Chip module release sorting and packaging integrated device

Abstract

The application provides a full-automatic chip module releasing, sorting and packaging integrated device, which comprises a chip module releasing module, a chip module deburring module and a sorting module. The chip module deburring module is arranged on the downstream side of the chip module releasing module to deburr the released module. The deburred chip module is sorted based on the double-station sorting module to distinguish the good products and the defective products of the chip module. The chip module is respectively placed in the corresponding tray based on the recognition result. The sorting precision and efficiency are improved.

Description

Technical Field

[0001] This application relates to automated equipment, and more particularly to a fully automated integrated device for releasing, sorting, and packaging chip modules. Background Technology

[0002] Currently, during the chip module packaging process, the chips are placed on a carrier to prevent movement. The chips are temporarily fixed with glue. After molding, a special jig is used to eject the chips from the carrier. During the ejection process, burrs and residual glue are easily generated on the surface of the modules. These burrs and residual glue need to be cleaned. After cleaning, the chips are scanned and identified. Currently, this process is set up on the production line, which limits the efficiency of ejection-deburring-sorting and results in limited production capacity.

[0003] In addition, when manual intervention is involved, each workstation on the assembly line needs to be equipped with an anti-static device, and regular inspections are also required to minimize defects caused by static electricity. Summary of the Invention

[0004] To overcome the above-mentioned shortcomings, this application provides a chip module release, sorting and packaging integrated device. This sorting and packaging integrated device realizes chip module ejector pin stamping, deburring, sorting and packaging, and improves sorting accuracy and efficiency through dual-station sorting.

[0005] To achieve the above objectives, this application adopts the following technical solution:

[0006] A chip module release, sorting, and packaging integrated device, characterized in that it comprises:

[0007] Chip module release module, chip module deburring module, and sorting module.

[0008] The chip module deburring module is configured downstream of the chip module release module to receive the released module and perform deburring.

[0009] The sorting module is located downstream of the deburring module. It receives and sorts the deburred chip modules at the sorting station, and places them into corresponding trays based on the identification results. This integrated device achieves chip module ejector stamping, deburring, sorting, and packaging in one operation, improving sorting accuracy and efficiency.

[0010] Preferably, the chip module release module includes:

[0011] A base, wherein a feeding bin clamping mechanism is disposed on the base, the feeding bin clamping mechanism comprising:

[0012] The first and second feeding hoppers are symmetrically arranged along the center line of the base.

[0013] The first feeding hopper clamp is equipped with a first lifting mechanism and a first transmission mechanism.

[0014] The second feeding hopper clamp is equipped with a second lifting mechanism and a second transmission mechanism.

[0015] The first transmission mechanism is used to transfer the carrier from the first feed bin clamp to a predetermined position.

[0016] The second transmission mechanism is used to transfer the carrier from the second feed bin clamp to the predetermined position.

[0017] Preferably, the first feeding clamp and the second feeding clamp are equipped with cooling fans to cool the material being loaded into the carrier.

[0018] Preferably, the second transmission mechanism includes:

[0019] A base plate is provided with a guide rail. A first side plate and a second side plate are arranged parallel to each other on the base plate. Tracks for transport by a vehicle are arranged on the first side plate and the second side plate. A partition is arranged on the track.

[0020] Preferably, the chip module release sorting and packaging integrated device is characterized by further comprising: a sensor disposed on the first side plate and / or the second side plate for detecting the entry and exit of the carrier.

[0021] Preferably, the integrated chip module release, sorting, and packaging device is characterized by further comprising:

[0022] A transfer mechanism, located downstream of the feeding hopper clamping mechanism, is used to transfer the carrier to the ejection station.

[0023] The transfer mechanism includes:

[0024] A linear drive motor is provided, on which a base plate is mounted. A pair of parallel transfer brackets are arranged on the base plate to fix the carrier to be transferred.

[0025] Preferably, the integrated chip module release, sorting, and packaging device is characterized by further comprising:

[0026] The lower ejector mechanism includes:

[0027] Base plate and cylinder,

[0028] The output end of the cylinder is connected to the lower PIN component, and a pressure sensor is disposed on the output end side of the cylinder to detect the output pressure of the cylinder.

[0029] The base plate is equipped with brackets with installation intervals. One side of one of the brackets is equipped with a drive unit. The output of the drive unit is connected to a drive shaft. The output side of the drive shaft is connected to a drive wheel. The drive wheel is connected to a driven wheel through a conveyor belt. The drive unit drives the drive shaft to rotate, which in turn drives the drive wheel to rotate and thus the driven wheel to rotate.

[0030] Preferably, the integrated chip module release, sorting, and packaging device is characterized by further comprising:

[0031] The top plate moving mechanism includes:

[0032] A pair of parallel mounting brackets

[0033] One mounting bracket is equipped with a linear motor, and the other mounting bracket is equipped with a guide rail.

[0034] The base is connected to the output end of a linear motor and slidably connected to a guide rail. A drive cylinder is mounted on the base, and the output end of the drive cylinder is connected to an upper PIN plate component. The upper PIN plate component is equipped with a clamping part, which allows for quick installation of the upper PIN plate component.

[0035] Driven by a linear motor, the base moves.

[0036] The upper PIN board component moves downward based on the drive cylinder and matches with the ejector pin of the lower PIN component to clamp the chip module. Then, the upper / lower components (upper / lower ejector pin mechanism) move upward slowly at the same time to release the chip module on the carrier.

[0037] Preferably, the upper PIN board component is provided with a suction nozzle, and the side of the suction nozzle that contacts the chip module is coated with adhesive.

[0038] Preferably, it also includes a CCD scanning detection module, which is used to detect the module transmitted to the carrier on the lower ejector mechanism in real time.

[0039] Preferably, the deburring module has a feeding end, a material unloading module, and a deburring station.

[0040] The feed end receives the carrier ejected by the chip module release module.

[0041] The material handling module is used to pick up the carrier and move it to the deburring station, and the deburring station is equipped with an anti-static device.

[0042] The deburring station is equipped with an anti-static brush. The anti-static brush rotates to remove burrs from the chip modules on the carrier. The material handling module places the deburred carrier at a preset discharge end and moves it to the sorting module via the discharge end.

[0043] The sorting module includes: a lower rack on which a transmission component is configured.

[0044] Downstream of the transmission component are a first sorting module and a second sorting module, which are used to distinguish between good and defective chip modules and place the chip modules into the corresponding trays based on the identification results.

[0045] Beneficial effects

[0046] Compared with existing technologies, the chip module release, sorting, and packaging integrated device proposed in this application ejects the module through a stamping process using a top-mounted component module. The module then passes through a deburring module, followed by sorting via a dual-station sorting module, improving sorting accuracy and efficiency. This integrated device, with its three modules, significantly reduces space requirements. Attached Figure Description

[0047] Figure 1 This is a three-dimensional structural diagram of the integrated device according to an embodiment of this application;

[0048] Figure 2 for Figure 1 Internal structure diagram of the integrated device;

[0049] Figures 3-12 for Figure 1 Internal structure diagram of the chip module release module;

[0050] Figure 13 for Figure 1 Internal structure diagram of the burr module;

[0051] Figure 14 for Figure 1 A schematic diagram of the internal structure of the sorting module. Detailed Implementation

[0052] The above-described solution will be further illustrated below with reference to specific embodiments. It should be understood that these embodiments are for illustrative purposes only and are not intended to limit the scope of this application. The implementation conditions used in the embodiments may be further adjusted according to the conditions of specific manufacturers, and the implementation conditions not specified are generally those in routine experiments.

[0053] This application proposes a fully automated chip module release, sorting, and packaging integrated device, comprising a chip module release module, a chip module deburring module, and a sorting module. The chip module deburring module is positioned downstream of the chip module release module to deburr the released modules. The deburred chip modules are then sorted using a dual-station sorting module to distinguish between good and defective chip modules. Based on the identification results, the chip modules are placed into their respective trays. In this embodiment, upstream / downstream refers to the direction of chip movement on the device; the side in front of the chip in the direction of movement is the downstream side, and vice versa.

[0054] Please refer to the following. Figures 1 to 14 This application describes in detail the fully automated chip module release, sorting, and packaging integrated device according to its embodiments.

[0055] Figure 1 This is a schematic diagram of the integrated chip module release, sorting, and packaging device according to an embodiment of this application. Figure 2 for Figure 1 Internal structure diagram.

[0056] The integrated device includes:

[0057] The system includes a chip module release module 100, a chip module deburring module 200, and a sorting module 300. The chip module deburring module 200 is located downstream of the chip module release module 100 to deburr the released modules. The deburred chip modules are then sorted to distinguish between good and defective modules. Based on the identification results, the chip modules are placed into their respective trays. In this embodiment, the sorting module 300 employs a dual-sorting station.

[0058] Please refer to the following. Figures 3 to 12 The chip module release module 100 proposed in this application is described in detail. The chip module release module is used to eject the chip module to facilitate its pickup at the next work station.

[0059] The chip module release module 100 includes:

[0060] Base 110, on which a feeding bin clamping mechanism 120 is disposed, the feeding bin clamping mechanism 120 includes:

[0061] First feeding bin clamp 121 and second feeding bin 122

[0062] The first feeding bin clamp 121 is equipped with a first lifting mechanism 121a and a first transmission mechanism 121b.

[0063] The second feeding bin clamp 122 is equipped with a second lifting mechanism 122a and a second transmission mechanism 122b.

[0064] The first feeding bin clamp 121 and the second feeding bin 122 are symmetrically arranged along the center line (module movement direction) of the base 110. Cooling fans are provided on the first feeding bin clamp 121 and the second feeding bin 122 to cool the loading carrier.

[0065] In this embodiment, the first feeding bin clamp 121 and the second feeding bin clamp 122 have the same structure. The following description uses the second feeding bin clamp 122 as an example. The second feeding bin clamp 122 is matched with a second transfer mechanism 122b, which is used to transfer the carrier 10 from the second feeding bin clamp 122 to a predetermined position so that it can be transferred to the ejection station by the transfer mechanism 130. The carrier 10 is provided with a plurality of holes 101 for accommodating chip modules (not shown) to be ejected.

[0066] The second transmission mechanism 122b includes:

[0067] A base plate 124 is provided, with a guide rail 124a mounted on it. Side plates 125a and 125b are arranged parallel to each other on the base plate 124. The side plates 125b are movably fixed to the guide rail 124a via sliders, allowing adjustment of the spacing between them to accommodate carriers of different sizes. A partition 123 is mounted on the second transmission mechanism 122b and is positioned on the carrier transmission track. The partition 123 facilitates the cleaning of debris generated during carrier transmission. A sensor 126 is mounted at the end of the side plate 125b to detect the entry and exit of the carrier 10. In other embodiments, the structures of the first feeding bin clamp 121 and the second feeding bin 122 may differ.

[0068] A transfer mechanism 130, located downstream of the feeding bin clamping mechanism 120, is used to transfer the carrier 10 to the lower ejector pin mechanism 140.

[0069] Transfer mechanism 130 includes:

[0070] A linear drive motor 131 is mounted on a base plate 132. Parallel transfer brackets are mounted on the base plate 132. A drive unit 136 is located on one side of each bracket, and a limiting part 135 is located on the base plate 132 to ensure that the carrier (not shown) remains in the track during the transfer process. Sensors 133 / 134 are mounted on one side of the bracket to detect the entry and exit of the carrier. Driven by the drive unit 136, the carrier on the transfer mechanism 130 is transferred to a predetermined position and then enters the track of the lower ejector mechanism 140, moving to the predetermined position of the lower ejector mechanism 140.

[0071] The lower ejector pin mechanism 140 and the upper ejector plate transfer mechanism 150 engage in a pressing action to release the chip module. Specifically,

[0072] The lower ejector mechanism 140 includes:

[0073] Base plate 142, electric cylinder 141, the output terminal 141a of which is connected to the lower top PIN component 147.

[0074] A bracket 143 with mounting intervals is disposed on the base plate 142. A drive unit 144 is disposed on one side of one of the brackets 143. The output of the drive unit 144 is connected to a drive shaft 145. The output side of the drive shaft 145 is connected to a drive wheel 145a. The drive wheel 145a is connected to a driven wheel 146 via a conveyor belt. The drive unit 144 drives the drive shaft 145 to rotate, which in turn drives the drive wheel 145a to rotate, and thus the driven wheel 146 to rotate. In this embodiment, a pressure sensor is disposed on the output end 141a side to detect the output pressure of the electric cylinder 141. The lower push pin component 147 is configured to be detachable. The lower push pin component 147 is disposed with a plurality of push pin portions 147a arranged in a staggered manner.

[0075] The top plate moving mechanism 150 includes:

[0076] A pair of parallel mounting brackets 151, one bracket 151 is equipped with a linear motor 152, and the other bracket 151 is equipped with a guide rail 152a.

[0077] The base 153 is connected to the output end of the linear motor 152 and is slidably connected to the guide rail 152a.

[0078] A drive cylinder 154 is mounted on the base 153. The output end 154a of the drive cylinder 154 is connected to the upper PIN board component 155. The upper PIN board component 155 is equipped with a clamping part 155a, which allows for quick installation of the upper PIN board component 155. The base 153 is also equipped with a guide component 154b. Thus, the base 153 is moved by the drive of the linear motor 152. Driven by the drive cylinder 154, the upper PIN board component 155 moves downward and matches and presses against the ejector pin part 147a of the lower PIN component 147 to release the chip module on the carrier. A suction nozzle 155b is provided on the upper PIN board component 155. The end of the suction nozzle 155b is coated with rubber 155b1 (the top of the contact surface with the module is coated with rubber) to prevent scratching the module.

[0079] The CCD scanning detection module 160 is used to detect the modules transmitted to the carrier 10 on the lower ejector mechanism 140 in real time.

[0080] The deburring module 200 includes a feed end 210, which receives chip modules ejected by the chip module release module 100. Typically, the feed end 210 is equipped with a tray for temporarily holding the ejected chip modules.

[0081] The tray is transported to a predetermined position via the first transfer component 220, picked up by the picking module 230, and moved to the deburring station 240. At the deburring station 240, deburring (removing burrs and surface residue) is performed by a rotating brush 241. An antistatic device 242 is installed on one side of the brush 241. The picking module 230 places the deburred chip module at the discharge end, and then transports it to the sorting module 300. In this embodiment, the rotation speed of the brush 241 is adjustable (adjustable according to different types of chip modules and temporary fixing adhesives; it is usually preset during the operation of the deburring module). The deburring module is equipped with a human-machine interface (HMI), through which control commands are input to ensure normal operation of the deburring module.

[0082] Sorting module 300 includes:

[0083] The lower rack 310 has a base plate 311 mounted on it. The base plate 311 has a second transmission component 320 mounted on it. Downstream of the second transmission component 320, a dual-station sorting module 330 (first sorting module 330a / second sorting module 330b) is mounted.

[0084] Good products sorted by the sorting head of the first sorting module 330a are placed in the first storage bin 340a, and defective products are placed in the storage box 351.

[0085] Good products sorted by the sorting head of the second sorting module 330b are placed in the second storage bin 340b, and defective products are placed in the storage box 352. In this embodiment, the sorting heads of the first sorting module 330a and the second sorting module 330b are both configured on the first Y-rail beam 370, which is configured to be perpendicular or substantially perpendicular to the second transmission component 320. A second Y-rail beam 360 is also configured on the lower frame 310. The second Y-rail beam 360 is configured parallel to the first Y-rail beam 370 and is located downstream of the first Y-rail beam 370. A transfer part 361 is configured on the second Y-rail beam 360 for loading empty trays.

[0086] In this way, when the integrated device is running, the chip module is ejected by the chip module release module 100, then deburred by the deburring module 200, and sorted by the dual-station sorting module 300, which enables efficient sorting of chip modules, greatly reducing the space requirements, and the degree of human intervention in the whole process is very small.

[0087] The above embodiments are only for illustrating the technical concept and features of this application, and are intended to enable those skilled in the art to understand the content of this application and implement it accordingly. They should not be used to limit the scope of protection of this application. All equivalent changes or modifications made in accordance with the spirit and essence of this application should be included within the scope of protection of this application.

Claims

1. A chip module release, sorting, and packaging integrated device, characterized in that, include: Chip module release module, chip module deburring module, and sorting module. The chip module deburring module is configured downstream of the chip module release module to receive the released module and perform deburring. The sorting module is located downstream of the deburring module. It receives and sorts the deburred chip modules at the sorting station, and places them into corresponding trays based on the identification results. The module also includes a lower ejector pin mechanism, comprising a base plate and an electric cylinder. The output end of the electric cylinder is connected to the lower ejector pin component. A pressure sensor is mounted on the output end of the electric cylinder to detect its output pressure. The base plate is equipped with spaced brackets, one of which has a drive unit on one side. The output of the drive unit is connected to a drive shaft, and the output side of the drive shaft is connected to a drive wheel. The drive wheel is connected to a driven wheel via a conveyor belt. The drive unit drives the drive shaft to rotate, which in turn drives the drive wheel and consequently the driven wheel. The deburring module includes a feeding end, a picking module, and a deburring station. The feeding end receives a carrier ejected by the chip module release module. The picking module picks up the carrier and moves it to the deburring station. An antistatic device is installed on the side of the deburring station, which is also equipped with an antistatic brush. The antistatic brush rotates to remove burrs from the chip modules on the carrier. The picking module places the deburred carrier at a preset discharge end and moves it through the discharge end to the sorting module. The sorting module includes: a lower rack on which a second transmission component is configured, and a first sorting module and a second sorting module are configured on the downstream side of the transmission component, which are used to distinguish between good and defective chip modules, and to place the chip modules into the corresponding trays based on the identification results.

2. The chip module release, sorting, and packaging integrated device as described in claim 1, characterized in that, The chip module release module includes: A base, wherein a feeding bin clamping mechanism is disposed on the base, the feeding bin clamping mechanism comprising: The first and second feeding bin clamps are symmetrically arranged along the center line of the base. The first feeding hopper clamp is equipped with a first lifting mechanism and a first transmission mechanism. The second feeding hopper clamp is equipped with a second lifting mechanism and a second transmission mechanism. The first transmission mechanism is used to transfer the carrier from the first feed bin clamp to a predetermined position. The second transmission mechanism is used to transfer the carrier from the second feed bin clamp to the predetermined position.

3. The chip module release, sorting, and packaging integrated device as described in claim 2, characterized in that, The first and second feeding bin clamps are equipped with cooling fans to cool the loading carrier.

4. The chip module release, sorting, and packaging integrated device as described in claim 2 or 3, characterized in that, The second transmission mechanism includes: A base plate is provided with a guide rail. A first side plate and a second side plate are arranged parallel to each other on the base plate. Tracks for transport by a vehicle are provided on the first side plate and the second side plate. A partition is provided on the track.

5. The chip module release, sorting, and packaging integrated device as described in claim 4, characterized in that, Also includes: A sensor, disposed on the first side plate and / or the second side plate, is used to detect the entry and exit of the vehicle.

6. The chip module release, sorting, and packaging integrated device as described in claim 2, characterized in that, Also includes: A transfer mechanism, located downstream of the feeding hopper clamping mechanism, is used to transfer the carrier to the ejection station. The transfer mechanism includes: A linear drive motor is provided, on which a base plate is mounted. A pair of parallel transfer brackets are arranged on the base plate to fix the carrier to be transferred.

7. The chip module release, sorting, and packaging integrated device as described in claim 1, characterized in that, Also includes: The top plate moving mechanism includes: A pair of parallel mounting brackets One mounting bracket is equipped with a linear motor, and the other mounting bracket is equipped with a guide rail. The base is connected to the output end of a linear motor and slidably connected to a guide rail. A drive cylinder is mounted on the base, and the output end of the drive cylinder is connected to an upper PIN plate component. The upper PIN plate component is equipped with a clamping part, which allows for quick installation of the upper PIN plate component. Driven by a linear motor, the base moves. The upper PIN board component moves downward based on the drive electric cylinder, and matches and clamps the chip module with the ejector pin of the lower PIN component. At the same time, it moves upward slowly to release the chip module on the carrier.

8. The chip module release, sorting, and packaging integrated device as described in claim 7, characterized in that, The upper PIN board component is equipped with a suction nozzle, and the side of the suction nozzle that contacts the chip module is coated with adhesive.

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