A micro axial diode automatic curing device

Abstract

The present invention provides a micro axial diode automatic curing device, comprising: a frame support base, a lower heating base is provided in the center of the frame support base, a chip is placed in the center of the lower heating base, and the frame support base supports the metal frame; an upper crawler and a lower crawler are respectively provided at both ends of the frame support base; a lead box, one lead box is provided on each side of the frame support base, a traction wire clamp is installed between the frame support base and the two lead boxes, and the two traction wire clamps are respectively fixed to two X and Z axis motion modules. The present invention realizes automatic loading of leads through a wire pulling assembly, automatic loading of chips through a suction nozzle and a solder nozzle, and automatic soldering of chips through a heating base. In addition, by fixing the chip and leads to the metal frame, the leads of the chip are prevented from being pulled and detached from the chip during subsequent operation.

Description

Technical Field

[0001] The invention relates to a micro axial diode automatic curing device. Background Art

[0002] The length and width of a micro axial diode chip are approximately 0.5mm by 0.5mm, and the lead wire is a 0.15mm nickel wire. The current welding method involves manually clamping the ring lead wire, assembling the tiny chip on the end of the ring lead wire, applying solder paste, and then heating and curing. Due to the small size of the chip and lead wire, manual clamping is difficult, so the chip welding effect cannot be guaranteed. In addition, the production and assembly efficiency of this method is low, and the consistency and stability of the product cannot be guaranteed, which affects the production progress of the micro diode. For example, the laser solder ball welding equipment for micro thermistors disclosed in publication number CN113967771A uses a motion module to drive the welding device to move on the platform to weld the chip, and the chip and wire harness are fixed by automatic loading. While ensuring the quality of chip welding, the chip processing efficiency is improved. Summary of the Invention

[0003] In order to solve the above technical problems, the present invention provides a micro axial diode automatic curing device.

[0004] The present invention is achieved through the following technical solutions.

[0005] The present invention provides a micro axial diode automatic curing device, comprising:

[0006] Frame support base: a lower heating base is provided in the center of the frame support base, the chip is placed in the center of the lower heating base, and the frame support base supports the metal frame;

[0007] The loading crawler and the unloading crawler are respectively arranged at both ends of the frame support seat;

[0008] Lead box, one lead box is provided on both sides of the frame support base, and a traction wire clamp is installed between the frame support base and the two lead boxes. The two traction wire clamps are respectively fixed on the two X and Z axis motion modules;

[0009] The solder nozzle and the adsorption nozzle are arranged above the frame support seat. The solder nozzle and the adsorption nozzle are fixed on the three-coordinate motion module and move synchronously under the drive of the three-coordinate motion module.

[0010] A welding head is provided above the frame support seat on the movement track of the two traction wire clamps; and a vibration disk is provided in the movement track of the adsorption nozzle.

[0011] A retaining wire clamp is also provided between the lead box and the traction wire clamp. Both the retaining wire clamp and the traction wire clamp are installed on the clamping cylinder. The retaining wire clamp is fixed, and the traction wire clamp is fixed to the lower end of the Z-axis module of the X-axis and Z-axis motion modules.

[0012] A winding wheel with a lead wire wound thereon is hingedly connected inside the lead box, and a wire outlet hole is processed on the lead box in the direction facing the pulling wire clamp.

[0013] A wire track is also provided between the retaining wire clamp and the pulling wire clamp, and a wire entry hole is processed on the wire track. The wire entry hole is concentric with the emergence hole on the pulling wire clamp, and a wire wheel is installed on one end of the wire track close to the pulling wire clamp.

[0014] The top of the linear rail is also fixedly connected to one end of the connecting rod, and the other end of the connecting rod is used for installing the welding head.

[0015] The solder nozzle and the suction nozzle are respectively fixed on the protruding ends of the solder cylinder and the material taking cylinder. The solder cylinder and the material taking cylinder are fixed on the L-shaped hanging plate in a straight line. The L-shaped hanging plate is vertically fixed on the Z-axis module of the three-coordinate motion module.

[0016] A wire cutter is installed on both sides of the frame support seat. The wire cutter is higher than the frame support seat and the direction of the blade is parallel to the side wall of the frame support seat. The wire cutter is fixed on the front clamp. The center of the front clamp is movably installed on one end of the compression spring shaft. The other end of the compression spring shaft is movably installed with a rear clamp. There is a spring between the front clamp and the rear clamp installed on the compression spring shaft. The lower ends of the front clamp and the rear clamp are fixed on the two clamps of the clamping cylinder.

[0017] The distal ends of the loading crawler and the unloading crawler are respectively provided with a loading platform and an unloading platform at the same height.

[0018] The center of the lower heating base is processed with a right wire groove, a chip groove, and a left wire groove. The chip groove is processed in the center of the lower heating base. One end of the right wire groove and the left wire groove is vertically connected to the chip groove, and the other end is arranged at the end of the lower heating base. The height difference between the right wire groove and the chip groove is the thickness of the chip.

[0019] An upper heating base is also provided directly above the lower heating base. The upper heating base is fixed on the protruding end of the upper heating base cylinder. The lower end surface structure of the upper heating base is the same as the upper end surface structure of the lower heating base, but the positions of the right wire groove and chip groove thereon are opposite.

[0020] The beneficial effects of the present invention are: automatic loading of leads is achieved through the wire pulling assembly, automatic loading of chips is achieved through the suction nozzle and solder nozzle, automatic welding of chips is achieved through the heating base, and by fixing the chip and leads on the metal frame, the leads are prevented from being pulled and detached from the chip during subsequent operation. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 It is a structural schematic diagram of the present invention;

[0022] Figure 2 It is a schematic structural diagram of the feeding assembly of the present invention;

[0023] Figure 3 It is a schematic structural diagram of the string assembly of the present invention;

[0024] Figure 4 It is a schematic diagram of the welding assembly structure of the present invention;

[0025] Figure 5 This is a schematic structural diagram of the lower heating seat of the present invention;

[0026] In the figure: 1-wire pulling assembly, 11-lead box, 12-line rail, 121-wire entry hole, 122-wire wheel, 13-holding clamp, 14-traction clamp, 15-left wire clamp X-axis mover, 16-left wire clamp Z-axis mover, 17-right wire clamp Z-axis mover, 18-L-shaped support plate, 19-right wire clamp X-axis, 2-three-coordinate motion module, 21-X-axis mover, 22-Z-axis mover, 23-Y-axis mover, 24-guide, 25-motion module support seat, 3-loading assembly, 31-loading table, 32-unloading table, 33-loading crawler, 34-unloading crawler, 4-vibrating plate, 5-feeder, 51-L-shaped hanging plate, 52-solder cylinder, 53-feeding cylinder, 54-solder nozzle, 55-adsorption nozzle, 6-lead, 7-support platform, 8-welding assembly, 81-frame support seat, 811-flaring, 82-welding head, 83-lower heating base, 831-right wire slot, 832-chip slot, 833-left wire slot, 84-upper heating base, 841-upper heating base cylinder, 85-front clamp, 86-wire cutter, 87-compression spring shaft, 88-clamping cylinder, 89-rear clamp, 9-metal frame. DETAILED DESCRIPTION

[0027] The technical solution of the present invention is further described below, but the scope of protection claimed is not limited to the description.

[0028] A micro axial diode automatic curing device, such as Figure 1As shown, the welding device is installed on the supporting platform 7, including: a frame support seat 81, a lower heating base 83 is provided in the center of the frame support seat 81, and a square hole with a size of 0.5*0.5mm*0.1mm is processed in the center of the lower heating base 83 to place the chip, and the frame support seat 81 supports the metal frame 9; the metal frame is transported to the square groove processed in the middle of the frame support seat 81 by the loading crawlers 33 provided at both ends of the frame support seat 81. When welding is completed, the worker sends in a new metal frame, and the new metal frame pushes the processed metal frame so that one end is placed on the unloading crawler 34. Under the action of the unloading crawler 34, it first withdraws from the center of the frame support seat 81. In order to prevent the worker from placing the metal frame crookedly, a flare 811 is processed at the material opening of the square groove. The flare 811 is a trapezoidal opening. When the loading crawler 33 pushes the metal frame into the square groove, the metal frame is guided by the flare 811 so that it can enter the square groove smoothly.

[0029] like Figure 3 As shown, a lead box 11 is provided on each side of the frame support seat 81. A winding wheel with a lead wire 6 wound thereon is hinged inside the lead box 11. A wire outlet hole is machined on the lead box 11 in the direction of the pulling wire clamp 14. A pulling wire clamp 14 is installed between the frame support seat 81 and the two lead boxes 11. The two pulling wire clamps 14 are respectively fixed on the two X and Z axis motion modules. The lead wire ends in the lead box 11 are extended out of the holes during installation and passed through the linear track 12. During the pulling process, the pulling wire clamp 14 is used to clamp the wire ends, and then the X and Z axis motion modules move in the X-axis square to pull the leads onto the chip. Then, the retaining clamp 13 is used to keep the leads from shrinking, and the pulling wire clamp 14 is released and retracted to the linear track 12. According to the nickel wire (lead) diameter of 0.15mm, the wire entry hole on the wire rail is determined to be 0.2mm, with a tapered hole at the front end (for easy threading) and a through hole at the rear end. The lead (nickel wire) is sent out through the threading mechanism, passes through the tapered hole, reaches the lead transition rail and passes out, and is then clamped by the lead clamp (fixed) to avoid wire breakage between the lead clamp and the threading mechanism during subsequent work. After the lead passes through the transition rail, it is clamped by the lead traction clamp and pulled to the chip placement position (a wire wheel 122 is placed at the exit of the lead transition rail. The wire wheel 122 is an elastic pulley to ensure that a certain toughness is maintained during the traction process to avoid wire breakage during the traction process), that is, on the lower heating seat, and then the corresponding action is performed. The lead pulling clamps consist of two groups, one above and one below, which clamp the chip in the middle for heating and curing. The two groups of clamps are installed on two different groups of movable modules on the left and right, respectively, and can realize movement in the Z-axis and X-axis directions. The device can also ensure the straightness of the leads, eliminating the need for later lead straightening.

[0030] like Figure 4As shown, the solder nozzle 54 and the adsorption nozzle 55 are arranged above the frame support seat 81, and the adsorption nozzle 55 is connected to the negative pressure device. Driven by the three-coordinate motion module 2, the adsorption nozzle 55 moves back and forth between the vibration disk 4 and the heating base 83, and the chip in the vibration disk 4 is adsorbed by the negative pressure and placed in the lower heating base; the solder nozzle 54 is connected to the loading device, and the loading device sends the solder into the solder nozzle by pumping. After the solder nozzle 54 places the chip into the lower heating base 83, the three-coordinate motion module 2 moves forward in the Y-axis square so that the solder nozzle 54 is placed above the chip. Through the control of the solenoid valve, the channel is opened to fill the solder into the chip groove in the center of the lower heating base 83. The solder nozzle 54 and the adsorption nozzle 55 are fixed on the three-coordinate motion module 2 and move synchronously under the drive of the three-coordinate motion module 2.

[0031] like Figure 2 As shown, a welding head 82 is provided above the frame support seat 81 on the movement trajectory of the two pulling wire clamps 14. The welding head is directly above the metal frame and the lead. After the pulling wire clamp 14 pulls the lead into place, the welding head works to weld the lead to the metal frame to prevent the lead from being shaken or collided and falling off the chip during subsequent movement.

[0032] The top of the linear rail 12 is also fixedly connected to one end of the connecting rod, and the other end of the connecting rod is used to install the welding head 82.

[0033] like Figure 4 As shown, a wire cutter 86 is mounted on each side of the frame support base 81. The wire cutter 86 is higher than the frame support base 81, and the direction of the blade is parallel to the side wall of the frame support base 81. The wire cutter 86 is fixed to a front clamp 85. The center of the front clamp 85 is movably mounted on one end of a compression spring shaft 87. The other end of the compression spring shaft 87 is movably mounted on a rear clamp 89. A spring is mounted on the compression spring shaft 87 between the front and rear clamps 85 and 89. The lower ends of the front and rear clamps 85 and 89 are fixed to the two clamps of the clamping cylinder 88. After the heating and welding operations are completed, the lead wire is cut by the two sets of wire cutters and then pulled to the next working station. The wire cutter has a sharp edge on one end and a flexible flat base on the other. When cutting, it moves simultaneously toward the center, i.e., the lead wire. Both ends are mounted on springs to ensure a certain degree of elasticity. Cutting does not require much force, which ensures the life of the cutter and allows for long-term use. If the cutter is damaged, it can be quickly replaced.

[0034] The far ends of the loading crawler 33 and the unloading crawler 34 are respectively provided with a loading platform 31 and an unloading platform 32 at the same height. The loading platform 31 supports the rear end of the metal frame during loading, and the front end of the metal frame is on the loading crawler. When the loading crawler is started, the metal frame will be separated from the loading platform, reducing the labor of the staff. When the unloading platform 32 is processed to be the same height as the crawler, the welded metal frame is pushed flat on the unloading platform under the push of the unloading crawler, which can prevent the metal frame from falling and causing shock due to height difference.

[0035] like Figure 5 As shown, a right line groove 831, a chip groove 832, and a left line groove 833 are processed in the center of the lower heating base 83. The chip groove 832 is a square groove processed in the center of the lower heating base 83. One end of the right line groove 831 and the left line groove 833 is vertically connected to the chip groove 832, and the other end is arranged at the end of the lower heating base 83. The height difference between the right line groove 831 and the chip groove 832 is the thickness of the chip.

[0036] An upper heating base 84 is also provided directly above the lower heating base 83. The upper heating base 84 is fixed on the protruding end of the upper heating base cylinder 841. The lower end surface structure of the upper heating base 84 is the same as the upper end surface structure of the lower heating base 83, but the right wire groove 831 and the chip groove 832 thereon are in opposite positions. The upper heating base 84 can be pushed to dock with the lower heating base 83 under the action of the cylinder, and can squeeze the chip and the lead to ensure close contact between the chip, the lead and the solder paste, thereby ensuring the welding effect.

[0037] The specific working steps of the present invention are:

[0038] 1) Place the chip to be processed into the flexible vibration plate 4, and then place the metal frame on the loading platform;

[0039] 2) Start the equipment. The metal frame is transported into the metal frame via the loading crawler. The suction head in the chip picking motion module uses the top visual camera to collect the position of the chip on the flexible vibration plate. The Z axis on the suction nozzle moves downward to pick up the chip. After the chip is picked up, the Z axis moves upward and the X axis moves to the right. After reaching the designated position, the Y axis starts to move toward the heating base. The solder paste placement pipe reaches the top of the heating base, and the Z axis moves downward to the designated position to place the solder paste. After placement, the Z axis moves upward;

[0040] 3) The left lead pulling claw clamps the lead, and then the left claw module moves slightly in the Z-axis direction to reach the specified height, which can cross the height of the metal frame. The claw module moves in the X-axis to reach the specified position, and the Z-axis moves downward to place the end of the lead in the center of the heating base and stick it to the solder paste;

[0041] 4) The left side wire welding device works, welding one end of the lead to the metal frame for fixation;

[0042] 5) The chip picking module moves the nozzle to the heating base again, places the chip to press the left lead, and then moves again to place solder paste. Then the right lead is pulled and the gripper module performs the same logical action as the left side.

[0043] 6) After the above work is completed, the sheet picking motion module moves to the starting position, above the flexible vibration plate, ready to pick up the sheet again;

[0044] 7) Push the upper heating seat cylinder downward to fit the upper heating seat and the lower heating seat together for heating and cooling. Once completed, the chip and the lead are fixed.

[0045] 8) The upper heating seat returns to the starting position, the left and right lead traction clamps return to the starting position, clamping the middle lead, and the cutting tool starts working. The left and right tools cut at the same time, and return to the starting position after cutting is completed. This completes the single process.

[0046] 9) The metal frame support track is moved up to the specified position by the cylinder, and the metal frame is moved a corresponding distance by the loading track to carry out the work of the next product. When the specified chip is moved on the metal frame, it is moved to the unloading bin by the unloading track. This mechanism circulates to achieve the effect of automated production.

Claims

1. A micro axial diode automatic curing device, characterized in that: include: A frame support seat (81), wherein a lower heating base (83) is provided at the center of the frame support seat (81), a chip is placed at the center of the lower heating base (83), and the frame support seat (81) supports the metal frame (9); A loading crawler (33) and a unloading crawler (34), the loading crawler (33) and the unloading crawler (34) are respectively arranged at two ends of the frame support seat (81); A lead box (11) is provided on both sides of the frame support seat (81), and a traction clamp (14) is installed between the frame support seat (81) and the two lead boxes (11). The two traction clamps (14) are respectively fixed on the two X-axis and Z-axis motion modules; The soldering nozzle (54) and the adsorption nozzle (55) are arranged above the frame support seat (81), and the soldering nozzle (54) and the adsorption nozzle (55) are fixed on the three-coordinate motion module (2) and move synchronously under the drive of the three-coordinate motion module (2); A welding head (82) is also provided above the frame support seat (81) on the movement track of the two traction wire clamps (14); a vibration disk (4) is also provided within the movement track of the adsorption nozzle (55); The soldering nozzle (54) and the adsorption nozzle (55) are respectively fixed to the protruding ends of the soldering cylinder (52) and the material taking cylinder (53); the soldering cylinder (52) and the material taking cylinder (53) are fixed in a straight line on the L-shaped hanging plate (51); the L-shaped hanging plate (51) is vertically fixed on the Z-axis module of the three-coordinate motion module (2); The center of the lower heating base (83) is processed with a right line groove (831), a chip groove (832), and a left line groove (833); the chip groove (832) is processed in the center of the lower heating base (83); one end of the right line groove (831) and the left line groove (833) are vertically connected to the chip groove (832), and the other end is arranged at the end of the lower heating base (83); the height difference between the right line groove (831) and the chip groove (832) is the thickness of the chip; An upper heating base (84) is also provided directly above the lower heating base (83). The upper heating base (84) is fixed to the protruding end of the upper heating base cylinder (841). The lower end surface structure of the upper heating base (84) is the same as the upper end surface structure of the lower heating base (83), but the right wire groove (831) and the chip groove (832) thereon are positioned oppositely.

2. The micro axial diode automatic curing device according to claim 1, characterized in that: A retaining wire clamp (13) is further provided between the lead box (11) and the pulling wire clamp (14). The retaining wire clamp (13) and the pulling wire clamp (14) are both mounted on the clamping cylinder. The retaining wire clamp (13) is fixed, and the pulling wire clamp (14) is fixed to the lower end of the Z-axis module of the X-axis and Z-axis motion modules.

3. The micro axial diode automatic curing device according to claim 2, characterized in that: A winding wheel with a lead wire (6) wound thereon is hingedly connected inside the lead box (11), and a wire outlet hole is processed in the direction of the traction wire clamp (14) on the lead box (11).

4. The micro axial diode automatic curing device according to claim 2, characterized in that: A wire track (12) is further provided between the retaining wire clamp (13) and the pulling wire clamp (14). A wire entry hole (121) is machined on the wire track (12). The wire entry hole (121) is concentric with the emergence hole on the pulling wire clamp (14). A wire wheel (122) is installed on one end of the wire track (12) close to the pulling wire clamp (14).

5. The micro axial diode automatic curing device according to claim 4, characterized in that: The top of the linear rail (12) is also fixedly connected to one end of a connecting rod, and the other end of the connecting rod is used for mounting a welding head (82).

6. The micro axial diode automatic curing device according to claim 1, characterized in that: A wire cutter (86) is also installed on both sides of the frame support seat (81), and the wire cutter (86) is higher than the frame support seat (81) and the direction of the blade is parallel to the side wall of the frame support seat (81). The wire cutter (86) is fixed on the front clamp (85). The center of the front clamp (85) is movably installed on one end of the compression spring shaft (87). The other end of the compression spring shaft (87) is movably installed with a rear clamp (89). A spring is installed on the compression spring shaft (87) between the front clamp (85) and the rear clamp (89). The lower ends of the front clamp (85) and the rear clamp (89) are fixed on the two clamps of the clamping cylinder (88).

7. The micro axial diode automatic curing device according to claim 1, characterized in that: The distal ends of the loading crawler (33) and the unloading crawler (34) are respectively provided with a loading platform (31) and an unloading platform (32) of the same height.

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