Method for manufacturing a flow divider, flow divider processing apparatus and industrial line

Abstract

The application discloses a preparation method of a shunt, a shunt processing device and an industrial flow line, and the preparation method comprises the following steps: preparing a shunt body and a circuit board, and pre-assembling the shunt body and the circuit board; placing the pre-assembled shunt body and the circuit board in a preset environment; and driving the shunt body and the circuit board to be close to each other and be extruded while welding surfaces of the shunt body and the circuit board facing each other. The technical scheme can improve the current detection precision of the shunt.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of shunt, in particular to a preparation method of shunt, shunt processing equipment and industrial assembly line. BACKGROUND

[0002] The shunt is an instrument for measuring direct current, which is made according to the principle that voltage is generated at both ends of the resistance when direct current passes through the resistance. In the electronic measurement technology industry, the direct current shunt can be used for sampling detection of current limiting, backflow and current sharing of power supply of battery management system, electronic whole machine, communication system and automatic control system.

[0003] However, with the rapid development of some industries, the detection accuracy of the shunt is also increasingly required, for example, the BMS (Battery Management System) in the new energy automobile has high requirements for the current detection of the shunt, but the shunts on the market still have the problem of not meeting the requirements of high-precision current detection. SUMMARY

[0004] The main purpose of the present application is to provide a preparation method of shunt, which aims to eliminate the bubbles generated when the circuit board and the copper bar are welded, avoid the influence of the bubbles on the impedance of the shunt, and improve the current detection accuracy of the shunt.

[0005] To achieve the above purpose, the preparation method of shunt provided by the present application, the shunt includes a shunt body and a circuit board, and the preparation method of the shunt includes the following steps:

[0006] Prepare the shunt body and the circuit board, and pre-assemble them;

[0007] Place the pre-assembled shunt body and the circuit board in a predetermined environment;

[0008] While welding the surfaces of the circuit board and the shunt body facing each other, drive them to approach and extrude each other.

[0009] Optionally, the step of preparing the shunt body and the circuit board and pre-assembling them is specifically:

[0010] Prepare the shunt body and the circuit board;

[0011] Fix the shunt body;

[0012] Place the circuit board on the surface of the shunt body away from the fixed surface.

[0013] Optionally, before the step of preparing the shunt body and the circuit board and pre-assembling the two, the method further comprises:

[0014] acquiring a preset pressing area of the circuit board;

[0015] The step of driving the circuit board and the shunt body to be close to each other and be pressed at the same time of welding the two comprises:

[0016] pressing the preset pressing area of the circuit board to make it close to and press the shunt body at the same time of welding the surfaces of the circuit board and the shunt body facing each other.

[0017] Optionally, the step of acquiring the preset pressing area of the circuit board comprises:

[0018] acquiring surface information of the surface of the circuit board facing the shunt body;

[0019] acquiring the preset pressing area according to the surface information.

[0020] Optionally, the surface information comprises identification information and / or position setting information of components.

[0021] Optionally, after the step of driving the circuit board and the shunt body to be close to each other and be pressed at the same time of welding the two, the method further comprises:

[0022] vibrating either of the circuit board and the shunt body according to preset vibration parameters.

[0023] To achieve the above object, an embodiment of the present application provides a shunt processing device, the shunt comprising a shunt body and a circuit board, the circuit board being arranged on a welding surface of the shunt body, the shunt processing device comprising:

[0024] a first fixing assembly, the first fixing assembly being arranged with one of the shunt body and the circuit board; and

[0025] a second fixing assembly, the second fixing assembly being arranged with the other of the shunt body and the circuit board, the first fixing assembly and the second fixing assembly moving relative to each other to make the circuit board and the shunt body close to and abut each other.

[0026] Optionally, the first fixing assembly is a workbench, the workbench being arranged with a processing station for placing one of the copper bar and the circuit board;

[0027] The second fixing assembly is a pressing device, which is movably arranged above the processing station and used for pressing the other one of the shunt body or the circuit board, so that the circuit board and the shunt body are close to each other and abut.

[0028] Optionally, the pressing device is a mechanical hand device.

[0029] Optionally, the mechanical hand device is movably arranged above the processing station, and is used for pressing and vibrating the other one of the shunt body or the circuit board.

[0030] Optionally, the processing equipment further comprises an identification device arranged on the second fixing assembly, which is used for identifying the surface of the circuit board towards the shunt body, so as to obtain the surface information of the circuit board.

[0031] And / or, the workbench is a heating platform, which comprises a platform body, a heating device and a control device, the heating device and the control device are arranged in the inside of the platform body, the processing station is arranged on the surface of the platform body, and the control device is connected to the heating device, so that the heating device heats one of the shunt body or the circuit board on the processing station.

[0032] In order to achieve the above-mentioned purpose, an industrial assembly line is provided, which comprises the shunt processing equipment as described above.

[0033] The preparation method of the technical scheme, the shunt body and the circuit board are prepared in advance for pre-assembly, and then the two are placed in a predetermined environment after pre-assembly. When the copper bar of the shunt body and the circuit board are welded, the two are driven to approach and extrude each other. In this way, the shunt body and the circuit board can be closely attached during welding, which can reduce the generation of bubbles between the two during welding, thereby reducing the influence of bubbles on the impedance of the shunt. Therefore, the technical scheme can effectively improve the detection accuracy of the shunt to the current without improving the structure of the shunt, so as to meet the high-precision detection demand of the shunt in the industry. BRIEF DESCRIPTION OF DRAWINGS

[0034] In order to more clearly illustrate the technical scheme in the embodiments of the present application or the prior art, the drawings needed to be used in the embodiments or the prior art description will be briefly introduced. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative labor on the basis of the drawings shown.

[0035] Figure 1Structure schematic view of an embodiment of the shunt of the present application;

[0036] Figure 2 Flow schematic view of the first embodiment of the preparation method of the shunt of the present application;

[0037] Figure 3 Flow schematic view of the second embodiment of the preparation method of the shunt of the present application;

[0038] Figure 4 Flow schematic view of the third embodiment of the preparation method of the shunt of the present application;

[0039] Figure 5 Flow schematic view of the fourth embodiment of the preparation method of the shunt of the present application;

[0040] Figure 6 Flow schematic view of the fifth embodiment of the preparation method of the shunt of the present application;

[0041] Figure 7 Flow schematic view of the sixth embodiment of the preparation method of the shunt of the present application;

[0042] Figure 8 Flow schematic view of the seventh embodiment of the preparation method of the shunt of the present application;

[0043] Figure 9 Structure schematic view of an embodiment of the processing equipment of the shunt of the present application.

[0044] Explanation of reference numerals:

[0045] Reference Name Reference Name 100 Splitter 310 Workbench 10 Splitter body 320 Manipulator device 11 Copper bar 330 Identification device 13 Alloy 340 Carrier 30 Circuit board 350 Conveyor belt 300 Splitter processing equipment

[0046] The implementation, functional features and advantages of the present application will be further described with reference to the embodiments and the accompanying drawings. DETAILED DESCRIPTION

[0047] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work fall within the protection scope of the present application.

[0048] It should be noted that all directionality indications (such as up, down, left, right, front, back, etc.) in the embodiments of the present application are only used to explain the relative position relationship, movement condition, etc. between components in a certain specific posture (as shown in the drawings). If the specific posture changes, the directionality indications also change accordingly.

[0049] In addition, the description related to "first", "second" and the like in the present application is only for the purpose of description, and cannot be understood as indicating or implying the relative importance of the indicated technical features or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first", "second" can be explicitly or implicitly included at least one of the features. In addition, the technical solutions of various embodiments can be combined with each other, but it must be based on the realization of ordinary skilled in the art, when the combination of technical solutions appears contradictory or cannot be realized, it should be considered that the combination of technical solutions does not exist, also not within the protection scope required by the present application.

[0050] The shunt is an instrument for measuring direct current, which is made according to the principle that the voltage is generated at both ends of the resistance when the direct current passes through the resistance. In the electronic measurement technology industry, the direct current shunt can be used for sampling detection of current limiting, backflow and current sharing of power supply of battery management system, electronic whole machine, communication system and automatic control system. However, with the rapid development of some industries, the requirement for the detection accuracy of shunt is also increasing, for example, the BMS (Battery Management System) in new energy vehicles has high requirements for current detection of shunt, but the shunts on the market still have the problem of not meeting the requirements of high-precision current detection.

[0051] At present, the shunt manufacturers basically improve the detection accuracy of the shunt from the following aspects to improve the detection accuracy of the shunt:

[0052] (1) Improving the material of the shunt itself, for example, to solve the problem of uneven material of the copper bar of the shunt, the shunt manufacturer improves the uniformity of the material of the copper bar to improve the detection accuracy of the shunt;

[0053] (2) Improving the connection between the sampling connector and the copper bar, for example, to solve the problem of poor connection between the sampling connector and the copper bar, the shunt manufacturer increases the detection point on the shunt to improve the detection accuracy of the shunt;

[0054] (3) Improving the use environment of the shunt, for example, to solve the problem of harsh use environment of the shunt, the shunt manufacturer improves the use environment of the shunt, such as avoiding large temperature change of the use environment of the shunt, avoiding high humidity of the use environment or avoiding causing vibration of the shunt, to improve the detection accuracy of the shunt;

[0055] (4) Improving the detection accuracy of the ADC (Analog to Digital Converter) of the shunt, for example, improving the detection accuracy of the ADC to improve the detection accuracy of the shunt.

[0056] The inventors of the present application found that the current detection accuracy of the shunt is still poor after improving the current detection accuracy of the shunt which is generally affected. Therefore, through repeated experimental tests, it was found that there are other problems affecting the current detection accuracy of the shunt. The problem is that a gap exists between the circuit board and the copper bar when they are welded, which causes bubbles to be generated between the circuit board and the copper bar when they are welded. The bubbles generated at this position affect the impedance of the shunt body and further affect the current detection accuracy of the shunt body.

[0057] Among the ways to eliminate bubbles, the inventors of the present application have improved the structure of the copper bar and have also eliminated bubbles through process steps during the welding process of the circuit board and the copper bar to achieve the elimination of bubbles. The technical solution of the present application is a preparation method for eliminating bubbles through processes during the welding process of the circuit board and the copper bar.

[0058] The present application provides a preparation method of a shunt 100.

[0059] Reference Figures 1 to 2 In the embodiment of the present application, the preparation method of the shunt 100, the shunt body 10 includes two spaced copper bars 11, and the preparation method of the shunt 100 includes the following steps:

[0060] Step S10: Prepare the shunt body 10 and the circuit board 30, and pre-assemble them;

[0061] Step S20: Place the pre-assembled shunt body 10 and the circuit board 30 in a predetermined environment;

[0062] Step S30: Weld the surfaces of the circuit board 30 and the shunt body 10 facing each other while driving them to approach and extrude each other.

[0063] In the embodiment, the shunt body 10 comprises two spaced copper bars 11 and a resistance alloy 13, the two ends of the resistance alloy 13 are welded with the two copper bars 11 and electrically connected with the two copper bars 11. Each copper bar 11 is provided with a measurement connection end. It can be understood that the measurement connection end of one copper bar 11 is a positive connection end, and the measurement connection end of the other copper bar 11 is a negative connection end, so that the measurement current can flow from the positive connection end to the resistance alloy 13, and then flow from the resistance alloy 13 to the negative connection end, thereby realizing the measurement of the current value, and the current value can be transmitted to external devices by the circuit board 30. The material of the copper bar 11 can be red copper or brass, and a protective layer can be plated on the surface of the copper bar 11 to prevent oxidation of the surface of the copper bar 11, thereby avoiding the problem of poor contact caused by oxidation of the surface of the copper bar 11. For example, the copper bar 11 can be plated with tin, nickel, or organic solder film, which is not limited herein. The material of the resistance alloy 13 can be manganese copper alloy 13, iron chromium aluminum alloy 13, or nickel chromium alloy 13. When the resistance alloy 13 is manganese copper alloy 13, it has low resistivity and low temperature coefficient characteristics.

[0064] It can be understood that since welding is a hot working method, the copper bar 11 will be deformed by heat during welding with the resistance alloy 13. Even if the electron beam welding method is used, the copper bar 11 will still be affected, so that an arc angle is formed between the upper surface of the copper bar 11 and the inner side surface, and a gap is formed between the two. Therefore, the position of the arc angle of the copper bar 11 will produce bubbles when welding with the circuit board 30, and the bubbles will affect the impedance of the shunt body 10, thereby affecting the current detection accuracy of the shunt body 10. Of course, in other embodiments, the upper surface of the copper bar 11 will be directly deformed by heat, so that the circuit board 30 and the upper surface of the copper bar 11 will also have a certain gap, thereby producing a certain amount of bubbles when the circuit board 30 and the upper surface of the copper bar 11 are welded.

[0065] Specifically, in step S10, the shunt body 10 and the circuit board 30 are prepared and pre-assembled. Specifically, step S10 can be: preparing the shunt body 10 and the circuit board 30; fixing the circuit board 30; placing the shunt body 10 on the surface of the circuit board 30 facing the shunt body 10; or: preparing the shunt body 10 and the circuit board 30; fixing the shunt body 10; placing the circuit board 30 on the surface of the shunt body 10 facing the circuit board 30.

[0066] In step S20, the pre-assembled shunt body 10 and the circuit board 30 are placed in a predetermined environment. The predetermined environment can be a vacuum environment and / or a constant temperature environment. In the constant temperature environment, the solder paste used in welding can flow quickly, thereby improving the welding efficiency and effect. In the vacuum environment, some bubbles generated during welding can be eliminated, thereby reducing the bubble rate between the two, reducing the influence of bubbles on the impedance of the shunt 100, and improving the current detection effect of the shunt 100.

[0067] In step S30, while the copper bar 11 of the circuit board 30 and the shunt body 10 is being welded, the two are driven to move close to each other to eliminate the gap between the copper bar 11 of the shunt body 10 and the circuit board 30, so that the shunt body 10 and the circuit board 30 can be tightly attached during welding, thereby reducing the generation of bubbles between the two during welding, reducing the bubble rate between the two, and reducing the influence of bubbles on the impedance of the shunt 100, thereby improving the current detection effect of the shunt 100. The circuit board 30 can be fixed, and the copper bar 11 can be driven to move close to the circuit board 30. At this time, the two can move close to each other and be pressed against each other. The circuit board 30 can also be fixed, and the copper bar 11 can be driven to move close to the circuit board 30. At this time, the two can move close to each other and be pressed against each other. Alternatively, the two can be driven to move close to each other and be pressed against each other. The specific implementation is not limited here and can be selected according to the actual manufacturing scene and the shunt processing equipment 300.

[0068] It can be understood that the reasons for the generation of bubbles between the shunt body 10 and the circuit board 30 during welding include but are not limited to the following two reasons: one reason is that the copper bar 11 of the shunt body 10 has some protruding areas or recessed areas on the surface due to the influence of the existing production process during the production and processing process, which causes the copper bar 11 of the shunt body 10 and the circuit board 30 to not be tightly attached during welding, thereby affecting the generation of bubbles that affect the current detection accuracy of the shunt 100; another reason is that the welding material cannot be uniformly distributed between the shunt body 10 and the circuit board 30 during welding, such as solder that cannot be uniformly distributed between the copper bar 11 of the shunt body 10 and the circuit board 30, which causes the copper bar 11 and the circuit board 30 to not be tightly attached during welding, leaving a gap that causes bubbles that affect the current detection accuracy of the shunt 100. Therefore, the preparation method of the technical solution of the present application prepares the shunt body 10 and the circuit board 30 for pre-assembly, and then places them in a predetermined environment after pre-assembly, and then welds the copper bar 11 of the shunt body 10 and the circuit board 30, which drives them to approach and press each other. In this way, the shunt body 10 and the circuit board 30 can be tightly attached during welding, which can reduce the generation of bubbles in the gap between them during welding, thereby reducing the impact of bubbles on the impedance of the shunt 100, and the technical solution of the present application can effectively improve the current detection accuracy of the shunt 100 without improving the structure of the shunt 100, thereby meeting the high-precision detection requirements of the shunt 100 in the industry.

[0069] Reference Figure 3 In an embodiment of the present application, the step of preparing the shunt body 10 and the circuit board 30 and pre-assembling them is specifically:

[0070] Step S11: Prepare the shunt body 10 and the circuit board 30;

[0071] Step S12: Fix the shunt body 10;

[0072] Step S13: Place the circuit board 30 on the surface of the surface of the fixed shunt body 10.

[0073] In this embodiment, in the industrial pipeline process, the two copper bars 11 and the resistance alloy 13 are welded in the previous process to form the shunt body 10. Therefore, from the previous process to the process of this preparation method, in step S11, the main body in the previous process can be directly transported by the conveying belt, and then the circuit board 30 is placed on the main board. In step S12, the shunt 100 is fixed to ensure that the shunt 100 is stable and does not deviate. In step S13, the circuit board 30 is clamped and placed on the surface of the shunt body 10 facing the circuit board 30. Specifically, the clamping method of the circuit board 30 can be manual clamping, or the circuit board 30 can be clamped by an automatic device, which can be a mechanical hand device 320 or an electric clamp, etc. For example, the clamping and releasing of the circuit board 30 are realized by the mechanical hand device 320 to improve the degree of automation of the workshop, which is not limited here. In this way, the embodiment is convenient to operate and has high automation degree, so as to improve the preparation efficiency of the workshop.

[0074] Referring to Figure 4 In an embodiment of the present application, before the step of preparing the shunt body 10 and the circuit board 30 and pre-assembling the two, it further includes:

[0075] Step S11: obtaining a preset pressing area of the circuit board 30;

[0076] The step of driving the circuit board 30 and the shunt body 10 to approach and extrude each other while welding the surfaces of the circuit board 30 and the shunt body 10 includes:

[0077] Step S31: while welding the surfaces of the circuit board 30 and the shunt body 10, pressing the preset pressing area of the circuit board 30 to make it approach and extrude the copper bar 11 of the shunt body 10.

[0078] In this embodiment, in step S11, the preset pressing area of the circuit board 30 is obtained. In step S31, while welding the surfaces of the circuit board 30 and the shunt body 10, the preset pressing area of the circuit board 30 is pressed to make it approach and extrude the copper bar 11 of the shunt body 10. In this way, the pressing position can be ensured to have a gap between the copper bar 11 and the circuit board 30, the elimination effect of the air bubbles is improved, and during the pressing process, the components on the circuit board 30 can be avoided from being pressed, the components on the circuit board 30 are not damaged, the circuit board 30 is not scrapped during the preparation process, and the preparation cost of the workshop is reduced.

[0079] In an embodiment, the step of driving the circuit board 30 and the shunt body 10 to approach and extrude each other while welding the surfaces of the circuit board 30 and the shunt body 10 includes:

[0080] determining the pressing movement sequence of the shunt body 10 and the circuit board 30;

[0081] While welding the surface of the shunt body 10 and the circuit board 30, the pressing area of the circuit board 30 is pressed according to the pressing movement sequence, so that the pressing area is close to and pressed against the shunt body 10.

[0082] Optionally, the pressing movement sequence of the shunt body 10 and the circuit board 30 is determined; while welding the surface of the shunt body 10 and the circuit board 30, the pressing area of the circuit board 30 is pressed according to the pressing movement sequence, so that the pressing area is close to and pressed against the shunt body 10. Optionally, the pressing movement sequence can be that the copper bar 11 is driven to move close to the circuit board 30, and the two can move close to each other and be pressed against each other at this time. The pressing movement sequence can also be that the circuit board 30 is driven to move close to the copper bar 11, and the two can move close to each other and be pressed against each other at this time. Alternatively, the pressing movement sequence can drive the two to move close to each other and be pressed against each other, which is not limited here and can be selected according to the actual manufacturing scene and the actual shunt processing equipment 300.

[0083] Reference Figure 5 In an embodiment of the present application, the step of obtaining the preset pressing area of the circuit board 30 comprises:

[0084] Step S111: obtaining surface information of the surface of the circuit board 30 facing the shunt body 10;

[0085] Step S112: obtaining the preset pressing area according to the surface information.

[0086] In the embodiment, in step S111, the specific obtaining method can be achieved by the identification device 330 to identify the preset pressing area of the circuit board 30. Specifically, the identification device 330 can be a CCD device (Charge Coupled Device, Charge Coupled Device), which can quickly and accurately identify the surface information of the circuit board 30, or a CMOS (Complementary Metal-Oxide-Semiconductor, Complementary Metal-Oxide-Semiconductor) device, which is not limited here and can be selected according to the actual identification requirements and the actual preparation cost. In step S112, the preset pressing area can be obtained according to the surface information, which can be understood as obtaining the position corresponding to the other surface of the circuit board 30 when the position of the circuit board 30 facing the copper bar 11 is not provided with components. In this way, the preset pressing area can be automatically obtained, which improves the effect of eliminating bubbles and ensures that the circuit board 30 is not damaged during pressing.

[0087] In an embodiment of the present application, the surface information comprises identification information and / or position setting information of the components.

[0088] In the embodiment, the surface information can comprise identification information and / or position setting information of the components, so that the bubble elimination effect can be ensured and the components on the circuit board 30 can be prevented from being damaged. In the embodiment, the surface information can be identification information, or the surface information can be position setting information of the components, or the surface information can be identification information and position setting information of the components, which is not limited herein. The identification information can comprise pad information and white frame information, which is not limited herein.

[0089] In some embodiments, on the surface of the circuit board 30 facing the copper bar 11, pads for welding the copper bar 11 are arranged on opposite sides along the center line of the circuit board 30, and no components are arranged at the two positions. At this time, the two preset pressing areas can be the pad positions on the opposite surfaces of the circuit board 30. Since the position where the bubble is generated is generally the gap between the pad and the circuit board 30, pressing the preset pressing area can ensure the bubble elimination effect and prevent the components on the circuit board 30 from being damaged.

[0090] Further, according to the surface information, the step of obtaining the preset pressing area comprises: determining at least one pressing point according to the surface information;

[0091] determining the priority of the at least one pressing point according to the information type of the surface information;

[0092] determining the pressing area according to the pressing point with the priority in the front.

[0093] Specifically, the at least one pressing point is determined according to the surface information, wherein the pressing point can be a point other than the identification information and / or the position setting information of the components, and the position corresponding to the pressing point has no identification information and components. The priority of the at least one pressing point is determined according to the information type of the surface information, for example, the priority of a pressing point a located at the middle position of the circuit board is the first priority, and the priority of a pressing point b located at the edge position of the circuit board is the second priority. The pressing area is determined according to the pressing point with the priority in the front. Alternatively, the pressing area with a preset position and a preset shape is determined with the pressing point as the center, for example, a square area with a preset side length is determined with the pressing point as the center.

[0094] In an embodiment, the step of pressing the preset pressing area of the circuit board 30 to make it close to and extrude the shunt body 10 while welding the surface of the circuit board 30 facing the shunt body 10 comprises:

[0095] If the position information of the preset pressing area is a preset position of the circuit board, a pressing force change curve corresponding to the pressing area is determined, and the pressing force change curve is decreased with the increase of the pressing time after the preset time point.

[0096] The pressing force and the corresponding pressing time are determined according to the pressing force change curve.

[0097] The pressing area of the circuit board 30 is pressed according to the pressing force and the pressing time while the surfaces of the circuit board 30 and the shunt body 10 are welded.

[0098] Optionally, the position information of the preset pressing area on the circuit board 30 is obtained, and the position information can be a middle position or an edge position of the circuit board.

[0099] Optionally, the preset position can be an edge position of the circuit board 30. Since the pressing area is at the edge position of the circuit board 30, when the pressing area of the circuit board 30 is pressed during welding, uneven stress is easily caused, the corresponding circuit board 30 is heated more, and deformation of the edge area of the circuit board 30 can be caused. Therefore, the pressing force change curve corresponding to the pressing area needs to be determined.

[0100] Optionally, in the pressing force change curve, the pressing force is decreased with the increase of the pressing time after the preset time point. Optionally, in the pressing force change curve, the first pressing force is used to press the pressing area of the circuit board 30 before the preset time point, and the second pressing force is used to press the pressing area of the circuit board 30 after the preset time point, and the first pressing force is greater than the second pressing force.

[0101] In the technical scheme of the embodiment, by determining the pressing force change curve corresponding to the preset pressing area, different shunts 100 are processed, and the pressing force of the circuit board 30 is reduced after a preset time length of welding of the circuit board 30, so that uneven heating of the circuit board 30 when the circuit board 30 is pressed at the preset position is avoided, and deformation of the edge of the circuit board 30 is avoided.

[0102] Reference Figure 6 In an embodiment of the present application, the step of pressing the preset pressing area of the circuit board 30 while the surfaces of the circuit board 30 and the shunt body 10 are welded to make the pressing area close to and press the copper bar 11 includes:

[0103] Step S311: The preset pressing area of the circuit board 30 is pressed by the mechanical hand device 320 while the surfaces of the shunt body 10 and the circuit board 30 are welded to make the pressing area close to and press the shunt body 10.

[0104] In this embodiment, it can be understood that in step S311, by controlling the mechanical arm device 320 to press the preset pressing area of the circuit board 30, the automatic pressing process can be realized, and the preset pressing force and the preset pressing time of the mechanical arm device 320 to the circuit board 30 can be controlled, which can ensure that the circuit board 30 is not damaged and improve the effect of eliminating the bubbles between them. Here, it should be noted that the application does not specifically limit the force value of the preset pressing force of the mechanical arm device 320 to the circuit board 30, and the force value of the preset pressing force can be selected and adjusted according to the actual situation of the circuit board 30; For example, the substrate of the circuit board 30 can be an epoxy glass cloth laminated board, a ceramic substrate or a metal substrate, and different types of substrates of the circuit board 30 can withstand different preset pressing sizes, so the force value of the preset pressing force can be adjusted according to the actual situation of the circuit board 30, as long as it can ensure that the bubbles are pressed and eliminated and the circuit board 30 is not damaged during the pressing process.

[0105] Similarly, the length of the preset pressing time is not specifically limited herein, and can be adjusted according to the actual preparation situation of the workshop. In the actual preparation process, the length of the preset pressing time can be adjusted according to the force value of the preset pressing force. For example, when the force value of the preset pressing force is large, the preset pressing time can be correspondingly reduced to improve the preparation efficiency of the workshop; and when the force value of the preset pressing force is small, the preset pressing time can be correspondingly increased to ensure the elimination effect of the bubbles. In some other examples, the preset pressing time is also affected by the specific welding situation. For example, during the welding process of the diverter body 10 and the circuit board 30, the mechanical arm device 30 needs to avoid moving too fast between pressing and not pressing the circuit board 30, because if the mechanical arm device 30 moves too fast, it will cause a violent impact on the circuit board 30, which will easily cause the molten solder material to splash under the violent impact, for example, the mechanical arm device 30 will cause a violent impact on the molten solder paste, which will have the risk of solder paste splashing, and thus there is a risk of affecting the welding effect and causing harm to the workers in the workshop; Therefore, the preset pressing time can also be adjusted according to the welding situation of the workshop, which is not specifically limited herein.

[0106] In some example embodiments, the mechanical arm device 320 can be used to clamp and press the circuit board 30, and one mechanical arm device 320 can realize two functions, so that the number of devices can be reduced, and the device arrangement space of the workshop can be saved, thereby adapting to various workshop environments.

[0107] In an embodiment, the step of welding the surfaces of the circuit board 30 and the diverter body 10 towards each other while pressing the preset pressing area of the circuit board 30 to make it close to and press the diverter body 10 includes:

[0108] According to the position information of the preset pressing area, the preset pressing force and the preset pressing time are determined.

[0109] While welding the surface of the shunt body 10 and the circuit board 30, according to the preset pressing force and the preset pressing time, the preset pressing area of the circuit board 30 is pressed to make it close to and extrude the shunt body 10.

[0110] Optionally, the pressing device can be a mechanical hand device. Optionally, the position information of different preset pressing areas corresponds to the preset pressing force and the preset pressing time.

[0111] Optionally, the position information of the preset pressing area can be the edge position or the center position of the circuit board.

[0112] Optionally, the preset pressing force and the preset pressing time when the preset pressing area is located at the edge position of the circuit board are smaller than the preset pressing force and the preset pressing time when the preset pressing area is located at the center position of the circuit board. Optionally, the preset pressing force when the preset pressing area is located at the edge position of the circuit board is smaller than the preset pressing force when the preset pressing area is located at the center position of the circuit board, and the preset pressing time when the preset pressing area is located at the edge position of the circuit board is greater than the preset pressing time when the preset pressing area is located at the center position of the circuit board.

[0113] In the technical scheme of the embodiment, according to the position information of the preset pressing area of the circuit board, the preset pressing force and the preset pressing time of the pressing device are determined, and the shunt 100 is prepared according to different preset pressing force and preset pressing time, thereby realizing the diversification of the shunt 100 processed by the shunt processing equipment.

[0114] Referring to Figure 7 In an embodiment of the present application, after the step of driving the circuit board 30 and the shunt body 10 to be close to each other for extrusion while welding the two, the method further comprises:

[0115] Step S40: Vibrate either the circuit board 30 or the shunt body 10 according to preset vibration parameters.

[0116] In the embodiment, since the pressure of the extrusion is substantially perpendicular to the surface of the circuit board 30, the effect of eliminating the bubbles in the direction parallel to the surface of the circuit board 30 is not good. Therefore, in order to further improve the effect of eliminating the bubbles between the circuit board 30 and the copper bar 11 of the shunt body 10, in step S40, the circuit board 30 and the copper bar 11 are shaken according to the preset vibration parameters, which can further eliminate the bubbles on the basis of the extrusion, eliminate the bubbles in the direction parallel to the surface of the circuit board 30, and further improve the effect of eliminating the bubbles between the circuit board 30 and the copper bar 11 of the shunt body 10, thereby further improving the detection accuracy of the shunt 100 to the current.

[0117] Specifically, the shunt body 10 can be shaken according to the preset vibration parameters, for example, a vibration device is arranged in the workbench 310, the shunt body 10 is driven to shake by the vibration device, or the shunt body 10 is driven to shake by the mechanical hand device 320; or the circuit board 30 can be shaken according to the preset vibration parameters, which is not limited here.

[0118] Referring to Figure 8 In an embodiment of the present application, the step of shaking any one of the circuit board 30 and the shunt body 10 according to the preset vibration parameters comprises:

[0119] Step S41: controlling the mechanical hand device 320 to shake any one of the circuit board 30 and the shunt body 10 according to the preset vibration parameters.

[0120] In the embodiment, in step S41, the robot device 320 is controlled to vibrate either the circuit board 30 or the shunt main body 10 according to the preset vibration parameters, so that the robot device 320 can give the circuit board 30 or the shunt main body 10 a preset amplitude and a preset vibration time, thereby achieving the effect of automatic vibration and improving the preparation efficiency and preparation effect. In some exemplary embodiments, the robot device 320 can realize the functions of clamping the circuit board 30, pressing, and vibrating, for example, the robot device 320 clamps the circuit board 30 and places it on the surface of the copper bar 11 of the shunt main body 10, and then controls the robot device 320 to press and vibrate the circuit board 30 to eliminate the bubbles between the copper bar 11 of the shunt main body 10 and the circuit board 30. In this way, the number of devices can be further reduced, the device arrangement space in the workshop can be saved, and the workshop environment can be more adapted to various environments. It should be pointed out that the preset amplitude and the preset vibration time of the robot device 320 are not limited in the present application, and can be adjusted according to the actual bubble elimination effect and the actual preparation process in the workshop. For example, the preset amplitude and the preset vibration time can be set to avoid excessive amplitude and excessive vibration time, thereby ensuring the preparation efficiency of the workshop while avoiding the splashing of the welding material between the shunt main body 10 and the circuit board 30 during the vibration process.

[0121] In an embodiment of the present application, the preset environment includes a vacuum environment and / or a constant temperature environment.

[0122] In the embodiment, the preset environment can be a vacuum environment and / or a constant temperature environment. In the constant temperature environment, the solder paste used during welding can flow quickly to improve the welding efficiency and welding effect. It should be pointed out that the type of solder paste used in the actual preparation process of the shunt main body 10 and the circuit board 30 needs to be selected according to the actual preparation situation, and the melting point of different types of solder paste will be different, therefore, the present application does not limit the specific temperature range of the constant temperature environment, as long as the solder paste can melt to achieve good welding in the constant temperature environment. In some exemplary embodiments, when the melting point of the solder paste is 190℃, the temperature of the constant temperature environment can be selected at a temperature value between 190℃ and 200℃, so that the solder paste can melt during the welding process, and the workshop can continue to prepare and process in the constant temperature environment, thereby improving the preparation efficiency of the workshop, and avoiding the increase of the preparation cost of the workshop due to the high temperature.

[0123] In the vacuum environment, part of the bubbles generated during welding can be eliminated, thereby ensuring the welding effect, reducing the bubble rate between the two, and reducing the influence of the bubbles on the impedance of the shunt 100, so as to improve the detection effect of the shunt 100 on the current. In some examples, the vacuum degree of the vacuum environment is not limited, as long as the vacuum environment can further improve the elimination effect of the bubbles during the preparation process. In some examples, the vacuum environment is prepared under a preset vacuum degree, which can eliminate the bubbles under the influence of the vacuum environment, and the value of the preset vacuum degree is not too large, for example, it does not reach a vacuum environment close to absolute vacuum, so as to avoid increasing the cost of the workshop due to a larger preset vacuum degree. Thus, it can be more suitable for actual preparation in the workshop.

[0124] In some examples, the preset environment includes a vacuum environment and a constant temperature environment, so that the welding efficiency and effect are ensured, and the elimination effect of the bubbles is improved, thereby improving the detection precision of the shunt 100 on the current.

[0125] In some examples, the step of welding the surface of the shunt body 10 and the circuit board 30 includes:

[0126] According to the area size of the pressing area, a target pressing piece matched with the pressing area is determined;

[0127] While welding the surface of the circuit board and the shunt body, the target pressing piece is controlled to press the pressing area of the circuit board.

[0128] Optionally, the pressing device is provided with pressing pieces of different sizes. Optionally, the pressing device is a mechanical hand device. Optionally, the target pressing piece is a pressing piece corresponding to the current pressing area, wherein the larger the area size of the pressing area, the larger the size of the target pressing piece for pressing the circuit board; the smaller the area size of the pressing area, the smaller the size of the target pressing piece for pressing the circuit board.

[0129] Optionally, the area size of the pressing area can be the area of the pressing area, or the length and width of the pressing area.

[0130] Optionally, according to the area size of the pressing area, the pressing force of the target pressing piece is determined; while welding the surface of the shunt body and the circuit board, the target pressing piece is controlled to press the pressing area of the circuit board according to the pressing force.

[0131] Optionally, the pressing area has different sizes, and the target pressing member has different pressing forces corresponding to the sizes; optionally, the greater the size of the pressing area, the greater the pressing force of the target pressing member for pressing the circuit board; the smaller the size of the pressing area, the smaller the pressing force of the target pressing member for pressing the circuit board.

[0132] Optionally, when the size of the pressing area belongs to a preset first size range, a pressing member corresponding to the preset first size range is obtained as the target pressing member; and when the size of the pressing area belongs to a preset second size range, a pressing force corresponding to the preset second size range is obtained.

[0133] In some embodiments, while the surface of the circuit board 30 and the shunt body 10 are being welded, the step of driving the two to be close to each other for extrusion comprises:

[0134] The welding information is obtained and written into the two-dimensional code corresponding to the shunt 100, and the welding information includes at least one of the welding time, the welding temperature and the pressing area;

[0135] The welding detection result of the shunt 100 is obtained; if the yield of the shunt determined according to the welding detection result is less than a preset threshold, the adjustment working parameter of the shunt processing equipment is determined according to the welding detection result and the welding information.

[0136] Specifically, the welding information is obtained and written into the two-dimensional code corresponding to the shunt 100, and the welding information includes at least one of the welding time, the welding temperature and the pressing area, so that the staff can query the welding information in the two-dimensional code subsequently. After the adjustment working parameter of the shunt processing equipment is determined, the shunt processing equipment can be adjusted according to the adjustment working parameter; optionally, the adjustment working parameter is a control parameter of the welding temperature, the pressing area and the welding time. Optionally, the welding detection result can be determined by radiating the welding area with X-rays or by performing a red ink experiment. Optionally, if there are more than a preset number of welding detection results that the edge of the circuit board is deformed, the pressing area for welding needs to be re-determined; if there are more than a preset number of welding detection results that the circuit board is burned during welding, the welding temperature needs to be re-determined.

[0137] Please refer to Figure 1 and Figure 9 The present application also proposes a shunt processing equipment 300, which can be used to implement the preparation method of the shunt 100 in any of the above embodiments, and the shunt processing equipment 300 comprises:

[0138] The first fixing assembly is provided with one of the shunt body 10 and the circuit board 30; and

[0139] The second fixing assembly is provided with the other one of the shunt body 10 and the circuit board 30, and the first fixing assembly and the second fixing assembly are relatively moved to make the circuit board 30 and the shunt body 10 close to and abut each other.

[0140] In the embodiment, the first fixing assembly and the second fixing assembly can be relatively moved in the following manners: the first fixing assembly is fixed, and the second fixing assembly is moved, for example, the first fixing assembly is the workbench 310, and the second fixing assembly is the pressing device; or the second fixing assembly is fixed, and the first fixing assembly is moved, for example, the second fixing assembly is the workbench 310, and the first fixing assembly is the pressing device; or the first fixing assembly and the second fixing assembly are both moved, for example, the first fixing assembly and the second fixing assembly are both the pressing device, which is not limited here. In this way, the circuit board 30 and the copper bar 11 of the shunt body 10 can be made to close to and abut each other to eliminate the bubbles therebetween and reduce the bubble rate therebetween, so that the detection accuracy of the shunt 100 on the current can be improved.

[0141] Optionally, the first fixing assembly is the workbench 310, and the workbench 310 is provided with a processing station for placing one of the copper bar 11 or the circuit board 30;

[0142] The second fixing assembly is the pressing device, which is movably arranged above the processing station and is used for pressing the other one of the shunt body 10 or the circuit board 30 to make the circuit board 30 and the shunt body 10 close to and abut each other.

[0143] In the embodiment, the workbench 310 is provided with the processing station, one of the copper bar 11 or the circuit board 30 is placed on the processing station, and the copper bar 11 and the circuit board 30 are pre-assembled, so that the shunt processing equipment 300 has a preset environment. Therefore, while the circuit board 30 and the copper bar 11 of the shunt body 10 are welded, the pressing device can press the other one of the copper bar 11 or the circuit board 30 to make the circuit board 30 close to and press the copper bar 11. In this way, the pressing device can press the other one of the copper bar 11 or the circuit board 30 to make the circuit board 30 and the shunt body 10 close to and press each other to eliminate the bubbles therebetween and reduce the bubble rate therebetween, so that the detection accuracy of the shunt 100 on the current can be improved.

[0144] The shunt processing equipment 300 further comprises a welding device (not shown in the figure) arranged above the processing station to weld the copper bar 11 of the shunt main body 10 and the circuit board 30. It is explained that the pressing device can be a mechanical arm device 320 or a weight device, and the other of the shunt main body 10 or the circuit board 30 is pressed by the mechanical arm device 320 or the weight device, so that the circuit board 30 and the shunt main body 10 are close to and abut each other, which is not specifically limited here.

[0145] With reference to Figure 9 In an embodiment of the present application, the pressing device is a mechanical arm device 320.

[0146] In this embodiment, it can be understood that when the pressing device is a mechanical arm device 320, the other of the copper bar 11 of the shunt main body 10 or the circuit board 30 can be automatically abutted, thereby improving the automation degree of the shunt processing equipment 300 and improving the production efficiency of the workshop. Specifically, the mechanical arm device 320 can be a multi-axis mechanical arm, thereby realizing the functions of flexible movement and abutting.

[0147] With reference to Figure 9 In an embodiment of the present application, the mechanical arm device 320 is movably arranged above the processing station, and the mechanical arm device 320 is used to press and vibrate the other of the shunt main body 10 or the circuit board 30.

[0148] In this embodiment, it can be understood that the mechanical arm device 320 can simultaneously realize the functions of pressing and vibrating the other of the copper bar 11 of the shunt main body 10 or the circuit board 30, thereby realizing the functions of pressing and vibrating by the mechanical arm device 320. Therefore, the number of devices in the shunt processing equipment 300 can be further reduced, the arrangement space of the shunt processing equipment 300 in the workshop can be saved, and the shunt processing equipment 300 can be more suitable for various workshop environments.

[0149] With reference to Figure 9 In an embodiment of the present application, the shunt processing equipment 300 further comprises an identification device 330 arranged on the second fixing assembly, which is used to identify the surface of the circuit board 30 towards the shunt main body 10 to obtain the surface information of the circuit board 30.

[0150] In the embodiment, the recognition device 330 can be a CCD device (Charge Coupled Device) or a CMOS (Complementary Metal-Oxide-Semiconductor) device, etc. When the recognition device 330 is a CCD device, the surface information of the circuit board 30 can be quickly and accurately recognized. The surface information can be identification information and / or position setting information of the components, etc., which is not specifically limited herein.

[0151] In some exemplary embodiments, the recognition device 330 can be installed on the mechanical arm device 320, so that the accuracy of the mechanical arm device 320 in performing the operations such as clamping, pressing or vibrating can be improved.

[0152] Referring to Figure 9 In an embodiment of the present application, the workbench 310 is a heating platform, which includes a platform body, a heating device and a control device.

[0153] The heating device and the control device are arranged in the interior of the platform body, and the processing station is arranged on the surface of the platform body. The control device is connected to the heating device, so that the heating device can heat one of the shunt body 10 or the circuit board 30 on the processing station.

[0154] In the embodiment, the heating platform can further include a detection device (not shown in the figure). After the temperature of the surface of the platform body is detected by the detection device, the heating temperature of the heating device is adjusted by the control device according to the detected temperature value, so that the surface temperature of the platform body changes. In this way, the heating device can heat one of the shunt body 10 or the circuit board 30 on the processing station in a constant temperature environment, so as to improve the effect and efficiency of welding and realize automatic adjustment.

[0155] Referring to Figure 9 In an embodiment of the present application, the shunt processing equipment 300 further includes a carrier 340, which is placed on the processing station and used to carry one of the shunt body 10 or the circuit board 30. The material of the carrier 340 is a heat-conducting material.

[0156] In the embodiment, the carrier 340 can ensure the carrying and fixing effect of one of the copper bar 11 of the shunt body 10 or the circuit board 30, so as to ensure that the copper bar 11 can be relatively fixed with the circuit board 30 when the mechanical arm device 320 presses the other one of the shunt body 10 or the circuit board 30, and ensure the pressing effect. In addition, the material of the carrier 340 can be a heat-conducting material, such as a metal material or a silica gel material, etc., which is not specifically limited herein.

[0157] Referring toFigure 9 In an embodiment of the present application, the shunt processing device 300 further comprises a vacuum cover (not shown in the figure), which is movably arranged above the processing station and is used to cover the shunt body 10, the circuit board 30 and the pressing device, so that the shunt body 10 and the circuit board 30 are welded in a vacuum environment.

[0158] In the embodiment, when the copper bar 11 of the shunt body 10 is ready to be welded with the circuit board 30, the vacuum cover can cover the copper bar 11, the circuit board 30 and the pressing device, so that the copper bar 11 of the shunt body 10 and the circuit board 30 are welded in a vacuum environment, and the bubbles between the copper bar 11 and the circuit board 30 will be broken due to the vacuum environment when welding, so that some bubbles between the copper bar 11 and the circuit board 30 can be eliminated, thereby improving the detection accuracy of the shunt 100 to the current.

[0159] In addition, the present application also provides an industrial assembly line (not shown in the figure), which comprises the shunt processing device 300 as described above.

[0160] It should be noted that the detailed structure of the shunt processing device 300 can refer to the above-mentioned embodiments of the shunt processing device 300, which will not be described here; since the above-mentioned shunt processing device 300 is used in the industrial assembly line of the present application, the embodiments of the shunt processing device 300 of the present application include all the technical solutions of all the embodiments of the above-mentioned shunt processing device 300, and the technical effects achieved are also completely the same, which will not be described here.

[0161] The above-mentioned is only the preferred embodiment of the present application, which does not limit the patent scope of the present application, and any equivalent structural transformation made according to the content of the present application specification and drawings, or direct / indirect application in other related technical fields under the inventive concept of the present application are included in the patent protection scope of the present application.

Claims

1. A method of preparing a shunt, characterized in that, The shunt comprises a shunt body and a circuit board, and the preparation method of the shunt comprises the following steps: preparing the shunt body and the circuit board and pre-assembling them; Before the step of preparing the shunt body and the circuit board and pre-assembling them, further comprising: acquiring a preset pressing area of the circuit board; The step of acquiring the preset pressing area of the circuit board comprises: acquiring surface information of a surface of the circuit board facing the shunt body; According to the surface information, the preset pressing area is acquired; The surface information comprises identification information and / or position setting information of components and elements; The pre-assembled shunt body and the circuit board are placed in a preset environment, which is a vacuum environment and a constant temperature environment; While welding the surfaces of the circuit board and the shunt body facing each other, the two are driven to approach and extrude each other; The step of driving the circuit board and the shunt body to approach and extrude each other while welding the surfaces of the two facing each other comprises: While welding the surfaces of the circuit board and the shunt body facing each other, the preset pressing area of the circuit board is pressed to make it approach and extrude the shunt body.

2. The method of claim 1, wherein the shunt is prepared by, The step of preparing the shunt body and the circuit board and pre-assembling them specifically comprises: preparing the shunt body and the circuit board; fixing the shunt body; placing the circuit board on the surface of the shunt body away from the fixed surface.

3. The method of preparing a shunt according to any one of claims 1 to 2, wherein, After the step of driving the circuit board and the shunt body to approach and extrude each other while welding the surfaces of the two facing each other, further comprising: vibrating either of the circuit board and the shunt body according to preset vibration parameters.

4. A shunt processing apparatus characterized by, The preparation method of the shunt according to any one of claims 1 to 3, wherein the shunt comprises a shunt body and a circuit board, the circuit board is arranged on a welding surface of the shunt body, and the shunt processing device comprises: a first fixing assembly, which is provided with one of the shunt body and the circuit board; and a second fixing assembly, which is provided with the other of the shunt body and the circuit board, and the first fixing assembly and the second fixing assembly are relatively moved to make the circuit board and the shunt body approach and abut each other.

5. The shunt processing apparatus of claim 4, wherein, The first fixing assembly is a workbench, and a processing station for placing one of the shunt body and the circuit board is arranged on a surface of the workbench; The second fixing assembly is a pressing device, which is movably arranged above the processing station and is used for pressing the other of the shunt body and the circuit board to make the circuit board and the shunt body approach and abut each other.

6. The shunt processing apparatus of claim 5, wherein, The pressing device is a mechanical hand device.

7. The splitter processing apparatus of claim 6, wherein, The mechanical hand device is movably arranged above the processing station, and is used for pressing and vibrating the other of the shunt body and the circuit board.

8. The shunt processing apparatus of any one of claims 5 to 7, wherein, The processing equipment further comprises an identification device arranged on the second fixing assembly, which is used to identify the surface of the circuit board towards the shunt body, so as to obtain the surface information of the circuit board. Furthermore, the workbench is a heating platform, which comprises a platform body, a heating device and a control device. The heating device and the control device are arranged in the interior of the platform body, and the processing station is arranged on the surface of the platform body. The control device is connected to the heating device, so that the heating device heats one of the shunt body and the circuit board of the processing station.

9. An industrial pipeline, characterized in that, The shunt processing equipment according to any one of claims 4 to 8.

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