Electronic product injection packaging structure and process

Abstract

The application discloses an electronic product injection packaging structure and process, relates to the electronic product packaging technical field, and discloses the packaging operation of the electronic product. The application discards the traditional manual packaging operation mode and adopts a continuous integrated injection packaging mode. Specifically, the molten glue is used as the connecting structure of the electronic product accessory, which can better adapt to electronic product accessories with different shapes, so that the electronic product accessories can form an integrated structure. The continuous stacking packaging action can make most of the electronic product accessories form an integrated structure. The structure stability is ensured, the sealing performance is better, and the glue extrusion amount and the glue extrusion speed in each layer-by-layer packaging position are limited according to different electronic product accessories. The action time of the multiple initial positions, the layer-by-layer packaging positions and the material taking positions is in a stable running state.

Description

TECHNICAL FIELD

[0001] The application relates to the technical field of electronic product packaging, in particular to an electronic product injection packaging structure and process. BACKGROUND

[0002] In a literal sense, electronic products are related products based on electric energy, and the internal related precision parts include electron tubes and circuit boards. Therefore, the overall structure of each electronic product needs to be guaranteed to have excellent sealing performance, which mainly refers to the assembly operation of the electronic product.

[0003] At present, in different electronic product assembly operations, the assembly mode mainly relies on automation combined with manpower in the concept of efficient production. The process is as follows: the multiple components in the electronic product are placed in a stacked manner by manpower or a mechanical claw structure, the components at the corresponding positions are fixed by a mechanical structure, and the sealing gasket in the components plays a sealing and waterproof effect under the premise of fixedly connecting the components.

[0004] For the above electronic product operation, two or more components need to be placed in a stacked manner, and elastic structural parts such as sealing gaskets and rubber rings are arranged at the intersections between the components. The essence is that the elastic structural parts are deformed and fully attached to the connecting parts between the components. However, in this type of fixing mode, there are still slight gaps between the components and the elastic structural parts, and it is not a seamless form of complete integrated structure. Especially in the long-term use process, the sealing performance of the electronic product is seriously affected, and in the actual assembly process, the elastic structural parts need to be placed between the components in sequence, which prolongs the overall production cycle and reduces the actual production efficiency. SUMMARY

[0005] The purpose of the present application is to provide an electronic product injection packaging structure and process, which is used to solve the problem that the production cycle is long and the sealing performance of the assembled electronic product is not in the optimal state because the production mode mainly relies on manual assembly.

[0006] The purpose of the present application can be achieved by the following technical scheme: an electronic product injection packaging structure, comprising a double mold frame, an extrusion glue cylinder and a side support, a lower seat disc is installed at the center point position of the lower layer of the double mold frame, a turntable is rotatably installed on the lower seat disc, a servo motor is installed at the center point position inside the lower seat disc, the output shaft top end of the servo motor is connected with the center point position of the lower surface of the turntable, an assembly hydraulic cylinder is installed at the center point position of the upper surface of the double mold frame, the output shaft of the assembly hydraulic cylinder penetrates downward through the double mold frame, an upper mold plate is installed at the end of the output shaft of the assembly hydraulic cylinder, and the upper mold plate is slidingly connected in the double mold frame along the vertical direction;

[0007] The upper surface of the rotating disc is internally provided with a plurality of cavities, the lower surface of the upper die plate is provided with a plurality of punch seats corresponding to the cavities, the plurality of cavities are arranged in a ring array along the center point position of the rotating disc, and the plurality of cavities are respectively arranged as initial positions, layer-by-layer packaging positions and material taking positions along the rotation direction of the servo motor, the initial positions, layer-by-layer packaging positions and material taking positions are sequentially arranged in a ring closure along the rotation direction of the servo motor, and the initial positions and material taking positions are arranged in adjacent positions, the layer-by-layer packaging positions are located in the intermediate positions of the initial positions and material taking positions, the glue extruding cylinder is installed in the side support, the setting position of the side support corresponds to the setting position of the cavity, the glue injection structure is arranged on the lower layer position of the double die frame, and the controller is installed on the upper layer position of the double die frame.

[0008] Further provided are that a straight sliding plate is slidingly installed on the side support, and a grabbing piece is installed on the side of the straight sliding plate close to the cavity.

[0009] Further provided are that a rubber sheet is bonded to the inner bottom end of the plurality of cavities, and a through hole is formed in the center point position of the cavity and the rubber sheet.

[0010] Further provided are that a plurality of positioning grooves are formed in the upper surface of the rotating disc, a plurality of positioning columns matching the positioning grooves are formed in the lower surface of the upper die plate, and the positioning columns, punch seats, positioning grooves and cavities are arranged in a staggered manner.

[0011] Further provided are that a plurality of electric push rods are installed on the lower surface position of the upper die plate, the setting position of the electric push rod corresponds to the setting position of the punch seat, and the punch seat is installed on the transmission rod position of the electric push rod.

[0012] Further provided are that the glue injection structure comprises an outer ring wheel, a positioning ring plate and a flow channel, the positioning ring plate is slidingly connected to the outer circumferential wall of the rotating disc, the outer ring wheel is arranged on the outer position of the positioning ring plate, independent material cavities are formed in the positions of the outer ring wheel and the positioning ring plate corresponding to the cavities, a rubber pipe is connected to the outer ring wheel at a position corresponding to the independent material cavities, and the rubber pipe is connected to the glue extruding cylinder.

[0013] Further provided are that the independent material cavities between the outer ring wheel and the positioning ring plate are connected, the outer ring wheel is installed on the lower layer position of the double die frame, and the flow channel is formed in the rotating disc at a position between the cavities and the independent material cavities in the positioning ring plate.

[0014] Further provided are that a rubber buckle piece is installed on the outer wall position of the positioning ring plate close to the cavity, one end of the rubber buckle piece corresponds to one end of the flow channel, and the other end of the rubber buckle piece is connected to the independent material cavities in the positioning ring plate.

[0015] Further, the auxiliary push rod is installed on the position corresponding to the material taking position inside the lower seat disc, and a material lifting column is installed on the output end of the auxiliary push rod, and the material lifting column is matched with the through hole in the material taking position.

[0016] The controller is provided with a motion monitoring system during use, and the motion monitoring system comprises a data acquisition module, a data analysis module and a data control module.

[0017] The data acquisition module is used for recording the motion stroke of the assembly hydraulic cylinder and the straight sliding plate, recording the starting period of the grabbing part, and collecting the extrusion amount and extrusion efficiency of each extrusion cylinder, the additional stroke amount L of the electric push rod, and the surface area S in the cavity, wherein the motion stroke of the assembly hydraulic cylinder and the straight sliding plate, the starting period of the grabbing part, and the surface area in the cavity are quantitative, and the extrusion amount and extrusion efficiency of the extrusion cylinder and the additional stroke amount of the electric push rod are relative variables.

[0018] The data analysis module is used for receiving the quantitative and relative variables from the data acquisition module, combining the quantitative and relative variables, establishing the calculation formula of the extrusion efficiency ∫(t) in the initial position and the layer-by-layer packaging position: ∫(t) = V i / t, wherein V i is the volume of the extrusion amount in the layer-by-layer packaging position, i is the number of the layer-by-layer packaging positions, i is a natural positive integer, i = 1, 2, 3… i-1, and V i is calculated by the formula: V i =L i *S, L i is the additional stroke amount of the electric push rod in the layer-by-layer packaging position, and t is the injection packaging working time of the initial position, the layer-by-layer packaging position and the material taking position, and t is a constant value.

[0019] The data control module transmits the related data in the data analysis module to the data control module, and analyzes the related data in the data analysis module as follows:

[0020] Analysis process one: the extrusion amount V i in the layer-by-layer packaging position is a relative constant value, and the extrusion amount V i in each layer-by-layer packaging position is not equal, the additional stroke amount L of the electric push rod in each layer-by-layer packaging position is not equal, and L i >L i-1 ;

[0021] Analysis process two: the injection packaging working time of the initial position, the layer-by-layer packaging position and the material taking position, the initial packaging action is performed in the initial position, the injection action is performed in the layer-by-layer packaging position, the material taking action is performed in the material taking position, and the extrusion amount V iThe integral (t) is calculated, and the injection molding action is performed to the cavity by the integral (t) in each layer-by-layer packaging position.

[0022] Further, in the analysis process two, the extrusion amount curve in the injection molding action is established, and the following three states are presented in the extrusion amount curve:

[0023] State one: in 0-t / 2, V i / 2 is injected at a uniform speed;

[0024] State two: in t / 2-3t / 4, the remaining V i / 2 is injected at a uniform speed, and the integral (t) in the state two is greater than that in the state one;

[0025] State three: in 3t / 4-t, the injection molding action is not performed, and the motion state in the state two is maintained.

[0026] Further, the following is provided:

[0027] In use, the following processes are specifically included:

[0028] Process one: process parameter adjustment, corresponding process parameters are input into the controller according to the types and packaging requirements of electronic products, the fixture for the electronic product accessories is installed on the lower side of the punch seat, the packaging initial action of the electronic product is performed in the initial position, the injection molding action is performed according to the process parameters in each layer-by-layer packaging position, the electronic product in the taking position is in a packaging completed state, and the taking action is performed by the auxiliary push rod;

[0029] Process two: position adjustment step, the turntable is rotated by the servo motor, and the single rotation angle of the turntable is the offset angle between each cavity, after the position of the turntable is adjusted, each straight slide moves in the direction close to the turntable, and in the moving process, the electronic product accessories are grabbed by the grabbing part and placed into the cavity in the corresponding position;

[0030] Process three: injection molding packaging step, after the upper mold plate is lowered to the specified position by the assembly hydraulic cylinder, the punch seat is lowered by the electric push rod L i , and the glue liquid is injected into the cavity by the extrusion cylinder at the same time, and the packaging action of the electronic product accessories in each cavity is completed;

[0031] Process four: injection molding and taking, after the electronic product in the taking position completes the injection molding packaging action, the auxiliary push rod is started to move the ejector pin upward, and the electronic product completing the injection molding packaging action is grabbed by the grabbing part in the corresponding position.

[0032] The present application has the following advantages:

[0033] 1. The present application is directed to the packaging operation of electronic products, using a continuous integrated injection molding mode, abandoning the traditional manual packaging operation mode, which is specifically manifested as: using molten glue as the connecting structure for packaging electronic products. The fluidity of the molten glue can make the molten glue fully "embedded" into the gap between different electronic product accessories, and after the molten glue cools down, a solid connecting structure is formed, so that different electronic product accessories and the solid connecting structure form an integrated structure, which can meet the fixing requirements between different accessories and fully meet the sealing between different accessories.

[0034] 2. In combination with the technical content described in point 1, the present application utilizes the rotation mode of the turntable, and a plurality of cavities are added to the turntable. The cavities are used to place electronic product accessories and are combined with the rotation mode of the turntable to switch the actions performed by different cavities. The specific actions include packaging initial action, injection action, and material taking action, and the purpose is to keep the overall packaging operation in a continuous running state.

[0035] 3. In combination with the technical content described in point 2, first, the amount of glue extrusion and the glue extrusion speed in each layer-by-layer packaging position are limited according to different electronic product accessories. The purpose is to further limit the amount of glue extrusion and the glue extrusion speed under the premise of ensuring that the packaging initial action, injection action, and material taking action are in the same action time and ensuring that the overall injection packaging running state is relatively stable, so as to ensure that the action in each layer-by-layer packaging position is in a relatively stable running state and can ensure the sealing and structural stability. BRIEF DESCRIPTION OF DRAWINGS

[0036] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings needed to be used in the embodiments or prior art description. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can also be obtained by those skilled in the art without creative labor.

[0037] Figure 1 A structure diagram of an electronic product injection packaging structure is proposed for the present application;

[0038] Figure 2 A structure diagram of a double-mode frame component in an electronic product injection packaging structure is proposed for the present application;

[0039] Figure 3 A structure diagram of a side support component in an electronic product injection packaging structure is proposed for the present application;

[0040] Figure 4 A cross-sectional view of a lower seat disc and a turntable component in an electronic product injection packaging structure is proposed for the present application;

[0041] Figure 5 A cross-sectional view of a rotating disc component in an electronic product injection packaging structure according to the present application;

[0042] Figure 6 A split view of a lower seat disc and rotating disc component in an electronic product injection packaging structure according to the present application;

[0043] Figure 7 A top view of a rotating disc and outer ring component in an electronic product injection packaging structure according to the present application;

[0044] Figure 8 A structural schematic view of an upper mold plate component in an electronic product injection packaging structure according to the present application;

[0045] Figure 9 A squeezing amount curve schematic view in an electronic product injection packaging process according to the present application.

[0046] In the figure: 1, double mold frame; 2, upper mold plate; 3, side support; 4, squeezing cylinder; 5, controller; 6, assembly hydraulic cylinder; 7, rotating disc; 8, lower seat disc; 9, straight sliding plate; 10, grabbing piece; 11, servo motor; 12, auxiliary push rod; 13, material lifting column; 14, cavity; 15, positioning groove; 16, rubber sheet; 17, flow channel; 18, outer ring; 19, independent material cavity; 20, electric push rod; 21, positioning ring plate; 22, positioning column; 23, punch seat; 24, rubber clasp sheet. DETAILED DESCRIPTION

[0047] The technical solutions of the present application will be described below in connection with embodiments, obviously, the described embodiments are only some of the embodiments of the present application, but not all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor are within the scope of protection of the present application.

[0048] Embodiment one

[0049] For current electronic product packaging operation, it mostly depends on the operation mode of successive packaging, specifically: connecting two electronic products together, in which the connection structure used is mostly sealing gasket, rubber ring and the like, the essence of which is to utilize the deformation of elastic structure and fully attach to the connection between components, but in such fixing mode, there is still a slight gap between the components and the elastic structure, which is not a completely integrated structure of seamless form, especially in the long-term use process, which seriously affects the sealing of the electronic product, therefore, the following technical solutions are proposed:

[0050] Reference Figures 1-8The embodiment of the application discloses an injection molding packaging structure of an electronic product, which comprises a double mold frame 1, a glue extruding cylinder 4 and a side support 3, a lower seat plate 8 is arranged at the center point of the lower layer of the double mold frame 1, a rotating disc 7 is rotatably arranged on the lower seat plate 8, a servo motor 11 is arranged at the center point of the inside of the lower seat plate 8, the output shaft of the servo motor 11 is connected with the center point of the lower surface of the rotating disc 7, an assembly hydraulic cylinder 6 is arranged at the center point of the upper surface of the double mold frame 1, the output shaft of the assembly hydraulic cylinder 6 penetrates the double mold frame 1 downwards, and an upper mold plate 2 is arranged at the end of the output shaft of the assembly hydraulic cylinder 6 and is connected with the double mold frame 1 in the vertical direction;

[0051] A plurality of cavities 14 are arranged in the inside of the upper surface of the rotating disc 7, a plurality of punch seats 23 corresponding to the cavities 14 are arranged on the lower surface of the upper mold plate 2, the plurality of cavities 14 are arranged in a ring array along the center point of the rotating disc 7, the plurality of cavities 14 are arranged as an initial position, a layer-by-layer packaging position and a material taking position along the rotating direction of the servo motor 11, the initial position, the layer-by-layer packaging position and the material taking position are sequentially arranged in a ring shape along the rotating direction of the servo motor 11, the initial position and the material taking position are arranged in adjacent positions, the layer-by-layer packaging position is arranged at the intermediate position between the initial position and the material taking position, the glue extruding cylinder 4 is arranged in the side support 3, the arrangement position of the side support 3 corresponds to the arrangement position of the cavity 14, a glue injection structure is arranged at the lower layer position of the double mold frame 1, a controller 5 is arranged at the upper layer position of the double mold frame 1, a straight sliding plate 9 is slidably arranged on the side support 3, a grabbing piece 10 is arranged on the side of the straight sliding plate 9 close to the cavity 14, a rubber sheet 16 is arranged at the inside bottom end of the plurality of cavities 14, a through hole is arranged at the center point of the cavity 14 and the rubber sheet 16, a plurality of positioning grooves 15 are arranged on the upper surface of the rotating disc 7, a plurality of positioning columns 22 matching the positioning grooves 15 are arranged on the lower surface of the upper mold plate 2, the positioning columns 22 and the punch seats 23 and the positioning grooves 15 and the cavities 14 are arranged in a staggered mode, a plurality of electric push rods 20 are arranged at the lower surface position of the upper mold plate 2, the arrangement position of the electric push rod 20 corresponds to the arrangement position of the punch seat 23, and the punch seat 23 is arranged at the transmission rod position of the electric push rod 20.

[0052] The structure has the advantages that Figure 1 and Figure 7 The rotating disc 7 in the embodiment can bear the electronic product accessories, and the plurality of cavities 14 can be used as the packaging cavities of the electronic product accessories, Figure 7 for example, the rotating disc 7 is arranged to rotate clockwise, one of the cavities 14 is arranged as the initial position, the cavity 14 close to the initial position is arranged as the material taking position, and the direction from the initial position to the material taking position is counterclockwise, and the cavities 14 at other positions are arranged as the layer-by-layer packaging positions.

[0053] And need to explain: the electronic product packaging operation introduced in this embodiment, for this in this embodiment used to grab the piece 10 need to be according to different kinds of electronic product accessories, in this embodiment, can not be specifically limited to what kind of grab the piece 10, the same reason for reference 8, in which the punch seat 23 in " extrusion " electronic product accessories, need to install the corresponding positioning fixture structure of electronic product accessories on the punch seat 23, also need to be according to different kinds of electronic product accessories;

[0054] The main need to explain: the multiple cavity 14 in this embodiment can be synchronized, such as in the initial position first to execute the packaging initial action, make one of the electronic product accessories placed in the cavity 14, then in the next cavity 14, again placed another electronic product accessories, at the same time, also use the glue injection structure to extrude the molten glue into the cavity 14, the glue mainly in the middle position of two electronic product accessories, after the glue cooling, form the connection structure of two electronic product accessories, make two electronic product accessories and connection structure form an integral structure, the same reason, after the two electronic product accessories complete " packaging " action, the integral structure formed by it enters the next cavity 14, again to the integral structure obtained by packaging action;

[0055] From the above, all the actions in the cavity 14 in the turntable 7 are in the state of synchronous operation, the action time is equal, when the upper die plate 2 is close to the turntable 7, it is the first stage of a packaging action, when the upper die plate 2 leaves the turntable 7, it is the second stage of a packaging action, each packaging action can be synchronized with multiple packaging actions, thereby forming a continuous integral injection packaging mode, so that the final obtained electronic product has good sealing property.

[0056] Embodiment two

[0057] This embodiment is a technical supplement to the glue injection structure in embodiment one:

[0058] The glue injection structure includes the outer ring wheel 18, the positioning ring plate 21 and the flow groove 17, the positioning ring plate 21 is slidably connected to the outer wall of the rotating disc 7, the outer ring wheel 18 is arranged outside the positioning ring plate 21, and the outer ring wheel 18 and the positioning ring plate 21 are provided with independent material cavities 19 corresponding to the positions of the cavities 14, the outer ring wheel 18 is connected with the rubber tube corresponding to the positions of the independent material cavities 19, the rubber tube is connected to the glue extruding cylinder 4, the independent material cavities 19 between the outer ring wheel 18 and the positioning ring plate 21 are connected, the outer ring wheel 18 is arranged on the lower layer of the double mold frame 1, the flow groove 17 is arranged in the rotating disc 7 and located between the cavity 14 and the independent material cavity 19 in the positioning ring plate 21, the rubber buckle piece 24 is arranged on the outer wall of the positioning ring plate 21 close to the cavity 14, one end of the rubber buckle piece 24 corresponds to one end of the flow groove 17, and the other end of the rubber buckle piece 24 is connected with the independent material cavity 19 in the positioning ring plate 21, the auxiliary push rod 12 is arranged in the inner part of the lower seat disc 8 corresponding to the material taking position, the top material column 13 is arranged on the output end of the auxiliary push rod 12, and the top material column 13 is matched with the through hole in the material taking position.

[0059] The structure has the following advantages: according to the contents of the first embodiment, the present application is aimed at the packaging process of electronic products, the gap between two electronic product accessories is different in each assembly process, the gap volume can be calculated by drawing software, such as UG software, the volume between different accessories in different electronic products can be different, therefore, the amount of glue liquid injected into one of the cavities 14 needs to be limited, and therefore, one independent material cavity 19 is arranged in each cavity 14 to inject the corresponding amount of glue liquid.

[0060] It should be noted that the rotating disc 7 is continuously rotated, therefore, the glue injection structure corresponding to the rotating disc 7 is added, which is relatively stable positioning groove 15 and the positioning ring plate 21, the positioning ring plate 21 keeps rotating with the rotating disc 7, when the positioning ring plate 21 and the rotating disc 7 rotate relatively, the glue liquid in the glue extruding cylinder 4 is injected into the cavity 14 when the flow groove 17 is connected with the independent material cavity 19 through the rubber buckle piece 24, no matter how the rotating disc 7 rotates to any position, when each cavity 14 is connected with the corresponding independent material cavity 19, the cavity 14 can be redefined as the initial position, the successive packaging position or the material taking position.

[0061] Therefore, it should be explained that the amount of glue extruded by each independent material cavity 19 is limited to define the initial position, the successive packaging position or the material taking position of the cavity 14, for example, in the material taking position, the electronic product after completing the packaging is pushed out by the auxiliary push rod 12, and is grabbed by the grabbing piece 10 at the corresponding position, at this time, the material taking position becomes the initial position after the rotating disc 7 moves for one cycle, and the same is true for the successive packaging position.

[0062] Example three

[0063] This embodiment describes the process steps for the technical features in Embodiments 1 and 2:

[0064] Controller 5 is equipped with a motion monitoring system during use, which includes a data acquisition module, a data analysis module, and a data control module.

[0065] Data acquisition module: used to record the movement stroke of the assembly hydraulic cylinder 6 and the straight slide plate 9, as well as the start cycle of the gripper 10. It is also used to collect the extrusion amount and efficiency of each extrusion cylinder 4, the additional stroke L of the electric push rod 20, and the surface area S in the cavity 14. The movement stroke of the assembly hydraulic cylinder 6 and the straight slide plate 9, the start cycle of the gripper 10, and the surface area in the cavity 14 are quantitative, while the extrusion amount and efficiency of the extrusion cylinder 4 and the additional stroke of the electric push rod 20 are relative variables.

[0066] Data Analysis Module: Used to receive quantitative and relative variables from the data acquisition module, and combine these variables to establish the extrusion efficiency ∫(t) at the initial position and layer-by-layer encapsulation position: ∫(t)=V i / t, where V i V represents the volume of adhesive extruded in each encapsulation position, where i is the number of multiple encapsulation positions, i being a natural positive integer, i = 1, 2, 3…i-1. i The calculation formula is: V i =L i *S,L i The additional stroke of the electric push rod 20 in the layer-by-layer encapsulation position is t, which is the injection encapsulation working time of the initial position, the layer-by-layer encapsulation position and the material picking position, and t is a constant value.

[0067] Data Control Module: Transfers relevant data from the Data Analysis Module to the Data Control Module and performs the following analysis on the relevant data in the Data Analysis Module:

[0068] Analysis Process 1: Extrusion Amount V in Layer-by-Layer Encapsulation i The amount of adhesive V at each layer of encapsulation is a relatively constant value. i The additional stroke L of the electric actuator 20 in each layer-by-layer encapsulation position is not equal, and L is not equal. i >L i-1 ;

[0069] Analysis Process Two: Injection molding and encapsulation time at the initial position, layer-by-layer encapsulation position, and material picking position. The initial encapsulation action is performed at the initial position, the injection action at the layer-by-layer encapsulation position, and the material picking action at the material picking position. Furthermore, at the layer-by-layer encapsulation position, the extrusion amount V is calculated... i ∫(t) is calculated, and in each layer-by-layer encapsulation position, injection molding is performed into cavity 14 using ∫(t).

[0070] In the analysis process two, the extrusion amount curve in the injection action is established, and the extrusion amount curve presents the following three states:

[0071] State one: in 0~t / 2, V i / 2 of the glue amount is injected at a uniform speed;

[0072] State two: in t / 2~3t / 4, the remaining V i / 2 of the glue amount is injected at a uniform speed, and ∫(t) in state two is greater than that in state one;

[0073] State three: in 3t / 4~t, the injection injection action is not performed, and the motion state in state two is maintained.

[0074] In use, the process specifically includes the following:

[0075] Process one: process parameter adjustment, according to the types and packaging requirements of electronic products, corresponding process parameters are input into the controller 5, corresponding jig parts for electronic product accessories are installed on the lower side of the punch holder 23, packaging initial action for electronic products is performed in the initial position, and injection action is performed according to process parameters in each layer packaging position, wherein the electronic products in the taking position are in the state of completed packaging, and the auxiliary push rod 12 performs the taking action;

[0076] Process two: position adjustment step, the turntable 7 is rotated by the servo motor 11, and the single rotation angle of the turntable 7 is the offset angle between each cavity 14, after the position of the turntable 7 is adjusted, each straight slide 9 moves in the direction of approaching the turntable 7, and in the moving process, the grabbing part 10 performs the grabbing action for the electronic product accessories, and places the electronic product accessories into the corresponding position in the cavity 14;

[0077] Process three: injection packaging step, after the upper die plate 2 is lowered to the specified position by the assembly hydraulic cylinder 6, the punch holder 23 is lowered by the electric push rod 20 L i , and the glue liquid is injected into the cavity 14 at the same time by the extrusion cylinder 4, completing the packaging action of the electronic product accessories in each cavity 14;

[0078] Process four: injection completion and taking, after the electronic product in the taking position completes the injection packaging action, the auxiliary push rod 12 is started to move the ejection column 13 upward, and the electronic product completing the injection packaging action is grabbed by the grabbing part 10 in the corresponding position.

[0079] Technical advantages: the purpose of the embodiment is to further explain the overall injection packaging process: first, because the gaps between different electronic product accessories are different, and then the extrusion amount V iDifferent, but the amount of extrusion V in the cavity 14 in one position i As a relative value, and because the time spent in multiple cavities 14 when performing different actions is equal, therefore, the amount of extrusion V of the packaging position by layer in different stations needs to be re-planned according to the extrusion efficiency; i

[0080] And again combined with Figure 9 In each extrusion process, it is necessary to batch glue according to three states, but it needs to be noted that the action time in each packaging position by layer needs to be equal.

[0081] In summary: for the packaging operation of electronic products, abandon the traditional manual sequential packaging operation mode, and adopt the continuous integrated injection packaging mode, which is specifically manifested as: using molten glue as the connecting structure of the packaging electronic product accessories, which can better adapt to electronic product accessories of different shapes, so that the electronic product accessories can form an integrated structure, and the "continuous superposition" packaging action is adopted, which can make most of the parts in the electronic product can form an integrated structure, under the premise of ensuring the stability of the structure, it plays a more excellent sealing performance, and according to different electronic product accessories, the amount of extrusion and the extrusion speed in each packaging position by layer are limited, the purpose is to make the action time of multiple initial positions, packaging positions by layer and taking positions in a stable running state of different amounts.

[0082] The above content is only an example and description of the structure of the present application, and those skilled in the art can make various modifications or supplements to the described specific embodiments or adopt similar ways to replace them, as long as they do not deviate from the structure of the invention or exceed the scope defined by the present claims, which shall belong to the protection scope of the present application.

[0083] In the description of the present application, the description of the terms "one embodiment", "example", "specific example" and the like means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are contained in at least one embodiment or example of the present application. In the present application, the illustrative description of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0084] ​The preferred embodiments of the application disclosed above are only to facilitate the elucidation of the application. The preferred embodiments do not describe all the details of the application and limit the application to the specific embodiments. Obviously, many modifications and variations can be made in light of the teachings above. The description is chosen and described in order to provide the best illustration of the application and its practical application to those skilled in the art and to enable those skilled in the art to utilize the application in its best mode. The application is only limited by the claims and their full scope and equivalents.

Claims

1. An injection molding packaging structure for electronic products, comprising a dual mold frame (1), an extrusion cylinder (4), and a side support (3), characterized in that, A lower base plate (8) is installed at the center point of the lower layer of the dual-mold frame (1). A turntable (7) is rotatably installed on the lower base plate (8). A servo motor (11) is installed at the center point inside the lower base plate (8). The top end of the output shaft of the servo motor (11) is connected to the center point of the lower surface of the turntable (7). An assembly hydraulic cylinder (6) is installed at the center point of the upper surface of the dual-mold frame (1). The output shaft of the assembly hydraulic cylinder (6) passes through the dual-mold frame (1) downward. An upper template (2) is installed at the end of the output shaft of the assembly hydraulic cylinder (6). The upper template (2) is slidably connected in the vertical direction in the dual-mold frame (1). The turntable (7) has multiple cavities (14) inside its upper surface. The upper template (2) has multiple punch seats (23) corresponding to the cavities (14) on its lower surface. The multiple cavities (14) are arranged in a ring array along the center point of the turntable (7). The multiple cavities (14) are respectively set as the initial position, the layer-by-layer encapsulation position and the material picking position along the rotation direction of the servo motor (11). The initial position, the layer-by-layer encapsulation position and the material picking position are arranged in a closed ring along the rotation direction of the servo motor (11). The initial position and the material picking position are arranged in adjacent positions. The layer-by-layer encapsulation position is located in the middle position between the initial position and the material picking position. The extrusion cylinder (4) is installed in the side bracket (3). The setting position of the side bracket (3) corresponds to the setting position of the cavity (14). The lower position of the double mold frame (1) is provided with an injection structure, and the upper position of the double mold frame (1) is provided with a controller (5).

2. The electronic product injection molding packaging structure according to claim 1, characterized in that, A straight slide plate (9) is slidably mounted on the side bracket (3), and a gripper (10) is mounted on the side of the straight slide plate (9) near the cavity (14).

3. The electronic product injection molding packaging structure according to claim 2, characterized in that, A rubber sheet (16) is bonded to the bottom of the interior of each of the multiple cavities (14), and a through hole is provided at the center point of the cavity (14) and the rubber sheet (16).

4. The electronic product injection molding packaging structure according to claim 3, characterized in that, The turntable (7) has multiple positioning grooves (15) on its upper surface, and the upper template (2) has multiple positioning posts (22) that match the positioning grooves (15) on its lower surface. The positioning posts (22) are offset from the punch seat (23), and the positioning grooves (15) are offset from the cavity (14).

5. The electronic product injection molding packaging structure according to claim 4, characterized in that, Multiple electric push rods (20) are installed on the lower surface of the upper template (2). The positions of the electric push rods (20) correspond to the positions of the punch seat (23). The punch seat (23) is installed on the transmission rod position of the electric push rods (20).

6. The electronic product injection molding packaging structure according to claim 5, characterized in that, The glue injection structure includes an outer ring wheel (18), a positioning ring plate (21), and a flow channel (17). The positioning ring plate (21) is slidably connected to the outer wall of the turntable (7). The outer ring wheel (18) is located on the outside of the positioning ring plate (21). The outer ring wheel (18) and the positioning ring plate (21) are provided with independent material cavities (19) at the positions corresponding to the cavity (14). A glue tube is connected to the outer ring wheel (18) at the position corresponding to the independent material cavity (19). The glue tube is connected to the extrusion cylinder (4).

7. The electronic product injection molding packaging structure according to claim 6, characterized in that, The independent material cavity (19) between the outer ring wheel (18) and the positioning ring plate (21) is connected, and the outer ring wheel (18) is installed on the lower layer of the double mold frame (1). The flow channel (17) is opened in the turntable (7) at the middle position between the cavity (14) and the independent material cavity (19) in the positioning ring plate (21).

8. The electronic product injection molding packaging structure according to claim 7, characterized in that, A rubber buckle piece (24) is installed on the outer wall of the positioning ring plate (21) near the cavity (14). One end of the rubber buckle piece (24) corresponds to one end of the flow channel (17), and the other end of the rubber buckle piece (24) is connected to the independent material cavity (19) in the positioning ring plate (21).

9. The electronic product injection molding packaging structure according to claim 8, characterized in that, An auxiliary push rod (12) is installed inside the lower plate (8) at the position corresponding to the material taking position. A top material column (13) is installed on the output end of the auxiliary push rod (12). The top material column (13) matches the through hole in the material taking position.

10. The electronic product injection molding packaging structure according to claim 9, characterized in that, The controller (5) has a motion monitoring system in place during use. The motion monitoring system includes a data acquisition module, a data analysis module, and a data control module. Data acquisition module: used to record the motion stroke of the assembly hydraulic cylinder (6) and the straight sliding plate (9), as well as the start-up cycle of the gripper (10), and also used to collect the extrusion amount and extrusion efficiency of each extrusion cylinder (4), and the additional stroke of the electric push rod (20). Surface area in cavity (14) The motion stroke of the hydraulic cylinder (6) and the straight slide (9) and the starting cycle of the gripper (10) and the surface area in the cavity (14) are fixed quantities, while the extrusion amount and extrusion efficiency of the extrusion cylinder (4) and the external stroke of the electric push rod (20) are relative variables. Data Analysis Module: Receives quantitative and relative variables from the data acquisition module, and combines these variables to establish the extrusion efficiency at the initial and layer-by-layer encapsulation stages. The calculation formula is as follows: ,in The volume of the extruded adhesive in the layer-by-layer encapsulation position, and the volume of which... Numbering of multiple layers of encapsulated bits. Take a natural positive integer. The calculation formula is: , Additional stroke for the electric actuator (20) in the layer-by-layer encapsulation position, The injection molding and packaging operation time is for the initial position, the layer-by-layer encapsulation position, and the material picking position. It is a constant value; Data Control Module: Transfers relevant data from the Data Analysis Module to the Data Control Module and performs the following analysis on the relevant data in the Data Analysis Module: Analysis Process 1: Extrusion Amount in Layer-by-Layer Encapsulation This is a relatively constant value, and the amount of adhesive extruded at each layer-by-layer encapsulation location. The additional stroke of the electric actuator (20) in each layer of the encapsulation position is not equal. They are not equal, and ; Analysis Process Two: Injection molding and encapsulation time at the initial position, layer-by-layer encapsulation position, and material picking position. The initial encapsulation action is performed at the initial position, the injection action at the layer-by-layer encapsulation position, and the material picking action at the material picking position. Furthermore, the extrusion amount at the layer-by-layer encapsulation position is considered. Calculated In each layer-by-layer encapsulation bit, with The injection molding action is performed into the cavity (14).

11. The electronic product injection molding packaging structure according to claim 10, characterized in that, In the second analysis process, the extrusion amount curve during the injection molding process is established, and the extrusion amount curve presents the following three states: State 1: Uniform injection within the range of 0 to t / 2 The amount of adhesive; State 2: During the period from t / 2 to 3t / 4, the remaining water is injected at a constant rate. The amount of adhesive, and in state two Greater than state one; State 3: During 3t / 4~t, the injection molding action will not be performed, and the motion state in State 2 will be maintained.

12. An injection molding packaging process for electronic products, employing the injection molding packaging structure for electronic products as described in claim 11, characterized in that, The specific processes involved in its use are as follows: Process 1: Process parameter adjustment. According to the type and packaging requirements of electronic products, input the corresponding process parameters into the controller (5), and install the corresponding electronic product accessories fixtures on the lower side of the punch seat (23). Perform the initial packaging action of the electronic product in the initial position, and perform the injection molding action according to the process parameters in each layer-by-layer packaging position. The electronic product located in the material picking position is in the packaging completed state, and the material picking action is performed through the auxiliary push rod (12). Process 2: Position adjustment step, the servo motor (11) drives the turntable (7) to rotate, and the single rotation angle of the turntable (7) is the offset angle between each cavity (14). After the turntable (7) is adjusted, each straight slide (9) moves in the direction close to the turntable (7). During the movement, the gripper (10) performs the gripping action on the electronic product accessories and places the electronic product accessories into the cavity (14) in the corresponding position. Process 3: Injection molding and encapsulation steps. After the assembly hydraulic cylinder (6) moves the upper template (2) down to the designated position, the electric push rod (20) moves the punch seat (23) down. Simultaneously, glue is injected into the cavity (14) through the extrusion tube (4) to complete the encapsulation of electronic product accessories in each cavity (14); Process 4: Material Retrieval After Injection Molding is Completed. After the electronic product in the material retrieval position completes the injection molding and encapsulation action, the auxiliary push rod (12) is activated, the top material column (13) moves upward, and the gripper (10) at the corresponding position grabs the electronic product that has completed the injection molding and encapsulation action.

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