Vibrating thin film deposition device

Abstract

The present invention provides a vibration-type thin film deposition device, which mainly includes a vacuum chamber, a fixed rod and a powder trough, wherein the vacuum chamber includes at least one inner side surface, and a plurality of protrusions and a plurality of recesses are provided on the inner side surface. The fixed rod and the powder trough are arranged in a accommodating space of the vacuum chamber, wherein the powder trough is used to install powder and contacts the inner side surface of the vacuum chamber through at least one protruding unit. When the vacuum chamber rotates relative to the fixed rod, the protruding unit will move between the protruding portion and the recessed portion, causing the powder trough connected to the fixed rod to move up and down relative to the vacuum chamber, and vibrate the powder in the powder trough to form a uniform thin film on the surface of the powder.

Description

Technical Field

[0001] The present invention relates to a vibration type thin film deposition device, which can vibrate powder during the deposition process to facilitate the formation of a film with uniform thickness on the powder. Background Art

[0002] Nanoparticles are generally defined as particles smaller than 100 nanometers in at least one dimension. They possess distinct physical and chemical properties from macroscopic matter. While the physical properties of macroscopic matter are generally independent of their size, this is not the case for nanoparticles, which have potential applications in biomedicine, optics, and electronics.

[0003] Quantum dots are nanoparticles of semiconductor materials. Currently being researched are II-VI materials, such as ZnS, CdS, and CdSe, with CdSe attracting the most attention. Quantum dots typically range in size from 2 to 50 nanometers. When exposed to ultraviolet light, the electrons within them absorb energy and transition from the valence band to the conduction band. When these excited electrons return from the conduction band to the valence band, they release energy through luminescence.

[0004] The energy gap of a quantum dot is related to its size. Larger quantum dots have smaller energy gaps, and upon irradiation, they emit light with longer wavelengths. Smaller quantum dots have larger energy gaps, and upon irradiation, they emit light with shorter wavelengths. For example, quantum dots of 5 to 6 nanometers emit orange or red light, while those of 2 to 3 nanometers emit blue or green light. Of course, the color of the light also depends on the material composition of the quantum dot.

[0005] Light-emitting diodes (LEDs) using quantum dots produce a near-continuous spectrum of light with high color rendering properties, significantly improving the quality of their light. Furthermore, the wavelength of emitted light can be tuned by varying the size of the quantum dots, making quantum dots a key development focus for next-generation light-emitting devices and displays.

[0006] While quantum dots possess the aforementioned advantages and properties, they are prone to agglomeration during application and manufacturing. Furthermore, quantum dots have high surface activity and readily react with air and moisture, shortening their lifespan.

[0007] Specifically, when quantum dots are used as sealants for LEDs, they may aggregate, reducing their optical performance. Furthermore, even after the quantum dots are formed into the LED sealant, external oxygen or moisture may still penetrate the sealant and contact the surface of the quantum dots, causing oxidation and affecting the performance and lifespan of both the quantum dots and the LED. Surface defects and dangling bonds on the quantum dots can also lead to non-radiative recombination, similarly affecting the quantum dots' luminescence efficiency.

[0008] Currently, the industry mainly forms a nanometer-thick thin film on the surface of quantum dots through atomic layer deposition (ALD), or forms multiple layers of thin films on the surface of quantum dots to form a quantum well structure.

[0009] Atomic layer deposition (ALD) can form thin films of uniform thickness on substrates, effectively controlling the thickness of the film. This process is theoretically applicable to three-dimensional quantum dots. However, when quantum dots are stationary on a carrier, adjacent quantum dots have contact points, preventing the ALD precursor gas from reaching these points. Consequently, a uniform film cannot be formed on all nanoparticle surfaces. Summary of the Invention

[0010] In order to solve the above problems faced by the prior art, the present invention proposes a vibrating thin film deposition apparatus that can vibrate powder during an atomic layer deposition process to form a thin film with uniform thickness on the powder surface.

[0011] An object of the present invention is to provide a vibrating thin film deposition apparatus comprising a vacuum chamber, a fixed rod, and a powder trough, wherein the fixed rod and the powder trough are located within a receiving space of the vacuum chamber. The powder trough is connected to the fixed rod, and the powder trough and the fixed rod do not rotate with the vacuum chamber.

[0012] The inner surface of the vacuum chamber is provided with a plurality of raised portions and a plurality of recessed portions, and the powder trough contacts the inner surface of the vacuum chamber. When the vacuum chamber rotates relative to the powder trough and the fixed rod, the powder trough moves up and down with the raised portions and recessed portions, vibrating the powder contained in the powder trough to form a thin film of uniform thickness on the surface of the powder. In various embodiments, the accommodation space formed by the inner surface of the vacuum chamber can also be polygonal, similarly driving the powder trough to move up and down relative to the vacuum chamber when the vacuum chamber rotates.

[0013] In practical applications, the powder trough may include at least one arc-shaped corner or at least one protruding unit, and the arc-shaped corner or protruding unit contacts the inner side surface of the vacuum chamber, so that the powder trough moves up and down with the protruding portion and the recessed portion.

[0014] One purpose of the present invention is to provide a vibrating thin film deposition device, wherein a powder trough is arranged on a fixed rod through a connecting bracket, and a movable mechanism is provided between the connecting bracket and the powder trough, so that the powder trough can be displaced relative to the connecting bracket and the fixed rod, for example, the powder trough can be displaced along the radial direction of the vacuum chamber and vibrate the powder in the powder trough.

[0015] In actual application, the vibration frequency and amplitude of the powder tank can be adjusted by selecting the appropriate density, height and / or rotation speed of the protrusions according to the material, size and shape of the powder, the type of precursor, the pressure, the size of the powder tank and / or the size of the vacuum chamber.

[0016] In order to achieve the above-mentioned objectives, the present invention proposes a vibrating thin film deposition device, comprising: a vacuum chamber, comprising at least one inner side surface, and forming a accommodating space in the inner side surface, wherein a plurality of protrusions are arranged on the inner side surface, and a recessed portion is formed between adjacent protrusions; a fixed rod body, located in the accommodating space of the vacuum chamber, wherein the vacuum chamber is used to rotate relative to the fixed rod body; a powder trough, located in the accommodating space of the vacuum chamber, and comprising: a box body, used to accommodate powder, and connected to the fixed rod body through a connecting bracket; and at least one protruding unit, connected to the box body, wherein when the vacuum chamber rotates, the protruding unit will displace between the protruding portion and the recessed portion, so that the powder trough displaces up and down relative to the vacuum chamber and vibrates the powder in the box body.

[0017] The present invention proposes another vibration-type thin film deposition device, comprising: a vacuum chamber, comprising at least one inner side surface, and forming a accommodating space in the inner side surface; a fixed rod body, located in the accommodating space of the vacuum chamber, wherein the vacuum chamber is used to rotate relative to the fixed rod body; a powder trough, located in the accommodating space of the vacuum chamber, and comprising: a box body, used to accommodate powder, and connected to the fixed rod body through a connecting bracket; and at least one roller, connected to the box body, and at least one protrusion is provided on the surface of the roller, wherein the roller contacts the inner side surface of the vacuum chamber, and when the vacuum chamber rotates, the roller will rotate relative to the box body and the inner side surface of the vacuum chamber, so that the powder trough moves up and down relative to the vacuum chamber to vibrate the powder in the box body.

[0018] The vibrating thin film deposition device comprises: a shaft sealing device, comprising an outer tube body and an inner tube body, the outer tube body having a setting space for accommodating the inner tube body, wherein the outer tube body is connected to the vacuum chamber, and the inner tube body is connected to the fixed rod body; and a driving unit, which drives the vacuum chamber through the outer tube body of the shaft sealing device to rotate relative to the inner tube body, the fixed rod body and the powder tank.

[0019] The vibrating thin film deposition device includes: at least one air inlet pipeline, located in the inner tube body, fluidically connected to the accommodating space of the vacuum chamber, and used to transport a precursor to the accommodating space; and at least one exhaust pipeline, located in the inner tube body, fluidically connected to the accommodating space of the vacuum chamber, and used to extract the gas in the accommodating space.

[0020] The vibration type thin film deposition device comprises a heater located around the vacuum chamber and used for heating the powder tank and powder in the vacuum chamber.

[0021] In the vibration-type thin film deposition device, the connecting bracket is connected to the box body through a movable mechanism. When the vacuum chamber rotates, the powder trough will move up and down relative to the vacuum chamber, the fixed rod body and the connecting bracket to vibrate the powder in the box body.

[0022] In the vibrating thin film deposition device, the protruding unit of the powder trough is a wheel body.

[0023] The beneficial effect of the present invention is to provide a novel vibration type thin film deposition device, which can vibrate powder in the atomic layer deposition process to form a thin film with uniform thickness on the surface of the powder. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 FIG. 1 is a schematic transverse cross-sectional view of an embodiment of a vibrating thin film deposition apparatus according to the present invention.

[0025] Figure 2 FIG. 4 is a schematic longitudinal cross-sectional view of another embodiment of a vibrating thin film deposition apparatus according to the present invention.

[0026] Figure 3 FIG. 4 is a perspective schematic diagram of another embodiment of a vibrating thin film deposition apparatus according to the present invention.

[0027] Figure 4 FIG. 4 is a schematic longitudinal cross-sectional view of another embodiment of a vibrating thin film deposition apparatus according to the present invention.

[0028] Figure 5 FIG. 1 is a schematic transverse cross-sectional view of another embodiment of a vibrating thin film deposition apparatus according to the present invention.

[0029] Explanation of the reference numerals: 10-vibrating thin film deposition device; 11-vacuum chamber; 110-inner side; 111-protrusion; 112-accommodating space; 113-recess; 114-bottom; 12-powder; 13-fixed rod; 14-heater; 15-powder tank; 151-box body; 153-protruding unit; 154-wheel body; 155-limiting protrusion; 157-roller; 1571-protrusion; 161-exhaust pipeline; 163-intake pipeline; 165-filter; 17-connecting bracket; 171-movable mechanism; 172-groove; 173-length adjustment unit; 175-spring; 18-motor; 19-shaft sealing device; 191-outer tube; 192-setting space; 193-inner tube; 194-connecting space. DETAILED DESCRIPTION

[0030] See also Figure 1 and Figure 2 , respectively, are schematic transverse and longitudinal cross-sectional views of an embodiment of a vibrating thin film deposition apparatus according to the present invention. As shown in the figures, the vibrating thin film deposition apparatus 10 primarily comprises a vacuum chamber 11, a fixed rod 13, and a powder tank 15. The vacuum chamber 11 defines a receiving space 112, within which the fixed rod 13 and powder tank 15 are disposed.

[0031] The accommodating space 112 of the vacuum chamber 11 can be cylindrical or polygonal, and includes at least one inner side 110 and at least two bottom surfaces 114. The two bottom surfaces 114 are disposed on either side of the inner side 110, for example, the two bottom surfaces 114 are parallel to each other, and the bottom surfaces 114 and the inner side 110 form the accommodating space 112 of the cylindrical or polygonal shape.

[0032] A plurality of protrusions 111 may be disposed on the inner side surface 110 , wherein a recess 113 is formed between two adjacent protrusions 111 . The protrusions 111 and the recess 113 are sequentially disposed on the inner side surface 110 of the vacuum chamber 11 .

[0033] In one embodiment of the present invention, the protrusion 111 may be an elongated protrusion, such as a semicircular column or a polygonal column, wherein the protrusion 111 may be parallel to the axis of the vacuum chamber 11 or have an angle with the axis of the vacuum chamber.

[0034] The vacuum chamber 11 is rotatable relative to the fixed rod 13. For example, the fixed rod 13 is disposed on the bottom surface 114 of the vacuum chamber 11 and is connected to the vacuum chamber 11 via a shaft seal. This allows the fixed rod 13 to remain stationary during the rotation of the vacuum chamber 11. The detailed connection between the vacuum chamber 11 and the fixed rod 13 will be described in the following embodiments.

[0035] The powder tank 15 includes a housing 151 and at least one protruding unit 153. The housing 151 is used to accommodate the powder 12, and the protruding unit 153 is disposed on the outer surface of the housing 151. The housing 151 is connected to the fixed rod 13 via a connecting bracket 17. When the vacuum chamber 11 rotates relative to the fixed rod 13, the housing 151 does not rotate with the vacuum chamber 11. The powder 12 placed in the housing 151 can be quantum dots (quantum dots), such as II-VI semiconductor materials such as ZnS, CdS, and CdSe. The thin film formed on the quantum dots can be aluminum oxide (Al2O3).

[0036] Specifically, the protruding unit 153 arranged on the outside of the box body 151 will contact the inner side surface 110 of the vacuum chamber 11. When the vacuum chamber 11 rotates, the protruding unit 153 of the box body 151 will move along with the raised portion 111 and the recessed portion 113 of the inner side surface 110, causing the powder slot 15 to move up and down relative to the vacuum chamber 11 and vibrate the powder 12 placed in the box body 151. For example, the box body 151 and the protruding unit 153 will move up and down relative to the inner side surface 110 of the vacuum chamber 11.

[0037] In one embodiment of the present invention, the powder trough 15 is connected to the fixed rod body 13 via a connecting bracket 17, wherein a movable mechanism 171 can be set between the connecting bracket 17 and the box body 151 of the powder trough 15, so that the box body 151 can be moved up and down relative to the vacuum chamber 11, the connecting bracket 17 and / or the fixed rod body 13. For example, the movable mechanism 171 can be a spring, an elastic member or a telescopic rod or other components.

[0038] like Figure 1 As shown, the protruding unit 153 provided on the box body 151 can be a wheel or an arc-shaped corner of the box body 151, wherein the wheel can be fixed to the box body 151 and does not rotate relative to the box body 151. In another embodiment of the present invention, the protruding unit 153 can be a roller that can rotate relative to the box body 151 to reduce the generation of particles during the displacement of the powder trough 15 relative to the inner side surface 110 of the vacuum chamber 11.

[0039] like Figure 2 As shown, the vacuum chamber 11 can be connected to a shaft sealing device 19. For example, the shaft sealing device 19 can be a magnetic fluid shaft seal, wherein the shaft sealing device 19 includes an outer tube 191 and an inner tube 193. The outer tube 191 has a mounting space 192, and the inner tube 193 has a connecting space 194. For example, the outer tube 191 and the inner tube 193 can be hollow cylinders. The mounting space 192 of the outer tube 191 is used to accommodate the inner tube 193, wherein the outer tube 191 and the inner tube 193 are coaxially arranged.

[0040] The motor 18 is connected to the shaft seal 19 and drives the vacuum chamber 11 to rotate through the shaft seal 19. For example, the motor 18 is connected to the vacuum chamber 11 through the outer tube 191 and drives the vacuum chamber 11 to rotate relative to the inner tube 193, the fixed rod 13, and the powder tank 15. When the motor 18 drives the outer tube 191 and the vacuum chamber 11 to rotate, the inner tube 193 remains stationary and can fix the fixed rod 13 to the inner tube 193.

[0041] The motor 18 can drive the outer tube 191 and the vacuum chamber 11 to continuously rotate in the same direction, for example, clockwise or counterclockwise. In various embodiments, the motor 18 can drive the outer tube 191 and the vacuum chamber 11 to rotate clockwise for a specific angle, and then counterclockwise for a specific angle, for example, 360 degrees.

[0042] In one embodiment of the present invention, at least one exhaust line 161 and at least one air inlet line 163 may be disposed within the connection space 194 of the inner tube 193. The exhaust line 161 and the air inlet line 163 are fluidically connected to the accommodating space 112 of the vacuum chamber 11. For example, the exhaust line 161 and the air inlet line 163 may be connected to the accommodating space 112 via a filter 165. The exhaust line 161 is used to extract gas from the accommodating space 112, thereby maintaining a low pressure in the accommodating space 112. The air inlet line 163 is used to deliver at least one precursor, a carrier gas, or a cleaning gas into the accommodating space 112 to form a thin film on the surface of the powder 12 held by the box body 151.

[0043] like Figure 2 As shown, a heater 14 may be disposed outside the vacuum chamber 11. The heater 14 is disposed around or partially around the inner side 110 of the vacuum chamber 11, or around the bottom 114 of the vacuum chamber 11, and is used to heat the powder tank 15 and powder 12 within the vacuum chamber 11. For example, the heater 14 may be a heating coil, microwave, or electromagnetic heater, disposed below the vacuum chamber 11 and adjacent to the powder tank 15. The box body 151 may be made of a thermally conductive material, such as metal, ceramic, or graphite.

[0044] In different embodiments, the heater 14 may also be a heating lamp and is adjacent to the bottom surface 114 of the vacuum chamber 11 , wherein the bottom surface 114 of the vacuum chamber 11 not connected to the shaft sealing device 19 may be made of a translucent material, such as quartz, and the heater 14 heats the powder tank 15 and / or the powder 12 in the vacuum chamber 11 through the translucent bottom surface 114 .

[0045] See also Figure 3, a perspective diagram of another embodiment of a vibrating thin film deposition apparatus according to the present invention, is shown. As shown, the powder tank 15 according to this embodiment comprises a housing 151, at least one wheel 154, and at least one stopper 155. Stopper 155 is disposed on two opposing sides of housing 151, while wheel 154 is mounted on housing 151 and is rotatable relative to housing 151.

[0046] The connecting bracket 17 is mounted on the fixed rod 13 and is connected to the limiting protrusion 155 of the box body 151 via a movable mechanism 171. In this embodiment of the present invention, the movable mechanism 171 may be U-shaped and include a groove 172, into which the limiting protrusion 155 is inserted. The limiting protrusion 155 can move along the groove 172, allowing the box body 151 connected to the limiting protrusion 155 to move up and down relative to the connecting bracket 17 and / or the fixed rod 13.

[0047] In one embodiment of the present invention, a spring may be disposed in the groove 172 and connected to the box body 151 via the spring. When the protruding unit 153 contacts the protruding portion 111 of the vacuum chamber 11, the box body 151 will move toward the inside of the groove and compress the spring. When the protruding unit 153 enters the recessed portion 113 of the vacuum chamber 11, the spring will extend.

[0048] In actual use, the powder trough 15 and the powder 12 it carries can be directly removed from the accommodating space 112 along the axial direction of the vacuum chamber 11. The powder trough 15 and powder 12, which are subsequently prepared for thin film deposition, are then inserted into the groove 172 along the axial direction of the vacuum chamber 11. When replacing the powder 12 and powder trough 15, the entire vacuum chamber 11 does not need to be removed, allowing for quick disassembly and replacement of the powder trough 15 and improving production efficiency.

[0049] Furthermore, the vibration rate of the powder trough 15 can be adjusted by adjusting the number and density of the protrusions 111 within the vacuum chamber 11 and / or the rotation speed of the vacuum chamber 11. Furthermore, the vibration amplitude of the powder trough 15 can also be adjusted by adjusting the height of the protrusions 111.

[0050] In one embodiment of the present invention, the connecting bracket 17 can be connected to the movable mechanism 171 via at least one length adjustment unit 173. The length adjustment unit 173 can be used to adjust the distance between the movable mechanism 171 and the inner side surface 110 of the vacuum chamber 11, so that the connecting bracket 17 can be connected to powder troughs 15 at different heights via the movable mechanism 171. For example, the length adjustment unit 173 can be a screw, and the height of the movable mechanism 171 can be adjusted by rotating the screw relative to the connecting bracket 17.

[0051] like Figure 4As shown, the movable mechanism 171 is a spring 175 , wherein the connecting bracket 17 is connected to the powder trough 15 via the spring 175 , so that the powder trough 15 can move up and down or shake relative to the vacuum chamber 11 , the connecting bracket 17 and / or the fixed rod 13 to vibrate the powder 12 in the powder trough 15 .

[0052] In actual use, the powder trough 15, connecting bracket 17, spring 175, and / or fixing rod 13 can be directly removed from the accommodating space 112 along the axial direction of the vacuum chamber 11. The powder trough 15, connecting bracket 17, spring 175, and / or fixing rod 13, which are subsequently prepared for thin film deposition, can be placed into the accommodating space 112 along the vacuum chamber 11. For example, a groove can be provided on the inner tube 193 facing the accommodating space 112, and the fixing rod 13 can be inserted into the groove of the inner tube 193 to complete the installation of the powder trough 15, fixing bracket 17, spring 175, and / or fixing rod 13. During the process of replacing the powder 12 and the powder trough 15, the entire vacuum chamber 11 does not need to be removed. The powder trough 15 can be quickly disassembled and replaced, and the powder trough 15, connecting bracket 17, spring 175, and / or fixing rod 13 can be positioned using the groove on the inner tube 193.

[0053] See also Figure 5 , a schematic cross-sectional view of another embodiment of a vibrating thin film deposition apparatus according to the present invention. As shown, the vibrating thin film deposition apparatus 10 primarily comprises a vacuum chamber 11, a fixed rod 13, and a powder tank 15. The vacuum chamber 11 defines a receiving space 112, within which the fixed rod 13 and powder tank 15 are disposed.

[0054] In this embodiment, the inner side surface 110 of the vacuum chamber 11 is not provided with the raised portion 111 and / or recessed portion 113. For example, the inner side surface 110 is a smooth arc surface. The powder trough 15 includes a box body 151 and a roller 157, wherein the surface of the roller 157 is provided with at least one raised portion 1571. For example, the cross-section of the roller 157 may be polygonal. The box body 151 is connected to the roller 157, wherein the roller 157 contacts the inner side surface 110 of the vacuum chamber 11. When the vacuum chamber 11 rotates, the roller 157 rotates relative to the box body 151 and the inner side surface 110 of the vacuum chamber 11, causing the powder trough 15 to move up and down relative to the vacuum chamber 11 and vibrating the powder 12 in the box body 151.

[0055] Advantages of the present invention:

[0056] A novel vibration-type thin film deposition device is provided, which can vibrate powder in an atomic layer deposition process to form a thin film with uniform thickness on the powder surface.

[0057] The above is only a preferred embodiment of the present invention and is not intended to limit the scope of the present invention. That is, all equivalent changes and modifications based on the shape, structure, characteristics and spirit described in the scope of the patent application of the present invention should be included in the scope of the patent application of the present invention.

Claims

1. A vibrating thin film deposition device, characterized in that: include: A vacuum chamber comprising at least one inner side surface and forming a receiving space in the inner side surface, wherein the inner side surface is provided with a plurality of protrusions and a plurality of recesses; a fixed rod located in the accommodating space of the vacuum chamber, wherein the vacuum chamber is configured to rotate relative to the fixed rod; A powder tank is located in the accommodating space of the vacuum chamber and includes: A box body for accommodating powder and connected to the fixed rod body via a connecting bracket, wherein the connecting bracket is connected to the box body via a movable mechanism, and the movable mechanism includes a groove; At least one limiting protrusion is provided on two opposite sides of the box body, and the limiting protrusion is inserted into the groove; and At least one protruding unit is connected to the box body, wherein when the vacuum chamber rotates, the protruding unit will move between the raised portion and the recessed portion, and the limiting protrusion can move along the groove, so that the box body connected to the limiting protrusion moves up and down relative to the connecting bracket and / or the fixed rod body, and the powder trough moves up and down relative to the vacuum chamber, and vibrates the powder in the box body.

2. The vibrating thin film deposition device according to claim 1, wherein: include: A shaft sealing device, comprising an outer tube and an inner tube, wherein the outer tube has a space for accommodating the inner tube, wherein the outer tube is connected to the vacuum chamber, and the inner tube is connected to the fixing rod; and A driving unit drives the vacuum chamber through the outer tube of the shaft sealing device to rotate relative to the inner tube, the fixed rod and the powder tank.

3. The vibrating thin film deposition device according to claim 2, characterized in that: include: At least one air inlet line, located in the inner tube, fluidically connected to the accommodating space of the vacuum chamber, and used for delivering a precursor to the accommodating space; and At least one exhaust pipeline is located in the inner tube body, is fluidically connected to the accommodating space of the vacuum chamber, and is used to extract gas from the accommodating space.

4. The vibrating thin film deposition device according to claim 1, wherein: A heater is included which is located around the vacuum chamber and is used for heating the powder tank and the powder in the vacuum chamber.

5. The vibrating thin film deposition device according to claim 1, wherein: The protruding unit of the powder trough is a wheel body.

6. A vibrating thin film deposition device, characterized in that: include: A vacuum chamber comprising at least one inner side surface and forming a receiving space within the inner side surface; a fixed rod located in the accommodating space of the vacuum chamber, wherein the vacuum chamber is configured to rotate relative to the fixed rod; A powder tank is located in the accommodating space of the vacuum chamber and includes: A box body for accommodating powder and connected to the fixed rod body via a connecting bracket, wherein the connecting bracket is connected to the box body via a movable mechanism, and the movable mechanism includes a groove; At least one limiting protrusion is provided on two opposite sides of the box body, and the limiting protrusion is inserted into the groove; and At least one roller is connected to the box body, and at least one protrusion is provided on the surface of the roller, wherein the roller contacts the inner side surface of the vacuum chamber. When the vacuum chamber rotates, the roller rotates relative to the box body and the inner side surface of the vacuum chamber. The limiting protrusion can be displaced along the groove, so that the box body connected to the limiting protrusion is displaced up and down relative to the connecting bracket and / or the fixing rod body, and the powder trough is displaced up and down relative to the vacuum chamber to vibrate the powder in the box body.

7. The vibrating thin film deposition device according to claim 6, wherein: include: A shaft sealing device, comprising an outer tube and an inner tube, wherein the outer tube has a space for accommodating the inner tube, wherein the outer tube is connected to the vacuum chamber, and the inner tube is connected to the fixing rod; and A driving unit drives the vacuum chamber through the outer tube of the shaft sealing device to rotate relative to the inner tube, the fixed rod and the powder tank.

8. The vibrating thin film deposition device according to claim 7, wherein: include: At least one air inlet line, located in the inner tube, fluidically connected to the accommodating space of the vacuum chamber, and used for delivering a precursor to the accommodating space; and At least one exhaust pipeline is located in the inner tube body, is fluidically connected to the accommodating space of the vacuum chamber, and is used to extract gas from the accommodating space.

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