A sputtering device for experiments

Abstract

The application relates to the technical field of electroplating, in particular to a spraying device for experiments, which comprises a supporting cover plate, a plating groove is formed in the supporting cover plate, a workpiece to be plated is placed on the plating groove with an electroplating surface downward, a water distribution plate is hung on the lower surface of the supporting cover plate, a mounting seat is arranged on the water distribution plate, a positive plate is arranged on the upper surface of the mounting seat, a cathode conductive needle which is in contact with the electroplating surface of the workpiece to be plated is arranged on the mounting seat, a liquid spraying pipe is inserted into the positive plate, the liquid spraying pipe is hollow, the upper end of the liquid spraying pipe is directed to the electroplating surface of the workpiece to be plated, the lower end of the liquid spraying pipe is threadedly connected with the mounting seat after penetrating through the positive plate, a stopper or a stopper protrusion which limits the positive plate is arranged on the surface of the liquid spraying pipe, a threaded through hole which is in communication with the inner cavity of the liquid spraying pipe is formed in the mounting seat, a water distribution hole which is in communication with the threaded through hole is formed in the water distribution plate, and a liquid inlet pipe is connected with the water distribution hole, so that the liquid spraying pipe sprays electroplating liquid to the workpiece to be plated.

Description

An experimental spray coating device Technical Field

[0001] This invention relates to the field of electroplating technology, and more particularly to an experimental spray plating apparatus. Background Technology

[0002] Electroplating is a traditional and mature surface processing technology that is widely used in integrated circuit technology. It is a process of depositing a thin layer of other metals or alloys onto the surface of certain metals using the principle of electrolysis. It is a process that uses electrolysis to attach a metal film to the surface of metal or other material parts, thereby preventing metal oxidation, improving wear resistance, conductivity, reflectivity, corrosion resistance, and enhancing aesthetics.

[0003] Horizontal spray plating is an electroplating method in which the workpiece is parallel to the plating solution level. The plating tank contains an anode and a cathode, and a conductive needle connects the cathode of the power supply to the plating area of ​​the workpiece. The plating solution is then sprayed onto the workpiece to achieve localized plating. Due to limitations of the experimental environment and structural requirements, the anode, cathode, and spray pipe are installed within the plating tank, making these components susceptible to contamination by the plating solution. Regular disassembly and maintenance are necessary, resulting in inconvenient operation, high maintenance difficulty, and high costs. Summary of the Invention

[0004] Based on the above problems, the purpose of this invention is to provide an experimental electroplating device that reduces the difficulty of disassembling and assembling the anode and cathode connection structures and the spray pipe components, thereby meeting the needs of experimental electroplating.

[0005] To achieve the above objectives, the present invention adopts the following technical solution:

[0006] An experimental electroplating apparatus includes a support cover plate with a plating tank opening. A workpiece to be plated is placed on the plating tank opening with its electroplating surface facing down. A water distribution plate is suspended on the lower surface of the support cover plate. A mounting base is provided on the water distribution plate. An anode plate is provided on the upper surface of the mounting base, and a cathode conductive needle extends from the mounting base to contact the electroplating surface of the workpiece. A spray pipe is inserted into the anode plate. The spray pipe is hollow, with its upper end facing the electroplating surface of the workpiece. The lower end of the spray pipe passes through the anode plate and is threadedly connected to the mounting base. The surface of the spray pipe is provided with a stop or stop protrusion to limit the anode plate's movement. A threaded through hole communicating with the inner cavity of the spray pipe is provided on the mounting base. A water distribution hole communicating with the threaded through hole is provided on the water distribution plate. An inlet pipe is connected to the water distribution hole, allowing the spray pipe to spray electroplating solution onto the workpiece.

[0007] Optionally, the inner cavity of the spray pipe is in the shape of an internal hexagon that is easy to screw in, and the spray pipe can be removed from the plating tank opening. When the spray pipe is removed, the upper limit of the anode plate is disabled, and the anode plate and the cathode conductive needle can also be removed from the plating tank opening.

[0008] Optionally, the cathode conductive needle passes through the anode plate, and the anode plate is insulated from the cathode conductive needle.

[0009] Optionally, a groove is provided on the surface of the mounting base that contacts the anode plate, and a travel block is provided on the surface of the cathode conductive needle and located in the groove. A spring is sandwiched between the travel block and the bottom surface of the groove, so that the cathode conductive needle can float up and down relative to the mounting base, and the anode plate limits the upper travel of the travel block.

[0010] Optionally, a baffle plate surrounding the water distribution plate and the mounting base is provided on the lower surface of the support cover plate. An anode terminal, a cathode terminal and a liquid inlet are provided on the support cover plate and outside the baffle plate. The anode terminal is connected to the anode plate by a wire, the cathode terminal is connected to the cathode conductive needle by a wire, and the liquid inlet pipe extends out from the liquid inlet.

[0011] Optionally, the support cover plate has multiple plating tank openings and correspondingly provides multiple sets of mounting seats, anode plates, spray pipes and cathode conductive needles. The water distribution plate is provided with multiple water distribution holes corresponding to each mounting seat, and the liquid inlet pipe connected to each water distribution hole is connected to the main pipe of the electroplating solution.

[0012] Optionally, each mounting base has multiple spray tubes arranged on it, with the cathode conductive needle inserted through the center of the mounting base.

[0013] Optionally, a rubber ring is provided on the outer ring of the plating tank opening, and the upper surface of the workpiece to be plated is pressurized by a top pressure component to make the workpiece to be plated contact and seal with the rubber ring.

[0014] Optionally, an overflow port is provided on the support cover plate and on the outer ring of the rubber ring.

[0015] Optionally, a height adjustment plate is provided on the lower surface of the support cover. The water distribution plate and the height adjustment plate are connected by bolts. The length of the height adjustment plate is adjustable, so that the distance between the anode plate and the spray pipe and the workpiece to be plated is adjustable.

[0016] In summary, compared with the prior art, the experimental spraying device has the following advantages:

[0017] 1) The structure is compact and occupies little space, meeting the requirements for experimental use;

[0018] 2) The structure of sequentially limiting the liquid spray pipe, anode plate, and cathode conductive needle ensures reliable fixation while also enabling convenient disassembly and assembly for easy maintenance;

[0019] 3) The spray pipe, anode, and cathode components are well protected, effectively preventing contamination by the plating solution;

[0020] 4) High coating quality and low maintenance cost. Attached Figure Description

[0021] Figure 1 is a schematic diagram of the experimental spraying device provided in an embodiment of the present invention;

[0022] Figure 2 is an enlarged view of point A in Figure 1.

[0023] In the picture:

[0024] 1. Support cover plate; 2. Plating tank opening; 3. Rubber ring; 4. Overflow port; 5. Water distribution plate; 6. Mounting base; 7. Anode plate; 8. Cathode conductive needle; 9. Spray pipe; 10. Threaded through hole; 11. Water distribution hole; 12. Liquid inlet pipe; 13. Groove; 14. Stroke block; 15. Spring; 16. Water baffle; 17. Cathode terminal; 18. Liquid inlet; 19. Height adjustment plate; 20. Electroplating solution main pipe; 21. Workpiece to be plated. Detailed Implementation

[0025] Embodiments of the present invention are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar components or components having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain the present invention, and should not be construed as limiting the present invention.

[0026] In the description of this invention, unless otherwise explicitly specified and limited, the terms "connected," "linked," and "fixed" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, a mechanical connection, an electrical connection, or an indirect connection via an intermediate medium. They can also refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0027] In the description of this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature being directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature being directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature. The technical solutions of this invention will be further described below with reference to the accompanying drawings and specific embodiments.

[0028] Please refer to Figures 1 and 2. This preferred embodiment provides an experimental electroplating apparatus, including a support cover plate 1 with a plating tank opening 2. The workpiece 21 to be plated is placed on the plating tank opening 2 with the electroplating surface facing down. Specifically, a rubber ring 3 is provided around the outer ring of the plating tank opening 2. The upper surface of the workpiece 21 to be plated is pressed by a pressing component, preferably a cylinder, so that the workpiece 21 to be plated contacts and seals with the rubber ring 3. Further, an overflow port 4 is provided on the support cover plate 1 and located around the outer ring 3 to collect any small amount of overflowing electroplating solution.

[0029] A water distribution plate 5 is suspended on the lower surface of the support cover plate 1. A mounting base 6 is provided on the water distribution plate 5. An anode plate 7 is provided on the upper surface of the mounting base 6. A cathode conductive needle 8 extends from the mounting base 6 and contacts the electroplating surface of the workpiece 21 to be plated. A spray pipe 9 is inserted into the anode plate 7. The spray pipe 9 is hollow and its upper end faces the electroplating surface of the workpiece 21 to be plated. The lower end of the spray pipe 9 passes through the anode plate 7 and is threadedly connected to the mounting base 6. A stop or stop protrusion is provided on the surface of the spray pipe 9 to limit the anode plate 7. A threaded through hole 10 communicating with the inner cavity of the spray pipe 9 is provided on the mounting base 6. A water distribution hole 11 communicating with the threaded through hole 10 is provided on the water distribution plate 5. A liquid inlet pipe 12 is connected to the water distribution hole 11 so that the spray pipe 9 sprays electroplating liquid onto the workpiece 21 to be plated.

[0030] It is worth mentioning that the inner cavity of the spray pipe 9 is in the shape of an internal hexagon that is easy to screw in. Therefore, the spray pipe 9 can be easily removed from the plating tank opening 2 with a hex wrench. After the spray pipe 9 is removed, the upper limit of the anode plate 7 is disabled, and the anode plate 7 and the cathode conductive needle 8 can also be removed from the plating tank opening 2.

[0031] It should be noted that the mounting base 6 is made of insulating plastic, the cathode conductive needle 8 passes through the anode plate 7, the anode plate 7 and the cathode conductive needle 8 are insulated from each other, while the spray pipe 9 can make conductive contact with the anode plate 7.

[0032] Specifically, as shown in Figure 2, a groove 13 is provided on the surface of the mounting base 6 that contacts the anode plate 7. A travel block 14 is provided on the surface of the cathode conductive needle 8 and located in the groove 13. A spring 15 is sandwiched between the travel block 14 and the bottom surface of the groove 13, so that the cathode conductive needle 8 can float up and down relative to the mounting base 6. The anode plate 7 limits the upper travel of the travel block 14 so that the cathode conductive needle 8 can flexibly contact the workpiece 21 to be plated, adapting to changes in the anode-cathode spacing.

[0033] Specifically, a baffle plate 16 is provided on the lower surface of the support cover plate 1 to surround the water distribution plate 5 and the mounting base 6. An anode terminal, a cathode terminal 17 and a liquid inlet 18 are provided on the support cover plate 1 and located outside the baffle plate 16. The anode terminal is connected to the anode plate 7 by a wire, and the cathode terminal 17 is connected to the cathode conductive needle 8 by a wire. The liquid inlet pipe 12 passes through the liquid inlet 18 to improve the protection of the anode and cathode related components.

[0034] Based on the above, the support cover plate 1 has multiple plating tank openings 2, and correspondingly provides multiple sets of mounting seats 6, anode plates 7, spray pipes 9, and cathode conductive needles 8. The water distribution plate 5 has multiple water distribution holes 11 corresponding to each mounting seat 6. Each water distribution hole 11 is connected to an inlet pipe 12 that is connected to the main electroplating solution pipe 20. Furthermore, multiple spray pipes 9 are arranged on each mounting seat 6, and the cathode conductive needles 8 are inserted through the center of the mounting seat 6. Thus, high-quality plating can be performed on multiple workpieces within a limited space.

[0035] In addition, a height adjustment plate 19 is provided on the lower surface of the support cover plate 1. The water distribution plate 5 is connected to the height adjustment plate 19 by bolts. The length of the height adjustment plate 19 is adjustable, so that the distance between the anode plate 7 and the spray pipe 9 and the workpiece 21 to be plated is adjustable, and the distance between the cathode and the anode can be adjusted as needed.

[0036] In summary, the above-mentioned experimental spraying device has a compact structure, occupies little space, and meets the experimental requirements; the structure of sequentially limiting the spraying pipe, anode plate, and cathode conductive needle ensures reliable fixation while allowing for convenient disassembly and assembly, and easy maintenance; the spraying pipe, anode, and cathode components have good protection, effectively avoiding contamination by the plating solution; the plating quality is high, and the maintenance cost is low.

[0037] The above embodiments merely illustrate the basic principles and characteristics of the present invention. The present invention is not limited to the above embodiments. Various changes and modifications can be made to the present invention without departing from its spirit and scope, and all such changes and modifications fall within the scope of the present invention as claimed. The scope of protection of the present invention is defined by the appended claims and their equivalents.

Claims

1. An experimental spray coating apparatus, characterized in that, The system includes a support cover plate (1), on which a plating tank opening (2) is provided. The workpiece (21) to be plated is placed on the plating tank opening (2) with the plating surface facing down. A water distribution plate (5) is suspended on the lower surface of the support cover plate (1). A mounting base (6) is provided on the water distribution plate (5). An anode plate (7) is provided on the upper surface of the mounting base (6), and a cathode conductive needle (8) protrudes from the mounting base (6) to contact the plating surface of the workpiece (21). A spray pipe (9) is inserted into the anode plate (7). The spray pipe (9) is hollow, and the spray pipe (9) has a hollow core. The upper end faces the electroplating surface of the workpiece (21) to be plated. The lower end of the spray pipe (9) passes through the anode plate (7) and is threadedly connected to the mounting base (6). The surface of the spray pipe (9) is provided with a stop or stop protrusion that limits the anode plate (7). The mounting base (6) has a threaded through hole (10) that communicates with the inner cavity of the spray pipe (9). The water distribution plate (5) has a water distribution hole (11) that communicates with the threaded through hole (10). The water distribution hole (11) is connected to an inlet pipe (12) so that the spray pipe (9) sprays electroplating liquid onto the workpiece (21) to be plated.

2. The experimental spraying apparatus according to claim 1, characterized in that, The inner cavity of the spray pipe (9) is in the shape of an internal hexagon that is easy to twist, and the spray pipe (9) can be taken out from the plating tank opening (2). When the spray pipe (9) is taken out, the upper limit of the anode plate (7) is disabled, and the anode plate (7) and the cathode conductive needle (8) can also be taken out from the plating tank opening (2).

3. The experimental spraying apparatus according to claim 1, characterized in that, The cathode conductive needle (8) passes through the anode plate (7), and the anode plate (7) is insulated from the cathode conductive needle (8).

4. The experimental spraying apparatus according to claim 3, characterized in that, A groove (13) is provided on the surface of the mounting base (6) that contacts the anode plate (7). A travel block (14) is provided on the surface of the cathode conductive needle (8) and located in the groove (13). A spring (15) is sandwiched between the travel block (14) and the bottom surface of the groove (13), so that the cathode conductive needle (8) can float up and down relative to the mounting base (6). The anode plate (7) limits the upper travel of the travel block (14).

5. The experimental spraying apparatus according to claim 1, characterized in that, A baffle plate (16) is provided on the lower surface of the support cover plate (1) to surround the water distribution plate (5) and the mounting base (6). An anode terminal, a cathode terminal (17) and a liquid inlet (18) are provided on the support cover plate (1) and outside the baffle plate (16). The anode terminal is connected to the anode plate (7) by a wire, the cathode terminal (17) is connected to the cathode conductive needle (8) by a wire, and the liquid inlet pipe (12) extends out from the liquid inlet (18).

6. The experimental spraying apparatus according to claim 1, characterized in that, The support cover plate (1) has multiple plating tank openings (2) and is provided with multiple sets of mounting seats (6), anode plates (7), spray pipes (9) and cathode conductive needles (8). The water distribution plate (5) is provided with multiple water distribution holes (11) corresponding to each mounting seat (6). Each water distribution hole (11) is connected to an inlet pipe (12) which is connected to the main pipe (20) of the electroplating solution.

7. The experimental spraying apparatus according to claim 6, characterized in that, Each of the mounting bases (6) is provided with a plurality of spray pipes (9), and the cathode conductive needle (8) is inserted through the center of the mounting base (6).

8. The experimental spraying apparatus according to claim 1, characterized in that, The outer ring of the plating groove (2) is provided with a rubber ring (3), and the upper surface of the workpiece (21) to be plated is pressed by a top pressure component so that the workpiece (21) to be plated contacts and seals with the rubber ring (3).

9. The experimental spraying apparatus according to claim 8, characterized in that, An overflow port (4) is provided on the support cover plate (1) and on the outer ring of the rubber ring (3).

10. The experimental spraying apparatus according to claim 1, characterized in that, A height adjustment plate (19) is provided on the lower surface of the support cover plate (1). The water distribution plate (5) is connected to the height adjustment plate (19) by bolts. The length of the height adjustment plate (19) is adjustable, so that the distance between the anode plate (7) and the spray pipe (9) and the workpiece (21) to be plated is adjustable.

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