A method for manufacturing a backlight module, a backlight module and a display module

Abstract

The present invention discloses a method for manufacturing a backlight module, a backlight module and a display module. In the method for manufacturing a backlight module disclosed in the present invention, since the set distance between the surface of the first fixed structure facing away from the light-emitting substrate and the light-emitting substrate is greater than the height of the side wall of the back plate, when the back plate moves between the first fixed part and the second fixed part, the side wall and the light-emitting substrate are not in contact, and it can be determined in advance whether there will be interference between the side wall and the light-emitting substrate. When it is determined that there will be no interference between the side wall and the light-emitting substrate, the back plate is continuously moved toward the side of the light-emitting substrate until the back plate and the light-emitting substrate are attached, which can reduce the probability of interference between the side wall of the back plate and the light-emitting substrate, reduce the risk of light-emitting substrate fragmentation, and improve the yield rate.

Description

Technical Field

[0001] The present invention relates to the field of display technology, and in particular to a method for manufacturing a backlight module, a backlight module and a display module. Background Art

[0002] In a display device, a light-emitting module can be used as the light source of a passive display panel, wherein the substrate of the light-emitting module can be glass. However, during the production and transportation process, glass is easily broken, and it is usually necessary to fix and assemble the glass with a metal backplane to improve the mechanical strength.

[0003] The display panel and the light-emitting module need to be connected to two different circuit boards respectively, and then connected to the driver board through the circuit boards. At present, in order to meet the demand for narrowing the frame of the display device, two flexible printed circuits (FPCs) are usually used to connect the display panel and the light-emitting module respectively, and then the two FPCs are bent together to the side of the backplane away from the display panel to connect to the driver board. During the bending process, the two FPCs are prone to interference, which is not conducive to subsequent connection and further narrowing of the frame. Summary of the invention

[0004] The invention provides a method for manufacturing a backlight module, a backlight module and a display module, which are used to solve the problem of broken pieces caused by interference between the side wall of a back plate and a light-emitting substrate during the perforation process of a flexible circuit board.

[0005] A first aspect of the present invention provides a method for manufacturing a backlight module, comprising:

[0006] A light-emitting substrate is provided and placed on a fixed machine; a flexible circuit board structure is connected to the light-emitting substrate; on a side of the light-emitting substrate away from the fixed machine, the flexible circuit board structure includes an active area relative to the light-emitting substrate, the active area includes a fixed end connected to the light-emitting substrate and a free end away from the fixed end; and between the fixed end and the free end, there is also a first fixing portion and a second fixing portion sequentially arranged in a direction from the fixed end to the free end;

[0007] The free end is bent toward a side away from the light-emitting substrate, and the first fixing portion is fixed by a first fixing structure; a surface of the first fixing structure on a side away from the light-emitting substrate is at a set distance from the light-emitting substrate;

[0008] A back plate is provided, and the back plate is moved from a starting position of the first fixed structure away from the light-emitting substrate to a side close to the light-emitting substrate, and the free end is passed through the slot of the back plate; the back plate includes a bottom plate and a side wall vertically contacting the bottom plate; the slot is located on the bottom plate and passes through the bottom plate; the height of the side wall is less than the set distance;

[0009] When the back panel moves between the first fixing part and the second fixing part, if it is determined that the side wall does not interfere with the light-emitting substrate, the second fixing part is fixed by the second fixing structure, and the first fixing structure is detached from the first fixing part, so that the back panel continues to move toward the side close to the bottom panel until the back panel is in contact with the light-emitting substrate.

[0010] In the method provided by the present invention, along the width direction of the slot, the side wall is located on at least one side of the slot; the width direction is perpendicular to the extension direction of the bending axis when the free end is bent toward a side away from the light-emitting substrate;

[0011] Along the width direction of the slot, the side wall on either side of the slot satisfies the following relationship with the slot:

[0012] D 2 -H 2 <G 2 ;

[0013] Among them, D represents the length of the flexible circuit board structure between the end of the first fixing portion away from the fixed end and the fixed end; H represents the height of the side wall; G represents the distance between the edge of the light-emitting substrate close to the side wall and the side wall when the positive projection of the fixed end on the bottom plate coincides with the groove wall of the groove close to the side wall.

[0014] In the method provided by the present invention, the distance between the first fixing portion and the second fixing portion is greater than the thickness of the bottom plate.

[0015] The method provided by the present invention also includes:

[0016] When the back plate moves between the first fixing portion and the second fixing portion, if the side wall interferes with the light emitting substrate, the relative position between the back plate and the light emitting substrate is adjusted so that the side wall does not interfere with the light emitting substrate.

[0017] A second aspect of the present invention provides a backlight module, comprising:

[0018] The light-emitting substrate and the back panel; the light-emitting substrate is attached to the back panel;

[0019] A flexible circuit board structure is connected to the light-emitting substrate; the flexible circuit board structure includes an active area relative to the light-emitting substrate; the active area includes a fixed end connected to the side of the light-emitting substrate facing the back plate, and a free end away from the fixed end; between the fixed end and the free end, there is also a first fixing portion and a second fixing portion sequentially arranged along the direction from the fixed end to the free end;

[0020] The back plate includes a base plate and a side wall vertically contacting the base plate; the side wall is located on the side of the base plate facing the light-emitting substrate; the length of the flexible circuit board structure between the end of the first fixing portion away from the fixed end and the fixed end is greater than the height of the side wall; the base plate has a groove running through the thickness direction of the base plate; the free end of the flexible circuit board structure passes through the groove to reach the side of the back plate away from the light-emitting substrate.

[0021] In the backlight module provided by the present invention, along the width direction of the slot, the side wall is located on at least one side of the slot; the width direction is perpendicular to the extension direction of the bending axis when the free end is bent toward a side away from the light-emitting substrate;

[0022] Along the width direction of the slot, the side wall on either side of the slot satisfies the following relationship with the slot:

[0023] D 2 -H 2 <G 2 ;

[0024] Among them, D represents the length of the flexible circuit board structure between the end of the first fixing portion away from the fixed end and the fixed end; H represents the height of the side wall; G represents the distance between the edge of the first substrate close to the side wall and the side wall when the orthographic projection of the fixed end on the bottom plate coincides with the groove wall of the groove close to the side wall.

[0025] In the backlight module provided by the present invention, the distance between the first fixing portion and the second fixing portion is greater than the thickness of the bottom plate.

[0026] In the backlight module provided by the present invention, the flexible circuit board structure includes only one flexible circuit board; or,

[0027] The flexible circuit structure includes at least two electrically connected flexible circuit boards.

[0028] In the backlight module provided by the present invention, the flexible circuit structure includes a first flexible circuit board and a second flexible circuit board; one end of the first flexible circuit board is bound to a side of the driving substrate on which the light-emitting device is arranged, the other end of the first flexible circuit board is bent to a side of the driving substrate away from the light-emitting device, and is connected to one end of the second flexible circuit board through a connector, and the other end of the second flexible circuit board passes through the slot to reach a side of the back plate away from the light-emitting substrate;

[0029] The flexible circuit board structure includes peripheral areas located on both sides of the connector in the extension direction of the flexible circuit board structure; the peripheral areas are provided with protrusions and / or openings for connecting the connector; at least part of the peripheral area is fixed on the side of the driving substrate away from the light-emitting device.

[0030] A third aspect of the present invention provides a display module, comprising:

[0031] A display panel and any one of the above-mentioned backlight modules, wherein the backlight module is located at the light incident side of the display panel.

[0032] The beneficial effects of the present invention are as follows:

[0033] The present invention provides a method for manufacturing a backlight module, a backlight module and a display module. During the manufacturing process of the backlight module, since the set distance between the surface of the first fixed structure facing away from the light-emitting substrate and the light-emitting substrate is greater than the height of the back panel side wall, when the back panel moves between the first fixed part and the second fixed part, the side wall and the light-emitting substrate are not in contact, and it can be determined in advance whether there will be interference between the side wall and the light-emitting substrate. When it is determined that there will be no interference between the side wall and the light-emitting substrate, the back panel is continuously moved toward the side of the light-emitting substrate until the back panel and the light-emitting substrate are attached, which can reduce the probability of interference between the back panel side wall and the light-emitting substrate, reduce the risk of light-emitting substrate fragmentation, and improve the yield rate. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings required for use in the embodiments of the present invention will be briefly introduced below. Obviously, the accompanying drawings introduced below are only some embodiments of the present invention. For ordinary technicians in this field, other accompanying drawings can be obtained based on these accompanying drawings without paying creative work.

[0035] Figure 1 It is one of the cross-sectional structural schematic diagrams of a display device in the related art;

[0036] Figure 2 The second schematic diagram of the cross-sectional structure of a display device in the related art;

[0037] Figure 3 It is a schematic diagram of the light-emitting substrate FPC perforation process in the related art;

[0038] Figure 4 A flow chart of a method for manufacturing a backlight module provided by an embodiment of the present invention;

[0039] Figure 5 One of the schematic diagrams of the backlight module manufacturing process provided by the embodiment of the present invention;

[0040] Figure 6 The second schematic diagram of the backlight module manufacturing process provided by the embodiment of the present invention;

[0041] Figure 7 The third schematic diagram of the backlight module manufacturing process provided by the embodiment of the present invention;

[0042] Figure 8 A fourth schematic diagram of a backlight module manufacturing process provided by an embodiment of the present invention;

[0043] Fig. 9 One of the schematic diagrams of bending the flexible circuit board structure provided by an embodiment of the present invention;

[0044] Fig.10 The second schematic diagram of the bending structure of the flexible circuit board provided by the embodiment of the present invention;

[0045] Fig.11 A fifth schematic diagram of a backlight module manufacturing process provided by an embodiment of the present invention;

[0046] Fig.12 A schematic diagram of the cross-sectional structure of a backlight module provided by an embodiment of the present invention;

[0047] Fig.13 One of the cross-sectional structural schematic diagrams of the flexible circuit board structure provided by an embodiment of the present invention;

[0048] Fig.14 A second schematic diagram of a cross-sectional structure of a flexible circuit board structure provided by an embodiment of the present invention;

[0049] Fig.15 It is a schematic diagram of a top view of a flexible circuit board structure in the related art;

[0050] Fig.16 A schematic diagram of a top view of a flexible circuit board structure provided by an embodiment of the present invention;

[0051] Fig.17 A schematic diagram of the cross-sectional structure of a display module provided by an embodiment of the present invention.

[0052] Among them, 100-backlight module, 1-light-emitting substrate, 11-driving substrate, 12-light-emitting device, 2-back plate, 21-bottom plate, 22-side wall, 3-diffuser plate, 4-optical module, 5-reflector, F1, F2-flexible circuit board, K-groove, F11-bending part, 300-fixed machine, 6-flexible circuit board structure, 61-active area, 611-fixed end, 612-free end, 613-first fixed part, 614-second fixed part, 62-fixed area, T1-first fixed structure, T2-second fixed structure, W-width direction of the groove, 13-buffer layer, 610-first flexible circuit board, 620-second flexible circuit board, 630-connector, S1-first peripheral area, S2-second peripheral area, S3-fitting area. DETAILED DESCRIPTION

[0053] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and understandable, the present invention will be further described below with reference to the accompanying drawings and examples. However, the exemplary embodiments can be implemented in various forms and should not be understood as being limited to the embodiments described herein; on the contrary, these embodiments are provided to make the present invention more comprehensive and complete, and to fully convey the concepts of the exemplary embodiments to those skilled in the art. The same figure marks in the figures represent the same or similar structures, and thus their repeated descriptions will be omitted. The words expressing position and direction described in the present invention are all explained using the accompanying drawings as examples, but changes can be made as needed, and the changes made are all included in the scope of protection of the present invention. The drawings of the present invention are only used to illustrate the relative position relationship and do not represent the true proportions.

[0054] Figure 1 It is one of the cross-sectional structural schematic diagrams of a display device in the related art; Figure 2 This is the second schematic diagram of the cross-sectional structure of a display device in the related art.

[0055] In related technologies, such as Figure 1 and Figure 2 As shown, a liquid crystal display device generally includes a display panel 100 and a backlight module 200 .

[0056] The display panel 200 is a liquid crystal display panel. The liquid crystal display panel includes an array substrate and an opposite substrate arranged opposite to each other, and a liquid crystal layer (not shown in the figure) located between the array substrate and the opposite substrate. Voltage is applied through the pixel electrodes in the array substrate to drive the liquid crystal molecules in the liquid crystal layer to deflect, modulate the incident light, and thus realize image display. If a color filter is added, a color image can be displayed.

[0057] The backlight module 200 is located at the light incident side of the display panel 100. The backlight module generally includes a light emitting substrate 1, a back plate 2, a diffusion plate 3, an optical film 4 and a reflective sheet 5.

[0058] The light-emitting substrate 1 is used to provide backlight light, such as Figure 1As shown, the light-emitting substrate 1 is usually fixed on the back plate 2 to improve the mechanical strength. The light-emitting substrate 1 includes a driving substrate 11 and a light-emitting device 12 located on the driving substrate. The light-emitting device 12 is electrically connected to the driving substrate 11, and the driving substrate 11 can provide a driving signal to the light-emitting device 12 to drive the light-emitting device 11 to emit light as a light source for the backlight. Among them, the light-emitting device 12 can be a light-emitting diode (Light Emititng Diode, referred to as LED), a miniature light-emitting diode (Mini Light Emititng Diode, referred to as Mini LED), etc. Among them, Mini LED refers to a miniature light-emitting diode chip with a size of less than 500μm. Mini LED has a smaller size, which means that more light-emitting devices can be set on the driving substrate of the same area, so that a higher brightness range can be provided, and it is conducive to realizing partitioned brightness control and improving the dynamic contrast of the display screen. The driving substrate can usually be a printed circuit board (Printed Circuit Board, referred to as PCB) or a glass-based thin film transistor (Thin Film Transistor, referred to as TFT) substrate, etc.

[0059] The back plate 2 is located on the side of the light-emitting substrate 1 away from the display panel, and has a supporting and bearing function. The shape of the back plate 2 is adapted to the shape of the backlight module. The material of the back plate 2 can be aluminum, iron, aluminum alloy or iron alloy. The back plate 2 also plays a role in heat dissipation for the light-emitting substrate 1.

[0060] The diffuser 3 is located on the light-emitting side of the light-emitting substrate 1 and is at a certain distance from the light-emitting substrate 1. The distance is set to allow sufficient light mixing between the light sources on the light-emitting substrate. The function of the diffuser 3 is to scatter the incident light so that the light passing through the diffuser 3 is more uniform.

[0061] The diffuser 3 is provided with scattering particle material, and the light incident on the scattering particle material will be refracted and reflected continuously, thereby achieving the effect of scattering the light and achieving the effect of uniform light. The thickness of the diffuser is usually set to 1.5mm-3mm. The thicker the diffuser, the greater the haze and the better the uniform effect.

[0062] The diffusion plate 3 can usually be processed by an extrusion process, and the material used for the diffusion plate 3 is generally selected from at least one of polymethyl methacrylate PMMA, polycarbonate PC, polystyrene material PS, and polypropylene PP.

[0063] The optical film 4 is located on the side of the diffuser 3 away from the light-emitting substrate 1. In a specific implementation, the optical film 4 includes one or more combinations of a prism sheet and a brightness enhancement film, etc., which are arranged according to specific needs and are not limited here. When the light-emitting device emits blue light, the optical film 4 may also include a quantum dot film, which emits green light and red light under the excitation of blue light, thereby mixing into white light for backlighting.

[0064] The reflective sheet 5 is located on the side of the light-emitting substrate 1 away from the back plate 2. The reflective sheet 5 includes a plurality of openings for exposing the light-emitting device 12. The reflective sheet 5 is used to reflect the light incident on one side of the back plate 2 to one side of the diffuser plate 3, thereby improving the utilization rate of the light. The reflective sheet 5 can also use a reflective layer, which can usually be made of white oil.

[0065] like Figure 1 As shown, a support column can be provided between the light-emitting substrate 1 and the diffuser 3 to support the diffuser 3 and the optical film 4. The support column also forms a light mixing distance between the diffuser 3 and the light-emitting substrate 1 so that the light sources on the light-emitting substrate can be fully mixed.

[0066] In specific implementation, the display panel 200 and the light-emitting substrate 1 need to be connected to two different circuit boards respectively, and then connected to the driving board through the flexible circuit board to provide a driving signal through the driving board. Figure 1 As shown, currently, in order to meet the demand for narrowing the frame of the display device, two flexible printed circuits (FPC) F1 and F2 are usually used to connect the display panel 200 and the light-emitting substrate 100 respectively, and then the two FPCs are bent together to the side of the back plate 2 away from the display panel 200 to connect with the driving board. During the bending process, the two FPCs are prone to interference, which is not conducive to the subsequent connection with the driving board and further narrowing of the frame.

[0067] In order to solve the above problems, Figure 2 As shown, in the related art, a groove H is opened on the back plate 2, and the flexible circuit board F1 connected to the light-emitting substrate 1 passes through the groove to reach the side of the back plate 2 away from the light-emitting substrate 1, thereby avoiding interference between the flexible circuit board F2 connected to the light-emitting substrate 1 and the flexible circuit board F1 connected to the display panel 200, and further reducing the frame width.

[0068] Figure 3 It is a schematic diagram of the light-emitting substrate FPC perforation process in the related art.

[0069] In the related art, when the flexible circuit board F1 bound to the light-emitting substrate 1 is passed through the slot of the back plate 2, the light-emitting substrate 1 is usually placed on the fixed machine 300 first. It should be understood that since the surface of the light-emitting substrate 1 provided with the light-emitting device 12 is arranged opposite to the fixed machine 300, in order to prevent the light-emitting device 12 from being scratched or bumped during this process and affecting the yield of the product, a protective structure can be provided on the side of the light-emitting device 12 away from the driving substrate 11. For example, a protective film layer with a flat surface is made of transparent silicone to cover all the light-emitting devices 12; or a separate arc surface protection structure is provided on each light-emitting device 12, which is not limited here; then, the flexible circuit board F1 is bent to the side away from the light-emitting substrate 1, and the bent portion F11 of the flexible circuit board F1 is fixed by a fixing mechanism so that the bent portion F11 of the flexible circuit board F1 is perpendicular to the light-emitting substrate. Then, the back plate 2 is clamped to the top of the light-emitting substrate 1 by the robotic arm, and moved from the top of the light-emitting substrate 1 to the direction close to the light-emitting substrate 1. During the movement, the end of the flexible circuit board F1 away from the light-emitting substrate 1 passes through the slot, and finally the back plate 2 is moved to fit together with the light-emitting substrate 1.

[0070] like Figure 3 As shown, some back plates 2 are provided with side walls 21 protruding toward one side of the light-emitting substrate 1. The side walls 21 are generally used for fixing and assembling subsequent film layers after the light-emitting substrate 1 is attached to the back plate 2, for example, for supporting and fixing film layers such as a diffuser located on the light-emitting side of the light-emitting substrate. In specific implementation, the side walls 21 can be designed as a continuous structure arranged around the back plate 2, or the side walls 21 can be designed as a plurality of discontinuous structures arranged at intervals around the back plate 2, which is not limited here. The area enclosed by the side walls 21 can form an installation space for installing the light-emitting substrate.

[0071] Although designers usually intentionally reserve a certain gap between the side wall 21 and the light-emitting substrate 1 to avoid interference between the light-emitting substrate 1 and the side wall 21, the reserved gap will not be too large, generally around 0.9 mm, in consideration of the effect of narrowing the frame. Figure 3 As shown in the figure, when the flexible circuit board F1 is bent toward the side away from the light-emitting substrate 1, the angle formed between the bent portion F11 and the light-emitting substrate 1 is too large or too small, or when the back plate moves toward the side close to the light-emitting substrate, the mechanical arm shakes, etc., which may cause the relative position between the back plate and the light-emitting substrate to shift compared with the designed position, thereby causing interference between the side wall 21 and the light-emitting substrate 1, resulting in the risk of the light-emitting substrate 1 being hit by the side wall 21 and broken. When the light-emitting substrate 1 uses a glass-based TFT substrate as a driving substrate, the defective rate caused by the extrusion and fragmentation caused by the interference between the side wall and the light-emitting substrate exceeds 10% during actual operation.

[0072] In view of this, the present application provides a method for manufacturing a backlight module, which can solve the above problems.

[0073] Figure 4 A flow chart of a method for manufacturing a backlight module provided by an embodiment of the present invention; Figure 5 One of the schematic diagrams of the backlight module manufacturing process provided by the embodiment of the present invention; Figure 6 The second schematic diagram of the backlight module manufacturing process provided by the embodiment of the present invention; Figure 7 The third schematic diagram of the backlight module manufacturing process provided by the embodiment of the present invention; Figure 8 The fourth schematic diagram of the backlight module manufacturing process provided by the embodiment of the present invention.

[0074] like Figure 4 As shown, the method for manufacturing a backlight module provided by an embodiment of the present invention comprises the following steps:

[0075] S410: providing a light-emitting substrate, and placing the light-emitting substrate on a fixed machine; a flexible circuit board structure is connected to the light-emitting substrate; on a side of the light-emitting substrate away from the fixed machine, the flexible circuit board structure includes an active area relative to the light-emitting substrate, the active area includes a fixed end connected to the light-emitting substrate and a free end away from the fixed end; between the fixed end and the free end, there is also a first fixing portion and a second fixing portion sequentially arranged in a direction from the fixed end to the free end;

[0076] S420: bending the free end toward a side away from the light-emitting substrate, and fixing the first fixing portion by a first fixing structure; a surface of the first fixing structure away from the light-emitting substrate is at a set distance from the light-emitting substrate;

[0077] S430: providing a back plate, moving the back plate from a starting position of the first fixed structure away from the light-emitting substrate to a side close to the light-emitting substrate, and passing the free end through the slot of the back plate; the back plate includes a bottom plate and a side wall vertically contacting the bottom plate; the slot is located on the bottom plate and passes through the bottom plate; the height of the side wall is less than the set distance;

[0078] S440: When the back panel moves to between the first fixing portion and the second fixing portion, if it is determined that the side wall does not interfere with the light-emitting substrate, fix the second fixing portion by the second fixing structure, and detach the first fixing structure from the first fixing portion, so that the back panel continues to move toward the side close to the bottom panel until the back panel is in contact with the light-emitting substrate.

[0079] like Figure 5 As shown, firstly, a light-emitting substrate is provided, and then the light-emitting substrate is placed on a fixed platform.

[0080] In the embodiment of the present invention, a flexible circuit board structure 6 is connected to the light-emitting substrate 1. On the side of the light-emitting substrate 1 away from the fixed machine 300, the flexible circuit board structure 6 includes an active area 61 relative to the light-emitting substrate. The active area 61 includes a fixed end 611 connected to the light-emitting substrate 6 and a free end 612 away from the fixed end 611. Between the fixed end 611 and the free end 612, there are also a first fixing portion 613 and a second fixing portion 614 sequentially arranged in a direction from the fixed end to the free end.

[0081] The fixed end 611 is fixed on the light-emitting substrate, and the active area 61 can be bent relative to the light-emitting substrate 1, so that the free end 612 is bent to a side away from the light-emitting substrate 1. The first fixing portion 613 and the second fixing portion 614 are used to connect the active area 61 with the fixing structure after the active area 61 is bent to fix the active area 61.

[0082] In specific implementation, a reinforcing layer can be made on the surface of the active area 61 of the flexible circuit board structure 6 to improve the strength of the active area 61 after bending, so that the active area 61 can maintain its shape after bending. The reinforcing layer can be a flexible film layer such as a metal layer, which is not limited here.

[0083] In the embodiment of the present invention, the light-emitting substrate 1 includes a driving substrate 11 and a light-emitting device 12. In a specific implementation, the light-emitting device 12 is placed facing the fixed machine 300, and the fixed end 611 of the active area 61 is fixed to the side of the driving substrate 11 away from the light-emitting device 12. The driving substrate 11 is used to drive the light-emitting device 12 to emit light, and it can be a circuit board with a driving function such as a PCB board or a glass-based TFT substrate, which is not limited here.

[0084] One end of the flexible circuit board structure 6 is bound to the light-emitting substrate 1 and electrically connected to the driving substrate 11 , and the other end is connected to the control board of the display device to provide a control signal.

[0085] When implementing it, Figure 5 As shown, one end of the flexible circuit board structure 6 is bound to the side of the driving substrate 11 where the light emitting device 12 is arranged, and the other end is bent to the side of the driving substrate 11 away from the light emitting device 12. On the side of the driving substrate 11 away from the light emitting device 12, at least a part of the flexible circuit board structure 6 is connected to the driving substrate 11 through the adhesive layer to form a fixed area 62, and the rest of the flexible circuit board structure 6 forms an active area 61.

[0086] The flexible circuit board structure 6 may be a single flexible circuit board, or an extended structure formed by connecting at least two flexible circuit boards end to end. When the flexible circuit board structure 6 is connected by at least two flexible circuit boards, the length of the flexible circuit board structure 6 can be extended to avoid affecting the subsequent perforation process due to insufficient length of a single flexible circuit board, and the connection distance with the control board of the display device can be extended.

[0087] like Figure 6 As shown, after placing the light-emitting substrate on the fixed machine, the free end 612 is bent toward the side away from the light-emitting substrate, and the first fixing portion 613 is fixed by the first fixing structure T1. Among them, the surface of the first fixing structure T1 on the side away from the light-emitting substrate 11 is at a set distance h1 from the light-emitting substrate. For the backlight module of the same product, the distance between the first fixing structure and the light-emitting substrate is usually fixed. For the backlight modules of different products, the size of the set distance h1 can be adjusted by adjusting the position of the first fixing structure relative to the light-emitting substrate to meet the needs of different products. Since the first fixing structure is connected to the first fixing portion to fix the active area, the length of the flexible circuit board structure between the end of the first fixing portion away from the fixed end and the fixed end needs to be greater than the set distance h1, so that the length of the section of the flexible circuit board structure meets the fixing requirements. In specific implementation, the first fixing structure T1 can be a magnetic suction device or a vacuum suction device, so as to facilitate the suction and fixation of the first fixing portion 613, and facilitate the subsequent removal of the first fixing structure T1 from the flexible circuit structure 6.

[0088] like Figure 7 As shown, after the active area is bent and fixed by the first fixing structure T1, the back plate 2 is moved from the starting position of the first fixing structure away from the light-emitting substrate, to the side close to the light-emitting substrate, and the free end 612 passes through the slot K of the back plate 2. In specific implementation, the back plate 2 can be picked up by a clamping device or a fixing device such as a robotic arm, and the back plate 2 can be transferred to the side of the first fixing structure away from the light-emitting substrate, and the back plate 2 can be moved to the side close to the light-emitting substrate at the starting position preset by the robotic arm control program, so that the free end can pass through the slot K of the back plate 2. The starting position can be the position of the back plate 2 when the free end 612 can pass through the slot K of the back plate 2 after the relative position between the slot K and the free end is adjusted by the alignment mechanism.

[0089] The back plate 2 includes a bottom plate 22 and a side wall 21 in vertical contact with the bottom plate. The slot K is located on the bottom plate 22 and penetrates the bottom plate 22. The height H of the side wall 21 is less than the set distance h1.

[0090] like Figure 8As shown, when the back panel moves between the first fixing portion 613 and the second fixing portion 614, if it is determined that the side wall does not interfere with the light-emitting substrate, the second fixing portion 614 is fixed by the second fixing structure T2, and the first fixing structure T1 is detached from the first fixing portion 613, so that the back panel continues to move to the side close to the bottom plate until the back panel is attached to the light-emitting substrate. After the back panel is attached to the light-emitting substrate, the second fixing structure T2 is detached from the second fixing portion. In specific implementation, the second fixing structure can be a magnetic suction device or a vacuum suction device to facilitate the suction and fixation of the second fixing portion 614, and facilitate the subsequent removal of the second fixing structure 613 from the flexible circuit structure 6.

[0091] In the embodiment of the present invention, since the set distance h1 between the surface of the first fixed structure T1 facing away from the light-emitting substrate 11 and the light-emitting substrate 1 is greater than the height H of the back panel side wall 21, when the back panel moves between the first fixing portion 613 and the second fixing portion 614, the side wall 21 and the light-emitting substrate 1 are not in contact. At this time, it is determined in advance whether there will be interference between the side wall and the light-emitting substrate through manual judgment by the operator or automatic judgment by the industrial camera combined with the image analysis software. When it is determined that there will be no interference between the side wall and the light-emitting substrate, continue to move the back panel toward the side of the light-emitting substrate until the back panel fits with the light-emitting substrate, which can reduce the probability of interference between the back panel side wall and the light-emitting substrate, reduce the risk of light-emitting substrate fragmentation, and improve the yield rate.

[0092] In specific implementation, the size of the slot K on the bottom plate is usually designed to allow the active area of ​​the flexible circuit board structure to pass through the slot K, while the first fixed structure T1 cannot pass through the slot K. Therefore, when the back plate moves toward the side close to the light-emitting substrate to fit the back plate with the light-emitting substrate, when the back plate moves to the position in contact with the first fixed structure, the back plate cannot continue to move downward due to the obstruction of the first fixed structure. The blocking effect of the first fixed structure can be used to avoid the risk of the back plate continuing to move downward and squeezing the light-emitting substrate to cause the light-emitting substrate to break when there is interference between the side wall of the back plate and the light-emitting substrate.

[0093] In some embodiments, when the back panel moves between the first fixing portion and the second fixing portion, if it is determined through judgment that there is a risk of interference between the side wall and the light-emitting substrate, the relative position between the back panel and the light-emitting substrate can be adjusted by a robotic arm so that the back panel reaches a position where there is no interference between the side wall and the light-emitting substrate, and then the back panel and the light-emitting substrate continue to be fitted together to reduce the risk of fragmentation.

[0094] Fig. 9 One of the schematic diagrams of bending the flexible circuit board structure provided by an embodiment of the present invention; Fig.10 The second schematic diagram of the bending structure of the flexible circuit board provided in the embodiment of the present invention.

[0095] In some embodiments, Fig. 9 and Fig.10 As shown, along the width direction W of the slot K, the side wall 21 is located on at least one side of the slot K. The width direction W is perpendicular to the extension direction of the bending axis when the free end is bent toward the side away from the light-emitting substrate. Fig. 9 As shown, the extension direction of the bending axis is perpendicular to the paper surface (cross section).

[0096] Along the width direction W of the slot, the side wall 21 located on either side of the slot K satisfies the following relationship with the slot K:

[0097] D 2 -H 2 <G 2 ;

[0098] Among them, D represents the length of the flexible circuit board structure between the end of the first fixing portion away from the fixed end and the fixed end; H represents the height of the side wall; G represents the distance between the edge of the first substrate close to the side wall and the side wall when the orthographic projection of the fixed end on the bottom plate coincides with the groove wall of the groove close to the side wall.

[0099] Specifically, if Fig. 9 As shown, taking the case where there is a side wall 21 on the left side of the groove K along the width direction W of the groove as an example, when the orthographic projection of the fixed end 611 on the bottom plate 22 coincides with the groove wall of the groove K close to the left side wall, the distance G between the edge of the light-emitting substrate 1 close to the left side wall 21 and the side wall can be used to limit the maximum distance that the light-emitting substrate 1 can theoretically move to the left in the width direction W of the groove when the orthographic projection of the fixed end 611 on the bottom plate 22 coincides with the groove wall of the groove K close to the left side wall. When the distance that the light-emitting substrate moves to the left is greater than G, the side wall 21 interferes with the light-emitting substrate.

[0100] like Figure 7 and Fig.10 As shown, since the first fixing portion 613 is fixed by the first fixing structure T1, when the distance between the first fixing structure T1 and the light-emitting substrate is a constant value h1, the distance H1 between the end of the first fixing portion 613 away from the fixing end 611 and the light-emitting substrate 1 is also a constant value, and the first fixing portion 613 is fixed by the first fixing structure T1, and the end of the first fixing portion 613 away from the light-emitting substrate is just flush with the side of the first fixing structure T1 away from the light-emitting substrate, H1=h1. Then, when the length of the flexible circuit board structure between the end of the first fixing portion 613 away from the fixing end 611 and the fixing end 611 is D, in the width direction W of the slot K, the maximum distance actually moved when the light-emitting substrate 1 moves to the left (or right, not shown in the figure) is G1 ( Fig.10 The position of the fixed end 611 is relative to Fig. 9The distance that the position of the fixed end 611 moves in the width direction W of the slot K), After the first fixing portion 613 is fixed by the first fixing structure T1, H1 is a fixed value, and G1 depends on the length of D (when the end of the first fixing portion 613 away from the fixing end 611 and the flexible circuit board structure between the fixing end 611 are completely straightened, G1 is the largest).

[0101] like Figure 7 As shown, when the back plate and the light-emitting substrate are attached, the set distance h1 between the surface of the first fixing structure 613 on the side away from the light-emitting substrate 1 and the light-emitting substrate is greater than the height H of the side wall 21. Since the first fixing structure 613 is fixed by the first fixing portion T1, H1=h1, then the distance H1 between the end of the first fixing portion 613 away from the fixing end 611 and the light-emitting substrate 1 is also greater than H, thereby obtaining: G1 2 <D 2 -H 2 .

[0102] Then, when the orthographic projection of the fixed end 611 on the bottom plate 22 coincides with the groove wall of the groove K close to the left side wall, it should be ensured that G 2 >G1 2 , that is, G 2 >D 2 -H 2 That is, the maximum distance G that the light-emitting substrate can theoretically move to the left in the width direction W of the groove is greater than the maximum distance G1 that the light-emitting substrate actually moves in the width direction W of the groove, which can avoid the light-emitting substrate from being offset too much in the width direction W of the groove and interfering with the side wall of the back panel.

[0103] When the orthographic projection of the fixed end 611 on the bottom plate 22 is located between the left side wall and the right side wall of the slot K, the distance between the edge of the light-emitting substrate 1 close to the left side wall 21 and the left side wall is G. ′ , G ′ It can be used to limit the maximum distance that the light-emitting substrate 1 can theoretically move to the left in the width direction W of the slot. ′ >G, that is, the maximum distance G that the light-emitting substrate can theoretically move to the left in the width direction W of the slot ′ It is also greater than the maximum distance that the light-emitting substrate actually moves in the width direction W of the slot, so as to avoid the light-emitting substrate being deviated too much in the width direction W of the slot and interfering with the side wall of the back plate.

[0104] Therefore, when along the width direction W of the slot, the side wall 21 located on either side of the slot K satisfies D 2 -H 2 <G 2In the process of bonding the back plate and the light-emitting substrate, the probability of interference between the side wall of the back plate and the light-emitting substrate can be greatly reduced, the frequency of adjusting the relative position between the back plate and the light-emitting substrate is reduced, and the production efficiency and yield of the backlight module are improved.

[0105] In an embodiment of the present invention, the distance between the first fixing portion and the second fixing portion can be set to be greater than the thickness of the base plate, thereby ensuring that when the flexible circuit board structure passes through the slot K, the second fixing portion can completely pass through the slot K to be effectively connected to the second fixing structure.

[0106] Fig.11 The fifth schematic diagram of the backlight module manufacturing process provided by the embodiment of the present invention.

[0107] In the embodiment of the present invention, a buffer layer may be further provided on the side of the light-emitting substrate facing the back plate, or on the side of the bottom plate of the back plate facing the light-emitting substrate. The buffer layer is used to play a buffering role when the back plate contacts the light-emitting substrate, reducing the impact force generated by the back plate on the light-emitting substrate, thereby reducing the risk of the light-emitting substrate being broken.

[0108] For example, if Fig.11 As shown, the buffer layer 13 can be arranged on the side of the driving substrate away from the light emitting device. The buffer layer 13 can be arranged in an area outside the orthographic projection of the fixed area of ​​the flexible circuit board structure on the driving substrate, and the surface of the buffer layer 13 on the side away from the driving substrate is flush with the surface of the fixed area of ​​the flexible circuit board structure on the side away from the driving substrate. The buffer layer 13 can be as follows Fig.11 The continuous film layer shown may also be arranged as a plurality of spaced-apart structures, which is not limited here.

[0109] In specific implementation, the buffer layer 13 is not limited to Fig.11 The setting method in the embodiment will not be elaborated here as long as it can play a buffering role when the back plate contacts the light-emitting substrate.

[0110] Fig.12 A schematic diagram of the cross-sectional structure of a backlight module provided by an embodiment of the present invention.

[0111] According to a second aspect of the embodiments of the present invention, a backlight module is provided.

[0112] In the embodiment of the present invention, the backlight module includes: a light-emitting substrate 1 and a back plate 2 .

[0113] In the embodiment of the present invention, a flexible circuit board structure is connected to the light-emitting substrate. The flexible circuit board structure includes an active area relative to the light-emitting substrate, and the active area includes a fixed end connected to the side of the light-emitting substrate facing the back plate, and a free end away from the fixed end. Between the fixed end and the free end, there are also a first fixing portion and a second fixing portion sequentially arranged in a direction from the fixed end to the free end. The specific structure of the light-emitting substrate can refer to the description in the above method embodiment, and will not be repeated here.

[0114] The back plate includes a bottom plate and a side wall in vertical contact with the bottom plate; the side wall is located on the side of the bottom plate facing the light-emitting substrate; the length of the flexible circuit board structure between the end of the first fixing portion away from the fixing end and the fixing end is greater than the height of the side wall; the bottom plate has a slot running through the bottom plate thickness direction; the free end of the flexible circuit board structure passes through the slot to reach the side of the back plate away from the light-emitting substrate. The specific structure of the back plate can refer to the description in the above method embodiment, and will not be repeated here.

[0115] In specific implementation, the light-emitting substrate and the back panel can be bonded using any of the above methods, thereby avoiding the risk of interference between the side wall of the back panel and the light-emitting substrate during the bonding process of the light-emitting substrate and the back panel, reducing the probability of light-emitting substrate fragments, and improving the yield of the backlight module.

[0116] In some embodiments, along the width direction of the groove, the side wall is located on at least one side of the groove; the width direction is perpendicular to the extension direction of the bending axis when the free end is bent toward a side away from the light-emitting substrate;

[0117] Along the width direction of the slot, the side wall on either side of the slot satisfies the following relationship with the slot:

[0118] D 2 -H 2 <G 2 ;

[0119] Among them, D represents the length of the flexible circuit board structure between the end of the first fixing portion away from the fixed end and the fixed end; H represents the height of the side wall; G represents the distance between the edge of the first substrate close to the side wall and the side wall when the orthographic projection of the fixed end on the bottom plate coincides with the groove wall of the groove close to the side wall.

[0120] When along the width direction W of the slot, the side wall 21 located on either side of the slot K satisfies D 2 -H 2 <G 2 In the process of bonding the back plate and the light-emitting substrate, the probability of interference between the side wall of the back plate and the light-emitting substrate can be greatly reduced, the frequency of adjusting the relative position between the back plate and the light-emitting substrate is reduced, and the production efficiency and yield of the backlight module are improved.

[0121] In some embodiments, the distance between the first fixing portion and the second fixing portion is greater than the thickness of the bottom plate, thereby ensuring that when the flexible circuit board structure passes through the slot, the second fixing portion can completely pass through the slot to be effectively connected to the second fixing structure.

[0122] In some embodiments, the flexible circuit board structure includes only one flexible circuit board.

[0123] In some embodiments, the flexible circuit structure includes at least two electrically connected flexible circuit boards. When the flexible circuit board structure is connected by at least two flexible circuit boards, the length of the flexible circuit board structure can be extended to avoid the subsequent perforation process being affected by insufficient length of a single flexible circuit board, and the connection distance with the control board of the display device can be extended.

[0124] Fig.13 One of the cross-sectional structural schematic diagrams of the flexible circuit board structure provided by an embodiment of the present invention; Fig.14 A second schematic diagram of a cross-sectional structure of a flexible circuit board structure provided by an embodiment of the present invention; Fig.15 It is a schematic diagram of a top view of a flexible circuit board structure in the related art; Fig.16 A schematic diagram of a top view of a flexible circuit board structure provided in an embodiment of the present invention.

[0125] In some embodiments, the flexible circuit structure includes a first flexible circuit board 610 and a second flexible circuit board 620. In a specific implementation, Fig.13 As shown, one end of the first flexible circuit board 610 is bound to the side of the driving substrate where the light-emitting device is arranged, and the other end of the first flexible circuit board 610 is bent to the side of the driving substrate away from the light-emitting device, and is connected to one end of the second flexible circuit board 620 through the connector 630. The other end of the second flexible circuit board 620 is used to pass through the slot of the back plate to reach the side of the back plate away from the light-emitting substrate, and is connected to the control board of the display device.

[0126] In some embodiments, the flexible circuit board structure includes peripheral areas located on both sides of the connector in the extension direction of the flexible circuit board structure. Fig.14 As shown, the flexible circuit board structure includes a first peripheral area S1 disposed on the side of the connector 630 close to the first flexible circuit board 610, and a second peripheral area S2 disposed on the side of the connector 630 close to the second flexible circuit board 620. The first peripheral area S1 and the second peripheral area S2 are provided with protruding structures for connecting the connector, and the protruding structures are, for example, circuit elements such as resistors, capacitors, and pads, or openings for installing connectors.

[0127] In related technologies, such as Fig.15As shown in FIG. 1 , after the flexible circuit board structure is bent to the side of the driving substrate away from the light-emitting device, usually only the bonding area S3 on the left side of the first peripheral area S1 that does not overlap with the first peripheral area S1 is bonded and fixed to the driving substrate through the adhesive layer to form a fixed area, resulting in a longer length D of the flexible circuit board structure between the fixed end of the active area and the first fixed portion. When the back plate is bonded to the light-emitting substrate, the length D cannot be satisfied. 2 -H 2 <G 2 conditions, resulting in interference between the back panel side wall and the light-emitting substrate.

[0128] In view of this, during the specific implementation of the embodiment of the present invention, according to the length requirement of the flexible circuit board structure between the fixed end of the active area and the first fixed portion, at least part of the peripheral area is fixed to the side of the driving substrate away from the light-emitting device through an adhesive layer.

[0129] For example, in Fig.16 In the embodiment shown, the bonding area S3 and the first peripheral area S1 at least partially overlap, and the adhesive layer of the overlapping portion of the bonding area S3 and the first peripheral area S1 is specially designed to avoid the protruding structure and the opening provided in the first peripheral area S1, so as to increase the length of the fixed area and reduce the length D of the flexible circuit board structure between the fixed end of the active area and the first fixed portion, thereby ensuring that the back plate and the light-emitting substrate are bonded without interference. 2 -H 2 <G 2 conditions to avoid interference between the side wall of the back plate and the light-emitting substrate to cause fragments.

[0130] exist Fig.16 In the embodiment shown, only the laminating area S3 partially overlaps with the first peripheral area S1, so that part of the first peripheral area S1 is fixed to the side of the driving substrate away from the light-emitting device through the adhesive layer. In specific implementation, the adhesive layer can be designed with a special shape according to actual needs to avoid the protruding structure or opening for installing the connector around the connector, so as to further reduce the length D of the flexible circuit board structure between the fixed end of the active area and the first fixed part, so as to avoid the interference between the side wall of the back plate and the light-emitting substrate to cause fragments, which will not be described in detail here.

[0131] The backlight module provided in the embodiment of the present invention further includes film layer structures such as a diffusion plate, an optical film, and a reflective sheet, and the details can be referred to the description in the related art, which will not be described in detail here.

[0132] In some embodiments, the diffusion plate, optical film and other film layers can be supported by the side walls of the back plate, so that the use of support columns can be reduced or avoided in specific implementations, simplifying the structure of the backlight module.

[0133] Fig.17 A schematic diagram of the cross-sectional structure of a display module provided by an embodiment of the present invention.

[0134] According to a third aspect of the embodiments of the present invention, a display module is provided.

[0135] like Fig.17 As shown, the display module includes: a display panel 200 and a backlight module 100 provided in any of the above embodiments. The backlight module 100 is located on the light incident surface of the display panel 200. The display module can be a liquid crystal display module. In specific implementation, the display module has the same technical effect as the backlight module in any of the above embodiments, which will not be described in detail here.

[0136] Although the preferred embodiments of the present invention have been described, those skilled in the art may make other changes and modifications to these embodiments once they have learned the basic creative concept. Therefore, the appended claims are intended to be interpreted as including the preferred embodiments and all changes and modifications that fall within the scope of the present invention.

[0137] Obviously, those skilled in the art can make various changes and modifications to the present invention without departing from the spirit and scope of the present invention. Thus, if these modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention is also intended to include these modifications and variations.

Claims

1. A method for manufacturing a backlight module, characterized in that: include: A light-emitting substrate is provided, and the light-emitting substrate is placed on a fixed machine; the light-emitting substrate includes a driving substrate and a light-emitting device, and the light-emitting device is located on a side of the driving substrate facing the fixed machine; a flexible circuit board structure is connected to the light-emitting substrate; on a side of the light-emitting substrate away from the fixed machine, the flexible circuit board structure includes an active area relative to the light-emitting substrate, and the active area includes a fixed end connected to the light-emitting substrate and a free end away from the fixed end; between the fixed end and the free end, there are also a first fixing part and a second fixing part sequentially arranged along the direction from the fixed end to the free end; The free end is bent toward a side away from the light-emitting substrate, and the first fixing portion is fixed by a first fixing structure; a surface of the first fixing structure on a side away from the light-emitting substrate is at a set distance from the light-emitting substrate; A back plate is provided, and the back plate is moved from a starting position of the first fixing structure away from the light-emitting substrate to a side close to the light-emitting substrate, and the free end passes through the slot of the back plate; the back plate comprises a bottom plate and a side wall vertically contacting the bottom plate; the slot is located on the bottom plate and passes through the bottom plate; the height of the side wall is less than the set distance; the distance between the first fixing part and the second fixing part is greater than the thickness of the bottom plate; the first fixing structure cannot pass through the slot; When the back panel moves to between the first fixing part and the second fixing part, if it is determined that the side wall does not interfere with the light-emitting substrate, the second fixing part is fixed by a second fixing structure, and the first fixing structure is detached from the first fixing part, so that the back panel continues to move toward the side close to the bottom panel until the back panel is in contact with the light-emitting substrate.

2. The method according to claim 1, characterized in that Along the width direction of the slot, the side wall is located on at least one side of the slot; the width direction is perpendicular to the extension direction of the bending axis when the free end is bent toward a side away from the light-emitting substrate; Along the width direction of the slot, the side wall located on either side of the slot satisfies the following relationship with the slot: D 2 -H 2 <G 2 ; Among them, D represents the length of the flexible circuit board structure between the end of the first fixing portion away from the fixed end and the fixed end; H represents the height of the side wall; G represents the distance between the edge of the light-emitting substrate close to the side wall and the side wall when the orthographic projection of the fixed end on the bottom plate coincides with the groove wall of the groove close to the side wall.

3. The method according to claim 1 or 2, characterized in that Also includes: When the back plate moves between the first fixing portion and the second fixing portion, if the side wall interferes with the light emitting substrate, the relative position between the back plate and the light emitting substrate is adjusted so that the side wall does not interfere with the light emitting substrate.

4. A backlight module, characterized in that: The backlight module is manufactured by the method according to any one of claims 1 to 3, wherein the backlight module comprises: a light-emitting substrate and a back plate; the light-emitting substrate is attached to the back plate; A flexible circuit board structure is connected to the light-emitting substrate; the flexible circuit board structure includes an active area relative to the light-emitting substrate; the active area includes a fixed end connected to the light-emitting substrate facing the back plate, and a free end away from the fixed end; between the fixed end and the free end, there is also a first fixing portion and a second fixing portion sequentially arranged along the direction from the fixed end to the free end; The back plate includes a base plate and a side wall vertically contacting the base plate; the side wall is located on the side of the base plate facing the light-emitting substrate; the length of the flexible circuit board structure between the end of the first fixing portion away from the fixed end and the fixed end is greater than the height of the side wall; the base plate has a groove running through the base plate in the thickness direction; the free end of the flexible circuit board structure passes through the groove to reach the side of the back plate away from the light-emitting substrate; the distance between the first fixing portion and the second fixing portion is greater than the thickness of the base plate.

5. The backlight module according to claim 4, characterized in that: Along the width direction of the slot, the side wall is located on at least one side of the slot; the width direction is perpendicular to the extension direction of the bending axis when the free end is bent toward a side away from the light-emitting substrate; Along the width direction of the slot, the side wall located on either side of the slot satisfies the following relationship with the slot: D 2 -H 2 <G 2 ; Among them, D represents the length of the flexible circuit board structure between one end of the first fixing portion away from the fixed end and the fixed end; H represents the height of the side wall; G represents the distance between the edge of the light-emitting substrate close to the side wall and the side wall when the orthographic projection of the fixed end on the bottom plate coincides with the groove wall of the groove close to the side wall.

6. The backlight module according to claim 4, characterized in that: The flexible circuit board structure includes only one flexible circuit board; or, The flexible circuit board structure includes at least two electrically connected flexible circuit boards.

7. The backlight module according to claim 6, wherein: The flexible circuit board structure includes a first flexible circuit board and a second flexible circuit board; one end of the first flexible circuit board is bound to a side of the driving substrate on which the light-emitting device is arranged, the other end of the first flexible circuit board is bent to a side of the driving substrate away from the light-emitting device, and is connected to one end of the second flexible circuit board through a connector, and the other end of the second flexible circuit board passes through the slot to reach a side of the back plate away from the light-emitting substrate; The flexible circuit board structure includes peripheral areas located on both sides of the connector in the extension direction of the flexible circuit board structure; The peripheral area is provided with a protruding structure and / or an opening for connecting the connector; at least a part of the peripheral area is fixed to a side of the driving substrate away from the light-emitting device.

8. A display module, characterized in that: include: Display panel; The backlight module according to any one of claims 4 to 7, located on the light incident side of the display panel.

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