Drive motor controller uniform temperature liquid cooling plate

Abstract

A liquid cooling plate for a drive motor controller includes a controller housing. A heat dissipation substrate is provided inside the controller housing, and the heat dissipation substrate and the controller housing are sealed to form a liquid cooling plate channel. An IGBT module is disposed on the upper surface of the heat dissipation substrate, and a heat sink corresponding to the IGBT module is disposed on the lower surface of the heat dissipation substrate. The heat sink is located within the liquid cooling plate channel. The liquid cooling plate channel includes two channel regions: a first channel region and a second channel region, extending from the channel inlet to the channel outlet. Each channel region corresponds to a half-bridge of the IGBT module. The parameters of the liquid cooling plate channel satisfy the following relationship:

Description

Technical Field

[0001] This invention relates to the field of drive motor controller technology, and particularly to a heat exchanger liquid cooling plate for drive motor controllers. Background Technology

[0002] A liquid cooling plate in a drive motor controller indirectly transfers heat from heat-generating components to a cooling liquid enclosed in a circulation loop, and the cooling liquid then carries away the heat, thus dissipating the heat generated in the drive motor controller. Compared to other heat dissipation technologies, such as air cooling and direct circulation cooling, liquid cooling plates offer more efficient heat transfer and higher heat dissipation efficiency. Furthermore, liquid cooling plates can significantly reduce the size and weight of the motor, while improving its power density and acceleration performance.

[0003] Currently, liquid cooling plates for drive motor controllers, widely used in the new energy vehicle industry, involve coolant entering through the inlet and exiting through the flow channel. During this flow, the coolant continuously absorbs heat, causing its temperature to rise. This results in lower coolant temperatures near the inlet, leading to better heat dissipation for electronic components, and higher temperatures near the outlet, resulting in poorer heat dissipation and potentially causing overheating, failure, or even burnout of electronic devices. Furthermore, uneven temperature distribution and large temperature differences can lead to significant cyclic thermal stress on electronic components during operation, severely impacting their safe and stable operation. The design of liquid cooling plates for drive motor controllers requires consideration of the flow channel layout, length, shape, and liquid flow rate to maximize heat dissipation efficiency. However, the flow channel structure of existing drive motor controller liquid cooling plates is often designed based on experience, heavily reliant on the designer's expertise. This design process involves repeated testing and model modifications, resulting in long testing cycles, low design efficiency, and increased product development costs and timelines. The existing liquid cooling plate flow channel structure design of the drive motor controller is unreasonable, which easily leads to uneven cooling of the liquid cooling plate, excessive local temperature rise of electronic components, and failure or burnout of power devices. At the same time, the uneven temperature distribution of the heat dissipation substrate will generate large periodic thermal stress in electronic components during operation, which will seriously affect the normal operation of electronic components. Summary of the Invention

[0004] The purpose of this invention is to address the shortcomings of existing technologies by providing a uniform temperature liquid cooling plate for drive motor controllers. This solves the problems of heavy reliance on the experience of designers during the design process of liquid cooling plates for drive motor controllers, the need for repeated experiments and model modifications, long testing cycles, low design efficiency, and increased product development costs and cycles. Furthermore, the uneven temperature distribution and large temperature difference of the liquid cooling plate cause significant periodic thermal stress to electronic components during operation, which can seriously affect the safe and stable operation of electronic components.

[0005] The objective of this invention is achieved as follows:

[0006] A heat-dissipating liquid cooling plate for a drive motor controller includes a controller housing. A heat dissipation substrate is provided inside the controller housing. The heat dissipation substrate and the controller housing are sealed to form a liquid cooling plate channel. An IGBT module is disposed on the upper end face of the heat dissipation substrate, and a heat sink corresponding to the IGBT module is disposed on the lower end face of the heat dissipation substrate. The heat sink is located inside the liquid cooling plate channel. The liquid cooling plate channel includes two channel regions, namely a first channel region and a second channel region from the channel inlet to the channel outlet. Each channel region corresponds to each IGBT half-bridge of the IGBT module.

[0007] Wherein, the length of the IGBT half-bridge is L, the width of the IGBT half-bridge is B, and the height of the heat sink is h; the cross-sectional perimeter of the heat sink in the first flow channel region is P1, the cross-sectional area of ​​the heat sink in the first flow channel region is A1, the column spacing of the heat sink in the first flow channel region is s1, the row spacing of the heat sink in the first flow channel region is c1, the flow spacing between the heat sinks in the first flow channel region is e1, the cross-sectional perimeter of the heat sink in the second flow channel region is P2, the cross-sectional area of ​​the heat sink in the second flow channel region is A2, the column spacing of the heat sink in the second flow channel region is s2, the row spacing of the heat sink in the second flow channel region is c2, and the flow spacing between the heat sinks in the second flow channel region is e2, the relationship between them is:

[0008] .

[0009] Furthermore, the liquid cooling plate flow channel includes three flow channel regions, which correspond to the three IGBT half-bridges of the IGBT module, respectively. From the flow channel inlet to the flow channel outlet, they are the first flow channel region, the second flow channel region, and the third flow channel region.

[0010] Wherein, the length of the IGBT half-bridge is L, the width of the IGBT half-bridge is B, and the height of the heat sink is h; the cross-sectional perimeter of the heat sink in the first flow channel region is P1, the cross-sectional area of ​​the heat sink in the first flow channel region is A1, the column spacing of the heat sink in the first flow channel region is s1, the row spacing of the heat sink in the first flow channel region is c1, and the flow spacing between the heat sinks in the first flow channel region is e1; the cross-sectional perimeter of the heat sink in the second flow channel region is P2, the cross-sectional area of ​​the heat sink in the second flow channel region is A2, the column spacing of the heat sink in the second flow channel region is s2, the row spacing of the heat sink in the second flow channel region is c2, and the flow spacing between the heat sinks in the second flow channel region is e2; the cross-sectional perimeter of the heat sink in the third flow channel region is P3, the cross-sectional area of ​​the heat sink in the third flow channel region is A3, the column spacing of the heat sink in the third flow channel region is s3, and the row spacing of the heat sink in the third flow channel region is c3 and the flow spacing between the heat sinks in the third flow channel region is e3 satisfying the following relationship:

[0011] ; and / or,

[0012] .

[0013] Furthermore, the length of the liquid cooling plate channel is l, (B*n-10)mm≤l≤(B*n+10)mm; and / or, the width of the liquid cooling plate channel is b, (L-5)mm≤b≤(L+5)mm;

[0014] Where B is the width of the IGBT half-bridge, L is the length of the IGBT half-bridge, and n is the number of IGBT half-bridges.

[0015] Furthermore, the heat sink is arranged in a staggered pattern, and the cross-sectional shape of the heat sink is either regular or irregular.

[0016] Furthermore, the heat sink has an elliptical cross-section, with the major axis of the ellipse along the direction of coolant flow and the minor axis perpendicular to the direction of coolant flow.

[0017] Furthermore, the height h of the heat sink is 3mm ≤ h ≤ 10mm.

[0018] Furthermore, the minimum flow distance between two adjacent heat sinks in the liquid cooling plate channel is f, where f ≥ 1 mm.

[0019] Furthermore, the heat sink includes three regions, which correspond to the three IGBT half-bridges of the IGBT module respectively. From the inlet to the outlet of the liquid cooling plate channel, the heat sinks are respectively the first channel region corresponding to the first IGBT half-bridge of the IGBT module, the second channel region corresponding to the second IGBT half-bridge of the IGBT module, and the third channel region corresponding to the third IGBT half-bridge of the IGBT module.

[0020] The perimeter of the heat sink in the first flow channel region is P1, 3mm≤P1≤32mm; the cross-sectional area of ​​the heat sink in the first flow channel region is A1, 1mm². 2 ≤A1≤25mm 2 The heat sinks in the first flow channel region are spaced apart along the first preset direction. The column spacing between two adjacent heat sinks is s1, and the flow spacing between two adjacent heat sinks is e1, where 1mm≤e1≤5mm and e1<s1. The heat sinks in the first flow channel region are spaced apart along the second preset direction. The row spacing between two adjacent rows of heat sinks is c1, where c1<4A1 / P1.

[0021] The perimeter of the heat sink in the second flow channel region is P2, 3mm ≤ P2 ≤ 32mm; the cross-sectional area of ​​the heat sink in the second flow channel region is A2, 1mm². 2 ≤A2≤25mm 2 The heat sinks in the second flow channel region are spaced apart along the first preset direction. The column spacing between two adjacent heat sinks is s2, and the flow spacing between two adjacent heat sinks is e2, where 1mm≤e2≤5mm and e2<s2. The heat sinks in the second flow channel region are spaced apart along the second preset direction. The row spacing between two adjacent rows of heat sinks is c2, where c2<4A2 / P2.

[0022] The perimeter of the heat sink in the third flow channel region is P3, 3mm≤P3≤32mm; the cross-sectional area of ​​the heat sink in the third flow channel region is A3, 1mm². 2 ≤A3≤25mm 2 The heat sinks in the third flow channel region are spaced apart along the first preset direction, with a column spacing of s3 between two adjacent heat sinks and a flow spacing of e3 between two adjacent heat sinks, where 1mm≤e3≤5mm and e3<s3; the heat sinks in the third flow channel region are spaced apart along the second preset direction, with a row spacing of c3 between two adjacent rows of heat sinks, where c3<4A3 / P3.

[0023] Further, the heat sinks in the first flow channel region are spaced apart along a first preset direction, with each row containing [L / s1] heat sinks; the heat sinks in the first flow channel region are spaced apart along a second preset direction, with each row containing [B / c1] heat sinks; the heat sinks in the second flow channel region are spaced apart along the first preset direction, with each row containing [L / s2] heat sinks; the heat sinks in the second flow channel region are spaced apart along the second preset direction, with each row containing [B / c2] heat sinks; the heat sinks in the third flow channel region are spaced apart along the first preset direction, with each row containing [L / s3] heat sinks; the heat sinks in the third flow channel region are spaced apart along the second preset direction, with each row containing [B / c3] heat sinks; where the symbols... This represents taking the integer part.

[0024] Furthermore, the controller housing has a groove on the inner side for forming a liquid cooling plate channel. The controller housing and the heat dissipation substrate are sealed by a sealing ring, so that the groove and the heat dissipation substrate cooperate to form a liquid cooling plate channel. The channel inlet and channel outlet of the liquid cooling plate channel are located on both sides of the bottom of the groove.

[0025] Compared with existing technologies, the beneficial effects of the vapor chamber liquid cooling plate for drive motor controllers of the present invention are as follows: Through the aforementioned calculation formulas regarding the structural and arrangement parameters of the heat sinks within the liquid cooling plate flow channel, the relationship between the specific dimensions and arrangement positions of the heat sinks within the flow channel can be easily obtained. These calculation formulas are derived based on the external forced convection heat transfer law, thus enabling the selection and calculation of the specific dimensions and arrangement positions of the heat sinks within the flow channel while ensuring temperature uniformity and heat dissipation performance. This simplifies the design process of the drive motor controller liquid cooling plate flow channel structure and significantly reduces the design and modification cycles. Therefore, the technical solution provided by this invention can solve the technical problems of long design and modification cycles in the existing design methods for drive motor controller liquid cooling plate flow channel structures. Attached Figure Description

[0026] The accompanying drawings, which form part of this application, are used to provide a further understanding of the invention. The illustrative embodiments of the invention and their descriptions are used to explain the invention and do not constitute an improper limitation of the invention.

[0027] Figure 1 This is a schematic diagram of the heat exchanger liquid cooling plate structure for the drive motor controller;

[0028] Figure 2 This is a schematic diagram of the outer structure of the controller housing;

[0029] Figure 3 This is a cross-sectional view of the homogenizing liquid cooling plate for the drive motor controller.

[0030] Figure 4 Side view of the homogenizing liquid cooling plate for the drive motor controller;

[0031] Figure 5 This is a schematic diagram of the IGBT module structure on the heat sink substrate.

[0032] Figure 6 This is a schematic diagram of the heat sink structure on the heat sink substrate.

[0033] Figure 7 This is a schematic diagram of various shapes and structures of a heat sink.

[0034] Reference numerals: IGBT module 1, first IGBT half-bridge 11, second IGBT half-bridge 12, third IGBT half-bridge 13, controller housing 2, heat sink 3, liquid cooling plate channel 4, first channel region 41, second channel region 42, second channel region 43, channel inlet 44, channel outlet 45, heat sink 5, sealing ring 6. Detailed Implementation

[0035] It should be noted that, unless otherwise specified, the embodiments and features described in this application can be combined with each other. The present invention will now be described in detail with reference to the accompanying drawings and embodiments.

[0036] refer to Figures 1 to 7 A liquid cooling plate for a drive motor controller includes a controller housing 2. A heat dissipation substrate 3 is provided inside the controller housing 2. The heat dissipation substrate 3 and the controller housing 2 are sealed together to form a liquid cooling plate channel 4. A groove for forming the liquid cooling plate channel 4 is provided inside the controller housing 2. The controller housing 2 and the heat dissipation substrate 3 are sealed by a sealing ring 6, allowing the groove and the heat dissipation substrate 3 to cooperate in forming the liquid cooling plate channel 4. The channel inlet 44 and channel outlet 45 of the liquid cooling plate channel 4 are located on opposite sides of the bottom of the groove. A sealing groove is provided on the controller housing 2 near the groove, which cooperates with the sealing ring 6. The sealing ring 6 is located within the sealing groove to seal the gap between the controller housing 2 and the heat dissipation substrate 3. An IGBT (Insulated Gate Bipolar Transistor) module 1 is provided on the upper surface of the heat dissipation substrate 3, and a heat sink 5 corresponding to the IGBT module 1 is provided on the lower surface of the heat dissipation substrate 3. The heat sink 5 is located within the liquid cooling plate channel 4. A small gap may be left between the heat sink 5 and the bottom of the groove in the controller housing 2. The liquid cooling plate flow channel 4 includes two flow channel regions. The flow channel inlet 44 and the flow channel outlet 45 of the liquid cooling plate flow channel 4 are respectively the first flow channel region 41 and the second flow channel region 42. Each flow channel region corresponds to each IGBT half-bridge of the IGBT module 1.

[0037] Wherein, the length of the IGBT half-bridge is L, the width of the IGBT half-bridge is B, and the height of the heat sink is h; the cross-sectional perimeter of the heat sink in the first flow channel region is P1, the cross-sectional area of ​​the heat sink in the first flow channel region is A1, the column spacing of the heat sink in the first flow channel region is s1, the row spacing of the heat sink in the first flow channel region is c1, the flow spacing between the heat sinks in the first flow channel region is e1, the cross-sectional perimeter of the heat sink in the second flow channel region is P2, the cross-sectional area of ​​the heat sink in the second flow channel region is A2, the column spacing of the heat sink in the second flow channel region is s2, the row spacing of the heat sink in the second flow channel region is c2, and the flow spacing between the heat sinks in the second flow channel region is e2, the relationship between them is:

[0038] .

[0039] Preferably, the liquid cooling plate flow channel 4 includes three flow channel regions, which correspond to the three IGBT half-bridges of the IGBT module 1 respectively. From the flow channel inlet 44 to the flow channel outlet 45 of the liquid cooling plate flow channel 4, they are respectively the first flow channel region 41, the second flow channel region 42, and the third flow channel region 43.

[0040] Wherein, the length of the IGBT half-bridge is L, the width of the IGBT half-bridge is B, and the height of the heat sink is h; the cross-sectional perimeter of the heat sink in the first flow channel region is P1, the cross-sectional area of ​​the heat sink in the first flow channel region is A1, the column spacing of the heat sink in the first flow channel region is s1, the row spacing of the heat sink in the first flow channel region is c1, and the flow spacing between the heat sinks in the first flow channel region is e1; the cross-sectional perimeter of the heat sink in the second flow channel region is P2, the cross-sectional area of ​​the heat sink in the second flow channel region is A2, the column spacing of the heat sink in the second flow channel region is s2, the row spacing of the heat sink in the second flow channel region is c2, and the flow spacing between the heat sinks in the second flow channel region is e2; the cross-sectional perimeter of the heat sink in the third flow channel region is P3, the cross-sectional area of ​​the heat sink in the third flow channel region is A3, the column spacing of the heat sink in the third flow channel region is s3, and the row spacing of the heat sink in the third flow channel region is c3 and the flow spacing between the heat sinks in the third flow channel region is e3 satisfying the following relationship:

[0041] ; and / or,

[0042] .

[0043] It should be noted that the liquid cooling plate channel 4 in this embodiment is a coolant channel. The main function of the heat dissipation liquid cooling plate of the drive motor controller is to dissipate heat for the IGBT module 1. By the coolant flowing through the liquid cooling plate channel 4, the heat loss of the IGBT module 1 is carried away, reducing the temperature rise of the IGBT module 1, so that the IGBT module operates within a safe temperature range, and ensuring the reliability of the controller's stable operation.

[0044] Using the vapor chamber liquid cooling plate for the drive motor controller provided in this embodiment, the relationship between multiple specific parameter dimensions of the liquid cooling plate flow channel structure can be obtained by applying the above-mentioned relationship and the forced convection heat transfer law of the fluid sweeping across the tube bundle during the heat dissipation process. The above-mentioned relationship is based on the influence of the cross-sectional perimeter of the heat sink 5, the cross-sectional area of ​​the heat sink 5, the row spacing between the heat sinks 5, the row spacing between the heat sinks 5, and the flow spacing between the heat sinks 5 on the heat dissipation performance of the vapor chamber liquid cooling plate for the drive motor controller and the temperature distribution of the heat dissipation substrate 3. This improves the uniformity of the temperature distribution of the heat dissipation substrate 3, reduces the risk of excessive local temperature rise of the IGBT module 1, reduces the periodic thermal stress of the IGBT module, and improves the reliability of the controller's stable operation.

[0045] By employing the vapor chamber liquid cooling plate for the drive motor controller provided in this embodiment, and through the aforementioned calculation formulas regarding the parameters of the liquid cooling plate flow channel structure, the relationship between the specific parameter dimensions and arrangement positions of the heat sink in the liquid cooling plate flow channel structure can be easily obtained. This simplifies the design process of the liquid cooling plate flow channel structure for the drive motor controller, significantly reducing the design cycle and molding cycle. Therefore, the vapor chamber liquid cooling plate for the drive motor controller provided in this embodiment can solve the technical problems of long design cycles and long molding cycles in the existing design methods for liquid cooling plates of drive motor controllers.

[0046] Specifically, the length of the liquid cooling plate channel 4 is l, (B*n-10)mm≤l≤(B*n+10)mm; and / or, the width of the liquid cooling plate channel 4 is b, (L-5)mm≤b≤(L+5)mm;

[0047] Where B is the width of the IGBT half-bridge, L is the length of the IGBT half-bridge, and n is the number of IGBT half-bridges. In this embodiment, the number of IGBT half-bridges, n=3, is a common number for IGBT half-bridges in the IGBT module of the drive motor controller in the electric vehicle industry. The length and width of the liquid cooling plate channel 4 satisfy the above two relationships, which can prevent insufficient heat dissipation capacity or poor temperature uniformity of the heat dissipation substrate 3 due to the length and width of the liquid cooling plate channel 4 being too small. It can also prevent the structural size of the uniform temperature liquid cooling plate of the drive motor controller from being too large, thus increasing material costs and volume.

[0048] Specifically, the heat sink 5 is arranged in a staggered pattern, which can increase the turbulence intensity of the coolant within the liquid cooling plate channel 4, thereby enhancing the forced convection heat transfer performance, improving the heat dissipation capacity of the drive motor controller liquid cooling plate, and reducing the temperature rise of the IGBT module. The cross-sectional shape of the heat sink 5 can be regular or irregular. The shape and material of the heat sink 5 itself are not limited, as long as it can effectively transfer heat to the heat dissipation substrate. The cross-sectional shape of the heat sink 32 is also not limited; it can be regular or irregular. When a regular shape is used, the cross-section of the heat sink 5 can be elliptical, circular, racetrack-shaped, date-shaped, or hexagonal. The structure of the heat sink 5 itself is not limited, such as... Figure 7 As shown, the heat sink 5 can be configured with a variety of different shapes and structures.

[0049] In this embodiment, the heat sink 5 has an elliptical cross-section, with its major axis along the coolant flow direction and its minor axis perpendicular to the coolant flow direction. According to fluid mechanics principles, the angle between the arc side of the elliptical structure and the coolant flow direction significantly affects the heat transfer of the heat sink. When the smaller arc of the ellipse faces the coolant directly, the coolant flows smoothly across all surfaces of the heat sink, preventing large eddies from forming behind it. However, when the larger arc of the ellipse faces the coolant directly, the coolant is significantly obstructed, resulting in larger eddies behind the heat sink. Therefore, this configuration significantly increases the effective contact area and effective convective heat transfer coefficient between the heat sink 5 and the coolant, thereby effectively improving the forced convection heat transfer performance of the heat sink, enhancing the heat dissipation effect of the liquid cooling plate, and reducing the temperature rise of the IGBT module.

[0050] Specifically, the height h of the heat sink 5 is 3mm ≤ h ≤ 10mm, thereby achieving a better heat dissipation effect.

[0051] Specifically, the minimum flow distance between two adjacent heat sinks 5 in the liquid cooling plate flow channel 4 is f, where f ≥ 1 mm, so that the flow resistance between the heat sinks is small and the coolant flow velocity is high, thereby achieving a better forced convection heat transfer effect.

[0052] Specifically, the heat sink 5 includes three regions, which correspond to the three IGBT half-bridges of the IGBT module 1 respectively. From the inlet 44 to the outlet 45 of the liquid cooling plate channel 4, the heat sink is the first channel region corresponding to the first IGBT half-bridge 11 of the IGBT module 1, the second channel region corresponding to the second IGBT half-bridge 12 of the IGBT module 1, and the third channel region corresponding to the third IGBT half-bridge 13 of the IGBT module 1.

[0053] From the inlet 44 to the outlet 45 of the liquid cooling plate channel 4, the coolant continuously absorbs the heat loss from the IGBT module 1 during the flow process, and the temperature of the coolant continuously rises, while the heat dissipation capacity of the coolant gradually weakens. The liquid cooling plate channel 4 is divided into a first channel region 41, a second channel region 42, and a third channel region 43. In this way, according to the temperature change law of the coolant, different heat sink structure parameters and arrangement positions are designed in different channel regions, which can ensure the uniformity of heat dissipation of the liquid cooling plate and prevent the power device from failing or being damaged due to excessive temperature rise of the third IGBT half-bridge 13.

[0054] The perimeter of the heat sink in the first flow channel region is P1, 3mm≤P1≤32mm; the cross-sectional area of ​​the heat sink in the first flow channel region is A1, 1mm². 2 ≤A1≤25mm 2 The heat sinks in the first flow channel region are spaced apart along the first preset direction. The column spacing between two adjacent heat sinks is s1, and the flow spacing between two adjacent heat sinks is e1, where 1mm≤e1≤5mm and e1<s1. The heat sinks in the first flow channel region are spaced apart along the second preset direction. The row spacing between two adjacent rows of heat sinks is c1, where c1<4A1 / P1.

[0055] The perimeter of the heat sink in the second flow channel region is P2, 3mm ≤ P2 ≤ 32mm; the cross-sectional area of ​​the heat sink in the second flow channel region is A2, 1mm². 2 ≤A2≤25mm 2 The heat sinks in the second flow channel region are spaced apart along the first preset direction. The column spacing between two adjacent heat sinks is s2, and the flow spacing between two adjacent heat sinks is e2, where 1mm≤e2≤5mm and e2<s2. The heat sinks in the second flow channel region are spaced apart along the second preset direction. The row spacing between two adjacent rows of heat sinks is c2, where c2<4A2 / P2.

[0056] The perimeter of the heat sink in the third flow channel region is P3, 3mm≤P3≤32mm; the cross-sectional area of ​​the heat sink in the third flow channel region is A3, 1mm². 2 ≤A3≤25mm 2 The heat sinks in the third flow channel region are spaced apart along the first preset direction, with a column spacing of s3 between two adjacent heat sinks and a flow spacing of e3 between two adjacent heat sinks, where 1mm≤e3≤5mm and e3<s3; the heat sinks in the third flow channel region are spaced apart along the second preset direction, with a row spacing of c3 between two adjacent rows of heat sinks, where c3<4A3 / P3.

[0057] Based on the feasibility of the manufacturing process, when the perimeter of the heat sink 5 is less than 3mm or the cross-sectional area is less than 1mm², 2When the heat sink's cross-sectional perimeter is greater than 32mm or its cross-sectional area is greater than 25mm², the processing difficulty of the heat sink 5 will increase significantly. 2 When the effective convective heat transfer coefficient of the heat sink 5 decreases significantly, the convective heat transfer performance of the liquid cooling plate will be significantly reduced. The flow spacing between two adjacent heat sinks 5 in the first flow channel region 41, the flow spacing between two adjacent heat sinks 5 in the second flow channel region 42, and the flow spacing between two adjacent heat sinks 5 in the third flow channel region 43 respectively satisfy the above three relationships, so that the liquid cooling plate flow channel can meet the flow resistance loss requirements and ensure the forced convective heat transfer performance of the liquid cooling plate. When the flow channel spacing between two adjacent heat sinks is less than 1 mm, the flow channel is too narrow and the flow channel cross-sectional area is too small, resulting in excessive flow velocity and significantly increased flow resistance loss in the liquid cooling plate flow channel. When the flow channel spacing between two adjacent heat sinks is greater than 5 mm, the flow channel cross-sectional area is too large and the flow velocity is too small, resulting in significantly decreased forced convective heat transfer performance in the liquid cooling plate flow channel. In this embodiment, the first preset direction is the width direction of the liquid cooling plate flow channel 4, and the second preset direction is the length direction of the liquid cooling plate flow channel 4.

[0058] Specifically, the heat sinks in the first flow channel region are spaced apart along a first preset direction, with each row containing [L / s1] heat sinks; the heat sinks in the first flow channel region are spaced apart along a second preset direction, with each row containing [B / c1] heat sinks; the heat sinks in the second flow channel region are spaced apart along the first preset direction, with each row containing [L / s2] heat sinks; the heat sinks in the second flow channel region are spaced apart along the second preset direction, with each row containing [B / c2] heat sinks; the heat sinks in the third flow channel region are spaced apart along the first preset direction, with each row containing [L / s3] heat sinks; the heat sinks in the third flow channel region are spaced apart along the second preset direction, with each row containing [B / c3] heat sinks; where the symbols... This represents taking the integer part.

[0059] The heat dissipation substrate 3 is made of materials such as copper or silicon carbide aluminum; the heat sink 5 is made of metal materials such as aluminum, aluminum alloy, or copper; and the controller housing 2 is made of metal materials such as aluminum or aluminum alloy. Preferably, the heat dissipation substrate 3, the heat sink 5, and the controller housing 2 are all made of metal materials. This facilitates improved heat conduction, thereby enhancing the heat transfer capacity of the IGBT module 1 to the heat dissipation substrate 3 and the heat sink 5, improving the heat dissipation performance of the heat sink liquid cooling plate of the drive motor controller, reducing the temperature rise of the IGBT module 1, and improving the temperature rise reliability of the controller. The heat dissipation substrate 3 and the controller housing 2 are connected by conventional methods such as bolts and welding, and the heat dissipation substrate 3 and the heat sink 5 are connected by conventional methods such as welding and integral molding.

[0060] It should be noted that in all the above embodiments, the IGBT module is the portion above the heat dissipation substrate 3 of the vapor chamber cooling plate of the drive motor controller, and consists of three IGBT half-bridges. The IGBTs are the main heat source. In this embodiment, the difference in the maximum temperature rise between adjacent IGBT half-bridges is less than or equal to 2°C.

[0061] The heat generation Φ of a single IGBT half-bridge, and the heat generation q of an IGBT module consisting of n0 IGBT half-bridges. m Let be the mass flow rate of the coolant, and c be the specific heat capacity of the coolant. The coolant absorbs the heat lost by the IGBT as it flows through the liquid cooling plate channel, and the coolant temperature gradually increases. The temperature difference Δt between the coolant inlet and outlet of the channel is:

[0062] ;

[0063] The contact area between the liquid-cooled plate channel wall and the coolant is A, the convective heat transfer coefficient between the liquid-cooled plate channel wall and the coolant is h', and the average temperature of the liquid-cooled plate channel wall is t. 板 The average temperature of the coolant is t 液 Forced convection heat transfer Φ between the liquid cooling plate channel wall and the coolant 对流 :

[0064] ;

[0065] The Nusselt number (Nu) for convective heat transfer of a single-phase fluid within the liquid-cooled plate flow channel is affected by the Reynolds number (Re) and Prandtl number (Pr) of the coolant:

[0066] Nu = f(Re, Pr);

[0067] The thermal conductivity of the coolant is λ, the diameter of the heat sink is d, and the convective heat transfer coefficient between the liquid cooling plate channel wall and the coolant is h'.

[0068] h'=Nu λ / d;

[0069] During the cooling process of a liquid-cooled plate, the heat flow in the heat transfer process satisfies the following relationship:

[0070] Φ=Φ 对流 .

[0071] The above five formulas are all conventional theoretical formulas, and those skilled in the art can understand their specific meanings and calculation methods.

[0072] Based on the heat transfer characteristics during the cooling process of a liquid cooling plate, through theoretical derivation, numerical simulation, and experimental verification, the influence of the cross-sectional perimeter, cross-sectional area, row spacing, flow spacing, and row spacing of the heat sink on the temperature distribution of the heat dissipation substrate was discovered. A flow channel structure design method for the uniform temperature liquid cooling plate of the drive motor controller was obtained, enabling rapid design of the flow channel structure of the liquid cooling plate for the drive motor controller. This improves the design efficiency of the liquid cooling plate for the controller, reduces the number of tests and mold modifications, lowers the development difficulty and cost of the liquid cooling plate for the drive motor controller, enhances the uniform heat dissipation performance of the liquid cooling plate, prevents excessive local temperature rise of the IGBT module, reduces the thermal stress of the IGBT module, and improves the safety and reliability of the long-term stable operation of the drive motor controller.

[0073] The vapor chamber liquid cooling plate for drive motor controllers of the present invention achieves the following technical effects: it provides a design method for the flow channel structure of the vapor chamber liquid cooling plate for drive motor controllers, improves the design efficiency of the flow channel structure of the vapor chamber liquid cooling plate for drive motor controllers, reduces the number of tests and mold modifications, shortens the development cycle, reduces development and testing costs, reduces the risk of excessive local temperature rise of IGBT modules, improves the basic temperature uniformity of heat dissipation of the liquid cooling plate for drive motor controllers, reduces the periodic thermal stress of IGBT modules during operation, meets the safety requirements for temperature rise of power devices in drive motor controllers, and improves the long-term stable operation reliability of drive motor controllers.

[0074] It should be noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the exemplary embodiments according to this application. As used herein, the singular form is intended to include the plural form as well, unless the context clearly indicates otherwise. Furthermore, it should be understood that when the terms "comprising" and / or "including" are used in this specification, they indicate the presence of features, steps, operations, devices, components, and / or combinations thereof.

[0075] Unless otherwise specifically stated, the relative positions, numerical expressions, and values ​​of the components and steps described in these embodiments do not limit the scope of this application. It should also be understood that, for ease of description, the dimensions of the various parts shown in the drawings are not drawn to actual scale. Techniques, methods, and devices known to those skilled in the art may not be discussed in detail, but where appropriate, such techniques, methods, and devices should be considered part of the specification. In all examples shown and discussed herein, any specific values ​​should be interpreted as merely exemplary and not as limitations. Therefore, other examples of exemplary embodiments may have different values. It should be noted that similar reference numerals and letters in the following drawings denote similar items; therefore, once an item is defined in one drawing, it need not be further discussed in subsequent drawings.

[0076] In the description of this application, it should be understood that the orientation or positional relationship indicated by directional terms such as "front, back, up, down, left, right", "horizontal, vertical, horizontal" and "top, bottom" is usually based on the orientation or positional relationship shown in the accompanying drawings, and is only for the convenience of describing this application and simplifying the description. Unless otherwise stated, these directional terms do not indicate or imply that the device or element referred to must have a specific orientation or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on the scope of protection of this application; the directional terms "inner" and "outer" refer to the inner and outer contours relative to the outline of each component itself.

[0077] For ease of description, spatial relative terms such as "above," "over," "on the upper surface," "above," "of the upper end," etc., are used herein to describe the spatial positional relationship of a device or feature as shown in the figures to other devices or features. It should be understood that spatial relative terms are intended to encompass different orientations in use or operation besides the orientation of the device as described in the figures. For example, if the device in the figures is inverted, a device described as "above" or "above" other devices or structures will subsequently be defined as "below" or "under" other devices or structures. Thus, the exemplary term "above" can include both "above" and "below." The device may also be positioned in other different ways (rotated 90 degrees or in other orientations), and the spatial relative descriptions used herein will be interpreted accordingly.

[0078] Furthermore, it should be noted that the use of terms such as "first" and "second" to define components is merely for the purpose of distinguishing the corresponding components. Unless otherwise stated, the above terms have no special meaning and therefore cannot be construed as limiting the scope of protection of this application.

[0079] For ease of description, the above description is merely a preferred embodiment of the present invention and is not intended to limit the invention. Those skilled in the art will recognize that the present invention can have various modifications and variations. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the scope of protection of the present invention.

Claims

1. A heat-equalizing liquid cooling plate for a drive motor controller, characterized in that: The system includes a controller housing (2), a heat dissipation substrate (3) is provided inside the controller housing (2), the heat dissipation substrate (3) and the controller housing (2) are sealed to form a liquid cooling plate channel (4), an IGBT module (1) is provided on the upper surface of the heat dissipation substrate (3), and a heat sink (5) corresponding to the IGBT module (1) is provided on the lower surface of the heat dissipation substrate (3), the heat sink (5) is located in the liquid cooling plate channel (4); the liquid cooling plate channel (4) includes two channel regions, from the channel inlet (44) to the channel outlet (45) of the liquid cooling plate channel (4) are respectively the first channel region (41) and the second channel region (42), and each channel region corresponds to each IGBT half-bridge of the IGBT module (1); Wherein, the length of the IGBT half-bridge is L, the width of the IGBT half-bridge is B, and the height of the heat sink is h; the cross-sectional perimeter of the heat sink in the first flow channel region is P1, the cross-sectional area of ​​the heat sink in the first flow channel region is A1, the column spacing of the heat sink in the first flow channel region is s1, the row spacing of the heat sink in the first flow channel region is c1, the flow spacing between the heat sinks in the first flow channel region is e1, the cross-sectional perimeter of the heat sink in the second flow channel region is P2, the cross-sectional area of ​​the heat sink in the second flow channel region is A2, the column spacing of the heat sink in the second flow channel region is s2, the row spacing of the heat sink in the second flow channel region is c2, and the flow spacing between the heat sinks in the second flow channel region is e2, the relationship between them is: ； In the formula, the symbol Represents integer operations. Indicates taking Divide by The integer part, Indicates taking Divide by The integer part.

2. The heat-equalizing liquid cooling plate for the drive motor controller according to claim 1, characterized in that: The liquid cooling plate flow channel (4) includes three flow channel regions, which correspond to the three IGBT half-bridges of the IGBT module (1) respectively. The flow channel inlet (44) to the flow channel outlet (45) of the liquid cooling plate flow channel (4) are the first flow channel region (41), the second flow channel region (42), and the third flow channel region (43). The relationship between the cross-sectional perimeter of the heat sink in the third flow channel region being P3, the cross-sectional area of ​​the heat sink in the third flow channel region being A3, the column spacing of the heat sink in the third flow channel region being s3, the row spacing of the heat sink in the third flow channel region being c3, ​​and the flow distance between the heat sinks in the third flow channel region being e3, is as follows: 。 3. The heat exchange liquid cooling plate for the drive motor controller according to claim 1 or 2, characterized in that: The length of the liquid cooling plate channel (4) is l, (B*n-10)mm≤l≤(B*n+10)mm; and / or, the width of the liquid cooling plate channel (4) is b, (L-5)mm≤b≤(L+5)mm; Where B is the width of the IGBT half-bridge, L is the length of the IGBT half-bridge, and n is the number of IGBT half-bridges.

4. The heat exchange liquid cooling plate for the drive motor controller according to claim 1 or 2, characterized in that: The heat sink (5) is arranged in a staggered pattern, and the cross-sectional shape of the heat sink (5) is either regular or irregular.

5. The heat exchange liquid cooling plate for the drive motor controller according to claim 1 or 2, characterized in that: The heat sink (5) has an elliptical cross-section, with the major axis of the ellipse along the direction of coolant flow and the minor axis of the ellipse perpendicular to the direction of coolant flow.

6. The heat exchange liquid cooling plate for the drive motor controller according to claim 1 or 2, characterized in that: The height h of the heat sink (5) is 3mm ≤ h ≤ 10mm.

7. The heat exchange liquid cooling plate for the drive motor controller according to claim 1 or 2, characterized in that: The minimum flow distance between two adjacent heat sinks (5) in the liquid cooling plate flow channel (4) is f, where f ≥ 1 mm.

8. The heat-equalizing liquid cooling plate for the drive motor controller according to claim 2, characterized in that: The heat sink (5) includes three regions, which correspond to the three IGBT half-bridges of the IGBT module (1) respectively. From the inlet (44) of the liquid cooling plate channel (4) to the outlet (45), the heat sinks are respectively the first channel region corresponding to the first IGBT half-bridge (11) of the IGBT module (1), the second channel region corresponding to the second IGBT half-bridge (12) of the IGBT module (1), and the third channel region corresponding to the third IGBT half-bridge (13) of the IGBT module (1). The perimeter of the heat sink in the first flow channel region is P1, 3mm≤P1≤32mm; the cross-sectional area of ​​the heat sink in the first flow channel region is A1, 1mm². 2 ≤A1≤25mm 2 The heat sinks in the first flow channel region are spaced apart along the first preset direction. The column spacing between two adjacent heat sinks is s1, and the flow spacing between two adjacent heat sinks is e1, where 1mm≤e1≤5mm and e1<s1. The heat sinks in the first flow channel region are spaced apart along the second preset direction. The row spacing between two adjacent rows of heat sinks is c1, where c1<4A1 / P1. The perimeter of the heat sink in the second flow channel region is P2, 3mm ≤ P2 ≤ 32mm; the cross-sectional area of ​​the heat sink in the second flow channel region is A2, 1mm². 2 ≤A2≤25mm 2 The heat sinks in the second flow channel region are spaced apart along the first preset direction. The column spacing between two adjacent heat sinks is s2, and the flow spacing between two adjacent heat sinks is e2, where 1mm≤e2≤5mm and e2<s2. The heat sinks in the second flow channel region are spaced apart along the second preset direction. The row spacing between two adjacent rows of heat sinks is c2, where c2<4A2 / P2. The perimeter of the heat sink in the third flow channel region is P3, 3mm≤P3≤32mm; the cross-sectional area of ​​the heat sink in the third flow channel region is A3, 1mm². 2 ≤A3≤25mm 2 The heat sinks in the third flow channel region are spaced apart along the first preset direction, with a column spacing of s3 between two adjacent heat sinks and a flow spacing of e3 between two adjacent heat sinks, where 1mm≤e3≤5mm and e3<s3; the heat sinks in the third flow channel region are spaced apart along the second preset direction, with a row spacing of c3 between two adjacent rows of heat sinks, where c3<4A3 / P3.

9. The heat-equalizing liquid cooling plate for the drive motor controller according to claim 2, characterized in that: The heat sinks in the first flow channel region are spaced apart along a first preset direction, with each row containing [L / s1]. The heat sinks in the first flow channel region are spaced apart along a second preset direction, with each row containing [B / c1]. The heat sinks in the second flow channel region are spaced apart along the first preset direction, with each row containing [L / s2]. The heat sinks in the second flow channel region are spaced apart along the second preset direction, with each row containing [B / c2]. The heat sinks in the third flow channel region are spaced apart along the first preset direction, with each row containing [L / s3]. The heat sinks in the third flow channel region are spaced apart along the second preset direction, with each row containing [B / c3]. Wherein the symbols... This represents taking the integer part.

10. The heat exchange liquid cooling plate for the drive motor controller according to claim 1, characterized in that: The controller housing (2) has a groove on the inside for forming a liquid cooling plate channel (4). The controller housing (2) and the heat dissipation substrate (3) are sealed by a sealing ring (6) so that the groove and the heat dissipation substrate (3) cooperate to form a liquid cooling plate channel (4). The inlet (44) and outlet (45) of the liquid cooling plate channel (4) are located on both sides of the bottom of the groove.

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