A multi-mode integrated circuit chip performance evaluation device and method

By designing a multi-mode integrated circuit chip performance evaluation device, the chip is continuously heated and constant temperature using the first and second control devices, the problem of low chip testing efficiency in high-temperature environments in the prior art is solved, and the accuracy of the test is improved and efficiency, and energy savings.

CN116699366BActive Publication Date: 2025-01-03SHENZHEN AEGLIN ELECTRONICS CO LTD
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Patent Information

Application Number
CN202310709560.3
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2023-06-14
Publication Date
2025-01-03
Estimated Expiration
2043-06-14

AI Technical Summary

Technical Problem

It is difficult for existing chip thermal testing equipment to test multiple chips at the same time in high temperature environments, and manual operation steps are cumbersome and time-consuming, affecting the testing efficiency and accuracy.

Method used

A multi-mode integrated circuit chip performance evaluation device is designed, including a chip, a water bearing box, a first control device, a timer, a pointer and a heating member. The start and stop of the heating member is controlled by the first control device, and the second control device controls the The heating time of hot water achieves continuous heating and constant temperature of the chip, and the display device is used to monitor the chip status in real time, optimize temperature and time control, and improve testing efficiency.

Benefits of technology

It realizes accurate constant temperature testing of the chip, improves the accuracy and consistency of the test, saves energy, reduces manual operation time, and improves the quality and efficiency of chip design and manufacturing.

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Abstract

The present invention discloses a multi-mode integrated circuit chip performance evaluation device and method, comprising: a chip, a water receiving box, a hot water pipe, a first control device, a timer, a pointer, a second control device and a heating element; the first control device is connected in series with the second control device and the water pump through the wire; the first control device is used to control the start and stop of the heating element; the second control device and the pointer are used to control the hot water heating time; the water receiving box is used to continuously heat the chip and keep the temperature constant; the chip performance evaluation device is externally connected to a power supply; the first control device controls the temperature of water in the hot water pipe; the chip comprises an input end and an output end; the input end and the output end are externally connected to a display device; the method for measuring the thermal stability of the chip is a controlled variable method; one variable among temperature and time is controlled, and the other variable is increased step by step, so as to observe the thermal stability performance of the chip.
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Description

Technical Field

[0001] The present invention relates to the technical field of integrated circuit chips, and in particular to a multi-mode integrated circuit chip performance evaluation device and method. Background Art

[0002] The normal operating temperature range of civil chips is 0℃-70℃. The development of modern communication equipment technology depends on the design and manufacture of semiconductor products. As the core component of data processing in communication equipment, chips have high precision. Chips are prone to generate heat after a long period of operation. High-precision chips are prone to running jams in high-temperature environments, which affects the overall working efficiency of the equipment. Therefore, it is necessary to test the performance of the chip in a high-temperature environment before the chip is put into use; the existing chip thermal test requires the use of a chip thermal test aging cabinet. First, the test sub-board with the chip is pre-placed on the placement rack, and then the placement rack is placed in the aging cabinet. The test sub-board is connected through the test cable in the aging cabinet, and then the chip is powered on for testing. The chip is tested at different high temperatures. The values ​​of various parameters tested need to rely on the aging cabinet to complete the collection. The model size of the aging cabinet restricts the capacity of the chip to be tested, and it is difficult to test a large number of chips to be tested at the same time. The test board is first manually placed on the placement rack and then the cable is plugged in to connect the test main board for power-on testing. The manual operation steps are time-consuming. In the measurement process of the household solar water heating system, for example, the temperature sensor of the solar water heater needs to be evaluated before use to test its performance at a certain temperature. The heat resistance time; in the prior art, the common heating method is resistance wire heating; during long-term measurement, the heat dissipation is faster, and through the water-insulated heating method, because the water itself dissipates heat slower than the air, the energy consumption is lower in long-term continuous heating; therefore, the present invention provides a multi-mode integrated circuit chip performance evaluation device and method. Summary of the invention

[0003] In order to solve the problems existing in the prior art, the present invention discloses a multi-mode integrated circuit chip performance evaluation device and method, comprising: a chip, a water receiving box, a first control device, a timer, a pointer, a second control device and a heating element; the first control device is connected in series with the second control device and the water pump through the wire; the first control device is used to control the start and stop of the heating element; the second control device and the pointer are used to control the hot water heating time; the water receiving box is used to continuously heat the chip and keep the temperature constant; the chip performance evaluation device is externally connected to a power supply; the first control device controls the temperature of the water in the hot water pipe; the chip comprises an input end and an output end; the input end and the output end are externally connected to a display device; the timer increases each time period in steps, heats the water in the hot water pipe to boiling in each time period, observes the display stability of the display device, and thus evaluates the heat resistance of the chip.

[0004] Preferably, a multi-mode integrated circuit chip performance evaluation device and method include: a water receiving tank, a hot water pipe, a water receiving box, a water outlet device, a water cut-off device, a first control device, a timer, a water pump, a heating element, an external connector and a chip; the water receiving tank is located on the top of the evaluation device; the hot water pipe connects the water receiving box with the water receiving box; the internal size of the water receiving box matches the size of the chip; the water outlet device is located at the connection point between the water receiving tank and the hot water pipe; the chip surface is provided with an input end and the output end.

[0005] Preferably, the water outlet device includes: an electromagnet, a fixed rod, a piston, a clamping plate, a first spring and a water outlet plate; the water outlet plate is provided with evenly arranged water leakage holes; the water outlet device is located in the middle position below the water receiving tank; the water outlet device connects the water receiving tank and the hot water pipe; the electromagnet is located at the top of the water outlet device; a pair of fixed rods are provided; the pair of fixed rods are fixedly connected to the electromagnet; the electromagnet is electrically connected to the wire; the fixed rods are fixedly connected to the inner bottom surface of the water receiving tank.

[0006] Preferably, a water inlet is also provided on the top of the water receiving tank.

[0007] Preferably, the first control device includes: a first return spring, a fixed block, a sliding block, a movable plug, a mercury tube and a heat conducting plate; the first control device is fixedly connected to the water receiving tank and the hot water pipe; the first control device is located on the left side below the water receiving tank; the heat conducting plate is located at the bottom of the first control device; the mercury tube is located above the heat conducting plate; the movable plug is slidably connected to the mercury tube; the upper end of the first return spring is fixed to the inner wall of the first control device; the lower end of the first return spring is fixedly connected to the sliding block; the two ends of the fixed block are fixedly connected to the inner wall of the first control device; the outer shell of the first control device is provided with a plurality of bolt holes; the bolt holes correspond to temperature scales; the fixed block can be fixed to the inner wall of the first control device by external bolts; the sliding block is slidably connected to the inner wall of the first control device; the first control device is electrically connected to the heating element.

[0008] Preferably, the multi-mode integrated circuit chip performance evaluation device and method further include: a timer: the timer includes a pointer and the second control device; a gear is provided inside the pointer, and the pointer rotates counterclockwise.

[0009] Preferably, the second control device includes: a supporting plate, a second pressing block, a sensing block and a second return spring; the supporting plate is fixedly connected to the inner wall of the timer; the second pressing block is an oblique triangle; the sensing block is arranged above the inner wall of the supporting plate; the second return spring is fixedly connected to the second pressing block and the bottom of the inner wall of the supporting plate.

[0010] Preferably, the water cutoff device comprises: a second spring, a sensing plate and a suspension ball; the second spring fixedly connects the hot water pipe and the suspension ball; the sensing plate is located on the lower side of the inner wall of the hot water pipe; the diameter of the suspension ball is greater than the width of the water outlet device.

[0011] Preferably, the bottom surface of the water receiving box is provided with a first pressing block, a limiting spring, a connecting block and a connecting plate; the bottom of the water receiving box is provided with a groove; the groove matches the shape of the connecting plate; the first pressing block is embedded in the connecting plate; the first pressing block is electrically connected to the wire; the connecting block is electrically connected to the wire; the limiting spring is fixedly connected to the inner wall of the connecting plate and the first pressing block; the connecting block is fixedly connected to the bottom of the inner wall of the connecting plate.

[0012] Compared with the prior art, the present invention has the following beneficial effects:

[0013] 1. By setting the first control device and the heating element, the temperature can be continuously maintained at a certain fixed value, thereby achieving an accurate constant temperature effect; the first control device can accurately control the temperature environment of the chip by adjusting the opening of the heating element according to the real-time temperature. Through the feedback control mechanism, the working state of the heating element is continuously adjusted so that the temperature of the chip is always stable near the target value, achieving a constant temperature technical effect.

[0014] 2. By setting the second control device and the pointer, the heating time can be precisely controlled; at the beginning of the test, the countdown device is started and the heating element starts working; when the countdown ends, the second control device will automatically disconnect to ensure that the chip is properly heated within the specified time; this time control method can ensure the accuracy and consistency of the test while improving work efficiency.

[0015] 3. Intelligent control of the hot water system can be achieved by setting a float device. The float can determine whether the hot water pipe is full of water according to the change of water level. When the water level reaches a certain height, the float will sense it and block the water outlet device upward through buoyancy to prevent water from continuing to flow out, thereby improving water use efficiency; this control mechanism can effectively avoid the waste of hot water and save energy and resources.

[0016] 4. By connecting a display device to the input and output ends, real-time monitoring and determination of the chip status can be achieved. The display device can display the circuit connection status between the input and output ends; by observing the status of the display device, it is possible to intuitively determine whether the chip is damaged, thereby improving the convenience of determination.

[0017] In summary, through the above improvement measures, the multi-mode integrated circuit chip performance evaluation device has been further optimized and improved in terms of temperature control, time control, water resource utilization and status monitoring. This will help improve the quality and efficiency of chip design and manufacturing. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a vertical cross-sectional view of the present invention;

[0019] Figure 2 This is a vertical cross-sectional view of the water receiving tank of the present invention;

[0020] Figure 3 is a cross-sectional view of a first control device of the present invention;

[0021] Figure 4 It is a partial enlarged view of the housing of the first control device of the present invention;

[0022] Figure 5 It is a cross-sectional view of the timer of the present invention;

[0023] Figure 6 It is an enlarged schematic diagram of the second control device of the present invention;

[0024] Figure 7 It is a top view of the inner bottom surface of the water receiving box of the present invention;

[0025] Figure 8 This is a vertical cross-sectional view of the water receiving box of the present invention;

[0026] Fig. 9 This is a perspective view of the appearance of the present invention;

[0027] Fig.10 It is a cross-sectional view of an external connecting member of the present invention;

[0028] Fig.11 It is a partial cross-sectional view of the elevation of the water receiving box of the present invention;

[0029] Fig.12 A top view of the chip of the present invention;

[0030] Fig.13 It is a cross-sectional view of the water outlet device of the present invention;

[0031] Fig.14 It is a cross-sectional view of the water cut-off device of the present invention;

[0032] In the figure: 1, chip; 101, input end; 102, output end; 2, water box; 201, first pressing block; 202, limit spring; 203, connecting block; 204, connecting plate; 3, wire; 4, water box; 401, water inlet; 5, hot water pipe; 6, water outlet device; 601, electromagnet; 602, fixing rod; 603, piston; 604, clamping plate; 605, first spring; 606, water outlet plate; 7, first control device; 701, first reset spring Spring; 702, fixed block; 703, movable plug; 704, mercury tube; 705, heat conductive sheet; 706, bolt hole; 707, sliding block; 8, timer; 801, pointer; 802, second control device; 8021, supporting plate; 8022, second pressing block; 8023, induction block; 8024, second return spring; 9, water pump; 10, heating element; 11, water cut-off device; 1101, second spring; 1102, suspension ball; 12, external connecting piece. DETAILED DESCRIPTION

[0033] In order to solve the problems existing in the prior art, the present invention discloses a multi-mode integrated circuit chip performance evaluation device and method, comprising: a chip 1, a water receiving box 2, a first control device 7, a timer 8, a pointer 801, a second control device 802 and a heating element 10; the first control device 7 is connected in series with the second control device 802 and the water pump 9 through the wire 3; the first control device 7 is used to control the start and stop of the heating element 10; the second control device 802 and the pointer 801 are used to control the hot water heating time; the water receiving box 2 is used to continuously heat the chip 1 and keep the temperature constant; the chip 1 performance evaluation device is externally connected to a power supply; the first control device 7 controls the temperature of the water in the hot water pipe 5; the chip 1 includes an input end 101 and an output end 102; the input end 101 and the output end 102 are externally connected to a display device; the timer 8 increases each time period in steps, heats the water in the hot water pipe 5 to boiling in each time period, and observes the display stability of the display device, thereby evaluating the heat resistance of the chip 1.

[0034] Specifically, a multi-mode integrated circuit chip performance evaluation device and method include: a water receiving tank 4, a hot water pipe 5, a water receiving box 2, a water outlet device 6, a water cut-off device 11, a first control device 7, a timer 8, a water pump 9, a heating element 10, an external connector 12 and a chip 1; the water receiving tank 4 is located at the top of the evaluation device; the hot water pipe 5 connects the water receiving box 2 and the water receiving tank 4; the internal dimensions of the 2 match the dimensions of the chip 1; the water outlet device 6 is located at the connection point between the water receiving tank 4 and the hot water pipe 5; the surface of the chip 1 is provided with an input end 101 and an output end 102.

[0035] Specifically, the water outlet device 6 includes: an electromagnet 601, a fixed rod 602, a piston 603, a clamping plate 604, a first spring 605 and a water outlet plate 606; the water outlet plate 606 is provided with evenly arranged water leakage holes; the water outlet device 6 is located in the middle position below the water receiving tank 4; the water outlet device 6 connects the water receiving tank 4 and the hot water pipe 5; the electromagnet 601 is located at the top of the water outlet device 6; a pair of fixed rods 602 are provided; a pair of fixed rods 602 are fixedly connected to the electromagnet 601; the electromagnet 601 is electrically connected to the wire 3; the fixed rod 602 is fixedly connected to the inner bottom surface of the water receiving tank 4.

[0036] Specifically, a water inlet 401 is also provided on the top of the water receiving tank 4 .

[0037] Specifically, the first control device 7 includes: a first return spring 701, a fixed block 702, a sliding block 707, a movable plug 703, a mercury tube 704 and a heat conducting sheet 705; the first control device 7 is fixedly connected to the water receiving tank 4 and the hot water pipe 5; the first control device 7 is located at the lower left side of the water receiving tank 4; the heat conducting sheet 705 is located at the bottom of the first control device 7; the mercury tube 704 is located above the heat conducting sheet 705; the movable plug 703 is slidably connected to the mercury tube 704; the first return spring 70 The upper end of the first control device 7 is fixed to the inner wall of the first control device 7; the lower end of the first return spring 701 is fixedly connected to the sliding block 707; the two ends of the fixing block 702 are fixedly connected to the inner wall of the first control device 7; the outer shell of the first control device 7 is provided with a plurality of bolt holes 706; the bolt holes 706 correspond to the temperature scale; the fixing block 702 can be fixed to the inner wall of the first control device 7 by external bolts; the sliding block 707 is slidably connected to the inner wall of the first control device 7; the first control device 7 is electrically connected to the heating element 10.

[0038] Specifically, the multi-mode integrated circuit chip performance evaluation device and method further include: a timer 8: the timer 8 includes a pointer 801 and the second control device 802; a gear is provided inside the pointer 801, and the pointer 801 rotates counterclockwise.

[0039] Specifically, the second control device 802 includes: a supporting plate 8021, a second pressing block 8022, a sensing block 8023 and a second return spring 8024; the supporting plate 8021 is fixedly connected to the inner wall of the timer 8; the second pressing block 8022 is an oblique triangle; the sensing block 8023 is arranged above the inner wall of the supporting plate 8021; the second return spring 8024 is fixedly connected to the second pressing block 8022 and the lower part of the inner wall of the supporting plate 8021.

[0040] Specifically, the water cut-off device 11 includes: a second spring 1101, a sensing plate and a suspension ball 1102; the second spring 1101 is fixedly connected to the hot water pipe 5 and the suspension ball 1102; the sensing plate is located on the lower side of the inner wall of the hot water pipe 5; the diameter of the suspension ball 1102 is greater than the width of the water outlet device 6.

[0041] Specifically, the bottom surface of the water receiving box 2 is provided with a first pressing block 201, a limiting spring 202, a connecting block 203 and a connecting plate 204; the bottom of the water receiving box 2 is provided with a groove; the groove matches the shape of the connecting plate 204; the first pressing block 201 is embedded in the connecting plate 204; the first pressing block 201 is electrically connected to the wire 3; the connecting block 203 is electrically connected to the wire 3; the limiting spring 202 is fixedly connected to the inner wall of the connecting plate 204 and the first pressing block 201; the connecting block 203 is fixedly connected to the bottom of the inner wall of the connecting plate 204.

[0042] Working principle:

[0043] When measuring the thermal stability of the chip 1 at a certain temperature, a multi-stage time step increase method is used; the inconvenience of controlling the temperature is to adjust the fixed block 702 and the sliding block 707 to the bolt hole 706 corresponding to the temperature scale line; and the fixed block 702 is fixed by an external bolt; the duration of the device is controlled by a timer 8; the pointer 801 is rotated to the time for heating the water to the required temperature; then the external connector 12 is inserted into the water receiving box 2; the external connector 12 presses down the first pressing block 201; at this time, the first pressing block 201 presses down the limit spring 202 and contacts the connecting block 203; the electromagnet 601 is energized so that the piston 603 is adsorbed upward; the water outlet device 6 is opened, and the water in the water receiving box 4 flows into the hot water pipe 5; when the water in the hot water pipe 5 is full, at this time, the suspension ball 1102 blocks the water outlet device 6 under the action of buoyancy; the first control device 7 is energized, and the heating element 10 starts to heat the water in the hot water pipe 5 to the required temperature; at the same time, the water pump 9 is turned on , the hot water is continuously transferred to the water receiving box 2; when the required temperature is reached, the movable plug 703 pushes the sliding block 707; the first control device 7 is disconnected, and the heating element 10 stops working; when the temperature drops slightly, the mercury tube 704 senses the temperature through the heat conducting sheet 705 and contracts, and the first return spring 701 presses the sliding block 707 down to connect to the fixed block 702; the first control device 7 restarts; the cycle is repeated to keep the water temperature in the hot water pipe 5 at the required temperature; the chip 1 is inserted into the water receiving box 2; reset the timer 8; connect the input terminal 101 and the output terminal 102 of the chip 1 to the display device and the power supply; observe whether the display device is disconnected within a certain period of time; when the pointer 801 starts to enter the countdown 0, the pointer 801 presses down the second pressing block 8022 and the second reset spring 8024; at this time, the second pressing block 8022 is disconnected from the sensing block 8023; this period of evaluation time meets the standard; using this method, the time is increased step by step; the chip 1 of the same standard is evaluated.

[0044] When measuring the temperature that the chip 1 can maintain within a certain period of time, each period of time measured by the timer 8 is kept constant, the fixed block 702 and the sliding block 707 are adjusted to the bolt hole 706 with the required temperature corresponding scale, and the chip 1 of the same specification is measured by increasing the temperature in steps to observe whether the external display device is short-circuited.

Claims

1. A multi-mode integrated circuit chip performance evaluation device, characterized in that: include: water receiving tank; Hot water pipes; Water receiving box; Water outlet device; Water cut-off device; a first control device; Water pump; Heating element; External connectors; chip; Timer: The water receiving box is located on the top of the evaluation device; the hot water pipe connects the water receiving box and the water receiving box; the inner size of the water receiving box matches the size of the chip; The water outlet device is located at the connection point between the water receiving tank and the hot water pipe; the chip surface is provided with an input end and an output end; the water outlet device includes: an electromagnet, a fixed rod, a piston, a clamping plate, a first spring and a water outlet plate; the water outlet plate is provided with evenly arranged water leakage holes; the water outlet device is located in the middle position below the water receiving tank; the water outlet device connects the water receiving tank and the hot water pipe; the electromagnet is located at the top of the water outlet device; the fixed rod is provided with a pair; a pair of the fixed rods are fixedly connected to the electromagnet; the electromagnet is electrically connected to the wire; the fixed rod is fixedly connected to the bottom surface of the water receiving tank; the first control device includes: a first reset spring, a fixed block, a sliding block, a movable plug, a mercury tube and a heat conducting plate; the first control device is fixedly connected to the water receiving tank and the hot water pipe; the first control device is located on the left side below the water receiving tank; the heat conducting plate is located at the bottom of the first control device; the mercury tube is located above the heat conducting plate; the movable plug is slidably connected to the mercury tube; the upper end of the first reset spring is fixed to the inner wall of the first control device; the The lower end of the first return spring is fixedly connected to the sliding block; the two ends of the fixed block are fixedly connected to the inner wall of the first control device; the housing of the first control device is provided with a plurality of bolt holes; the bolt holes correspond to the temperature scale; the fixed block can be fixed to the inner wall of the first control device by external bolts; the sliding block is slidably connected to the inner wall of the first control device; the first control device is electrically connected to the heating element; the timer includes a pointer and a second control device; a gear is provided inside the pointer, and the pointer rotates counterclockwise; the second control device includes: a supporting plate, a second pressing block, a sensing block and a second return spring; the supporting plate is fixedly connected to the inner wall of the timer; the second pressing block is an oblique triangle; the sensing block is arranged above the inner wall of the supporting plate; the second return spring is fixedly connected to the second pressing block and below the inner wall of the supporting plate; the water cut-off device includes: a second spring, a sensing plate and a suspension ball; the second spring is fixedly connected to the hot water pipe and the suspension ball; the sensing plate is located at the lower side of the inner wall of the hot water pipe; the diameter of the suspension ball is greater than the width of the water outlet device.

2. The multi-mode integrated circuit chip performance evaluation device according to claim 1, characterized in that: A water inlet is also provided on the top of the water receiving tank.

3. The multi-mode integrated circuit chip performance evaluation device according to claim 1, characterized in that: The bottom surface of the water receiving box is provided with a first pressing block, a limiting spring, a connecting block and a connecting plate; the bottom of the water receiving box is provided with a groove; the groove matches the shape of the connecting plate; the first pressing block is embedded in the connecting plate; the first pressing block is electrically connected to the wire; the connecting block is electrically connected to the wire; the limiting spring is fixedly connected to the inner wall of the connecting plate and the first pressing block; the connecting block is fixedly connected to the bottom of the inner wall of the connecting plate.