Water-cooling heat dissipation structure and electrical equipment

By using a double-sided water-cooled heat dissipation structure, the coolant is guided to circulate between the shells using a guide plate, which solves the problems of poor heat dissipation and small cooling area in the existing technology, and achieves a cooling effect with a larger cooling area and higher flow rate.

CN116685123BActive Publication Date: 2026-02-24WEICHAI POWER CO LTD +1
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Patent Information

Application Number
CN202310763230.2
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2023-06-27
Publication Date
2026-02-24
Estimated Expiration
2043-06-27

AI Technical Summary

Technical Problem

In the existing technology, the heat dissipation methods of power converters are mainly air cooling and natural cooling, which have poor heat dissipation effect and low efficiency. In addition, the cooling area of ​​water cooling structure is small, which cannot fully utilize the heat dissipation capacity of water channels, and the manufacturing process is difficult and the flexibility is poor.

Method used

It adopts a water-cooled heat dissipation structure with double-sided heat dissipation. The outer shell is equipped with water inlet and water outlet channels, including a first shell and a second shell. Cooling water channels are set on the shells, and a guide plate is located between the shells. The guide plate is used to guide the coolant to cool the high-heat area. The coolant circulates between the shells and changes the cross-sectional area of ​​the cooling water channels to improve the flow.

Benefits of technology

It achieves a larger cooling area, improved cooling effect, increased coolant flow rate, solves the problem of poor heat dissipation, reduces water flow resistance, and improves heat dissipation efficiency.

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Abstract

The application belongs to the technical field of power electronics, and discloses a water-cooling heat dissipation structure and electrical equipment, the water-cooling heat dissipation structure comprises a shell and a flow guide plate, the shell is provided with an inlet water channel and an outlet water channel, the first shell and the second shell are both provided with a cooling water channel, the cooling water channel is in communication with the inlet water channel and the outlet water channel, the flow guide plate is located between the first shell and the second shell, and the flow guide plate is arranged on the cooling water channel, the cooling liquid enters the inlet water channel, flows along the area between the first shell and the flow guide plate, cools the high-heat area of the first shell, then the cooling liquid flows along the area between the second shell and the flow guide plate, cools the high-heat area of the second shell, the flow guide plate can change the cross-sectional area of the cooling water channel, improve the flow condition of the cooling liquid, solve the problem of low flow speed of the cross-sectional cooling liquid, realize the three-dimensional circulation inside the cross-sectional cooling water channel, and greatly improve the heat dissipation effect.
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Description

Technical Field

[0001] This invention relates to the field of power electronics technology, and more particularly to water-cooled heat dissipation structures and electrical equipment. Background Technology

[0002] A power converter is an electrical device that transforms one DC voltage value into another. Power converters contain many power components and have complex internal circuit structures. During operation, especially under full load and during uphill driving, they generate significant heat, causing a rapid temperature rise. If not cooled promptly, the controller will operate at high temperatures for extended periods, easily leading to damage. Currently, the main cooling methods for controllers on the market are air cooling and natural cooling. Air cooling is more conventional, using concentrated airflow to dissipate heat in a localized area, but this method has significant limitations. Natural cooling, on the other hand, is insufficient for rapidly cooling the controller. Therefore, traditional controller cooling methods suffer from poor heat dissipation and low efficiency.

[0003] To address the aforementioned issues, a single-sided cooling water channel system is employed. This system features a serpentine distribution of cooling water channels, extending alternately in both directions, starting at the inlet and ending at the outlet. The coolant flows along these channels to cool components requiring heat dissipation, with additional guide ribs added to areas with high heat generation to enhance cooling efficiency. However, this single-sided cooling method results in a small heat dissipation area, failing to fully utilize the channel's cooling capacity. Furthermore, the guide ribs in the cooling water channel design are difficult to manufacture, lack flexibility, and increase water flow resistance.

[0004] Therefore, water-cooled heat dissipation structures and electrical equipment are urgently needed to solve the above problems. Summary of the Invention

[0005] The purpose of this invention is to provide a water-cooled heat dissipation structure with double-sided heat dissipation and a larger cooling area, which fully utilizes the heat dissipation and cooling capacity. At the same time, it can change the cross-sectional area of ​​the cooling water channel, improve the flow of coolant, and solve the problem of low cross-sectional coolant flow rate.

[0006] To address the aforementioned problems in the existing technology, the present invention adopts the following technical solution:

[0007] The water-cooled heat dissipation structure includes:

[0008] The outer casing is provided with an inlet water channel and an outlet water channel. The outer casing includes a first shell and a second shell. Both the first shell and the second shell have a high-heat zone and a low-heat zone. Both the first shell and the second shell are provided with a cooling water channel. The cooling water channel is connected to the inlet water channel and the outlet water channel. The cooling water channel is circulated with coolant for cooling the high-heat zone.

[0009] A guide plate is located between the first housing and the second housing, and is disposed in the cooling water channel. The guide plate is used to guide the coolant to cool the high-heat areas of the first housing and the second housing.

[0010] Preferably, the guide plate includes a first water-blocking part and a second water-blocking part, the first water-blocking part and the second water-blocking part are arranged to form a cooling cavity, and the first water-blocking part and the second water-blocking part are spaced apart from the first shell and the second shell to form an annular channel, the annular channel being used for the flow of coolant.

[0011] Preferably, the guide plate further includes a vertical plate portion, which is connected between the first water-blocking portion and the second water-blocking portion. The guide plate is provided with a plurality of cavity portions at intervals along the first direction, and the vertical plate portion is provided between any two adjacent cavity portions.

[0012] Preferably, the first water-blocking part is provided with a water inlet, the second water-blocking part is provided with a water outlet, the water inlet channel is connected to a portion of the cavity part through the water inlet, and the annular channel is connected to another portion of the cavity part through the water outlet.

[0013] Preferably, the guide plate further includes an intermediate water-blocking portion, which is disposed between the first water-blocking portion and the second water-blocking portion. The intermediate water-blocking portion extends along the first direction and is connected to the vertical plate portion. The intermediate water-blocking portion is used to divide the cooling cavity into a first cavity and a second cavity along a second direction, wherein the second direction and the first direction are perpendicular to each other.

[0014] Preferably, there are two guide vanes, and the cooling water channel includes a first cooling water channel and a second cooling water channel, with the two guide vanes respectively disposed in the first cooling water channel and the second cooling water channel.

[0015] Preferably, the first housing and the second housing are further provided with an intermediate cooling water channel, which is located between the first cooling water channel and the second cooling water channel. The intermediate cooling water channel is connected to the first cooling water channel and the second cooling water channel respectively, and the intermediate cooling water channel is circulated with coolant for cooling the low-heat zone.

[0016] Preferably, the first cavity of one of the two guide plates is connected to the water inlet channel, and its second cavity is connected to the intermediate cooling channel; the first cavity of the other guide plate is connected to the intermediate cooling channel, and its second cavity is connected to the water outlet channel.

[0017] Preferably, the cooling water channel further includes a flow divider plate, which is disposed in the intermediate cooling water channel.

[0018] To achieve the above objectives, the present invention also provides an electrical device, including components, and the above-mentioned water-cooling heat dissipation structure, wherein the components are disposed in the water-cooling heat dissipation structure.

[0019] The beneficial effects of this invention are as follows:

[0020] The water-cooled heat dissipation structure provided by this invention has an outer shell with an inlet water channel and an outlet water channel. The outer shell includes a first shell and a second shell, both of which are provided with cooling water channels, which are connected to the inlet and outlet water channels. The cooling water channels of the first shell and the second shell are joined to form a three-dimensional water channel, which provides a larger cooling area compared to single-sided cooling, allowing the cooling water channels to remove more heat and fully utilize the heat dissipation and cooling capacity. A guide plate is located between the first shell and the second shell and is disposed within the cooling water channel. The guide plate is used to guide the coolant to cool the high-heat areas of the first shell and the second shell. The coolant enters the inlet water channel and then flows along the cooling water channel between the first shell and the guide plate, thereby cooling the high-heat area of ​​the first shell. Then, the coolant flows circumferentially along the guide plate and flows through the cooling water channel between the second shell and the guide plate, thereby cooling the high-heat area of ​​the second shell. Finally, after cooling is complete, the coolant enters the outlet water channel and is discharged through the overall water outlet. The deflector plate can change the cross-sectional area of ​​the cooling water channel, improve the flow of coolant, solve the problem of low cross-sectional coolant flow rate, and achieve three-dimensional circulation inside the cross-sectional cooling water channel while ensuring unobstructed cooling water flow, thus greatly improving the heat dissipation effect.

[0021] The electrical equipment provided by this invention includes components and a water-cooling structure, with the components housed within the water-cooling structure. In the power inductor region, where heat generation is low, a dual-channel parallel cooling system significantly reduces coolant flow resistance. In the high-heat-generating MOSS and DIODE regions, guide vanes alter the cross-sectional area of ​​the cooling channels, improving coolant flow and addressing the issue of low coolant velocity. This achieves three-dimensional circulation within the cooling channels while ensuring unobstructed flow, resulting in a substantial improvement in heat dissipation. Attached Figure Description

[0022] Figure 1 This is a schematic diagram of the water-cooled heat dissipation structure in an embodiment of the present invention;

[0023] Figure 2 This is a schematic diagram of the structure of the second housing in an embodiment of the present invention;

[0024] Figure 3 This is a schematic diagram of the structure of the first housing in an embodiment of the present invention;

[0025] Figure 4 This is a schematic diagram of the structure of the guide plate in an embodiment of the present invention. Figure 1 ;

[0026] Figure 5 This is a schematic diagram of the structure of the guide plate in an embodiment of the present invention. Figure 2 ;

[0027] Figure 6 This is a partial cross-sectional view of the water-cooled heat dissipation structure in an embodiment of the present invention;

[0028] Figure 7 This is a schematic diagram of the water cooling route of the water cooling heat dissipation structure in an embodiment of the present invention.

[0029] Figure label:

[0030] 100, High-heat zone; 200, Low-heat zone;

[0031] 1. Outer shell; 11. First shell; 12. Second shell;

[0032] 2. Water inlet channel;

[0033] 3. Water outlet channel;

[0034] 4. Cooling water channel; 41. First cooling water channel; 42. Second cooling water channel;

[0035] 5. Guide vane; 51. First water baffle; 52. Second water baffle; 53. Cooling chamber; 54. Vertical plate; 55. Middle water baffle;

[0036] 6. Intermediate cooling water channel. Detailed Implementation

[0037] The present invention will now be described in further detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and not intended to limit it. Furthermore, it should be noted that, for ease of description, the accompanying drawings show only the parts relevant to the present invention, and not all of the structures.

[0038] In the description of this invention, unless otherwise explicitly specified and limited, the terms "connected," "linked," and "fixed" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0039] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0040] In the description of this embodiment, the terms "upper," "lower," "left," and "right," etc., refer to the orientation or positional relationship shown in the accompanying drawings. They are used only for ease of description and simplification of operation, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the present invention. In addition, the terms "first" and "second" are used only for distinction in description and have no special meaning.

[0041] Existing technologies employ a single-sided cooling water channel system. The cooling water channels are serpentine, extending alternately from the inlet to the outlet. Coolant is circulated along these channels to cool components requiring heat dissipation, with guide ribs added to areas with high heat generation to enhance cooling efficiency. However, this single-sided cooling method results in a small cooling area, failing to fully utilize the channel's cooling capacity. Furthermore, the guide ribs in the cooling water channel design are difficult to manufacture, lack flexibility, and increase water flow resistance. To address this, this embodiment provides a water-cooled structure with double-sided cooling, offering a larger cooling area and fully utilizing the cooling capacity. Simultaneously, it allows for modification of the cooling water channel cross-sectional area, improving coolant flow and solving the problem of low coolant velocity.

[0042] like Figures 1-7As shown, in this embodiment, the water-cooled heat dissipation structure includes a shell 1 and a guide plate 5. The shell 1 is provided with an inlet water channel 2 and an outlet water channel 3. The shell 1 includes a first shell 11 and a second shell 12, both of which have high-heat and low-heat zones. Both the first shell 11 and the second shell 12 are provided with cooling water channels 4, which are connected to the inlet water channel 2 and the outlet water channel 3. Coolant for cooling the high-heat zones flows through the cooling water channels 4. The guide plate 5 is located between the first shell 11 and the second shell 12, and is disposed within the cooling water channel 4. The guide plate 5 guides the coolant to cool the high-heat zones of the first shell 11 and the second shell 12. Specifically, a connection port is provided on one side of the guide plate for connecting the cooling water channels above and below the guide plate for the flow of coolant. The first housing 11 and the second housing 12 are fixedly installed opposite to each other and have basically the same structure. Each has a power inductor area, a MOSFET area, and a DIODE area. These areas are the main heat sources of the power converter. The MOSFET and DIODE areas are high-heat areas with higher heat generation, while the power inductor area is a low-heat area with lower heat generation. Furthermore, the first housing 11 and the second housing 12 have a high-heat area-low-heat area-high-heat area distribution. Among them, the MOSFET is a metal-oxide-semiconductor field-effect transistor, the power inductor is an inductor used in electrical engineering that can withstand high power, and the DIODE is a metal-semiconductor diode. After the first housing 11 and the second housing 12 are assembled, the water inlet channel 2 of the first housing 11 is spliced ​​with the water inlet channel 2 of the second housing 12 and communicates with the overall water inlet of the first housing 11. The water inlet provides the input of cooling water for the entire cooling water circuit. The water outlet channel 3 of the first housing 11 is connected to the water outlet channel 3 of the second housing 12, and communicates with the overall water outlet of the second housing 12 to discharge the heated cooling water. The cooling water channel 4 of the first housing 11 and the cooling water channel 4 of the second housing 12 are connected to form a three-dimensional water channel. The outer shell 1 adopts a double-sided cooling method, which has a larger cooling area than single-sided cooling, so that the cooling water channel 4 can remove more heat and give full play to the heat dissipation and cooling capacity. The cooling route is as follows: the coolant enters the water inlet channel 2 from the overall water inlet, and then flows along the cooling water channel between the first housing 11 and the guide plate 5, thereby cooling the high-heat MOSFET and DIODE areas of the first housing 11. Then the coolant flows circumferentially along the guide plate 5, and flows through the connection port of the guide plate 5 into the cooling water channel between the second housing 12 and the guide plate 5, thereby cooling the high-heat MOSFET and DIODE areas of the second housing 12. Then, after the coolant has completed cooling, it enters the water outlet channel 3 from the cooling water channel 4 and is discharged through the overall water outlet. The guide plate 5 can change the cross-sectional area of ​​the cooling water channel 4, improve the flow of coolant, solve the problem of low cross-sectional coolant flow rate, and realize three-dimensional circulation inside the cross-sectional cooling water channel 4 while ensuring unobstructed cooling water path, thus greatly improving the heat dissipation effect.

[0043] Furthermore, continue to refer to Figures 1-7 The guide plate 5 includes a first water-blocking part 51 and a second water-blocking part 52. The first water-blocking part 51 and the second water-blocking part 52 surround a cooling cavity 53. The first water-blocking part 51 and the second water-blocking part 52, together with the first housing 11 and the second housing 12, form an annular channel for the flow of coolant. Specifically, with Figure 4 Taking this example, the first water-blocking part 51 and the second water-blocking part 52 are U-shaped and are joined together to form a cooling cavity 53. The first water-blocking part 51 has an inlet, and the second water-blocking part 52 has an outlet. The inlet channel 2 is connected to part of the cavity through the inlet, and the annular channel is connected to another part of the cavity through the outlet. The coolant enters through the inlet channel, one path through the inlet and filling the cooling cavity 53 on the lower left side of the guide plate 5. Another path of coolant flows along the cooling channel between the first housing 11 and the first water-blocking part 51, cooling the high-heat MOSFET and DIODE areas of the first housing 11. Then, the coolant flows through the connection port of the guide plate 5 along the cooling channel between the second housing 12 and the second water-blocking part 52, cooling the high-heat MOSFET and DIODE areas of the second housing 12. After cooling is completed, it enters the cooling cavity 53 on the upper left side of the guide plate 5 and finally exits through the outlet channel.

[0044] Furthermore, continue to refer to Figures 1-7 The guide plate 5 also includes a vertical plate portion 54, which is connected between the first water-blocking portion 51 and the second water-blocking portion 52. The guide plate 5 has multiple cavity portions spaced apart along a first direction, and a vertical plate portion 54 is provided between any two adjacent cavity portions. Specifically, the first direction is the AB direction, and the second direction is the CD direction. There are multiple vertical plate portions 54. Some vertical plate portions 54 have no gap with the outer shell 1, while others have gaps with the outer shell 1, so that one stream of coolant can enter the cavity portion on the lower left side of the guide plate 5 from the water inlet. Since there are at least two guide plates to be installed, and the installation positions are different, the front and back of the guide plates are also different. To avoid multiple guide plates being installed upside down, a closed cavity portion is provided to prevent mistaken installation. At the same time, multiple guide plates only require one mold-making device, reducing costs. The other coolant flows sequentially along the annular cooling channel between the first housing 11 and the first baffle 51, the connection port, and between the second housing 12 and the second baffle 52, cooling the first housing 11 and the second housing 12. After cooling, it enters the cooling cavity 53 on the upper left side of the guide plate 5 and is finally discharged through the outlet channel. Optionally, the multiple vertical plates 54 can be set with different height dimensions to change the coolant flow rate of the first cooling channel 41 and the second cooling channel 42.

[0045] Furthermore, continue to refer to Figures 1-7 The guide plate 5 also includes a middle water-blocking part 55, which is disposed between the first water-blocking part 51 and the second water-blocking part 52. The middle water-blocking part 55 extends along a first direction and connects to the vertical plate part 54. The middle water-blocking part 55 is used to divide the cooling cavity 53 into a first cavity and a second cavity along a second direction, which are perpendicular to each other. The first cavity is the cooling cavity 53 at the lower part of the guide plate 5, and the second cavity is the cooling cavity 53 at the upper part of the guide plate 5. The middle water-blocking part 55 is engaged with the cooling water channel 4 for fixing the guide plate 5.

[0046] Furthermore, continue to refer to Figures 1-7 There are two guide plates 5, and the cooling water channels 4 include a first cooling water channel 41 and a second cooling water channel 42. The two guide plates 5 are respectively disposed in the first cooling water channel 41 and the second cooling water channel 42. Specifically, both the first housing 11 and the second housing 12 are provided with a first cooling water channel 41 and a second cooling water channel 42. The inlet water channel 2 communicates with the first cooling water channel 41, and the outlet water channel 3 communicates with the second cooling water channel 42. The first cooling water channel 41 of the first housing 11 is attached to the first cooling water channel 41 of the second housing 12, and the second cooling water channel 42 of the first housing 11 is attached to the second cooling water channel 42 of the second housing 12, forming two three-dimensional water channels to cool and dissipate heat from the upper and lower MOSFETs and DIODE areas of the outer casing 1.

[0047] Furthermore, continue to refer to Figures 1-7 The first housing 11 and the second housing 12 are also provided with an intermediate cooling water channel 6. The intermediate cooling water channel 6 is located between the first cooling water channel 41 and the second cooling water channel 42, and is connected to both the first cooling water channel 41 and the second cooling water channel 42. The intermediate cooling water channel 6 circulates coolant for cooling the low-heat zone. Specifically, with Figure 4 Taking the guide plate 5 as an example, in order to connect the various cooling water channels, a connection port is provided between the first cooling water channel 41 and the intermediate cooling water channel 6. This connection port is located at the connection position between the cooling cavity 53 and the intermediate cooling water channel on the upper left side of the guide plate 5. Figure 5Taking the guide plate 5 as an example, it is provided with a connection port between the second cooling water channel 42 and the intermediate cooling water channel 6. This connection port is located at the connection port between the cooling cavity 53 and the intermediate cooling water channel on the lower right side of the guide plate 5. The intermediate cooling water channel 6 of the first housing 11 and the intermediate cooling water channel 6 of the second housing 12 are attached to each other to form a bottom cooling water channel, which cools and dissipates heat to the power inductor area of ​​the first housing 11 and the second housing 12. This power inductor area is a low-heat area. The first cavity of one of the two guide plates 5 is connected to the inlet water channel 2, and its second cavity is connected to the intermediate cooling water channel 6. The first cavity of the other guide plate 5 is connected to the intermediate cooling water channel 6, and its second cavity is connected to the outlet water channel 3. The coolant enters from the inlet water channel 2, flows sequentially through the annular cooling water channel 4 of the first guide plate 5, its second cavity, the intermediate cooling water channel 6, the first cavity of the second guide plate 5, and its annular cooling water channel 4, and finally exits from the outlet water channel 3 after being heated.

[0048] Furthermore, continue to refer to Figures 1-7 The water-cooled heat dissipation structure also includes a flow divider plate, which is located in the intermediate cooling water channel 6. Specifically, under the action of the flow divider plate, the intermediate cooling water channel 6 adopts a dual-channel parallel flow, which reduces the use of flow-around columns and reinforcing ribs, and greatly reduces the flow resistance of the coolant.

[0049] This embodiment also provides an electrical device, including components and the aforementioned water-cooled heat dissipation structure, with the components disposed within the water-cooled heat dissipation structure. Specifically, in the power inductor region where heat generation is low, dual parallel water channels are used to significantly reduce the flow resistance of the coolant. In the high-heat-generating MOSS and DIODE regions, guide plates 5 are used to change the cross-sectional area of ​​the cooling water channel 4, improving the flow of the coolant and solving the problem of low cross-sectional coolant flow velocity. While ensuring unobstructed cooling water flow, a three-dimensional circulation within the cross-sectional cooling water channel 4 is achieved, significantly improving the heat dissipation effect. Preferably, the first housing 11 is mounted upright, and the second housing 12 is mounted upside down, sharing a common cooling water channel, resulting in a compact arrangement and improved space utilization.

[0050] The water cooling route of the water-cooled heat dissipation structure is as follows:

[0051] Coolant enters through the inlet channel 2 and flows along the cooling channel between the first housing 11 and the first baffle 51, cooling the high-heat area of ​​the first housing 11. Then, coolant flows through the connection port on the right side between the first baffle 51 and the second baffle 52 into the cooling channel between the second housing 12 and the second baffle 52, cooling the high-heat area of ​​the second housing 12. Coolant then enters the cooling chamber 53 on the upper left side of the guide plate 5 through the outlet, and enters the intermediate cooling channel 6 through the connection port between the cooling chamber 53 and the intermediate cooling channel 6, cooling the low-heat area of ​​the outer casing 1. Next, the coolant enters through the connection between the upper right cooling chamber 53 of the second guide plate and the intermediate cooling water channel 6, and flows through the inlet into the cooling water channel between the first housing 11 and the first water baffle of the second guide plate 5. It then flows through the connection on the left side between the first water baffle 51 and the second water baffle 52 into the cooling water channel between the second housing 12 and the second water baffle 52, cooling the high-heat areas of the first housing 11 and the second housing 12. The two guide plates 5 have identical structures and function, but are installed in opposite directions. Finally, the coolant enters the outlet water channel 3 and is discharged through the overall water outlet.

[0052] Obviously, the above embodiments of the present invention are merely examples for clearly illustrating the present invention, and are not intended to limit the implementation of the present invention. Those skilled in the art will be able to make various obvious changes, readjustments, and substitutions without departing from the scope of protection of the present invention. It is neither necessary nor possible to exhaustively describe all embodiments here. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention should be included within the scope of protection of the claims of the present invention.

Claims

1. A water-cooled heat dissipation structure, characterized in that, include: The outer shell (1) is provided with an inlet water channel (2) and an outlet water channel (3). The outer shell (1) includes a first shell (11) and a second shell (12). Both the first shell (11) and the second shell (12) have a high-heat zone and a low-heat zone. Both the first shell (11) and the second shell (12) are provided with a cooling water channel (4). The cooling water channel (4) is connected to the inlet water channel (2) and the outlet water channel (3). The cooling water channel (4) is circulated with coolant for cooling the high-heat zone. A guide plate (5) is located between the first housing (11) and the second housing (12), and the guide plate (5) is disposed in the cooling water channel (4). The guide plate (5) is used to guide the coolant to cool the high-heat area of ​​the first housing (11) and the high-heat area of ​​the second housing (12). There are two guide vanes (5), and the cooling water channel (4) includes a first cooling water channel (41) and a second cooling water channel (42). The two guide vanes (5) are respectively disposed in the first cooling water channel (41) and the second cooling water channel (42). The first housing (11) and the second housing (12) are also provided with an intermediate cooling water channel (6), which is located between the first cooling water channel (41) and the second cooling water channel (42). The intermediate cooling water channel (6) is connected to the first cooling water channel (41) and the second cooling water channel (42) respectively, and the intermediate cooling water channel (6) is circulated with coolant for cooling the low heat zone. The first cavity of one of the two guide plates (5) is connected to the water inlet channel (2), and its second cavity is connected to the intermediate cooling channel (6). The first cavity of the other guide plate (5) is connected to the intermediate cooling channel (6), and its second cavity is connected to the water outlet channel (3).

2. The water-cooled heat dissipation structure according to claim 1, characterized in that, The guide plate (5) includes a first water-blocking part (51) and a second water-blocking part (52). The first water-blocking part (51) and the second water-blocking part (52) form a cooling cavity (53). The first water-blocking part (51) and the second water-blocking part (52) together with the first housing (11) and the second housing (12) form an annular channel for the flow of coolant.

3. The water-cooled heat dissipation structure according to claim 2, characterized in that, The guide plate (5) also includes a vertical plate (54), which is connected between the first water-blocking part (51) and the second water-blocking part (52). The guide plate (5) is provided with a plurality of cavity parts at intervals along the first direction, and the vertical plate (54) is provided between any two adjacent cavity parts.

4. The water-cooled heat dissipation structure according to claim 3, characterized in that, The first water-blocking part (51) is provided with a water inlet, the second water-blocking part (52) is provided with a water outlet, the water inlet channel (2) is connected to part of the cavity part through the water inlet, and the annular channel is connected to another part of the cavity part through the water outlet.

5. The water-cooled heat dissipation structure according to claim 3, characterized in that, The guide plate (5) further includes an intermediate water baffle (55), which is disposed between the first water baffle (51) and the second water baffle (52). The intermediate water baffle (55) extends along the first direction and is connected to the vertical plate (54). The intermediate water baffle (55) is used to divide the cooling cavity (53) into a first cavity and a second cavity along the second direction, wherein the second direction and the first direction are perpendicular to each other.

6. The water-cooled heat dissipation structure according to claim 1, characterized in that, The water-cooled heat dissipation structure also includes a flow divider plate, which is disposed in the intermediate cooling water channel (6).

7. Electrical equipment, including components, characterized in that, It also includes the water-cooled heat dissipation structure according to any one of claims 1-6, wherein the component is disposed on the water-cooled heat dissipation structure.

Citation Information

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