Temperature monitoring and analysis system for a hollow reactor

Abstract

The application provides a temperature monitoring and analysis system of a hollow reactor, comprising a monitoring terminal, a passive temperature chip sensing module and a temperature data collector, the passive temperature chip sensing module is used for real-time temperature detection on a to-be-detected area to obtain temperature detection data; the temperature data collector is in communication connection with the monitoring terminal, is used for collecting the temperature detection data and transmitting the temperature detection data to the monitoring terminal; wherein the monitoring terminal judges the fault analysis of the temperature detection data based on an analysis model and outputs a warning mode corresponding to a fault analysis result. The application can realize intelligent detection of the hollow reactor, improves the monitoring efficiency of the hollow reactor and avoids the safety hidden danger caused by battery power supply.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of electromechanical devices, and in particular to a temperature monitoring and analysis system for a hollow reactor. BACKGROUND

[0002] A dry-type hollow reactor is composed of winding coils, connection terminals and some accessories, and is mainly cooled by natural air. In addition to the relay protection characterized by current, there is no other monitoring and protection measures, and it is impossible to monitor and control in advance when a fault occurs. When the reactor is abnormal or fails, the fault area of the reactor will heat up rapidly, and the temperature will rise. The operation state of the reactor can be effectively judged by monitoring the temperature of the hollow reactor.

[0003] At present, the temperature monitoring means for the hollow reactor includes infrared temperature measurement technology and active wireless temperature measurement technology. The infrared temperature measurement technology is easily affected by the environment, and cannot accurately measure the bright metal surface. When the measured object is in a blocked state, it cannot be measured. In the active wireless temperature measurement technology, a battery is needed for power supply. Since the battery has a limited life, it needs to be replaced regularly. At the same time, the battery is not suitable for working in high-temperature harsh environments, and is prone to electrolyte leakage, thereby causing safety hazards. Therefore, there is an urgent need for a temperature monitoring and analysis system for a hollow reactor to solve the problem of low temperature monitoring efficiency and safety hazards of the hollow reactor in the prior art. SUMMARY

[0004] Therefore, it is necessary to provide a temperature monitoring and analysis system for a hollow reactor to solve the problem of low temperature monitoring efficiency and safety hazards of the hollow reactor in the prior art.

[0005] The present application provides a temperature monitoring and analysis system for a hollow reactor, comprising:

[0006] A plurality of passive temperature chip sensor modules are respectively built-in in the to-be-measured areas of the hollow reactor. The passive temperature chip sensor module is used for real-time temperature detection of the to-be-measured area to obtain temperature detection data.

[0007] A temperature data collector is respectively in communication connection with the plurality of passive temperature chip sensor modules and the monitoring terminal, and is used for collecting the temperature detection data and transmitting the temperature detection data to the monitoring terminal.

[0008] The monitoring terminal is used for obtaining a fault analysis result by performing fault analysis and judgment on the temperature detection data based on an analysis model, and outputting a warning mode corresponding to the fault analysis result.

[0009] In a possible implementation manner, the passive temperature chip sensor module comprises a passive temperature chip sensor assembly, a heat-conducting ceramic substrate packaging layer and a heat-conducting silicone adhesive layer.

[0010] The passive temperature chip sensor module is encapsulated in the hollow reactor by the heat-conducting ceramic base material encapsulation layer, and the heat-conducting ceramic base material encapsulation layer is bonded to the to-be-measured region of the hollow reactor by the heat-conducting silicone bonding layer.

[0011] In a possible implementation, the passive temperature chip sensor module is arranged inside the encapsulation layer of the hollow reactor.

[0012] In a possible implementation, the passive temperature chip sensor module comprises:

[0013] The radio frequency analog front end is configured to output the temperature detection data to the temperature data collector.

[0014] The digital controller is configured to perform analog-to-digital conversion on the temperature detection data.

[0015] The memory is configured to store the temperature detection data.

[0016] The temperature sensor is configured to detect the temperature detection data of the to-be-measured region.

[0017] In a possible implementation, the passive temperature chip sensor module adopts a dual-band working mode.

[0018] In a possible implementation, the temperature data collector comprises:

[0019] The power supply unit is configured to provide power supply for the temperature data collector.

[0020] The interface unit is configured to establish a communication connection with the monitoring terminal.

[0021] The DSP processor unit is configured to perform processing operation on the received temperature detection data.

[0022] The transmitter unit is configured to transmit an instruction signal to the passive temperature chip sensor module.

[0023] The receiver unit is configured to receive a data signal sent by the passive temperature chip sensor module.

[0024] The transceiver switching and antenna selection switch unit.

[0025] In a possible implementation, the DSP processor unit adopts a time division multiple access and time division multiplexing manner to collect the temperature detection data of the passive temperature chip sensor module in turn.

[0026] In a possible implementation, the analysis model is constructed by using an adaptive fuzzy reasoning neural network algorithm.

[0027] In a possible implementation, the monitoring terminal comprises:

[0028] The signal acquisition unit is configured to receive temperature detection data transmitted by the temperature data collector.

[0029] The data preprocessing unit is configured to preprocess the temperature detection data to obtain target temperature detection data.

[0030] The rule encoder is configured to encode the target temperature detection data.

[0031] The analysis unit is configured to analyze the encoded target temperature detection data based on an analysis model to obtain a fault analysis result.

[0032] The judgment unit is configured to judge the fault analysis result, and when the fault analysis result is not recorded in the analysis module, a first fault analysis result obtained through manual fault identification is updated in the analysis unit.

[0033] In a possible implementation, the system further comprises:

[0034] The data query unit is configured to query the target temperature detection data and the fault analysis result.

[0035] The permission management unit is configured to set operation permissions of different users.

[0036] The beneficial effects of the above embodiments are that: through the real-time temperature measurement of the to-be-measured region of the air-core reactor by the plurality of passive temperature chip sensor modules, the temperature detection data is obtained, the temperature detection data is collected by the temperature data collector, the fault analysis result is determined by the monitoring terminal according to the temperature detection data, and then the corresponding early warning mode is matched, so that the automatic detection of the temperature of the to-be-measured region of the air-core reactor is realized, the corresponding early warning mode is automatically matched according to the detection result, the intelligent detection of the air-core reactor is realized, the monitoring efficiency of the air-core reactor is improved, and the safety of temperature monitoring is improved without battery replacement. BRIEF DESCRIPTION OF DRAWINGS

[0037] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following will briefly introduce the drawings needed to be used in the embodiment description. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can also be obtained by those skilled in the art without creative labor.

[0038] Figure 1 The structure diagram of the temperature monitoring and analysis system of the air-core reactor provided by the present application;

[0039] Figure 2 The structure diagram of the passive temperature chip sensor module provided by the present application;

[0040] Figure 3 The structural schematic diagram of the temperature data collector provided by the present application is shown in the figure;

[0041] Figure 4 The principle schematic diagram of the temperature data collector provided by the present application is shown in the figure. DETAILED DESCRIPTION

[0042] The technical solutions in the embodiments of the present application will be clearly and completely described in combination with the drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all the other embodiments obtained by those skilled in the art without creative work fall within the protection scope of the present application.

[0043] Some block diagrams shown in the drawings are functional entities, which do not necessarily correspond to physically or logically independent entities. These functional entities can be implemented in the form of software, or in one or more hardware modules or integrated circuits, or in different network and / or processor systems and / or microcontroller systems.

[0044] In this document, the term "embodiment" is meant to encompass a particular feature, structure, or characteristic described in connection with an embodiment. The appearance of the phrase in various places in the specification is not necessarily all referring to the same embodiment, nor is it necessarily referring to a particular alternative embodiment. Those skilled in the art will appreciate that embodiments described herein can be combined with other embodiments.

[0045] The abnormal operation or failure of the power equipment is usually manifested as abnormal change of temperature, so the temperature monitoring of the air-core reactor becomes an effective measure for the safety monitoring, and the timely device monitoring of the power system can guarantee the normal operation of the power transmission and transformation system, which will further affect the safety and reliability of the entire power system.

[0046] At present, the temperature monitoring means for the air-core reactor is mainly infrared temperature measurement. Since the infrared temperature measurement is easily affected by the environment, the temperature reading is greatly affected for the bright or polished metal surface, and it is not convenient to measure the temperature inside the object, and other temperature measurement methods (such as optical fiber temperature measurement method and wireless temperature measurement method) need to use battery power supply. Since the battery life is limited, the battery needs to be replaced regularly, and the battery is not suitable for working in high-temperature harsh environment, which is easy to cause electrolyte leakage, corrosion of other working configuration accessories, and even explosion danger, which is easy to cause safety accidents.

[0047] This invention provides a temperature monitoring and analysis system for an air-core reactor, which will be described below.

[0048] Figure 1 This is a schematic diagram of the temperature monitoring and analysis system for the air-core reactor provided by the present invention.

[0049] Multiple passive temperature chip sensor modules 12 are respectively built into the test area of ​​the hollow reactor. The passive temperature chip sensor modules 12 are used to perform real-time temperature detection of the test area to obtain temperature detection data.

[0050] Temperature data acquisition unit 13 is communicatively connected to multiple passive temperature chip sensor modules and monitoring terminal 11, respectively, and is used to collect temperature detection data and transmit the temperature detection data to monitoring terminal 11.

[0051] The monitoring terminal 11 performs fault analysis on the temperature detection data based on the analysis model to obtain the fault analysis result and outputs the early warning mode corresponding to the fault analysis result.

[0052] The above solution uses multiple passive temperature chip sensor modules 12 to measure the temperature of the area under test of the air-core reactor in real time, obtain temperature detection data, collect temperature detection data using a temperature data acquisition device 13, and perform fault analysis and judgment based on the temperature detection data through a monitoring terminal 11, thereby matching the corresponding early warning mode. This enables automatic detection of the temperature of the area under test of the air-core reactor and automatic matching of the corresponding early warning mode based on the detection results, realizing intelligent detection of the air-core reactor, improving the monitoring efficiency of the air-core reactor, and the present invention does not require battery replacement, thus improving the safety of temperature monitoring.

[0053] Since the encapsulation layer of an air-core reactor is under the influence of a strong magnetic field, temperature detection and signal transmission are impossible. Therefore, equipment for temperature monitoring of air-core reactors must be placed in an environment with high voltage, high temperature, strong magnetic field, and strong electromagnetic interference. In order to monitor the temperature of the area to be measured in an air-core reactor, the above problems need to be solved.

[0054] In one embodiment, the passive temperature chip sensor module 12 includes a passive temperature chip sensor assembly, a thermally conductive ceramic substrate encapsulation layer, and a thermally conductive silicone adhesive layer.

[0055] Specifically, the passive temperature chip sensor assembly is insulated and encapsulated within the hollow reactor through a thermally conductive ceramic substrate encapsulation layer, and the thermally conductive ceramic substrate encapsulation layer is bonded to the test area of ​​the hollow reactor through a thermally conductive silicone adhesive layer.

[0056] Since the main part of the passive temperature chip sensor assembly is a metal antenna, if the metal antenna is too close to the air-core reactor, the microwave signal to be received by the passive temperature chip sensor assembly will be directly reflected by the air-core reactor and cannot be received by the passive temperature chip sensor assembly, so that the passive temperature chip sensor module cannot normally operate, by packaging the passive chip sensor assembly in the air-core reactor by the heat-conducting ceramic substrate packaging layer, the passive temperature chip sensor assembly and the air-core reactor are kept at a certain distance, so that the surface can ensure efficient heat conduction while avoiding interference from the air-core reactor high voltage, large current and strong magnetic field.

[0057] In an embodiment, the passive temperature chip sensor assembly includes a UHF-RFID temperature measuring chip to realize identification of temperature detection data of different to-be-measured regions of the air-core reactor.

[0058] The UHF-RFID temperature measuring chip is connected in communication with the temperature data collector according to the ISO18000-6 and EPC Class Gen2 communication protocols.

[0059] In an embodiment, the passive temperature chip sensor module 12 is arranged inside the encapsulating layer of the air-core reactor, so that the passive temperature chip sensor can be directly in contact with the to-be-measured region, the accuracy of temperature monitoring can be ensured, and the passive temperature chip sensor module 12 can be safely and stably operated in a complex environment, and the practicality of the passive temperature chip sensor is improved.

[0060] Figure 2 The passive temperature chip sensor module provided by the application provides a structural schematic diagram of the passive temperature chip sensor module.

[0061] Referring to Figure 2 The passive temperature chip sensor module 12 includes:

[0062] The radio frequency analog front end is used for outputting temperature detection data to the temperature data collector.

[0063] The digital controller is used for analog-digital conversion of the temperature detection data.

[0064] The memory is used for storing the temperature detection data.

[0065] The temperature sensor is used for detecting temperature detection data of the to-be-measured region.

[0066] The passive temperature chip sensor module 12 can realize temperature detection of the to-be-measured region in the air-core reactor through the radio frequency analog front end, the digital controller, the memory and the temperature sensor, and the obtained temperature detection data is connected in communication with the temperature data collector.

[0067] In an embodiment, the radio frequency analog front end comprises a reset unit, a demodulator, a voltage generator, a clock component and an amplitude modulation / frequency modulation component, wherein the reset unit is configured to perform a reset setting of the radio frequency front end, the demodulator is configured to convert a digital signal into an analog signal, the voltage generator is configured to generate a target voltage according to a received signal, and the amplitude modulation / frequency modulation component is configured to perform an amplitude modulation / frequency modulation operation on an emitted analog signal.

[0068] The digital controller comprises a cyclic redundancy check, a radio frequency interface control, an electronic pulse memory, a protection component of a house collision component, wherein the cyclic redundancy check is configured to detect or check errors that may occur after transmission or storage of temperature detection data, the radio frequency interface control is configured to control a radio frequency interface, the electronic pulse memory is a storage component, and the protection component of the house collision component is configured to protect temperature transmission data; the memory comprises an electronic pulse memory and a charge pump; and the temperature sensor comprises a PATA power generation component, a power supply, a comparator and a calculator.

[0069] In an embodiment, the passive temperature chip sensor module 12 adopts a dual-band working mode.

[0070] Specifically, the passive temperature chip sensor module 12 adopts a 915 MHZ and 2.45 GHZ dual-band working mode to solve the problem of insufficient energy supply of a traditional single-band, and can effectively improve the communication distance of the passive temperature chip sensor module 12, and improve the temperature measurement range, communication stability and temperature measurement accuracy.

[0071] In an embodiment, the temperature measurement range of the passive temperature chip sensor module 12 is 25℃-125℃, and the temperature measurement accuracy is ±1℃.

[0072] As Figure 3 A structural schematic diagram of the temperature data collector provided by the application is shown in FIG. 1.

[0073] Referring to Figure 3 , the temperature data collector 13 comprises:

[0074] A power supply unit configured to provide power supply for the temperature data collector;

[0075] An interface unit configured to establish a communication connection with a monitoring terminal;

[0076] A DSP processor unit configured to process and calculate received temperature detection data;

[0077] A transmitter unit configured to transmit an instruction signal to the passive temperature chip sensor module;

[0078] A receiver unit configured to receive a data signal emitted by the passive temperature chip sensor module;

[0079] Transmit-receive switching and antenna selection switch unit.

[0080] The temperature data collector 13 is connected to the monitoring terminal 11 through a power supply unit, an interface unit, a DSP processor unit, a transmitter unit, a receiver unit and a transmit-receive switching and antenna selection switch unit, and transmits the collected temperature detection data to the monitoring terminal 11.

[0081] In an embodiment, the DSP processor unit adopts time division multiple access (TDMA) and time division multiplexing (TDM) to collect the temperature detection data of the passive temperature chip sensor module in turn.

[0082] The TDMA mode allows multiple passive temperature chip sensor modules 12 to use the same frequency to transmit temperature detection data to the temperature data collector 13 at different time slices, and the TDM mode allows multiple passive temperature sensor modules 12 to transmit temperature detection data to the temperature data collector 13 through the same communication channel, which can simultaneously realize the ordered collection of multiple temperature detection data and improve the monitoring efficiency of the air core reactor.

[0083] It can be understood that when the temperature detection data is within the preset temperature range, it is determined that the air core reactor is in a normal state, and when the temperature detection data is outside the preset range, it is determined that the air core reactor is in a fault state.

[0084] The corresponding preset temperature range is different due to the different materials and structures of different components of the air core reactor, resulting in different normal temperature ranges of different to-be-measured regions.

[0085] Figure 4 The temperature data collector provided by the present application is shown in the principle diagram.

[0086] Referring to Figure 4 In an embodiment, the data collector 13 includes:

[0087] The antenna unit is used for receiving and outputting temperature detection data.

[0088] The radio frequency unit is used for converting the temperature detection data into an analog signal that can be output by the antenna unit.

[0089] The relay unit is used for managing and transmitting temperature detection data.

[0090] The display unit is used for displaying temperature detection data to the user and receiving operation instructions.

[0091] The micro processing unit is used for processing temperature detection data.

[0092] A secure storage unit is configured to store the temperature detection data.

[0093] An interface unit is configured to establish a communication connection with the monitoring terminal 11.

[0094] In an embodiment, the analysis model is constructed using an adaptive fuzzy inference neural network algorithm.

[0095] The adaptive fuzzy inference neural network algorithm is used to judge the fault of the air-core reactor. By sample learning of the collected temperature detection data, the characteristic values of the temperature detection data are extracted, and the fault analysis result is generated by comprehensive analysis and judgment of factors such as temperature index parameters of different to-be-tested regions and external environment temperature. The corresponding early warning mode of the fault analysis result is output.

[0096] Specifically, the adaptive fuzzy inference neural network algorithm is trained by the following methods, including:

[0097] The temperature detection data samples and the actual fault results of the to-be-tested regions are obtained. The temperature detection data samples are taken as input, and the fault analysis result is taken as output. When the matching rate of the fault analysis result and the actual fault result reaches a preset threshold, the training of the analysis model is completed.

[0098] It can be understood that the adaptive fuzzy inference neural network algorithm is trained using fault instance data. The training result is a system model parameter that conforms to the actual situation. When new temperature detection data is obtained, the temperature detection data of each to-be-tested region needs to be preprocessed first to extract the characteristic values (such as curve shape and change stage number) of the temperature data in the diagnosis period. The characteristic data of all to-be-tested regions form a new diagnosis input BP neural network, and a decision report is output for the recorded fault result. For unrecorded fault results, the analysis model will re-encode the temperature detection data samples, and perform fault identification in the manner of manual detection and expert diagnosis. The neural network learning method is used to record the fault diagnosis result, so as to achieve the purpose of continuously improving the analysis model.

[0099] After obtaining the fault analysis result, the analysis model matches the preset early warning mode according to the fault analysis result, and then sends a corresponding early warning reminder to the staff, so that the staff can accurately and quickly respond to the fault of the air-core reactor.

[0100] In an embodiment, the monitoring terminal includes:

[0101] A signal acquisition unit is configured to receive temperature detection data transmitted by a temperature data collector.

[0102] A data preprocessing unit is configured to preprocess the temperature detection data and obtain target temperature detection data.

[0103] a rule encoder configured to encode the target temperature detection data;

[0104] an analysis unit configured to analyze the encoded target temperature detection data based on an analysis model to obtain a fault analysis result of fault analysis;

[0105] a judgment unit configured to judge the fault analysis result, and update a first fault analysis result obtained through manual fault identification in the analysis unit when the fault analysis result is not recorded in the analysis model.

[0106] The first fault analysis result is only used to distinguish the fault analysis result, and refers to the fault analysis result obtained through manual fault identification.

[0107] The fault analysis result obtained through fault analysis and judgment of the monitoring terminal based on the temperature detection data can realize rapid identification of the operating state of the air-core reactor, and improve the detection efficiency of the air-core reactor.

[0108] In an embodiment, the temperature detection and analysis system of the air-core reactor further comprises:

[0109] a data query unit configured to query the target temperature detection data and the fault analysis result;

[0110] a permission management unit configured to set the operation permission of different users.

[0111] The data query unit can realize rapid and accurate access to the target temperature detection data and the fault analysis result, and the permission management unit can set the operation permission of different users, thereby improving the security of the temperature detection and analysis system of the air-core reactor.

[0112] According to another aspect of the present application, a temperature monitoring and analysis method of an air-core reactor is also provided, comprising:

[0113] obtaining temperature detection data of a plurality of to-be-measured regions of the air-core reactor respectively;

[0114] collecting the temperature detection data and transmitting the temperature detection data to a monitoring terminal;

[0115] judging the fault analysis result based on an analysis model, and outputting a corresponding early warning mode of the fault analysis result.

[0116] The above embodiment provides a temperature monitoring and analysis method of an air-core reactor, which can realize the technical solutions described in the above temperature monitoring and analysis system of an air-core reactor. The principles of the specific implementation of each module or unit can be referred to the corresponding content in the temperature monitoring and analysis system of an air-core reactor, which will not be described here.

[0117] The temperature monitoring and analyzing system of the hollow reactor provided by the present application is described in detail above, and the principle and implementation mode of the present application are described by using specific examples in this paper. The above description of the examples is only used to help understand the method of the present application and its core idea. Meanwhile, for those skilled in the art, there will be changes in the specific implementation mode and application range according to the idea of the present application. In summary, the content of the specification should not be understood as a limitation of the present application.

Claims

1. A temperature monitoring and analysis system for an air-core reactor, characterized in that, include: Multiple passive temperature chip sensor modules are respectively built into the test area of ​​the hollow reactor. The passive temperature chip sensor module is used to perform real-time temperature detection of the test area to obtain temperature detection data. A temperature data acquisition unit is communicatively connected to the plurality of passive temperature chip sensor modules and a monitoring terminal, respectively, for acquiring the temperature detection data and transmitting the temperature detection data to the monitoring terminal; The monitoring terminal is used to perform fault analysis and judgment on the temperature detection data based on the analysis model to obtain the fault analysis result, and output the early warning mode corresponding to the fault analysis result; the analysis model is constructed using an adaptive fuzzy inference neural network algorithm; The passive temperature chip sensor module includes a passive temperature chip sensor assembly, a thermally conductive ceramic substrate encapsulation layer, and a thermally conductive silicone adhesive layer. Specifically, the passive temperature chip sensor assembly is insulated and encapsulated within the hollow reactor by the thermally conductive ceramic substrate encapsulation layer, and the thermally conductive ceramic substrate encapsulation layer is bonded to the test area of ​​the hollow reactor by the thermally conductive silicone adhesive layer.

2. The temperature monitoring and analysis system according to claim 1, characterized in that, The passive temperature chip sensor module is arranged inside the encapsulation layer of the hollow reactor.

3. The temperature monitoring and analysis system according to claim 1, characterized in that, The passive temperature chip sensor module includes: An RF analog front-end is used to output the temperature detection data to the temperature data acquisition unit; A digital controller is used to perform analog-to-digital conversion on the temperature detection data; A memory for storing the temperature detection data; A temperature sensor is used to detect the temperature data of the area to be measured.

4. The temperature monitoring and analysis system according to claim 1, characterized in that, The passive temperature chip sensing module adopts a dual-band operating mode.

5. The temperature monitoring and analysis system according to claim 1, characterized in that, The temperature data acquisition device includes: A power supply unit is used to provide power to the temperature data acquisition unit; An interface unit is used to establish a communication connection with the monitoring terminal; A DSP processor unit is used to process and perform calculations on the received temperature detection data; The transmitter unit is used to transmit command signals to the passive temperature chip sensor module; A receiver unit is used to receive data signals emitted by the passive temperature chip sensor module. Transmit / receive switching and antenna selection switch unit.

6. The temperature monitoring and analysis system according to claim 5, characterized in that, The DSP processor unit uses time-division multiple access and time-division multiplexing to collect temperature detection data from the passive temperature chip sensor module in turn.

7. The temperature monitoring and analysis system according to claim 1, characterized in that, The analytical model is constructed using an adaptive fuzzy inference neural network algorithm.

8. The temperature monitoring and analysis system according to claim 7, characterized in that, The monitoring terminal includes: The signal acquisition unit is used to receive the temperature detection data transmitted by the temperature data acquisition device; A data preprocessing unit is used to preprocess the temperature detection data to obtain target temperature detection data; A rule encoder is used to encode the target temperature detection data; The analysis unit is used to analyze the coded target temperature detection data based on the analysis model, and obtain fault analysis results. The judgment unit is used to judge the fault analysis results. When the fault analysis results are not recorded in the analysis unit, the first fault analysis result obtained through manual fault identification is updated in the analysis unit.

9. The temperature monitoring and analysis system according to claim 8, characterized in that, Also includes: The data query unit is used to query the target temperature detection data and the fault analysis results; The access control unit is used to set operation permissions for different users.

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