A table for heating and cooling an object

By designing heating and cooling sections on the worktable and filling the gaps between the slots with heat transfer medium, the problem of unstable contact between the tube and the worktable was solved, achieving stable temperature control and simplified processing.

CN116685713BActive Publication Date: 2026-03-24ADVANTEC CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2022-02-03
Publication Date
2026-03-24

AI Technical Summary

Technical Problem

In the prior art, the contact between the heating and cooling pipes of the worktable and the worktable is unstable, which leads to a decrease in temperature control efficiency and processing difficulties.

Method used

A workbench was designed, comprising heating and cooling sections, with heat-conducting medium filling the gaps in the slots. Tubular sections are fixed by notches and connecting parts to ensure stable contact between the tubes and the workbench.

Benefits of technology

This achieves stable contact between the workbench tube and the workbench, simplifies temperature control, and improves the convenience and efficiency of processing.

✦ Generated by Eureka AI based on patent content.

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Abstract

The present invention provides a workbench that allows a tube provided in the workbench to be in contact with the workbench permanently and easily, and also allows easy correction. The solution of the present invention is a workbench 1 provided in a chamber and used for heating and cooling an object, the workbench 1 having: a workbench body 5 having a mounting surface for mounting the object; a first tubular portion 7 for allowing a first fluid to flow therethrough, the first fluid being used for adjusting the temperature of the mounting surface; and a first tube support portion 9 for supporting the first tubular portion 7; the workbench body 5 having: a first groove portion 11 for accommodating the first tubular portion 7; and a pair of notches 13a, 13b facing each other across the first groove portion 11; and the first tube support portion 9 having: a connecting portion 15 connecting the pair of notches 13a, 13b.
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Description

TECHNICAL FIELD

[0001] The present application relates to a table for heating and cooling an object. BACKGROUND

[0002] Japanese Patent No. 5427367 describes a rectangular base. The base is used as a table, for example, when manufacturing semiconductor integrated circuits, flat display panels, and solar cell panels. The base is used to heat a substrate, for example, during a manufacturing process. Rapid and uniform heating of the substrate is required at this time. Cooling of the substrate is also desirable. Therefore, a cooling pipe or a heating pipe is considered to be used to control the temperature of the table. In the case of simply contacting the pipe with the table, the pipe can fall off, and the temperature control efficiency can decrease. In the case of inserting the pipe into the inside of the table, processing is difficult, and correction can not be possible.

[0003] PRIOR ART DOCUMENTS

[0004] PATENT DOCUMENTS

[0005] Patent Document 1: Japanese Patent No. 5427367 SUMMARY

[0006] PROBLEMS TO BE SOLVED BY THE INVENTION

[0007] An object of the present application is to provide a table that allows a pipe provided in the table to be in contact with the table permanently and easily corrected in a simple manner.

[0008] TECHNICAL SOLUTION TO THE PROBLEM

[0009] The above problem can be solved by a table that has not only a heating portion that heats a mounting surface of the table but also a cooling portion. The above problem can also be solved by filling a gap of a groove that accommodates the heating portion or the cooling portion with a heat-conducting medium.

[0010] The first type of the present application relates to a table 1 that is provided in a chamber and is used to heat and cool an object.

[0011] The table 1 has:

[0012] a table body 5 that has a mounting surface on which the object is mounted;

[0013] a first pipe-shaped portion 7 that is used to circulate a first fluid that is used to adjust the temperature of the mounting surface; and

[0014] a first pipe support portion 9 that is used to support the first pipe-shaped portion 7.

[0015] The table body 5 has:

[0016] a first groove portion 11 for accommodating the first tubular portion 7; and

[0017] a pair of notches 13a, 13b facing each other across the first groove portion 11.

[0018] Then, the first pipe support portion 9 has:

[0019] a connecting portion 15 connecting the pair of notches 13a, 13b.

[0020] A preferred example of the worktable is that a heat transfer medium is provided in the gap between the first tubular portion 7 and the first groove portion 11. Preferred examples of the heat transfer medium are silver, grease, metal fibers, or gas.

[0021] A preferred example of the worktable is the worktable as described in the first aspect of the invention,

[0022] The first fluid is a fluid for increasing the temperature of the mounting surface;

[0023] The worktable further has: a second tubular portion 21 for passing a second fluid, the second fluid being a fluid for decreasing the temperature of the mounting surface;

[0024] a second groove portion 23 for accommodating the second tubular portion 21; and

[0025] a second pipe support portion 25 for supporting the second tubular portion 21.

[0026] The second aspect of the invention is about a vacuum device having the above-described worktable as a base.

[0027] The vacuum device is used, for example, in the manufacture of semiconductor integrated circuits, flat display panels, or solar cell panels.

[0028] The third aspect of the invention is about a method of manufacturing semiconductor integrated circuits, flat display panels, or solar cell panels using the above-described vacuum device.

[0029] Effects of the Invention

[0030] The invention has a groove portion for accommodating a tubular portion, a pair of notches facing each other across the groove portion, and a pipe support portion having a connecting portion connecting the pair of notches, and thus can provide a worktable in which a pipe provided in the worktable is in constant contact with the worktable in a simple manner and is also easily corrected. BRIEF DESCRIPTION OF DRAWINGS

[0031] [ Figure 1 ] Figure 1 is a conceptual view showing the state of the worktable;

[0032] [ Figure 2 ] Figure 2 is a schematic view of the worktable;

[0033] [ Figure 3 ] Figure 3 is a partial sectional view of a work table;

[0034] [ Figure 4 ] Figure 4 is a conceptual diagram for explaining a joint portion;

[0035] [ Figure 5 ] Figure 5 is a reference diagram for explaining a work table in a manufacturing process;

[0036] [ Figure 6 ] Figure 6 is a conceptual diagram showing an example of use of a heat transfer medium;

[0037] [ Figure 7 ] Figure 7 is a photograph of a drawing showing a back surface of a work table in which grooves and notches have been formed;

[0038] [ Figure 8 ] Figure 8 is a photograph of a drawing showing a jig in which a pipe support portion has been welded. DETAILED DESCRIPTION

[0039] Embodiments for carrying out the present application will be explained below using the drawings. The present application is not limited to the modes explained below, but also includes those obtained by making appropriate modifications to the modes below within a range that is obvious to those skilled in the art.

[0040] Figure 1 is a conceptual diagram showing a state of arrangement of a work table. The work table 1 is generally arranged inside a process chamber 2 and performs temperature management of a substrate 3. The process chamber 2 is isolated from outside air and maintained at a desired degree of vacuum. The process chamber 2 can also be filled with a process gas 4 to maintain a pressure. The pressure of the process gas 4 differs depending on the type of process chamber, such as a physical vapor deposition (PVD) chamber or a sputtering chamber, an ion metal implantation (IMP) chamber, a chemical vapor deposition (CVD) chamber, an atomic layer deposition (ALD) chamber, a plasma etching chamber, an annealing chamber, other chambers.

[0041] Figure 2 is a schematic view of a work table. Figure 3 is a partial sectional view of a work table. The work table is arranged in a chamber and is a mounting table for heating and cooling an object. An example of the chamber is a vacuum chamber. Examples of the object are a semiconductor integrated circuit, a flat panel display panel, and a solar cell panel, or a substrate in a process of manufacturing these objects.

[0042] As Figures 1 to 3As shown, the stage 1 has a stage body 5, a first tubular portion 7, and a first tube support portion 9. The stage body 5 has a first groove portion 11 and a pair of notches 13a, 13b. Then, the first tube support portion 9 has a linking portion 15. Also, the preferred example of the stage 1 further has a second tubular portion 21, a second groove portion 23, and a second tube support portion 25. In Figures 1 to 3 In the example shown, the tubular portion communicates with the outside of the process chamber 2 through the inside of the stage support portion 6. Thus, fluid can flow from the outside into the tubular portion.

[0043] Stage body 5

[0044] The stage body 5 means a portion having a mounting surface on which an object is mounted.

[0045] First tubular portion 7

[0046] The first tubular portion 7 is a tube for passing a first fluid, which is used to adjust the temperature of the mounting surface. The tubular portion is preferably made of a material that does not dissolve when the stage 1 is heated. By passing a liquid for temperature adjustment through this tube, the temperature of the stage 1 can be adjusted. The first tubular portion 7 can be, for example, a portion composed of a cylindrical tube through which a liquid for cooling the stage 1 is passed. The shape of the tube of the first tubular portion 7 can be, for example, a cylindrical shape having a circular base with a radius of 5 mm. The radius can be 3 mm or more and 9 mm or less, or 4 mm or more and 8 mm or less. The size or length of the tube can be appropriately adjusted in accordance with the size of the stage 1. The radii of the first tubular portion 7 can be equal, or can increase as they progress from upstream to downstream. The cross-sectional shape of the tube of the first tubular portion 7 can be circular, elliptical, or rectangular (quadrangular, pentagonal, hexagonal, or octagonal). The first fluid can be a fluid for increasing the temperature of the mounting surface, or a fluid for decreasing the temperature. Different fluids can be injected into one tube.

[0047] First tube support portion 9

[0048] The first tube support portion 9 is an element for supporting the first tubular portion 7.

[0049] First groove portion 11

[0050] The first groove portion 11 is an element provided in the stage body 5 and used to accommodate the first tubular portion 7. The first groove portion 11 can be provided on the mounting surface side of the stage body 5, or on the back surface (the surface opposite the mounting surface) side. The first groove portion 11 is a portion having a lower height than the surrounding portions.

[0051] Pair of notches 13a, 13b

[0052] The notch pair 13a, 13b is a recess provided at a position facing across the first groove portion 11. The notch pair 13a, 13b can also be said to be a hole for insertion provided at both sides of the first tubular portion 7 facing across the first tubular portion 7. The recess is inserted with the coupling portion 15 of the first pipe support portion 9 described later. In this way, the first pipe support portion 9 is fixed by the coupling portion 15. Along with this, the first tubular portion 7 is fixed in the first groove portion 11. The hole of the notch pair 13a, 13b can be, for example, a hole elongated by about 30 mm in the direction in which the pipe of the tubular portion extends. The hole of the notch pair 13a, 13b can be a hole having a depth of 20 mm or more and 30 mm or less, or a hole having a depth of 21 mm or more and 35 mm or less. The notch pair 13a, 13b is preferably provided in plurality on the back surface of the workbench. The number of the notch pair 13a, 13b can be, for example, three with respect to one workbench, or four, or five. The more the number of the notch pair 13a, 13b provided in the workbench 1, the more the coupling portion 15 can be installed, and thus the first tubular portion 7 can be more stably fixed.

[0053] The interval from one hole of the notch pair 13a, 13b of one set facing across the first groove portion 11 to one hole of the notch pair 13a, 13b located adjacent in the direction in which the pipe of the first tubular portion 7 extends can be, for example, 70 mm or more and 100 mm or less, or 70 mm or more and 110 mm or less, or 80 mm or more and 100 mm or less, or 80 mm or more and 110 mm or less. The interval of the holes of one set of the notch pair 13a, 13b facing across the first groove portion 11 can be, for example, 10 mm or more and 15 mm or less, or 12 mm or more and 15 mm or less, or 15 mm or more and 20 mm or less.

[0054] Figure 4 This is a conceptual diagram for explaining the coupling portion. The coupling portion 15 can be installed in the notch pair 13a, 13b of the workbench 1 in a manner covering the first tubular portion 7 and the first groove portion 11. The shape of the coupling portion 15 can be, for example, a shape in which the central portion of any one of the bottom surfaces of a quadrangular column is processed into a recessed shape. Further, the height of the above-described central portion is lower than the surrounding bottom surface, and a wall portion can be formed on both sides of the recessed portion, and the wall portion is formed in a protruding shape. The height of the protrusion (wall portion) is formed to a height corresponding to the depth of the hole of the notch pair 13a, 13b, and can be, for example, 10 mm or more and 13 mm or less, or 13 mm or more and 16 mm or less.

[0055] In the above wall portion, the surface facing the central region of the bottom surface does not necessarily have to be perpendicular with respect to the bottom surface, and the above portion of the wall portion can extend in a direction opening from the central region of the bottom surface of the quadrangular column toward the direction of the opposite sides of the bottom surface. For example, the angle between the above protrusion (wall portion) of one side and the protrusion (wall portion) of the opposite side can be 30 degrees or more and 40 degrees or less, 40 degrees or more and 50 degrees or less, or 50 degrees or more and 60 degrees or less.

[0056] Figure 5 Reference diagram for explaining the workbench in the manufacturing process.

[0057] A preferred example of this workbench is that a heat transfer medium is provided in the gap between the first tubular portion 7 and the first groove portion 11. A preferred example of the heat transfer medium is silver, grease, metal fibers, or a gas.

[0058] Figure 6 Conceptual diagram showing an example of the use of a heat transfer medium. Microscopically, a minute gap exists in the gap between the first tubular portion 7 and the first groove portion 11. Therefore, it is effective to use a heat transfer medium. The heat transfer medium can be a solid such as carbon fibers, a grease-like substance, a liquid such as silver, or a gas such as hydrogen or helium. In the case of a grease-like substance, a liquid, or a gas, sealing can be performed in order to prevent leakage.

[0059] In the case of a fluid such as a grease-like substance, a liquid, or a gas as the heat transfer medium, the heat transfer medium is preferably filled into the gap and sealed so as not to leak. For the sake of simplicity, a sealing plate 31 is attached to the end portion of the workbench support portion 6, and the first tubular portion 7 and the second tubular portion 21 are completely sealed with a sealing portion 33. By sealing the heat transfer medium so as to be isolated from the atmosphere and prevent leakage. In the case of a gas as the heat transfer medium, by pressing the gas into the gap, the heat transfer efficiency can be dramatically improved.

[0060] A preferred example of this workbench is that

[0061] The first fluid is a fluid for increasing the temperature of the mounting surface;

[0062] The workbench further has a second tubular portion 21 for circulating a second fluid for decreasing the temperature of the mounting surface;

[0063] a second groove portion 23 for accommodating the second tubular portion 21; and

[0064] a second tube support portion 25 for supporting the second tubular portion 21.

[0065] In this case, the first tubular portion functions as a heating portion. Also, the second tubular portion functions as a cooling portion.

[0066] The second aspect of the present application is about a vacuum apparatus having the above-described workbench as a base. The vacuum apparatus is, for example, a vacuum apparatus used for manufacturing a semiconductor integrated circuit, a flat panel display panel, or a solar cell panel. The vacuum apparatus generally has a chamber and a vacuum pump for making the chamber vacuum. Also, the vacuum apparatus can have an introduction portion for introducing various materials into the chamber. Also, the vacuum apparatus can appropriately have a sensor or a measuring device for performing various measurements. An example of the chamber is a process chamber for manufacturing an object. Examples of the flat panel display panel are an organic EL display, a plasma display, and a liquid crystal display.

[0067] The third aspect of the present application is about a method for manufacturing a semiconductor integrated circuit, a flat panel display panel, or a solar cell panel using the above-described vacuum apparatus. The method for manufacturing a semiconductor integrated circuit is known, for example, as described in Japanese Patent No. 3956697, Japanese Patent No. 3519589, and Japanese Patent No. 3064993. The method for manufacturing a flat panel display panel is known, for example, as described in Japanese Patent No. 5173757, Japanese Patent No. 5169757, and Japanese Patent No. 4604752. The method for manufacturing a solar cell panel is known, for example, as described in Japanese Patent No. 6555964, Japanese Patent No. 6498053, and Japanese Patent No. 5386044.

[0068] The workbench can be manufactured, for example, as follows. A groove (flow path) is mechanically processed in an aluminum plate having a thickness of 30 to 100 mm and a rectangular (e.g., square) plate having a length of 1500 to 4000 mm on one side. Also, a pair of notches is appropriately formed on both sides of the groove. The material of the workbench body is not limited to aluminum, but can be any metal. A pipe having an outer diameter of φ5 to φ20 is inserted into the groove (flow path) obtained in this way. After the pipe is inserted into the groove, the pipe support portion is inserted into the pair of notches. The pipe support portion can be appropriately welded. The workbench can be manufactured in this way.

[0069] Embodiment

[0070] The base is manufactured as follows.

[0071] A flow path is processed in an aluminum plate having a material of A6061, and temperature control is performed by passing a heater or a heat conduction medium therethrough. The workbench (base) is originally used in a vacuum apparatus, but here, temperature change is measured in the atmosphere in order to measure temperature change.

[0072] Figure 7 A photograph of a drawing showing the back of the workbench on which a groove and notches have been formed. Figure 8 A photograph of a drawing showing a model in which a pipe support portion has been welded.

Claims

1. A workbench (1), characterized in that, The worktable (1), located within a cavity and used for heating and cooling objects, has the following features: The workbench body (5) has a mounting surface for the object to be mounted; A first tubular portion (7) is used to allow a first fluid to flow through, the first fluid being used to adjust the temperature of the mounting surface; and Multiple independent first tube support portions (9) are used to support the first tubular portion (7). The workbench body (5) has: A first groove (11) is used to receive the first tubular portion (7); and The notches (13a, 13b) face each other across the first groove (11); The first tube support (9) has: Connecting part (15), which connects the notch pair (13a, 13b); The first fluid is a fluid used to increase the temperature of the mounting surface; The workbench body (5) further has: The second tubular portion (21) is used to allow a second fluid to flow through, the second fluid being used to reduce the temperature of the mounting surface; The second groove (23) is used to receive the second tubular portion (21); and Multiple independent second tube support portions are provided to support the second tubular portion (21) and are provided separately from the first tube support portion (9); The workbench body (5) has: The second notch pair faces each other across the second groove (23); The second tube support has: The second connecting part connects to the second notch pair; The connecting part (15) has: The main body is shaped like a four-cornered prism; A planar portion, located at the center of the upper surface of the body portion; and Two wall portions are located on either side of the planar portion; The two wall portions correspond to the notch pair (13a, 13b). The second connecting part has: The second body part is shaped like a four-cornered column; The second planar portion is located at the center of the upper surface of the second body portion; and Two second wall portions are located on both sides of the second planar portion; The two second wall portions correspond to the second notch pair.

2. The workbench according to claim 1, characterized in that, A heat-conducting medium is present in the gap between the first tubular portion (7) and the first groove portion (11).

3. The workbench according to claim 2, characterized in that, The heat transfer medium is silver, grease, metal fiber, or gas.

4. A vacuum device, characterized in that, It has a worktable as a base as claimed in any one of claims 1 to 3.

5. The vacuum device according to claim 4, characterized in that, It is used in the manufacture of semiconductor integrated circuits, flat panel display panels, or solar panels.

6. A method for manufacturing a semiconductor integrated circuit, a flat panel display panel, or a solar panel, characterized in that, It is performed using the vacuum apparatus as described in claim 4.

Citation Information

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