materials of the first conducting component 131, the support rod 121, the flexible component 122, and the connecting component 123 all have electrical conductivity, the heating current can not only flow between adjacent heating arc segments 111 along the first conducting component 131, but also flow between adjacent heating arc segments 111 along a first path formed by a support rod 121, two flexible components 122, and the connecting component 123 in the same support component 120. More specifically, since the resistance of the first conducting component 131 is less than the resistance on the first path, the current flowing through the first conducting component 131 is larger, and the current flowing through the support rod 121, the flexible component 122, and the connecting component 123 is smaller. This makes the heat generated by the current on the flexible component 122 smaller, effectively reducing the temperature of the flexible component 122 and minimizing its thermal creep. When the temperature decreases, the flexible component 122 can return to its original position, thereby reducing the deformation and displacement of the heating arc segment 111. However, the present invention is not limited thereto.

[0051] Please continue to refer to Figure 1, the heater assembly further includes: a plurality of isolation components 140; each of the isolation components 140 is correspondingly disposed between the support rod 121 and the flexible component 122 to insulate the support rod 121 and the flexible component 122 from each other.

[0052] Specifically, in this embodiment, the isolation component 140 can be prepared from a heat-resistant heat-insulating material to reduce the heat conduction rate between the support rod 121 and the flexible component 122, thereby further reducing the temperature of the flexible component 122, reducing its thermal creep, and further reducing the deformation and displacement of the heating component 110. In addition, since the isolation component 140 has an insulating property, when the isolation component 140 is provided between the support rod 121 and the flexible component 122, current cannot flow from the support rod 121 to the flexible component 122 and the connecting component 123. At this time, the first conduction component 131 only needs to have a conductive property, and there is no requirement for its resistance. Preferably, the material of the isolation component 140 is ceramic, but the present invention is not limited thereto.

[0053] Embodiment Two

[0054] Combined with the attached Figure 2 As shown, the difference from Embodiment One is that each support assembly 120 includes 2 support rods 121; and each support rod 121 is fixedly connected to the adjacent heating arc segment 111.

[0055] Please continue to refer to Figure 2 , in each support assembly 120, the number of the flexible components 122 is the same as that of the support rods 121; each flexible component 122 is correspondingly fixedly connected to one end of a support rod 121 in the same support assembly away from the heating arc segment 111, and all the flexible components 122 are oppositely arranged.

[0056] Specifically, in this embodiment, in the same support assembly 120, each support rod 121 can be fixedly connected to one heating arc segment 111 in the adjacent heating arc segments 111 to stably support the adjacent heating arc segments 111 by the two support rods 121. The number of the flexible components 122 in each support assembly 120 is also two, and each flexible component 122 is correspondingly disposed below one heating arc segment 111 and fixedly connected to the side surface of the support rod 121 supporting the heating arc segment 111 to control the deformation and displacement of the support rod 121 and the heating arc segment 111 along the radial direction of the heating component 110, but the present invention is not limited thereto.

[0057] Please continue to refer to Figure 2, the conducting component is the second conducting component 132, and the second conducting component 132 is fixedly connected to the adjacent heating arc segments 111.

[0058] It can be understood that in some other embodiments, the resistance of the second conducting component 132 is less than the sum of the resistances of the support rod 121, the flexible component 122, and the connecting component 123 in the same support assembly.

[0059] Specifically, in this embodiment, the second conducting component 132 may be located above the heating arc segments 111; and the two lower ends of the second conducting component 132 are respectively fixedly connected to the adjacent heating arc segments 111, so that current can flow between the adjacent heating arc segments 111 along the second conducting component 132. In addition, current can also flow between the adjacent heating arc segments 111 along a second path formed by two support rods 121, two flexible components 122, and the connecting component 123 in the same support assembly 120. More specifically, since the resistance of the second conducting component 132 is less than the resistance on the second path, the current flowing through the second conducting component 132 is larger, and the current flowing through the support rod 121, the flexible component 122, and the connecting component 123 is smaller, so that the heat generated by the current on the flexible component 122 is smaller, which can effectively reduce the temperature of the flexible component 122, reduce its thermal creep, and further reduce the deformation and displacement of the heating arc segments 111, but the present invention is not limited thereto.

[0060] Embodiment III

[0061] Combined with the attached Figure 3 As shown, the difference from Embodiment II is that the conducting component is the third conducting component 133, and the third conducting component 133 is fixedly connected to all the support rods 121 in the same support assembly.

[0062] It can be understood that in some other embodiments, the resistance of the third conducting component 133 is less than the sum of the resistances of the flexible component 122 and the connecting component 123 in the same support assembly.

[0063] Specifically, in this embodiment, the third conduction component 133 can be disposed between two of the support rods 121 of the same support assembly 120, such that current can flow between adjacent heating arc segments 111 along a third path formed by the third conduction component 133 and two of the support rods 121 in the corresponding support assembly 120. Additionally, current can also flow between adjacent heating arc segments 111 along a second path formed by two of the support rods 121, two of the flexible components 122, and the connection component 123 in the same support assembly 120. Since the resistance of the third conduction component 133 is less than the sum of the resistances of all of the flexible components 122 and the connection component 123 in the same support assembly 120, the resistance of the third path is less than the resistance of the second path, such that the current flowing through the third conduction component 133 and the support rods 121 is greater, and the current flowing through the flexible components 122 and the connection component 123 is less, such that the heat generated by the current in the flexible components 122 is less, which can effectively reduce the temperature of the flexible components 122, reduce their thermal creep, and thereby reduce the deformation and displacement of the heating arc segments 111, but the present invention is not limited thereto.

[0064] Embodiment Four

[0065] The difference from Embodiment Two is that the conduction component is a fourth conduction component, and the fourth conduction component is fixedly connected to all of the support rods 121 and adjacent heating arc segments 111 in the same support assembly.

[0066] In some other embodiments, the resistance of the fourth conduction component is less than the sum of the resistances of the support rods 121, the flexible components 122, and the connection component 123 in the same support assembly.

[0067] Specifically, in this embodiment, the fourth conducting component may be located between the heating arc segment 111 and the support rod 121. The upper ends of both sides of the fourth conducting component may be fixedly connected to the adjacent heating arc segments 111 respectively, and the lower side of the fourth conducting component may be fixedly connected to all the support rods 121 in the same support assembly 120, so that the support rod 121 supports the adjacent heating arc segment 111 through the fourth conducting component, and at the same time, current can flow between the adjacent heating arc segments 111 along the fourth conducting component. In addition, current can also flow between the adjacent heating arc segments 111 along a fourth path formed by the fourth conducting component, two support rods 121 in the corresponding support assembly 120, two flexible components 122 and the connecting component 123. Since the resistance of the fourth conducting component is smaller than the resistance on the fourth path, the current flowing through the fourth conducting component is larger, and the current flowing through the support rod 121, the flexible component 122 and the connecting component 123 is smaller, so that the heat generated by the current on the flexible component 122 is smaller, the temperature of the flexible component 122 can be effectively reduced, its thermal creep can be reduced, and further the deformation and displacement of the heating arc segment 111 can be reduced, but the present invention is not limited thereto.

[0068] On the other hand, this embodiment also provides a chemical vapor deposition device, including: a chemical vapor deposition reaction chamber and the heater assembly as described above; and the heater assembly is disposed in the chemical vapor deposition reaction chamber.

[0069] In summary, the present embodiment provides a heater assembly and a chemical vapor deposition apparatus. The heating component can be composed of several heating arc segments; the support rods in each support assembly can support adjacent heating arc segments, and the flexible component can control the deformation and displacement of the heating arc segments in the radial direction of the heating component; the conduction component electrically connected to the adjacent heating arc segments and / or the support rods can enable current to flow between adjacent heating arc segments to heat the wafer tray. In the present embodiment, the current can not only flow between adjacent heating arc segments along the conduction component, but also flow between adjacent heating arc segments along the support rods, flexible components and connection components in the same support assembly; since the resistance of the path where the conduction component is located is less than the resistance of the path where the flexible component is located, the current flowing through the conduction component is larger, and the current flowing through the flexible component is smaller, so that the heat generated by the current on the flexible component is smaller, which can effectively reduce the temperature of the flexible component and reduce its thermal creep, thereby reducing the deformation and displacement of the heating arc segments. In the present embodiment, by providing an isolation component, the support rod and the flexible component can be insulated from each other, so that the current cannot flow from the support rod to the flexible component, and further the current cannot flow between adjacent heating arc segments along the support rods, flexible components and connection components in the same support assembly to reduce the temperature of the flexible component; at the same time, the isolation component can also reduce the heat conduction rate between the support rod and the flexible component, thereby further reducing the temperature of the flexible component.

[0070] Although the content of the present invention has been introduced in detail through the above preferred embodiments, it should be recognized that the above description should not be considered as a limitation of the present invention. After those skilled in the art have read the above content, various modifications and substitutions of the present invention will be obvious. Therefore, the protection scope of the present invention should be defined by the appended claims.

Claims

1. A heater assembly for heating a wafer tray in a chemical vapor deposition apparatus, characterized in that, Comprising: A heating component that can heat the wafer tray when current flows through it; the heating component includes a plurality of heating arc segments; A plurality of support components, each support component including at least one support rod for supporting adjacent heating arc segments; A flexible component connected to an end of the support rod away from the heating arc segment for controlling the displacement and deformation direction of the heating arc segment; A conduction component electrically connected to adjacent heating arc segments and / or to the support rod for enabling current to flow between adjacent heating arc segments; And the current flowing through the conduction component is greater than the current flowing through the flexible component.

2. The heater assembly according to claim 1, characterized in that, Each support component further includes: a connecting component connected to the flexible component in the same support component for restricting the displacement of the flexible component along the circumferential direction of the heating component.

3. The heater assembly according to claim 2, wherein The number of support rods in each support component is 1; the conduction component is a first conduction component, and the first conduction component is fixedly connected to the support rod and adjacent heating arc segments respectively.

4. The heater assembly according to claim 3, wherein, The resistance of the first conduction component is less than the sum of the resistances of the support rod, the flexible component, and the connecting component in the same support component.

5. The heater assembly according to claim 3, characterized in that, The number of flexible components in each support component is 2, and the two flexible components are fixedly connected to the two side surfaces of the end of the support rod away from the heating arc segment in the same support component, and the two flexible components are arranged oppositely.

6. The heater assembly according to claim 2, wherein Each support component includes 2 support rods; and each support rod is fixedly connected to adjacent heating arc segments.

7. The heater assembly according to claim 6, characterized in that, The conduction component is a second conduction component, and the second conduction component is fixedly connected to adjacent heating arc segments.

8. The heater assembly according to claim 7, wherein The resistance of the second conduction component is less than the sum of the resistances of the support rod, the flexible component, and the connecting component in the same support component.

9. The heater assembly according to claim 6, characterized in that, The conduction component is a third conduction component, and the third conduction component is fixedly connected to all the support rods in the same support component.

10. The heater assembly according to claim 9, characterized in that, The resistance of the third conduction component is less than the sum of the resistances of the flexible component and the connecting component in the same support component.

11. The heater assembly according to claim 6, characterized in that, The conduction component is a fourth conduction component, and the fourth conduction component is fixedly connected to all the support rods and adjacent heating arc segments in the same support component respectively.

12. The heater assembly according to claim 11, wherein, The resistance of the fourth conduction component is less than the sum of the resistances of the support rod, the flexible component, and the connecting component in the same support component.

13. The heater assembly according to claim 6, wherein, The number of flexible components and support rods in each support component is the same; each flexible component is correspondingly fixedly connected to an end of one support rod away from the heating arc segment in the same support component, and all the flexible components are arranged oppositely.

14. The heater assembly according to claim 1, characterized in that, Further comprising: A plurality of isolation components; each isolation component is correspondingly arranged between the support rod and the flexible component to insulate the support rod and the flexible component from each other.

15. The heater assembly according to claim 1, characterized in that, The heating arc segments are arranged at intervals along the circumferential direction of the circle.

16. The heater assembly according to claim 1, wherein, The flexible component is one or any combination of a U-shaped spring and a leaf spring.

17. The heater assembly according to claim 2, wherein, The materials of the conduction component, the support rod, the flexible component, and the connecting component are one or any combination of tungsten, molybdenum, rhenium, or their alloys.

18. A vapor deposition device, characterized in that, Comprising: A chemical vapor deposition reaction chamber and a heater assembly according to any one of claims 1 to 17; and the heater assembly is disposed in the chemical vapor deposition reaction chamber.

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