A temperature decoupled pressure measurement method and flexible thin film pressure sensor

Abstract

The application discloses a temperature decoupling-based pressure measurement method and a flexible thin film pressure sensor. The pressure measurement method comprises the following steps: pressure measurement is performed by using the flexible thin film pressure sensor, the flexible thin film pressure sensor comprises a first base body, a second base body, a first electrode and a second electrode, at least one temperature measuring metal wire is embedded in the first base body and the second base body respectively, the overall temperature of the first base body and the second base body is detected in real time by using the temperature measuring metal wire to form a temperature value, and the measurement value of the flexible thin film pressure sensor is corrected by using the temperature value to form an actual pressure value. The temperature measuring metal wire can detect the temperature of the flexible thin film pressure sensor in real time, the pressure value of the flexible thin film pressure sensor is corrected based on the temperature value to obtain the actual pressure value, and then the pressure and the temperature are decoupled, so that the pressure value accuracy of the flexible thin film pressure sensor is greatly improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of flexible thin film pressure sensor, and particularly relates to a pressure measurement method based on temperature decoupling and a flexible thin film pressure sensor. BACKGROUND

[0002] Wearable technology has potential application value in health care, human-computer interaction and Internet of Things, and flexible thin film pressure sensors are an important part of wearable devices. An ideal flexible thin film pressure sensor should have high sensitivity, high linearity, a wide pressure response range, and high measurement stability. Building a certain surface microstructure can improve the sensitivity of the sensor, but the structural hardening of soft materials under pressure makes the response of the sensor gradually saturated, resulting in a relatively narrow sensing range and a significant nonlinear response.

[0003] The connection between traditional objects often uses adhesives such as glue or simple suction cup structures. Once placed in a humid environment or an environment with a lot of dust, the adhesion effect will be greatly reduced, and existing adhesives are often affected by factors such as temperature and shelf life. The existing flexible thin film pressure sensor is affected by temperature and will deform, resulting in inaccurate pressure values detected by the pressure sensor.

[0004] For example, Comparative Document 1: Chinese Patent No. CN108784670B discloses a flexible adsorption device and a manufacturing method thereof. The device is adsorbed and fixed on the surface of a living body through multiple suction cups, and the materials of the multiple suction cups, multiple support parts and flexible substrate of the device are flexible materials. The manufacturing method, the flexible adsorption device manufactured has strong adsorption, good heat dissipation effect, can be used multiple times, has a wide range of applications, and is non-toxic and harmless to living organisms. However, the adsorption structure is exposed to the air, and the adsorption force of the suction cup structure is easily affected by external environmental factors, which is not suitable for stable adsorption of any material, and the manufacturing process is relatively complex.

[0005] For example, Comparative Document 2: Chinese Patent No. CN112415856A discloses a flexible adsorption device and a photolithography equipment. The device includes a moving module and two flexible support members arranged at opposite ends of the moving module, and a vacuum adsorption cavity is arranged in the flexible support member to achieve vacuum adsorption of the adsorbed member. For adsorbed members with greater rigidity than the flexible support member, the adsorption effect is still effective, but for adsorbed members with smaller rigidity, the adsorption effect will be affected, and a vacuum pump is required, which is difficult to use on micro devices.

[0006] For example, the contrast file 3: the Chinese patent with the publication number CN113752246A discloses a heavy load precision flexible adsorption manipulator, but the structure it shows is through the base installation cylinder cooperates with the adsorption plate and other structures, realizes the function of heavy load precision adsorption, but its structure needs large space for the micro device, the structure is complex, the cost is high, and it cannot meet the requirements of micro flexible device adsorption.

[0007] For example, the contrast file 4: the Energy and Power Engineering College of Nanjing University of Science and Technology studies a mechanism for drag reduction through a bottom concave structure. At subsonic speed, the bottom concave structure replaces the original solid bottom surface, thereby changing the formation position, shape and strength of the tail vortex, ultimately increasing the bottom pressure and reducing the drag. At transonic speed, the solid bottom surface has the same effect as the fluid boundary surface, so the bottom concave structure no longer has a drag reduction effect. At supersonic speed, the fluid in the bottom concave structure adds mass to the bottom recirculation zone, thereby achieving drag reduction. However, this method is aimed at the drag reduction effect of the concave cavity during projectile motion, and cannot complete the adsorption function of the concave cavity.

[0008] For example, the contrast file 5: the Chinese patent with the publication number CN201811073426.4 proposes a flexible pressure and temperature integrated thin film array sensor sensitive element and preparation method, but the pressure and temperature changes are mutual influencing factors, which can be detected simultaneously but not decoupled.

[0009] For example, the contrast file 6: the Chinese patent with the publication number CN202210300789.7 proposes a method for simultaneous detection of pressure and temperature based on gel, but cannot distinguish the independent changes of pressure and temperature.

[0010] For example, the contrast file 7: the Chinese patent with the publication number CN202210827469.7 proposes a metal-based pressure and temperature sensor on an alumina-silica substrate by magnetron sputtering, wherein the flexibility is for alumina inorganic material, not for organic polymer material, and mainly focuses on the application of high-temperature materials, without elaborating the coupling or decoupling of pressure and temperature.

[0011] In summary, since the existing flexible thin film pressure sensor is affected by temperature and will deform, resulting in inaccurate pressure value detected by the pressure sensor, therefore, there is an urgent need for a pressure value measurement optimization method that is not affected by sensor deformation or strain when the flexible thin film pressure sensor is working, to improve the accuracy of the flexible thin film pressure sensor. SUMMARY

[0012] The main purpose of the present application is to provide a pressure measurement method based on temperature decoupling and a flexible thin film pressure sensor, aiming to solve the technical problem of inaccurate pressure value detected by the flexible thin film pressure sensor due to temperature influence in the prior art.

[0013] To achieve the above object, the application provides a pressure measurement method based on temperature decoupling, which utilizes a flexible thin film pressure sensor to measure pressure, wherein the flexible thin film pressure sensor comprises a first base, a second base, a first electrode and a second electrode; the plate surfaces of the first base and the second base are parallel to each other, a plurality of first arc-shaped protrusions are uniformly and spacedly arranged on the side of the first base close to the second base, a plurality of second arc-shaped protrusions are uniformly and spacedly arranged on the side of the second base close to the first base, and each second arc-shaped protrusion is located between two adjacent first arc-shaped protrusions; the first electrode covers the side of the first base away from the first arc-shaped protrusions; the second electrode covers the outer wall of the second base on the side provided with the second arc-shaped protrusions and the outer wall of each second arc-shaped protrusion; the first base and the second base are sealingly connected around to form a receiving space for receiving the first arc-shaped protrusions and the second arc-shaped protrusions between the first base and the second base; at least one temperature measuring metal wire is embedded in the first base and the second base, respectively.

[0014] The pressure measurement method comprises the following steps.

[0015] The temperature measuring metal wire is utilized to detect the overall temperature of the first base and the second base in real time to form a temperature value.

[0016] The temperature value is utilized to correct the measurement value of the flexible thin film pressure sensor to form an actual pressure value.

[0017] Preferably, the temperature value is formed by detecting the overall temperature of the first base and the second base in real time by the temperature measuring metal wire in the following manner.

[0018] T=aX 4 +bX 3 +cX 2 +dX+f

[0019] wherein T is the temperature value, X is the measured resistance value of the metal wire, a to f are calibration fitting coefficients respectively, and the value range is [-20, 20] and the dimensionless.

[0020] Preferably, the actual pressure value is formed by correcting the measurement value of the flexible thin film pressure sensor by the temperature value in the following manner.

[0021] C x =kT / (2πEC)

[0022] wherein C xThe actual measurement value of the flexible thin film pressure sensor after the correction of the capacitive reactance; E is the frequency of the test signal, and the range is set to [20 Hz, 50 Hz]; C is the real-time capacitance value between the first electrode and the second electrode, and the range is [0.1 mu F, 1 mu F]; k is the correction coefficient, when T>0 ℃, k=0.994, when T≤0 ℃, k=1.07.

[0023] In order to achieve the above object, the application further provides a flexible thin film pressure sensor applying the pressure measuring method described in any one of the above. The flexible thin film pressure sensor comprises a first base, a second base, a first electrode and a second electrode. The plate surfaces of the first base and the second base are parallel to each other. A plurality of first arc-shaped protrusions are uniformly and spacedly arranged on the side of the first base close to the second base. A plurality of second arc-shaped protrusions are uniformly and spacedly arranged on the side of the second base close to the first base, and each second arc-shaped protrusion is located between two adjacent first arc-shaped protrusions. The first electrode covers the side of the first base away from the first arc-shaped protrusions. The second electrode covers the outer wall of the second base on the side provided with the second arc-shaped protrusions and the outer wall of each second arc-shaped protrusion. The first base and the second base are sealingly connected around to form a containing space for containing the first arc-shaped protrusions and the second arc-shaped protrusions between the first base and the second base. At least one temperature measuring metal wire is embedded in the first base and the second base respectively.

[0024] Preferably, the side of each first arc-shaped protrusion away from the first base is uniformly and spacedly provided with a plurality of columns, the extension direction of each column is perpendicular to the first base, and the length of each column is equal.

[0025] Preferably, the side of the second base away from the second arc-shaped protrusions is spacedly provided with a plurality of recessed holes.

[0026] Preferably, the aperture of each recessed hole is between [1 mu m, 100 mu m], and the spacing between every two adjacent recessed holes is between [1 mu m, 100 mu m].

[0027] Preferably, each temperature measuring metal wire in the first base is a smooth curve parallel to the extension direction of the first base, and each temperature measuring metal wire in the second base is a smooth curve parallel to the extension direction of the first base.

[0028] Preferably, the single diameter of each temperature measuring metal wire in the first base is less than or equal to 1 mm, and the number is less than or equal to 10 per square centimeter; the single diameter of each temperature measuring metal wire in the second base is less than or equal to 1 mm, and the number is less than or equal to 10 per square centimeter.

[0029] Preferably, the material of the temperature measuring wire is one of platinum, gold, silver, iron, nickel, palladium, rhodium, iridium, platinum-gold alloy, gold-silver alloy, iron-nickel alloy, palladium-rhodium alloy, rhodium-iridium alloy, platinum-silver alloy, platinum-iron alloy, gold-palladium alloy, silver-palladium alloy and palladium-iridium alloy.

[0030] In the technical scheme of the present application:

[0031] I. The structural design of the first arc-shaped protrusion and the second arc-shaped protrusion can effectively increase the sensitivity and dynamic range of the flexible thin film pressure sensor, and reduce the drift and noise of the capacitance value.

[0032] II. The design of the temperature measuring wire can realize temperature monitoring and compensation of the flexible thin film pressure sensor, and also can be used as a connecting line between electrodes, thereby simplifying the manufacturing process and connection mode of the flexible thin film pressure sensor.

[0033] III. By arranging the temperature measuring wire on the first base body and the second base body, the temperature of the flexible thin film pressure sensor can be detected in real time, and a temperature value is formed. Based on the temperature value, the pressure value of the flexible thin film pressure sensor is corrected to obtain an actual pressure value, thereby realizing pressure and temperature decoupling, avoiding the influence of temperature on the accuracy of the pressure value of the flexible thin film pressure sensor, greatly improving the pressure value accuracy of the flexible thin film pressure sensor, and making up for the defects of the prior art, which is helpful to realize the wide application of the wearable flexible device measurement optimization method of adsorption enhancement and temperature decoupling. BRIEF DESCRIPTION OF DRAWINGS

[0034] In order to more clearly illustrate the technical scheme in the embodiments of the present application or the prior art, the drawings needed to be used in the embodiments or the prior art description will be briefly introduced below. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative labor based on the drawings shown.

[0035] Figure 1 It is a schematic diagram of the overall structure of the present application.

[0036] Figure 2 It is a schematic diagram of the first base body and the temperature measuring wire arranged on the first base body of the present application.

[0037] Figure 3 It is a schematic diagram of the second base body and the second arc-shaped protrusion of the present application.

[0038] Figure 4 It is a schematic diagram of the second base body and the temperature measuring wire arranged on the second base body of the present application.

[0039] EXPLANATION OF REFERENCE NUMBERS:

[0040] 1, first base; 2, second base; 3, column; 4, concave hole; 5, first arc-shaped protrusion; 6, second arc-shaped protrusion; 7, temperature measuring metal wire.

[0041] The object, features and advantages of the present application will be further illustrated in conjunction with the embodiments, with reference to the accompanying drawings. DETAILED DESCRIPTION

[0042] The technical solutions in the embodiments of the present application will be described clearly and completely below with reference to the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments of the present application. Based on the embodiments in the present application, all the other embodiments obtained by those skilled in the art without creative work fall within the scope of protection of the present application.

[0043] It should be understood that the specific embodiments described herein are merely intended to explain the present application, and are not intended to limit the present application.

[0044] In the following description, the suffix used for an element such as "module", "part", or "unit" is merely intended for facilitating explanation of the present application, and it does not have a specific meaning by itself. Thus, "module", "part", or "unit" can be mixedly used.

[0045] In addition, the technical solutions among the various embodiments of the present application can be combined with each other, but it must be based on the fact that a person skilled in the art can realize it, and when the combination of technical solutions appears contradictory or unachievable, it should be considered that the combination of technical solutions does not exist, and is also not within the scope of protection required by the present application.

[0046] Please refer to Figures 1 to 4To achieve the above object, the first embodiment of the pressure measurement method based on temperature decoupling provided by the application uses a flexible thin film pressure sensor, which comprises a first base 1, a second base 2, a first electrode and a second electrode; the plate surfaces of the first base 1 and the second base 2 are parallel to each other, a plurality of first arc-shaped protrusions 5 are uniformly and spacedly arranged on the side of the first base 1 close to the second base 2, a plurality of second arc-shaped protrusions 6 are uniformly and spacedly arranged on the side of the second base 2 close to the first base 1, and each second arc-shaped protrusion 6 is located between two adjacent first arc-shaped protrusions 5; the first electrode covers the side of the first base 1 away from the first arc-shaped protrusions 5; the second electrode covers the outer wall of the second base 2 on the side provided with the second arc-shaped protrusions 6 and the outer wall of each second arc-shaped protrusion 6; the first base 1 and the second base 2 are sealingly connected around to form a receiving space for accommodating the first arc-shaped protrusions 5 and the second arc-shaped protrusions between the first base 1 and the second base 2; at least one temperature measurement metal wire 7 is embedded in the first base 1 and the second base 2 respectively.

[0047] The pressure measurement method comprises the following steps:

[0048] In step S10, the temperature measurement metal wire 7 is used to detect the overall temperature of the first base 1 and the second base 2 in real time to form a temperature value.

[0049] In step S20, the temperature value is used to correct the measurement value of the flexible thin film pressure sensor to form an actual pressure value.

[0050] In the technical scheme of the application:

[0051] Firstly, the structural design of the first arc-shaped protrusions 5 and the second arc-shaped protrusions 6 can effectively increase the sensitivity and dynamic range of the flexible thin film pressure sensor, and reduce the drift of the capacitance value and noise.

[0052] Secondly, the design of the temperature measurement metal wire 7 can realize temperature monitoring and compensation of the flexible thin film pressure sensor, and also can serve as a connecting line between the electrodes, thereby simplifying the manufacturing process and connection mode of the flexible thin film pressure sensor.

[0053] Thirdly, the temperature measurement metal wire 7 arranged on the first base 1 and the second base 2 can detect the temperature of the flexible thin film pressure sensor in real time and form a temperature value, and based on the temperature value, the pressure value of the flexible thin film pressure sensor is corrected to obtain an actual pressure value, thereby realizing pressure and temperature decoupling, avoiding the influence of temperature on the accuracy of the pressure value of the flexible thin film pressure sensor, greatly improving the pressure value accuracy of the flexible thin film pressure sensor, and making up for the defects of the prior art, which is helpful to realize the wide application of the wearable flexible device measurement optimization method of adsorption enhancement and temperature decoupling.

[0054] Based on the first embodiment of the temperature decoupling based pressure measurement method of the present application, in the second embodiment of the temperature decoupling based pressure measurement method of the present application, the real-time detection of the overall temperature of the first substrate 1 and the second substrate 2 by the temperature measuring metal wire 7 forms a temperature value, and the reference is as follows:

[0055] T=aX 4 +bX 3 +cX 2 +dX+f;

[0056] Wherein, T is the temperature value; X is the measured metal wire resistance value; a to f are calibration fitting coefficients, the value range is [-20, 20], and the dimensionless.

[0057] Specifically, by substituting the measured metal wire resistance value into X, and substituting the calibration fitting coefficients [-20, 20] into a to f, the temperature T of the flexible thin film pressure sensor can be obtained, and the detection of the temperature of the flexible thin film pressure sensor is realized.

[0058] Based on the second embodiment of the temperature decoupling based pressure measurement method of the present application, in the third embodiment of the temperature decoupling based pressure measurement method of the present application, the temperature value is used to correct the measurement value of the flexible thin film pressure sensor to form an actual pressure value, and the reference is as follows:

[0059] C x =kT / (2πEC);

[0060] Wherein, C x is the actual measurement value of the flexible thin film pressure sensor after correction of the capacity resistance; E is the frequency of the test signal, and the set range is [20Hz, 50Hz]; C is the real-time capacitance value between the first electrode and the second electrode, and the value range is [0.1μF, 1μF]; k is the correction coefficient, when T>0℃, k=0.994, and when T≤0℃, k=1.07.

[0061] Specifically, by substituting the temperature value of the flexible thin film pressure sensor into T, substituting the frequency of the test signal into E, and substituting the real-time capacitance value between the first electrode and the second electrode into C, and substituting the correction coefficient according to the value of T into k, the correction of the flexible thin film pressure sensor value is realized, and the actual pressure value of the flexible thin film pressure sensor is obtained.

[0062] Please refer to the attached Figures 1-4To achieve the above object, the application further provides a flexible thin film pressure sensor applying the pressure measurement method as described in any one of the above.

[0063] Specifically, the first base 1, the second base 2, the first arc-shaped bump 5 and the second arc-shaped bump 6 are all made of flexible material, and further, the first base 1, the second base 2, the first arc-shaped bump 5 and the second arc-shaped bump 6 are made of PVA material; the first electrode and the second electrode are made of Au or Cu.

[0064] Please refer to the accompanying drawings Figure 1 Each of the first arc-shaped bumps 5 is uniformly and spacedly provided with a plurality of columns 3 on the side away from the first base 1, each of the columns 3 is perpendicular to the first base 1 in the extension direction, and the length of each of the columns 3 is equal. The first arc-shaped bump 5 is in a micro-dome structure, and the plurality of columns 3 and the first arc-shaped bump 5 cooperatively form a gradient fitting structure on the side of the plurality of columns 3 away from the first arc-shaped bump 5. The columns 3 are made of flexible material. When the first arc-shaped bump 5 is close to the second arc-shaped bump 6, the second arc-shaped bump 6 will gradually contact the columns 3 on the first arc-shaped bump 5 in sequence, effectively improving the compressibility of the flexible thin film pressure sensor, significantly reducing the deconstruction hardening, and realizing the unification of high sensitivity, linear response and wide sensing range of the flexible sensing. The design of the column 3 structure can effectively enhance the elastic recovery ability and wear resistance of the flexible thin film pressure sensor, prolonging the service life of the flexible thin film pressure sensor.

[0065] Please refer to the accompanying drawings Figure 1, the second base body 2 is spaced apart from the second arc-shaped protrusion 6 and is provided with a plurality of recessed holes 4. The second arc-shaped protrusion 6 is a micro-dome structure protruding towards the side away from the second base body 2. When the flexible thin film pressure sensor is in use, the second base body 2 is placed on the mounting surface. When the second base body 2 is pressed and deformed, the recessed holes 4 are also deformed, and part of the air in the recessed holes 4 is discharged, resulting in a pressure difference between the inside and outside of the recessed holes 4, so that the adsorption force of the flexible thin film pressure sensor is greatly enhanced, and the sensitivity, adsorption force and stability of the flexible thin film pressure sensor are effectively improved.

[0066] Please refer to the accompanying drawings Figure 1 The diameter of each recessed hole 4 is between [1 μm, 100 μm], and the spacing between every two adjacent recessed holes 4 is between [1 μm, 100 μm]. The diameter of the recessed hole 4 and the spacing between the recessed holes 4 can improve the adsorption of the second base body 2; the cross-sectional shape of the recessed hole 4 includes cylinder, cuboid, inverted cone, circular truncated cone, prism, sphere and ellipsoid.

[0067] Please refer to the accompanying drawings Figures 1-2 Each of the temperature measuring metal wires 7 in the first base body 1 is in a smooth curve and parallel to the extension direction of the first base body 1; each of the temperature measuring metal wires 7 in the second base body 2 is in a smooth curve and parallel to the extension direction of the first base body 1. The curved temperature measuring metal wire 7 can increase the setting length of the temperature measuring metal wire 7 in the first base body 1 and the second base body 2, thereby improving the temperature measuring accuracy of the temperature measuring metal wire 7.

[0068] Please refer to the accompanying drawings Figures 1-2 The diameter of each of the temperature measuring metal wires 7 in the first base body 1 is less than or equal to 1 mm, and the number is less than or equal to 10 per square centimeter; the diameter of each of the temperature measuring metal wires 7 in the second base body 2 is less than or equal to 1 mm, and the number is less than or equal to 10 per square centimeter. The temperature measuring metal wire 7 is used for temperature measurement when the flexible thin film pressure sensor is in use, and is not affected by the deformation or strain of the flexible thin film pressure sensor, so as to achieve more accurate pressure measurement.

[0069] Please refer to the accompanying drawings Figure 1 The material of the temperature measuring metal wire 7 is one of platinum, gold, silver, iron, nickel, palladium, rhodium, iridium, platinum-gold alloy, gold-silver alloy, iron-nickel alloy, palladium-rhodium alloy, rhodium-iridium alloy, platinum-silver alloy, platinum-iron alloy, gold-palladium alloy, silver-palladium alloy and palladium-iridium alloy.

[0070] Specifically, these metals or alloys have high electrical conductivity and thermal conductivity, and can quickly respond to temperature changes;

[0071] These metals or alloys have high melting points and oxidation resistance, enabling stable operation in high-temperature and corrosive environments, improving the durability and reliability of the temperature measuring wire 7.

[0072] These metals or alloys have high strength and toughness, enabling them to maintain their shape and integrity under stress and vibration, reducing damage and failure of the temperature measuring wire 7.

[0073] Through the description of the above embodiments, those skilled in the art can clearly understand that the above-mentioned embodiment methods can be realized by means of software and the necessary general hardware platform, of course, they can also be realized by hardware, but in many cases the former is a better embodiment. Based on such understanding, the technical solutions of the present application can be embodied in the form of a software product.

[0074] In the description of the present specification, the description of the terms "one embodiment", "another embodiment", "other embodiments", or "first embodiment to Xth embodiment" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In the present specification, the illustrative description of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, method steps or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0075] It should be noted that in this paper, the term "include", "contain" or any other variant thereof is intended to cover non-exclusive inclusion, so that the process, method, article or system including a series of elements not only includes those elements, but also includes other elements not explicitly listed, or includes elements inherent to such process, method, article or system. Without more limitations, the element defined by the statement "including a" does not exclude the presence of other identical elements in the process, method, article or system including the element.

[0076] The above-mentioned embodiment numbers of the present application are only for description, not representing the advantages and disadvantages of the embodiments.

[0077] The above is only the preferred embodiment of the present application, and does not limit the patent scope of the present application. Any equivalent structure or equivalent process transformation, or direct or indirect application in other related technical fields, is also included in the patent protection scope of the present application.

Claims

1. A pressure measurement method based on temperature decoupling, characterized in that, Pressure measurement is performed using a flexible thin-film pressure sensor, which includes a first substrate, a second substrate, a first electrode, and a second electrode. The surfaces of the first substrate and the second substrate are parallel to each other. Multiple first arc-shaped protrusions are evenly spaced on the side of the first substrate closest to the second substrate, and multiple second arc-shaped protrusions are evenly spaced on the side of the second substrate closest to the first substrate. Each second arc-shaped protrusion is located between two adjacent first arc-shaped protrusions. The first electrode covers the side of the first substrate away from the first arc-shaped protrusions. The second electrode covers the outer wall of the second substrate on the side with the second arc-shaped protrusions and the outer wall of each second arc-shaped protrusion. The first substrate and the second substrate are sealed together to form a receiving space for accommodating the first arc-shaped protrusions and the second arc-shaped protrusions. At least one temperature-sensing metal wire is embedded in each of the first substrate and the second substrate. The pressure measurement method includes: The overall temperature of the first and second substrates is detected in real time using a temperature-sensing metal wire, and a temperature value is generated. The temperature value is used to correct the measured value of the flexible thin film pressure sensor to form the actual pressure value; The first substrate, the second substrate, the first arc-shaped protrusion, and the second arc-shaped protrusion are all made of flexible materials; The second substrate has multiple recesses spaced apart on the side opposite to the second arc-shaped protrusion.

2. The pressure measurement method based on temperature decoupling according to claim 1, characterized in that, The temperature of the first and second substrates is detected in real time using a temperature-sensing metal wire to generate temperature values; this is done in the following manner: ； Where T is the temperature value; X is the measured resistance value of the metal wire; a to f are the calibration fitting coefficients, with values ​​ranging from [-20, 20], and are dimensionless.

3. The pressure measurement method based on temperature decoupling according to claim 2, characterized in that, The temperature value is used to correct the measured value of the flexible thin-film pressure sensor to form the actual pressure value; this is done in the following manner: ； Among them, C x The actual measured value of the flexible thin-film pressure sensor after capacitive reactance correction is given; π is pi; E is the frequency of the test signal, set within the range of [20Hz, 50Hz]; C is the real-time capacitance value between the first electrode and the second electrode, with a value range of [0.1μF, 1μF]; k is the correction coefficient, which is 0.994 when T > 0℃ and 1.07 when T ≤ 0℃.

4. A flexible thin-film pressure sensor, characterized in that, The pressure measurement method described in any one of claims 1 to 3 is applied; the flexible thin-film pressure sensor includes a first substrate, a second substrate, a first electrode, and a second electrode; the surfaces of the first substrate and the second substrate are parallel to each other; a plurality of first arc-shaped protrusions are evenly spaced on the side of the first substrate near the second substrate; a plurality of second arc-shaped protrusions are evenly spaced on the side of the second substrate near the first substrate; each second arc-shaped protrusion is located between two adjacent first arc-shaped protrusions; the first electrode covers the side of the first substrate away from the first arc-shaped protrusions; the second electrode covers the outer wall of the second substrate on the side with the second arc-shaped protrusions and the outer wall of each second arc-shaped protrusion; the first substrate and the second substrate are sealed together around their perimeters so that the first substrate and the second substrate cooperate to form a receiving space for accommodating the first arc-shaped protrusions and the second arc-shaped protrusions; at least one temperature-sensing metal wire is embedded in the first substrate and the second substrate respectively.

5. The flexible thin-film pressure sensor according to claim 4, characterized in that, Each of the first arc-shaped protrusions has multiple columns evenly spaced on the side away from the first base. The extension direction of each column is perpendicular to the first base, and the length of each column is equal.

6. The flexible thin-film pressure sensor according to claim 4, characterized in that, The diameter of each of the aforementioned recesses is between [1μm, 100μm], and the distance between any two adjacent recesses is between [1μm, 100μm].

7. The flexible thin-film pressure sensor according to claim 4, characterized in that, Each of the temperature-sensing metal wires located in the first substrate has a smoothly varying curve and is parallel to the extension direction of the first substrate; each of the temperature-sensing metal wires located in the second substrate has a smoothly varying curve and is parallel to the extension direction of the first substrate.

8. The flexible thin-film pressure sensor according to claim 7, characterized in that, The temperature-sensing metal wires located in the first substrate have a single diameter of less than or equal to 1 mm, and the number is less than or equal to 10 per square centimeter; the temperature-sensing metal wires located in the second substrate have a single diameter of less than or equal to 1 mm, and the number is less than or equal to 10 per square centimeter.

9. The flexible thin-film pressure sensor according to claim 7, characterized in that, The material of the temperature-measuring metal wire is one of the following: platinum, gold, silver, iron, nickel, palladium, rhodium, iridium, platinum alloy, gold-silver alloy, iron-nickel alloy, palladium-rhodium alloy, rhodium-iridium alloy, platinum-silver alloy, platinum-iron alloy, gold-palladium alloy, silver-palladium alloy, and palladium-iridium alloy.

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